CN116847693A - Manufacturing method and equipment of flexible AMOLED display screen and packaging layer - Google Patents

Manufacturing method and equipment of flexible AMOLED display screen and packaging layer Download PDF

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Publication number
CN116847693A
CN116847693A CN202310977081.XA CN202310977081A CN116847693A CN 116847693 A CN116847693 A CN 116847693A CN 202310977081 A CN202310977081 A CN 202310977081A CN 116847693 A CN116847693 A CN 116847693A
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CN
China
Prior art keywords
panel
film layer
glass substrate
ijp
hole area
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Pending
Application number
CN202310977081.XA
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Chinese (zh)
Inventor
请求不公布姓名
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Semiconductor Integrated Display Technology Co Ltd
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Semiconductor Integrated Display Technology Co Ltd
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Application filed by Semiconductor Integrated Display Technology Co Ltd filed Critical Semiconductor Integrated Display Technology Co Ltd
Priority to CN202310977081.XA priority Critical patent/CN116847693A/en
Publication of CN116847693A publication Critical patent/CN116847693A/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application discloses a manufacturing method, manufacturing equipment and a packaging layer of a flexible AMOLED display screen, wherein the manufacturing method comprises the following steps: packaging a glass substrate with a hole area Panel (Panel); filling the hole area of each Panel (Panel) on the packaged glass substrate; the PI film layer is peeled off from the glass substrate, and then a dicing process is performed to cut off the filler material in the hole region of each Panel (Panel). When the method is used, the problems that in the production and manufacturing process of the flexible AMOLED in the prior art, when a PI film layer is stripped, inward shrinkage stress is generated on each Panel (Panel), and as the hole area is not filled with IJP, the stress cannot be relieved, and the film layer is bulged, cracked or even falls off (the hole area is generally called as crack) due to overlarge stress are solved.

Description

Manufacturing method and equipment of flexible AMOLED display screen and packaging layer
Technical Field
The application relates to the technical field of AMOLED screen processing, in particular to a manufacturing method, manufacturing equipment and a packaging layer of a flexible AMOLED display screen.
Background
In the flexible AMOLED (Active-matrix organic light-emitting diode) manufacturing industry, one process is an Ink Jet Printing process (IJP). The basic principle of the process is as follows: in the atmosphere of a nitrogen chamber, organic Ink (Ink) is uniformly sprayed (Print) on a Panel (Panel) of a glass substrate through a spray opening (Jet), then allowed to flow and finally cured. To this end, the inkjet printing process is complete.
In the conventional perforated screen, when the PI film is peeled from the glass substrate during the production process (laser peeling+mechanical peeling), the hole area is not covered with IJP (the reason is that if the hole area is covered with IJP, the hole area is covered with the IJP, and then the CVD (Chemical Vapor Deposition, chemical vapor deposition) film layer is performed, so that the packaging film layer is damaged during the module segment handle Kong Qiediao, and the hole area packaging fails). When the PI film layer is stripped, each Panel (Panel) can generate inward shrinkage stress, because the hole area is not filled with IJP, the stress cannot be relieved, the film layer at the position is bulged and cracked or even falls off (the hole area is collectively referred to as cracking) due to overlarge stress, and the phenomenon can cause air to enter into the screen along the cracked part of the film layer in actual production, so that an evaporation device is damaged to fail, and the whole Panel (Panel) is scrapped.
Therefore, the application provides a manufacturing method, manufacturing equipment and a manufacturing method of a flexible AMOLED display screen, which can prevent the phenomenon of hole area cracking and reduce the problems of product scrapping and yield reduction caused by the phenomenon, in the using and processing process, and the manufacturing method of a packaging layer is a problem to be solved in the application.
Disclosure of Invention
Aiming at the technical problems, the application aims to solve the problems that in the production and manufacturing process of the flexible AMOLED in the prior art, when a PI film layer is stripped, each Panel (Panel) can generate inward shrinkage stress, because a hole area is not filled with IJP, the stress can not be relieved, the film layer is bulged, cracked or even fall off (the hole area crack is generally called herein), the phenomenon can cause air to enter into the screen along the cracked part of the film layer in actual production, the evaporation device is damaged to lose efficacy, and then the whole Panel (Panel) is scrapped, so that the manufacturing method, the manufacturing equipment and the packaging layer of the flexible AMOLED display screen can prevent the problem of 'hole area crack' in the use and processing process, and reduce the product scrapping and yield reduction caused by the stress.
In order to achieve the above object, the present application provides a method for manufacturing a flexible AMOLED display screen, the method comprising:
packaging a glass substrate with a hole area Panel (Panel);
filling the hole area of each Panel (Panel) on the packaged glass substrate;
the PI film layer is peeled off from the glass substrate, and then a dicing process is performed to cut off the filler material in the hole region of each Panel (Panel).
Preferably, before the packaging of the glass substrate with the Panel (Panel), the manufacturing method further includes:
coating PI glue on a glass substrate, and then drying to form a PI film layer;
manufacturing a plurality of metal wires and metal blocks on the PI film layer to form an anode layer;
a light emitting layer and a cathode layer are sequentially deposited on the anode layer.
Preferably, after the PI film layer is peeled off from the glass substrate and then a cutting process is performed to cut off the filling material in each hole region, the manufacturing method further includes:
respectively assembling a circuit board, a polaroid and a cover plate on a Panel (Panel) on the glass substrate after the cutting process;
and detecting the manufactured flexible AMOLED display screen.
Preferably, the filling the hole area of each Panel (Panel) on the packaged glass substrate comprises the following steps:
IJP printing is performed on Kong Oufen of each Panel (Panel) on the glass substrate;
the printed material of each hole area is cured to form a second IJP film layer such that each hole area is filled separately.
Preferably, the packaging of the glass substrate with the aperture area Panel (Panel) comprises the following steps:
depositing on the cathode layer of the whole glass substrate to form a first CVD film layer;
performing IJP printing on a region other than the hole region on the first CVD film layer of the entire glass substrate to form a first IJP film layer;
a second CVD film layer is deposited over the first IJP film layer of the entire glass substrate.
The application also provides a manufacturing device of the flexible AMOLED display screen, which comprises:
a packaging unit for packaging a glass substrate having a Panel (Panel) with a hole area;
a filling unit for filling the hole area of each Panel (Panel) on the packaged glass substrate;
the stripping unit is used for stripping the PI film layer from the glass substrate;
and the cutting unit is used for carrying out a cutting process on the display component with the PI film layer peeled off so as to cut off the filling material in the hole area of each Panel (Panel).
Preferably, the filling unit is an IJP device for individually performing IJP printing on Kong Oufen of each Panel (Panel) on the glass substrate.
The application also provides an encapsulation layer of the flexible AMOLED display screen, which comprises: a first CVD film layer, a second CVD film layer, a first IJP film layer, and a second IJP film layer; wherein,,
the first CVD film layer is deposited on the cathode layer of the whole glass substrate, the first IJP film layer is printed on the first CVD film layer, the concave area corresponding to the hole area of each Panel (Panel) is removed, and the second CVD film layer is deposited on the first IJP film layer of the whole glass substrate and the concave area corresponding to the hole area of each Panel (Panel); the second IJP film layer is printed in the concave area corresponding to the hole area of each Panel (Panel) to fill all the concave areas corresponding to the hole areas.
According to the technical scheme, the manufacturing method, the manufacturing equipment and the packaging layer of the flexible AMOLED display screen have the beneficial effects that: after packaging the processed glass substrate, the concave area of the hole area of each Panel (Panel) is filled independently, so that the inward shrinkage stress generated in the area of the hole area of each Panel (Panel) can be supported at the moment that the subsequent PI film layer is peeled off, so that the problem that the film layer is raised, cracked or even falls off (collectively referred to as hole area crack) due to overlarge stress is prevented, and the yield of products is effectively improved.
Additional features and advantages of the application will be set forth in the detailed description which follows; and none of the applications are related to the same or are capable of being practiced in the prior art.
Drawings
The accompanying drawings are included to provide a further understanding of the application, and are incorporated in and constitute a part of this specification, illustrate the application and together with the description serve to explain, without limitation, the application. In the drawings:
FIG. 1 is a flow chart of a method of fabricating a flexible AMOLED display screen provided in a preferred embodiment of the present application;
FIG. 2 is a second flowchart of a method for fabricating a flexible AMOLED display screen provided in a preferred embodiment of the present application;
FIG. 3 is a flow chart of filling the hole area of each Panel (Panel) on the packaged glass substrate provided in a preferred embodiment of the present application;
FIG. 4 is a block diagram of a fabrication apparatus for a flexible AMOLED display screen provided in a preferred embodiment of the present application;
fig. 5 is a schematic structural view of an encapsulation layer of a flexible AMOLED display screen provided in a preferred embodiment of the present application.
Description of the reference numerals
1 packaging Unit 2 filling Unit
3 stripping unit 4 cutting unit
5 first CVD film layer 6 second CVD film layer
7 second IJP film layer 8 first IJP film layer
9 glass substrate 10PI film layer
Detailed Description
The following describes specific embodiments of the present application in detail with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the application, are not intended to limit the application.
As shown in fig. 1, the present application provides a method for manufacturing a flexible AMOLED display screen, where the method includes:
step S101, packaging a glass substrate with a hole area Panel (Panel);
step S102, filling the hole area of each Panel (Panel) on the packaged glass substrate;
step S103, peeling the PI film layer from the glass substrate, and then performing a cutting process to cut off the filling material in the hole area of each Panel (Panel).
In the above scheme, when the manufacturing method is used, after the processed glass substrate is packaged, the concave area of the hole area of each Panel (Panel) is filled independently, so that the inward shrinkage stress generated in the area of the hole area of each Panel (Panel) can be supported at the moment that the subsequent PI film layer is peeled off, so that the problem that the film layer at the position bulges, cracks or even falls off (collectively referred to as hole area cracks) due to overlarge stress is prevented, and the yield of products is effectively improved;
the method not only can ensure the problem of influence on the film layer caused by the hole area structure when peeling the PI film layer, but also can not damage the packaged packaging layer, thereby improving the yield of products.
As shown in fig. 2, the present application provides a method for manufacturing a flexible AMOLED display screen, which includes:
step S201, coating PI glue on a glass substrate, and then drying to form a PI film layer;
step S202, manufacturing a plurality of metal wires and metal blocks on a PI film layer to form an anode layer;
step S203, sequentially depositing a light emitting layer and a cathode layer on the anode layer.
Step S204, packaging a glass substrate with a Panel (Panel) with a hole area;
step S205, filling the hole area of each Panel (Panel) on the packaged glass substrate;
step S206, peeling the PI film layer from the glass substrate, and then performing a cutting process to cut off the filling material in the hole area of each Panel (Panel);
step S207, respectively assembling a circuit board, a polaroid and a cover plate on a Panel (Panel) of the glass substrate after the cutting process;
and step S208, detecting the manufactured flexible AMOLED display screen.
In the above scheme, the steps S201 to S203 are performed to manufacture the PI film layer, the anode layer, the light emitting layer and the cathode layer, after the above structure is manufactured, the packaging operation is performed on the PI film layer, and after the packaging is completed, the hole area of each Panel (Panel) is filled, so as to prevent the film layer from being damaged by the stress effect when the PI film is peeled off.
As shown in fig. 3, step S102 provided in the present application fills the hole area of each Panel (Panel) on the packaged glass substrate, including the following steps:
step S1021, performing IJP printing on Kong Oufen of each Panel (Panel) on the glass substrate;
in step S1022, the printed material of each hole area is cured to form a second IJP film layer, so that each hole area is filled up respectively.
In the above scheme, the IJP equipment is utilized to print the concave area corresponding to the hole area of each Panel (Panel) separately, and then the printed material is solidified, so that a second IJP film layer is formed, which fills each hole area, and the stress generated by the hole area can be buffered during the subsequent PI film stripping operation, so that the film layer can be protected, the problem that the film layer bulges and cracks or even falls off due to overlarge stress (the hole area crack is collectively called herein), and then after stripping is completed, the second IJP film layer in the hole area is precisely cut, and the whole packaging film layer is not destroyed during the cutting operation, so that the packaging effectiveness of the hole area is ensured.
In a preferred embodiment of the present application, the encapsulation of the glass substrate having the aperture Panel (Panel) includes the steps of:
depositing on the cathode layer of the whole glass substrate to form a first CVD film layer;
performing IJP printing on a region other than the hole region on the first CVD film layer of the entire glass substrate to form a first IJP film layer;
a second CVD film layer is deposited over the first IJP film layer of the entire glass substrate.
In the above-mentioned scheme, the encapsulation is performed by sandwiching a first IJP film layer between two CVD film layers, and the two CVD film layers are all deposited over the whole glass substrate, while the first IJP film layer is printed and covered on the portion other than Kong Ouou, which is to prevent the portion of the first IJP film layer in the hole area from affecting the normal encapsulation effect, even if the first IJP film layer is covered here, the first IJP film layer needs to be cut off in the subsequent processing.
As shown in fig. 4, the present application provides a fabrication apparatus of a flexible AMOLED display screen, the fabrication apparatus comprising:
a packaging unit 1 for packaging a glass substrate having a Panel (Panel) of a hole area;
a filling unit 2 for filling the hole area of each Panel (Panel) on the packaged glass substrate;
a peeling unit 3 for peeling the PI film layer from the glass substrate;
a cutting unit 4 for performing a cutting process on the display assembly from which the PI film layer is peeled off, so as to cut off the filler material in the hole area of each Panel (Panel);
in the above scheme, after the processed glass substrate is packaged by the filling unit 2, the concave area of the hole area of each Panel (Panel) is filled independently, so that the inward shrinkage stress generated in the area of the hole area of each Panel (Panel) can be supported at the moment that the subsequent PI film layer is peeled off, so that the problem that the film layer at the position bulges, cracks or even falls off (collectively referred to as hole area cracks) due to overlarge stress is prevented, and the yield of products is effectively improved.
In a preferred embodiment of the present application, the filling unit is an IJP device for individually performing IJP printing on Kong Oufen of each Panel (Panel) on the glass substrate.
As shown in fig. 5, the present application further provides an encapsulation layer of the flexible AMOLED display screen, the encapsulation layer comprising: a first CVD film layer 5, a second CVD film layer 6, a second IJP film layer 7, and a first IJP film layer 8; wherein,,
the first CVD film layer 5 is deposited on the cathode layer of the whole glass substrate, the first IJP film layer 8 is printed on the first CVD film layer 5 except for the area corresponding to the hole area of each Panel (Panel), and the second CVD film layer 6 is deposited on the first IJP film layer 8 of the whole glass substrate and the concave area corresponding to the hole area of each Panel (Panel); the second IJP film layer is printed in the concave area corresponding to the hole area of each Panel (Panel) to fill all the concave areas corresponding to the hole areas.
In summary, when the manufacturing method, the manufacturing equipment and the packaging layer of the flexible AMOLED display screen are used, the IJP hole filling mode is adopted, and after the thin film packaging process, IJP printing and curing are carried out at the hole area of each panel, so that the hole area is filled. The method can stop the hole area crack through experiments and trial production verification. The product rejection and yield reduction resulting therefrom are reduced.
The preferred embodiments of the present application have been described in detail above with reference to the accompanying drawings, but the present application is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present application within the scope of the technical concept of the present application, and all the simple modifications belong to the protection scope of the present application.
In addition, the specific features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations are not described further.
Moreover, any combination of the various embodiments of the application can be made without departing from the spirit of the application, which should also be considered as disclosed herein.

Claims (8)

1. The manufacturing method of the flexible AMOLED display screen is characterized by comprising the following steps of:
packaging a glass substrate with a hole area Panel (Panel);
filling the hole area of each Panel (Panel) on the packaged glass substrate;
the PI film layer is peeled off from the glass substrate, and then a dicing process is performed to cut off the filler material in the hole region of each Panel (Panel).
2. The method of manufacturing a flexible AMOLED display of claim 1, wherein prior to encapsulating the glass substrate having the aperture Panel (Panel), the method further comprises:
coating PI glue on a glass substrate, and then drying to form a PI film layer;
manufacturing a plurality of metal wires and metal blocks on the PI film layer to form an anode layer;
a light emitting layer and a cathode layer are sequentially deposited on the anode layer.
3. The method of manufacturing a flexible AMOLED display according to claim 2, wherein after the PI film layer is peeled off from the glass substrate and then subjected to a cutting process to cut the filling material in each hole region, the method further comprises:
respectively assembling a circuit board, a polaroid and a cover plate on a Panel (Panel) of the glass substrate after the cutting process;
and detecting the manufactured flexible AMOLED display screen.
4. The method of manufacturing a flexible AMOLED display of claim 1, wherein the filling the hole area of each Panel (Panel) on the encapsulated glass substrate comprises the steps of:
IJP printing is performed on Kong Oufen of each Panel (Panel) on the glass substrate;
the printed material of each hole area is cured to form a second IJP film layer such that each hole area is filled separately.
5. The method of manufacturing a flexible AMOLED display of claim 2, wherein the encapsulating the glass substrate with the aperture Panel (Panel) comprises the steps of:
depositing on the cathode layer of the whole glass substrate to form a first CVD film layer;
performing IJP printing on a region other than the hole region on the first CVD film layer of the entire glass substrate to form a first IJP film layer;
a second CVD film layer is deposited over the first IJP film layer of the entire glass substrate.
6. A fabrication apparatus for a flexible AMOLED display screen according to any of claims 1-5, characterized in that the fabrication apparatus comprises:
a packaging unit for packaging a glass substrate having a Panel (Panel) with a hole area;
a filling unit for filling the hole area of each Panel (Panel) on the packaged glass substrate;
the stripping unit is used for stripping the PI film layer from the glass substrate;
and the cutting unit is used for carrying out a cutting process on the display component with the PI film layer peeled off so as to cut off the filling material in the hole area of each Panel (Panel).
7. The apparatus for manufacturing a flexible AMOLED display screen according to claim 6, wherein the filling unit is an IJP device for performing IJP printing on Kong Oufen of each Panel (Panel) on the glass substrate.
8. An encapsulation layer for a flexible AMOLED display according to any of claims 1-5, wherein the encapsulation layer comprises: a first CVD film layer, a second CVD film layer, a first IJP film layer, and a second IJP film layer; wherein,,
the first CVD film layer is deposited on the cathode layer of the whole glass substrate, the first IJP film layer is printed on the first CVD film layer, the concave area corresponding to the hole area of each Panel (Panel) is removed, and the second CVD film layer is deposited on the first IJP film layer of the whole glass substrate and the concave area corresponding to the hole area of each Panel (Panel); the second IJP film layer is printed in the concave area corresponding to the hole area of each Panel (Panel) to fill all the concave areas corresponding to the hole areas.
CN202310977081.XA 2023-08-03 2023-08-03 Manufacturing method and equipment of flexible AMOLED display screen and packaging layer Pending CN116847693A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310977081.XA CN116847693A (en) 2023-08-03 2023-08-03 Manufacturing method and equipment of flexible AMOLED display screen and packaging layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310977081.XA CN116847693A (en) 2023-08-03 2023-08-03 Manufacturing method and equipment of flexible AMOLED display screen and packaging layer

Publications (1)

Publication Number Publication Date
CN116847693A true CN116847693A (en) 2023-10-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN116847693A (en)

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