KR20220118278A - Antenna and electronic device including the same - Google Patents

Abstract

Various embodiments of the present invention relate to an electronic device including an antenna. The electronic device includes: a housing; a main substrate disposed in the inner space of the housing, including a first surface facing a first direction and a second surface facing a direction opposite to the first surface, and including a through hole; and an antenna module disposed on the main substrate and including a substrate at least partially disposed in the through hole and including a plurality of antenna elements and a wireless communication circuit configured to transmit and/or receive a wireless signal in a designated frequency band through the antenna elements on the second surface of the main substrate. Other embodiments may also be possible. Accordingly, impedance matching loss and/or insertion loss due to the main substrate can be reduced.

Description

Antenna and electronic device comprising the same

Various embodiments of the present invention relate to an antenna and an electronic device including the same.

BACKGROUND With the development of wireless communication technology, electronic devices (eg, electronic devices for communication) are commonly used in daily life, and the use of content is increasing exponentially. Due to the rapid increase in content usage, network capacity is gradually reaching its limit, and after the commercialization of the 4G (4th generation) communication system, in order to meet the increasing demand for wireless data traffic, high-frequency bands (eg mmWave, about 3 GHz ~ A communication system (eg, 5G (5th generation), pre-5G communication system, or new radio (NR)) that transmits and/or receives a signal using a frequency of 300 GHz band) is being studied.

The electronic device may include an antenna capable of transmitting and/or receiving a signal using a frequency of a high frequency band (eg, mmWave, about 3 GHz to 300 GHz band). Antenna (eg, antenna module) is being developed in various forms corresponding to the efficient mounting structure to overcome the high free space loss and increase the gain due to the characteristics of the high frequency band. For example, an antenna (eg, an antenna module) is an array antenna in which a variable number of antenna elements (eg, conductive patches and/or conductive patterns) are disposed at regular intervals on a dielectric structure (eg, a substrate). (array antenna) may be included.

The electronic device may include a wireless communication circuit (eg, a radio frequency front end (RFFE)) for substantially simultaneously transmitting and/or receiving signals through a plurality of antenna elements included in the array antenna. The wireless communication circuitry includes a plurality of amplifier circuits (eg, a power amplifier (PA) and/or a low noise amplifier (LNA)) and/or a plurality of frequency converters to transmit and/or receive a signal through each antenna element. devices (eg, a mixer and/or a phase lock loop (PLL)). As the structure of a wireless communication circuit (eg, RFFE) becomes relatively complex, a relatively larger physical area may be required.

As the electronic device becomes slim, the size of the internal space of the electronic device decreases, so it may be difficult to secure a space for arranging an array antenna and/or a wireless communication circuit.

Various embodiments of the present invention disclose an apparatus and method for reducing the size of a space (eg, a physical area) in which an antenna (eg, an antenna module) and/or a wireless communication circuit are disposed in an electronic device.

According to various embodiments, the electronic device is disposed in a housing and an internal space of the housing, and includes a first surface facing a first direction and a second surface facing in a direction opposite to the first surface, and includes a through hole. hole) and an antenna module disposed on the main board, wherein the plurality of antennas are disposed at least partially in the through hole, the board including a plurality of antenna elements and a second surface of the main board, the plurality of antennas and an antenna module including wireless communication circuitry configured to transmit and/or receive wireless signals in a designated frequency band through the elements.

According to various embodiments, the electronic device is disposed in a housing and an internal space of the housing, and includes a first surface facing a first direction and a second surface facing in a direction opposite to the first surface, and includes a through hole. hole) and an antenna module disposed on the main board, the board including a plurality of antenna elements and at least partially disposed in the through hole, electrically connected to the board, and the plurality of antenna elements It may include an antenna module including a wireless communication circuit configured to transmit and/or receive a wireless signal in a specified frequency band through the antenna module.

According to various embodiments of the present disclosure, an electronic device may at least partially arrange a plurality of antenna elements, a first substrate including a plurality of antenna elements, or a wireless communication circuit in a through hole formed in a main substrate, thereby providing an array antenna and/or a wireless communication circuit. Alternatively, a space in which the wireless communication circuit is disposed may be secured, and impedance matching loss and/or insertion loss caused by the main board may be reduced.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;
2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments of the present disclosure;
3A is a perspective view of a mobile electronic device according to various embodiments;
3B is a rear perspective view of a mobile electronic device according to various embodiments of the present disclosure;
3C is an exploded perspective view of a mobile electronic device according to various embodiments of the present disclosure;
4A and 4B show an example of a structure of an antenna module according to various embodiments.
FIG. 4C is a cross-sectional view of an antenna module taken along line AA of FIG. 4B according to various embodiments.
4D is a plan view of an antenna module viewed along the -z axis of FIG. 4B according to various embodiments of the present disclosure;
4E is a plan view of an antenna module viewed along the z-axis of FIG. 4B according to various embodiments of the present disclosure;
4F illustrates an example of a wireless communication circuit disposed in an antenna module according to various embodiments.
5A and 5B are flowcharts illustrating a manufacturing process of an antenna module according to various embodiments.
6 illustrates an example of the structure of an antenna module using an interposer according to various embodiments.
7A, 7B, and 7C show an example of a matching circuit according to various embodiments.
8A and 8B illustrate an example of a structure disposed in a through hole of a main substrate for each antenna element according to various embodiments.
9A and 9B show another example of the structure of an antenna module according to various embodiments.
9C is a cross-sectional view of an antenna module viewed from line BB of FIG. 9B according to various embodiments of the present disclosure;
9D is a plan view of an antenna module viewed along the -z axis of FIG. 9B according to various embodiments of the present disclosure;
9E is a plan view of an antenna module viewed along the z-axis of FIG. 9B according to various embodiments of the present disclosure;
9F illustrates another example of a wireless communication circuit disposed in an antenna module according to various embodiments.
10 shows another example of the structure of an antenna module using an interposer according to various embodiments.
11A and 11B illustrate an example of a structure of an antenna module including a plurality of array antennas according to various embodiments.
12A and 12B illustrate a structure in which a through hole is disposed in a partial region of an outer portion of a main substrate according to various embodiments of the present disclosure.
13 illustrates another example of the structure of an antenna module including a plurality of array antennas according to various embodiments.
14 shows an arrangement of an amplification circuit according to various embodiments.

Hereinafter, various embodiments will be described in detail with reference to the accompanying drawings.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present disclosure. Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 includes a peak data rate (eg, 20 Gbps or more) for realization of eMBB, loss coverage for realization of mMTC (eg, 164 dB or less), or U-plane latency (for URLLC realization) ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported. According to various embodiments, the subscriber identification module 196 may include a plurality of subscriber identification modules. For example, the plurality of subscriber identification modules may store different subscriber information.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 198 or the second network 199 is selected from a plurality of antennas by, for example, the communication module 190 . can be A signal or power may be transmitted or received between the communication module 190 and an external electronic device through at least one selected antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a high-frequency (eg, mmWave) antenna module. According to one embodiment, a high frequency (eg mmWave) antenna module is disposed on or adjacent to a printed circuit board, a first side (eg, bottom side) of the printed circuit board and supports a designated high frequency band (eg, mmWave band). an RFIC capable of capable of transmitting or receiving a signal in a designated high frequency band and disposed on or adjacent to a second side (eg, top or side) of the printed circuit board (eg, an array antenna). may include For example, the plurality of antennas may include a patch array antenna and/or a dipole array antenna.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signals (eg, : commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations performed by the electronic device 101 may be executed by one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to a specific embodiment, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, for example, and interchangeably with terms such as logic, logic block, component, or circuit. can be used A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of the one or more instructions stored from the storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to an embodiment, the method according to various embodiments disclosed in this document may be included in a computer program product and provided. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. . According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

2 is a block diagram 200 of an electronic device 101 for supporting legacy network communication and 5G network communication, according to various embodiments of the present disclosure.

According to various embodiments with reference to FIG. 2 , the electronic device 101 includes a first communication processor 212 , a second communication processor 214 , a first radio frequency integrated circuit (RFIC) 222 , and a second RFIC ( 224), a third RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module ( 244 , and an antenna 248 . The electronic device 101 may further include a processor 120 and a memory 130 . The network 199 may include a first network 292 and a second network 294 . According to another embodiment, the electronic device 101 may further include at least one component among the components illustrated in FIG. 1 , and the network 199 may further include at least one other network. According to an embodiment, a first communication processor 212 , a second communication processor 214 , a first RFIC 222 , a second RFIC 224 , a fourth RFIC 228 , a first RFFE 232 , and the second RFFE 234 may form at least a part of the wireless communication module 192 . According to another embodiment, the fourth RFIC 228 may be omitted or may be included as a part of the third RFIC 226 .

The first communication processor 212 may support establishment of a communication channel of a band to be used for wireless communication with the first network 292 and legacy network communication through the established communication channel. According to an embodiment, the first network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor 214 establishes a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second network 294 , and 5G network communication through the established communication channel can support According to an embodiment, the second network 294 may be a 5G network (eg, new radio (NR)) defined by 3GPP. Additionally, according to an embodiment, the first communication processor 212 or the second communication processor 214 is configured to correspond to another designated band (eg, about 6 GHz or less) among bands to be used for wireless communication with the second network 294 . It is possible to support the establishment of a communication channel, and 5G network communication through the established communication channel. According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to an embodiment, the first communication processor 212 or the second communication processor 214 may be formed in a single chip or a single package with the processor 120 , the coprocessor 123 , or the communication module 190 . .

According to an embodiment, the first communication processor 212 may transmit/receive data to and from the second communication processor 214 . For example, data classified to be transmitted through the second network 294 may be changed to be transmitted through the first network 292 .

In this case, the first communication processor 212 may receive transmission data from the second communication processor 214 . For example, the first communication processor 212 may transmit and receive data through the interface between the second communication processor 214 and the processor. For example, the interprocessor interface may be implemented as a universal asynchronous receiver/transmitter (UART) (eg, high speed-UART (HS-UART)) or a peripheral component interconnect bus express (PCIe) interface, but there is no limitation on the type . For example, the first communication processor 212 and the second communication processor 214 may exchange control information and packet data information using a shared memory. For example, the first communication processor 212 may transmit/receive various information such as sensing information, information on output strength, and resource block (RB) allocation information to and from the second communication processor 214 .

Depending on the implementation, the first communication processor 212 may not be directly coupled to the second communication processor 214 . In this case, the first communication processor 212 may transmit and receive data through the second communication processor 214 and the processor 120 (eg, an application processor). For example, the first communication processor 212 and the second communication processor 214 may transmit and receive data with the processor 120 (eg, an application processor) through the HS-UART interface or the PCIe interface, but There is no restriction on the type. For example, the first communication processor 212 and the second communication processor 214 may exchange control information and packet data information using a shared memory with the processor 120 (eg, an application processor). can According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be formed in a single chip or a single package with the processor 120 , the coprocessor 123 , or the communication module 190 . .

The first RFIC 222, when transmitting, transmits a baseband signal generated by the first communication processor 212 to about 700 MHz to about 3 GHz used in the first network 292 (eg, a legacy network). can be converted to a radio frequency (RF) signal of Upon reception, an RF signal is obtained from a first network 292 (eg, a legacy network) via an antenna (eg, a first antenna module 242 ), and via an RFFE (eg, a first RFFE 232 ). It may be preprocessed. The first RFIC 222 may convert the preprocessed RF signal into a baseband signal to be processed by the first communication processor 212 .

The second RFIC 224, when transmitting, transmits the baseband signal generated by the first communication processor 212 or the second communication processor 214 to the second network 294 (eg, a 5G network). It can be converted into an RF signal (hereinafter, 5G Sub6 RF signal) of the Sub6 band (eg, about 6 GHz or less). Upon reception, a 5G Sub6 RF signal is obtained from the second network 294 (eg, 5G network) via an antenna (eg, second antenna module 244 ), and RFFE (eg, second RFFE 234 ) can be pre-processed. The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding one of the first communication processor 212 or the second communication processor 214 .

The third RFIC 226 transmits the baseband signal generated by the second communication processor 214 to the RF of the 5G Above6 band (eg, about 6 GHz to about 60 GHz) to be used in the second network 294 (eg, 5G network). It can be converted into a signal (hereinafter referred to as 5G Above6 RF signal). Upon reception, a 5G Above6 RF signal may be obtained from the second network 294 (eg, 5G network) via an antenna (eg, antenna 248 ) and pre-processed via a third RFFE 236 . The third RFIC 226 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214 . According to one embodiment, the third RFFE 236 may be formed as part of the third RFIC 226 .

According to an embodiment, the electronic device 101 may include the fourth RFIC 228 separately from or as at least a part of the third RFIC 226 . In this case, the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter, IF signal) of an intermediate frequency band (eg, about 9 GHz to about 11 GHz). After conversion, the IF signal may be transmitted to the third RFIC 226 . The third RFIC 226 may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second network 294 (eg, 5G network) via an antenna (eg, antenna 248 ) and converted into an IF signal by the third RFIC 226 . . The fourth RFIC 228 may convert the IF signal into a baseband signal for processing by the second communication processor 214 .

According to an embodiment, the first RFIC 222 and the second RFIC 224 may be implemented as at least a part of a single chip or a single package. According to an embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as at least a part of a single chip or a single package. According to an embodiment, at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or may be combined with another antenna module to process RF signals of a plurality of corresponding bands.

According to an embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246 . For example, the wireless communication module 192 or the processor 120 may be disposed on the first substrate (eg, main PCB). In this case, the third RFIC 226 is located in a partial area (eg, the bottom surface) of the second substrate (eg, sub PCB) separate from the first substrate, and the antenna 248 is located in another partial region (eg, the top surface). is disposed, the third antenna module 246 may be formed. By disposing the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This, for example, can reduce loss (eg, attenuation) of a signal in a high-frequency band (eg, about 6 GHz to about 60 GHz) used for 5G network communication by the transmission line. Accordingly, the electronic device 101 may improve the quality or speed of communication with the second network 294 (eg, a 5G network).

According to an embodiment, the antenna 248 may be formed as an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC 226 may include, for example, as a part of the third RFFE 236 , a plurality of phase shifters 238 corresponding to a plurality of antenna elements. During transmission, each of the plurality of phase shifters 238 may transform the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element. . Upon reception, each of the plurality of phase shifters 238 may convert the phase of the 5G Above6 RF signal received from the outside through the corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.

The second network 294 (eg, 5G network) may be operated independently (eg, stand-alone (SA)) or connected to the first network 292 (eg, legacy network) (eg: non-stand alone (NSA)). For example, the 5G network may have only an access network (eg, 5G radio access network (RAN) or next generation RAN (NG RAN)), and may not have a core network (eg, next generation core (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 may access an external network (eg, the Internet) under the control of a core network (eg, evolved packed core (EPC)) of the legacy network. Protocol information for communication with a legacy network (eg, LTE protocol information) or protocol information for communication with a 5G network (eg, new radio (NR) protocol information) is stored in the memory 130, and other components (eg, processor 120 , the first communication processor 212 , or the second communication processor 214 ).

3A is a perspective view of a front surface of an electronic device 300 according to various embodiments of the present disclosure. 3B is a rear perspective view of an electronic device 300 according to various embodiments. The electronic device 300 of FIGS. 3A and 3B may be at least partially similar to the electronic device 101 of FIGS. 1 or 2 , or may include other embodiments of the electronic device.

The electronic device 300 (eg, the electronic device 101 of FIG. 1 ) according to various embodiments with reference to FIGS. 3A and 3B includes a first surface (or front) 310A, a second surface (or rear). and a housing 310 including a side surface 310C surrounding a space (or interior space) between the first surface 310A and the second surface 310B. In one embodiment (not shown), the housing 310 may refer to a structure that forms part of the first surface 310A, the second surface 310B, and the side surface 310C. According to one embodiment, the first surface 310A may be formed by a front plate 302 (eg, a glass plate comprising various coating layers, or a polymer plate) that is at least partially transparent. The second surface 310B may be formed by a substantially opaque back plate 311 . The back plate 311 may be formed, for example, by coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. can be The side surface 310C engages the front plate 302 and the rear plate 311 and may be formed by a side bezel structure (or “side member”) 318 comprising a metal and/or a polymer. In some embodiments, the back plate 311 and the side bezel structure 318 are integrally formed and may include the same material (eg, a metal material such as aluminum).

According to various embodiments, the front plate 302 includes first regions 310D that seamlessly extend by bending from the first side 310A toward the back plate 311 , the long edge of the front plate 302 . (long edge) can be included at both ends. In the illustrated embodiment (see FIG. 3B ), the rear plate 311 may include second regions 310E that extend seamlessly from the second surface 310B toward the front plate 302 at both ends of the long edge. have. In some embodiments, front plate 302 (or back plate 311 ) may include only one of first regions 310D (or second regions 310E). In one embodiment, the front plate 302 (or the back plate 311 ) may not include some of the first regions 310D (or the second regions 310E). In one embodiment, when viewed from the side of the electronic device 300 , the side bezel structure 318 has a first thickness (or width) at the side where the first area 310D or the second area 310E is not included. ), and may have a second thickness thinner than the first thickness on the side surface including the first region 310D or the second region 310E.

According to an embodiment, the electronic device 300 includes a display 301 , audio modules 303 , 307 , 314 , sensor modules 304 and 319 , camera modules 305 , 312 , 313 , and a key input device ( 317 ), an indication (not shown), and at least one of connector holes 308 and 309 . In some embodiments, the electronic device 300 may omit at least one of the components (eg, the key input device 317 , the indicator, or the connector holes 308 and 309 ) or additionally include other components. .

According to various embodiments, the display 301 may be visually exposed through a substantial portion of the front plate 302 . In some embodiments, at least a portion of the display 301 may be visually exposed through the front plate 302 defining the first area 310D of the first side 310A and side 310C. In some embodiments, the edge of the display 301 may be formed to be substantially identical to an adjacent outer shape of the front plate 302 . In one embodiment (not shown), in order to expand the area to which the display 301 is exposed, the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be substantially the same.

In one embodiment (not shown), an audio module 314, a sensor module ( 304), at least one of the camera module 305 and the indicator may be included. In an embodiment (not shown), at least one of an audio module 314 , a sensor module 304 , a camera module 305 , and an indicator may be included on the rear surface of the screen display area of the display 301 . For example, the audio module 314 , the camera module 305 , the sensor module 304 and/or the indicator are perforated from the interior space of the electronic device 300 to the front plate 302 of the display 301 . It may be arranged so as to be in contact with an external environment through the opening. For another example, some sensor modules 304 , camera modules 305 and/or indicators may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device 300 . may be For example, the area of the display 301 facing the sensor module 304 , the camera module 305 and/or the indicator may not require a perforated opening.

In one embodiment (not shown), the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen. can be placed. In some embodiments, at least a portion of the sensor modules 304 , 319 , and/or at least a portion of the key input device 317 may be disposed in the first area 310D, and/or the second area 310E. have.

According to various embodiments, the audio modules 303 , 307 , and 314 may include a microphone hole 303 and speaker holes 307 and 314 . In the microphone hole 303, a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a call receiver hole 314 . In some embodiments, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as a single hole, or a speaker (eg, a piezo speaker) may be included without the speaker holes 307 and 314 .

According to various embodiments, the sensor modules 304 and 319 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 300 or an external environmental state. The sensor modules 304 and 319 include, for example, a first sensor module 304 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first surface 310A of the housing 310 . ) (eg, a fingerprint sensor), and/or a third sensor module 319 (eg, an HRM sensor) disposed on the second surface 310B of the housing 310 . The fingerprint sensor may be disposed on the second surface 310B as well as the first surface 310A (eg, the display 301 ) of the housing 310 . For example, a fingerprint sensor (eg, an ultrasonic fingerprint sensor or an optical fingerprint sensor) may be disposed below the display 301 of the first surface 310A. The electronic device 300 includes a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor 304 .

According to various embodiments, the camera modules 305 , 312 , and 313 are, the first camera device 305 disposed on the first side 310A of the electronic device 300 , and the second side 310B disposed on the electronic device 300 . It may include a second camera device 312 , and/or a flash 313 . The camera module 305 , 312 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300 .

According to various embodiments, the key input device 317 may be disposed on the side surface 310C of the housing 310 . In an embodiment, the electronic device 300 may not include some or all of the key input devices 317 , and the not included key input devices 317 are displayed in the form of soft keys on the display 301 . can be implemented. In some embodiments, the key input device 317 may be implemented using a pressure sensor included in the display 301 .

According to various embodiments, an indicator (not shown) may be disposed on the first surface 310A of the housing 310 . The indicator may provide, for example, state information of the electronic device 300 in the form of light. In an embodiment, the indicator may provide, for example, a light source that is linked to the operation of the camera module 305 . Indicators may include, for example, LEDs, IR LEDs and xenon lamps.

According to various embodiments, the connector holes 308 and 309 include a first connector hole 308 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device; and/or a second connector hole (eg, earphone jack) 309 capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device.

3C is an exploded perspective view of an electronic device 300 according to various embodiments.

According to various embodiments with reference to FIG. 3C , the electronic device 300 includes a side bezel structure 321 , a first support member 3211 (eg, a bracket), a front plate 322 , a display 323 , and printing. It may include a circuit board 324 (eg, a main board), a battery 325 , a second support member 326 (eg, a rear case), an antenna 327 , and a rear plate 328 . In some embodiments, the electronic device 300 may omit at least one of the components (eg, the first support member 3211 or the second support member 326 ) or additionally include other components. . At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 300 of FIG. 3A or 3B , and overlapping descriptions will be omitted below.

According to various embodiments, the first support member 3211 may be disposed inside the electronic device 300 and connected to the side bezel structure 321 , or may be integrally formed with the side bezel structure 321 . The first support member 3211 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The first support member 3211 may have a display 323 coupled to one surface and a printed circuit board 324 coupled to the other surface. Printed circuit board 324 includes a processor (eg, processor 120 in FIG. 1 ), memory (eg, memory 130 in FIG. 1 ), and/or an interface (eg, interface 177 in FIG. 1 ). can be mounted The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

The memory may include, for example, a volatile memory (eg, the volatile memory 132 of FIG. 1 ) or a non-volatile memory (eg, the non-volatile memory 134 of FIG. 1 ).

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

According to various embodiments, the battery 325 is a device for supplying power to at least one component of the electronic device 300 , for example, a non-rechargeable primary cell, or a rechargeable secondary cell, or fuel. It may include a battery. At least a portion of the battery 325 may be disposed substantially coplanar with the printed circuit board 324 , for example. The battery 325 may be integrally disposed inside the electronic device 300 , or may be disposed detachably from the electronic device 300 .

According to various embodiments, the antenna 327 may be disposed between the back plate 328 and the battery 325 . The antenna 327 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 327 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In one embodiment, the antenna structure may be formed by a part of the side bezel structure 321 and/or the first support member 3211 or a combination thereof.

According to various embodiments, the electronic device 300 may have a bar-type or plate-type appearance, but the appearance of the electronic device 300 is not limited thereto. For example, the electronic device 300 may be a foldable electronic device, a slideable electronic device, a stretchable electronic device, and/or a part of a rollable electronic device.

4A and 4B show an example of a structure of an antenna module according to various embodiments. According to an embodiment, the antenna module of FIGS. 4A and 4B may be at least partially similar to the third antenna module 246 of FIG. 2 , or may include other embodiments of the antenna module.

According to various embodiments with reference to FIGS. 4A and 4B , the antenna module includes a first substrate 410 including a plurality of antenna elements 420 and a wireless communication circuit 430 electrically connected to the first substrate 410 . ) may be included.

According to various embodiments, the first substrate 410 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The first substrate 410 may provide an electrical connection between the first substrate 410 and/or various electronic components disposed outside by using wires and conductive vias formed in the conductive layer.

According to various embodiments, the first substrate 410 may include a plurality of antenna elements 420 disposed at predetermined intervals to form a directional beam. According to an embodiment, the antenna elements 420 may be formed on or inside the first surface 412 of the first substrate 410 . According to an embodiment, the plurality of antenna elements 420 may be configured to form a beam pattern in a first direction (eg, a z-axis direction).

According to various embodiments, the first substrate 410 may have a through hole 402 formed in at least a portion of the main substrate 400 (eg, the printed circuit board 324 of FIG. 3C ), as shown in FIG. 4B . may be at least partially disposed on. According to an embodiment, when the first surface 412 of the first substrate 410 is disposed in the through hole 402 of the main substrate 400 , the first surface 412 of the main substrate 400 is It may protrude from one side 404 . According to an embodiment, when the first surface 412 of the first substrate 410 is disposed in the through hole 402 of the main substrate 400 , the first surface 412 of the main substrate 400 is It may be disposed substantially the same as the first side 404 . According to an embodiment, when the first surface 412 of the first substrate 410 is disposed in the through hole 402 of the main substrate 400 , the first surface 412 of the main substrate 400 is It may be disposed lower than one side 404 . According to an embodiment, the first substrate 410 may be formed of a material having a relatively lower dielectric constant than that of the main substrate 400 .

According to various embodiments, when the first substrate 410 is disposed to be inserted into the through hole 402 of the main board 400 , the wireless communication circuit ( 430) may be combined or connected. According to an embodiment, the first substrate 410 and the wireless communication circuit 430 may be electrically and/or physically coupled through a conductive bonding method. For example, the conductive bonding method may include soldering, jet soldering, and/or an anisotropic conductive film (ACF).

According to one embodiment, when the wireless communication circuit 430 is viewed from above (eg, -z-axis direction) the first surface 404 of the main board 400, as shown in FIG. 4B, the main board 400 and may be disposed to at least partially overlap. According to an embodiment, when the wireless communication circuit 430 is viewed in the z-axis direction, at least a portion of the wireless communication circuit 430 overlaps with the main board 400 , and at least a portion of the remaining at least a portion of the main board 400 . The first substrate 410 disposed in the through hole 402 and the through hole 402 may overlap. For example, the wireless communication circuit 430 may be coupled or connected to the main board 400 . For example, the wireless communication circuit 430 and the main board 400 may be electrically and/or physically coupled through a conductive bonding method. For example, the wireless communication circuit 430 may include one chipset or package.

According to various embodiments, the wireless communication circuit 430 may transmit and/or receive a wireless signal in a designated frequency band through the plurality of antenna elements 420 disposed on the first substrate 410 . According to an embodiment, the wireless communication circuit 430 (eg, the third RFIC 226 of FIG. 2 ) may include at least one circuit (eg, communication) disposed on the main board 400 through the main board 400 . The processor may be electrically connected to a communication processor (CP) 452 and/or a PMIC 454 . For example, the wireless communication circuit 430 may up-convert a baseband signal obtained from the communication processor 452 into an RF signal of a designated band during transmission. The RF signal may be transmitted to the plurality of antenna elements 420 through the first substrate 410 . The wireless communication circuit 430, upon reception, down-converts an RF signal received through a plurality of antenna elements 420 (eg, an array antenna) disposed on the first substrate 410 into a baseband signal. communication processor 452 . For another example, the wireless communication circuit 430, at the time of transmission, an IF signal (eg, about 9 GHz ~) obtained from an intermediate frequency integrate circuit (IFIC) (eg, the fourth RFIC 228 of FIG. about 11 GHz) can be up-converted into an RF signal of a designated band. The wireless communication circuit 430, upon reception, down-converts an RF signal obtained through the plurality of antenna elements 420 (eg, an array antenna) disposed on the first substrate 410 into an IF signal to the IFIC. can transmit

According to various embodiments, the main substrate 400 may be disposed in a housing (eg, the housing 310 of FIG. 3A ) of the electronic device (eg, the electronic device 300 of FIG. 3A ). According to an embodiment, at least one circuit may be disposed on one surface (eg, the first surface 404 and/or the second surface 406 ) of the main substrate 400 . For example, the main board 400 may have a communication processor 452 and/or a power management integrate circuit (PMIC) 454 disposed on the first side 404 (or the second side 406 ).

According to an embodiment, the communication processor 452 (eg, the processor 120 of FIG. 1 , the first communication processor 212 of FIG. 2 , or the second communication processor 214 of FIG. 2 ) may process a baseband signal. . For example, the communication processor 452 may generate a baseband signal and transmit it to the wireless communication circuit 430 through the main board 400 . For example, the communication processor 452 may process a baseband signal received from the wireless communication circuit 430 through the main board 400 . According to an embodiment, the PMIC 454 may receive a voltage from the main board 400 to provide power required for various components (eg, the wireless communication circuit 430 ) on the antenna module.

FIG. 4C is a cross-sectional view of an antenna module taken along line A-A of FIG. 4B according to various embodiments of the present disclosure; 4D is a plan view of an antenna module viewed along the -z axis of FIG. 4B according to various embodiments of the present disclosure; 4E is a plan view of an antenna module viewed along the z-axis of FIG. 4B according to various embodiments of the present disclosure;

According to various embodiments with reference to FIGS. 4C, 4D, and 4E, at least a portion of the first substrate 410 is disposed in a through hole 402 formed in at least a portion of the main substrate 400, and a wireless communication circuit ( 430) and may be combined or connected. According to an embodiment, when the first surface 404 of the main substrate 400 is viewed from above (eg, -z-axis direction), the first substrate 410 is It may be disposed in the through hole 402 . According to an embodiment, the wireless communication circuit 430 penetrates the main board 400 as shown in FIG. 4E when the second surface 406 of the main board 400 is viewed from above (eg, in the z-axis direction). The first substrate 410 disposed in the hole 402 may be at least partially overlapped with the main substrate 400 to support it.

According to various embodiments, the first substrate 410 may include a plurality of antenna elements 420 and/or a plurality of matching circuits 461 , 462 , 463 and 464 . For example, the plurality of antenna elements 420 may include a first element 421 , a second element 422 , a third element 423 , or a fourth element 424 . According to an embodiment, the plurality of matching circuits 461 , 462 , 463 and 464 may serve to match the impedance of the electrically connected antenna element 421 , 422 , 423 or 424 . For example, the first element 421 may be electrically connected to the first matching circuit 461 through the first via 471 . The second element 422 may be electrically connected to the second matching circuit 462 through the second via 472 . The third element 423 may be electrically connected to the third matching circuit 463 through the third via 473 . The fourth element 424 may be electrically connected to the fourth matching circuit 464 through the fourth via 474 .

According to various embodiments, the first substrate 410 may be electrically and/or physically connected to the wireless communication circuit 430 through a conductive bonding method. According to an embodiment, the first matching circuit 461 of the first substrate 410 may be electrically connected to the wireless communication circuit 430 through the fifth via 475 . According to an embodiment, the second matching circuit 462 of the first substrate 410 may be electrically connected to the wireless communication circuit 430 through the sixth via 476 . According to an embodiment, the third matching circuit 463 of the first substrate 410 may be electrically connected to the wireless communication circuit 430 through the seventh via 477 . According to an embodiment, the fourth matching circuit 464 of the first substrate 410 may be electrically connected to the wireless communication circuit 430 through the eighth via 478 .

According to various embodiments, the wireless communication circuit 430 is electrically connected to at least one circuit (eg, the communication processor 452 and/or the PMIC 454 ) disposed on the main board 400 through the main board 400 . can be connected to According to an embodiment, the wireless communication circuit 430 may be electrically connected to the second electrical wiring 489 of the main board 400 through the fifteenth via 488 of the main board 400 . The second electrical wiring 489 of the main board 400 may be electrically connected to the communication processor 452 through the 16th via 490 . For example, the wireless communication circuit 430 may transmit and/or receive a signal (eg, a control signal, a baseband signal, or an IF signal) with the communication processor 452 electrically connected through the main board 400 .

According to an embodiment, the wireless communication circuit 430 may be electrically connected to the fourth electrical wiring 495 of the main board 400 through the 19th via 494 of the main board 400 . The fourth electrical wiring 495 of the main board 400 may be electrically connected to the PMIC 454 through the twentieth via 496 . For example, the wireless communication circuit 430 may receive a power signal from the PMIC 454 electrically connected through the main board 400 .

According to various embodiments, the main substrate 400 may include at least one circuit. According to an embodiment, a communication processor (CP) 452 and/or a PMIC 454 may be disposed on the first surface 404 of the main board 400 . According to an embodiment, at least one other circuit 456 and/or 458 may be disposed on the second surface 406 of the main substrate 400 . According to an embodiment, the main substrate 400 may further include a shielding member (not shown). For example, the shielding member may be disposed on a portion of the main substrate 400 to electromagnetically shield at least one circuit 452 , 454 , 456 , and/or 458 disposed on the main substrate 400 . For example, the shielding member may include a shield can.

According to various embodiments, the first substrate 410 may be electrically connected to the wireless communication circuit 430 through the main substrate 400 . According to an embodiment, the first substrate 410 and the main substrate 400 may be electrically and/or physically coupled through a conductive bonding method. The first substrate 410 may be electrically connected to the wireless communication circuit 430 through the main substrate 400 electrically and/or physically coupled through a conductive bonding method.

4F illustrates an example of a wireless communication circuit disposed in an antenna module according to various embodiments.

According to various embodiments with reference to FIG. 4F , at least a portion of the first substrate 410 is disposed in the through hole 402 formed in at least a portion of the main substrate 400 , and is coupled or connected to the second substrate 440 . can According to an embodiment, when the second surface 406 of the main substrate 400 is viewed from above (eg, in the z-axis direction), the second substrate 440 is disposed within the through hole 402 of the main substrate 400 . The first substrate 410 may be disposed to at least partially overlap with the main substrate 400 to support the disposed first substrate 410 . According to an exemplary embodiment, a detailed description of the first substrate 410 of FIG. 4F is omitted to avoid overlapping description with FIG. 4C .

According to various embodiments, the first substrate 410 may be electrically and/or physically connected to the second substrate 440 through a conductive bonding method (eg, soldering). According to an embodiment, the first matching circuit 461 of the first substrate 410 communicates with the wireless communication circuit 430 through the fifth via 475 and the ninth via 481 of the second substrate 440 . can be electrically connected. For example, the fifth via 475 and the ninth via 481 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). According to an embodiment, the second matching circuit 462 of the first substrate 410 communicates with the wireless communication circuit 430 through the sixth via 476 and the tenth via 482 of the second substrate 440 . It can be electrically connected. For example, the sixth via 476 and the tenth via 482 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). According to an embodiment, the third matching circuit 463 of the first substrate 410 communicates with the wireless communication circuit 430 through the seventh via 477 and the eleventh via 483 of the second substrate 440 . can be electrically connected. For example, the seventh via 477 and the eleventh via 483 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). According to an embodiment, the fourth matching circuit 464 of the first substrate 410 communicates with the wireless communication circuit 430 through the eighth via 478 and the twelfth via 484 of the second substrate 440 . It can be electrically connected. For example, the eighth via 478 and the twelfth via 484 may be electrically and/or physically connected through a conductive bonding method (eg, soldering).

According to various embodiments, the wireless communication circuit 430 may be disposed on one surface of the second substrate 440 . According to an embodiment, the wireless communication circuit 430 may be fixed by a protective layer 440 - 1 (eg, resin) on one surface of the second substrate 440 .

According to various embodiments, the wireless communication circuit 430 includes at least one circuit (eg, a communication processor 452 and/or a communication processor 452 ) disposed on the main board 400 through the second board 440 and the main board 400 . It may be electrically connected to the PMIC 454). According to an embodiment, the wireless communication circuit 430 may be electrically connected to the first electrical wiring 486 of the second substrate 440 through the thirteenth via 485 . The first electrical wiring 486 of the second substrate 440 is connected to the second electrical wiring 489 of the main substrate 400 through the 14th via 487 and the 15th via 488 of the main substrate 400 . can be electrically connected. The second electrical wiring 489 of the main board 400 may be electrically connected to the communication processor 452 through the 16th via 490 . For example, the fourteenth via 487 and the fifteenth via 488 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). For example, the wireless communication circuit 430 transmits and transmits a signal (eg, a control signal, a baseband signal, or an IF signal) with the communication processor 452 electrically connected through the second substrate 440 and the main substrate 400 . / or receive.

According to an embodiment, the wireless communication circuit 430 may be electrically connected to the third electrical wiring 492 of the second substrate 440 through the seventeenth via 491 . The third electrical wiring 492 of the second substrate 440 is connected to the fourth electrical wiring 495 of the main substrate 400 through the 18th via 493 and the 19th via 494 of the main substrate 400 . can be electrically connected. The fourth electrical wiring 495 of the main board 400 may be electrically connected to the PMIC 454 through the twentieth via 496 . For example, the eighteenth via 493 and the nineteenth via 494 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). For example, the wireless communication circuit 430 may receive a power signal from the PMIC 454 electrically connected through the second substrate 440 and the main substrate 400 .

According to various embodiments, at least one circuit 452 , 454 , 456 , and/or 458 disposed on the main board 400 may be connected to the main board through a separate board (not shown), such as the wireless communication circuit 430 . It may be disposed on the substrate 400 .

According to various embodiments, the electronic device 101 or 300 inserts the first substrate 410 including the plurality of antenna elements 420 (eg, an array antenna) into the through hole 402 of the main substrate 400 . By positioning, the space (eg height) required by the antenna module can be reduced.

5A and 5B are flowcharts 500 illustrating a manufacturing process of an antenna module according to various embodiments.

According to various embodiments with reference to FIGS. 5A and 5B , in operation 501 , the first substrate 410 may be connected to one surface (eg, the first surface 432 ) of the wireless communication circuit 430 . According to one embodiment, the first substrate 410 may be electrically and/or physically coupled to the first side 432 of the wireless communication circuitry 430 (510 and 520 ). For example, the first substrate 410 may include a plurality of antenna elements 420 and/or a plurality of matching circuits disposed within or on the first surface 412 of the first substrate 410 to form a directional beam. (461, 462, 463 and 464). For example, the first substrate 410 may include the second surface 414 or a ground formed therein. According to an embodiment, the plurality of antenna elements 420 disposed on the first substrate 410 may be electrically connected to the wireless communication circuit 430 through the first substrate 410 .

In operation 503 , at least a portion of the first substrate 410 disposed on one surface (eg, the first surface 432 ) of the wireless communication circuit 430 is disposed inside the through hole 402 of the main board 400 . can be According to an embodiment, the wireless communication circuit 430 may be coupled to at least partially overlap the main board 400 . For example, the wireless communication circuit 430 and the main board 400 may be electrically and/or physically coupled through a conductive bonding method (eg, soldering) for some overlapping regions ( 530 ). According to an embodiment, the wireless communication circuit 430 is electrically connected to at least one circuit (eg, the communication processor 452 and/or the PMIC 454 ) disposed on the main board 400 through the main board 400 . can be connected to

According to various embodiments, the order of the operations for manufacturing the antenna module shown in FIG. 5A may be at least partially changed, or some operations may be omitted. According to an embodiment, the wireless communication circuit 430 may be coupled to at least partially overlap the main board 400 . The first substrate 410 may be disposed inside the through hole of the main substrate 400 coupled to the wireless communication circuit 430 to at least partially overlap.

6 illustrates an example of the structure of an antenna module using an interposer according to various embodiments. According to an embodiment, the antenna module of FIG. 6 may be at least partially similar to the third antenna module 246 of FIG. 2 , or may include other embodiments of the antenna module.

According to various embodiments with reference to FIG. 6 , the antenna module includes a first substrate 410 including a plurality of antenna elements 420 and a wireless communication circuit 430 electrically connected to the first substrate 410 . can do. For example, the plurality of antenna elements 420 may include a first element 421 , a second element 422 , a third element 423 , or a fourth element 424 . According to an embodiment, a detailed description of the first substrate 410 and the wireless communication circuit 430 of FIG. 6 is omitted to avoid overlapping description with FIGS. 4A, 4B, 4C and/or 4F.

According to various embodiments, the wireless communication circuit 430 includes at least one circuit (eg, a communication processor 452 ) disposed on the main board 400 through the interposer 600 and/or 610 and the main board 400 . and/or the PMIC 454). According to an embodiment, the wireless communication circuit 430 is configured to connect the second via 621 of the first interposer 600 and the second via 488 of the main board 400 to the second via 488 of the main board 400 . It may be electrically connected to the electrical wiring 489 . For example, the twenty-first via 621 and the fifteenth via 488 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). For example, the wireless communication circuit 430 may transmit and/or receive a signal (eg, a control signal, a baseband signal, or an IF signal) with the communication processor 452 electrically connected thereto.

According to an embodiment, the wireless communication circuit 430 is configured to connect the fourth via 623 of the second interposer 610 and the 19th via 494 of the main board 400 to the fourth of the main board 400 . It may be electrically connected to the electrical wiring 495 . For example, the 22nd via 623 and the 19th via 494 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). For example, the wireless communication circuit 430 may receive a power signal from the electrically connected PMIC 454 .

According to various embodiments, the electronic device 101 or 300 electrically and/or physically connects the main board 400 and the wireless communication circuit 430 through the interposers 600 and 610, so that a plurality of antenna elements The space (eg, height) required by the antenna module by disposing the first substrate 410 including the elements 420 (eg, an array antenna) relatively deeper in the through hole 402 of the main substrate 400 . can reduce

7A, 7B, and 7C show an example of a matching circuit according to various embodiments. 7B is a plan view of the second surface 414 of the first substrate 410 . 7C is a plan view of a first side 432 of the wireless communication circuitry 430 . According to an embodiment, the antenna module of FIGS. 7A, 7B and 7C may be at least partially similar to the third antenna module 246 of FIG. 2 , or may include other embodiments of the antenna module.

7A, 7B, and 7C illustrate a plurality of matching circuits 701-1, 701-2, 702-1, 702-2, 703-1, 703-2, and 704-1, according to various embodiments to which reference is made. and 704 - 2 may be disposed in a bonding area between the first substrate 410 and the wireless communication circuit 430 . According to an embodiment, at least some of the plurality of matching circuits 701-1, 701-2, 702-1, 702-2, 703-1, 703-2, 704-1 and 704-2 wirelessly communicate It may be disposed on the first side 432 of the circuit 430 . The remaining at least some of the plurality of matching circuits 701-1, 701-2, 702-1, 702-2, 703-1, 703-2, 704-1, and 704-2 are formed on the first substrate 410 . It may be disposed on the second surface 414 .

According to an embodiment, a first polarization (eg, one of the plurality of matching circuits 701-1, 701-2, 702-1, 702-2, 703-1, 703-2, 704-1 and 704-2) : The first matching circuit 701-1, the third matching circuit 702-1, the fifth matching circuit 703-1 and the seventh matching circuit 704-1 related to horizontal polarization are 7C , it may be disposed on the first side 432 of the wireless communication circuit 430 . For example, the first matching circuit 701-1 may be electrically connected to the first element 421 disposed on the first substrate 410 through the first via 471 of the first substrate 410 . . The first matching circuit 701 may be electrically connected to the wireless communication circuit 430 . For example, the third matching circuit 702-1 may be electrically connected to the second element 422 disposed on the first substrate 410 through the second via 472 of the first substrate 410 . . The third matching circuit 702-1 may be electrically connected to the wireless communication circuit 430 . For example, the fifth matching circuit 703 - 1 may be electrically connected to the third element 423 disposed on the first substrate 410 through the third via 473 of the first substrate 410 . . The fifth matching circuit 703 - 1 may be electrically connected to the wireless communication circuit 430 . For example, the seventh matching circuit 704 - 1 may be electrically connected to the fourth element 424 disposed on the first substrate 410 through the fourth via 474 of the first substrate 410 . . The seventh matching circuit 704 - 1 may be electrically connected to the wireless communication circuit 430 .

According to an embodiment, a second polarization (eg, a second polarization of the plurality of matching circuits 701-1, 701-2, 702-1, 702-2, 703-1, 703-2, 704-1 and 704-2) : The second matching circuit 701-2, the fourth matching circuit 702-2, the sixth matching circuit 703-2, and the eighth matching circuit 704-2 related to vertical polarization are 7B , it may be disposed on the second surface 414 of the first substrate 410 . For example, the second matching circuit 701 - 2 may be electrically connected to the first element 421 through a via (not shown) of the first substrate 410 . The second matching circuit 701 - 2 may be electrically connected to the wireless communication circuit 430 . For example, the fourth matching circuit 702 - 2 may be electrically connected to the second element 422 through a via (not shown) of the first substrate 410 . The fourth matching circuit 702 - 2 may be electrically connected to the wireless communication circuit 430 . For example, the sixth matching circuit 703 - 2 may be electrically connected to the third element 423 through a via (not shown) of the first substrate 410 . The sixth matching circuit 703 - 2 may be electrically connected to the wireless communication circuit 430 . For example, the eighth matching circuit 704 - 2 may be electrically connected to the fourth element 424 through a via (not shown) of the first substrate 410 . The eighth matching circuit 704 - 2 may be electrically connected to the wireless communication circuit 430 . For example, each of the plurality of matching circuits 701-1, 701-2, 702-1, 702-2, 703-1, 703-2, 704-1 and 704-2 is configured for electrical connection with a via. It may include ports.

According to an embodiment, the first matching circuit 701-1, the third matching circuit 702-1, and the fifth matching circuit 703-1 are disposed on the first surface 432 of the wireless communication circuit 430 . ) and the seventh matching circuit 704-1 and the second matching circuit 701-2, the fourth matching circuit 702-2, and the sixth disposed on the second surface 414 of the first substrate 410 The matching circuit 703 - 2 and the eighth matching circuit 704 - 2 are shown in FIGS. 7B and 7C when the first surface 404 of the main board 400 is viewed from above (eg, -z-axis direction). As such, it may be arranged not to overlap.

According to an exemplary embodiment, the plurality of matching circuits 701-1, 701-2, 702-1, 702-2, 703-1, 703-2, 704-1, and 704-2 are connected to the first substrate 410 ) and/or may be implemented in the form of a conductive pattern in the wireless communication circuit 430 . According to an exemplary embodiment, the plurality of matching circuits 701-1, 701-2, 702-1, 702-2, 703-1, 703-2, 704-1, and 704-2 are connected to the first substrate 410 ) and/or a passive element disposed on one side of the wireless communication circuit 430 .

According to an exemplary embodiment, the plurality of matching circuits 701-1, 701-2, 702-1, 702-2, 703-1, 703-2, 704-1, and 704-2 are connected to the first substrate 410 ) may be disposed on the second side 414 or the first side 432 of the wireless communication circuit 430 .

According to an embodiment, the wireless communication circuit 430 may include a plurality of conductive pads 730 for the interposers 600 and/or 610 . For example, at least a portion of the plurality of conductive pads 730 may be connected to a ground layer through a via to form the plurality of matching circuits 701-1, 701-2, 702-1, 702-2, 703-1, 703-2, 704-1 and 704-2) may be electromagnetically shielded. For example, at least a portion of the plurality of conductive pads 730 may be used as a path for electrical connection with the main substrate 400 . For example, at least some of the plurality of conductive pads 730 may be used as conductive bonding pads for conductive bonding (eg, soldering) with the interposers 600 and/or 610 .

According to various embodiments, the antenna module includes a plurality of matching circuits 701-1, 701-2, 702-1, 702-2, 703-1, 703-2, 704 for the plurality of antenna elements 420 . -1 and 704-2) are disposed in the bonding area of the first substrate 410 and the wireless communication circuit 430, so that the antenna elements 420 and the wireless communication circuit 430 are connected in the first substrate 410. The height of the first substrate 410 may be relatively reduced by excluding the ground layer related to the electrical wiring.

8A and 8B illustrate an example of a structure disposed in a through hole of a main substrate for each antenna element according to various embodiments. According to an embodiment, the antenna module of FIGS. 8A and 8B may be at least partially similar to the third antenna module 246 of FIG. 2 , or may include other embodiments of the antenna module. In the following description, a detailed description of the wireless communication circuit 430 of FIGS. 8A and 8B will be omitted to avoid overlapping description with FIGS. 4A, 4B, 4C and/or 4F.

According to various embodiments with reference to FIGS. 8A and 8B , the plurality of antenna structures 811 , 812 , 813 , and 814 forming the array antenna have different through-holes 801 , 802 , 803 or 804). For example, the first substrate (eg, the first substrate 410 ) may be omitted. According to an embodiment, the first antenna structure 811 may be disposed in the first through hole 801 of the main substrate 400 . The second antenna structure 812 may be disposed in the second through hole 802 of the main substrate 400 . The third antenna structure 813 may be disposed in the third through hole 803 of the main substrate 400 . The fourth antenna structure 814 may be disposed in the fourth through hole 804 of the main substrate 400 .

According to various embodiments, when the plurality of antenna structures 811 , 812 , 813 and 814 are disposed to be inserted into different through-holes 801 , 802 , 803 or 804 of the main substrate 400 , FIG. 8A and Likewise, it may be coupled or connected to the wireless communication circuit 430 disposed on the second surface 406 of the main board 400 .

According to an embodiment, the plurality of antenna structures 811 , 812 , 813 and 814 may include a plurality of antenna elements 811-1 , 812-1 , 813-1 and 814-1. For example, the first antenna element 811-1 may be formed on or inside the first antenna structure 811 . For example, the second antenna element 812-1 may be formed on one surface or inside the second antenna structure 812 . For example, the third antenna element 813 - 1 may be formed on one surface or inside the third antenna structure 813 . For example, the fourth antenna element 814 - 1 may be formed on one surface or the inside of the fourth antenna structure 814 .

According to an embodiment, the first element 811-1 included in the first antenna structure 811 is connected to the wireless communication circuit 430 through the forty-eighth via 811-2 of the first antenna structure 811. can be electrically connected.

According to one embodiment, the second element 812-1 included in the second antenna structure 812 is connected to the wireless communication circuit 430 through the 49th via 812-2 of the second antenna structure 812. can be electrically connected.

According to an embodiment, the third element 813 - 1 included in the third antenna structure 813 is connected to the wireless communication circuit 430 through the fiftieth via 813 - 2 of the third antenna structure 813 . can be electrically connected.

According to an embodiment, the fourth element 814 - 1 included in the fourth antenna structure 814 is connected to the wireless communication circuit 430 through the 51 th via 814 - 2 of the fourth antenna structure 814 . can be electrically connected.

According to various embodiments, when the plurality of antenna structures 811 , 812 , 813 and 814 are disposed to be inserted into different through-holes 801 , 802 , 803 or 804 of the main substrate 400 , FIG. 8b and Likewise, it may be coupled or connected to the second substrate 440 disposed on the second surface 406 of the main substrate 400 .

According to an embodiment, the first element 811-1 included in the first antenna structure 811 includes the 48th via 811 - 2 of the first antenna structure 811 and the second element 811-1 of the second substrate 440 . 23 may be electrically connected to the first matching circuit 821 of the second substrate 440 through the via 831 . The first matching circuit 821 may be electrically connected to the wireless communication circuit 430 through the twenty-fourth via 832 . For example, the forty-eighth via 811 - 2 and the twenty-third via 831 may be electrically and/or physically connected through a conductive bonding method (eg, soldering).

According to an embodiment, the second element 812-1 included in the second antenna structure 812 includes the 49th via 812-2 of the second antenna structure 812 and the second element 812-1 of the second substrate 440. 25 may be electrically connected to the second matching circuit 822 of the second substrate 440 through the via 833 . The second matching circuit 822 may be electrically connected to the wireless communication circuit 430 through the twenty-sixth via 834 . For example, the 49th via 812 - 2 and the 25th via 833 may be electrically and/or physically connected through a conductive bonding method (eg, soldering).

According to an embodiment, the third element 813 - 1 included in the third antenna structure 813 includes the fiftieth via 813 - 2 of the third antenna structure 813 and the second element of the second substrate 440 . 27 may be electrically connected to the third matching circuit 823 of the second substrate 440 through the via 835 . The third matching circuit 823 may be electrically connected to the wireless communication circuit 430 through the twenty-eighth via 836 . For example, the 50th via 813 - 2 and the 27th via 835 may be electrically and/or physically connected through a conductive bonding method (eg, soldering).

According to an embodiment, the fourth element 814 - 1 included in the fourth antenna structure 814 includes the 51 th via 814 - 2 of the fourth antenna structure 814 and the second substrate 440 . 29 may be electrically connected to the fourth matching circuit 824 of the second substrate 440 through the via 837 . The fourth matching circuit 824 may be electrically connected to the wireless communication circuit 430 through the thirtieth via 838 . For example, the 51 th via 814 - 2 and the 29 th via 837 may be electrically and/or physically connected through a conductive bonding method (eg, soldering).

According to various embodiments, an electronic device (eg, the electronic device 101 of FIG. 1 or 2 , or the electronic device 300 of FIGS. 3A to 3C ) includes a housing (eg, the housing 310 of FIG. 3A ); A first surface disposed in the inner space of the housing and facing a first direction and a direction opposite to the first surface (eg, the first surface 404 of FIGS. 4A, 6, 7A, 8A or 8B) a second side (eg, the second side 406 of FIGS. 4A, 6, 7A, 8A or 8B) facing toward A main substrate (eg, the main substrate 400 of FIGS. 4A, 6, 7A, 8A or 8B) including the through hole 402 of 7A, 8A or 8B) and the main substrate disposed on the main substrate As an antenna module, a substrate (eg, FIG. 4A ) disposed at least partially in the through hole and including a plurality of antenna elements (eg, the antenna elements 420 of FIGS. 4A , 6 , 8A or 8B ). , in the first substrate 410 of FIG. 6, 8A or 8B) and the second side of the main substrate, wireless communication configured to transmit and/or receive a radio signal in a designated frequency band through the plurality of antenna elements It may include an antenna module including a circuit (eg, the wireless communication circuit 430 of FIGS. 4A, 6, 7A, 8A, or 8B).

According to various embodiments, the substrate may protrude from the first surface of the main substrate.

According to various embodiments, the substrate may be substantially the same as the first surface of the main substrate or may be lower than the first surface.

According to various embodiments, the wireless communication circuit may be disposed to at least partially overlap the main board when the first surface of the main board is viewed from above.

According to various embodiments, the substrate and the wireless communication circuit may be electrically and/or physically coupled through a conductive bonding method.

According to various embodiments, the wireless communication circuit may be coupled or connected to the main board, and the board may be coupled or connected to the wireless communication circuit.

According to various embodiments, the wireless communication circuit may be coupled or connected to the main board through a conductive bonding method.

According to various embodiments, the main board may include at least one circuit, and the wireless communication circuit may be electrically connected to the at least one circuit through the main board.

According to various embodiments, the at least one circuit may include a communication processor and/or a power management circuit.

According to various embodiments, it further includes an interposer (eg, interposers 600 and 610 of FIG. 6 ) disposed between the main board and the wireless communication circuit, wherein the wireless communication circuit includes an interposer and the main It may be electrically connected to the main board through the board.

According to various embodiments, at least one matching circuit disposed between the substrate and the wireless communication circuit and electrically connected to the plurality of antenna elements (eg, the matching circuits 461 and 462 of FIG. 4A or FIG. 6 , 463 and/or 464)).

According to various embodiments, the matching circuit may include at least one conductive pattern disposed on the substrate and/or the wireless communication circuit.

According to various embodiments, the at least one conductive pattern disposed on the substrate and/or the wireless communication circuit may not overlap each other when the first surface of the main substrate is viewed from above.

According to various embodiments, the substrate may be formed of a material having a lower dielectric constant than that of the main substrate.

According to various embodiments, the antenna module includes a plurality of other antenna elements disposed at a predetermined interval, and another substrate electrically connected to the wireless communication circuit (eg, the third substrate 1100 of FIG. 11A or 11B ) ) and an interposer (eg, interposers 1101 and 1102 of FIG. 11B ) disposed between the wireless communication circuit and the other substrate, wherein the wireless communication circuit is between the substrate and the other substrate and may be electrically connected to the plurality of other antenna elements through an interposer and the other substrate.

9A and 9B show another example of the structure of an antenna module according to various embodiments. According to an embodiment, the antenna module of FIGS. 9A and 9B may be at least partially similar to the third antenna module 246 of FIG. 2 , or may include other embodiments of the antenna module.

According to various embodiments with reference to FIGS. 9A and 9B , the antenna module includes a first substrate 910 including a plurality of antenna elements 920 , and a wireless communication circuit 930 electrically connected to the first substrate 910 . ) may be included.

According to various embodiments, the first substrate 910 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The first substrate 910 may provide an electrical connection between the first substrate 910 and/or various electronic components disposed outside by using wires and conductive vias formed in the conductive layer.

According to various embodiments, the first substrate 910 may include a plurality of antenna elements 920 arranged at predetermined intervals to form a directional beam. According to an embodiment, the antenna elements 920 may be formed on or inside the first surface 912 of the first substrate 910 . According to an embodiment, the plurality of antenna elements 920 may be configured to form a beam pattern in a first direction (eg, a z-axis direction).

According to various embodiments, as shown in FIG. 9B , the first substrate 910 is the main substrate 900 when the first surface 904 of the main substrate 900 is viewed from above (eg, in the -z-axis direction). and may be disposed to at least partially overlap. According to an embodiment, when the first substrate 910 is viewed in the -z-axis direction, at least a portion of the first substrate 910 overlaps the main substrate 900 , and at least a portion of the remaining first substrate 910 overlaps the main substrate 900 . It may overlap the second substrate 940 disposed in the through hole 902 of the . For example, the first substrate 910 may be coupled or connected to the main substrate 900 . For example, the first substrate 910 and the main substrate 900 may be electrically and/or physically coupled or connected through a conductive bonding method (eg, soldering). According to an embodiment, the first substrate 910 may be formed of a material having a relatively lower dielectric constant than that of the main substrate 900 .

According to various embodiments, the wireless communication circuit 930 may include a through hole 902 formed in at least a portion of the main board 900 (eg, the printed circuit board 324 of FIG. 3C ), as shown in FIG. 9B . It can be arranged in such a way that it is inserted into. For example, the wireless communication circuit 930 may be configured as one chipset or package.

According to various embodiments, when the wireless communication circuit 930 is disposed in the through hole 902 of the main board 900 , the first board 910 disposed on the first surface 904 of the main board 900 . may be combined with or linked to. According to an embodiment, the first substrate 910 and the wireless communication circuit 930 may be electrically and/or physically coupled or connected through a conductive bonding method (eg, soldering).

According to various embodiments, the wireless communication circuit 930 may transmit and/or receive a wireless signal in a designated frequency band through the plurality of antenna elements 920 disposed on the first substrate 910 . According to an embodiment, the wireless communication circuit 930 (eg, the third RFIC 226 of FIG. 2 ) is at least disposed on the main board 900 through the first board 910 and the main board 900 . It may be electrically connected to one circuit (eg, a communication processor (CP) 952 and/or a PMIC 954 ). For example, the wireless communication circuit 930 may up-convert a baseband signal obtained from the communication processor 952 into an RF signal of a designated band during transmission. The RF signal may be transmitted to the plurality of antenna elements 920 through the first substrate 910 . The wireless communication circuit 930, upon reception, down-converts an RF signal received through the plurality of antenna elements 920 (eg, an array antenna) disposed on the first substrate 910 into a baseband signal. communication processor 952 . For another example, the wireless communication circuit 930, at the time of transmission, an IF signal obtained from an intermediate frequency integrate circuit (IFIC) (eg, the fourth RFIC 228 of FIG. 2 ) (eg, about 9 GHz about 11 GHz) can be up-converted into an RF signal of a designated band. The wireless communication circuit 930, upon reception, down-converts an RF signal obtained through a plurality of antenna elements 920 (eg, an array antenna) disposed on the first substrate 910 into an IF signal to the IFIC. can transmit

According to various embodiments, the main board 900 may be disposed in a housing (eg, the housing 310 of FIG. 3A ) of the electronic device (eg, the electronic device 300 of FIG. 3A ). According to an embodiment, at least one circuit may be disposed on one surface (eg, the first surface 904 and/or the second surface 906 ) of the main substrate 900 . For example, the main board 900 may have a communication processor 952 and/or a power management integrate circuit (PMIC) 954 disposed on the first side 904 (or the second side 906 ). According to an embodiment, in order to avoid overlapping description with FIGS. 4A, 4B, 4C and/or 4F, detailed descriptions of the communication processor 952 and the PMIC 954 of FIGS. 9A and 9B are omitted.

9C is a cross-sectional view of an antenna module taken along line B-B of FIG. 9B according to various embodiments. 9D is a plan view of an antenna module viewed along the -z axis of FIG. 9B according to various embodiments of the present disclosure; 9E is a plan view of an antenna module viewed along the z-axis of FIG. 9B according to various embodiments of the present disclosure;

According to various embodiments with reference to FIGS. 9C, 9D, and 9E, the wireless communication circuit 930 is disposed in the through hole 902 formed in at least a part of the main board 900, and the first board 910 and may be combined or linked. According to an embodiment, when the first surface 904 of the main substrate 900 is viewed from above (eg, -z-axis direction), the first substrate 910 is At least partially overlapping the through hole 902 and may be disposed to at least partially overlap the main substrate 900 so as to be coupled or connected to the main substrate 900 . According to an embodiment, the wireless communication circuit 930 penetrates the main board 900 as shown in FIG. 9E when the second surface 906 of the main board 900 is viewed from above (eg, in the z-axis direction). It may be disposed within the hole 902 .

According to various embodiments, the first substrate 910 may include a plurality of antenna elements 920 and/or a plurality of matching circuits 961 , 962 , 963 and 964 . For example, the plurality of antenna elements 920 may include a first element 921 , a second element 922 , a third element 923 , or a fourth element 924 . According to an embodiment, the first element 921 may be electrically connected to the first matching circuit 961 through the first via 971 . According to an embodiment, the second element 922 may be electrically connected to the second matching circuit 962 through the second via 972 . According to an embodiment, the third element 923 may be electrically connected to the third matching circuit 963 through the third via 973 . According to an embodiment, the fourth element 924 may be electrically connected to the fourth matching circuit 964 through the fourth via 974 .

According to various embodiments, the first substrate 910 may be electrically and/or physically connected to the wireless communication circuit 930 through a conductive bonding method (eg, soldering). According to an embodiment, the first matching circuit 961 of the first substrate 910 may be electrically connected to the wireless communication circuit 930 through the fifth via 975 . According to an embodiment, the second matching circuit 962 of the first substrate 910 may be electrically connected to the wireless communication circuit 930 through the sixth via 976 . According to an embodiment, the third matching circuit 963 of the first substrate 910 may be electrically connected to the wireless communication circuit 930 through the seventh via 977 . According to an embodiment, the fourth matching circuit 964 of the first substrate 910 may be electrically connected to the wireless communication circuit 930 through the eighth via 978 .

According to various embodiments, the wireless communication circuit 930 includes at least one circuit (eg, the communication processor 952 and/or the PMIC) disposed on the main board 900 through the first board 910 and the main board 900 . 954 ) In accordance with one embodiment, the wireless communication circuit 930 may provide a first electrical wiring of the first substrate 910 through the fourteenth via 986 of the first substrate 910 . The first electrical wiring 987 of the first substrate 910 may be electrically connected to the main substrate 900 through the fifteenth via 988 and the sixteenth via 989 of the main substrate 900 . . For example, the fifteenth via 988 and the sixteenth via 989 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). A signal (eg, a control signal, a baseband signal, or an IF signal) may be transmitted and/or received with the communication processor 952 electrically connected through the 910 and the main board 900 .

According to an embodiment, the wireless communication circuit 930 may be electrically connected to the third electrical wiring 994 of the first substrate 910 through the 19th via 993 of the first substrate 910 . The third electrical wiring 994 of the first substrate 910 is connected to the fourth electrical wiring 997 of the main substrate 900 through the twentieth via 995 and the twenty-first via 996 of the main substrate 900 . can be electrically connected. The fourth electrical wiring 997 of the main board 900 may be electrically connected to the PMIC 959 through the 22nd via 998 . For example, the twentieth via 995 and the twenty-first via 996 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). For example, the wireless communication circuit 930 may receive a power signal from the PMIC 959 electrically connected through the first board 910 and the main board 900 .

According to various embodiments, the main board 900 may include at least one circuit. According to an embodiment, a communication processor (CP) 952 and/or a PMIC 954 may be disposed on the first surface 904 of the main board 900 . According to an embodiment, at least one other circuit 956 may be disposed on the second surface 906 of the main substrate 900 .

9F illustrates another example of a wireless communication circuit disposed in an antenna module according to various embodiments.

According to various embodiments with reference to FIG. 9F , the wireless communication circuit 930 may be disposed on one surface of the second substrate 940 . The second substrate 940 is disposed in the through hole 902 formed in at least a portion of the main substrate 900 , and may be coupled or connected to the first substrate 910 . According to an embodiment, the wireless communication circuit 930 may be fixed by a protective layer 940 - 1 (eg, resin) on one surface (eg, the second surface 934 ) of the second substrate 440 . . According to an embodiment, when the second surface 906 of the main substrate 900 is viewed from above (eg, in the z-axis direction), the second substrate 940 is disposed within the through hole 902 of the main substrate 900 . can be placed. According to an exemplary embodiment, a detailed description of the first substrate 910 of FIG. 9F will be omitted to avoid overlapping description with FIG. 9C .

According to various embodiments, the first substrate 910 may be electrically and/or physically connected to the second substrate 940 through a conductive bonding method (eg, soldering). According to an embodiment, the first matching circuit 961 of the first substrate 910 is connected through the fifth via 975 of the first substrate 910 and the ninth via 981 of the second substrate 940 . It may be electrically connected to the wireless communication circuit 930 . For example, the fifth via 975 and the ninth via 981 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). According to an embodiment, the second matching circuit 962 of the first substrate 910 is connected through the sixth via 976 of the first substrate 910 and the tenth via 982 of the second substrate 940 . It may be electrically connected to the wireless communication circuit 930 . For example, the sixth via 976 and the tenth via 982 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). According to an embodiment, the third matching circuit 963 of the first substrate 910 is connected through the seventh via 977 of the first substrate 910 and the eleventh via 983 of the second substrate 940 . It may be electrically connected to the wireless communication circuit 930 . For example, the seventh via 977 and the eleventh via 983 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). According to one embodiment, the fourth matching circuit 964 of the first substrate 910 is connected via the eighth via 978 of the first substrate 910 and the twelfth via 984 of the second substrate 940 . It may be electrically connected to the wireless communication circuit 930 . For example, the eighth via 978 and the twelfth via 984 may be electrically and/or physically connected through a conductive bonding method (eg, soldering).

According to various embodiments, the wireless communication circuit 930 includes at least one circuit (eg, communication) disposed on the main board 900 through the first board 910 , the second board 940 , and the main board 900 . The processor 952 and/or the PMIC 954 may be electrically connected. According to an embodiment, the wireless communication circuit 930 is configured to connect the first substrate 910 through the thirteenth via 985 of the second substrate 940 and the fourteenth via 986 of the first substrate 910 . 1 may be electrically connected to the electrical wiring 987 . The first electrical wiring 987 of the first substrate 910 is connected to the second electrical wiring 990 of the main substrate 900 through the 15th via 988 and the 16th via 989 of the main substrate 900 . can be electrically connected. The second electrical wiring 990 of the main board 900 may be electrically connected to the communication processor 952 through the seventeenth via 991 . For example, the thirteenth via 985 and the fourteenth via 986 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). For example, the fifteenth via 988 and the sixteenth via 989 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). For example, the wireless communication circuit 930 includes a communication processor 952 and signals (eg, a control signal, a baseband signal) electrically connected through the first substrate 910 , the second substrate 940 , and the main substrate 900 . or IF signal) may be transmitted and/or received.

According to an embodiment, the wireless communication circuit 930 is configured to connect the first substrate 910 through the eighteenth via 992 of the second substrate 940 and the nineteenth via 993 of the first substrate 910 . 3 may be electrically connected to the electrical wiring 994 . The third electrical wiring 994 of the first substrate 910 is connected to the fourth electrical wiring 997 of the main substrate 900 through the twentieth via 995 and the twenty-first via 996 of the main substrate 900 . can be electrically connected. The fourth electrical wiring 997 of the main board 900 may be electrically connected to the PMIC 959 through the 22nd via 998 . For example, the eighteenth via 992 and the nineteenth via 993 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). For example, the twentieth via 995 and the twenty-first via 996 may be electrically and/or physically connected through a conductive bonding method (eg, soldering). For example, the wireless communication circuit 930 may receive a power signal from the PMIC 959 electrically connected through the first substrate 910 , the second substrate 940 , and the main substrate 900 .

According to various embodiments, the plurality of matching circuits 961 , 962 , 963 , and 964 may be disposed in a junction area of the first substrate 910 and the second substrate 940 (or the wireless communication circuit 930 ). (not shown). According to an embodiment, at least some of the plurality of matching circuits 961 , 962 , 963 and 964 (eg, the first matching circuit 961 and the third matching circuit 963 ) are It may be disposed on the first surface 932 of the second substrate 940 (or the wireless communication circuit 930) The remaining parts (eg, the second The matching circuit 962 and the fourth matching circuit 964) may be disposed on the second surface 914 of the first substrate 910. According to one embodiment, a plurality of matching circuits 961, 962, 963 and 964 may be disposed on the second side 914 of the first substrate 910 or the first side 932 of the second substrate 940 (or the wireless communication circuitry 930 ).

According to various embodiments, the electronic device 101 or 300 uses at least a portion of the wireless communication circuit 930 or the second substrate 940 on which the wireless communication circuit 930 is disposed through the through hole 902 of the main substrate 900 . ), it is possible to reduce the space (eg height) required by the antenna module.

10 shows another example of the structure of an antenna module using an interposer according to various embodiments. According to an embodiment, the antenna module of FIG. 10 may be at least partially similar to the third antenna module 246 of FIG. 2 , or may include other embodiments of the antenna module.

According to various embodiments with reference to FIG. 10 , the main board 900 may be electrically and/or physically coupled to the other main board 1030 through the interposers 1000 and 1010 . According to an embodiment, the main substrate 900 is connected to another main substrate 1030 through the 23 th via 1021 of the first interposer 1000 and the 24 th via 1022 of the second interposer 1010 . may be electrically and/or physically connected.

According to various embodiments, the main board 900 and/or the other main board 1030 may include at least one circuit disposed in the internal space 1060 secured by the interposers 1000 and 1010 . . According to an embodiment, the wireless communication circuit 930 may be located in a space 1060 formed by the main board 900 and another main board 1030 . According to an embodiment, the first circuit 1041 and/or the second circuit 1042 is the second circuit of the other main substrate 1030 forming the internal space 1060 secured by the interposers 1000 and 1010 . It may be disposed on one side 1032 . According to an embodiment, the third circuit 1043 , the fourth circuit 1044 , and/or the fifth circuit 1045 has a second surface facing the first surface 1032 of the other main board 1030 in a direction opposite to that of the first surface 1032 . 1034 may be disposed.

According to an embodiment, the other main substrate 1030 may further include a shielding member 1050 . For example, the shielding member 1050 may include a third circuit 1043 , a fourth circuit 1044 , and/or a fifth circuit 1045 disposed on the second surface 1034 of the other main board 1030 . It may be disposed on a portion of the other main substrate 1030 (eg, the second surface 1034) to be miraculously shielded. For example, the shielding member 1050 may include a shield can.

11A and 11B illustrate an example of a structure of an antenna module including a plurality of array antennas according to various embodiments. According to an embodiment, the antenna module of FIGS. 11A and 11B may be at least partially similar to the third antenna module 246 of FIG. 2 , or may include other embodiments of the antenna module.

According to various embodiments referring to FIG. 11A , the antenna module includes a first substrate 410 including a plurality of antenna elements 420 , a wireless communication circuit 430 electrically connected to the first substrate 410 , and a plurality of may include a third substrate 1100 including other antenna elements 1120 of According to an embodiment, a detailed description of the first substrate 410 and the wireless communication circuit 430 of FIG. 11A is omitted to avoid overlapping description with FIGS. 4A, 4B, 4C and/or 4F.

According to various embodiments, the first substrate 410 may include a plurality of antenna elements 420 disposed to form a beam in a first direction (eg, a z-axis direction). For example, the plurality of antenna elements 420 may include a first element 421 , a second element 422 , a third element 423 , or a fourth element 424 . According to an embodiment, at least a portion of the first substrate 410 is disposed in a through hole 402 formed in at least a portion of the main substrate 400 (eg, the printed circuit board 324 of FIG. 3C ). can be For example, at least a portion of the first substrate 410 is disposed in the through hole 402 of the main board 400 , and the wireless communication circuit 430 is disposed on the second surface 406 of the main board 400 . may be combined with or connected to.

According to various embodiments, the third substrate 1100 may include a plurality of other antenna elements 1120 arranged to form a beam in the second direction (eg, the -z-axis direction). For example, the plurality of other antenna elements 1120 may include a fifth element 1121 , a sixth element 1122 , a seventh element 1123 , or an eighth element 1124 .

According to various embodiments, a plurality of other antenna elements 1120 disposed on the third substrate 1100 may be electrically connected to the wireless communication circuit 430 through the third substrate 1100 . According to an embodiment, the fifth element 1121 may be electrically connected to the fifth matching circuit 1111 of the third substrate 1100 through the 31 th via 1131 of the third substrate 1100 . The fifth matching circuit 1111 may be electrically connected to the wireless communication circuit 430 through the thirty-second via 1132 . According to an embodiment, the sixth element 1122 may be electrically connected to the sixth matching circuit 1112 of the third substrate 1100 through the 36 th via 1137 of the third substrate 1100 . The sixth matching circuit 1112 may be electrically connected to the wireless communication circuit 430 through the forty-sixth via 1156 . According to an embodiment, the seventh element 1123 may be electrically connected to the seventh matching circuit 1113 of the third substrate 1100 through the 37 th via 1138 of the third substrate 1100 . The seventh matching circuit 1113 may be electrically connected to the wireless communication circuit 430 through the forty-seventh via 1157 . According to an embodiment, the eighth element 1124 may be electrically connected to the eighth matching circuit 1114 of the third substrate 1100 through the 38 th via 1139 of the third substrate 1100 . The eighth matching circuit 1114 may be electrically connected to the wireless communication circuit 430 through the thirty-ninth via 1140 .

According to various embodiments, the main board 400 may be electrically and/or physically coupled to another main board 1180 through interposers 1150 and 1151 . According to an embodiment, the main substrate 400 is connected to another main substrate 1180 through the 44th via 1153 of the third interposer 1150 and the 45th via 1155 of the fourth interposer 1151 . may be electrically and/or physically connected.

According to various embodiments, at least one circuit 1161 , 1162 , 1163 , and/or 1164 may be disposed on the main board 400 and/or the other main board 1180 . According to an embodiment, the first circuit (eg, other IC #1) 1161 may be disposed on the first surface 404 of the main board 400 . For example, the main substrate 400 may further include a first shielding member 1171 . The first shielding member 1171 is a part of the main board 400 (eg, the first surface 404 ) so that the first circuit 1161 disposed on the first surface 404 of the main board 400 is electromagnetically shielded. )) can be placed in For example, the first shielding member 1171 may include a shield can.

According to an embodiment, the main board 400 and the other main board 1180 may include at least one circuit disposed in the internal space 1190 secured by the interposers 1150 and 1151 . For example, the second circuit (eg, other IC #2) 1162 may have a second surface 406 of the main board 400 that forms an internal space 1190 secured by the interposers 1150 and 1151 . ) can be placed in According to an embodiment, the second circuit 1162 may be electrically connected to the wireless communication circuit 430 through the main board 400 . For example, the wireless communication circuit 430 may be electrically connected to the second electrical wiring 489 of the main board 400 through the fifteenth via 488 of the main board 400 . The second electrical wiring 489 of the main board 400 may be electrically connected to the third circuit 1162 through the 43 th via 1145 .

According to an embodiment, the third circuit (eg, other IC #3) 1163 and/or the fourth circuit (eg, other IC #4) 1164 may be connected to the second side 1184 of the other main board 1180 . ) can be placed in For example, the other main substrate 1180 may further include a second shielding member 1172 . The second shielding member 1172 is formed on the other main substrate 1180 so that the third circuit 1163 and/or the fourth circuit 1164 disposed on the second surface 1184 of the other main substrate 1180 are electromagnetically shielded. ) (eg, the second surface 1184). For example, the second shielding member 1172 may include a shield can.

According to various embodiments with reference to FIG. 11B , the antenna module includes a first substrate 410 including a plurality of antenna elements 420 , a second substrate 440 electrically connected to the first substrate 410 , and a second A third substrate 1100 including a wireless communication circuit 430 and a plurality of other antenna elements 1120 disposed on the second substrate 440 may be included. According to an embodiment, a detailed description of the first substrate 410 and the wireless communication circuit 430 of FIG. 11B is omitted to avoid overlapping description with FIGS. 4A, 4B, 4C and/or 4F.

According to various embodiments, the first substrate 410 may include a plurality of antenna elements 420 disposed to form a beam in a first direction (eg, a z-axis direction). According to an embodiment, at least a portion of the first substrate 410 is disposed in a through hole 402 formed in at least a portion of the main substrate 400 (eg, the printed circuit board 324 of FIG. 3C ). can be For example, at least a portion of the first substrate 410 is disposed in the through hole 402 of the main substrate 400 , and the second substrate 440 is disposed on the second surface 406 of the main substrate 400 . may be combined with or linked to.

According to various embodiments, a plurality of other antenna elements 1120 disposed on the third substrate 1100 are connected to the third substrate 1100 , the interposers 1101 and 1102 , and the second substrate 440 through the second substrate 440 . 2 It may be electrically connected to the wireless communication circuit 430 disposed on the substrate 440 . According to an embodiment, the fifth element 1121 may be electrically connected to the fifth matching circuit 1111 of the third substrate 1100 through the 31 th via 1131 of the third substrate 1100 . The fifth matching circuit 1111 is connected to the second substrate 440 through the 32 th via 1132 , the 33 th via 1133 of the first interposer 1101 , and the 34 th via 1134 of the second substrate 440 . ) may be electrically connected to the fifth electrical wiring 1135 . The fifth electrical wiring 1135 may be electrically connected to the wireless communication circuit 430 through the 35 th via 1136 . For example, the fifth element 1121 may be electrically connected to the wireless communication circuit 430 through the third substrate 1100 , the first interposer 1101 , and the second substrate 440 . According to an embodiment, the sixth element 1122 may be electrically connected to the sixth matching circuit 1112 of the third substrate 1100 through the 36 th via 1137 of the third substrate 1100 . The sixth matching circuit 1112 may be electrically connected to the wireless communication circuit 430 through the forty-sixth via 1156 . According to an embodiment, the seventh element 1123 may be electrically connected to the seventh matching circuit 1113 of the third substrate 1100 through the 37 th via 1138 of the third substrate 1100 . The seventh matching circuit 1113 may be electrically connected to the wireless communication circuit 430 through the forty-seventh via 1157 .

According to an embodiment, the eighth element 1124 may be electrically connected to the eighth matching circuit 1114 of the third substrate 1100 through the 38 th via 1139 of the third substrate 1100 . The eighth matching circuit 1114 is connected to the second substrate 440 through the 39 th via 1140 , the 40 th via 1141 of the second interposer 1102 , and the 41 th via 1142 of the second substrate 440 . ) may be electrically connected to the sixth electrical wiring 1143 . The sixth electrical wiring 1143 may be electrically connected to the wireless communication circuit 430 through the forty-second via 1144 . For example, the eighth element 1124 may be electrically connected to the wireless communication circuit 430 through the third substrate 1100 , the second interposer 1102 , and the second substrate 440 .

12A and 12B illustrate a structure in which a through hole is disposed in a partial region of an outer portion of a main substrate according to various embodiments of the present disclosure. 12A is a plan view of the antenna module as viewed along the -z axis of FIG. 4B. 12B is a plan view of the antenna module as viewed along the z-axis of FIG. 4B.

12A and 12B, the antenna module includes a first substrate 1210 including a plurality of antenna elements 1220, and a wireless communication circuit electrically connected to the first substrate 1210 ( 1230) may be included. According to an embodiment, the first substrate 1210 may include a plurality of antenna elements 1220 arranged to form a directional beam.

According to various embodiments, the first substrate 1210 may be disposed in a hole (or groove) 1202 formed in at least a portion of an outer portion of the main substrate 1200 (eg, the printed circuit board 324 of FIG. 3C ). have.

According to an embodiment, when at least a portion of the first substrate 1210 is disposed in the hole 1202 of the main board 1200, a wireless communication circuit disposed on the second surface 1206 of the main board 1200 ( 1230) and may be combined or connected. For example, when the first substrate 1210 is viewed from the top of the first surface 1204 of the main substrate 1200 (eg, -z-axis direction), as shown in FIG. 12A , the hole ( 1202). For example, the wireless communication circuit 1230 overlaps the through hole 1202 as shown in FIG. 12B when the second surface 1206 of the main board 1200 is viewed from above (eg, in the z-axis direction), The main board 1200 may be at least partially overlapped to be coupled to or connected to the main board 1200 .

According to various embodiments, at least one circuit 1231 , 1232 , and/or 1233 may be disposed on one surface (eg, the first surface 1204 and/or the second surface 1206 ) of the main board 1200 . have.

According to various embodiments, the wireless communication circuit 1230 may be disposed in a hole (or groove) 1202 formed in at least a portion of an outer portion of the main board 1200 (eg, the printed circuit board 324 of FIG. 3C ). have.

According to an embodiment, when at least a portion of the wireless communication circuit 1230 is disposed in the hole 1202 of the main board 1200, the first board ( 1210) and may be combined or linked. For example, the wireless communication circuit 1230 may be disposed in the hole 1202 of the main board 1200 when the second surface 1206 of the main board 1200 is viewed from above (eg, in the z-axis direction). have. For example, when the first surface 1204 of the main substrate 1200 is viewed from above (eg, in the -z-axis direction), the first substrate 1210 overlaps the through hole 1202 and the main substrate 1200 . ) and may be disposed to at least partially overlap with the main board 1200 to be coupled or connected.

13 illustrates another example of the structure of an antenna module including a plurality of array antennas according to various embodiments. According to an embodiment, the antenna module of FIG. 13 may be at least partially similar to the third antenna module 246 of FIG. 2 , or may include other embodiments of the antenna module.

According to various embodiments with reference to FIG. 13 , the antenna module includes a first substrate 410 including a plurality of antenna elements 420 , a second substrate 440 electrically connected to the first substrate 410 , and a second and a third substrate 1310 including a wireless communication circuit 430 disposed on the second substrate 440 and a plurality of other antenna elements 1321 and/or 1323 . According to an embodiment, a detailed description of the first substrate 410 and the wireless communication circuit 430 of FIG. 13 will be omitted to avoid overlapping description with FIGS. 4A, 4B, 4C and/or 4F.

According to various embodiments, the first substrate 410 may include a plurality of antenna elements 420 disposed to form a beam in a first direction (eg, a z-axis direction). For example, the plurality of antenna elements 420 may include a first element 421 , a second element 422 , a third element 423 , or a fourth element 424 . According to an embodiment, at least a portion of the first substrate 410 may include a first through hole 402 formed in at least a portion of the main substrate 400 (eg, the printed circuit board 324 of FIG. 3C ). can be placed within. For example, at least a portion of the first substrate 410 is disposed in the first through hole 402 of the main substrate 400 , and the second substrate ( 406 ) is disposed on the second surface 406 of the main substrate 400 . 440) may be combined or connected.

According to various embodiments, the third substrate 1310 may include a plurality of other antenna elements 1321 and/or 1323 arranged to form a beam in the second direction (eg, the -z-axis direction). According to an embodiment, at least a portion of the third substrate 1310 may be disposed in the second through hole 1300 formed in at least a portion of the second substrate 440 . For example, at least a portion of the third substrate 1310 is disposed in the second through hole 1300 of the second substrate 440 , and the first through hole 402 of the main substrate 400 is disposed in the first through hole 402 . It may be coupled or connected to the substrate 410 . For example, the second through hole 1300 may be formed to at least partially overlap the first through hole 402 .

According to various embodiments, the plurality of antenna elements 1321 and/or 1323 disposed on the third substrate 1310 may be connected through the third substrate 1310 , the first substrate 410 , and the second substrate 440 . It may be electrically connected to the wireless communication circuit 430 disposed on the second substrate 440 . According to an embodiment, the fifth element 1321 is connected to the first substrate 410 through the 52 th via 1331 of the third substrate 1310 and the 53 th via 1332 of the first substrate 410 . 7 may be electrically connected to the electrical wiring 1333 . The seventh electrical wiring 1333 may be electrically connected to the wireless communication circuit 430 through the 54 th via 1334 of the first substrate 410 and the 55 th via 1335 of the second substrate 440 . For example, the fifth element 1321 may be electrically connected to the wireless communication circuit 430 through the third substrate 1310 , the first substrate 410 , and the second substrate 440 .

According to an embodiment, the sixth element 1323 is connected to the first substrate 410 through the 56th via 1341 of the third substrate 1310 and the 57th via 1342 of the first substrate 410 . 8 may be electrically connected to the electrical wiring 1343 . The eighth electrical wiring 1343 may be electrically connected to the wireless communication circuit 430 through the 58 th via 1344 of the first substrate 410 and the 59 th via 1345 of the second substrate 440 . For example, the sixth element 1323 may be electrically connected to the wireless communication circuit 430 through the third substrate 1310 , the first substrate 410 , and the second substrate 440 .

According to various embodiments, the electronic device 101 or 300 uses a first substrate 410 including a plurality of antenna elements 420 (eg, an array antenna) through a first through hole 402 of the main substrate 400 . ), and a third substrate 1310 including a plurality of other antenna elements 1321 and/or 1323 (eg, an array antenna) is disposed in the second through hole 1300 of the second substrate 440 . By doing so, the space (eg, height) required by the antenna module can be reduced.

14 shows an arrangement of an amplification circuit according to various embodiments. According to an embodiment, the antenna module of FIG. 14 may be at least partially similar to the third antenna module 246 of FIG. 2 , or may include other embodiments of the antenna module.

According to various embodiments with reference to FIG. 14 , the antenna module includes a first substrate 410 including a plurality of antenna elements 420 , a second substrate 440 electrically connected to the first substrate 410 , and a second 2 may include a wireless communication circuit 430 and an amplifier circuit (eg, mmW AMP) 1410 disposed on the substrate 440 . According to an embodiment, a detailed description of the first substrate 410 and the wireless communication circuit 430 of FIG. 14 is omitted to avoid overlapping description with FIGS. 4A, 4B, 4C and/or 4F.

According to various embodiments, the first substrate 410 may include a plurality of antenna elements 420 disposed to form a beam in a first direction (eg, a z-axis direction). For example, the plurality of antenna elements 420 may include a first element 421 , a second element 422 , a third element 423 , or a fourth element 424 . According to an embodiment, at least a portion of the first substrate 410 may include a first through hole 402 formed in at least a portion of the main substrate 400 (eg, the printed circuit board 324 of FIG. 3C ). can be placed within. For example, at least a portion of the first substrate 410 is disposed in the first through hole 402 of the main substrate 400 , and the second substrate ( 406 ) is disposed on the second surface 406 of the main substrate 400 . 440) may be combined or connected.

According to various embodiments, at least a portion of the amplification circuit 1410 may be disposed in the second through hole 1400 formed in at least a portion of the second substrate 440 . For example, at least a portion of the amplification circuit 1410 is disposed in the second through hole 1400 of the second substrate 440 , and the first substrate is disposed in the first through hole 402 of the main substrate 400 . It may be combined with or connected to 410 . For example, the second through-hole 1400 may be formed to at least partially overlap the first through-hole 402 .

According to various embodiments, the amplification circuit 1410 may be electrically coupled to the plurality of antenna elements 420 and/or the wireless communication circuit 430 via the first substrate 410 and/or the second substrate 440 . can

According to an embodiment, the amplification circuit 1410 may be electrically connected to the ninth electrical wiring 1422 of the first substrate 410 through the 60th via 1421 of the first substrate 410 . The ninth electrical wiring 1422 may be electrically connected to the wireless communication circuit 430 through the 61 th via 1423 of the first substrate 410 and the 62 th via 1424 of the second substrate 440 .

According to an embodiment, the amplification circuit 1410 may be electrically connected to the fourth antenna element 424 through the 63 th via 1431 of the first substrate 410 . As an example, the amplification circuit 1410 may include a first antenna element 421, a second antenna element 422 and/or a third antenna element (not shown) through each via (not shown) included in the first substrate 410 . 423) may be electrically connected to.

According to an embodiment, the amplification circuit 1410 may be electrically connected to the tenth electrical wiring 1442 of the first substrate 410 through the 64th via 1441 of the first substrate 410 . The tenth electrical wiring 1442 is connected to the eleventh electrical wiring 1445 of the second substrate 440 through the 65th via 1443 of the first substrate 410 and the 66th via 1444 of the second substrate 440 . ) can be electrically connected to. The eleventh electrical wiring 1445 is connected to the twelfth electrical wiring 1448 of the main substrate 400 through the 67th via 1446 of the second substrate 440 and the 68th via 1447 of the main substrate 400 . can be electrically connected. The twelfth electrical wiring 1448 may be electrically connected to the PMIC 454 through the 68th via 1449 of the main board 400 . For example, the amplification circuit 1410 may be electrically connected to the PMIC 454 disposed on the main substrate 400 through the main substrate 400 , the first substrate 410 , and the second substrate 420 .

According to various embodiments, an electronic device (eg, the electronic device 101 of FIG. 1 or 2 , or the electronic device 300 of FIGS. 3A to 3C ) includes a housing (eg, the housing 310 of FIG. 3A ); A first surface disposed in the inner space of the housing and facing a first direction (eg, the first surface 904 in FIG. 9A or FIG. 10 ) and a second surface facing in a direction opposite to the first surface (eg, in FIG. 9A ) The main substrate (eg, FIG. 9A or 10 ) includes the second surface 906 of FIG. 9A or 10 ) and includes a through hole (eg, the through hole 902 of FIG. 9A or 10 ). of the main board 900) and a board (eg, FIG. 9A ) including a plurality of antenna elements (eg, a plurality of antenna elements 920 of FIG. 9A or FIG. 10 ) as an antenna module disposed on the main board. or at least partially disposed in the first substrate 910 of FIG. 10 and the through hole, electrically connected to the substrate, and transmit and/or receive a radio signal in a designated frequency band through the plurality of antenna elements. An antenna module including a set wireless communication circuit (eg, the wireless communication circuit 930 of FIG. 9A or FIG. 10 ) may be included.

According to various embodiments, the substrate may be disposed to at least partially overlap the main substrate when the second surface of the main substrate is viewed from above.

According to various embodiments, the substrate and the wireless communication circuit may be electrically and/or physically coupled through a conductive bonding method.

According to various embodiments, the board may be coupled or connected to the main board, and the wireless communication circuit may be coupled or coupled to the board.

According to various embodiments, the main board may include at least one circuit, and the wireless communication circuit may be electrically connected to the at least one circuit through the board and the main board.

According to various embodiments, an electronic device (eg, the electronic device 101 of FIG. 1 or 2 , or the electronic device 300 of FIGS. 3A to 3C ) includes a housing (eg, the housing 310 of FIG. 3A ); A first surface disposed in the inner space of the housing and facing a first direction and the first surface (eg, the first surface of FIGS. 4A, 6, 7A, 8A, 8B, 13 or 14 ( 404)) and a second surface (eg, the second surface 406 of FIGS. 4A, 6, 7A, 8A, 8B, 13 or 14) facing in the opposite direction, and a through hole (through) hole) (eg, the through hole 402 of FIGS. 4A, 6, 7A, 8A, 8B, 13 or 14) of a main substrate (eg, FIGS. 4A, 6, 7A, and 14). 8a, 8b, 13 or 14 of the main board 400) and an antenna module disposed on the main board, wherein the antenna module is at least partially disposed in the first through hole, and a plurality of antennas A first substrate (eg, FIGS. 4A, 6, 8A, 8B ) including elements (eg, the antenna elements 420 of FIGS. 4A, 6, 8A, 8B, 13 or 14 ). , the first substrate 410 of FIG. 13 or 14 ) and a second substrate disposed on the second surface of the main substrate and electrically connected to the first substrate (eg, the second substrate 410 of FIGS. 4F , 13 or 14 ) 2 substrate 440); and a wireless communication circuit (eg, the wireless communication circuit 430 of FIGS. 4F, 13 or 14) configured to transmit and/or receive a wireless signal in a specified frequency band through the plurality of antenna elements on the second substrate. may include

According to various embodiments, the second substrate may be disposed to at least partially overlap the main substrate when the first surface of the main substrate is viewed from above.

According to various embodiments, the second substrate includes a second through-hole (eg, the second through-hole 1300 of FIG. 13 ), and the antenna module is disposed in the second through-hole, and has a predetermined interval. A third substrate (eg, the third substrate 1310 of FIG. 13 ) including a plurality of other antenna elements (eg, a plurality of other antenna elements 1321 and/or 1323 of FIG. 13 ) disposed as may include

According to various embodiments, it further includes an amplification circuit (eg, the amplification circuit 1410 of FIG. 14 ), wherein the amplification circuit includes a second through hole (eg, the second through hole of FIG. 14 ) included in the second substrate. hole 1400).

The embodiments of the present invention disclosed in the present specification and drawings are merely provided for specific examples in order to easily explain the technical contents according to the embodiments of the present invention and help the understanding of the embodiments of the present invention, and to limit the scope of the embodiments of the present invention It's not what you want to do. Therefore, in the scope of various embodiments of the present invention, in addition to the embodiments disclosed herein, all changes or modifications derived from the technical ideas of various embodiments of the present invention should be interpreted as being included in the scope of various embodiments of the present invention.

Claims (20)

In an electronic device,
housing;
a main substrate disposed in the inner space of the housing, the main substrate including a first surface facing in a first direction and a second surface facing in a direction opposite to the first surface, the main substrate including a through hole; and
It includes an antenna module disposed on the main board,
The antenna module is
a substrate at least partially disposed in the through hole and including a plurality of antenna elements; and
and a wireless communication circuit configured to transmit and/or receive a wireless signal in a designated frequency band through the plurality of antenna elements on the second side of the main board.
The method of claim 1,
The substrate may protrude from the first surface of the main substrate.
The method of claim 1,
The substrate may be substantially the same as or lower than the first surface of the main substrate.
The method of claim 1,
The wireless communication circuit is an electronic device disposed to overlap the main board at least partially when the first surface of the main board is viewed from above.
The method of claim 1,
The substrate and the wireless communication circuit are electrically and/or physically coupled to each other through a conductive bonding method.
The method of claim 1,
The wireless communication circuit is coupled or connected to the main board,
The substrate is an electronic device coupled or connected to the wireless communication circuit.
7. The method of claim 6,
The wireless communication circuit is an electronic device coupled or connected to the main board through a conductive bonding method.
The method of claim 1,
The main board includes at least one circuit,
The wireless communication circuit is an electronic device electrically connected to the at least one circuit through the main board.
9. The method of claim 8,
The at least one circuit comprises a communication processor and/or a power management circuit.
The method of claim 1,
Further comprising an interposer disposed between the main board and the wireless communication circuit,
The wireless communication circuit is an electronic device electrically connected to the main board through an interposer and the main board.
The method of claim 1,
and at least one matching circuit disposed between the substrate and the wireless communication circuit and electrically connected to the plurality of antenna elements.
12. The method of claim 11,
The matching circuit includes at least one conductive pattern disposed on the substrate and/or the wireless communication circuit.
13. The method of claim 12,
The at least one conductive pattern disposed on the substrate and/or the wireless communication circuit is disposed so as not to overlap each other when the first surface of the main substrate is viewed from above.
The method of claim 1,
The substrate may be formed of a material having a lower dielectric constant than that of the main substrate.
The method of claim 1,
The antenna module is
Another substrate comprising a plurality of different antenna elements disposed at predetermined intervals and electrically connected to the wireless communication circuit; and
Further comprising an interposer disposed between the wireless communication circuit and the other substrate,
The wireless communication circuit is disposed between the substrate and the other substrate, and is electrically connected to the plurality of other antenna elements through the interposer and the other substrate.
In an electronic device,
housing;
a main substrate disposed in the inner space of the housing, the main substrate including a first surface facing in a first direction and a second surface facing in a direction opposite to the first surface, the main substrate including a through hole; and
It includes an antenna module disposed on the main board,
The antenna module is
a substrate including a plurality of antenna elements; and
and a wireless communication circuit disposed at least partially in the through hole, electrically connected to the substrate, and configured to transmit and/or receive a wireless signal in a designated frequency band through the plurality of antenna elements.
17. The method of claim 16,
The substrate is disposed to overlap the main substrate at least partially when the second surface of the main substrate is viewed from above.
17. The method of claim 16,
The substrate and the wireless communication circuit are electrically and/or physically coupled to each other through a wireless bonding method.
17. The method of claim 16,
The substrate is coupled or connected to the main substrate,
The wireless communication circuit is an electronic device coupled or connected to the substrate.
17. The method of claim 16,
The main board includes at least one circuit,
The wireless communication circuit is an electronic device electrically connected to the at least one circuit through the substrate and/or the main substrate.

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