CN116864472A - Lead frame and packaging structure comprising same - Google Patents

Lead frame and packaging structure comprising same Download PDF

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Publication number
CN116864472A
CN116864472A CN202310877267.8A CN202310877267A CN116864472A CN 116864472 A CN116864472 A CN 116864472A CN 202310877267 A CN202310877267 A CN 202310877267A CN 116864472 A CN116864472 A CN 116864472A
Authority
CN
China
Prior art keywords
frame
base island
lead
bending section
frame body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310877267.8A
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Chinese (zh)
Inventor
高学
柴展
罗杰馨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Gongcheng Semiconductor Technology Co Ltd
Original Assignee
Shanghai Gongcheng Semiconductor Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Gongcheng Semiconductor Technology Co Ltd filed Critical Shanghai Gongcheng Semiconductor Technology Co Ltd
Priority to CN202310877267.8A priority Critical patent/CN116864472A/en
Publication of CN116864472A publication Critical patent/CN116864472A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

The utility model provides a lead frame and a packaging structure, wherein the lead frame comprises a frame body and a lead part, the frame body is erected above a base island and surrounds the periphery of a chip, at least part of projection of the frame body is overlapped with the base island, and the lead part extends from the frame body to the base island side and exceeds the base island. The lead frame is extended above the base island, so that the lead frame is prolonged, the number of leads can be greatly expanded by the prolonged lead frame, that is, the number of leads can be greatly increased on the chip, and the conduction internal resistance of the chip is reduced.

Description

Lead frame and packaging structure comprising same
Technical Field
The present utility model relates to the field of semiconductor integrated circuit manufacturing technology, and in particular, to a semiconductor device package structure.
Background
Chip packaging, which is a technology for packaging integrated circuits with insulating plastic or ceramic materials, not only plays roles of placing, fixing, sealing, protecting chips and enhancing heat conduction performance, but also is a bridge for communicating the world inside the chips with external circuits, and a lead frame is used as a chip carrier of a semiconductor integrated circuit and is a key structural member for realizing electrical connection between a lead-out end of the internal circuit of the chip and an external lead by means of bonding materials (gold, aluminum and copper), wherein in general, as shown in fig. 1 and 2, a traditional old pin 1, such as a Source pin a, is positioned on the side edge of a base island 2 and does not coincide with the base island, and Gate pins and Drain pins are arranged side by side, the frame area of the Source pin a is limited, and the design requirements of more lead expansion cannot be met, so that the internal resistance of the pins is difficult to optimize.
The patent of application number 2022229323398 proposes a TO-263 base island pin structure. According to the utility model, the length dimension of the connection structure of the Gate pin and the island main body is reduced, and the length dimension of the connection structure of the Source pin is increased, so that the Source pin has enough area for aluminum wire bonding, the number of aluminum wires is increased, the density of the aluminum wires is improved, the internal resistance of the Source pin is effectively reduced, the energy consumption is reduced, and the requirement of further improving the performance of a finished product is met.
However, since the space on the side of the island is limited, although the increase in the area of the Source foot is obtained by sacrificing the size of the Gate foot, the frame of the Source foot is still limited to a smaller space, the increase in the area of the Source foot is limited, and the effects of increasing the number of aluminum wires and reducing the internal resistance of the package are not obvious.
Accordingly, it is necessary to provide a lead frame to effectively solve the above-mentioned problems.
Disclosure of Invention
The utility model provides a lead frame and a packaging structure comprising the same.
The embodiment of the utility model provides a lead frame, which comprises a frame main body and lead parts, wherein the frame main body is erected above a base island and surrounds the periphery of a chip, at least part of projection of the frame main body is overlapped with the base island, and the lead parts extend from the frame main body to one side of the base island and exceed the base island.
In some examples, the frame body is connected to the base island by an insulating column.
The frame body is a part of the lead frame extending above the base island, and the insulation column is provided with supporting points for the extending lead frame, so that the stability of the lead frame is ensured, and the quality of the packaging structure is further enhanced.
In some examples, the lead portion has a first bending structure thereon, the first bending structure being connected to the frame body.
The lead part is required to be connected with the lead, on one hand, the strength of the lead frame is enhanced by the first bending structure, on the other hand, the area of the lead part of the lead frame is increased by the bending structure, more leads can be expanded, and the internal resistance of the lead is optimized.
In some examples, the first bending structure comprises a first bending section, a second bending section, a third bending section, a fourth bending section, and a fifth bending section connected in sequence;
the first bending section is parallel to the plane where the base island is located; the second bending section extends to the direction of the base island and extends from the upper side of the base island to the upper surface of the base island; the third bending section is parallel or coplanar with the plane where the base island is located; the fourth bending section extends to the direction of the base island and extends to the upper side of the base island; the fifth bending section is parallel to the plane where the base island is located; the frame body is connected with the fifth bending section.
The tail end of the fifth bending section in the first bending structure is positioned above the base island, and is exactly consistent with the orientation of the frame main body in the lead frame, so that the connection with the frame main body is facilitated.
The first bending structure is in a downward groove shape, so that the thickness of the packaging structure is not increased.
In some examples, the frame body extends along the edge of the base island, a chip is fixedly arranged in the middle of the upper surface of the base island, and the frame body surrounds the periphery of the chip and does not interfere with the chip.
In some examples, the frame body includes frame units, one of which is disposed on each side of the chip, and adjacent ones of which are electrically connected.
In some examples, the frame unit is provided on one or two or three consecutive sides of the chip.
The leads are led out from the chip, and the frame units in the lead frame are in one-to-one correspondence with the side surfaces of the chip, so that the connection of the leads is facilitated; depending on the number of leads, the frame elements may be arranged consecutively on adjacent sides of the chip, with electrical conduction between adjacent frame elements.
In some examples, lap joints between adjacent ones of the frame units; or, adjacent frame units are integrally formed.
In some examples, the frame body is provided with a second bending structure. The area of the lead frame is further increased, and the structural strength of the lead frame is improved.
In some examples, the leadframe is a source electrode leadframe.
The utility model also provides a packaging structure comprising the lead frame.
Compared with the prior art, the technical scheme of the embodiment of the utility model has the following beneficial effects:
the lead frame is extended above the base island, so that the lead frame is prolonged, the number of leads can be greatly expanded by the prolonged lead frame, that is, the number of leads can be greatly increased on the chip, and the conduction internal resistance of the chip is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the prior art, a brief description of the drawings is provided below, wherein it is apparent that the drawings in the following description are some, but not all, embodiments of the present utility model. Other figures may be derived from these figures without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a schematic top view of a leadframe according to the prior art;
FIG. 2 is a schematic side view of a leadframe according to the prior art;
fig. 3 is a schematic side view of a lead frame according to an embodiment of the present utility model;
fig. 4 is a schematic view of a lead frame according to an embodiment of the present utility model;
fig. 5 is a schematic view of a lead frame according to another embodiment of the present utility model.
Fig. 6 is a schematic view of a lead frame according to another embodiment of the present utility model.
In the figure: a. source electrode pin, 1. Old frame pin, 2, base island, 3, pin part, 31, first bending section, 32, second bending section, 33, third bending section, 34, fourth bending section, 35, fifth bending section, 4, frame main body, 41, frame unit, 5, insulating column, 6, chip, 7, and lead.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The technical scheme of the utility model is described in detail below by specific examples. The following embodiments may be combined with each other, and some embodiments may not be repeated for the same or similar concepts or processes.
As shown in fig. 3 and 4, the utility model discloses a lead frame, which comprises a frame body 4 and a pin part 3, wherein the frame body 4 is erected above a base island 2, a chip is arranged in the middle of the upper surface of the base island 2, the chip 6 does not completely cover the upper surface of the base island 2, the edge of the base island 2 exceeds the periphery of the chip 6, and the frame body 4 is arranged on the part of the base island 2 exceeding the periphery of the chip 6. The frame body 4 is an extension of the lead frame above the islands, greatly increasing the area on the lead frame to which the leads 7 can be attached.
In this embodiment, the orthographic projection of the frame body 4 in the direction of the island 2 is coincident with the island 2, and in other embodiments, the projection of the frame body 4 may partially overlap with the island 2, which is also within the scope of the present utility model.
The frame main body 4 is arranged on the edge of the base island 2 which is not covered by the chip 6, the projection of the frame main body 4 on the base island 2 accounts for 8-12% of the area of the base island 2, the duty ratio on the base island 2 is not large, the arrangement of the chip 6 is not affected, and the size of the packaging structure is not greatly affected. If the projection area is large, the large occupied area of the frame is indicated, and the chip loading of the large chip (the large chip cannot be mounted on the base island) is affected; if the projected area is too small, meaning that the frame is small, it may not be able to withstand wire bonding or thick and sufficient wire bonding, and thus the purpose of reducing the internal resistance of conduction is not achieved, and therefore, it is preferable that the projection of the frame body 4 on the island 2 occupies 10% of the area of the island 2.
With continued reference to fig. 3, the lead portion 3 extends from the frame body 4 toward the island 2 side and beyond the island 2. The chip package is typically 3 pins, and in general, the Source pin is located on the side of the base island, and the Gate pin and the Drain pin are arranged side by side. In this embodiment, the lead portion is a Source lead, and the lead frame is a Source electrode lead frame. In other embodiments, the pin portion 3 may be other pins, which is within the scope of the present utility model.
In some examples, with continued reference to fig. 3 and 4, the frame body 4 is connected to the base island 2 via insulating posts 5 to support an elongated lead frame for improved structural stability.
In the frame body 4 of the above example, the insulating columns 5 may be disposed at the corners of the frame body 4, or other positions that need to be supported, and the number of the insulating columns 5 may be increased or decreased according to circumstances, which is within the scope of the present utility model.
With continued reference to fig. 4-6, the frame body 4 includes frame elements 41, one frame element 41 being disposed on each side of the chip 6 to facilitate easy routing of the leads 7 from the chip 7 to the lead frame. Adjacent frame units 41 are interconnected and electrically conductive.
Specifically, the chip 6 is provided with frame units on one or two or three consecutive sides. As shown in fig. 4 and 6, the chip 6 is provided with frame units on three sides, and as shown in fig. 5, two sides of the chip are provided with frame units.
In the present embodiment, the adjacent frame units 41 are lap-jointed; in other examples, it is within the scope of the present utility model to have adjacent frame units 41 integrally formed therewith.
In some examples, with continued reference to fig. 3, the lead portion 3 has a first bending structure thereon, the first bending structure being connected to the frame body 4. The lead part 3 is required to be connected with a lead, and the first bending structure is designed, so that on one hand, the strength of the lead frame is enhanced, on the other hand, the bending structure increases the area of the lead part of the lead frame, more leads can be expanded, and further the internal resistance of the lead is optimized.
The first bending structure comprises a first bending section 31, a second bending section 32, a third bending section 33, a fourth bending section 34 and a fifth bending section 35 which are sequentially connected.
Wherein, the first bending section 31 is parallel to the plane of the base island 2; the second bending section 32 extends to the direction of the base island 2 and extends from the upper side of the base island 2 to the upper surface of the base island 2; the third bending section 33 is parallel to or coplanar with the plane of the base island 2; the fourth bending section 34 extends to the direction of the base island 2 and extends to the upper side of the base island 2; the fifth bending section 35 is parallel to the plane of the base island 2; the frame body 4 is connected to the fifth bending section 35.
The tail end of the fifth bending section 35 in the first bending structure is positioned above the base island 2 and just coincides with the orientation of the frame body 4 in the lead frame, so that the lead part 3 is conveniently connected with the frame body 4.
The first bending structure is in a downward groove shape, so that the thickness of the packaging structure is not increased.
The frame body 4 is provided with a second bending structure (not shown in the drawings). The area of the lead frame is further increased, the number of the bearable leads is expanded, and the structural strength of the lead frame is also improved.
As shown in fig. 4 and 6, the present utility model further provides a package structure, including the lead frame in any one of the foregoing embodiments. Such packages as VDMOS, trench MOS, SGT, super Junction MOS, IGBT, etc. are commonly available for power devices.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.

Claims (10)

1. The lead frame is characterized by comprising a frame body and lead parts, wherein the frame body is erected above a base island and surrounds the periphery of a chip, at least part of projection of the frame body is overlapped with the base island, and the lead parts extend from the frame body to the base island side and exceed the base island.
2. The lead frame of claim 1, wherein the frame body is connected to the island by an insulating post.
3. The leadframe of claim 1, wherein the lead portion has a first bending structure thereon, the first bending structure being connected to the frame body.
4. The lead frame according to claim 3, wherein the first bending structure comprises a first bending section, a second bending section, a third bending section, a fourth bending section, and a fifth bending section connected in sequence;
the first bending section is parallel to the plane where the base island is located; the second bending section extends to the direction of the base island and extends from the upper side of the base island to the upper surface of the base island; the third bending section is parallel or coplanar with the plane where the base island is located; the fourth bending section extends to the direction of the base island and extends to the upper side of the base island; the fifth bending section is parallel to the plane where the base island is located; the frame body is connected with the fifth bending section.
5. The leadframe of claim 1, wherein the projection of the frame body onto the island is 8-12% of the island area.
6. The lead frame according to claim 1, wherein the frame body includes frame units, one of which is disposed correspondingly to one side of the chip, and electrical conduction is provided between adjacent ones of the frame units.
7. The leadframe according to claim 6, characterized in that one or two or three consecutive sides of the chip are provided with the frame unit.
8. The lead frame of claim 6, wherein adjacent ones of said frame cells are lap-connected; or, adjacent frame units are integrally formed.
9. The lead frame according to claim 1, wherein the frame body is provided with a second bending structure; alternatively, the leadframe is a source electrode leadframe.
10. A package structure comprising the lead frame according to any one of claims 1 to 9.
CN202310877267.8A 2023-07-17 2023-07-17 Lead frame and packaging structure comprising same Pending CN116864472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310877267.8A CN116864472A (en) 2023-07-17 2023-07-17 Lead frame and packaging structure comprising same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310877267.8A CN116864472A (en) 2023-07-17 2023-07-17 Lead frame and packaging structure comprising same

Publications (1)

Publication Number Publication Date
CN116864472A true CN116864472A (en) 2023-10-10

Family

ID=88232001

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310877267.8A Pending CN116864472A (en) 2023-07-17 2023-07-17 Lead frame and packaging structure comprising same

Country Status (1)

Country Link
CN (1) CN116864472A (en)

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