CN116884930A - Heat dissipation structure and manufacturing method thereof - Google Patents
Heat dissipation structure and manufacturing method thereof Download PDFInfo
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- CN116884930A CN116884930A CN202310965507.XA CN202310965507A CN116884930A CN 116884930 A CN116884930 A CN 116884930A CN 202310965507 A CN202310965507 A CN 202310965507A CN 116884930 A CN116884930 A CN 116884930A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 123
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 191
- 238000003466 welding Methods 0.000 claims description 40
- 239000002131 composite material Substances 0.000 claims description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 17
- 230000007704 transition Effects 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 238000005219 brazing Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 7
- 238000002955 isolation Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005070 sampling Methods 0.000 claims description 3
- 238000010008 shearing Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000004506 ultrasonic cleaning Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract description 26
- 230000002035 prolonged effect Effects 0.000 abstract description 5
- 230000007774 longterm Effects 0.000 abstract description 3
- 239000000110 cooling liquid Substances 0.000 description 12
- 238000005192 partition Methods 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 6
- 238000003754 machining Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 230000000171 quenching effect Effects 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910019752 Mg2Si Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a heat radiation structure and a manufacturing method thereof, wherein the heat radiation structure comprises an electric device, an upper radiator and a lower radiator which are arranged on the upper side and the lower side of the electric device, the upper radiator and the lower radiator respectively comprise a lower heat radiation cover plate, a heat radiation main body and an upper heat radiation cover plate, heat radiation grooves which are spirally arranged are respectively arranged on the two side plate surfaces of the heat radiation main body, the upper heat radiation cover plate and the lower heat radiation cover plate can respectively enclose a heat radiation channel, and a liquid inlet nozzle and a liquid outlet nozzle are arranged on the heat radiation main body; the heat dissipation groove comprises a liquid inlet groove and a liquid outlet groove. According to the heat radiation structure and the manufacturing method thereof, the upper radiator and the lower radiator are respectively arranged on the upper side and the lower side of the electric device, so that good heat radiation conditions are provided for the electric device, and high-efficiency long-term operation in a low-temperature environment is ensured; the heat dissipation grooves of the heat dissipation main body adopt a mode that the liquid inlet grooves and the liquid outlet grooves are distributed at intervals, double-spiral heat dissipation channels can be formed, heat dissipation uniformity is effectively improved, and the service life of the electric device is prolonged.
Description
Technical Field
The application belongs to the technical field of electronic heat dissipation structures, and particularly relates to a heat dissipation structure and a manufacturing method thereof.
Background
In the power electronics industry, cooling and heat dissipation techniques are an important technique. Particularly for integrated gate commutated thyristor devices, heat dissipation is a particular issue. The Integrated Gate Commutated Thyristor (IGCT) has the characteristics of large current, high voltage blocking and switching frequency, and the like, is widely applied to high-power flexible alternating current transmission systems and high-power transmission devices, and has a heat dissipation structure capable of ensuring that an electric device can efficiently work for a long time in a low-temperature environment.
With the improvement of the power and the frequency of the electric device, the heating density of the electric device is correspondingly improved, the prior IGCT is difficult to achieve an ideal cooling effect, and the normal operation of the electric device is seriously influenced.
Disclosure of Invention
The application aims to provide a heat dissipation structure and a manufacturing method thereof, which can quickly and efficiently cool an electric device, ensure that the electric device can work in a low-temperature environment for a long time and have good cooling effect.
In order to achieve the above purpose, the application adopts the following technical scheme: the upper radiator and the lower radiator comprise a lower radiating cover plate, a radiating main body and an upper radiating cover plate which are sequentially arranged from bottom to top, radiating grooves which are spirally arranged are respectively arranged on the two side plate surfaces of the radiating main body, the radiating main body can respectively enclose with the upper radiating cover plate and the lower radiating cover plate to form a radiating channel, and the radiating main body is provided with a liquid inlet nozzle and a liquid outlet nozzle which are respectively communicated with two ends of the radiating grooves in a one-to-one correspondence manner;
the heat dissipation groove comprises a liquid inlet groove which extends to the center of the heat dissipation main body from the liquid inlet nozzle in an inward spiral manner and a liquid outlet groove which extends to the liquid outlet nozzle from the liquid outlet end of the liquid inlet groove in an outward spiral manner, and the liquid inlet groove and the liquid outlet groove are distributed at intervals in the radial direction of the heat dissipation main body to form a double-spiral heat dissipation channel.
In one possible implementation manner, a plurality of electric devices are distributed along the up-down direction, an upper radiator is arranged above the electric device at the top, a lower radiator is arranged below the electric device at the bottom, and a middle radiator is arranged between the upper adjacent electric device and the lower adjacent electric device.
In one possible implementation manner, the heat dissipation main body is provided with a liquid inlet hole for installing the liquid inlet nozzle and a liquid outlet hole for installing the liquid outlet nozzle, and the liquid inlet hole and the liquid outlet hole respectively penetrate through the same side wall of the heat dissipation main body and are arranged in parallel with the main shaft of the liquid inlet hole and the liquid outlet hole.
In some embodiments, the liquid inlet hole and the liquid outlet hole are also provided with electrode sleeves, the electrode sleeves are embedded on the inner peripheral wall of the liquid inlet hole or the liquid outlet hole, and a gap is arranged between the outer end surface of the electrode sleeves and the inner end surface of the liquid inlet nozzle or the liquid outlet nozzle.
In some embodiments, the liquid inlet groove is connected with the liquid inlet hole through a first transition groove, the first transition groove extends to be communicated with the liquid inlet end of the liquid inlet groove perpendicular to the axial direction of the liquid inlet hole, the liquid outlet groove is connected with the liquid outlet hole through a second transition groove, and the second transition groove extends to be communicated with the liquid outlet end of the liquid outlet groove perpendicular to the axial direction of the liquid outlet hole.
In one possible implementation manner, the upper side and the lower side of the heat dissipation main body are respectively provided with a welding composite plate, and the welding composite plate is located between the upper heat dissipation cover plate and the heat dissipation main body or between the lower heat dissipation cover plate and the heat dissipation main body.
In one possible implementation, a partition plate extending along the direction of the heat dissipation groove is arranged in the heat dissipation groove, and the side edge of the partition plate away from the heat dissipation groove can be in contact fit with the upper heat dissipation cover plate or the lower heat dissipation cover plate.
In some embodiments, the heat dissipation groove has a rectangular cross section, and the distances from the partition plate to the inner cavity walls on two sides of the heat dissipation groove are equal.
In one possible implementation, the top surface of the upper heat sink cover plate and the bottom surface of the lower heat sink cover plate are respectively provided with a nickel plating layer.
Compared with the prior art, the heat dissipation structure provided by the embodiment of the application has the advantages that the upper heat radiator and the lower heat radiator are respectively arranged on the upper side and the lower side of the electric device, so that good heat dissipation conditions are provided for the electric device, and the high-efficiency long-term work in a low-temperature environment is ensured; the heat dissipation grooves of the heat dissipation main body adopt a mode that the liquid inlet grooves and the liquid outlet grooves are distributed at intervals, double spiral heat dissipation channels can be formed, heat dissipation uniformity is effectively improved, a good temperature equalizing function is achieved, and the service life of an electric device is prolonged.
The application also provides a manufacturing method of the heat dissipation structure, which is suitable for manufacturing the heat dissipation structure, and the manufacturing method of the heat dissipation structure comprises the following steps:
s100: adopting high-precision CNC to respectively process a liquid inlet groove, a liquid outlet groove, a liquid inlet hole and a liquid outlet hole on the two side plate surfaces of the radiating main body;
s200: cutting an upper radiating cover plate, a lower radiating cover plate, a radiating main body and a welding composite plate by using a plate shearing machine, and ultrasonically cleaning the radiating main body, the upper radiating cover plate, the lower radiating cover plate and the welding composite plate;
s300: sequentially stacking an upper heat-dissipating cover plate, a layer of welding composite plate, a heat-dissipating main body, another layer of welding composite plate and a lower heat-dissipating cover plate from bottom to top to form a group of heat radiators;
s400: placing a base plate above the operation table, horizontally laying a plurality of parallel isolation square tubes on the base plate, and laying a group of radiators above the isolation square tubes;
s500: repeating the step S400 for a plurality of times, stacking a plurality of parallel isolating square tubes on the top-most radiator, stacking a pressing plate above the top-most isolating square tubes, fastening and fixing the backing plate and the pressing plate by using fastening bolts, and welding by adopting a vacuum brazing process;
s600: after welding, naturally cooling or air-supplying cooling the radiator, sampling the radiator, performing ultrasonic C scanning water immersion detection, performing solution treatment on the radiator, and chemically plating nickel on the surface of the radiator, wherein the thickness of a nickel film is 8-12 mu m;
s700: the heat sink is mounted to the top surface, or the bottom surface, of the electrical device, or between two adjacent electrical devices to form a heat dissipating structure.
Compared with the prior art, the manufacturing method of the heat dissipation structure provided by the embodiment has the advantages that the heat dissipation structure is subjected to braze welding by using the welding tool, and good heat dissipation conditions are provided for the electric device by arranging the upper radiator and the lower radiator on the upper side and the lower side of the electric device respectively, so that the electric device can work in a low-temperature environment for a long time with high efficiency; the heat dissipation grooves of the heat dissipation main body adopt a mode that the liquid inlet grooves and the liquid outlet grooves are distributed at intervals, double spiral heat dissipation channels can be formed, heat dissipation uniformity is effectively improved, a good temperature equalizing function is achieved, and the service life of an electric device is prolonged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a front cross-sectional structure of a heat dissipation structure according to an embodiment of the present application;
FIG. 2 is a schematic diagram illustrating an exploded structure of the upper heat sink of FIG. 1 according to an embodiment of the present application;
FIG. 3 is a schematic top view of FIG. 2 according to an embodiment of the present application;
FIG. 4 is a schematic cross-sectional view of A-A of FIG. 3 in accordance with an embodiment of the present application;
fig. 5 is a schematic top view of a heat dissipating body according to embodiment 2 of the present application;
fig. 6 is a schematic diagram of a front cross-sectional structure of another embodiment of a heat dissipation structure according to an embodiment of the present application;
fig. 7 is a schematic front view of a brazing process of a radiator according to an embodiment of the present application.
Wherein, each reference sign in the figure:
1. an electrical device; 2. a heat sink; 21. an upper heat sink; 22. a middle radiator; 23. a lower radiator; 24. a partition plate; 31. a lower heat-dissipating cover plate; 32. a heat dissipating body; 321. a first transition groove; 322. a second transition groove; 33. an upper heat-dissipating cover plate; 331. positioning holes; 332. a positioning pin; 34. a liquid inlet tank; 35. a liquid outlet groove; 36. a liquid inlet nozzle; 37. a liquid outlet nozzle; 38. a liquid inlet hole; 39. a liquid outlet hole; 4. an electrode sleeve; 5. welding the composite board; 51. a backing plate; 52. a pressing plate; 53. a fastening bolt; 54. isolating the square tubes.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or be indirectly on the other element. It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present application. The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a number" is two or more, unless explicitly defined otherwise.
Referring to fig. 1 to 7, a heat dissipation structure and a method for manufacturing the same according to the present application will now be described. The heat radiation structure comprises an electric device 1, an upper radiator 21 and a lower radiator 23 which are arranged on the upper side and the lower side of the electric device 1, wherein the upper radiator 21 and the lower radiator 23 respectively comprise a lower heat radiation cover plate 31, a heat radiation main body 32 and an upper heat radiation cover plate 33 which are sequentially arranged in a laminated manner from bottom to top, heat radiation grooves which are spirally arranged are respectively arranged on the two side plate surfaces of the heat radiation main body 32, the heat radiation main body 32 can respectively enclose with the upper heat radiation cover plate 33 and the lower heat radiation cover plate 31 to form a heat radiation channel, and a liquid inlet nozzle 36 and a liquid outlet nozzle 37 which are respectively communicated with the two ends of the heat radiation grooves in a one-to-one correspondence manner are arranged on the heat radiation main body 32;
the heat dissipation groove comprises a liquid inlet groove 34 extending from a liquid inlet nozzle 36 to the center of the heat dissipation main body 32 in an inward spiral manner, and a liquid outlet groove 35 extending from a liquid outlet end of the liquid inlet groove 34 to a liquid outlet nozzle 37 in an outward spiral manner, wherein the liquid inlet groove 34 and the liquid outlet groove 35 are arranged at intervals in the radial direction of the heat dissipation main body 32 to form a double-spiral heat dissipation channel.
Compared with the prior art, the heat dissipation structure provided by the embodiment provides good heat dissipation conditions for the electric device 1 by arranging the upper heat radiator 21 and the lower heat radiator 23 on the upper side and the lower side of the electric device 1 respectively, so that the heat dissipation structure can work in a low-temperature environment for a high-efficiency and long time; the heat dissipation grooves of the heat dissipation main body 32 adopt a mode of arranging the liquid inlet groove 34 and the liquid outlet groove 35 at intervals, so that double spiral heat dissipation channels can be formed, the heat dissipation uniformity is effectively improved, a good temperature equalizing function is achieved, and the service life of the electric device 1 is prolonged.
The upper radiator 21, the middle radiator 22, and the lower radiator 23 are collectively referred to as a radiator 2. The number of the electric devices 1 is N (N.gtoreq.1), and the number of the heat sinks 2 is N+1. When n=1, only the upper heat sink 21 and the lower heat sink 23 need be provided at the top and under the electric device 1, respectively; when N is not less than 2, the upper radiator 21, the middle radiator 22 and the lower radiator 23 are required to be respectively arranged. The radiator 2 positioned above the topmost electric device 1 is defined as an upper radiator 21, the radiator 2 positioned below the bottommost electric device 1 is defined as a lower radiator 23, and the radiator 2 positioned between the upper and lower adjacent electric devices 1 is defined as a middle radiator 22.
In this embodiment, the liquid inlet tank 34 and the liquid outlet tank 35 on the surface of the heat dissipating main body 32 form a double-spiral structure, the cooling liquid flows in from the liquid inlet end of the liquid inlet tank 34 (i.e. the peripheral position of the heat dissipating main body 32) and spirally extends to the central position of the heat dissipating main body 32, and then flows into the liquid outlet tank 35 and spirally diffuses along the liquid outlet tank 35 to the periphery, so that the defect of high central temperature in the prior art is solved, the temperature difference between the central position and the peripheral position of the heat dissipating main body 32 is avoided, the uniformity of the internal temperature of the heat dissipating channel is ensured, the uniform heat dissipating effect is achieved on each position of the electric device 1, the problem of higher local temperature of the electric device 1 is avoided, the whole surface temperature of the electric device 1 is uniform, and the electric device 1 can operate for a long time with high efficiency.
Further, a liquid outlet groove 35 is arranged between two adjacent liquid inlet grooves 34 extending in the circumferential direction, and the liquid inlet grooves 34 are arranged in the two adjacent liquid outlet grooves 35 extending in the circumferential direction, so that the temperatures of cooling liquid with different temperatures are relatively balanced, and the cooling uniformity is improved. In addition, the double-spiral heat dissipation channel is convenient for improving the flow velocity of the cooling liquid, reducing the flow resistance of the cooling liquid, reducing the pump lift and flow of a user and enabling the cost of the whole matched device to be lower.
The heat dissipation main body 32 is made of 6063-T6 aluminum plates, main alloy elements of the 6063-T6 aluminum plates are magnesium and silicon, and Mg2Si phases are formed, the heat dissipation main body 32 is used for processing the liquid inlet tank 34 and the liquid outlet tank 35 through high-precision CNC equipment (generally referred to as a computer numerical control machine tool, including precision machining, CNC machining lathe, CNC machining milling machine, CNC machining boring milling machine and the like), the forming precision of the liquid inlet tank 34 and the liquid outlet tank 35 is improved, the consistency of flow rates of the liquid inlet tank 34 and the liquid outlet tank 35 is ensured, the heat exchange capacity of a heat dissipation channel for the position is identical, and the temperature uniformity of a table top is improved.
On this basis, the upper and lower heat radiating cover plates 33 and 31 are welded to the upper and lower sides of the heat radiating body 32 by a vacuum brazing process. In specific welding, a welding composite board 5 is respectively arranged between the upper radiating cover board 33 and the radiating main body 32 and between the lower radiating cover board 31 and the radiating main body 32, the welding composite board 5 adopts a mode that 3003 aluminum plates are combined with welding layers, the welding layers are respectively arranged on the upper side surface and the lower side surface of the 3003 aluminum plates, the welding layers are melted in the brazing process, and the 3003 aluminum plates are connected between the upper radiating cover board 33 and the radiating main body 32 or between the lower radiating cover board 31 and the radiating main body 32, so that the welding reliability is ensured. In the welding mode, the welding pressure resistance reaches 1.5Mpa air pressure.
Meanwhile, in order to facilitate the positioning of the upper heat-dissipating cover plate 33, positioning holes 331 are respectively formed in the upper heat-dissipating cover plate 33 and the lower heat-dissipating cover plate 31, the electric device 1 is provided with matching holes corresponding to the positioning holes 331, and the upper heat radiator 21 or the lower heat radiator 23 is matched with the electric device 1 in a positioning manner through positioning pins 332, so that the structural positioning of the components is facilitated, and the positioning accuracy is improved.
Specifically, the locating hole 331 is formed in the top surface of the upper heat dissipating cover 33, the depth of the locating hole 331 is smaller than the thickness of the upper heat dissipating cover 33, the welding composite board 5 below the upper heat dissipating cover 33 is prevented from being damaged due to overlarge depth, and the structural tightness of the upper radiator 21 is guaranteed.
In one possible implementation, referring to fig. 1 to 7, a plurality of electric devices 1 are arranged along the up-down direction, an upper radiator 21 is arranged above the electric device 1 at the top, a lower radiator 23 is arranged below the electric device 1 at the bottom, and a middle radiator 22 is arranged between two adjacent electric devices 1.
In this embodiment, have a plurality ofly in the heat radiation structure, in order to satisfy the heat dissipation demand, still set up well radiator 22 between upper and lower two-layer, the total number of layers that the number of piles of well radiator 22 compares is less one, is equipped with the heat dissipation layer on the top surface that is located the top, and the bottom that is located the bottom is equipped with the heat dissipation layer down, so far, the top surface and the bottom surface of every all obtain effective heat dissipation, have realized effective cooling to, the life of the extension of being convenient for.
In a possible implementation, referring to fig. 1 to 7, the heat dissipating main body 32 is provided with a liquid inlet 38 for installing the liquid inlet 36 and a liquid outlet 39 for installing the liquid outlet 37, where the liquid inlet 38 and the liquid outlet 39 are respectively disposed through the same side wall of the heat dissipating main body 32, and the main axes of the liquid inlet 38 and the liquid outlet 39 are disposed in parallel.
In this embodiment, through setting up the installation of advance liquid mouth 36 and liquid mouth 37 of feed liquor hole 38 and play liquid hole 39 advance respectively on the same lateral wall of heat dissipation main part 32, the setting of feed liquor hole 38 and play liquid hole 39 position is convenient for carry out the structure processing of heat dissipation main part 32, can effectively practice thrift the occupation space of heat dissipation main part 32 simultaneously, and then reduce heat dissipation structure's volume. The liquid inlet 38 and the liquid outlet 39 are positioned inside the heat dissipating main body 32, the outer ends of the liquid inlet 38 and the liquid outlet 39 are used for installing the liquid inlet 36 or the liquid outlet 37, and the inner ends of the liquid inlet and the liquid outlet are used for communicating with the liquid inlet tank 34 or the liquid outlet tank 35.
In this embodiment, the liquid inlet 36 is screwed into the liquid inlet 38, and the liquid outlet 37 is screwed into the liquid outlet 39. The structures of the liquid inlet nozzle 36 and the liquid inlet hole 38 are described as an example. A limiting step is arranged in the liquid inlet hole 38, and the outer end surface of the limiting step is abutted with the inner end surface of the liquid inlet nozzle 36 to limit the installation position of the liquid inlet nozzle 36.
The limiting step is arranged in the liquid inlet hole 38, the inner end face of the liquid inlet nozzle 36 is propped against the end face of the limiting step, the structural tightness of the installation of the liquid inlet nozzle 36 is guaranteed, the cooling liquid is prevented from leaking, the occupied space is reduced, and the structure is simple and easy to operate.
In some embodiments, the liquid inlet 38 and the liquid outlet 39 are also provided with an electrode sleeve 4, the electrode sleeve 4 is embedded on the inner peripheral wall of the liquid inlet 38 or the liquid outlet 39, and a gap is arranged between the outer end surface of the electrode sleeve 4 and the inner end surface of the liquid inlet 36 or the liquid outlet 37.
In this embodiment, the electrode sleeve 4 has a protective effect on the liquid inlet 36 or the liquid outlet 37. The electrode sleeve 4 is made of stainless steel 316L, so that the heat dissipation structure cannot strike through the liquid inlet nozzle 36 or the liquid outlet nozzle 37 at high potential. The inner diameter of the electrode sleeve 4, the inner diameter of the liquid inlet hole 38 and the inner diameter of the liquid outlet hole 39 are respectively equal, so that the cross-sectional area through which the cooling liquid flows is kept unchanged, and the fluency of the cooling liquid flow is ensured.
In some embodiments, the liquid inlet tank 34 is connected to the liquid inlet hole 38 through a first transition groove 321, the first transition groove 321 extends perpendicularly to the axial direction of the liquid inlet hole 38 to be communicated with the liquid inlet end of the liquid inlet tank 34, the liquid outlet tank 35 is connected to the liquid outlet hole 39 through a second transition groove 322, and the second transition groove 322 extends perpendicularly to the axial direction of the liquid outlet hole 39 to be communicated with the liquid outlet end of the liquid outlet tank 35.
In this embodiment, for convenience of description, the first transition groove 321 is taken as an example, and the first transition groove 321 is used to connect the liquid inlet 38 and the liquid inlet groove 34. The first transition groove 321 is arranged on the plate surface of the heat dissipation main body 32 and is communicated with the outside, the first transition groove 321 is communicated with the liquid inlet groove 34 and the liquid outlet end of the liquid inlet hole 38, so that the conveying efficiency of the cooling liquid is conveniently improved, and good cooling effect is ensured.
In one possible implementation, referring to fig. 1 to 7, the upper and lower sides of the heat dissipating body 32 are respectively provided with a welding composite plate 5, and the welding composite plate 5 is located between the upper heat dissipating cover 33 and the heat dissipating body 32 or between the lower heat dissipating cover 31 and the heat dissipating body 32.
In this embodiment, the welded composite plate 5 includes a lower solder layer, a middle aluminum plate layer, and an upper solder layer, which are sequentially stacked from bottom to top. Taking the welded composite board 5 between the heat dissipation cover plate 33 and the heat dissipation main body 32 as an example for illustration, the lower solder layer and the upper solder layer can be melted during welding operation, so that the middle aluminum plate layer is connected between the heat dissipation main body 32 and the upper heat dissipation cover plate 33, and the middle aluminum plate layer is connected on the top surface of the heat dissipation main body 32, and forms a heat dissipation channel in cooperation with the heat dissipation main body 32, and the cooling liquid circulates from the heat dissipation channel, so that a uniform heat dissipation effect is realized.
In one possible implementation, referring to fig. 1 to 7, the heat sink is provided with a partition plate 24 extending along the direction of the heat sink, and a side edge of the partition plate 24 away from the heat sink can be in contact fit with the upper heat sink cover 33 or the lower heat sink cover 31.
In this embodiment, the partition plate 24 is provided to form two parallel flow paths in the liquid inlet tank 34 and the liquid outlet tank 35, respectively, thereby improving the conductivity. The arrangement of the parallel flow channels is convenient for reducing the flow resistance of the heat dissipation channels, improving the flow velocity of the cooling liquid, effectively reducing the temperature of the table top of the upper radiator 21 or the lower radiator 23 and realizing the cooling effect.
The edge of the partition plate 24 extending to the outside of the liquid inlet groove 34 or the liquid outlet groove 35 can be tightly contacted with the 3003 aluminum plate of the welding composite plate 5, so that the hidden danger of high temperature caused by water connection is reduced, and the cooling liquid is fully subjected to heat exchange with the electric device 1, thereby achieving the purpose of heat dissipation.
In some embodiments, referring to fig. 1 to 7, the heat dissipation groove has a rectangular cross section, and the distance from the partition plate 24 to the inner cavity walls at two sides of the heat dissipation groove is equal. The rectangular cross-section heat sink is more convenient to machine and also facilitates the layout of the divider plate 24. The edge of one side of the partition plate 24 is connected to the bottom wall of the heat dissipation groove, and the edge of the other side of the partition plate is connected to the middle aluminum plate layer of the welded composite plate 5, so that two flow channels which are adjacently arranged and are arranged in parallel are formed, and the fluency of cooling liquid supply is improved.
In one possible implementation, referring to fig. 1 to 7, the top surface of the upper heat dissipating cover 33 and the bottom surface of the lower heat dissipating cover 31 are respectively provided with a nickel plating layer, specifically, the nickel plating layer has a thickness of 8-12 μm, which not only ensures the overall conductivity of the heat dissipating mechanism, but also provides good corrosion resistance.
Based on the same inventive concept, the embodiment of the application also provides a device, which is suitable for manufacturing a heat dissipation structure, and the manufacturing method of the heat dissipation structure comprises the following steps:
s100: adopting high-precision CNC to respectively process a liquid inlet groove 34, a liquid outlet groove 35, a liquid inlet hole 38 and a liquid outlet hole 39 on two side plate surfaces of the radiating main body 32;
s200: cutting the upper radiating cover plate 33, the lower radiating cover plate 31, the radiating main body 32 and the welding composite plate 5 by using a plate shearing machine, and ultrasonically cleaning the radiating main body 32, the upper radiating cover plate 33, the lower radiating cover plate 31 and the welding composite plate 5;
s300: sequentially stacking an upper heat-dissipating cover plate 33, one layer of the welded composite plate 5, a heat-dissipating body 32, another layer of the welded composite plate 5, and a lower heat-dissipating cover plate 31 from bottom to top to form a heat sink 2;
s400: placing the base plate 51 above the operation table, horizontally laying a plurality of parallel isolating square pipes 54 on the base plate 51, and laying a group of radiators 2 above the isolating square pipes 54;
s500: the step S400 is repeated for a plurality of times, a plurality of parallel isolating square tubes 54 are stacked on the top-layer radiator 2, a pressing plate 52 is stacked above the top-layer isolating square tubes 54, the backing plate 51 and the pressing plate 52 are fastened and fixed by using the fastening bolts 53, and the vacuum brazing process is adopted for welding.
Specifically, in order to avoid direct contact between the isolating square tube 54 and the radiator 2, a stainless steel plate can be arranged between the isolating square tube 54 and the radiator, so that effective isolation of the isolating square tube and the radiator can be realized.
S600: after welding, naturally cooling or air-supplying cooling the radiator 2, sampling the radiator 2, performing ultrasonic C scanning water immersion detection, performing solution treatment on the radiator 2, and chemically plating nickel on the surface of the radiator 2, wherein the thickness of a nickel film is 8-12 mu m; the conductivity of the heat dissipation structure is ensured, and the heat dissipation structure has good corrosion resistance.
S700: the heat sink 2 is mounted to the top surface or the bottom surface of the electric devices 1 or between adjacent two electric devices 1 to form a heat dissipation structure. The number of the installed radiators 2 is correspondingly distributed according to the number of the electric devices 1, so that the two sides of the plate surface of each electric device 1 are ensured to be contacted with different radiators 2, and a good radiating effect is obtained.
In the manufacturing process, ultrasonic C scanning water immersion detection is used for detecting the welding strength and the welding strength of the radiator 2, and brazing is guaranteed to meet the welding quality requirement.
The solution treatment (solution treatment) is a heat treatment process in which the alloy is heated to a high temperature in a single-phase region and kept at a constant temperature, and the excess phase is sufficiently dissolved into a solid solution and then rapidly cooled to obtain a supersaturated solid solution. Because the operation process is similar to quenching, the quenching is also called solid solution quenching. And in the process of carrying out solution treatment on the radiator, the hardness of the radiator 2 is checked by adopting a 9-point rule, so that the hardness of the radiator is ensured to be more than 80HB.
Compared with the prior art, the manufacturing method of the heat dissipation structure provided by the embodiment has the advantages that the heat dissipation structure is subjected to braze welding by using the welding tool, and the upper radiator 21 and the lower radiator 23 are respectively arranged on the upper side and the lower side of the electric device 1, so that good heat dissipation conditions are provided for the electric device 1, and the high-efficiency long-term work in a low-temperature environment is ensured; the heat dissipation grooves of the heat dissipation main body 32 adopt a mode of arranging the liquid inlet groove 34 and the liquid outlet groove 35 at intervals, so that double spiral heat dissipation channels can be formed, the heat dissipation uniformity is effectively improved, a good temperature equalizing function is achieved, and the service life of the electric device 1 is prolonged.
The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.
Claims (10)
1. The heat dissipation structure is characterized by comprising an electric device, an upper radiator and a lower radiator, wherein the upper radiator and the lower radiator are arranged on the upper side and the lower side of the electric device, the upper radiator and the lower radiator respectively comprise a lower heat dissipation cover plate, a heat dissipation main body and an upper heat dissipation cover plate which are sequentially arranged in a stacked manner from bottom to top, heat dissipation grooves which are spirally arranged are respectively arranged on the two side plate surfaces of the heat dissipation main body, the upper heat dissipation cover plate and the lower heat dissipation cover plate can respectively enclose into heat dissipation channels, and liquid inlets and liquid outlets which are respectively communicated with the two ends of the heat dissipation grooves in a one-to-one correspondence manner are arranged on the heat dissipation main body;
the heat dissipation groove comprises a liquid inlet groove which extends from the liquid inlet nozzle to the center of the heat dissipation main body in an inward spiral manner and a liquid outlet groove which extends from the liquid outlet end of the liquid inlet groove to the liquid outlet nozzle in an outward spiral manner, and the liquid inlet groove and the liquid outlet groove are arranged at intervals in the radial direction of the heat dissipation main body to form a double-spiral heat dissipation channel.
2. The heat dissipating structure of claim 1, wherein a plurality of said electric devices are arranged in a vertical direction, said upper heat sink is disposed above the electric device at the top, said lower heat sink is disposed below the electric device at the bottom, and a middle heat sink is disposed between the upper and lower adjacent electric devices.
3. The heat dissipation structure as defined in claim 1, wherein the heat dissipation main body is provided with a liquid inlet hole for installing the liquid inlet nozzle and a liquid outlet hole for installing the liquid outlet nozzle, the liquid inlet hole and the liquid outlet hole are respectively arranged penetrating through the same side wall of the heat dissipation main body, and main shafts of the liquid inlet hole and the liquid outlet hole are arranged in parallel.
4. The heat dissipation structure as defined in claim 3, wherein the liquid inlet hole and the liquid outlet hole are further provided with electrode sleeves, the electrode sleeves are embedded on the inner peripheral wall of the liquid inlet hole or the liquid outlet hole, and a gap is arranged between the outer end surface of the electrode sleeves and the inner end surface of the liquid inlet nozzle or the liquid outlet nozzle.
5. The heat dissipating structure of claim 3, wherein said liquid inlet slot is connected to said liquid inlet hole by a first transition slot extending perpendicular to the axial direction of said liquid inlet hole to communicate with the liquid inlet end of said liquid inlet slot, and said liquid outlet slot is connected to said liquid outlet hole by a second transition slot extending perpendicular to the axial direction of said liquid outlet hole to communicate with the liquid outlet end of said liquid outlet slot.
6. The heat dissipating structure of claim 1, wherein the upper and lower sides of the heat dissipating body are respectively provided with a welded composite plate, and the welded composite plate is located between the upper heat dissipating cover plate and the heat dissipating body or between the lower heat dissipating cover plate and the heat dissipating body.
7. The heat dissipating structure of any of claims 1-6, wherein a divider plate extending along the trend of the heat dissipating groove is provided in the heat dissipating groove, and a side edge of the divider plate away from the heat dissipating groove is capable of contact fit with the upper heat dissipating cover plate or the lower heat dissipating cover plate.
8. The heat dissipating structure of claim 7, wherein said heat dissipating slot has a rectangular cross section, and said divider plates are equidistant from inner cavity walls on both sides of said heat dissipating slot.
9. The heat dissipating structure of claim 1, wherein a nickel plating layer is provided on the top surface of said upper heat dissipating cover plate and the bottom surface of said lower heat dissipating cover plate, respectively.
10. A method for manufacturing a heat dissipation structure, adapted to manufacture a heat dissipation structure as defined in any one of claims 1 to 9, characterized in that the method for manufacturing a heat dissipation structure comprises the steps of:
s100: adopting high-precision CNC to respectively process a liquid inlet groove, a liquid outlet groove, a liquid inlet hole and a liquid outlet hole on the two side plate surfaces of the radiating main body;
s200: cutting an upper radiating cover plate, a lower radiating cover plate, a radiating main body and a welding composite plate by using a plate shearing machine, and carrying out ultrasonic cleaning on the radiating main body, the upper radiating cover plate, the lower radiating cover plate and the welding composite plate;
s300: sequentially stacking the upper heat-dissipating cover plate, one layer of welding composite plate, the heat-dissipating main body, the other layer of welding composite plate and the lower heat-dissipating cover plate from bottom to top to form a group of heat radiators;
s400: placing a base plate above an operation table, horizontally laying a plurality of parallel isolation square tubes on the base plate, and laying a group of radiators above the isolation square tubes;
s500: repeating the step S400 for a plurality of times, stacking a plurality of parallel isolating square tubes on the top-most radiator, stacking a pressing plate above the top-most isolating square tubes, fastening and fixing the backing plate and the pressing plate by using fastening bolts, and welding by using a vacuum brazing process;
s600: after welding, naturally cooling or air-supplying cooling the radiator, sampling the radiator, performing ultrasonic C scanning water immersion detection, performing solution treatment on the radiator, and performing chemical nickel plating on the surface of the radiator, wherein the thickness of a nickel film is 8-12 mu m;
s700: the heat sink is mounted to the top surface or the bottom surface of the electrical device or between two adjacent electrical devices to form a heat dissipating structure.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310965507.XA CN116884930A (en) | 2023-08-02 | 2023-08-02 | Heat dissipation structure and manufacturing method thereof |
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