CN116888821A

CN116888821A - Antenna and electronic device comprising same

Info

Publication number: CN116888821A
Application number: CN202280015559.4A
Authority: CN
Inventors: 赵南俊; 罗孝锡; 姜智姬; 金英柱; 孙贞焕
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2021-02-18
Filing date: 2022-02-18
Publication date: 2023-10-13

Abstract

Various embodiments of the present invention relate to an electronic device including an antenna. The electronic device may include: a housing; a main plate disposed in the inner space of the housing and including a first surface facing a first direction and a second surface facing a second direction opposite to the first surface; and an antenna module disposed on the motherboard, wherein the antenna module comprises: a first substrate disposed at the first surface of the main board and including a plurality of through holes; a plurality of antenna structures, each of the antenna structures being disposed through each of the plurality of through holes and including one or more antenna elements spaced apart from each other by a predetermined distance; and a matching structure for one or more antenna elements included in each of the plurality of antenna structures, the matching structure being disposed at the first substrate. Other embodiments are also possible.

Description

Antenna and electronic device comprising same

Technical Field

Various embodiments of the present disclosure relate to antennas and electronic devices including the same.

Background

With the development of wireless communication technology, electronic devices (e.g., electronic devices for communication) have been widely used in daily life, and the use of content has also been exponentially increased accordingly. Network capacity has almost reached a limit due to the continued increase in content usage. In order to meet the increasing demand for wireless data traffic since the commercialization of fourth-generation (4G) communication systems, research has been conducted on communication systems (e.g., fifth-generation (5G), quasi-5G communication systems, or New Radios (NRs)) configured to transmit and/or receive signals by using frequencies in a high frequency band (e.g., millimeter wave, about 3GHz-300GHz frequency band).

Disclosure of Invention

Technical problem

The electronic device may include an antenna module capable of transmitting and/or receiving signals by using frequencies in a high frequency band (e.g., millimeter wave, about 3GHz-300GHz band). The antenna module has been developed to have an efficient mounting structure and various types corresponding thereto in order to overcome a high degree of free space loss caused by high-frequency band characteristics and increase gain. For example, the antenna module may include an array antenna having various numbers of antenna elements (e.g., conductive patches and/or conductive patterns) disposed at intervals on a dielectric structure (e.g., a substrate).

The antenna module may include wireless communication circuitry (e.g., radio Frequency Front End (RFFE)) for substantially simultaneously transmitting and/or receiving signals through a plurality of antenna elements included in the array antenna. The wireless communication circuit may include a plurality of amplifier circuits (e.g., power Amplifiers (PA)) and/or Low Noise Amplifiers (LNA)) and/or a plurality of frequency conversion devices (e.g., mixers and/or Phase Locked Loops (PLL)) to transmit and/or receive signals through respective antenna elements. Wireless communication circuitry (e.g., RFFE) may require a larger physical area proportional to the complexity of the structure.

As electronic devices become thinner, the size of the internal space thereof decreases, and it may be difficult to secure a space in which an antenna module (e.g., an array antenna and/or a wireless communication circuit) is disposed.

Various embodiments of the present disclosure provide apparatus and methods for reducing the size of a space (e.g., physical area) of an electronic device in which an antenna module (e.g., an array antenna and/or wireless communication circuitry) is disposed.

Solution to the problem

According to various embodiments, an electronic device may include: a housing; a main substrate disposed in an inner space of the case and including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; and an antenna module disposed on the main substrate, wherein the antenna module includes: a first substrate disposed on a first surface of the main substrate and including a plurality of through holes; a plurality of antenna structures disposed to pass through the plurality of through holes, respectively, and including at least one antenna element spaced apart at a designated interval; and a matching structure disposed on the first substrate and configured for at least one antenna element included in each of the plurality of antenna structures.

According to various embodiments, an electronic device may include: a housing; a main substrate disposed in an inner space of the case and including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; a plurality of antenna structures including at least one antenna element spaced apart and disposed at a designated interval on a first surface of the main substrate; and a plurality of submount disposed adjacent to the plurality of antenna structures on the first surface of the main substrate, wherein the plurality of submount includes a matching structure configured for at least one antenna element included in each of the plurality of antenna structures.

Advantageous effects of the invention

According to various embodiments of the present disclosure, an electronic device may be configured such that a plurality of antenna structures on which at least one antenna element is disposed and an electrical connection structure and/or a matching structure of at least one antenna element are separately disposed, thereby securing a space in which an antenna module (e.g., an array antenna and/or a wireless communication circuit) is disposed and reducing impedance matching loss and/or insertion loss due to a main substrate.

Drawings

FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments;

FIG. 2 is a block diagram of an electronic device for supporting legacy communications and 5G network communications, according to various embodiments;

FIG. 3a is a front perspective view of a mobile electronic device according to various embodiments;

FIG. 3b is a rear perspective view of a mobile electronic device according to various embodiments;

FIG. 3c is an exploded perspective view of a mobile electronic device according to various embodiments;

fig. 4a and 4b illustrate examples of structures of antenna modules according to various embodiments;

fig. 4c is a cross-sectional view of the antenna module as seen from line A-A of fig. 4b, in accordance with various embodiments;

fig. 4d is a plan view of the antenna module looking toward the-z-axis direction of fig. 4b, in accordance with various embodiments;

Fig. 4e is an enlarged plan view of region a of the antenna module of fig. 4d, in accordance with various embodiments;

fig. 4f illustrates an example of a wireless communication circuit disposed in an antenna module in accordance with various embodiments;

fig. 5a and 5b illustrate another example of the structure of an antenna module according to various embodiments;

fig. 5c is a plan view of the antenna module looking toward the-z-axis direction of fig. 5b, in accordance with various embodiments;

fig. 6a and 6b illustrate another example of a structure of an antenna module according to various embodiments;

fig. 6c is a cross-sectional view of the antenna module as seen from line B-B of fig. 6B, in accordance with various embodiments;

fig. 6d is a plan view of the antenna module looking toward the-z-axis direction of fig. 6b, in accordance with various embodiments;

fig. 6e illustrates another example of a structure of an antenna module according to various embodiments; and

fig. 7 illustrates an example of a structure of an antenna module including a plurality of array antennas according to various embodiments.

Detailed Description

Hereinafter, various example embodiments will be described in more detail with reference to the accompanying drawings.

Fig. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Referring to fig. 1, an electronic device 101 in a network environment 100 may communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with at least one of the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection end 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a Subscriber Identity Module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above-described components (e.g., connection end 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 that is connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store commands or data received from another component (e.g., the sensor module 176 or the communication module 190) into the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a Central Processing Unit (CPU) or an Application Processor (AP)) or an auxiliary processor 123 (e.g., a Graphics Processing Unit (GPU), a Neural Processing Unit (NPU), an Image Signal Processor (ISP), a sensor hub processor, or a Communication Processor (CP)) that is operatively independent of or combined with the main processor 121. For example, when the electronic device 101 comprises a main processor 121 and a secondary processor 123, the secondary processor 123 may be adapted to consume less power than the main processor 121 or to be dedicated to a particular function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

The auxiliary processor 123 (instead of the main processor 121) may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) when the main processor 121 is in an inactive (e.g., sleep) state, or the auxiliary processor 123 may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) with the main processor 121 when the main processor 121 is in an active state (e.g., running an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware structures dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, by the electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a Deep Neural Network (DNN), a Convolutional Neural Network (CNN), a Recurrent Neural Network (RNN), a boltzmann machine limited (RBM), a Deep Belief Network (DBN), a bi-directional recurrent deep neural network (BRDNN), or a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., program 140) and input data or output data for commands associated therewith. Memory 130 may include volatile memory 132 or nonvolatile memory 134.

The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an Operating System (OS) 142, middleware 144, or applications 146.

The input module 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons) or a digital pen (e.g., a stylus).

The sound output module 155 may output a sound signal to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers may be used for general purposes such as playing multimedia or playing a record. The receiver may be used to receive an incoming call. Depending on the embodiment, the receiver may be implemented separate from the speaker or as part of the speaker.

Display module 160 may visually provide information to the outside (e.g., user) of electronic device 101. The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may comprise a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of the force caused by a touch.

The audio module 170 may convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., the electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101 and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

Interface 177 may support one or more specific protocols that will be used to connect electronic device 101 with an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly. According to an embodiment, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

The connection end 178 may include a connector via which the electronic device 101 may be physically connected with an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module 179 may convert the electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that may be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrostimulator.

The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a Power Management Integrated Circuit (PMIC).

Battery 189 may power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a primary non-rechargeable battery, a rechargeable battery, or a fuel cell.

The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently of the processor 120 (e.g., an Application Processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module 194 (e.g., a Local Area Network (LAN) communication module or a Power Line Communication (PLC) module). A respective one of these communication modules may communicate with external electronic devices via a first network 198 (e.g., a short-range communication network such as bluetooth, wireless fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a conventional cellular network, a 5G network, a next-generation communication network, the internet, or a computer network (e.g., a LAN or wide-area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

The wireless communication module 192 may support a 5G network following a 4G network as well as next generation communication technologies (e.g., new Radio (NR) access technologies). NR access technologies may support enhanced mobile broadband (eMBB), large-scale machine type communication (mctc), or Ultra Reliable Low Latency Communication (URLLC). The wireless communication module 192 may support a high frequency band (e.g., millimeter wave band) to achieve, for example, a high data transmission rate. The wireless communication module 192 may support various techniques for ensuring performance over high frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20Gbps or greater) for implementing an eMBB, a lost coverage (e.g., 164dB or less) for implementing an emtc, or a U-plane delay (e.g., a round trip of 0.5ms or less, or 1ms or less for each of the Downlink (DL) and Uplink (UL)) for implementing a URLLC.

The antenna module 197 may transmit signals or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive signals or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element composed of a conductive material or conductive pattern formed in or on a substrate, such as a Printed Circuit Board (PCB). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., array antennas). In this case, at least one antenna suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from the plurality of antennas, for example, by the communication module 190 (e.g., the wireless communication module 192). Signals or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, further components (e.g., a Radio Frequency Integrated Circuit (RFIC)) other than radiating elements may additionally be formed as part of the antenna module 197.

According to various embodiments, antenna module 197 may form a millimeter wave antenna module. According to embodiments, a millimeter-wave antenna module may include a printed circuit board, a Radio Frequency Integrated Circuit (RFIC) disposed on a first surface (e.g., a bottom surface) of the printed circuit board or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., a millimeter-wave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band. For example, the plurality of antennas may include a patch array antenna and/or a dipole array antenna.

At least some of the above components may be interconnected via an inter-peripheral communication scheme (e.g., bus, general Purpose Input Output (GPIO), serial Peripheral Interface (SPI), or Mobile Industrial Processor Interface (MIPI)) and communicatively communicate signals (e.g., commands or data) therebetween.

According to an embodiment, commands or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be the same type of device as the electronic device 101 or a different type of device from the electronic device 101. According to an embodiment, all or some of the operations to be performed at the electronic device 101 may be performed at one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of or in addition to the function or service, or the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service. The one or more external electronic devices that received the request may perform the requested at least part of the function or service or perform another function or another service related to the request and transmit the result of the performing to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing of the result. For this purpose, for example, cloud computing technology, distributed computing technology, mobile Edge Computing (MEC) technology, or client-server computing technology may be used. The electronic device 101 may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may comprise an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to smart services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to the embodiments of the present disclosure, the electronic device is not limited to those described above.

It should be understood that the various embodiments of the disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the particular embodiments, but rather include various modifications, equivalents or alternatives to the respective embodiments. For the description of the drawings, like reference numerals may be used to refer to like or related elements. It will be understood that a noun in the singular corresponding to a term may include one or more things unless the context clearly indicates otherwise. As used herein, each of the phrases such as "a or B", "at least one of a and B", "at least one of a or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any or all possible combinations of items listed with a corresponding one of the plurality of phrases. As used herein, terms such as "1 st" and "2 nd" or "first" and "second" may be used to simply distinguish one element from another element and not to limit the element in other respects (e.g., importance or order). It will be understood that if the terms "operatively" or "communicatively" are used or the terms "operatively" or "communicatively" are not used, then if an element (e.g., a first element) is referred to as being "coupled to," "connected to," or "connected to" another element (e.g., a second element), it is intended that the element can be directly (e.g., wired) connected to, wireless connected to, or connected to the other element via a third element.

As used in connection with various embodiments of the present disclosure, the term "module" may include an element implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuitry"). A module may be a single integrated component adapted to perform one or more functions or a minimal unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an Application Specific Integrated Circuit (ASIC).

The various embodiments set forth herein may be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, under control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may invoke and execute at least one of the one or more instructions stored in the storage medium with or without the use of one or more other components. This enables the machine to operate to perform at least one function in accordance with the at least one instruction invoked. The one or more instructions may include code generated by a compiler or code capable of being executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein the term "non-transitory" merely means that the storage medium is a tangible device and does not include a signal (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

According to embodiments, methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be used as a product for conducting transactions between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium, such as a compact disk read only memory (CD-ROM), or may be distributed via an application Store (e.g., a Play Store ^TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). At least some of the computer program product may be temporarily generated if published online, or at least some of the computer program product may be stored at least temporarily in a machine readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a forwarding server.

According to various embodiments, each of the above-described components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately provided in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the plurality of components in the same or similar manner as the corresponding one of the plurality of components performed the one or more functions prior to integration. According to various embodiments, operations performed by a module, a program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added.

Fig. 2 is a block diagram 200 illustrating an example configuration of an electronic device 101 supporting legacy network communications and 5G network communications, in accordance with various embodiments.

Referring to fig. 2, according to various embodiments, the electronic device 101 may include a first communication processor (e.g., including processing circuitry) 212, a second communication processor (e.g., including processing circuitry) 214, a first Radio Frequency Integrated Circuit (RFIC) 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first Radio Frequency Front End (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna 248. The electronic device 101 may include a processor 120 and a memory 130. The network 199 may include a first network 292 and a second network 294. According to an embodiment, the electronic device 101 may further include at least one of the components shown in fig. 1, and the network 199 may further include at least one other network. According to an embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may be at least a portion of the wireless communication module 192. According to an embodiment, the fourth RFIC 228 may be omitted or may be included as part of the third RFIC 226.

The first communication processor 212 may establish a communication channel of a frequency band to be used for wireless communication with the first network 292 and may support legacy network communication via the established communication channel. According to an embodiment, the first network may be a legacy network including a second generation (2G), third generation (3G), fourth generation (4G), or Long Term Evolution (LTE) network. The second communication processor 214 may establish a communication channel corresponding to a designated frequency band (e.g., about 6GHz to 60 GHz) among frequency bands to be used for wireless communication with the second network 294, and may support 5G network communication via the established communication channel. According to an embodiment, the second network 294 may be a 5G network (e.g., a New Radio (NR)) defined in 3 GPP. Further, according to an embodiment, the first communication processor 212 or the second communication processor 214 may establish a communication channel corresponding to another designated frequency band (for example, about 6GHz or less) among frequency bands to be used for wireless communication with the second network 294, and may support 5G network communication via the established communication channel. The first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package, depending on the embodiment. Depending on the embodiment, the first communication processor 212 or the second communication processor 214 may be implemented in a single chip or a single package with the processor 120, the sub-processor 123, or the communication module 190.

According to an embodiment, the first communication processor 212 may perform data transmission or reception with the second communication processor 214. For example, data that has been classified as being transmitted via the second network 294 may be changed to be transmitted via the first network 292.

In this case, the first communication processor 212 may receive the transmission data from the second communication processor 214. For example, the first communication processor 212 may perform data transmission or reception with the second communication processor 214 via an inter-processor interface. The inter-processor interface may be implemented as, for example, a universal asynchronous receiver/transmitter (UART) (e.g., a high-speed UART (HS-UART)) or a high-speed peripheral component interconnect bus (PCIe), although the interface type is not limited thereto. For example, the first communication processor 212 and the second communication processor 214 may exchange control information and packet data information using, for example, a shared memory. For example, the first communication processor 212 may perform transmission or reception of various types of information such as sensing information, information associated with output strength, and Resource Block (RB) allocation information with the second communication processor 214.

According to an embodiment, the first communication processor 212 may not be directly connected to the second communication processor 214. In this case, the first communication processor 212 may perform data transmission or reception with the second communication processor 214 via the processor 120 (e.g., an application processor). For example, the first communication processor 212 and the second communication processor 214 may perform data transmission or reception via the processor 120 (e.g., an application processor) and an HS-UART interface or PCIe interface, but the type of interface is not limited. For example, the first communication processor 212 and the second communication processor 214 may exchange control information and packet data information using the processor 120 (e.g., an application processor) and a shared memory. The first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package, depending on the embodiment. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be implemented in a single chip or a single package with the processor 120, the sub-processor 123, or the communication module 190.

In the case of transmission, the first RFIC 222 may convert baseband signals generated by the first communication processor 212 to Radio Frequency (RF) signals in the range of approximately 700MHz to 3GHz for use in the first network 292 (e.g., a legacy network). In the case of reception, the RF signal is obtained from a first network 292 (e.g., a legacy network) via an antenna (e.g., first antenna module 242), and may be preprocessed via an RFFE (e.g., first RFFE 232). The first RFIC 222 may convert the preprocessed RF signal to baseband signals such that the baseband signals are processed by the first communication processor 212.

In the case of transmission, the second RFIC 224 may convert the baseband signal generated by the first communication processor 212 or the second communication processor 214 into an RF signal (hereinafter, 5G Sub6RF signal) in a Sub6 band (for example, about 6GHz or less) used in the second network 294 (for example, 5G network). In the case of reception, the 5G Sub6RF signal may be obtained from the second network 294 (e.g., 5G network) via an antenna (e.g., second antenna module 244), and the 5G Sub6RF signal may be preprocessed by the RFFE (e.g., second RFFE 234). The second RFIC 224 may convert the pre-processed 5g Sub6RF signal to a baseband signal so that the signal may be processed by a corresponding communication processor among the first communication processor 212 or the second communication processor 214.

The third RFIC 226 may convert baseband signals generated by the second communication processor 214 into RF signals (hereinafter, 5G Above6RF signals) of a 5G Above6 band (e.g., about 6GHz to 60 GHz) to be used in a second network 294 (e.g., a 5G network). In the case of reception, the 5G Above6RF signal is obtained from the second network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248), and the 5G Above6RF signal may be preprocessed by the third RFFE 236. The third RFIC 226 may convert the pre-processed 5g Above6RF signal to a baseband signal such that the signal is processed by the second communications processor 214. According to an embodiment, the third RFFE 236 may be implemented as part of the third RFIC 226.

According to an embodiment, the electronic device 101 may include a fourth RFIC 228 separate from the third RFIC 226 or as part of the third RFIC 226. In this case, the fourth RFIC 228 may convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter, IF signal) in a mid-band (for example, about 9GHz to 11 GHz), and may transmit the IF signal to the third RFIC 226. The third RFIC 226 may convert the IF signal to a 5g Above6RF signal. In the case of reception, the 5G Above6RF signal may be received from the second network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248), and the 5G Above6RF signal may be converted to an IF signal by the third RFIC 226. The fourth RFIC 228 may convert the IF signal to a baseband signal such that the second communication processor 214 may process the baseband signal.

According to embodiments, the first RFIC 222 and the second RFIC 224 may be implemented as at least a portion of a single chip or a single package. According to an embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as at least a portion of a single chip or a single package. According to an embodiment, at least one of the first antenna module 242 or the second antenna module 244 may be omitted or may be combined with another antenna module to process RF signals of a plurality of corresponding frequency bands.

According to an embodiment, the third RFIC 226 and the antenna 248 may be disposed in the same substrate and a third antenna module 246 may be formed. For example, the wireless communication module 192 or the processor 120 may be disposed in a first substrate (e.g., a main PCB). In this case, the third RFIC 226 is disposed in a portion (e.g., a lower portion) of a second substrate (e.g., a sub PCB) different from the first substrate, and the antenna 248 is disposed in another portion (e.g., an upper portion), so that the third antenna module 246 may be formed. By disposing the third RFIC 226 and the antenna 248 in the same substrate, the length of the transmission line therebetween may be reduced. For example, this may reduce (e.g., reduce) losses of high-band signals (e.g., about 6GHz to 60 GHz) for 5G network communications, the losses being caused by the transmission lines. Accordingly, the electronic device 101 may improve the quality or speed of communication with the second network 294 (e.g., a 5G network).

According to an embodiment, antenna 248 may be implemented as an antenna array comprising a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC 226 may include, for example, a plurality of phase shifters 238 corresponding to a plurality of antenna elements as part of the third RFFE 236. In the case of transmission, each of the plurality of phase shifters 238 may shift the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (e.g., a base station of a 5G network) via a corresponding antenna element. In the case of reception, each of the plurality of phase shifters 238 may shift the phase of the 5g Above6 RF signal received from the outside via the corresponding antenna element to the same or substantially the same phase. This may enable transmission or reception between the electronic device 101 and the outside via beamforming.

The second network 294 (e.g., a 5G network) may operate independently of the first network 292 (e.g., a legacy network) (e.g., independent networking (SA)), or may operate by connecting to the first network 292 (e.g., non-independent Networking (NSA)). For example, in a 5G network, only an access network (e.g., a 5G Radio Access Network (RAN) or a next generation RAN (NG RAN)) may exist, and a core network (e.g., a Next Generation Core (NGC)) may not exist. In this case, the electronic device 101 may access an access network of the 5G network and may access an external network (e.g., the internet) under the control of a core network (e.g., an Evolved Packet Core (EPC)) of a legacy network. Protocol information for communicating with a legacy network (e.g., LTE protocol information) or protocol information for communicating with a 5G network (e.g., new Radio (NR) protocol information) may be stored in the memory 130 and may be accessed by another component (e.g., the processor 120, the first communication processor 212, or the second communication processor 214).

Fig. 3a is a front perspective view of an electronic device 300 according to various embodiments. Fig. 3b is a rear perspective view of an electronic device 300 according to various embodiments. The electronic device 300 of fig. 3a and 3b may be at least partially similar to the electronic device 101 of fig. 1 or 2, or may include other embodiments of electronic devices.

An electronic device 300 (e.g., the electronic device 101 of fig. 1) according to various embodiments with reference to fig. 3a and 3B may include a housing 310, the housing 310 including a first surface 310A (or a front surface), a second surface 310B (or a rear surface), and a side surface 310C configured to surround a space (or an interior space) between the first surface 310A and the second surface 310B. In an embodiment (not shown), the housing 310 may be referred to as a structure configured to form a part of the first surface 310A, the second surface 310B, and the side surface 310C. According to an embodiment, the first surface 310A may be formed from a front plate 302 (e.g., a glass or polymer plate including various coatings), at least a portion of the front plate 302 being substantially transparent. The second surface 310B may be formed from a substantially opaque back plate 311. For example, the rear plate 311 may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface 310C may be formed from a side frame structure 318 (or "side member"), the side frame structure 318 being coupled to the front and rear panels 302, 311 and comprising metal and/or polymer. In some embodiments, the back plate 311 and the side frame structure 318 may be integrally formed and may comprise the same material (e.g., a metallic material such as aluminum).

According to various embodiments, the front plate 302 may include a first region 310D, the first region 310D being curved from the first surface 310A toward the rear plate 311, extending seamlessly, and being provided at both long edge ends of the front plate 302, respectively. In the illustrated embodiment (referring to fig. 3B), the rear plate 311 may include a second region 310E, the second region 310E being curved from the second surface 310B toward the front plate 302, extending seamlessly, and being provided at both long edge ends thereof, respectively. In some embodiments, the front plate 302 (or the rear plate 311) may include only one of the first regions 310D (or the second regions 310E). In an embodiment, the front plate 302 (or the rear plate 311) may not include a portion of the first region 310D (or the second region 310E). In an embodiment, the side frame structure 318 may have a first thickness (or width) on a side of the side surface that does not include the first region 310D or the second region 310E, and may have a second thickness thinner than the first thickness on a side of the side surface that includes the first region 310D or the second region 310E, when viewed from the side surface of the electronic device 300.

According to an embodiment, the electronic device 300 may include at least one of a display 301, audio modules 303, 307, and 314, sensor modules 304 and 319, camera modules 305, 312, and 313, a key input device 317, an indicator (not shown), and connector holes 308 and 309. In some embodiments, the electronic device 300 may omit at least one element (e.g., key input device 317, indicators, or connector holes 308 and 309) and may additionally include another element.

According to various embodiments, the display 301 may be visually exposed through a substantial portion of the front panel 302. In some embodiments, at least a portion of the display 301 may be visually exposed through the front panel 302, the front panel 302 being configured to form a first surface 310A and a first region 310D of the side surface 310C. In some embodiments, the edge of the display 301 may be formed to be substantially identical to the outer peripheral shape of the front plate 302 adjacent thereto. In an embodiment (not shown), in order to expand the exposed area of the display 301, a gap between the outer circumference of the display 301 and the outer circumference of the front plate 302 may be formed to be substantially the same.

In an embodiment (not shown), a recess or opening may be formed on or through a portion of the screen display area of the display 301, and at least one of the audio module 314, the sensor module 304, the camera module 305, or an indicator aligned with the recess or opening may be included therein. In an embodiment (not shown), at least one of the audio module 314, the sensor module 304, the camera module 305, or the pointer may be included in a rear surface of a screen display area of the display 301. For example, the audio module 314, the camera module 305, the sensor module 304, and/or the indicator may be arranged to be in contact with the external environment by perforating in the interior space of the electronic device 300 up to the opening of the front panel 302 of the display 301. As another example, the sensor module 304, the camera module 305, and/or a portion of the indicator may be arranged to perform its function in the interior space of the electronic device 300 without being visually exposed through the front plate 302. As an example, the area of the display 301 facing the sensor module 304, the camera module 305 and/or the indicator may not necessarily have a perforated opening.

In an embodiment (not shown), the display 301 may be coupled or adjacently disposed to a touch detection circuit, a pressure sensor capable of measuring touch intensity (pressure), and/or a digitizer for detecting a magnetic field type stylus. In some embodiments, at least a portion of the sensor modules 304 and 319 and/or at least a portion of the key input device 317 may be disposed in the first region 310D and/or the second region 310E.

According to various embodiments, the audio modules 303, 307, and 314 may include microphone holes 303 and speaker holes 307 and 314. A microphone for capturing external sound is provided in the microphone hole 303, and in some embodiments, a plurality of microphones may be arranged to be able to detect the sound direction. Speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for a call. In some embodiments, speaker holes 307 and 314 and microphone hole 303 may be implemented as one hole, or may include a speaker (e.g., a piezoelectric speaker) without speaker holes 307 and 314.

According to various embodiments, the sensor module 304 or 319 may generate electrical signals or data values corresponding to an operating state or an environmental state internal or external to the electronic device 300. For example, the sensor module 304 or 319 may include: a first sensor module 304 (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface 310A of the housing 310; and/or a third sensor module 319 (e.g., HRM sensor) disposed on the second surface 310B of the housing 310. The fingerprint sensor may be disposed not only on the first surface 310A (e.g., the display 301) but also on the second surface 310B of the housing 310. For example, a fingerprint sensor (e.g., an ultrasonic or optical fingerprint) in the first surface 310A may be disposed below the display 301. The electronic device 300 may further include a sensor module, not shown, such as at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 304.

According to various embodiments, the camera modules 305, 312, and 313 may include a first camera device 305 disposed on a first surface 310A of the electronic device 300, and a second camera device 312 and/or a flash 313 disposed on a second surface 310B. The camera modules 305 and 312 may include one or more lenses, image sensors, and/or image signal processors. For example, the flash 313 may include a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an infrared camera, a wide angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 300.

According to various embodiments, the key input device 317 may be provided on the side surface 310C of the housing 310. In an embodiment, the electronic device 300 may not include some or all of the key input devices 317, and the key input devices 317 not included therein may be implemented in a soft key type on the display 301. In some embodiments, the key input device 317 may be implemented using a pressure sensor included in the display 301.

According to various embodiments, an indicator (not shown) may be disposed on the first surface 310A of the housing 310. For example, the indicator may provide status information of the electronic device 300 in the form of light. In one embodiment, for example, the indicator may provide a light source in operative connection with the camera module 305. For example, the indicator may comprise an LED, an IR LED, or a xenon lamp.

According to various embodiments, connector holes 308 and 309 may include: a first connector hole 308 capable of receiving a connector (e.g., a USB connector) for transmitting/receiving power and/or data to/from an external electronic device; and/or a second connector hole 309 (e.g., a headphone jack) capable of receiving a connector for transmitting/receiving audio signals to/from an external electronic device.

Fig. 3c is an exploded perspective view of an electronic device 300 according to various embodiments.

According to various embodiments referring to fig. 3c, the electronic device 300 may include a side frame structure 321, a first support member 3211 (e.g., a bracket), a front plate 322, a display 323, a printed circuit board 324 (e.g., a main substrate), a battery 325, a second support member 326 (e.g., a rear case), an antenna 327, and a rear plate 328. In some embodiments, the electronic device 300 may omit at least one element (e.g., the first support member 3211 or the second support member 326) and may additionally include other elements. At least one element of the electronic device 300 may be the same as or similar to at least one element of the electronic device 300 of fig. 3a or 3b, and a repetitive description will be omitted hereinafter.

According to various embodiments, the first support member 3211 may be provided inside the electronic apparatus 300 to be connected to the side frame structure 321, or may be integrally formed with the side frame structure 321. For example, the first support member 3211 may be formed of a metallic material and/or a non-metallic (e.g., polymeric) material. The first support member 3211 may have one surface coupled to the display 323 and the other surface coupled to the printed circuit board 324. The printed circuit board 324 may have mounted thereon a processor (e.g., the processor 120 of fig. 1), a memory (e.g., the memory 130 of fig. 1), and/or an interface (e.g., the interface 177 of fig. 1). For example, the processor may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

For example, the memory may include volatile memory (e.g., volatile memory 132 of FIG. 1) or nonvolatile memory (e.g., nonvolatile memory 134 of FIG. 1).

For example, the interface may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and/or an audio interface. For example, the interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

According to various embodiments, the battery 325 may be a device for powering at least one element of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of the battery 325 may be disposed on substantially the same plane as the printed circuit board 324. The battery 325 may be integrally provided inside the electronic device 300, or may be provided to be detachable/attachable from the electronic device 300.

According to various embodiments, the antenna 327 may be disposed between the rear plate 328 and the battery 325. For example, the antenna 327 may include a Near Field Communication (NFC) antenna, a wireless charging antenna, and/or a Magnetic Security Transmission (MST) antenna. For example, the antenna 327 may perform short-range communication with an external device, or may wirelessly transmit/receive power required for charging. In one embodiment, the antenna structure may be formed from a portion of the side frame structure 321 and/or the first support member 3211, or a combination thereof.

According to various embodiments, the electronic device 300 may have a bar-type or plate-type appearance, but the appearance of the electronic device 300 may not be limited thereto. For example, the electronic device 300 may be part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and/or a rollable electronic device.

Fig. 4a and 4b illustrate examples of structures of antenna modules according to various embodiments. According to an embodiment, the antenna module of fig. 4a and 4b may be at least partially similar to the third antenna module 246 of fig. 2, and may include other embodiments of antenna modules.

According to various embodiments with reference to fig. 4a and 4b, an antenna module may include a first substrate 410, a plurality of antenna structures 421, 422, 423, and 424, and a wireless communication circuit 430.

According to various embodiments, the first substrate 410 may be disposed on the first surface 402 of the main substrate 400 (e.g., the printed circuit board 324 of fig. 3 c). According to an embodiment, the first substrate 410 may be electrically and/or physically connected to the main substrate 400. For example, the first substrate 410 may be coupled or connected to the first surface 402 of the main substrate 400. As an example, the first substrate 410 may be coupled or connected to the first surface 402 of the main substrate 400 by a conductive bonding method. For example, the conductive bonding method may include soldering, jet soldering, and/or Anisotropic Conductive Film (ACF). According to an embodiment, the first substrate 410 may have a dielectric constant different from that of the main substrate 400. For example, the first substrate 410 may have a dielectric constant lower than that of the main substrate 400.

According to various embodiments, the first substrate 410 may have a plurality of holes (e.g., through holes 411, 412, 413, and 414) formed through at least a portion of the first substrate 410. As used herein, the term "aperture" may include an aperture or any type of opening in the first substrate 410 that extends partially or completely through the first substrate 410, and include a recess or other type of aperture that may not extend completely through the first substrate 410. The term "aperture" may include "slots", "cut-out portions", and the like. These terms may be considered to refer to an area within the general plane of the substrate (or the general contour of the substrate if the substrate is uneven) in which physical substances of the substrate are not present throughout the thickness of the substrate, thereby forming a space. In some examples, such spaces may be located within an interior region of the substrate plane, forming apertures (of any suitable shape). In some examples, such spaces may be located at edge regions of the substrate and/or corner regions of the substrate (e.g., such that a portion of the outer perimeter of the substrate has a concave shape at least partially surrounding the space), forming "cut-out portions. According to an embodiment, each of the plurality of antenna structures 421, 422, 423, and 424 may be disposed in such a way that they extend through (or are inserted into) the plurality of through holes 411, 412, 413, and 414 of the first substrate 410, respectively. For example, in the case where the plurality of antenna structures 421, 422, 423, and 424 are respectively disposed inside the plurality of through holes 411, 412, 413, and 414 of the first substrate 410, at least portions thereof may be respectively exposed outside the through holes 411, 412, 413, and 414 of the first substrate 410. For example, the first substrate 410 may be electrically connected to a plurality of antenna structures 421, 422, 423, and 424.

According to various embodiments, the first substrate 410 may include an electrical connection structure for electrically connecting the plurality of antenna structures 421, 422, 423, and 424 arranged in the through holes 411, 412, 413, and 414 and the main substrate 400. According to an embodiment, the first substrate 410 may provide electrical connection between the first substrate 410 and/or various electronic components (e.g., the plurality of antenna structures 421, 422, 423, and 424 and/or the main substrate 400) disposed outside thereof by using electrical connection structures (e.g., wires and conductive vias formed on and through the conductive layer). According to an embodiment, the electrical connection structure included in the first substrate 410 may include a matching element (e.g., 453, 459, 465, or 472 of fig. 4 c) for at least one antenna element (e.g., 421-1, 422-1, 423-1, and/or 424-1 of fig. 4 c) included in each of the plurality of antenna structures 421, 422, 423, and 424. For example, the matching element (e.g., 453, 459, 465, or 472 of fig. 4 c) may include at least one conductive pattern disposed on at least a portion of the plurality of insulating layers configured to constitute the first substrate 410. For example, the matching element may include at least one passive element disposed on a surface (or substrate surface) of the first substrate 410 (e.g., the first surface 415 of the first substrate 410).

According to various embodiments, the plurality of antenna structures 421, 422, 423, and 424 may include a plurality of antenna elements (e.g., 421-1, 422-1, 423-1, and 424-1 of fig. 4 c) arranged at specific intervals to form a directional beam. According to an embodiment, each of the antenna structures 421, 422, 423 or 424 may include at least one antenna element disposed at a specific interval. According to an embodiment, the at least one antenna element included in each of the antenna structures 421, 422, 423 or 424 may be provided on or in a surface of a rigid body configured to constitute each of the antenna structures 421, 422, 423 or 424. According to an embodiment, a plurality of antenna elements (e.g., array antenna 420) included in the plurality of antenna structures 421, 422, 423, and 424 may be configured to form a beam pattern in a first direction (e.g., a z-axis direction). For example, the plurality of antenna structures 421, 422, 423, and 424 may have a dielectric constant different from that of the first substrate 410. As an example, the plurality of antenna structures 421, 422, 423, and 424 may have a dielectric constant lower than that of the first substrate 410. For example, the plurality of antenna structures 421, 422, 423, and 424 may be made of a material different from that of the first substrate 410. For example, the rigid body of the plurality of antenna structures 421, 422, 423 and/or 424 may be made of ceramic or Liquid Crystal Polymer (LCP).

According to various embodiments, the wireless communication circuit 430 may be disposed on the second surface 404 of the primary substrate 400 (e.g., the printed circuit board 324 of fig. 3 c). According to an embodiment, the wireless communication circuit 430 may be electrically and/or physically connected to the main substrate 400. For example, the wireless communication circuit 430 may be coupled or connected to the second surface 404 of the primary substrate 400.

According to various embodiments, the wireless communication circuit 430 may transmit and/or receive wireless signals in a designated frequency band through a plurality of antenna elements (e.g., 421-1, 422-1, 423-1, and 424-1 of fig. 4 c) disposed on a plurality of antenna structures 421, 422, 423, and 424. According to an embodiment, the wireless communication circuit 430 (e.g., the third RFIC 226 of fig. 2) may be electrically connected to a plurality of antenna elements (e.g., 421-1, 422-1, 423-1, and 424-1 of fig. 4 c) disposed on a plurality of antenna structures 421, 422, 423, and 424 through the first substrate 410 and the main substrate 400. For example, when transmitting, the wireless communication circuit 430 may up-convert baseband signals obtained from a communication processor of the electronic device (e.g., the first communication processor 212 and/or the second communication processor 214 of fig. 2) to RF signals of a specified frequency band. RF signals may be transmitted to a plurality of antenna elements (e.g., 421-1, 422-1, 423-1, and 424-1 of fig. 4 c) through the main substrate 400 and the first substrate 410. Upon receiving the signal, the wireless communication circuit 430 may down-convert the RF signals received through the plurality of antenna elements (e.g., 421-1, 422-1, 423-1, and 424-1 of fig. 4 c) to baseband signals to communicate the baseband signals to the communication processor. As another example, when transmitting, the wireless communication circuit 430 may upconvert an IF signal (e.g., about 9GHz to about 11 GHz) obtained from an Intermediate Frequency Integrated Circuit (IFIC) (e.g., the fourth RFIC 228 of fig. 2) to an RF signal of a specified frequency band. Upon reception, the wireless communication circuit 430 may down-convert RF signals obtained through a plurality of antenna elements (e.g., 421-1, 422-1, 423-1, and 424-4 of fig. 4 c) (e.g., array antenna 420) to IF signals to transmit the IF signals to the IFIC.

According to various embodiments, the master substrate 400 may be disposed in a housing (e.g., the housing 310 of fig. 3 a) of an electronic device (e.g., the electronic device 300 of fig. 3 a). According to an embodiment, at least one circuit may be disposed on a surface (e.g., first surface 402 and/or second surface 404) of host substrate 400. For example, a communication processor and/or a Power Management Integrated Circuit (PMIC) may be disposed on the first surface 402 (or the second surface 404) of the main substrate 400.

Fig. 4c is a cross-sectional view of the antenna module as seen from line A-A of fig. 4b, in accordance with various embodiments. Fig. 4d is a plan view of the antenna module looking toward the-z-axis direction of fig. 4b, in accordance with various embodiments. Fig. 4e is an enlarged plan view of region a of the antenna module of fig. 4d, in accordance with various embodiments.

According to various embodiments with reference to fig. 4c, 4d and 4e, a plurality of antenna structures 421, 422, 423 and 424 may be disposed in through holes 411, 412, 413 and 414 formed through at least a portion of the first substrate 410, and may be coupled and connected to the first substrate 410 and/or the main substrate 400. According to an embodiment, the plurality of antenna structures 421, 422, 423, and 424 may be coupled or connected to the first surface 402 of the main substrate 400 by a conductive bonding method. According to an embodiment, the plurality of antenna structures 421, 422, 423, and 424 may be coupled or connected to the first substrate 410 by a conductive bonding method. In this case, the plurality of antenna structures 421, 422, 423, and 424 may not be electrically connected to the main substrate 400. According to an embodiment, when the first surface 402 of the main substrate 400 is seen from above (when seen towards the-z-axis direction), as shown in fig. 4d, a plurality of antenna structures 421, 422, 423 and 424 may be arranged in the through holes 411, 412, 413 and 414 of the first substrate 410.

According to various embodiments, the first substrate 410 may include an electrical connection structure configured to electrically connect the plurality of antenna elements 421-1, 422-1, 423-1, and 424-1 included in the plurality of antenna structures 421, 422, 423, and 424, and the main substrate 400 (or the wireless communication circuit 430). According to an embodiment, the electrical connection structure included in the first substrate 410 may include a matching element 453, 459, 465, or 472 for the antenna element 421-1, 422-1, 423-1, or 424-1 included in each of the plurality of antenna structures 421, 422, 423, and 424. For example, the matching element 453, 459, 465, or 472 may perform a function for matching the impedance of the antenna element 421-1, 422-1, 423-1, or 424-1 electrically connected thereto. According to an embodiment, the first antenna element 421-1 provided on the first antenna structure 421 may be electrically connected to the first matching element 453 through the first wire 451 and the first via 452. The first matching element 453 may be electrically connected to the third via 455 of the main substrate 400 through the second via 454. According to an embodiment, the second antenna element 422-1 disposed on the second antenna structure 422 may be electrically connected to the second matching element 459 through the second wire 457 and the fifth via 458. The second matching element 459 may be electrically connected to the seventh via 461 of the main substrate 400 through the sixth via 460. According to an embodiment, the third antenna element 423-1 provided on the third antenna structure 423 may be electrically connected to the third matching element 465 through a third electric wire 463 and a ninth via 464. The third matching element 465 may be electrically connected to the eleventh via 468 of the main substrate 400 through the tenth via 467. According to an embodiment, the fourth antenna element 424-1 disposed on the fourth antenna structure 424 may be electrically connected to the fourth matching element 472 through a fourth wire 470 and a thirteenth via 471. The fourth matching element 472 may be electrically connected to the fifteenth via 474 of the main substrate 400 through a fourteenth via 473. In this disclosure, a "via" (e.g., when referring to an "nth via," where n is an integer designation that distinguishes between different vias) may be understood to refer to a component (e.g., a wire or other portion of conductive material) that provides a connection (e.g., an electrical connection) between two or more other elements, components, circuits, etc. Such connection may be provided by additional elements or components.

According to various embodiments, the wireless communication circuit 430 may be electrically connected to the first substrate 410 through the main substrate 400. According to an embodiment, the wireless communication circuit 430 may be electrically connected to the first matching element 453 of the first substrate 410 through the third via 455 of the main substrate 400 and the second via 454 of the first substrate 410. According to an embodiment, the wireless communication circuit 430 may be electrically connected to the second matching element 459 of the first substrate 410 through the seventh via 461 of the main substrate 400 and the sixth via 460 of the first substrate 410. According to an embodiment, the wireless communication circuit 430 may be electrically connected to the third matching element 465 of the first substrate 410 through the eleventh path 468 of the main substrate 400 and the tenth path 467 of the first substrate 410. According to an embodiment, the wireless communication circuit 430 may be electrically connected to the fourth matching element 472 of the first substrate 410 through the fifteenth via 474 of the main substrate 410 and the fourteenth via 473 of the first substrate 410. As an example, the wireless communication circuit 430 may transmit RF signals to and/or receive RF signals from the plurality of antenna elements 421-1, 422-1, 423-1, and 424-1, the plurality of antenna elements 421-1, 422-1, 423-1, and 424-1 being included in the plurality of antenna structures 421, 422, 423, 424 electrically connected through the first substrate 410 and the main substrate 400. As an example, the first, second, third and/or fourth wires 451, 457, 463 and/or 470 may include a conductive pattern disposed on a surface of the first substrate 410 and/or a surface of the main substrate 400 (e.g., the first surface 402).

According to various embodiments, the plurality of antenna structures 421, 422, 423, and 424 may transmit and/or receive RF signals of a first polarization (e.g., horizontal polarization) and/or RF signals of a second polarization (e.g., vertical polarization) perpendicular to the first polarization. According to an embodiment, the first substrate 410 may include electrical connection structures for the first polarization and the second polarization of the plurality of antenna elements 421-1, 422-1, 423-1, and 424-1 included in the plurality of antenna structures 421, 422, 423, and 424. For example, the electrical connection structure of the first substrate 410 may include a first electrical wire 451, a first via 452, and a first matching element 453 for the first polarization H of the first antenna element 421-1 disposed on the first antenna structure 421. As an example, the first antenna element 421-1 may be electrically connected to the first wire 451, the first via 452, and the first matching element 453 of the first substrate 410 in order to transmit and/or receive a signal of the first polarization. The electrical connection structure of the first substrate 410 may include a fifth electrical wire 481, a seventeenth via 482, and a fifth matching element 483 for the second polarization V of the first antenna element 421-1. As an example, the first antenna element 421-1 can be electrically connected to the fifth wire 481, the seventeenth via 482, and the fifth matching element 483 of the first substrate 410 to transmit and/or receive signals of the second polarization. As an example, the fifth matching element 483 may be electrically connected to the main substrate 400 through an eighteenth via 484. As an example, as shown in fig. 4e, the first matching element 453 and/or the fifth matching element 483 may include at least one conductive pattern disposed on at least a portion of a plurality of insulating layers configured to constitute the first substrate 410.

For example, the electrical connection structure of the first substrate 410 may include a second wire 457, a fifth via 458, and a second matching element 459 for the first polarization H of the second antenna element 422-1 disposed on the second antenna structure 422. As an example, the second antenna element 422-1 may be electrically connected to the second wire 457, the fifth via 458, and the second matching element 459 of the first substrate 410 in order to transmit and/or receive a signal of the first polarization. The electrical connection structure of the first substrate 410 may include a sixth wire 485, a nineteenth via 486, and a sixth matching element 487 for the second polarization V of the second antenna element 422-1. As an example, the second antenna element 422-1 may be electrically connected to the sixth wire 485, the nineteenth via 486, and the sixth matching element 487 of the first substrate 410 in order to transmit and/or receive signals of the second polarization. As an example, the sixth matching element 487 may be electrically connected to the main substrate 400 through a twentieth via 488. As an example, the second matching element 459 and/or the sixth matching element 487 may include at least one conductive pattern disposed on at least a portion of a plurality of insulating layers configured to constitute the first substrate 410.

For example, the electrical connection structure of the first substrate 410 may include a third electrical wire 463, a ninth via 464, and a third matching element 465 for the first polarization H of the third antenna element 423-1 disposed on the third antenna structure 423. As an example, the third antenna element 423-1 may be electrically connected to the third wire 463, the ninth path 464, and the third matching element 465 of the first substrate 410 to transmit and/or receive signals of the first polarization. The electrical connection structure of the first substrate 410 may include a seventh electrical wire 489, a twenty-first via 490, and a seventh matching element 491 for the second polarization V of the third antenna element 423-1. As an example, the third antenna element 423-1 may be electrically connected to the seventh wire 489, the twenty-first via 490, and the seventh matching element 491 of the first substrate 410 to transmit and/or receive signals of the second polarization. As an example, the seventh mating element 491 may be electrically connected to the main substrate 400 by a twenty-two via 492. As an example, the third matching element 465 and/or the seventh matching element 491 may include at least one conductive pattern disposed on at least a portion of a plurality of insulating layers configured to constitute the first substrate 410.

For example, the electrical connection structure of the first substrate 410 may include a fourth electrical wire 470, a thirteenth via 471 and a fourth matching element 472 for the first polarization H of the fourth antenna element 424-1 disposed on the fourth antenna structure 424. As an example, the fourth antenna element 424-1 may be electrically connected to the fourth wire 470, the thirteenth via 471 and the fourth matching element 472 of the first substrate 410 in order to transmit and/or receive signals of the first polarization. The electrical connection structure of the first substrate 410 may include an eighth electrical wire 493, a twenty-third via 494, and an eighth matching element 495 for the second polarization V of the fourth antenna element 424-1. As an example, the fourth antenna element 424-1 may be electrically connected to the eighth wire 493, the twenty-third path 494, and the eighth matching element 495 of the first substrate 410 in order to transmit and/or receive signals of the second polarization. As an example, the eighth matching element 495 may be electrically connected to the main substrate 400 through a twenty-fourth passage 496. As an example, the fourth matching element 472 and/or the eighth matching element 493 may include at least one conductive pattern disposed on at least a portion of a plurality of insulating layers configured to constitute the first substrate 410.

Fig. 4f illustrates an example of a wireless communication circuit disposed in an antenna module, in accordance with various embodiments.

According to various embodiments referring to fig. 4f, an antenna module may include a first substrate 410, a plurality of antenna structures 421, 422, 423, and 424, a second substrate 440, and a wireless communication circuit 430 disposed on the second substrate 440. According to an embodiment, in order to avoid a repeated description with fig. 4c, a detailed description of the first substrate 410 and the plurality of antenna structures 421, 422, 423, and 424 of fig. 4f will be omitted.

According to various embodiments, the second substrate 440 may be disposed on the second surface 404 of the main substrate 400 (e.g., the printed circuit board 324 of fig. 3 c). According to an embodiment, the second substrate 440 may be electrically and/or physically connected to the main substrate 400. For example, the second substrate 440 may be coupled or connected to the second surface 404 of the main substrate 400. According to an embodiment, the second substrate 440 may have a dielectric constant different from that of the main substrate 400. For example, the second substrate 440 may have a dielectric constant lower than that of the main substrate 400.

According to various embodiments, the wireless communication circuit 430 may be disposed on the second substrate 440. According to an embodiment, the wireless communication circuit 430 may be electrically connected to the first substrate 410 through the second substrate 440 and the main substrate 400. For example, the wireless communication circuit 430 may be electrically connected to the first matching element 453 of the first substrate 410 through the fourth via 456 of the second substrate 440, the third via 455 of the main substrate 400, and the second via 454 of the first substrate 410. For example, the wireless communication circuit 430 may be electrically connected to the second matching element 459 of the first substrate 410 through the eighth via 462 of the second substrate 440, the seventh via 461 of the main substrate 400, and the sixth via 460 of the first substrate 410. For example, the wireless communication circuit 430 may be electrically connected to the third matching element 465 of the first substrate 410 through the twelfth via 469 of the second substrate 440, the eleventh via 468 of the main substrate 400, and the tenth via 467 of the first substrate 410. For example, the wireless communication circuit 430 may be electrically connected to the fourth matching element 472 of the first substrate 410 through the sixteenth via 475 of the second substrate 440, the fifteenth via 474 of the main substrate 400, and the fourteenth via 473 of the first substrate 410. As an example, the wireless communication circuit 430 may transmit RF signals to the plurality of antenna elements 421-1, 422-1, 423-1, and 424-1 and/or receive RF signals from the plurality of antenna elements 421-1, 422-1, 423-1, and 424-1, the plurality of antenna elements 421-1, 422-1, 423-1, and 424-1 being included in the plurality of antenna structures 421, 422, 423, 424 electrically connected through the first substrate 410, the second substrate 440, and the main substrate 400.

According to various embodiments, a plurality of antenna elements 421-1, 422-1, 423-1, and 424-1 included in a plurality of antenna structures 421, 422, 423, and 424 may be electrically connected to the wireless communication circuit 430 through the main substrate 400. According to an embodiment, the main substrate 400 may include an electrical connection structure for electrically connecting the plurality of antenna structures 421, 422, 423, and 424 arranged in the through holes 411, 412, 413, and 414 of the first substrate 410 and the wireless communication circuit 430. According to an embodiment, the matching elements 453, 459, 465, and/or 472 included in the first substrate 410 may be electrically connected to at least a portion of an electrical connection structure for electrically connecting the plurality of antenna structures 421, 422, 423, and 424 and the wireless communication circuit 430.

According to various embodiments, the electronic device 101 or 300 may have a plurality of antenna structures 421, 422, 423, and 424 disposed in through holes 411, 412, 413, and 414 formed through at least a portion of the first substrate 410 to relatively reduce a space (e.g., a height) required for the antenna module and to relatively increase mechanical rigidity of the antenna module.

According to various embodiments, the electronic device 101 or 300 may have a plurality of antenna structures 421, 422, 423, and 424 arranged in through holes 411, 412, 413, and 414 formed through at least a portion of the first substrate 410 such that the height of the first substrate 410 is set to be relatively high. In this case, the first substrate 410 may be configured to increase the distance between the matching element and the ground within a first range (e.g., about 60%) of the heights of the plurality of antenna structures 421, 422, 423, and 424, thereby reducing the loss of the matching element.

Fig. 5a and 5b illustrate another example of the structure of an antenna module according to various embodiments. According to an embodiment, the antenna module of fig. 5a and 5b may be at least partially similar to the third antenna module 246 of fig. 2, and may include other embodiments of antenna modules.

According to various embodiments with reference to fig. 5a and 5b, an antenna module may include a plurality of sub-substrates 501, 502, 503, and 504, a plurality of antenna structures 421, 422, 423, and 424, and a wireless communication circuit 430. For example, the plurality of antenna structures 421, 422, 423, and 424 and the wireless communication circuit 430 of fig. 5a and 5b may operate similar to the plurality of antenna structures 421, 422, 423, and 424 and the wireless communication circuit 430 of fig. 4a and 4 b. Therefore, in connection with the descriptions of fig. 5a and 5b, in order to avoid the repeated descriptions with fig. 4a and 4b, detailed descriptions of the plurality of antenna structures 421, 422, 423, and 424 and the wireless communication circuit 430 will be omitted.

According to various embodiments, a plurality of submounts 501, 502, 503, and 504 may be disposed on the first surface 402 of the primary substrate 400 (e.g., the printed circuit board 324 of fig. 3 c). According to an embodiment, the plurality of sub-substrates 501, 502, 503, and 504 may be electrically and/or physically connected to the main substrate 400. For example, the plurality of sub-substrates 501, 502, 503, and 504 may be coupled or connected to the first surface 402 of the main substrate 400 by an electrically conductive bonding method. According to an embodiment, the plurality of sub-substrates 501, 502, 503, and 504 may have a dielectric constant different from that of the main substrate 400. For example, the plurality of sub-substrates 501, 502, 503, and 504 may have a dielectric constant lower than that of the main substrate 400.

According to various embodiments, the plurality of sub-substrates 501, 502, 503, and 504 may be disposed adjacent to the plurality of antenna structures 421, 422, 423, and 424 on the first surface of the main substrate 400. According to an embodiment, the first sub-substrate 501 may be disposed adjacent to the first antenna structure 421. For example, the first sub-substrate 501 may be electrically connected to the first antenna structure 421. According to an embodiment, the second sub-substrate 502 may be disposed adjacent to the second antenna structure 422. For example, the second sub-substrate 502 may be electrically connected to the second antenna structure 422. According to an embodiment, the third sub-substrate 503 may be disposed adjacent to the third antenna structure 423. For example, the third sub-substrate 503 may be electrically connected to the third antenna structure 423. According to an embodiment, the fourth sub-substrate 504 may be disposed adjacent to the fourth antenna structure 424. For example, the fourth sub-substrate 504 may be electrically connected to the fourth antenna structure 424.

According to various embodiments, the plurality of sub-substrates 501, 502, 503, and 504 may include electrical connection structures for electrically connecting the plurality of antenna structures 421, 422, 423, and 424 arranged adjacent to each other and the main substrate 400. According to an embodiment, the first sub-substrate 501 may provide electrical connection between the first sub-substrate 501 and/or various electronic components (e.g., the first antenna structure 421 and/or the main substrate 400) disposed outside thereof by using electrical connection structures (e.g., wires and conductive vias formed on and through the conductive layer). For example, the electrical connection structure included in the first sub-substrate 501 may include a matching element (e.g., the ninth matching element 513 and/or the tenth matching element 517 of fig. 5 c) for at least one antenna element (e.g., the first antenna element 421-1 of fig. 4 c) included in the first antenna structure 421. As an example, the matching element may include at least one conductive pattern disposed on at least a portion of the plurality of insulating layers configured to constitute the first sub-substrate 501. For example, the matching element may include at least one passive element disposed on a surface (or substrate surface) of the first sub-substrate 501.

According to an embodiment, the second sub-substrate 502 may provide electrical connection between the second sub-substrate 502 and/or various electronic components disposed outside thereof (e.g., the second antenna structure 422 and/or the main substrate 400) by using an electrical connection structure. For example, the electrical connection structure included in the second sub-substrate 502 may include matching elements (e.g., eleventh matching element 523 and/or twelfth matching element 527 of fig. 5 c) for at least one antenna element (e.g., second antenna element 422-1 of fig. 4 c) included in the second antenna structure 422.

According to an embodiment, the third sub-substrate 503 may provide electrical connection between the third sub-substrate 503 and/or various electronic components disposed outside thereof (e.g., the third antenna structure 423 and/or the main substrate 400) by using an electrical connection structure. For example, the electrical connection structure included in the third sub-substrate 503 may include matching elements (e.g., thirteenth matching element 533 and/or fourteenth matching element 537 of fig. 5 c) for at least one antenna element (e.g., third antenna element 423-1 of fig. 4 c) included in the third antenna structure 423.

According to an embodiment, the fourth sub-substrate 504 may provide electrical connection between the fourth sub-substrate 504 and/or various electronic components disposed outside thereof (e.g., the fourth antenna structure 424 and/or the main substrate 400) by using an electrical connection structure. For example, the electrical connection structure included in the fourth sub-substrate 504 may include a matching element (e.g., the fifteenth matching element 543 and/or the sixteenth matching element 547 of fig. 5 c) for at least one antenna element (e.g., the fourth antenna element 424-1 of fig. 4 c) included in the fourth antenna structure 424.

Fig. 5c is a plan view of the antenna module looking toward the-z-axis direction of fig. 5b, in accordance with various embodiments.

According to various embodiments with reference to fig. 5c, a plurality of antenna structures 421, 422, 423, and 424 may be arranged adjacent to the plurality of submount 501, 502, 503, and 504 on the first surface 402 of the main substrate 400. According to an embodiment, when the first surface 402 of the main substrate 400 is seen from above (when seen toward the-z-axis direction), a plurality of antenna structures 421, 422, 423, and 424 may be alternately arranged with a plurality of sub-substrates 501, 502, 503, and 504.

According to various embodiments, the plurality of sub-substrates 501, 502, 503, and 504 may include an electrical connection structure configured to electrically connect the plurality of antenna elements 421-1, 422-1, 423-1, and 424-1 included in the plurality of antenna structures 421, 422, 423, and 424, and the main substrate 400 (or the wireless communication circuit 430). According to an embodiment, the first sub-substrate 501 may comprise electrical connection structures for the first polarization and the second polarization of the first antenna element 421-1 comprised in the first antenna structure 421. For example, the first antenna element 421-1 may be electrically connected to the ninth matching element 513 by a ninth wire 511 and a twenty-fifth via 512 for signals of the first polarization. The ninth matching element 513 may be electrically connected to the main substrate 400 (e.g., the third via 455) through the twenty-sixth via 514. For example, the first antenna element 421-1 may be electrically connected to the tenth matching element 517 through a tenth wire 515 and a twenty-seventh via 516 for a second polarized signal. The tenth matching element 517 may be electrically connected to the main substrate 400 through a twenty-eighth via 518. As an example, the ninth matching element 513 and/or the tenth matching element 517 may include at least one conductive pattern disposed on at least a portion of the plurality of insulating layers configured to constitute the first sub-substrate 501. As an example, the ninth wire 511 and/or the tenth wire 515 may include a conductive pattern disposed on a surface of the first sub-substrate 501 and/or a surface of the main substrate 400 (e.g., the first surface 402).

According to an embodiment, the second sub-substrate 502 may comprise electrical connection structures for the first polarization and the second polarization of the second antenna element 422-1 comprised in the second antenna structure 422. For example, the second antenna element 422-1 may be electrically connected to the eleventh matching element 523 via the eleventh wire 521 and the twenty-ninth via 522 for signals of the first polarization. The eleventh matching element 523 may be electrically connected to the main substrate 400 (e.g., the seventh via 461) through a thirty-th via 524. For example, the second antenna element 422-1 may be electrically connected to the twelfth matching element 527 through a twelfth wire 525 and a thirty-first via 526 for a second polarized signal. The twelfth mating element 527 may be electrically connected to the main substrate 400 through a thirty-two via 528. As an example, the eleventh matching element 523 and/or the twelfth matching element 527 may include at least one conductive pattern disposed on at least a portion of the plurality of insulating layers configured to constitute the second sub-substrate 502. As an example, the eleventh wire 521 and/or the twelfth wire 525 may include a conductive pattern disposed on a surface of the second sub-substrate 502 and/or a surface of the main substrate 400 (e.g., the first surface 402).

According to an embodiment, the third sub-substrate 503 may comprise electrical connection structures for the first polarization and the second polarization of the third antenna element 423-1 comprised in the third antenna structure 423. For example, the third antenna element 423-1 may be electrically connected to the thirteenth matching element 533 through the thirteenth wire 531 and the thirty-third path 532 for the signal of the first polarization. The thirteenth mating element 533 may be electrically connected to the main substrate 400 (e.g., the eleventh via 468) through a thirty-fourth via 534. For example, third antenna element 423-1 may be electrically connected to fourteenth matching element 537 through fourteenth wire 535 and thirty-fifth via 536 for the second polarized signal. The fourteenth mating element 537 may be electrically connected to the main substrate 400 through a thirty-sixth via 538. As an example, the thirteenth matching element 533 and/or the fourteenth matching element 537 may include at least one conductive pattern disposed on at least a portion of the plurality of insulating layers configured to constitute the third sub-substrate 503. As an example, the thirteenth and/or fourteenth wires 531 and 535 may include conductive patterns disposed on a surface of the third sub-substrate 503 and/or a surface of the main substrate 400 (e.g., the first surface 402).

According to an embodiment, the fourth sub-substrate 504 may comprise electrical connection structures for the first polarization and the second polarization of the fourth antenna element 424-1 comprised in the fourth antenna structure 424. For example, the fourth antenna element 424-1 may be electrically connected to the fifteenth matching element 543 through a fifteenth wire 541 and a thirty-seventh via 542 for signals of the first polarization. The fifteenth matching element 543 may be electrically connected to the main substrate 400 (e.g., the fifteenth via 474) through a thirty-eighth via 544. For example, the fourth antenna element 424-1 may be electrically connected to the sixteenth matching element 547 through a sixteenth wire 545 and a thirty-ninth via 546 for a second polarized signal. The sixteenth matching element 547 may be electrically connected to the main substrate 400 through a forty-pass 548. As an example, the fifteenth matching element 543 and/or the sixteenth matching element 547 may include at least one conductive pattern disposed on at least a portion of the plurality of insulating layers configured to constitute the fourth sub-substrate 504. As an example, the fifteenth wire 541 and/or the sixteenth wire 545 may include a conductive pattern disposed on a surface of the fourth sub-substrate 504 and/or a surface of the main substrate 400 (e.g., the first surface 402).

According to various embodiments, an electronic device (e.g., the electronic device 101 of fig. 1 or 2, or the electronic device 300 of fig. 3 a-3 c) may include: a housing (e.g., housing 310 of fig. 3 a); a main substrate (e.g., the main substrate 400 of fig. 5 a) disposed in the inner space of the case and including a first surface (e.g., the first surface 402 of fig. 5 a) facing a first direction and a second surface (e.g., the second surface 404 of fig. 5 a) facing a second direction opposite to the first direction; a plurality of antenna structures (e.g., the plurality of antenna structures 421, 422, 423, and 424 of fig. 5 a) including at least one antenna element (e.g., the antenna elements 421-1, 422-1, 423-1, and/or 424-1 of fig. 5 a) spaced apart and disposed at specified intervals on the first surface of the main substrate; and a plurality of submount (e.g., the plurality of submount 501, 502, 503, and/or 504 of fig. 5 a) disposed adjacent to the plurality of antenna structures on the first surface of the main substrate, wherein the plurality of submount includes a matching structure (e.g., the matching element 513, 517, 523, 527, 533, 537, 543, and/or 547 of fig. 5 c) for at least one antenna element included in each of the plurality of antenna structures.

According to various embodiments, each of the plurality of antenna structures may include a rigid body and at least one antenna element included in the rigid body, and the rigid body and the plurality of sub-substrates may have different dielectric constants.

According to various embodiments, the plurality of sub-substrates may include an electrical connection structure configured to electrically connect the at least one antenna element and the main substrate.

According to various embodiments, the matching structure may include at least one conductive pattern disposed on at least one insulating layer on each of the plurality of sub-substrates.

According to various embodiments, the matching structure may include passive elements disposed on each of the plurality of sub-substrates.

According to various embodiments, a wireless communication circuit (e.g., wireless communication circuit 430 of fig. 5 a) may be further included therein, disposed on the second surface of the main substrate, electrically connected to the plurality of sub-substrates through the main substrate, and configured to transmit and/or receive wireless signals in a designated frequency band through at least one antenna element included in each of the plurality of antenna structures.

According to various embodiments, a plurality of sub-substrates may be coupled or connected to the main substrate, and a plurality of antenna structures may be coupled or connected to the plurality of sub-substrates and/or the main substrate.

Fig. 6a and 6b illustrate another example of the structure of an antenna module according to various embodiments. According to an embodiment, the antenna module of fig. 6a and 6b may be at least partially similar to the third antenna module 246 of fig. 2, and may include other embodiments of antenna modules.

According to various embodiments with reference to fig. 6a and 6b, an antenna module may include a first substrate 410, a plurality of antenna structures 421, 422, 423, and 424, a wireless communication circuit 430, and a plurality of other antenna structures 601, 602, 603, and 604. For example, the wireless communication circuit 430 of fig. 6a and 6b may operate similar to the wireless communication circuit 430 of fig. 4a and 4 b. Accordingly, in order to avoid repetition of the description of fig. 4a and fig. 4b in conjunction with the description of fig. 6a and fig. 6b, a detailed description of the wireless communication circuit 430 will be omitted.

According to various embodiments, the plurality of antenna structures 421, 422, 423, and 424 may include a plurality of antenna elements (e.g., the plurality of antenna elements 421-1, 422-1, 423-1, and 424-1 of fig. 6 c) arranged at specified intervals to form a directional beam. According to an embodiment, each of the antenna structures 421, 422, 423, or 424 may include at least one antenna element disposed at a designated interval. According to an embodiment, a plurality of antenna elements included in a plurality of antenna structures 421, 422, 423, and 424 as an array antenna 420 for supporting a first frequency band (e.g., a low frequency band) may be set to form a beam pattern in a first direction (e.g., a z-axis direction) for signals of the first frequency band.

According to various embodiments, each of the plurality of antenna structures 421, 422, 423, and 424 may be arranged in such a way that they extend through the through holes 411, 412, 413, and 414 of the first substrate 410 (or are inserted into the through holes 411, 412, 413, and 414 of the first substrate 410), respectively. According to an embodiment, in case that the plurality of antenna structures 421, 422, 423, and 424 are arranged inside the through holes 411, 412, 413, and 414 of the first substrate 410, at least portions thereof may be exposed outside the through holes 411, 412, 413, and 414 of the first substrate 410, respectively. For example, the first substrate 410 may be at least partially coupled or connected to the plurality of antenna structures 421, 422, 423, and 424 by a conductive bonding method.

According to various embodiments, the first substrate 410 may include an electrical connection structure for electrically connecting the plurality of antenna structures 421, 422, 423, and 424 arranged in the through holes 411, 412, 413, and 414 and the main substrate 400. According to an embodiment, the first substrate 410 may provide electrical connection between the first substrate 410 and/or various electronic components (e.g., the plurality of antenna structures 421, 422, 423, and 424 and/or the main substrate 400) disposed outside thereof by using electrical connection structures (e.g., wires and conductive vias formed on and through the conductive layer). According to an embodiment, the electrical connection structure included in the first substrate 410 may include a matching element (e.g., 453, 459, 465, 472 of fig. 4 c) for at least one antenna element (e.g., 421-1, 422-1, 423-1, and/or 424-1 of fig. 4 c) included in each of the plurality of antenna structures 421, 422, 423, and 424.

According to various embodiments, the plurality of other antenna structures 601, 602, 603, and 604 may include a plurality of other antenna elements (e.g., 601-1, 602-1, 603-1, and 604-1 of fig. 6 c) arranged at specified intervals to form a directional beam. According to an embodiment, each of the other antenna structures 601, 602, 603 or 604 may include at least one antenna element disposed at a specified interval. According to an embodiment, a plurality of other antenna elements included in a plurality of other antenna structures 601, 602, 603, and 604 as an array antenna 600 for supporting a second frequency band (e.g., a high frequency band) may be set to form a beam pattern in a first direction (e.g., a z-axis direction) for signals of the second frequency band.

According to various embodiments, a plurality of other antenna structures 601, 602, 603, and 604 may be arranged on the first substrate 410. For example, the first substrate 410 may be electrically and/or physically connected to the plurality of other antenna structures 601, 602, 603, and 604 by conductive bonding methods.

According to various embodiments, the first substrate 410 may include electrical connection structures for electrically connecting the plurality of other antenna structures 601, 602, 603, and 604 and the main substrate 400. According to an embodiment, the first substrate 410 may provide electrical connection between the first substrate 410 and/or various electronic components (e.g., the plurality of other antenna structures 601, 602, 603, and 604 and/or the main substrate 400) disposed outside thereof by using electrical connection structures (e.g., wires and conductive vias formed on and through the conductive layer). According to an embodiment, the electrical connection structure comprised in the first substrate 410 may comprise a matching element (e.g. 621, 622, 623, 624, 625, 626, 627 or 628 of fig. 6 e) for at least one antenna element (e.g. 601-1, 602-1, 603-1 and/or 604-1 of fig. 6 c) comprised in each of the plurality of other antenna structures 601, 602, 603 and 604.

According to various embodiments, the wireless communication circuit 430 may be disposed on the second surface 404 of the primary substrate 400 (e.g., the printed circuit board 324 of fig. 3 c). According to an embodiment, the wireless communication circuit 430 may transmit and/or receive wireless signals in a designated frequency band through a plurality of antenna elements (e.g., 421-1, 422-1, 423-1, and 424-1 of fig. 6 c) disposed on a plurality of antenna structures 421, 422, 423, and 424, or a plurality of other antenna elements (e.g., 601-1, 602-1, 603-1, and 604-1 of fig. 6 c) disposed on a plurality of other antenna structures 601, 602, 603, and 604. According to an embodiment, the wireless communication circuit 430 may transmit and/or receive wireless signals in a first frequency band (e.g., a low frequency band) through a plurality of antenna elements (e.g., 421-1, 422-1, 423-1, and 424-1 of fig. 4 c) disposed in a plurality of antenna structures 421, 422, 423, and 424 electrically connected through the first substrate 410 and the main substrate 400. According to an embodiment, the wireless communication circuit 430 may transmit and/or receive wireless signals in a second frequency band (e.g., a high frequency band) through a plurality of other antenna elements (e.g., 601-1, 602-1, 603-1, and 604-1 of fig. 6 c) disposed in a plurality of other antenna structures 601, 602, 603, and 604 electrically connected through the first substrate 410 and the main substrate 400.

Fig. 6c is a cross-sectional view of the antenna module as seen from line B-B of fig. 6B, in accordance with various embodiments. Fig. 6d is a plan view of the antenna module looking toward the-z-axis direction of fig. 6b, in accordance with various embodiments.

According to various embodiments with reference to fig. 6c and 6d, a plurality of antenna structures 421, 422, 423, and 424 may be disposed in through holes 411, 412, 413, and 414 formed through at least a portion of the first substrate 410, and may be coupled or connected to the first substrate 410 and/or the main substrate 400. According to an embodiment, when the first surface 402 of the main substrate 400 is seen from above (when seen towards the-z-axis direction), as shown in fig. 6d, a plurality of antenna structures 421, 422, 423 and 424 may be arranged in the through holes 411, 412, 413 and 414 of the first substrate 410.

According to various embodiments, the first substrate 410 may include an electrical connection structure configured to electrically connect the plurality of antenna elements 421-1, 422-1, 423-1, and 424-1 included in the plurality of antenna structures 421, 422, 423, and 424, and the main substrate 400 (or the wireless communication circuit 430). According to an embodiment, in order to avoid the repetition of the description with fig. 4c and 4d, a detailed description of an electrical connection structure configured to electrically connect the plurality of antenna elements 421-1, 422-1, 423-1, and 424-1 and the main substrate 400 (or the wireless communication circuit 430) will be omitted.

According to various embodiments, the first substrate 410 may include an electrical connection structure configured to electrically connect the plurality of other antenna elements 601-1, 602-1, 603-1, and 604-1 included in the plurality of other antenna structures 601, 602, 603, and 604 and the main substrate 400 (or the wireless communication circuit 430). According to an embodiment, the electrical connection structure included in the first substrate 410 may include a matching element 621, 622, 623, 624, 625, 626, 627 or 628 for the other antenna element 601-1, 602-1, 603-1 or 604-1 included in each of the plurality of other antenna structures 601, 602, 603 and 604. For example, the matching element 621, 622, 623, 624, 625, 626, 627 or 628 may perform the function of matching the impedance of the other antenna element 601-1, 602-1, 603-1 or 604-1 of the electrical connection. According to an embodiment, the first substrate 410 may include electrical connection structures for a first polarization (e.g., H) and a second polarization (e.g., V) of the plurality of other antenna elements 601-1, 602-1, 603-1, and 604-1 included in the plurality of other antenna structures 601, 602, 603, and 604. For example, a first other antenna element 601-1 disposed on a first other antenna structure 601 may be electrically connected to the seventeenth matching element 621 for use with signals of a first polarization. The seventeenth matching element 621 may be electrically connected to the first substrate 410 through the forty-first via 611. The first further antenna element 601-1 may be electrically connected to the eighteenth matching element 622 for use with the second polarized signal. The eighteenth matching element 622 may be electrically connected to the first substrate 410 through the forty-second via 612.

For example, a second other antenna element 602-1 disposed on a second other antenna structure 602 may be electrically connected to the nineteenth matching element 623 for signals of the first polarization. The nineteenth matching element 623 may be electrically connected to the first substrate 410 through a forty-third via 613. The second other antenna element 602-1 may be electrically connected to the twentieth matching element 624 for use with the second polarized signal. The twentieth matching element 624 may be electrically connected to the first substrate 410 through the forty-fourth via 614.

For example, a third other antenna element 603-1 disposed on a third other antenna structure 603 may be electrically connected to the twenty-first matching element 625 for signals of the first polarization. The twenty-first mating element 625 may be electrically connected to the first substrate 410 through a forty-fifth via 615. The third other antenna element 603-1 may be electrically connected to a twenty-second matching element 626 for use with the second polarized signal. The twenty-second matching element 626 may be electrically connected to the first substrate 410 through a forty-sixth via 616.

For example, a fourth other antenna element 604-1 disposed on the fourth other antenna structure 604 may be electrically connected to the twenty-third matching element 627 for signals of the first polarization. The twenty-third matching element 627 may be electrically connected to the first substrate 410 by a forty-seventh via 617. The fourth other antenna element 604-1 may be electrically connected to a twenty-fourth matching element 628 for the second polarized signal. The twenty-fourth matching element 628 may be electrically connected to the first substrate 410 through the forty-eighth via 618.

Fig. 6e illustrates another example of the structure of an antenna module according to various embodiments.

According to various embodiments with reference to fig. 6e, an antenna module may include a first substrate 410, a plurality of antenna structures 421, 422, 423, and 424, a wireless communication circuit 430, and a plurality of other antenna elements 631, 632, 633, and 634 disposed on the first substrate 410. For example, the plurality of antenna structures 421, 422, 423, and 424 and the wireless communication circuit 430 of fig. 6e may operate similar to the plurality of antenna structures 421, 422, 423, and 424 and the wireless communication circuit 430 of fig. 4a and 4 b. Accordingly, in connection with the description of fig. 6e, in order to avoid the repetition of the description with fig. 4a and 4b, detailed descriptions of the plurality of antenna structures 421, 422, 423, and 424 and the wireless communication circuit 430 will be omitted.

According to various embodiments, the first substrate 410 may have a plurality of other antenna elements 631, 632, 633, and 634 arranged to form a directional beam. According to an embodiment, a plurality of other antenna elements 631, 632, 633, and 634 may be formed on or inside the surface of the first substrate 410. According to an embodiment, the plurality of other antenna elements 631, 632, 633 and 634 may support a different frequency band from that of the plurality of antenna elements 421-1, 422-1, 423-1 and 424-1 arranged in the plurality of antenna structures 421, 422, 423 and 424.

According to various embodiments, the first substrate 410 may include an electrical connection structure for electrically connecting the plurality of other antenna elements 631, 632, 633, and 634 and the main substrate 400. According to an embodiment, the first substrate 410 may provide electrical connection between the first substrate 410 and/or various electronic components (e.g., the plurality of other antenna elements 631, 632, 633 and 634 and/or the main substrate 400) disposed outside thereof by using an electrical connection structure (e.g., wires and conductive vias formed on and through the conductive layer). According to an embodiment, the electrical connection structure included in the first substrate 410 may include matching elements for the plurality of other antenna elements 631, 632, 633 and 634.

According to an embodiment, the wireless communication circuit 430 may transmit and/or receive wireless signals in a designated frequency band through a plurality of antenna elements 421-1, 422-1, 423-1, and 424-1 disposed on a plurality of antenna structures 421, 422, 423, and 424 or a plurality of other antenna elements 631, 632, 633, and 634 disposed on the first substrate 410. According to an embodiment, the wireless communication circuit 430 may transmit and/or receive wireless signals in a first frequency band (e.g., a low frequency band) through a plurality of antenna elements (e.g., 421-1, 422-1, 423-1, and 424-1 of fig. 4 c) disposed on a plurality of antenna structures 421, 422, 423, and 424 electrically connected through the first substrate 410 and the main substrate 400. According to an embodiment, the wireless communication circuit 430 may transmit and/or receive wireless signals in a second frequency band (e.g., a high frequency band) through a plurality of other antenna elements 631, 632, 633 and 634 electrically connected via the first substrate 410 and the main substrate 400.

Fig. 7 illustrates an example of a structure of an antenna module including a plurality of array antennas according to various embodiments. According to embodiments, the antenna module of fig. 7 may be at least partially similar to the third antenna module 246 of fig. 2, and may include other embodiments of antenna modules.

According to various embodiments referring to fig. 7, an antenna module may include a first substrate 410, a plurality of antenna structures 421, 422, 423, and 424, a wireless communication circuit 430, and a third substrate 700 including a plurality of other antenna elements 720. According to an embodiment, in order to avoid the repeated description with fig. 4a, 4b and/or 4c, a detailed description of the first substrate 410, the plurality of antenna structures 421, 422, 423 and 424 and the wireless communication circuit 430 of fig. 7 will be omitted.

According to various embodiments, the plurality of antenna structures 421, 422, 423, and 424 may be arranged in such a way that they extend through the through holes 401, 402, 403, and 404 (or are inserted into the through holes 401, 402, 403, and 404), the through holes 401, 402, 403, and 404 being formed through at least a portion of the first substrate 410. For example, the plurality of antenna structures 421, 422, 423, and 424 may include a plurality of antenna elements 421-1, 422-1, 423-1, and 424-1 arranged to form a beam in a first direction (e.g., a z-axis direction).

According to various embodiments, the third substrate 700 may comprise a plurality of other antenna elements 720 arranged to form a beam in a second direction (e.g. -z-axis direction).

According to various embodiments, a plurality of other antenna elements 720 disposed on the third substrate 700 may be electrically connected to the wireless communication circuit 430 disposed on the third substrate 700. According to an embodiment, the wireless communication circuit 430 may be disposed on the third substrate 700 in an inner space 708 formed by the main substrate 400, the intermediaries 710, 712, 714, and/or 716, and the third substrate 700.

According to an embodiment, the first further antenna element 721 may be electrically connected to the twenty-fifth matching circuit 732 of the third substrate 700 through the forty-ninth via 731 of the third substrate 700. The twenty-fifth matching circuit 732 may be electrically connected to the wireless communication circuit 430 through a fifty-th via 733 of the third substrate 700. As an example, the twenty-fifth matching circuit 732 may include at least one conductive pattern disposed on at least a portion of the plurality of insulating layers configured to constitute the third substrate 700.

According to an embodiment, the second other antenna element 723 may be electrically connected to the twenty-sixth matching circuit 735 of the third substrate 700 through the fifty-first via 734 of the third substrate 700. The twenty-sixth matching circuit 735 may be electrically connected to the wireless communication circuit 430 through the fifty-first via 736 of the third substrate 700. As an example, the twenty-sixth matching circuit 735 may include at least one conductive pattern disposed on at least a portion of a plurality of insulating layers configured to constitute the third substrate 700.

According to an embodiment, the third further antenna element 725 may be electrically connected to the twenty-seventh matching circuit 738 of the third substrate 700 through a fifty-third via 737 of the third substrate 700. The twenty-seventh matching circuit 738 may be electrically connected to the wireless communication circuit 430 through a fifty-fourth path 739 of the third substrate 700. As an example, the twenty-seventh matching circuit 738 may include at least one conductive pattern disposed on at least a portion of the plurality of insulating layers configured to constitute the third substrate 700.

According to an embodiment, the fourth other antenna element 727 may be electrically connected to the twenty-eighth matching circuit 741 of the third substrate 700 through the fifty-fifth via 740 of the third substrate 700. The twenty-eighth matching circuit 741 may be electrically connected to the wireless communication circuit 430 through a fifty-sixth via 742 of the third substrate 700. As an example, the twenty-eighth matching circuit 741 may include at least one conductive pattern disposed on at least a portion of the plurality of insulating layers configured to constitute the third substrate 700.

According to various embodiments, the wireless communication circuit 430 may be electrically connected to the first substrate 410 through the third substrate 700 and the main substrate 400. According to an embodiment, the wireless communication circuit 430 may be electrically connected to the third via 455 of the main substrate 400 through a fifty-seventh via 753, a seventeenth wire 752, a fifty-eighth via 751, and a fifty-ninth via 717 of the fourth interposer 716 of the third substrate 700. For example, the third via 455 of the main substrate 400 may be electrically connected to the first matching element 453 through the second via 454 of the first substrate. As an example, the first matching element 453 may be electrically connected to a first antenna element 421-1 provided on the first antenna structure 421.

According to an embodiment, the wireless communication circuit 430 may be electrically connected to the seventh via 461 of the main substrate 400 through the sixty via 715 of the third interposer 714. For example, the seventh via 461 of the main substrate 400 may be electrically connected to the second matching element 459 through the sixth via 460 of the first substrate. As an example, the second matching element 459 may be electrically connected to the second antenna element 422-1 disposed on the second antenna structure 422.

According to an embodiment, the wireless communication circuit 430 may be electrically connected to the eleventh via 468 of the main substrate 400 through a sixty-first via 713 of the second interposer 712. For example, the eleventh via 468 of the main substrate 400 may be electrically connected to the third matching element 465 through the tenth via 467 of the first substrate. As an example, the third matching element 465 may be electrically connected to the third antenna element 423-1 disposed on the third antenna structure 423.

According to an embodiment, the wireless communication circuit 430 may be electrically connected to the fifteenth via 474 of the main substrate 400 through the sixteenth via 758, the eighteenth wire 757, the sixty-via 756, and the sixty-four via 711 of the first interposer 710 of the third substrate 700. For example, the fifteenth via 474 of the main substrate 400 may be electrically connected to the fourth matching element 472 through the fourteenth via 473 of the first substrate. As an example, the fourth matching element 472 may be electrically connected to a fourth antenna element 424-1 disposed on the fourth antenna structure 424.

According to various embodiments, the host substrate 400 may be electrically and/or physically connected to other host substrates 760 through intervening layers 770 and 772. According to an embodiment, the master substrate 400 may be electrically connected to other master substrates 760 through the sixty-five vias 751 of the fifth interposer 770 and the sixty-six vias 773 of the sixth interposer 772.

According to various embodiments, the primary substrate 400 and/or the other primary substrates 760 may each have at least one circuit 780, 781, 782, and/or 783 disposed thereon. According to an embodiment, the first circuit 780 and the second circuit 781 may be disposed on one surface of the other main substrate 760. For example, the other main substrate 760 may include a shielding member disposed on a portion of the other main substrate 760 such that the first circuit 780 and the second circuit 781 disposed on the one surface of the other main substrate 760 are electromagnetically shielded. As an example, the shielding member may include a shielding can. As an example, at least one circuit 780, 781, 782, and/or 783 may include a Communication Processor (CP) and/or a PMIC.

According to an embodiment, the third circuit 782 may be disposed on one surface (e.g., the first surface 402) of the main substrate 400. For example, the main substrate 400 may include a shielding member disposed on a portion of the main substrate 400 such that the third circuit 782 disposed on the one surface of the main substrate 400 is electromagnetically shielded.

According to an embodiment, the master substrate 400 and the other master substrates 760 may include at least circuitry disposed in an interior space 775 secured by the interposers 770 and 772. For example, the fourth circuit 783 may be disposed on the second surface 404 of the primary substrate 400 in the interior space 775 secured by the interposers 770 and 772.

According to an embodiment, the first circuit 780, the second circuit 781, the third circuit 782, and/or the fourth circuit 783 may be electrically connected to the wireless communication circuit 430 by using electrical connection structures (e.g., conductive and conductive vias formed on or through a conductive layer) disposed on the main substrate 400, the other main substrate 760, and/or the third substrate 700.

According to an embodiment, the wireless communication circuit 430 may be disposed on one surface (e.g., the second surface 404) of the main substrate 400.

According to various embodiments, the matching structures may include open circuit (single or multiple open circuit) structures, stub structures, and/or lambda/4 transformer (single-step quarter-wavelength transformer or multi-step quarter-wavelength transformer) structures.

According to various embodiments, an electronic device (e.g., the electronic device 101 of fig. 1 or 2, or the electronic device 300 of fig. 3 a-3 c) may include: a housing (e.g., housing 310 of fig. 3 a); a main substrate (e.g., the main substrate 400 of fig. 4a or 6 a) disposed in the inner space of the case and including a first surface (e.g., the first surface 402 of fig. 4a or 6 a) facing a first direction and a second surface (e.g., the second surface 404 of fig. 4a or 6 a) facing a second direction opposite to the first direction; and an antenna module disposed on the main substrate, wherein the antenna module includes: a first substrate (e.g., first substrate 410 of fig. 4a or 6 a) disposed on the first surface of the main substrate and including a plurality of through holes (e.g., through holes 401, 402, 403, and 404 of fig. 4a or 6 a); a plurality of antenna structures (e.g., the plurality of antenna structures 421, 422, 423, and 424 of fig. 4a or 6 a) disposed to penetrate the plurality of through holes, respectively, and including at least one antenna element (e.g., 421-1, 4221, 423-1, and 424-1 of fig. 4a or 6 a) spaced apart at a designated interval; and a matching structure (e.g., matching structures 453, 459, 465, 472, 483, 487, 491, and/or 495 of fig. 4a or 6 a) disposed on the first substrate and configured for at least one antenna element included in each of the plurality of antenna structures.

According to various embodiments, the plurality of antenna structures may protrude beyond the first substrate.

According to various embodiments, each of the plurality of antenna structures may include a rigid body and at least one antenna element included in the rigid body.

According to various embodiments, the rigid body and the first substrate may have different dielectric constants.

According to various embodiments, the first substrate may be coupled or connected to the main substrate, and the plurality of antenna structures may be coupled or connected to the first substrate and/or the main substrate.

According to various embodiments, the antenna module may further include a wireless communication circuit (e.g., wireless communication circuit 430 of fig. 4a or 6 a) disposed on the second surface of the main substrate and electrically connected to the first substrate through the main substrate, the wireless communication circuit may transmit and/or receive wireless signals in a designated frequency band through at least one antenna element included in each of the plurality of antenna structures.

According to various embodiments, the matching structure may include at least one conductive pattern disposed on at least one insulating layer in the first substrate.

According to various embodiments, the matching structure may include a passive element disposed on the first substrate.

According to various embodiments, the antenna module may further include an electrical connection structure disposed on the first substrate and configured to electrically connect each of the plurality of antenna structures to the main substrate.

According to various embodiments, the antenna module may further include a plurality of other antenna structures (e.g., the plurality of other antenna structures 601, 602, 603, and 604 of fig. 6 a) including at least one other antenna element (e.g., the other antenna elements 601-1, 602-1, 603-1, and/or 604-1 of fig. 6 c) disposed on the first substrate and spaced apart at a designated interval, and the at least one other antenna element included in each of the plurality of other antenna structures may support a frequency band different from the frequency band of the at least one antenna element included in each of the plurality of antenna structures.

According to various embodiments, the antenna module may further comprise an electrical connection structure disposed on the first substrate and configured to electrically connect each of the plurality of antenna structures to the main substrate, and the plurality of other antenna structures may be arranged to at least partially overlap with the electrical connection structure when the first surface of the main substrate is seen from above.

According to various embodiments, the plurality of other antenna structures and the first substrate may be at least partially coupled or connected to each other by a conductive bonding method.

According to various embodiments, the antenna module may further include a plurality of other antenna elements (e.g., the plurality of other antenna elements 631, 632, 633 and 634 of fig. 6 e) spaced apart and arranged at a designated interval on the first substrate, and the plurality of other antenna elements may support a frequency band different from a frequency band of at least one antenna element included in each of the plurality of antenna structures.

The embodiments of the present disclosure disclosed in the specification and the drawings are merely specific examples presented for the purpose of easily describing the technical contents of the embodiments according to the present disclosure and helping understanding the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of the various embodiments of the present disclosure will be interpreted to include not only the embodiments disclosed herein but also all the forms of change or modification based on the technical ideas of the various embodiments of the present disclosure.

Claims

1. An electronic device, comprising:

a main substrate including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; and

an antenna module disposed on the main substrate, wherein

The antenna module comprises

A first substrate disposed on the first surface of the main substrate and including a plurality of through holes,

a plurality of antenna structures disposed at least partially in the plurality of through holes, respectively, and including at least one antenna element spaced apart at a specified interval, and

a matching structure disposed on the first substrate and configured for including the at least one antenna element in each of the plurality of antenna structures.

2. The electronic device of claim 1, further comprising a housing, wherein the primary substrate is disposed in an interior space of the housing.

3. The electronic device of claim 1, wherein the plurality of antenna structures protrude beyond the first substrate.

4. The electronic device defined in claim 1 wherein each of the plurality of antenna structures comprises a rigid body and the at least one antenna element included in the rigid body.

5. The electronic device of claim 1, wherein the rigid body and the first substrate have different dielectric constants.

6. The electronic device of claim 1, wherein the first substrate is coupled or connected to the main substrate, and

the plurality of antenna structures are coupled or connected to the first substrate and/or the main substrate.

7. The electronic device of claim 1, wherein the antenna module further comprises a wireless communication circuit disposed on the second surface of the primary substrate and electrically connected to the first substrate through the primary substrate, and

the wireless communication circuit transmits and/or receives wireless signals in a designated frequency band through at least one antenna element included in each of the plurality of antenna structures.

8. The electronic device of claim 1, wherein the matching structure comprises at least one conductive pattern disposed on at least one insulating layer in the first substrate.

9. The electronic device of claim 1, wherein the matching structure comprises a passive element disposed on the first substrate.

10. The electronic device of claim 1, wherein the antenna module comprises an electrical connection structure disposed on the first substrate and configured to electrically connect each of the plurality of antenna structures to the main substrate.

11. The electronic device of claim 1, wherein the antenna module further comprises a plurality of other antenna structures including at least one other antenna element disposed on the first substrate and spaced apart at a specified spacing, and

the at least one other antenna element included in each of the plurality of other antenna structures supports a different frequency band than the frequency band of the at least one antenna element included in each of the plurality of antenna structures.

12. The electronic device defined in claim 11 wherein the antenna module comprises electrical connection structures that are disposed on the first substrate and that are configured to electrically connect each of the plurality of antenna structures to the host substrate.

13. The electronic device of claim 12, the plurality of other antenna structures being arranged to at least partially overlap the electrical connection structure when the first surface of the main substrate is seen from above.

14. The electronic device of claim 12, wherein the plurality of other antenna structures and the first substrate are at least partially coupled or connected to each other by a conductive bonding scheme.

15. The electronic device of claim 1, wherein the antenna module further comprises a plurality of other antenna elements spaced apart and arranged at specified intervals on the first substrate, and

the plurality of other antenna elements support a frequency band different from a frequency band of the at least one antenna element included in each of the plurality of antenna structures.