CN116837265A - Liquid metal heat conduction material and coating thereof, preparation method and application - Google Patents

Liquid metal heat conduction material and coating thereof, preparation method and application Download PDF

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Publication number
CN116837265A
CN116837265A CN202310928038.4A CN202310928038A CN116837265A CN 116837265 A CN116837265 A CN 116837265A CN 202310928038 A CN202310928038 A CN 202310928038A CN 116837265 A CN116837265 A CN 116837265A
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metal heat
liquid metal
oxide
coating
heat conducting
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CN116837265B (en
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张嘉楠
曹勇
孙爱祥
杨健虹
窦兰月
周晓燕
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Shenzhen Hongfucheng New Material Co ltd
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Shenzhen Hongfucheng New Material Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/10—Liquid materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The application discloses a liquid metal heat conduction material, a coating thereof, a preparation method and application thereof, and belongs to the technical field of materials. The preparation raw materials of the liquid metal heat conduction material comprise, by mass, 0.5-10% of Ga, 50-70% of In, 20-40% of Bi and 5-25% of Sn. The liquid metal heat conducting material can be prepared into a metal heat conducting material coating in a spraying mode, the coating is low in preparation cost, excellent in heat conducting performance, high in heat conducting coefficient, small in heat resistance, good in heat stability, favorable for radiating heat, convenient to use and long in service life, and the binding force between the heat radiating module and the heating source is improved.

Description

Liquid metal heat conduction material and coating thereof, preparation method and application
Technical Field
The application relates to the technical field of materials, in particular to a liquid metal heat conduction material, a coating thereof, a preparation method and application.
Background
With the continuous progress of technology, electronic components and electronic devices are miniaturized and miniaturized, but the negative effects caused by the heat dissipation problem are also serious, and the heat dissipation design has become an important component of the modern electronic and electric industry.
At present, a conventional heat dissipation mode is to conduct heat dissipation through a metal heat conducting plate, but the mode cannot obtain good heat conducting performance under the condition of low cost.
In view of this, the present application has been made.
Disclosure of Invention
One of the objectives of the present application is to provide a liquid metal heat conductive material, which has high heat conductive performance and low manufacturing cost.
The second objective of the present application is to provide a method for preparing the above liquid metal heat conductive material.
The third object of the present application is to provide a metal heat conductive material coating prepared from the above liquid metal heat conductive material.
The fourth object of the application is to provide a preparation method of the metal heat conducting material coating.
The fifth object of the present application is to provide an electronic component comprising the above-mentioned coating layer of a metal heat conductive material.
The application can be realized as follows:
in a first aspect, the application provides a liquid metal heat conducting material, which comprises, by mass, 0.5-10% of Ga, 50-70% of In, 20-40% of Bi and 5-25% of Sn.
In an alternative embodiment, the starting materials for the preparation comprise 0.5-10% Ga, 55.8-65.3% In, 22-25% Bi and 9.7-12.2% Sn.
In an alternative embodiment, the source of gallium providing Ga, the source of indium providing In, the source of bismuth providing Bi, and the source of tin providing Sn are each independently a powder material having a particle size of 3-8mm.
In a second aspect, the present application provides a method for preparing a liquid metal heat conducting material according to any one of the preceding embodiments, comprising the steps of: liquefying the preparation raw materials.
In an alternative embodiment, the liquefaction includes at least one of the following features:
characteristic one: liquefaction is carried out under vacuum conditions;
and the second characteristic is: the liquefying temperature is 300-500 ℃;
and (3) the following characteristics: the liquefying time is 1.5-2.5h.
In a third aspect, the present application provides a metallic thermal conductive material coating formed by spraying a liquid metallic thermal conductive material according to any of the preceding embodiments.
In alternative embodiments, the thickness of the metallic thermally conductive material coating may be in the range of 5-20 μm.
In a fourth aspect, the present application provides a method for preparing a coating of a metal heat conducting material according to the previous embodiment, comprising the steps of: spraying the liquid metal heat conducting material in any one of the previous embodiments on the surface of the material to be sprayed, and cooling and molding.
In an alternative embodiment, the liquid metal thermally conductive material remains in a liquid state throughout the nozzle prior to being ejected from the nozzle; and, the liquid metal heat conductive material is in a viscous paste state after being ejected from the nozzle.
In an alternative embodiment, the metallic heat conductive material In paste state contains both In oxide, sn oxide and Bi oxide.
In an alternative embodiment, the total amount of In oxide, sn oxide, and Bi oxide is 4-6wt% of the metallic thermally conductive material In the paste state.
In an alternative embodiment, the oxide of In includes In 2 O 3 The oxide of Sn includes SnO 2 The oxide of Bi includes Bi 2 O 3 。
In an alternative embodiment, the spray speed is 150-250mm/s; and/or the spraying distance is 25-35cm.
In a fifth aspect, the present application provides an electronic component, which includes a heat dissipation module and a heat source, wherein a contact surface between the heat dissipation module and the heat source is provided with the metal heat conductive material coating of the foregoing embodiment.
The beneficial effects of the application include:
according to the application, in, bi, sn and Ga In the preparation raw materials of the liquid metal heat conduction material are prepared according to a specific proportion, so that the liquid metal heat conduction material has good infiltration performance and is favorable for exerting good heat conduction and heat dissipation effects. The liquid metal heat conduction material is prepared into the metal heat conduction material coating through a spraying mode, so that the preparation cost is low, the operation is easy, the surface of the obtained coating is smooth and flat, the heat conduction coefficient is high, the heat resistance is small, the coating prepared through the mode has good binding force with the heat radiation module and the heating source, the binding force between the heat radiation module and the heating source can be improved, and the service life of corresponding products is prolonged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a photograph of a sprayed coating provided in example 1 of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below. The specific conditions are not noted in the examples and are carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
The liquid metal heat conduction material and the coating and the preparation method and application thereof provided by the application are specifically described below.
The application provides a liquid metal heat conduction material, which comprises, by mass, 0.5-10% of Ga, 50-70% of In, 20-40% of Bi and 5-25% of Sn.
Ga has a strong wettability to a metal or Si, and by mixing In, bi, sn with Ga together, compared with a heat conduction material containing only In, bi and Sn, the heat conduction material has better infiltration capacity and is more beneficial to playing good heat conduction and heat dissipation effects.
Illustratively, the mass percentage of Ga in the above-mentioned preparation raw materials may be 0.5%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6%, 6.5%, 7%, 7.5%, 8%, 8.5%, 9%, 9.5% or 10%, etc., and may be any other value in the range of 0.5 to 10%.
It should be noted that if the mass fraction of Ga in the preparation raw material is lower than 0.5%, the wettability and thermal conductivity of the liquid metal thermal conductive material are not ideal; if the mass fraction of Ga in the preparation raw material exceeds 10 percent (for example, more than 45 percent), the flexibility of the material is easily affected, and the surface of the coating layer becomes fragile and is easily cracked. Further, ga has a small atomic radius and good wettability with metals, and if the Ga is used in an excessive amount, it penetrates into metals such as Cu and Al to break the atomic bonds thereof, thereby forming intermetallic compounds, which corrode them.
The mass percentage of In the above-mentioned raw materials for production may be 50%, 52%, 55%, 58%, 60%, 62%, 65%, 68% or 70%, etc., or may be any other value within the range of 50 to 70%. Preferably, the mass percentage of In the preparation raw material may be 55.8-65.3%.
It should be noted that if the mass fraction of In the preparation raw material is less than 50%, the ductility of the material is reduced; if the mass fraction of In the preparation raw material exceeds 70%, the melting point of the material may be raised.
The mass percentage of Bi in the above preparation raw materials may be 20%, 22%, 25%, 28%, 30%, 32%, 35%, 38% or 40%, etc., or may be any other value within the range of 20 to 40%. Preferably, the mass percentage of Bi in the preparation raw material may be 22-25%.
It should be noted that if the mass fraction of Bi in the preparation raw material is lower than 20%, the wettability of the material is reduced; if the mass fraction of Bi in the raw material for production exceeds 40%, the melting point of the material is increased and the thermal conductivity is lowered.
The mass percentage of Sn in the preparation raw materials can be 5%, 8%, 10%, 12%, 15%, 18%, 20%, 22% or 25%, etc., and can be any other value within the range of 5-25%. Preferably, the mass percentage of Sn in the preparation raw material may be 9.7-12.2%.
It should be noted that if the mass fraction of Sn in the preparation raw material is lower than 5%, the thermal conductivity of the material is reduced; if the mass fraction of Sn in the preparation raw material exceeds 25%, the melting point of the material may be raised.
In some preferred embodiments, the liquid metal thermally conductive material may be prepared from a feedstock comprising 0.5-10% Ga, 55.8-65.3% In, 22-25% Bi, and 9.7-12.2% Sn. According to the proportion range, the liquid metal heat conduction material with better heat conduction performance can be obtained.
In the present application, the gallium source providing Ga, the indium source providing In, the bismuth source providing Bi, and the tin source providing Sn are each independently powder materials, and the particle size of these powder materials may be 3-8mm, for example.
If the particle size of the powder material is less than 3mm, the surface of the powder material is exposed excessively, and the possibility of forming an oxide film outside is increased; if the particle size of the powder material is larger than 8mm, the smelting efficiency is not reduced.
It should be noted that the powder material under the particle size condition is specifically adopted in the application, so that the liquid metal heat conduction material can be prepared into the metal heat conduction material coating with better performance (such as surface evenness, uniformity of the material in the coating, heat conductivity of the coating and the like) in a spraying manner, the preparation cost is lower, the adhesion between the heat radiation module and the heating source is improved, and the service life of the corresponding product is prolonged.
Correspondingly, the application also provides a preparation method of the liquid metal heat conduction material, which comprises the following steps: the feedstock is liquefied.
For reference, the liquefaction process may be performed in a furnace in which vacuum conditions are maintained. The corresponding vacuum degree in the liquefaction process can be less than or equal to 1 multiplied by 10 -3 Pa。
The liquid metal heat conducting material needs to be liquefied under vacuum condition to prevent oxidation of materials. If the vacuum degree is higher than 1X 10 -3 Pa, the material is easily oxidized in advance.
As a reference, the liquefaction temperature may be 300-500℃such as 300℃350℃400℃450℃or 500℃or any other value within the range of 300-500 ℃.
The application controls the liquefying temperature to 300-500 ℃ to melt the raw materials to form alloy. If the liquefaction temperature is lower than 300 ℃ but higher than 100 ℃, the material is not easy to be sufficiently melted; if the liquefaction temperature is higher than 500 ℃, the smelting efficiency is not improved, the quality of finished products is easily affected, and metal volatilization can be caused.
The liquefaction time may be 1.5-2.5h, such as 1.5h, 2h, or 2.5h, etc., or any other value within the range of 1.5-2.5h.
All preparation raw materials of the liquid metal heat conduction material are in a liquid form through the liquefaction stage.
In some alternative embodiments, the above-mentioned preparation raw materials in liquid state may be stirred and mixed so as to uniformly mix the raw materials. The stirring process may be carried out, for example, at 100-120deg.C and 350-450r/min for 25-35min.
By adopting the liquefaction mode, the liquid metal heat conduction material with uniform components and good fluidity can be obtained.
Furthermore, the application also provides a metal heat conducting material coating which is formed by spraying the liquid metal heat conducting material and can be used as a heat conducting layer.
For reference, the thickness of the coating of the metal heat conductive material may be 5-20 μm, such as 5 μm, 10 μm, 15 μm, 20 μm, or the like.
Accordingly, the present application provides a method for preparing a metal heat conductive material coating according to the foregoing embodiment, for example, the method may include the following steps: spraying the liquid metal heat conduction material on the surface of the material to be sprayed, and cooling and forming.
It should be noted that In, bi and Sn are metal materials with very high ductility, and Ga is brittle metal, so the liquid metal heat conductive material of the present application cannot be prepared into a sheet-like product by a conventional casting method. According to the application, the liquid metal heat conduction material is deposited to a thermal interface (for example, between a heat radiation module and a heating source) in a spraying mode, so that the preparation cost is low, the process condition is easy to control, and a coating product with better performance can be obtained.
In the application, the liquid metal heat conduction material is always kept in a liquid state before being sprayed out of the nozzle; and, the liquid metal heat conductive material is in a viscous paste state after being ejected from the nozzle.
For reference, the spraying mode is air spraying, that is, spraying the paint by atomizing compressed air. In order to control the liquid metal heat conductive material to remain in a liquid state until it is ejected from the nozzle, the components (e.g., the feed pipe and the nozzle) that convey the liquid metal heat conductive material may be kept at not lower than 120 ℃.
If the metal heat conduction material is always sprayed to the surface to be sprayed in a liquid state, the heat conduction stability of the final coating is greatly reduced; if the metal heat conducting material is directly prepared into a coating in a paste form, the coating is difficult to implement because the paste metal heat conducting material has higher tension.
It should be emphasized that the present application controls the specific state of the metal heat conducting material before and during the spraying process, so that the obtained coating has better performance effect. Specifically, in the scheme of the application, before the liquid metal heat conduction material is sprayed out from the nozzle to reach the surface to be sprayed, part of metal is oxidized, so that a viscous paste state is presented, the fluidity in the state is greatly reduced compared with the liquid state with less oxidation, and better heat conduction stability can be obtained.
The liquid metal heat conductive material In paste state contains In oxide (such as In 2 O 3 ) Oxides of Sn (e.g. SnO 2 ) And oxides of Bi (e.g., bi 2 O 3 ) Ga is not substantially oxidized.
In some embodiments, the total amount of In oxide, sn oxide, and Bi oxide is 4-6wt%, such as 4wt%, 4.5wt%, 5wt%, 5.5wt%, or 6wt%, and more preferably 4-5wt% of the liquid metal thermally conductive material In the paste state. Taking the example that the total amount of In oxide, sn oxide and Bi oxide is 5wt% of the liquid metal heat conduction material In the paste state, wherein In 2 O 3 Can be about 3% SnO 2 May be about 1%, bi 2 O 3 May be about 1%.
It is based on the In oxide, sn oxide and Bi oxide containing the above ranges, and these oxides have better chemical stability and thermal stability, so that the sprayed coating has better thermal stability and thermal conductivity, etc.
If the amount of In, sn, and Bi to be oxidized is too large, for example, more than 6wt%, it is rather disadvantageous to improve the thermal conductivity.
In the present application, the spraying speed may be 150 to 250mm/s, such as 150mm/s, 180mm/s, 200mm/s, 220mm/s, 250mm/s, etc., or any other value in the range of 150 to 250mm/s.
If the spraying speed is lower than 150mm/s, the coating is easy to be too thick and easy to crack; and the content of oxide can be increased when the spraying speed is too low, so that the surface roughness of the coating is improved, and the heat conduction is not facilitated. If the spraying speed is higher than 250mm/s, the sprayed paste cannot be continuously and uniformly deposited on the surface to be sprayed due to higher viscosity, so that faults can occur and the heat conduction performance is seriously affected.
In the present application, the spraying distance may be 25-35cm, such as 25cm, 28cm, 30cm, 32cm or 35cm, etc., or any other value within the range of 25-35cm.
By spraying at the above spraying distance in combination with the above spraying speed, it is possible to secure a sufficient flight time and to control the oxidized substance in the range of 4 to 6wt%.
If the spraying distance is more than 35cm, the spraying cannot be uniformly and completely sprayed on the surface to be sprayed, and gaps appear in the middle of the surface to be sprayed, so that the thermal resistance is greatly increased. If the spraying distance is less than 25cm, the spraying area is concentrated, the spraying layer is too thick, and the cracking is easy to occur.
On the premise of bearing, the spraying method provided by the application has the advantages that the cost is lower, the prepared metal heat-conducting material coating is smaller in surface roughness, high in surface flatness, high in uniformity of materials in the coating, and high in heat conductivity and heat stability, and in addition, the coating is beneficial to improving the adhesive force between a heat radiation module and a heating source and prolonging the service life of corresponding products.
The application further provides an electronic component, which comprises a heat radiation module and a heating source, wherein the contact surface of the heat radiation module and the heating source is provided with the metal heat conducting material coating.
The heat dissipation module may include a heat dissipation fin, a heat pipe, a cold plate, or the like; the heat source may include, for example, CPU, GPU, IGBT modules or large server chips, etc.
The electronic component can rapidly dissipate heat and has long service life.
The features and capabilities of the present application are described in further detail below in connection with the examples.
Example 1
The embodiment provides an electronic component, which comprises a heat radiation module (CPU) and a heat source (heat radiation fin), wherein a metal heat conduction material coating is deposited between contact surfaces of the heat radiation module and the heat source.
The metal heat-conducting material coating is prepared by the following steps:
s1: the preparation method comprises the steps of using indium particles, bismuth particles, tin particles and gallium particles as preparation raw materials, wherein the purities of the indium particles, the bismuth particles, the tin particles and the gallium particles are not lower than 99.99%, and the particle diameters of the indium particles, the bismuth particles, the tin particles and the gallium particles are all 5mm. In the preparation raw materials, the mass percentage ratio of indium, bismuth, tin and gallium is 55.8:22:1 in sequence2.2:10. Putting the above raw materials into vacuum intermediate frequency smelting furnace, and vacuumizing to less than 1×10 -3 Pa, heating to 400 ℃ and keeping for 2 hours to obtain the liquid metal heat conduction material.
S2: and (3) placing the liquid metal heat conduction material obtained in the step (S1) into a vacuum heating stirrer, and stirring at the speed of 400r/min for 30min at the temperature of 100 ℃ to uniformly mix the raw materials.
S3: and (3) pouring the uniformly mixed liquid metal heat conduction material obtained in the step (S2) into a mechanical pump with heating, wherein the mechanical pump is connected with a heating spray head through a heating pipe. The temperature of all parts involved in the spraying was maintained at 120 ℃. Starting a mechanical pump, pumping liquid metal into a spray pipe for spraying, placing a heat radiation module to be sprayed below a spray head, controlling the spraying distance to be 30cm, spraying the liquid metal in a required area by setting the moving direction of the spray head, and controlling the spraying speed to be 200mm/s by adjusting a servo motor. After the spray coating was completed, the resultant coating was cooled and formed to a thickness of 10. Mu.m (a photograph of the coating is shown in FIG. 1).
Example 2
This embodiment differs from embodiment 1 in that: in the preparation raw materials, the mass percentage ratio of indium, bismuth, tin and gallium is 60.3:25:9.7:5 in sequence.
Example 3
This embodiment differs from embodiment 1 in that: in the preparation raw materials, the mass percentage ratio of indium, bismuth, tin and gallium is 65.3:22:12.2:0.5 in sequence.
Example 4
This embodiment differs from embodiment 1 in that: in the preparation raw materials, the mass percentage ratio of indium, bismuth, tin and gallium is 50:40:5:5 in sequence.
Example 5
This embodiment differs from embodiment 1 in that: in the preparation raw materials, the mass percentage ratio of indium, bismuth, tin and gallium is 70:20:8:2 in sequence.
Example 6
This embodiment differs from embodiment 1 in that: in the preparation raw materials, the mass percentage ratio of indium, bismuth, tin and gallium is 60:20:15:5 in sequence.
Example 7
This embodiment differs from embodiment 1 in that: in the preparation raw materials, the mass percentage ratio of indium, bismuth, tin and gallium is 55:20:15:10 in sequence.
Example 8
This embodiment differs from embodiment 1 in that: the particle diameters of the indium particles, the bismuth particles, the tin particles and the gallium particles are all 3mm.
Example 9
This embodiment differs from embodiment 1 in that: the particle diameters of the indium particles, the bismuth particles, the tin particles and the gallium particles are all 8mm.
Example 10
This embodiment differs from embodiment 1 in that: the spraying speed was 150mm/s.
Example 11
This embodiment differs from embodiment 1 in that: the spraying speed was 250mm/s.
Example 12
This embodiment differs from embodiment 1 in that: the spraying distance was 25cm.
Example 13
This embodiment differs from embodiment 1 in that: the spraying distance was 35cm.
Comparative example 1
The difference between this comparative example and example 1 is that: the spraying distance was 40cm.
Comparative example 2
The difference between this comparative example and example 1 is that: the spraying distance was 20cm.
Comparative example 3
The difference between this comparative example and example 1 is that: the spraying speed was 300mm/s.
Comparative example 4
The difference between this comparative example and example 1 is that: the spraying speed was 100mm/s.
Comparative example 5
The difference between this comparative example and example 1 is that: and (3) placing the uniformly mixed liquid metal heat conduction material obtained in the step (S2) in a crucible, keeping the temperature at 120 ℃, and then soaking the liquid metal heat conduction material in a brush to coat the surface of the heat dissipation module.
Namely, the application does not use a spraying mode to prepare the coating, and does not relate to the metal heat conduction material in a paste state.
Comparative example 6
The difference between this comparative example and example 1 is that: and (3) oxidizing the uniformly mixed liquid metal heat conduction material obtained in the step (S2) into a paste state, and then coating.
Comparative example 7
The difference between this comparative example and example 1 is that: ga is not contained in the preparation raw materials, and the mass percentage ratio of the indium, the bismuth and the tin is 65.8:22:12.2 in sequence.
Comparative example 8
The difference between this comparative example and example 1 is that: in the preparation raw material, the content of Ga is 26.8wt%, and the mass ratio of the rest of indium, bismuth and tin is 60:8:5.2.
Comparative example 9
The difference between this comparative example and example 1 is that: in the preparation raw materials, the mass percentage ratio of indium, bismuth, tin and gallium is 45:45:5:5 in sequence.
Comparative example 10
The difference between this comparative example and example 1 is that: in the preparation raw materials, the mass percentage ratio of indium, bismuth, tin and gallium is 75:15:2:8 in sequence.
Comparative example 11
The difference between this comparative example and example 1 is that: in the preparation raw materials, the mass percentage ratio of indium, bismuth, tin and gallium is 45:10:30:15 in sequence.
Comparative example 12
The difference between this comparative example and example 1 is that: in the preparation raw materials, the particle diameters of indium particles, bismuth particles, tin particles and gallium particles are all 1mm.
Comparative example 13
The difference between this comparative example and example 1 is that: in the preparation raw materials, the particle diameters of indium particles, bismuth particles, tin particles and gallium particles are all 10mm.
Test examples
The coatings prepared in examples 1 to 13 and comparative examples 1 to 13 were tested and observed for oxide ratio, thermal conductivity, thermal resistance, and surface flatness, and the results are shown in table 1.
Wherein, the measurement of the heat conductivity coefficient refers to ASTM D5470, and the measurement of the heat resistance refers to ASTM D5470.
Table 1 results
As can be seen from table 1: each example can produce a coating with higher thermal conductivity, less thermal resistance, smooth and even surface, and the best effect of example 1. In the case of comparative example 2, although the effect is similar to that of the example, the coating obtained in this comparative example is not very practical and is liable to brittle fracture.
The comparison can show that the proportion of the raw materials and the preparation conditions can directly influence the performance of the coating, and the coating with better performance can be obtained only by matching the proper raw materials and the proper preparation conditions.
In summary, the liquid metal heat conducting material provided by the application can be prepared into a metal heat conducting material coating by a spraying mode, the preparation cost is low, the obtained coating has excellent heat conducting performance, high heat conducting coefficient, low heat resistance and good heat stability, and is favorable for radiating heat, and in addition, the coating is favorable for improving the binding force between a radiating module and a heating source, and is convenient to use and long in service life.
The above is only a preferred embodiment of the present application, and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. The liquid metal heat conduction material is characterized by comprising, by mass, 0.5-10% of Ga, 50-70% of In, 20-40% of Bi and 5-25% of Sn.
2. The liquid metal heat conducting material according to claim 1, wherein the preparation raw material comprises 0.5-10% Ga, 55.8-65.3% In, 22-25% Bi, and 9.7-12.2% Sn.
3. The liquid metal heat conducting material according to claim 1 or 2, wherein the source of gallium providing Ga, the source of indium providing In, the source of bismuth providing Bi and the source of tin providing Sn are each independently a powder mass having a particle size of 3-8mm.
4. A method of preparing a liquid metal heat conducting material according to any one of claims 1 to 3, comprising the steps of: liquefying the preparation raw materials;
preferably, the liquefaction comprises at least one of the following features:
characteristic one: liquefaction is carried out under vacuum conditions;
and the second characteristic is: the liquefying temperature is 300-500 ℃;
and (3) the following characteristics: the liquefying time is 1.5-2.5h.
5. A metal heat conducting material coating, characterized in that it is formed by spraying the liquid metal heat conducting material according to any one of claims 1-3;
preferably, the thickness of the metal heat conducting material coating is 5-20 μm.
6. The method for preparing a metal heat conducting material coating according to claim 5, comprising the steps of: a method of spraying a liquid metal heat conducting material according to any one of claims 1 to 3 onto the surface of a material to be sprayed, and cooling and molding.
7. The method of manufacturing according to claim 6, wherein the liquid metal heat conductive material remains in a liquid state until ejected from the nozzle; and, the liquid metal heat conduction material is in a viscous paste state after being sprayed out from the nozzle.
8. The method according to claim 7, wherein the paste-state metal heat conductive material contains an oxide of In, an oxide of Sn, and an oxide of Bi at the same time;
preferably, the total amount of the In oxide, the Sn oxide and the Bi oxide is 4-6wt% of the metallic heat conductive material In the paste state;
preferably, the oxide of In includes In 2 O 3 The oxide of Sn includes SnO 2 The oxide of Bi includes Bi 2 O 3 。
9. The method of any one of claims 6 to 8, wherein the spray rate is 150 to 250mm/s; and/or the spraying distance is 25-35cm.
10. An electronic component, characterized in that the electronic component comprises a heat radiation module and a heating source, and the contact surface of the heat radiation module and the heating source is provided with the metal heat conducting material coating as claimed in claim 5.
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Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005122252A1 (en) * 2004-05-04 2005-12-22 S-Bond Technologies, Llc Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
CN104218010A (en) * 2014-09-10 2014-12-17 北京依米康科技发展有限公司 Metal thermal interface material
CN104745911A (en) * 2015-02-13 2015-07-01 北京依米康科技发展有限公司 Preparation method and application of high-viscosity low-melting-point metal heat-conducting fin
CN105349866A (en) * 2015-11-26 2016-02-24 苏州天脉导热科技有限公司 Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy
CN105400497A (en) * 2015-10-28 2016-03-16 苏州天脉导热科技有限公司 All-metal heat conducting paste and preparation method thereof
CN105483486A (en) * 2015-11-26 2016-04-13 苏州天脉导热科技有限公司 Low-melting-point alloy and thermal interface material made from low-melting-point alloy
CN106119653A (en) * 2016-06-29 2016-11-16 北京态金科技有限公司 A kind of phase-changing metal alloy, alloy constant temperature quilt and the preparation method of alloy
CN108997980A (en) * 2018-08-02 2018-12-14 中国工程物理研究院化工材料研究所 A kind of optical fiber laser phase-change heat conductive material, preparation method and application method
CN110306091A (en) * 2019-07-18 2019-10-08 深圳前海量子翼纳米碳科技有限公司 A kind of high wellability low thermal resistance liquid metal sheet and preparation method thereof
CN113564446A (en) * 2021-07-15 2021-10-29 云南海瀚有机光电子科技有限责任公司 Room-temperature multiphase coexisting liquid metal thermal interface material and preparation method thereof
CN114276785A (en) * 2021-11-29 2022-04-05 江阴镓力材料科技有限公司 Metal-based phase-change interface heat conduction material, preparation method and application thereof
CN115041799A (en) * 2022-05-25 2022-09-13 云南前沿液态金属研究院有限公司 Alloy material for low-temperature welding of indium tin oxide film and welding method
CN115226360A (en) * 2021-04-14 2022-10-21 华为技术有限公司 Thermal interface, method of obtaining same, and method of promoting heat transfer
US20230197558A1 (en) * 2021-12-22 2023-06-22 Indium Corporation Liquid metal paste containing metal particle additive
CN116408453A (en) * 2021-12-31 2023-07-11 江阴镓力材料科技有限公司 Composite heat conduction material of copper foil substrate

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005122252A1 (en) * 2004-05-04 2005-12-22 S-Bond Technologies, Llc Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
CN104218010A (en) * 2014-09-10 2014-12-17 北京依米康科技发展有限公司 Metal thermal interface material
CN104745911A (en) * 2015-02-13 2015-07-01 北京依米康科技发展有限公司 Preparation method and application of high-viscosity low-melting-point metal heat-conducting fin
CN105400497A (en) * 2015-10-28 2016-03-16 苏州天脉导热科技有限公司 All-metal heat conducting paste and preparation method thereof
CN105349866A (en) * 2015-11-26 2016-02-24 苏州天脉导热科技有限公司 Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy
CN105483486A (en) * 2015-11-26 2016-04-13 苏州天脉导热科技有限公司 Low-melting-point alloy and thermal interface material made from low-melting-point alloy
CN106119653A (en) * 2016-06-29 2016-11-16 北京态金科技有限公司 A kind of phase-changing metal alloy, alloy constant temperature quilt and the preparation method of alloy
CN108997980A (en) * 2018-08-02 2018-12-14 中国工程物理研究院化工材料研究所 A kind of optical fiber laser phase-change heat conductive material, preparation method and application method
CN110306091A (en) * 2019-07-18 2019-10-08 深圳前海量子翼纳米碳科技有限公司 A kind of high wellability low thermal resistance liquid metal sheet and preparation method thereof
CN115226360A (en) * 2021-04-14 2022-10-21 华为技术有限公司 Thermal interface, method of obtaining same, and method of promoting heat transfer
CN113564446A (en) * 2021-07-15 2021-10-29 云南海瀚有机光电子科技有限责任公司 Room-temperature multiphase coexisting liquid metal thermal interface material and preparation method thereof
CN114276785A (en) * 2021-11-29 2022-04-05 江阴镓力材料科技有限公司 Metal-based phase-change interface heat conduction material, preparation method and application thereof
US20230197558A1 (en) * 2021-12-22 2023-06-22 Indium Corporation Liquid metal paste containing metal particle additive
CN116408453A (en) * 2021-12-31 2023-07-11 江阴镓力材料科技有限公司 Composite heat conduction material of copper foil substrate
CN115041799A (en) * 2022-05-25 2022-09-13 云南前沿液态金属研究院有限公司 Alloy material for low-temperature welding of indium tin oxide film and welding method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
刘晓云: "金属基热界面材料研究进展", 《沈阳理工大学学报》, no. 1, 7 January 2023 (2023-01-07), pages 42 - 48 *

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