CN116868069B - 用于半导体装置晶片的改进计量的系统及方法 - Google Patents

用于半导体装置晶片的改进计量的系统及方法 Download PDF

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Publication number
CN116868069B
CN116868069B CN202180094001.5A CN202180094001A CN116868069B CN 116868069 B CN116868069 B CN 116868069B CN 202180094001 A CN202180094001 A CN 202180094001A CN 116868069 B CN116868069 B CN 116868069B
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measurement
orientation
site
quality parameter
sdw
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Chinese (zh)
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CN116868069A (zh
Inventor
L·叶鲁舍米
D·内格里
O·巴沙尔
Y·西蒙
A·玛纳森
N·本大卫
Y·于齐耶尔
E·拉维特
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KLA Corp
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KLA Tencor Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
CN202180094001.5A 2021-04-22 2021-10-01 用于半导体装置晶片的改进计量的系统及方法 Active CN116868069B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163177966P 2021-04-22 2021-04-22
US63/177,966 2021-04-22
US17/469,280 US12131959B2 (en) 2021-04-22 2021-09-08 Systems and methods for improved metrology for semiconductor device wafers
US17/469,280 2021-09-08
PCT/US2021/053051 WO2022225549A1 (en) 2021-04-22 2021-10-01 Systems and methods for improved metrology for semiconductor device wafers

Publications (2)

Publication Number Publication Date
CN116868069A CN116868069A (zh) 2023-10-10
CN116868069B true CN116868069B (zh) 2024-09-06

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CN202180094001.5A Active CN116868069B (zh) 2021-04-22 2021-10-01 用于半导体装置晶片的改进计量的系统及方法

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US (1) US12131959B2 (enExample)
JP (1) JP7580627B2 (enExample)
KR (1) KR102901219B1 (enExample)
CN (1) CN116868069B (enExample)
TW (1) TWI865831B (enExample)
WO (1) WO2022225549A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12165930B2 (en) 2021-06-03 2024-12-10 Kla Corporation Adaptive modeling misregistration measurement system and method

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JP3609896B2 (ja) * 1996-04-16 2005-01-12 株式会社ルネサステクノロジ 重ね合わせ測定誤差補正方法
US6678038B2 (en) 2001-08-03 2004-01-13 Nikon Corporation Apparatus and methods for detecting tool-induced shift in microlithography apparatus
US7804994B2 (en) 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
EP1570232B1 (en) 2002-12-05 2016-11-02 KLA-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7608468B1 (en) 2003-07-02 2009-10-27 Kla-Tencor Technologies, Corp. Apparatus and methods for determining overlay and uses of same
US7656518B2 (en) 2007-03-30 2010-02-02 Asml Netherlands B.V. Method of measuring asymmetry in a scatterometer, a method of measuring an overlay error in a substrate and a metrology apparatus
DE102007033345B4 (de) * 2007-07-16 2009-07-16 Vistec Semiconductor Systems Gmbh Verfahren zur Korrektur von Abbildungsfehlern einer Messoptik einer Koordinaten-Messmaschine
WO2010069757A1 (en) 2008-12-16 2010-06-24 Asml Netherlands B.V. Calibration method, inspection method and apparatus, lithographic apparatus, and lithographic processing cell
US9927718B2 (en) 2010-08-03 2018-03-27 Kla-Tencor Corporation Multi-layer overlay metrology target and complimentary overlay metrology measurement systems
US8843875B2 (en) * 2012-05-08 2014-09-23 Kla-Tencor Corporation Measurement model optimization based on parameter variations across a wafer
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WO2015196168A1 (en) 2014-06-21 2015-12-23 Kla-Tencor Corporation Compound imaging metrology targets
KR102253565B1 (ko) * 2017-10-22 2021-05-18 케이엘에이 코포레이션 이미징 오버레이 계측에서 오버레이 오정렬 오차 평가치의 이용
WO2020106784A1 (en) * 2018-11-21 2020-05-28 Kla Corporation Process optimization using design of experiments and response surface models
EP3931865A4 (en) * 2019-02-14 2023-02-15 KLA Corporation SYSTEM AND METHOD FOR MEASUREMENT OF MISREGISTRATION OF SEMICONDUCTOR DEVICE WAFERS USING INDUCED TOPOGRAPHY
JP7317131B2 (ja) 2019-02-15 2023-07-28 ケーエルエー コーポレイション 結合された光および電子ビーム技術を使用する位置ずれ測定
CN113519047B (zh) 2019-03-25 2026-01-09 科磊股份有限公司 用于平整化弯曲半导体晶片的真空压紧设备
CN113924638B (zh) * 2019-03-28 2025-03-18 科磊股份有限公司 用于测量及校正半导体装置中的层之间的偏移的方法及用于其中的偏移目标
CN113950644B (zh) * 2019-06-20 2026-03-27 科磊股份有限公司 多工具参数集校准及偏移测量系统及方法
JP7542561B2 (ja) * 2019-06-25 2024-08-30 ケーエルエー コーポレイション 位置ずれの測定およびその改善のための関心領域の選択
US11182892B2 (en) 2019-09-16 2021-11-23 Kla Corporation Periodic semiconductor device misregistration metrology system and method

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
JP4314082B2 (ja) * 2003-08-19 2009-08-12 キヤノン株式会社 アライメント方法
CN103377963A (zh) * 2012-04-27 2013-10-30 台湾积体电路制造股份有限公司 用于叠加度量的工具所致移位减少量的确定

Also Published As

Publication number Publication date
WO2022225549A1 (en) 2022-10-27
KR102901219B1 (ko) 2025-12-16
KR20230174215A (ko) 2023-12-27
JP2024517055A (ja) 2024-04-19
TW202245090A (zh) 2022-11-16
JP7580627B2 (ja) 2024-11-11
US12131959B2 (en) 2024-10-29
TWI865831B (zh) 2024-12-11
US20220344218A1 (en) 2022-10-27
CN116868069A (zh) 2023-10-10

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