CN116841128A

CN116841128A - Chip photoetching device

Info

Publication number: CN116841128A
Application number: CN202310671360.3A
Authority: CN
Inventors: 陈超; 涂先勤; 蔡自立; 汪益立; 零萍; 敦士军; 唐战备
Original assignee: Zhongshan Aiscent Technologies Co ltd
Current assignee: Zhongshan Aiscent Technologies Co ltd
Priority date: 2023-06-07
Filing date: 2023-06-07
Publication date: 2023-10-03

Abstract

The invention discloses a chip photoetching device, which comprises: the device comprises a machine table, a displacement platform, a photoetching mechanism and a turnover mechanism; the displacement platform is arranged on the machine table, a jig disc for bearing the circuit board is arranged on the displacement platform, and two sides of the jig disc are provided with hollowed-out photoetching positions; the photoetching mechanism is arranged on the machine table and is used for carrying out photoetching operation on photoetching positions on the jig plate; the turnover mechanism is arranged on the machine table, the displacement platform can drive the jig disc to move close to or far away from the turnover mechanism, the turnover mechanism comprises at least two wheel trucks capable of driving the jig disc to move, and the turnover mechanism is used for driving each wheel truck to turn over in sequence and move close to or far away from the displacement platform in sequence. Under the continuous operation of the turnover mechanism, the jig plates on each wheel rotating frame can orderly and sequentially turn over and go to the photoetching mechanism one by one to carry out photoetching operation, so that the turnover process in the photoetching operation can be more orderly and efficiently carried out.

Description

Chip photoetching device

Technical Field

The invention relates to the field of photoetching treatment, in particular to a chip photoetching device.

Background

It is known that single-sided digital photolithography systems typically require at least two exposures of a first side and a second side during the manufacturing process of the chip, and a flip operation after the exposure of the first side, the exposure of the second side. Therefore, the substrate needs to be flipped multiple times during the exposure. However, the conventional substrate flipping operation generally has problems of low efficiency and inaccurate alignment.

Disclosure of Invention

The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a chip photoetching device which can more efficiently and accurately perform overturning operation.

According to an embodiment of the first aspect of the present invention, a chip lithography apparatus includes: the device comprises a machine table, a displacement platform, a photoetching mechanism and a turnover mechanism; the displacement platform is arranged on the machine table, a jig disc for bearing the circuit board is arranged on the displacement platform, and two sides of the jig disc are provided with hollowed-out photoetching positions; the photoetching mechanism is arranged on the machine table and is used for carrying out photoetching operation on photoetching positions on the jig plate; the turnover mechanism is arranged on the machine table, the displacement platform can drive the jig disc to move to be close to or far away from the turnover mechanism, the turnover mechanism comprises at least two wheel trucks capable of driving the jig disc to move, and the turnover mechanism is used for driving the wheel trucks to turn over in sequence and move to be close to or far away from the displacement platform in sequence.

The chip photoetching device provided by the embodiment of the invention has at least the following beneficial effects: after the photoetching mechanism performs photoetching treatment on one surface of the circuit board on the jig disc through the hollowed-out photoetching position on the jig disc, the displacement platform can drive the jig disc to move away from the photoetching mechanism, and the jig disc is conveyed to the wheel rotating frame. The turning mechanism will then be able to turn the wheel truck. Under the duration of the process, each wheel rotating frame is provided with a jig disc. Therefore, under the continuous operation of the turnover mechanism, the jig plates on each wheel rotating frame can orderly turn over in sequence and go to the photoetching mechanism one by one to carry out photoetching operation, so that the turnover process in the photoetching operation can be more orderly and accurately carried out, and the effect of turning over a plurality of jig plates in a lump can be realized through the turning over of each wheel rotating frame in a lump, and the effect of improving the turning over efficiency can be further effectively achieved.

According to some embodiments of the invention, the lithography mechanism and the turnover mechanism are respectively located at two sides of the displacement platform, and the displacement platform is used for driving the jig disc to reciprocate between the lithography mechanism and the turnover mechanism.

According to some embodiments of the invention, the displacement platform comprises a first motor and a screw nut pair, wherein the first motor is connected with a displacement seat through the screw nut pair; the displacement seat is provided with a fixed clamping jaw, and the jig disc is arranged in the fixed clamping jaw.

According to some embodiments of the invention, the lithography mechanism comprises a mounting frame arranged on the machine table, wherein the mounting frame is connected with an adjusting assembly, and the adjusting assembly is connected with a spatial light modulator and can drive the spatial light modulator to move relative to the mounting frame.

According to some embodiments of the invention, the adjusting assembly comprises a first cylinder, a second cylinder and a third cylinder, wherein the orientations of the first cylinder, the second cylinder and the third cylinder are different from each other and are sequentially connected; the third cylinder is connected with a connecting frame, and the spatial light modulator is arranged at the connecting frame.

According to some embodiments of the invention, the mounting frame is located above the displacement platform, one of the first cylinder, the second cylinder and the third cylinder points to the lower side of the mounting frame, and the displacement platform drives the jig tray to displace along the horizontal direction.

According to some embodiments of the invention, the turnover mechanism comprises a chassis arranged on the machine table, the chassis is provided with a connecting arm and a driving device, the driving device is connected with the connecting arm and can drive the connecting arm to turn over, and each wheel rotating frame is installed on the connecting arm.

According to some embodiments of the invention, the wheel turret is provided with a suction cup set and is capable of sucking the jig disc through the suction cup set.

According to some embodiments of the invention, the machine has a material taking position, and the lithography mechanism and the material taking position are respectively located at two sides of the connecting arm; the driving device is connected to the middle part of the connecting arm; the wheel rotating frames are two and are respectively connected to two ends of the connecting arm.

According to some embodiments of the invention, a second motor is connected to an end of the connecting arm, said second motor being connected to the wheel truck and being able to drive it to turn over with respect to the connecting arm.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic diagram of a chip lithography apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a lithographic mechanism of the chip lithographic apparatus shown in FIG. 1;

FIG. 3 is a schematic diagram of a displacement stage of the chip lithography apparatus shown in FIG. 1;

FIG. 4 is a schematic diagram of a flipping mechanism of the chip lithography apparatus shown in FIG. 1;

FIG. 5 is a schematic diagram of a connection arm of the chip lithography apparatus shown in FIG. 1.

Reference numerals: a machine 100; a pick-up level 150; a displacement platform 200; a first motor 210; a belt 220; a lead screw nut pair 230; a displacement seat 240; a stationary jaw 250; a turnover mechanism 300; a chassis 310; a connecting arm 320; a rotation shaft 330; a second motor 340; a wheel turret 350; a driving device 360; a jig tray 400; a lithography mechanism 500; a mounting rack 510; a connection frame 520; an adjustment assembly 530; a first cylinder 531; a second cylinder 532; a third cylinder 533; a spatial light modulator 550;

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.

In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.

In the description of the present invention, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

Referring to fig. 1, a chip lithography apparatus includes: a machine 100, a displacement platform 200, a lithography mechanism 500 and a tilting mechanism 300; the displacement platform 200 is arranged on the machine 100, the displacement platform 200 is provided with a jig disc 400 for bearing a circuit board, and two sides of the jig disc 400 are provided with hollowed-out photoetching positions; the lithography mechanism 500 is disposed on the machine 100, and the lithography mechanism 500 is used for performing lithography operation on the lithography position on the jig tray 400; the turnover mechanism 300 is disposed on the machine 100, the displacement platform 200 can drive the jig tray 400 to move close to or far away from the turnover mechanism 300, the turnover mechanism 300 comprises at least two wheel turnframes 350 capable of driving the jig tray 400 to move, and the turnover mechanism 300 is used for driving each wheel turnframe 350 to turn over in sequence and move close to or far away from the displacement platform 200 in sequence. After the lithography mechanism 500 performs lithography processing on one surface of the circuit board on the jig tray 400 through the hollowed-out lithography position on the jig tray 400, the displacement platform 200 can drive the jig tray 400 to move away from the lithography mechanism 500, and enable the jig tray 400 to be conveyed to the wheel turning frame 350. Subsequently, the flipping mechanism 300 will be able to flip the wheel truck 350. For the duration of this process, each turret 350 carries a jig tray 400. Therefore, under the continuous operation of the turning mechanism 300, the jig plates 400 on each wheel turret 350 can be turned orderly and sequentially and go to the photolithography mechanism 500 one by one to perform photolithography operation, so that the turning process in photolithography operation can be performed more orderly and accurately, and the turning effect on the plurality of jig plates 400 can be achieved through the turning of each wheel turret 350, and the effect of improving the turning efficiency can be further effectively achieved.

Specifically, the jig tray 400 is a hollow frame, and the substrate is fixed by the edge of the frame. When the jig tray 400 is turned over, both sides of the jig tray can perform photolithography operation through the hollow portions thereof.

In some embodiments, referring to fig. 1, the lithography mechanism 500 and the tilting mechanism 300 are respectively located at two sides of the displacement platform 200, and the displacement platform 200 is used to drive the jig tray 400 to reciprocate between the lithography mechanism 500 and the tilting mechanism 300. Since each turret 350 will be constantly turned over, the photolithography and turning operations will be performed simultaneously. The positional relationship between the photolithography mechanism 500 and the tilting mechanism 300 prevents the photolithography operation and the tilting operation from interfering with each other during operation, thereby effectively ensuring that the photolithography operation and the tilting operation can be smoothly operated at the same time, and further improving the overall processing efficiency.

In certain embodiments, referring to fig. 3, the displacement platform 200 includes a first motor 210 and a lead screw nut pair 230, the first motor 210 being coupled to a displacement seat 240 through the lead screw nut pair 230; the displacement seat 240 is provided with a fixed clamping jaw 250, and the jig tray 400 is installed in the fixed clamping jaw 250. After the first motor 210 is started, the lead screw nut pair 230 is driven to move, so that the displacement seat 240 can be driven to displace by the lead screw nut pair 230, and the effect of directly and effectively driving the jig plate 400 on the displacement seat 240 to displace can be achieved. The fixing clamping jaw 250 can effectively achieve the clamping and fixing or loosening effects on the jig tray 400, so that the jig tray 400 can be conveniently displaced or carried away by the wheel turning frame 350, and the jig tray 400 can be conveniently turned over.

Specifically, the first motor 210 and the screw nut pair 230 are provided with a driving belt 220 and are connected through the driving belt 220, so that the position layout and the rotation speed can be adjusted between the two, and the displacement seat 240 can drive the jig plate 400 to move more stably.

Further, the fixed jaw 250 is a cylinder jaw. Of course, the fixed clamping jaw 250 may also be composed of other components, and the specific embodiment may be correspondingly adjusted according to actual needs, which is not limited herein.

In some embodiments, referring to FIG. 2, the lithographic mechanism 500 includes a mounting frame 510 disposed on the stage 100, the mounting frame 510 being coupled to an adjustment assembly 530, the adjustment assembly 530 being coupled to the spatial light modulator 550 and capable of displacing it relative to the mounting frame 510. The mounting frame 510 may mount the spatial light modulator 550 near the displacement stage 200, and further position-adjust the spatial light modulator 550 through the adjusting component 530, so as to effectively ensure that the laser light transmitted by the spatial light modulator 550 can perform photolithography on the substrate more accurately.

Specifically, the mounting frame 510 extends to above the displacement stage 200 and loads the spatial light modulator 550 above the displacement stage 200, thereby achieving a position adjustment effect by lifting.

In certain embodiments, referring to fig. 2, the adjustment assembly 530 includes a first cylinder 531, a second cylinder 532, and a third cylinder 533, oriented differently from each other and connected in sequence; the third cylinder 533 is connected to the connection frame 520, and the spatial light modulator 550 is disposed at the connection frame 520. The first air cylinder 531, the second air cylinder 532 and the third air cylinder 533 which are different in two-to-two directions can respectively drive the connecting frame 520 from different dimension directions, so that the connecting frame 520 can be displaced to any direction of a three-dimensional space under the action of the first air cylinder 531, the second air cylinder 532 and the third air cylinder 533, and further the effects of accurately positioning and carrying out photoetching operation can be effectively achieved.

Specifically, the first, second, and third cylinders 531, 532, and 533 are disposed in the left-right, front-rear, and up-down directions, respectively.

In some embodiments, referring to fig. 2, the mounting frame 510 is located above the displacement platform 200, and one of the first air cylinder 531, the second air cylinder 532, and the third air cylinder 533 is directed below itself, and the displacement platform 200 moves the jig tray 400 in the horizontal direction. The connection frame 520 moves up and down to approach or separate from the displacement platform 200, and the displacement platform 200 drives the jig tray 400 from the horizontal direction. Therefore, the photolithography operation and the displacement operation of the displacement platform 200 can be more effectively prevented from interfering with each other, thereby ensuring that both operations can be performed smoothly.

In some embodiments, referring to fig. 4, the turning mechanism 300 includes a chassis 310 disposed on the machine 100, where the chassis 310 is provided with a connection arm 320 and a driving device 360, and the driving device 360 is connected to the connection arm 320 and can drive the connection arm 320 to turn, and each wheel turret 350 is mounted on the connection arm 320. After the driving device 360 is started, the connecting arm 320 is driven to turn over, so that the wheel turning frames 350 mounted on the connecting arm 320 can follow the connecting arm to turn over together, thereby smoothly achieving the effect of turning over the wheel turning frames 350 together and improving the efficiency of turning over operation.

Specifically, the chassis 310 is provided with a rotating shaft 330, and the driving device 360 is a motor and is connected with the rotating shaft 330; the middle part of the connecting arm 320 is sleeved on the periphery of the rotating shaft 330, and the wheel rotating frames 350 are two and respectively connected with the two ends of the connecting arm 320. Of course, the number and distribution of the wheel trucks 350 is not exclusive, and individuals may be, without limitation, present.

In some embodiments, referring to fig. 4, a suction cup set is provided on the wheel turret 350 and a jig tray 400 can be sucked by the suction cup set. After the sucker group is started, the jig plate 400 can be adsorbed and fixed in a negative pressure adsorption mode, so that the effect of relatively fixing the wheel rotating frame 350 and the jig plate 400 is effectively achieved, and the wheel rotating frame 350 is ensured to drive the jig plate 400 to perform overturning motion.

In some embodiments, referring to FIG. 1, the tool 100 has a take-out station 150, and the lithography mechanism 500 and the take-out station 150 are located on opposite sides of the connecting arm 320, respectively; the driving device 360 is connected to the middle of the connecting arm 320; the wheel brackets 350 are two and are respectively connected to both ends of the connection arm 320. After the driving device 360 is started, the connecting arm 320 drives the rotating frame 350 to reciprocally rotate between the material taking position 150 and the lithography mechanism 500, so that the jig tray 400 returns to the lithography mechanism 500 again after turning over. The jig tray 400 after the photolithography operation is performed on both sides can be driven to the material taking position 150 under the action of the connecting arm 320, and can be taken away and subjected to the next operation, thereby facilitating the efficient operation of the overall operation.

In some embodiments, referring to fig. 5, a second motor 340 is connected to an end of the link arm 320, the second motor 340 being connected to the wheel truck 350 and being capable of driving it to flip relative to the link arm 320. The second motor 340 can drive the wheel rotating frame 350 to rotate relative to the connecting arm 320, so that the effect of adjusting the orientation angle of the wheel rotating frame 350 can be more conveniently and accurately achieved, and the purpose of overturning the wheel rotating frame 350 can be smoothly and accurately achieved, so that the jig disc 400 can be smoothly and accurately ensured to be transported back to the lithography mechanism 500 again after overturning to the back for lithography operation.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.

Claims

1. A chip lithographic apparatus, comprising:

a machine (100);

the displacement platform (200) is arranged on the machine table (100), a jig disc (400) for bearing a circuit board is arranged on the displacement platform (200), and two sides of the jig disc (400) are provided with hollowed-out photoetching positions;

a lithography mechanism (500) disposed on the machine (100), wherein the lithography mechanism (500) is configured to perform a lithography operation on a lithography position on the jig tray (400);

the turnover mechanism (300) is arranged on the machine table (100), the displacement platform (200) can drive the jig tray (400) to move close to or far away from the turnover mechanism (300), the turnover mechanism (300) comprises at least two wheel turnframes (350) capable of driving the jig tray (400) to move, and the turnover mechanism (300) is used for driving each wheel turnframe (350) to turn over in sequence and move close to or far away from the displacement platform (200) in sequence.

2. A chip lithographic apparatus according to claim 1, wherein:

the photoetching mechanism (500) and the turnover mechanism (300) are respectively positioned at two sides of the displacement platform (200), and the displacement platform (200) is used for driving the jig disc (400) to reciprocate between the photoetching mechanism (500) and the turnover mechanism (300).

3. A chip lithographic apparatus according to claim 2, wherein:

the displacement platform (200) comprises a first motor (210) and a screw nut pair (230), wherein the first motor (210) is connected with a displacement seat (240) through the screw nut pair (230); the displacement seat (240) is provided with a fixed clamping jaw (250), and the jig disc (400) is installed in the fixed clamping jaw (250).

4. A chip lithographic apparatus according to claim 1, wherein:

the photoetching mechanism (500) comprises a mounting frame (510) arranged on the machine table (100), the mounting frame (510) is connected with an adjusting component (530), and the adjusting component (530) is connected with a spatial light modulator (550) and can drive the spatial light modulator to move relative to the mounting frame (510).

5. A chip lithographic apparatus according to claim 4, wherein:

the adjusting assembly (530) comprises a first air cylinder (531), a second air cylinder (532) and a third air cylinder (533), wherein the directions of the first air cylinder (531), the second air cylinder (532) and the third air cylinder (533) are different from each other and are sequentially connected; the third cylinder (533) is connected with a connecting frame (520), and the spatial light modulator (550) is arranged at the connecting frame (520).

6. A chip lithographic apparatus according to claim 5, wherein:

the mounting frame (510) is located above the displacement platform (200), one of the first air cylinder (531), the second air cylinder (532) and the third air cylinder (533) points to the lower side of the mounting frame, and the displacement platform (200) drives the jig disc (400) to displace along the horizontal direction.

7. A chip lithographic apparatus according to claim 1, wherein:

the turnover mechanism (300) comprises a bottom frame (310) arranged on the machine table (100), the bottom frame (310) is provided with a connecting arm (320) and a driving device (360), the driving device (360) is connected with the connecting arm (320) and can drive the connecting arm (320) to turn over, and each wheel turning frame (350) is installed on the connecting arm (320).

8. A chip lithographic apparatus according to claim 7, wherein:

the wheel rotating frame (350) is provided with a sucker set, and the jig disc (400) can be adsorbed by the sucker set.

9. A chip lithographic apparatus according to claim 8, wherein:

the machine (100) is provided with a material taking position (150), and the photoetching mechanism (500) and the material taking position (150) are respectively positioned at two sides of the connecting arm (320); the driving device (360) is connected to the middle part of the connecting arm (320); the number of the wheel trucks (350) is two, and the wheel trucks are respectively connected to two ends of the connecting arm (320).

10. A chip lithographic apparatus according to claim 9, wherein:

the end of the connecting arm (320) is connected with a second motor (340), and the second motor (340) is connected with the wheel turning frame (350) and can drive the wheel turning frame to turn over relative to the connecting arm (320).