CN116884671A - Polymer conductive film, preparation method and lithium ion battery core - Google Patents
Polymer conductive film, preparation method and lithium ion battery core Download PDFInfo
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- 229920000642 polymer Polymers 0.000 title claims abstract description 110
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 title claims abstract description 11
- 229910001416 lithium ion Inorganic materials 0.000 title claims abstract description 11
- 238000002360 preparation method Methods 0.000 title abstract description 7
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- 229920002521 macromolecule Polymers 0.000 claims description 19
- 238000000151 deposition Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 238000009501 film coating Methods 0.000 claims description 14
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- 238000004544 sputter deposition Methods 0.000 claims description 5
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Abstract
The embodiment of the invention provides a high-molecular conductive film, a preparation method and a lithium ion battery cell, wherein the high-molecular conductive film comprises the following components: a polymer base film; and a plurality of film layers formed on both side surfaces of the polymer-based film, the particle sizes in the plurality of film layers being different. The multi-layer composite film layers with different particle sizes are formed on two sides of the polymer base film, the mechanical properties of the polymer base film are regulated and controlled by regulating the proportion of the film layers with different particle sizes, and the change rate of the resistivity under the condition of regulating and controlling a certain stretching distance is lower while the mechanical properties are ensured.
Description
Technical Field
The invention relates to the field of flexible substrate conductive films, in particular to a high polymer conductive film, a preparation method and a lithium ion battery cell.
Background
At present, flexible materials with metallized surfaces of polymer substrates are applied in a plurality of fields, and particularly, with the urgent demands in the aspects of explosive growth of lithium ion battery applications and safety performance thereof in recent years, polymer conductive film layers are selected as materials for current collection.
Based on the prevention and control of the processing procedure and the safety performance of the battery cell, the conductive film material with high mechanical properties, such as high strength, high elongation and low resistance change rate, needs to be developed and produced.
In the process of implementing the present invention, the inventor finds that at least the following problems exist in the prior art: the conductive film material in the prior art cannot meet the requirement of high mechanical property.
Disclosure of Invention
Accordingly, an objective of the embodiments of the present invention is to provide a polymer conductive film, a preparation method and a lithium ion battery core, so as to produce a conductive film material with high mechanical properties.
In order to achieve the above object, according to a first aspect, an embodiment of the present invention provides a polymer conductive film, including:
a polymer base film;
and a plurality of film layers formed on both side surfaces of the polymer-based film, the particle sizes in the plurality of film layers being different.
In some possible embodiments, the film layers located on both sides of the polymer-based film are multilayer composite film layers of an asymmetric structure centered on the polymer-based film; and/or the number of layers of the multilayer film formed on the surface of one side of the polymer-based film is less than or equal to 15.
In some possible embodiments, the polymer conductive film includes any one or more of the following:
the thickness of the single-side film layer of the macromolecule conductive film is 850nm-1200nm;
the thickness of the first layer conductive film layer of the macromolecule conductive film is more than or equal to 100nm;
the thickness of the polymer-based film of the polymer conductive film is 3um-8um.
In some possible embodiments, the polymer conductive film has at least one film layer having a first characteristic, the film layer having the first characteristic has a thickness of 100nm or more, and the film layer having the first characteristic has a particle size larger than that of the other film layers, and the film layer having the first characteristic has a particle average size of 80nm or more.
In some possible embodiments, the polymer conductive film has at least one film layer having a second characteristic, the film layer having the second characteristic has a thickness of less than or equal to 100nm, a particle size in the film layer having the second characteristic is different from other film layers, and an average particle size of the film layer having the second characteristic is less than or equal to 50nm.
In some possible embodiments, the total number of layers of the polymer conductive film having the first characteristic is lower than the total number of coating layers of the single-sided final film.
That is, the single-side film layer of the polymer conductive film is formed by overlapping after independent film plating for a plurality of times, that is, the single-side film layer may be deposited for tens of times, so that the number of film plating times of the first characteristic is at least one layer less than the total number of film plating times, and the number of film plating times of the adhesive layer is not included. And the adhesion layer is mainly metal oxide, so the adhesion layer of the embodiment of the present invention can be understood as not having a conductive function.
In some possible embodiments, the polymer conductive film is formed by continuously alternating and/or non-continuously overlapping the film layer with the first characteristic and the film layer with the second characteristic in a single-side multi-layer film layer of the polymer conductive film.
In some possible embodiments, the polymer conductive film includes any one or more of the following:
the tensile strength of the macromolecule conductive film is more than or equal to 65% of the macromolecule based film performance before film coating;
the elongation rate of the macromolecule conductive film is more than or equal to 30% of the macromolecule based film performance before film coating;
the surface roughness of the macromolecule conductive film is more than or equal to 50nm;
the change rate of the sheet resistance of the polymer conductive film under the condition of 3% elongation is less than or equal to 5%;
the defect density of holes of the macromolecule conductive film with the thickness of more than 0.5mm is less than or equal to 0.1 holes per square meter;
the electrical property of the polymer conductive film is lower than 3.8x10 -8 Ω.m；
The adhesion layer with the thickness smaller than 20nm is arranged close to the surface of the polymer base film in the polymer conductive film, and the adhesion layer is an oxide film layer containing at least one element or a plurality of elements of Ti, cr, ni, si and Al.
In a second aspect, an embodiment of the present invention provides a method for preparing a polymer conductive film, where the method includes:
forming an adhesion layer on the surface of one side or both sides of the polymer-based film, wherein the adhesion layer is an oxide film layer formed by adopting an evaporation mode or a sputtering coating mode;
one or more film layers with first characteristics are deposited on the surface of the polymer base film deposited with the adhesion layer in a steady-state evaporation coating mode;
and continuously depositing a plurality of film layers with second characteristics on the surface deposited with the film layers with first characteristics by adopting an evaporation boat wire feeding or electron beam thermal evaporation mode, wherein the single-layer deposition thickness of the film layers with second characteristics is smaller than that of the film layers with first characteristics.
In a third aspect, an embodiment of the present invention provides a lithium ion battery cell, where the lithium ion battery cell includes any one of the polymer conductive films described in the first aspect.
The technical scheme has the following beneficial effects:
according to the conductive film and the preparation method thereof provided by the embodiment of the invention, the multi-layer composite film layers with different particle sizes are formed on the two sides of the polymer base film, the mechanical properties of the conductive film are regulated and controlled by regulating the proportion of the film layers with different particle sizes, and the change rate of the resistivity under the condition of regulating and controlling a certain stretching distance is lower while the mechanical properties are ensured.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a polymer conductive film according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for producing a polymer conductive film according to an embodiment of the present invention.
Reference numerals illustrate:
a00, a macromolecule basal membrane;
A21-A2N, coating film layer;
A11-A1N, and a film coating layer.
Detailed Description
Features and exemplary embodiments of various aspects of the invention are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the invention by showing examples of the invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order not to unnecessarily obscure the present invention; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
The embodiment of the invention designs the microstructure morphology of the metallized film, and particularly can obtain the polymer-based conductive film with different comprehensive properties by referring to the film layers with different crystal grains or particle sizes and different grain boundary sliding capacities.
Embodiments of the present invention provide a structure of a conductive film, and have related specific micro-morphology features, which solves one or more of the following technical problems: (1) reducing the probability of hole defects in the film deposition process; (2) The effect of improving the extensibility of the conductive film is achieved through the control of the microstructure morphology of the film; (3) Solves the problem of compactness of the composite film layer, and achieves the aim of improving the compactness of the whole film layer by overlapping the multi-layer films with different microcosmic appearance characteristics.
The embodiment of the invention provides a conductive film and a preparation method thereof, wherein multiple layers of film layers with different particle sizes are formed on two sides of a polymer base film, the mechanical properties of the conductive film are regulated and controlled by regulating the proportion of the film layers with different particle sizes, and the change rate of the resistivity under the condition of regulating and controlling a certain stretching distance is lower while the mechanical properties are ensured.
In short, continuous alternating or discontinuous alternating film layers of composite film layers with different particle sizes are formed on the surfaces of the two sides of the polymer base material, and finally the polymer conductive film with the physical and chemical properties of the target thickness is formed.
As shown in fig. 1, an embodiment of the present invention provides a polymer conductive film, which includes: a polymer-based film a00; and a multilayer film layer formed on both side surfaces of the polymer base film a00, including coating film layers a11, a12, a13, a.and A1N formed in this order on the first side surface of the polymer base film a00, and coating film layers a21, a22, a23, a24, a25, a.and A2N formed in this order on the second side surface of the polymer base film a00, the particle sizes in the multilayer film layers being different. In fig. 1, the film structure is schematically shown as a film structure that can be observed by a Scanning Electron Microscope (SEM) after cutting the interface section of the polymer conductive film.
In some embodiments, the film layers on both sides of the polymer base film a00 are multilayer composite film layers with an asymmetric structure centered on the polymer base film a00; and/or the number of layers of the multilayer film formed on the single-side surface of the polymer base film a00 is less than or equal to 15. The number of the related film layers can be observed through SEM section pictures after polishing and cutting the section of the polymer conductive film. In some embodiments, the number of single sided total film layers may be less than or equal to 12 layers.
In some embodiments, the polymeric conductive film includes any one or more of the following: the thickness of a single-side film layer of the polymer conductive film is 850-1200 nm, the polymer conductive film is a double-sided film coating, and the single-side film layer is one of the film layers; the thickness of a first conductive film layer of the high polymer conductive film is more than or equal to 100nm, a single-sided film layer is the required film thickness obtained after multiple film coating and deposition, and the first film layer refers to a first (first deposited) film layer in the multi-layer film layer; the thickness of the polymer-based film of the polymer conductive film is 3um to 8um. Specifically, the thickness of a first metal film layer with the same composition as that of a main film layer material is larger than or equal to 100nm as observed through SEM section pictures.
In some embodiments, the polymeric conductive film has at least one film layer having a first characteristic, the film layer having the first characteristic has a thickness greater than or equal to 100nm, and the film layer having the first characteristic has particles with a size greater than the other film layers, the average size of the particles of the film layer having the first characteristic being greater than or equal to 80nm.
The average particle size of the film layer in the embodiment of the present invention is measured by a scanning electron microscope or an atomic force microscope.
In some embodiments, the polymeric conductive film has at least one film layer having a second characteristic, the film layer having the second characteristic has a thickness of less than or equal to 100nm, the film layer having the second characteristic has a particle size different from the other film layers, and the film layer having the second characteristic has an average particle size of less than or equal to 50nm.
In some embodiments, the polymer conductive film has a single-sided multilayer film with a total number of films of the first characteristic that is less than the final total number of films on the single side, and the films of the first characteristic may be deposited continuously or discontinuously (i.e., multiple successive passes of film deposition of the films of the first characteristic, or alternatively with films of the second characteristic).
In some embodiments, the film layer having the first characteristic and the film layer having the second characteristic are alternately laminated and/or non-continuously laminated in a single-sided multilayer film layer of the polymeric conductive film to form the desired polymeric conductive film.
In some embodiments, the polymer base film may be selected from PET, PI, etc. or a corresponding modified functional polymer functional film, and the polymer conductive film includes any one or more of the following: the tensile strength of the polymer conductive film is more than or equal to 65% of the polymer-based film performance before film coating (mainly comprising the tensile strength of the polymer-based film); the elongation of the polymer conductive film is more than or equal to 30% of the polymer-based film performance (mainly comprising the tensile strength of the polymer-based film) before film coating; the surface roughness of the macromolecule conductive film is more than or equal to 50nm; the change rate of the sheet resistance of the polymer conductive film under the condition of 3% elongation is less than or equal to 5%; the electrical property of the polymer conductive film is lower than 3.8x10 -8 Omega, m; the defect density of holes of the macromolecule conductive film with the thickness of more than 0.5mm is less than or equal to 0.1 holes per square meter; the adhesion layer with the thickness smaller than 20nm is arranged close to the surface of the polymer base film in the polymer conductive film, and the adhesion layer is an oxide film layer containing at least one element or a plurality of element components of Ti, cr, ni, si and Al. The main film layer component of the polymer conductive film is Al element. The base material of the polymer conductive film includes various basic polymer functional films. According to the embodiment of the invention, a steady-state evaporation technology is adopted, one or more relatively thick Al metal film layers are formed on the surface of the base film, so that the base film has better resistance to hole burning of film materials caused by sputtering of aluminum liquid drops generated in the conventional modes of evaporation boat, wire feeding, electron beam evaporation and the like, the particle size and the microstructure of a formed coating are further adjusted in a coating mode, and a polymer conductive film product formed by the final coating thickness has better grain boundary sliding recovery capability under the condition of certain deformation.
Film-coated product A of polymer conductive film such as common evaporation boat wire-feeding of base film with same specification and the inventionThe polymer conductive film product B in the example was 180MPa in tensile strength, 4.5% in elongation and 0.45/m in hole density 2 The method comprises the steps of carrying out a first treatment on the surface of the The tensile strength of the latter B was 196MPa, the elongation was 28% and the pore density was 0.08/m 2 。
In order to realize a polymer conductive film layer with relatively obvious technical characteristics, particularly a film layer product based on the combination of the prior second-generation machine and first-generation machine film plating mode, the prior film plating mode has the result that the relative granularity of the film layer of the second-generation machine film plating is larger than that of the film layer of the first-generation machine film plating, and the larger granularity is favorable for improving the extensibility.
In order to exert the advantages of the second-generation machine and simultaneously give consideration to the productivity of the first-generation machine, the embodiment of the invention forms a two-to-one process route, and finally organically combines the second-generation machine film coating layer and the first-generation machine film coating layer to form a final expected film layer structure, and the film layer structure has various overlapped structural forms.
The first thickness is formed preferentially on the basis of the positions of the components on the surface of the polymer base film, which are the same as the positions of the main film layer, and a steady-state evaporation film coating mode is adopted, namely a high-temperature resistant container is adopted to contain film materials to be evaporated, and compared with the traditional film coating mode adopting an evaporation boat wire feeding mode, the mode has the advantage of less sputtered aluminum particles.
Therefore, the embodiment of the invention has the advantages that at least one layer of relatively thick film layer without hole defects is formed on the surface of the base film preferentially, and then the subsequent defects of Cheng Kongdong of sputtered aluminum can be restrained by adopting a high-temperature resistant container evaporation mode or an evaporation boat wire feeding evaporation mode on the surface of the film layer.
As shown in fig. 2, an embodiment of the present invention provides a method for preparing a polymer conductive film, which includes:
s110: forming an adhesion layer on the surface of one side or two sides of the polymer base film A00, wherein the adhesion layer is an oxide film layer formed by adopting an evaporation mode or a sputtering coating mode;
as shown in fig. 1, in the present embodiment, there is generally a layer of adhesive layer material between the polymer-based film a00 and the coating film a11, or between the polymer-based film a00 and the coating film a21, and the thickness of the layer is almost negligible compared to the first relatively thick metal-coated film, mainly because the film is too thin.
S120: one or more film layers with first characteristics are deposited on the surface of the polymer base film A00 deposited with the adhesive layer in a steady-state evaporation coating mode;
in this step, only one film layer having the first characteristic may be formed at a time by film plating, or a stack of continuous multilayer films having the first characteristic may be formed by continuous film plating a plurality of times.
S130: and continuously depositing a plurality of film layers with second characteristics on the surface deposited with the film layers with the first characteristics in a way of feeding wires by an evaporation boat or performing electron beam thermal evaporation, wherein the single-layer deposition thickness of the film layers with the second characteristics is smaller than that of the film layers with the first characteristics.
In an alternative embodiment, the film having the first characteristic and the film having the second characteristic may be deposited alternately in a symmetrical or asymmetrical structure of a single-sided film, or may be deposited in a symmetrical or asymmetrical structure of one side and the other side.
The roughness of the conductive film is typically measured using a coarseness meter commonly used in the art of composite current collector fabrication.
The film layer with the first characteristic and the film layer with the second characteristic in the embodiment of the invention are mainly different in density, appearance morphology, particle size and single-side film deposition thickness formed by different film plating modes or film plating process procedures, the film layer with the first characteristic has the tendency of high deposition speed (thicker film layer), large particles and larger surface roughness, and the film layer with the second characteristic has the characteristics of relatively lower deposition speed (thinner film layer), small particles and smaller surface roughness. Further, the process control of the first feature film layer in the embodiment of the present invention can obtain a film layer with fewer hole defects relative to the process control of the second feature film layer, that is, the number of holes deposited one or more times of the film layer of the first feature is significantly smaller than the hole defects deposited the same number of times of the film layer of the second feature as a whole, and the first feature film layer has a greater advantage in depositing the film layer of the same total thickness. In addition, the steady-state evaporation source technology in the embodiment of the invention is different from the traditional film plating mode adopting wire feeding and evaporation boat evaporation, namely the steady-state evaporation source technology adopts metal materials in a heating high-temperature resistant container, so that the metal materials are evaporated under a relatively static condition, unlike the traditional wire feeding evaporation which belongs to a dynamic process at any time, particularly aluminum wires are heated and melted and fall off the surface of the evaporation boat, and the evaporation boat secondarily heats aluminum liquid for evaporation.
In specific implementation, the method shown in fig. 2 specifically includes the following steps:
firstly, an ultrathin adhesive layer is formed on the surface of a polymer-based film A00, and the adhesive layer can be formed into an oxide film layer of at least one element or alloy component of Ti, cr, ni, si and Al with the total thickness of less than 20nm by adopting a multilayer evaporation or sputtering film plating mode, wherein the film plating mode can be a double-sided simultaneous film plating mode or a single-sided film plating mode.
And secondly, continuously depositing one or more thick films on the surface of the polymer base film A00 deposited with the adhesive layer through a steady-state evaporation coating mode, wherein the thickness of the thick films is at least not less than 100nm, namely the film layer with the first characteristic. The film layer having the first characteristic may be deposited one layer at a time or a plurality of layers in succession.
Then, the film layer coated by adopting the evaporation boat wire feeding or electron beam thermal evaporation mode can be continuously deposited on the surface deposited with the film layer with the first characteristic, the single-layer deposition thickness of the film layer is generally smaller than that of the film layer with the first characteristic, and the film layer deposited by adopting the wire feeding mode can be marked as the film layer with the second characteristic.
Further, the film layer with the second characteristic can also be deposited continuously, and the total deposition times can be one layer less than the total film layer thickness, namely, after the adhesion layer is removed, the film layer with the first characteristic is deposited once, namely, the film layer with the second characteristic is deposited completely until the required film layer thickness is formed.
Through the mode, a plurality of different structure deposition superposed film layer structures can be realized.
The embodiment of the invention also provides a lithium ion battery cell, which comprises the polymer conductive film.
The technical scheme of the embodiment of the invention has the advantages that:
the method is based on a novel steady-state film plating mode, the first thickness which is the same as the component elements of the main film layer is deposited on the surface of the base film, so that the phenomenon that the thickness film plating causes more hole burning defects due to aluminum splashing is prevented;
the superposition of the film layers with different particle sizes based on different film plating modes can achieve the high polymer conductive film with excellent mechanical properties and the film layer with higher density. The film layer with more excellent mechanical properties is particularly characterized in that the elongation percentage is obviously improved after the structure is implemented, and the film layer based on the completely small particles is mainly prevented from being well-maintained under higher deformation due to the fact that grain boundary sliding is restrained.
In the description of the present invention, it should be noted that the orientation or positional relationship indicated by "upper, lower, inner and outer", etc. in terms are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first, second, or third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The terms "mounted, connected, and coupled" should be construed broadly in this disclosure unless otherwise specifically indicated and defined, such as: can be fixed connection, detachable connection or integral connection; it may also be a mechanical connection, an electrical connection, or a direct connection, or may be indirectly connected through an intermediate medium, or may be a communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.
Claims (10)
1. A polymeric conductive film comprising:
a polymer base film;
and a plurality of film layers formed on both side surfaces of the polymer-based film, the particle sizes in the plurality of film layers being different.
2. The polymer conductive film according to claim 1, wherein:
the film layers positioned at the two sides of the polymer base film are multilayer composite film layers with asymmetric structures taking the polymer base film as the center; and/or the number of the groups of groups,
the number of layers of the multilayer film formed on the surface of one side of the polymer-based film is less than or equal to 15.
3. The polymeric conductive film of claim 1, comprising any one or more of:
the thickness of the single-side film layer of the macromolecule conductive film is 850nm-1200nm;
the thickness of the first conductive film layer of the macromolecule conductive film is more than or equal to 100nm;
the thickness of the polymer-based film of the polymer conductive film is 3um-8um.
4. The polymer conductive film according to claim 1, wherein:
the polymer conductive film has at least one film layer with a first characteristic, the thickness of the film layer with the first characteristic is greater than or equal to 100nm, the particle size in the film layer with the first characteristic is greater than that of other film layers, and the average size of the particles of the film layer with the first characteristic is greater than or equal to 80nm.
5. The polymer conductive film according to claim 4, wherein:
the polymer conductive film has at least one film layer with a second characteristic, the thickness of the film layer with the second characteristic is less than or equal to 100nm, the particle size in the film layer with the second characteristic is different from other film layers, and the average particle size of the film layer with the second characteristic is less than or equal to 50nm.
6. The polymer conductive film according to claim 4, wherein:
and in the single-side multi-layer film layer of the high-polymer conductive film, the total number of film layers with the first characteristic is lower than the final total number of film coating layers on one side.
7. The polymer conductive film according to claim 5, wherein:
and in the single-side multilayer film layer of the polymer conductive film, the film layer with the first characteristic and the film layer with the second characteristic are alternately overlapped and/or discontinuously overlapped in a continuous mode to form the polymer conductive film.
8. The polymeric conductive film of claim 1, comprising any one or more of:
the tensile strength of the macromolecule conductive film is more than or equal to 65% of the macromolecule based film performance before film coating;
the elongation rate of the macromolecule conductive film is more than or equal to 30% of the macromolecule based film performance before film coating;
the surface roughness of the macromolecule conductive film is more than or equal to 50nm;
the change rate of the sheet resistance of the polymer conductive film under the condition of 3% elongation is less than or equal to 5%;
the electrical property of the polymer conductive film is lower than 3.8x10 -8 Ω.m；
The defect density of holes of the macromolecule conductive film with the thickness of more than 0.5mm is less than or equal to 0.1 holes per square meter;
the adhesion layer with the thickness smaller than 20nm is arranged close to the surface of the polymer base film in the polymer conductive film, and the adhesion layer is an oxide film layer containing at least one element or a plurality of element components of Ti, cr, ni, si and Al.
9. A method for preparing a polymer conductive film, comprising:
forming an adhesion layer on the surface of one side or both sides of the polymer-based film, wherein the adhesion layer is an oxide film layer formed by adopting an evaporation mode or a sputtering coating mode;
one or more layers (film layers with first characteristics are deposited on the surface of the polymer base film deposited with the adhesive layer through a steady-state evaporation coating mode;
and continuously depositing a plurality of film layers with second characteristics on the surface deposited with the film layers with first characteristics by adopting an evaporation boat wire feeding or electron beam thermal evaporation mode, wherein the single-layer deposition thickness of the film layers with second characteristics is smaller than that of the film layers with first characteristics.
10. A lithium ion battery cell, wherein the lithium ion battery cell comprises the polymer conductive film according to any one of claims 1 to 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310890306.8A CN116884671A (en) | 2023-07-19 | 2023-07-19 | Polymer conductive film, preparation method and lithium ion battery core |
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| CN202310890306.8A CN116884671A (en) | 2023-07-19 | 2023-07-19 | Polymer conductive film, preparation method and lithium ion battery core |
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