CN116879586A - Coaxial high-speed interface device for semiconductor test - Google Patents
Coaxial high-speed interface device for semiconductor test Download PDFInfo
- Publication number
- CN116879586A CN116879586A CN202310941932.5A CN202310941932A CN116879586A CN 116879586 A CN116879586 A CN 116879586A CN 202310941932 A CN202310941932 A CN 202310941932A CN 116879586 A CN116879586 A CN 116879586A
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- interface device
- speed interface
- coaxial
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- 238000012360 testing method Methods 0.000 title claims abstract description 61
- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 abstract description 14
- 238000013461 design Methods 0.000 abstract description 10
- 238000001514 detection method Methods 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 description 6
- 230000002035 prolonged effect Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005381 potential energy Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a coaxial high-speed interface device for semiconductor testing, comprising: the base is made of metal and is suitable for conducting connection with a test main board for semiconductor test through a first coaxial cable; the signal end is made of metal, is arranged on the base and is in insulating connection with the base through an insulating piece; the signal end is suitable for being in conductive connection with the test main board through a second coaxial cable; the grounding end is made of metal, is arranged on the base and is in conductive connection with the base; the grounding end is suitable for being connected with the base in a conductive mode and then connected with the test main board conductive plate through the first coaxial cable. The coaxial high-speed interface device for semiconductor test provided by the invention can avoid signal crosstalk in a high-speed transmission environment by improving the connection design of the signal end, the grounding end and the test main board, and realize a high-precision and high-reliability chip detection function.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a coaxial high-speed interface device for semiconductor testing.
Background
After the integrated circuit chip is produced, the integrated circuit chip needs to be tested to detect and process the unqualified chip.
At present, an interface device of a chip detection device comprises a plurality of signal ends and a plurality of grounding ends, wherein the signal ends and the grounding ends are arranged at intervals, and each signal end and/or each grounding end is connected with the chip detection device through a cable. The traditional interface design can meet the transmission and processing of low-speed digital signals, but for the transmission of analog signals and high-speed digital signals with higher signal quality requirements, the design of a plurality of signal transmission cables is extremely easy to generate signal crosstalk, the chip detection result is interfered, and the reliability of the chip detection equipment is affected.
Accordingly, there is a need to provide an improved coaxial high speed interface device for semiconductor testing that addresses the above-described problems.
Disclosure of Invention
The invention aims to provide a coaxial high-speed interface device for semiconductor test, which can avoid signal crosstalk under a high-speed transmission environment, especially when the transmission frequency is in the range of 100Mbps-200Mbps by improving the connection design of a signal end, a grounding end and a test main board, thereby realizing a high-precision and high-reliability chip detection function.
The embodiment of the invention provides a coaxial high-speed interface device for semiconductor test, which comprises:
the base is made of metal and is suitable for conducting connection with a test main board for semiconductor test through a first coaxial cable;
the signal end is made of metal, is arranged on the base and is in insulating connection with the base through an insulating piece; the signal end is suitable for being in conductive connection with the test main board through a second coaxial cable;
the grounding end is made of metal, is arranged on the base and is in conductive connection with the base; the grounding end is suitable for being connected with the base in a conductive mode and then connected with the test main board conductive plate through the first coaxial cable.
Optionally, the signal end is a signal spring pin; the base is provided with a first slot; one end of the signal spring needle is axially inserted into the first slot and connected with the second coaxial cable; the other end of the signal spring needle is arranged outside the first slot; the insulating piece is circumferentially sleeved outside the signal spring needle, and insulates the outer wall of the signal spring needle and the inner wall of the first slot in the radial direction.
Optionally, the insulating member is a collar, and the collar is made of a low dielectric constant material; the lantern ring is sleeved outside the signal spring needle and coincides with the axis of the signal spring needle.
Optionally, the grounding end is a grounding spring pin; the base is provided with a second slot; one end of the grounding spring needle is axially inserted into the second slot and is in conductive connection with the base; the other end of the grounding spring pin is arranged outside the second slot.
Optionally, the grounding spring is sleeved outside the grounding spring needle along the circumferential direction, and is radially arranged between the outer wall of the grounding spring needle and the inner wall of the second slot; the drum spring is adapted to radially abut the ground spring pin.
Optionally, the impedance of the signal terminal and the ground terminal is 50Ω.
Optionally, the diameter of the signal spring pin is the same as the diameter of the inner conductor of the second coaxial cable.
Optionally, the outer diameter of the insulator is the same as the outer diameter of the insulating envelope of the second coaxial cable.
Optionally, the diameter of the grounding spring pin is the same as the diameter of the inner conductor of the first coaxial cable.
Compared with the prior art, the technical scheme of the embodiment of the invention has at least the following beneficial effects:
the coaxial high-speed interface device for semiconductor test provided by the invention adopts the base made of metal, so that the grounding ends and the base are connected in a conductive way, a plurality of grounding ends and the base form a grounding whole, and the design that the grounding whole can be connected with a test main board only through one first coaxial cable is realized, thereby avoiding the generation of signal crosstalk under a high-speed transmission environment, especially when the transmission frequency is in the range of 100Mbps-200Mbps, and realizing the chip detection function with high precision and high reliability. The signal ends are insulated from the base made of metal materials by the aid of the insulating piece, so that mutual insulation between the signal ends and the grounding ends is guaranteed, impedance matching is achieved, the signal ends are connected with the test main board through the second coaxial cable, the probability of signal crosstalk is further reduced, and testing precision and reliability are improved.
Further, through setting up the drum spring between earth spring needle and base, the outer wall of drum spring is laminated with the inner wall of the second slot of base, and when the one end of earth spring needle is along the axial in inserting the second slot of base, radially extrudees the drum spring to make drum spring compression set, through the elastic potential energy that compression set's drum spring produced, ensure the outer wall of earth spring needle of radial butt throughout to the inner wall of drum spring, thereby realize reliable contact between earth spring needle and the base, the conductive connection reliability between earth spring needle and the base improves greatly.
Further, the connection of the signal end, the grounding end and the test main board is realized through the coaxial cable, compared with the traditional multi-cable connection scheme, the signal crosstalk is effectively avoided, the interface material cost can be saved, the loss is reduced, and the service life is prolonged.
Further, the signal spring needle and the grounding spring needle are arranged in the first slot and the second slot of the base in a pluggable manner, so that the replacement is convenient, the whole service life of the interface device is further prolonged, and the economic benefit is improved.
Drawings
FIG. 1 is a schematic diagram of a coaxial high-speed interface device for semiconductor testing in accordance with an embodiment of the present invention;
FIG. 2 is a schematic diagram of a partial structure of a coaxial high-speed interface device for semiconductor testing in accordance with an embodiment of the present invention;
fig. 3 is a schematic diagram of another partial structure of a coaxial high-speed interface device for semiconductor testing in accordance with an embodiment of the present invention.
Detailed Description
In order to make the objects, features and advantageous effects of the present invention more comprehensible, embodiments accompanied with figures are described in detail below. It is to be understood that the following detailed description is merely illustrative of the invention, and not restrictive of the invention. Moreover, the use of the same, similar reference numbers in the figures may indicate the same, similar elements in different embodiments, and descriptions of the same, similar elements in different embodiments, as well as descriptions of prior art elements, features, effects, etc. may be omitted.
As shown in the specification and claims, unless otherwise indicated herein or apparent from the context, all numbers provided herein are modified by the term "about," which is to be understood as being within the normal tolerance of the art. "about" is to be understood as the stated value allows for a tolerance of 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0.5%, 0.1%, 0.05%, or 0.01% of the value thereof, etc. The axial direction, the radial direction and the circumferential direction in the embodiment of the invention respectively represent the axial direction, the radial direction and the circumferential direction of the signal spring needle.
FIG. 1 is a schematic diagram of a coaxial high-speed interface device for semiconductor testing in accordance with an embodiment of the present invention; FIG. 2 is a schematic diagram of a partial structure of a coaxial high-speed interface device for semiconductor testing in accordance with an embodiment of the present invention; fig. 3 is a schematic diagram of another partial structure of a coaxial high-speed interface device for semiconductor testing in accordance with an embodiment of the present invention.
Referring to fig. 1 to 3, an embodiment of the present invention provides a coaxial high-speed interface device for semiconductor testing, which avoids signal crosstalk in a high-speed transmission environment, especially in a transmission frequency range of 100Mbps to 200Mbps, by improving connection designs of a signal end, a ground end and a test motherboard, and realizes a high-precision and high-reliability chip detection function.
The coaxial high-speed interface device for semiconductor test provided by the embodiment of the invention comprises:
a base 10, the base 10 being made of metal and being adapted to be electrically connected to a test motherboard 3 for semiconductor testing by a first coaxial cable 22;
the signal end 11 is made of metal, is arranged on the base 10 and is in insulating connection with the base 10 through an insulating piece 12; the signal terminal 11 is adapted to be electrically connected to the test motherboard 3 via a second coaxial cable 21;
the grounding end 13 is made of metal, is arranged on the base 10 and is electrically connected with the base 10; the ground terminal 13 is adapted to be electrically connected to the base 10 and then electrically connected to the test board 3 via a first coaxial cable 22.
The base made of metal is adopted, the grounding ends 13 are connected with the base 10 in a conductive manner, so that a plurality of grounding ends 13 and the base 10 form a grounding whole, the design that the grounding whole can be connected with the test main board 3 only through one first coaxial cable 22 is realized, signal crosstalk caused by transmission signals of a plurality of cables under a high-speed transmission environment, particularly when the transmission frequency is in the range of 100Mbps-200Mbps, is avoided, and the chip detection function with high precision and high reliability is realized.
The signal ends 11 are insulated from the base 10 made of metal by additionally arranging the insulating piece 12 so as to ensure that the signal ends are mutually insulated from the grounding end, thereby meeting the impedance matching, and the design that a plurality of signal ends 11 are connected with the test main board 3 through one second coaxial cable 21 further reduces the possibility of signal crosstalk and improves the test precision and reliability.
In one embodiment of the present invention, the ground terminal 13 is electrically connected to the ground pad 30 of the test motherboard 3 through the inner conductor 222 of the first coaxial cable 22.
In one embodiment of the present invention, the signal terminal 11 is electrically connected to the signal pad 31 of the test motherboard 3 through the inner conductor 212 of the second coaxial cable 21.
In one embodiment of the present invention, the signal terminal 11 is a signal spring pin; the base 10 is provided with a first slot 101; one end of the signal spring pin is axially inserted into the first slot 101 and connected with the second coaxial cable 21; the other end of the signal spring pin is arranged outside the first slot 101; the insulating member 12 is circumferentially sleeved outside the signal spring pin, and insulates the outer wall of the signal spring pin from the inner wall of the first slot 101 in the radial direction.
In an embodiment, the insulating member 12 is a collar made of a low dielectric constant material; the lantern ring is sleeved outside the signal spring needle and is overlapped with the axis of the signal spring needle, and the lantern ring and the signal spring needle can be connected in a clearance fit mode.
In one embodiment of the present invention, the grounding terminal 13 is a grounding spring pin; the base 10 is provided with a second slot 102; one end of the grounding spring pin is axially inserted into the second slot 102 and is electrically connected with the base 10; the other end of the grounding spring pin is disposed outside the second slot 102.
In an embodiment of the present invention, the coaxial high-speed interface device for semiconductor testing further includes a drum spring 14, wherein the drum spring 14 is circumferentially sleeved outside the grounding spring pin, and is radially disposed between the outer wall of the grounding spring pin and the inner wall of the second slot 102; the drum spring 14 is adapted to radially abut the ground spring pin.
For example, when the dielectric constant of the insulator 12 is 1.08, the outer diameter D of the insulator 12 is 3mm, and the diameter D of the signal spring pin 1 And diameter d of grounding spring pin 2 At 1.25mm, the calculated impedance of the signal and ground terminals is 50Ω.
In one embodiment of the invention, the diameter d of the signal spring pin 1 The same diameter as the inner conductor 212 of the second coaxial cable 21.
In one embodiment of the present invention, the outer diameter of the insulator 12 is the same as the outer diameter of the insulating envelope 211 of the second coaxial cable 21.
In one embodiment of the invention, the diameter d of the ground spring pin 2 The same diameter as the inner conductor 222 of the first coaxial cable 22.
In one embodiment of the present invention, the outer diameter of the insulating envelope 221 of the first coaxial cable 22 is the same as the outer diameter of the insulating envelope 211 of the second coaxial cable 21.
The coaxial high-speed interface device for semiconductor test provided by the embodiment of the invention adopts the base 10 made of metal, so that the grounding ends 13 are electrically connected with the base 10, and a plurality of grounding ends 13 and the base 10 form a grounding whole, so that the design that the grounding whole can be connected with the test main board 3 through only one first coaxial cable 22 is realized, the generation of signal crosstalk under a high-speed transmission environment, particularly when the transmission frequency is in the range of 100Mbps-200Mbps, is avoided, and the chip detection function with high precision and high reliability is realized. The signal ends 11 are insulated from the base 10 made of metal by additionally arranging the insulating piece 12 so as to ensure that the signal ends 11 are mutually insulated from the grounding end 13, thereby meeting the impedance matching, further reducing the possibility of signal crosstalk and improving the testing precision and reliability by the design that a plurality of signal ends 11 are connected with the testing main board 3 through one second coaxial cable 21.
Further, by arranging the drum spring 14 between the grounding spring pin and the base 10, the outer wall of the drum spring 14 is attached to the inner wall of the second slot 102 of the base 10, and when one end of the grounding spring pin is axially inserted into the second slot 102 of the base 10, the drum spring 14 is radially pressed, so that the drum spring 14 is compressively deformed, and the inner wall of the drum spring 14 is always radially abutted against the outer wall of the grounding spring pin through elastic potential energy generated by the compressively deformed drum spring 14, so that reliable contact between the grounding spring pin and the base 10 is realized, namely, the reliability of conductive connection between the grounding spring pin and the base 10 is greatly improved.
Further, the connection of the signal end, the grounding end and the test main board is realized through the coaxial cable, compared with the traditional multi-cable connection scheme, the signal crosstalk is effectively avoided, the interface material cost can be saved, the loss is reduced, and the service life is prolonged.
Further, the signal spring needle and the grounding spring needle are arranged in the first slot and the second slot of the base in a pluggable manner, so that the replacement is convenient, the whole service life of the interface device is further prolonged, and the economic benefit is improved.
Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the disclosure, even where only a single embodiment is described with respect to a particular feature. The characteristic examples provided in the present disclosure are intended to be illustrative, not limiting, unless stated differently. In practice, the features of one or more of the dependent claims may be combined with the features of the independent claims where technically possible, according to the actual needs, and the features from the respective independent claims may be combined in any appropriate way, not merely by the specific combinations enumerated in the claims.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (9)
1. A coaxial high speed interface device for semiconductor testing, comprising:
the base is made of metal and is suitable for conducting connection with a test main board for semiconductor test through a first coaxial cable;
the signal end is made of metal, is arranged on the base and is in insulating connection with the base through an insulating piece; the signal end is suitable for being in conductive connection with the test main board through a second coaxial cable;
the grounding end is made of metal, is arranged on the base and is in conductive connection with the base; the grounding end is suitable for being connected with the base in a conductive mode and then connected with the test main board conductive plate through the first coaxial cable.
2. The coaxial high-speed interface device for semiconductor testing of claim 1, wherein the signal terminal is a signal spring pin; the base is provided with a first slot; one end of the signal spring needle is axially inserted into the first slot and connected with the second coaxial cable; the other end of the signal spring needle is arranged outside the first slot; the insulating piece is circumferentially sleeved outside the signal spring needle, and insulates the outer wall of the signal spring needle and the inner wall of the first slot in the radial direction.
3. The coaxial high-speed interface device for semiconductor testing of claim 2, wherein the insulator is a collar, the collar being of a low dielectric constant material; the lantern ring is sleeved outside the signal spring needle and coincides with the axis of the signal spring needle.
4. The coaxial high-speed interface device for semiconductor testing of claim 1, wherein the ground terminal is a ground spring pin; the base is provided with a second slot; one end of the grounding spring needle is axially inserted into the second slot and is in conductive connection with the base; the other end of the grounding spring pin is arranged outside the second slot.
5. The coaxial high-speed interface device for semiconductor testing of claim 4, further comprising a drum spring circumferentially sleeved outside the ground spring pin and radially disposed between an outer wall of the ground spring pin and an inner wall of the second socket; the drum spring is adapted to radially abut the ground spring pin.
6. The coaxial high-speed interface device for semiconductor testing of claim 5, wherein the impedance of the signal terminal and the ground terminal is 50Ω.
7. The coaxial high-speed interface device for semiconductor testing of claim 2, wherein the diameter of the signal spring pin is the same as the diameter of the inner conductor of the second coaxial cable.
8. The coaxial high-speed interface device for semiconductor testing of claim 7, wherein an outer diameter of the insulator is the same as an outer diameter of an insulating envelope of the second coaxial cable.
9. The coaxial high-speed interface device for semiconductor testing of claim 4, wherein the diameter of the ground spring pin is the same as the diameter of the inner conductor of the first coaxial cable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310941932.5A CN116879586A (en) | 2023-07-28 | 2023-07-28 | Coaxial high-speed interface device for semiconductor test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310941932.5A CN116879586A (en) | 2023-07-28 | 2023-07-28 | Coaxial high-speed interface device for semiconductor test |
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| Publication Number | Publication Date |
|---|---|
| CN116879586A true CN116879586A (en) | 2023-10-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310941932.5A Pending CN116879586A (en) | 2023-07-28 | 2023-07-28 | Coaxial high-speed interface device for semiconductor test |
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| CN (1) | CN116879586A (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2409647Y (en) * | 1999-12-16 | 2000-12-06 | 富士康(昆山)电脑接插件有限公司 | Cable connector |
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| KR20080109475A (en) * | 2007-06-13 | 2008-12-17 | 주식회사이은 | Inter-connector for semiconductor test |
| KR100985500B1 (en) * | 2009-08-17 | 2010-10-26 | 리노공업주식회사 | Test socket |
| CN102197469A (en) * | 2008-09-08 | 2011-09-21 | 3M创新有限公司 | Probe block assembly |
| CN202720246U (en) * | 2012-05-30 | 2013-02-06 | 济南无线电十厂有限责任公司 | Electric connector for testing |
| CN203340416U (en) * | 2013-05-16 | 2013-12-11 | 中兴通讯股份有限公司 | Printed circuit board and terminal |
| CN208128636U (en) * | 2018-04-12 | 2018-11-20 | 维沃移动通信有限公司 | A kind of pcb board and terminal |
| KR20190105985A (en) * | 2018-03-07 | 2019-09-18 | 주식회사 오킨스전자 | Test Socket Of Semiconductor Device |
| CN112003086A (en) * | 2020-08-21 | 2020-11-27 | 胜达克半导体科技(上海)有限公司 | High-speed signal transmission cable |
| CN216085417U (en) * | 2021-09-29 | 2022-03-18 | 惠州市万物互联科技有限公司 | Storage battery connector, connecting wire and storage battery |
| CN115053406A (en) * | 2020-02-05 | 2022-09-13 | 株式会社Isc | Connector for electrical connection |
| CN218445806U (en) * | 2022-10-08 | 2023-02-03 | 深圳市景尚科技有限公司 | Semiconductor test equipment based on wire needle transmission mode |
-
2023
- 2023-07-28 CN CN202310941932.5A patent/CN116879586A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2409647Y (en) * | 1999-12-16 | 2000-12-06 | 富士康(昆山)电脑接插件有限公司 | Cable connector |
| KR20080109477A (en) * | 2007-06-13 | 2008-12-17 | 주식회사이은 | Inter-connecting structure for semiconductor test and semiconductor tester using the same |
| KR20080109475A (en) * | 2007-06-13 | 2008-12-17 | 주식회사이은 | Inter-connector for semiconductor test |
| CN102197469A (en) * | 2008-09-08 | 2011-09-21 | 3M创新有限公司 | Probe block assembly |
| KR100985500B1 (en) * | 2009-08-17 | 2010-10-26 | 리노공업주식회사 | Test socket |
| CN202720246U (en) * | 2012-05-30 | 2013-02-06 | 济南无线电十厂有限责任公司 | Electric connector for testing |
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| KR20190105985A (en) * | 2018-03-07 | 2019-09-18 | 주식회사 오킨스전자 | Test Socket Of Semiconductor Device |
| CN208128636U (en) * | 2018-04-12 | 2018-11-20 | 维沃移动通信有限公司 | A kind of pcb board and terminal |
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| CN216085417U (en) * | 2021-09-29 | 2022-03-18 | 惠州市万物互联科技有限公司 | Storage battery connector, connecting wire and storage battery |
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