CN116825732A

CN116825732A - Power module and power conversion device

Info

Publication number: CN116825732A
Application number: CN202310722358.4A
Authority: CN
Inventors: 向志强; 麻斌
Original assignee: Huawei Digital Power Technologies Co Ltd
Current assignee: Huawei Digital Power Technologies Co Ltd
Priority date: 2023-06-16
Filing date: 2023-06-16
Publication date: 2023-09-29

Abstract

The application provides a power module and a power conversion device, wherein the power module comprises a metal frame, at least two chips, a plastic package shell and a through hole structure; at least two chips are arranged on the metal frame, the plastic package shell is enclosed on the metal frame and the outer sides of the at least two chips, and one surface of the metal frame, which is away from the chips, is exposed out of the plastic package shell; one surface of the plastic package shell, which is exposed out of the metal frame, is a first surface of the plastic package shell, the first surface of the plastic package shell is flush with one surface, which is away from the chip, of the metal frame, and the first surface of the plastic package shell is used for being connected with the radiator; the second surface of the plastic package shell is used for being connected with the circuit board, and the second surface of the plastic package shell is deviated from the first surface of the plastic package shell; the through hole structure penetrates through the plastic package shell along the thickness direction of the power module, and the through hole structure is located between two adjacent chips. The power module has the advantages of simple structure, low cost, convenient assembly and good heat radiation performance and electrical performance.

Description

Power module and power conversion device

Technical Field

The present application relates to the field of semiconductor packaging technology, and in particular, to a power module and a power conversion device.

Background

Semiconductor devices such as power diodes, metal-oxide-semiconductor field effect transistors (MOSFET) and insulated gate bipolar transistors (insulated gate bipolar transistor, IGBT) are core power device packages for implementing high-efficiency energy conversion by energy conversion devices such as photovoltaic inverters, energy storage converters, uninterruptible power supplies (uninterruptible power system, UPS) in data centers, rectifiers and server power modules. In order to better meet the demands of users, miniaturization, integration and modularization design of power device packaging are necessarily evolving trends.

In practical application, a plurality of power device packages are usually disposed on a circuit board for use, and in the process of miniaturization, integration and modularity of the power device packages, reasonable assembly of the plurality of power device packages is required to ensure that the plurality of power device packages on the circuit board have good through-flow and heat dissipation paths. The heat dissipation mode of the power device package in the related art comprises top heat dissipation and bottom heat dissipation, wherein the top heat dissipation refers to heat dissipation through one side of the power device package away from the circuit board, and the bottom heat dissipation refers to heat dissipation through one side of the power device package close to the circuit board.

However, due to factors such as larger mounting tolerance, it is difficult to ensure that the tops of the power device packages are located in the same plane when the power device packages are connected to the circuit board, so that the distances from each power device package to the radiator cannot be ensured to be equal when the power device packages are connected to the radiator, and the radiating effect of part of the power device packages is poor. In the solution of bottom heat dissipation, the form TO247 is the package form with the lowest heat resistance, and in order TO improve the circulation and heat dissipation performance of the plurality of power device packages in the form TO247, the plurality of power device packages need TO be assembled by means of a plurality of device sockets and then connected with a circuit board. Although the heat dissipation efficiency can be improved, the assembly difficulty is increased by means of the device socket, and the cost is greatly increased.

Disclosure of Invention

The application provides a power module and a power conversion device, wherein the power module is simple in structure, low in cost, convenient to assemble and good in heat radiation performance and electrical performance.

In a first aspect, the present application provides a power module, including a metal frame, at least two chips, a plastic package housing, and a through hole structure; the plastic package device comprises a metal frame, at least two chips, a plastic package shell, a metal frame, a plastic package shell and a plastic package shell, wherein the at least two chips are arranged on the metal frame, the plastic package shell is arranged on the outer sides of the metal frame and the at least two chips in a surrounding mode, and one surface of the metal frame, which is away from the chips, is exposed out of the plastic package shell; one surface of the plastic package shell, which is exposed out of the metal frame, is a first surface of the plastic package shell, the first surface of the plastic package shell is flush with one surface of the metal frame, which is away from the chip, and the first surface of the plastic package shell is used for being connected with a radiator; the second surface of the plastic package shell is used for being connected with the circuit board, and the second surface of the plastic package shell is deviated from the first surface of the plastic package shell; the through hole structure penetrates through the plastic package shell along the thickness direction of the power module, and the through hole structure is located between two adjacent chips.

By designing the power module to comprise at least two chips, the power module can comprise at least two power components, and setting one power module is equivalent to setting at least two power components when in use.

The surface of the metal frame, which is away from the chip, is exposed out of the plastic package shell, so that the plastic package module can radiate heat through the surface of the metal frame, which is exposed out of the plastic package shell.

Through the parallel and level that the first surface of plastic envelope casing deviates from the one side setting of chip with metal framework, can make this power module's first surface be a plane, when assembling this power module and radiator like this, can guarantee that the laminating degree of plastic envelope module and radiator different positions is the same, in other words, can make the first surface of plastic envelope module and the one side that metal framework deviates from the chip all laminate with the radiator to make the radiating effect of every position of power module all be in better state, and then promote radiating efficiency.

Through set up the through-hole structure between two adjacent chips, when being connected this power module and circuit board like this, can fix this power module on the circuit board through this through-hole structure, can make things convenient for later stage installation work to this through-hole structure makes things convenient for the preparation, can reduce processing cost.

In one possible implementation manner, the number of the metal frames is at least two, a spacing section is arranged between every two adjacent metal frames, and a part of the structure of the plastic package shell is arranged in the spacing section, so that the adjacent metal frames are mutually insulated, and the through hole structure penetrates through the spacing section.

By setting the number of the metal frames to be at least two, compared with a single power device package, the heat dissipation area of the power module can be increased, the heat resistance of the power module can be reduced, and the heat dissipation performance is improved. In addition, through setting up the interval section between two adjacent metal frame, can make not have electric connection between the power module that two adjacent chips correspond to make this power module can use in the scene that two power module do not need to connect, and then promote the flexibility of this power module's application scene. Through penetrating the through hole structure through the interval section, as no metal frame exists in the interval section, the processing difficulty of the through hole structure can be reduced.

In one possible implementation, the power module further includes a drain pin, a gate pin, and a source pin; the drain electrode pin, the gate electrode pin and the source electrode pin are all arranged on the same side of the power module; one ends of the drain electrode pin, the gate electrode pin and the source electrode pin are all positioned in the plastic package shell, and the other ends of the drain electrode pin, the gate electrode pin and the source electrode pin extend out of the plastic package shell in a direction away from the plastic package shell.

The drain electrode pins, the grid electrode pins and the source electrode pins are arranged on the same side of the power module, so that the space occupied by the power module can be saved relative to the arrangement of the pins in different directions, the miniaturization development of packaging is facilitated, and the power module can be conveniently connected with other devices; in addition, one ends of the drain electrode pin, the grid electrode pin and the source electrode pin are arranged in the plastic package shell, and the other ends of the drain electrode pin, the grid electrode pin and the source electrode pin are arranged outside the plastic package shell, so that the power module can be conveniently connected with other devices.

In one possible implementation, each of the chips corresponds to at least one of the drain leads, at least one of the source leads, and one of the gate leads.

By setting the number of source pins to at least one; the number of drain pins is set to be at least one, so that the flexibility of the application scene of the power module can be improved.

In one possible implementation manner, at least part of the drain pins corresponding to the chips in the at least two chips are separated from the metal frame, and one end of the drain pins located in the plastic package shell is connected with the chips through bonding wires; the metal frame corresponding to at least part of the chips comprises the source pins, and one end of the source pins, which is positioned in the plastic package shell, is contacted with the side edge of the metal frame; and the grid pins corresponding to at least part of the chips are separated from the metal frame, and one end of the grid pins in the plastic package shell is connected with the chips.

The source pin is positioned at one end in the plastic package shell and is contacted with the side edge of the metal frame, and the metal frame is of a conductive structure, so that after the source pin is connected with the metal frame, the metal frame can be used as a part of the source, the purpose of radiating through the source is achieved, and the area of the metal frame is quite large relative to the source pin, so that the radiating effect of the power component can be improved. In addition, the power module can be applied to different scenes by setting the first power component to be a structure radiating through the source electrode, so that the applicability of the power module is improved.

In one possible implementation manner, the source pins corresponding to at least part of the chips in the at least two chips are separated from the metal frame, and one end of the source pins located in the plastic package shell is connected with the chips through bonding wires; the metal frame corresponding to at least part of the chips comprises the drain electrode pins, and one end of the drain electrode pins, which is positioned in the plastic package shell, is contacted with the side edge of the metal frame; and the grid pins corresponding to at least part of the chips are separated from the metal frame, and one end of the grid pins positioned in the plastic package shell is connected with the chips through bonding wires.

Through the side contact of one end that is located the plastic envelope shell with the drain electrode pin and metal frame, because metal frame is conductive structure, so drain electrode pin and metal frame connect the back, can make metal frame as the part of drain electrode, and then realize through the radiating purpose of drain electrode, because the area of metal frame is very much for the drain electrode pin, so can promote the radiating effect of this power component. In addition, the power module can be applied to different scenes by arranging the second power component to be in a structure radiating through the drain electrode, so that the applicability of the power module is improved.

In one possible implementation manner, an end, close to the metal frame, of the gate pin includes a connection portion, a gap is formed between the connection portion and the metal frame, and a part of the structure of the plastic package shell is located in the gap, so that the gate pin and the metal frame are insulated from each other.

Through the insulation arrangement between the grid pins and the metal frame, the insulation arrangement between the grid pins and other pins can be realized, and the short circuit between different pins of the power module can be prevented, so that the power module can be normally used.

In one possible implementation manner, the metal frame is provided with a mounting notch, the projection of the mounting notch in the thickness direction of the power module overlaps with the projection of the chip in the thickness direction of the power module, and the connection part of the gate pin is located in the mounting notch.

Through set up the installation breach on metal frame to for the connecting portion of grid pin provides the setting space, so that this power module wholly forms the cuboid structure of one side area pin, reduces the volume of plastic envelope module, convenient assembly.

In one possible implementation, in a thickness direction of the power module, a thickness of the connection portion is smaller than a thickness of the metal frame.

In one possible implementation manner, in the thickness direction of the power module, one surface of the connection part is in electrical contact with the chip, and one surface of the connection part, which faces away from the chip, is provided with a part of the structure of the plastic package shell.

Through the thickness that is less than metal frame with the thickness setting of connecting portion, can reserve the setting space for the plastic envelope casing that is located the one side that connecting portion deviate from the chip like this to the plastic envelope casing that sets up on the connecting portion of messenger's grid pin deviates from the one side parallel and level of chip can deviate from with metal frame, so that follow-up and other device assembly. Through covering the part structure of plastic envelope casing in the one side that the connecting portion deviates from the chip, can make connecting portion parcel in the inside of plastic envelope casing like this to prevent this power module when being connected with the radiator, the metal sheet on the radiator short circuit between power module's source and the grid.

In one possible implementation, the power module further includes a gate boss; the grid lug boss is arranged between the connecting part of the grid pin and the chip, one end of the grid lug boss, which is close to the chip, is higher than one surface of the connecting part of the grid pin, which is close to the chip, and the grid lug boss is used for connecting the connecting part of the grid pin and the chip.

Through set up the grid boss between the connecting portion of grid pin and chip, can be at certain distance between connecting portion and the chip, can increase the processing space between connecting portion and the chip like this to connect connecting portion and chip, reduce the connection degree of difficulty between chip and the connecting portion, and then reduce cost.

In one possible implementation, the power module further includes a metal frame boss; the metal frame boss is located between the metal frame and the chip, one end of the metal frame boss, which is close to the chip, is higher than one surface of the metal frame, which is close to the chip, and the metal frame boss is used for connecting the metal frame and the chip.

Through setting up the metal frame boss, can be with certain distance between metal frame and the chip, when connecting chip and the metal frame like this, can increase the process space, conveniently connect chip and metal frame, can reduce the processing degree of difficulty, and then reduce cost.

In one possible implementation, the heights of the gate boss and the metal frame boss corresponding to the same chip in the thickness direction of the power module are the same.

Through the same with the high setting of grid boss and metal frame boss that same chip corresponds, can make the one side that this chip deviates from metal frame parallel with metal frame like this, can make the junction of this chip and metal frame and the atress of the junction of chip and grid pin even like this, and then can prevent the risk that cracking appears in the hookup location between this chip and metal frame or the grid pin to the life of this power module is prolonged.

In one possible implementation, the gate boss is a cylindrical structure, a triangular prism structure, or a quadrangular prism structure; the metal frame boss is of a cylindrical structure, a triangular prism-shaped structure or a quadrangular prism-shaped structure.

In one possible implementation, the power module further includes a temperature measurement terminal; one end of the temperature measuring terminal is positioned in the plastic package shell, and the other end extends in a direction away from the plastic package shell; and an extension line of the temperature measuring terminal in a first direction passes through the through hole structure, and the first direction is the length direction of the temperature measuring terminal.

The temperature measuring terminal is arranged on the power module, so that the temperature of the power module can be measured in real time, and the power module is maintained in later period.

In a second aspect, an embodiment of the present application provides a power conversion device, where the power conversion device includes any one of the power modules in the first aspect, a circuit board, and a radiator, where the power module is disposed on the circuit board, the radiator is connected to the power module, and the radiator is used to radiate heat for the power module.

According to the power conversion device provided by the embodiment of the application, the power module of the first aspect is arranged, so that the structure can be simplified, the assembly difficulty can be reduced, and the cost can be reduced.

Drawings

FIG. 1 is a schematic diagram of a power module according to an embodiment of the application;

FIG. 2 is an exploded view of a power module according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a power module according to an embodiment of the application;

FIG. 4 is a schematic diagram of a power module according to an embodiment of the application;

FIG. 5 is a schematic cross-sectional view of a power module according to an embodiment of the application;

FIG. 6 is a schematic diagram of a portion of a power module according to an embodiment of the application;

FIG. 7 is a schematic cross-sectional view of a power module according to an embodiment of the application;

FIG. 8 is a schematic diagram of a portion of a power module according to an embodiment of the application;

FIG. 9 is a schematic diagram of a portion of a power module according to an embodiment of the application;

FIG. 10 is a schematic diagram of a portion of a power module according to an embodiment of the application;

FIG. 11 is a schematic diagram of a portion of a power module according to an embodiment of the application;

FIG. 12 is a schematic diagram of a power module according to an embodiment of the application;

FIG. 13 is a schematic diagram of a power module according to an embodiment of the application;

FIG. 14 is a schematic diagram of a power module according to an embodiment of the application;

FIG. 15 is a schematic diagram of a power module according to an embodiment of the application;

FIG. 16 is a schematic diagram of a power module according to an embodiment of the application;

FIG. 17 is a schematic diagram of a portion of a power conversion device according to an embodiment of the present application;

fig. 18 is a schematic circuit diagram of a power conversion device according to an embodiment of the application.

Reference numerals illustrate:

100-power module; 110-a metal frame; 111-a first metal frame; 1111—a first metal frame boss;

1102-mounting notch; 1112-a first mounting notch; 112-a second metal frame; 1121-a second metal frame boss;

1122-a second mounting notch; 120-chip; 121-a first chip; 122-a second chip;

130-plastic packaging the shell; 140-drain pins; 141-a first drain pin; 142-a second drain pin;

150-gate pins; 1501-a connection; 151-first gate pins; 1511-a first connection; 1512-first gate bosses;

152-a second gate pin; 1521-a second connection; 1522-a second gate boss;

160-source pins; 161-a first source pin; 162-a second source pin;

170-via structure; 171-bond wire; 180-spacer segments;

190-a power component; 191-a first power component; 192-a second power component;

193-temperature measuring terminal; 1000-a power conversion device; 200-circuits;

210-half bridge arms; 220-neutral point clamped bridge arm; 300-a circuit board; 400-heat sink.

Detailed Description

The terminology used in the description of the embodiments of the application herein is for the purpose of describing particular embodiments of the application only and is not intended to be limiting of the application.

Throughout the specification and claims, unless the context requires otherwise, the word "comprise" and its other forms such as the third person referring to the singular form "comprise" and the present word "comprising" are to be construed as open, inclusive meaning, i.e. as "comprising, but not limited to. In the description of the specification, the terms "one embodiment", "some embodiments", "example embodiment", "example", or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, in the present application, directional terms such as "front", "rear", and the like are defined with respect to the orientation in which the components are schematically disposed in the drawings, and it should be understood that these directional terms are relative concepts, which are used for description and clarity with respect thereto, and which may be correspondingly changed according to the change in the orientation in which the components are disposed in the drawings.

In the embodiment of the present application, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In the traditional industrial, communication and vehicle-size fields, the power device package used for the power conversion products with medium and small power levels is widely mature from surface mount powerpak-SO8 TO a plug-in TO247plus discrete device application, but short boards exist in the respective heat dissipation capacity and manufacturability. In the current heat dissipation state analysis of a small-power metal-oxide-semiconductor field-effect transistor (MOSFET), abbreviated as MOS, the TO247 form is the package form with the lowest thermal resistance, but the assembly application is relatively complex and the manufacturing cost is high.

The embodiment of the application provides a power module and a power conversion device, wherein the power module is simple in structure, convenient to assemble, heat-dissipation and electrical performance, and capable of greatly reducing cost.

The power module provided by the embodiment of the application is described in detail below with reference to the accompanying drawings.

For convenience of description, a thickness direction of the power module is taken as a z direction, a length direction of the power module is taken as an x direction, and a width direction of the power module is taken as a y direction.

The present application provides a power module 100, as shown in fig. 1, the power module 100 includes a metal frame 110, at least two chips 120, a plastic package 130, and a through hole 170. At least two chips 120 are disposed on the metal frame 110, and for example, the number of chips 120 is two, the plastic package housing 130 is enclosed on the metal frame 110 and the outer sides of the at least two chips 120, and one surface of the metal frame 110 facing away from the chips 120 is exposed to the plastic package housing 130. One surface of the plastic package housing 130, which exposes the metal frame 110, is a first surface of the plastic package housing 130, the first surface of the plastic package housing 130 is flush with a surface of the metal frame 110, which faces away from the chip 120, and the first surface of the plastic package housing 130 is used for being connected with a heat sink (shown in the figure). The second surface of the plastic package body 130 is used for being connected with a circuit board, and the second surface of the plastic package body 130 is away from the first surface of the plastic package body 130. The through hole structure 170 penetrates through the plastic package housing 130 along the thickness direction of the power module 100, and the through hole structure 170 is located between two adjacent chips 120.

In the power module 100 according to the embodiment of the present application, the power module 100 is designed to include at least two chips 120, so that the power module 100 may include at least two power components 190. In this way, when in use, the arrangement of one power module 100 is equivalent to the arrangement of at least two power components 190, and compared with the scheme that in the related art, after a plurality of power devices are assembled together by means of device sockets, the power module 100 in the embodiment of the application is simpler in structure and more convenient to install, and the connection of the plurality of power components and the circuit board can be realized without the aid of other device sockets, so that the installation cost can be greatly reduced.

In some embodiments, the plastic package case 130 may be integrally formed on the outer side of the metal frame 111 and the chip by injection molding. In the embodiment of the present application, the molding method of the plastic package 130 is not further described.

It should be noted that, one chip 120 corresponds to one power component 190, for example, when the chip 120 is one, the power module 100 includes one power component 190; when the number of chips 120 is two, the power module 100 includes two power components 190; when the number of chips 120 is three, the power module 100 includes three power components 190 and so on.

Through set up the through-hole structure 170 between two adjacent chips 120, when being connected this power module 100 and circuit board like this, can fix this power module 100 on the circuit board through this through-hole structure 170, can make things convenient for later stage installation work to this through-hole structure 170 makes things convenient for the preparation, can reduce processing cost.

In the embodiment of the present application, the number of the through hole structures 170 is not limited, for example, one through hole structure 170 may be disposed between two adjacent chips 120, and when the number of the chips 120 is two, the number of the through hole structures 170 may be one, and when the number of the chips 120 is three, the number of the through hole structures 170 may be two.

For example, the number of chips 120 may be two, three, four, or more, and at least two chips 120 are tiled on the metal frame 110, for example, at least two chips 120 are tiled on the metal frame 110 along the y-direction. In the embodiment of the present application, there is no limitation on the number of chips 120.

In one possible implementation, the power module 100 may further include a drain pin 140, a gate pin 150, and a source pin 160; the drain lead 140, the gate lead 150, and the source lead 160 are all disposed on the same side of the power module 100, and exemplary drain lead 140, gate lead 150, and source lead 160 are all disposed on one side of the power module 100 along the x direction, one ends of the drain lead 140, gate lead 150, and source lead 160 are all located in the plastic package housing 130, and the other ends extend out of the plastic package housing 130 in a direction away from the plastic package housing 130.

By arranging the drain electrode pins 140, the gate electrode pins 150 and the source electrode pins 160 on the same side of the power module 100, the space occupied by the power module 100 can be saved relative to arranging the pins in different directions, the miniaturization development of the power module package is facilitated, and the connection with other devices can be facilitated; in addition, by disposing one end of the drain lead 140, the gate lead 150 and the source lead 160 in the plastic package case 130 and the other end outside the plastic package case 130, the power module 100 can be conveniently connected with other devices.

Of course, in other embodiments, the drain lead 140, the gate lead 150 and the source lead 160 may be disposed in different directions, so as to adapt to different application scenarios and facilitate connection.

In one possible implementation, each chip 120 corresponds to at least one drain lead 140, at least one source lead 160, and one gate lead 150.

By setting the number of source pins 160 to at least one; setting the number of drain pins 140 to be at least one can improve the flexibility of the application scenario of the power module 100.

It should be noted that, the number of the metal frames 110 is at least two, and the portion of the metal frame opposite to one chip in the z-direction is one metal frame 110. Wherein the number of metal frames 110 and the number of chips 120 may be the same. In some embodiments, the metal frames 110 corresponding to the chips 120 may be in contact with each other, which may be referred to as a larger metal frame 110 corresponding to the chips 120.

In one possible implementation, the number of the metal frames 110 is at least two, and a spacer 180 (see fig. 4) may be disposed between adjacent metal frames 110, and a part of the plastic package case 130 is disposed in the spacer 180, so that the adjacent metal frames 110 are insulated from each other.

By setting the number of the metal frames 110 to at least two, the heat dissipation area of the power module 100 can be increased, and the thermal resistance of the power module 100 can be reduced, thereby improving the heat dissipation performance, relative to a single power device package. In addition, by arranging the spacer 180 between the two adjacent metal frames 110, no electrical connection exists between the power components 190 corresponding to the two adjacent chips 120, so that the power module 100 can be applied in a scenario where the two power components 190 do not need to be connected, and flexibility of application scenarios of the power module 100 is improved.

The power module 100 includes two chips 120 as an example. That is, the power module 100 in the embodiment of the present application includes two power components 190. For convenience of description, two power components 190 are referred to as a first power component 191 and a second power component 192, respectively.

The chip 120 corresponding to the first power component 191 is referred to as a first chip 121 and a second chip 122. A portion of the metal frame 110 opposite to the first chip 121 in the z-direction is taken as a first metal frame 111, and a portion of the metal frame 110 opposite to the second chip 122 in the z-direction is taken as a second metal frame 112.

The drain lead 140, the gate lead 150, and the source lead 160 corresponding to the first chip 121 in the x-direction are respectively referred to as a first drain lead 141, a first gate lead 151, and a first source lead 161, and the drain lead 140, the gate lead 150, and the source lead 160 corresponding to the second chip 122 in the x-direction are respectively referred to as a second drain lead 142, a second gate lead 152, and a second source lead 162.

As shown in fig. 1, the first power component 191 and the second power component 192 are tiled, and as an example, the first power component 191 and the second power component 192 may be tiled along the y-direction.

In some embodiments, the first drain lead 141, the first gate lead 151, and the first source lead 161 of the first power component 191 are disposed at one side of the first metal frame 111 in the x-direction, and the first drain lead 141, the first gate lead 151, and the first source lead 161 are disposed at intervals in the y-direction.

The second drain lead 142, the second gate lead 152, and the second source lead 162 of the second power device 192 are disposed at one side of the second metal frame 112 along the x-direction, and the second drain lead 142, the second gate lead 152, and the second source lead 162 are disposed at intervals along the y-direction on the second metal frame 112. The first drain lead 141, the first gate lead 151, the first source lead 161, the second drain lead 142, the second gate lead 152 and the second source lead 162 are all disposed on the same side of the power module 100.

By disposing the first drain lead 141, the first gate lead 151, the first source lead 161, the second drain lead 142, the second gate lead 152, and the second source lead 162 on the same side of the power module 100, the space occupied by the power module 100 can be saved, the miniaturization development of the package can be facilitated, and the connection with other devices can be facilitated, relative to disposing the leads in different directions.

It should be noted that the number of the first source lead 161, the first drain lead 141, the second source lead 162, and the second drain lead 142 is not limited in the embodiment of the present application, for example, the number of the first source lead 161 and the second source lead 162 may be one, two, three, or more, the number of the first drain lead 141 and the second drain lead 142 may be one, two, three, or more, or the like. And the number of the first source pins 161 and the second source pins 162 may be the same or different, and the number of the first drain pins 141 and the second drain pins 142 may be the same or different. That is, as long as the number of the first source pins 161 is at least one, the number of the first drain pins 141 is at least one, the number of the second source pins 162 is at least one, and the number of the second drain pins 142 is at least one. And may be specifically set according to the specific circumstances, and will not be further described in the embodiments of the present application.

By setting the number of the first source pins 161 to at least one, the number of the first drain pins 141 to at least one, the number of the second source pins 162 to at least one, and the number of the second drain pins 142 to at least one, flexibility of the applicable scenario of the power module 100 can be improved.

In addition, the via structure 170 may be disposed between the first power component 191 and the second power component 192. And, the through hole structure 170 penetrates the plastic package housing 130 along the z direction. The position of the via structure 170 along the x-direction is not limited in the embodiment of the present application.

As shown in fig. 2, the first chip 121 of the first power component 191 is stacked on the first metal frame 111, and the second chip 122 of the second power component 192 is stacked on the second metal frame 112. The first chip 121 and the second chip 122 are of a unitary structure. The via structure penetrates the first chip 121 and the second chip 122. For example, the first chip 121 and the second chip 122 may be an entire chip structure cut from the same silicon wafer.

Through setting up first chip 121 and second chip 122 as an organic whole structure, can reduce the processing degree of difficulty, and then reduce cost, in addition, can also increase the connection stability between first power component 191 and the second power component 192, prolong the life of this power module 100.

Of course, in other embodiments, the first chip 121 and the second chip 122 may be provided in a split structure (not shown in the drawings), that is, a space between the first chip 121 and the second chip 122 is provided, and a part of the plastic package case 130 is provided in the space between the first chip 121 and the second chip 122.

It should be noted that, the first chip 121 and the second chip 122 are both semiconductor structures, the first metal frame 111 and the second metal frame 112 are both metal structures, the first chip 121 and the first metal frame 111 may be fixedly connected by a welding manner, and the second chip 122 and the second metal frame 112 may also be fixedly connected by a welding manner.

As shown in fig. 3, a surface of the first metal frame 111 facing away from the first chip 121 is exposed to the plastic package housing 130. The surface of the second metal frame 112 facing away from the second chip 122 is exposed to the plastic package housing 130. The side of the first metal frame 111 facing away from the first chip 121 and the side of the second metal frame 112 facing away from the first chip 121 are located on the same plane.

By arranging the surface of the first metal frame 111 facing away from the first chip 121 and the surface of the second metal frame 112 facing away from the first chip 121 on the same plane, the heat dissipation area of the power module 100 can be increased relative to the package of only one power device, and the heat dissipation performance of the power module 100 can be further improved.

In one possible implementation, as shown in fig. 3, the first metal frame 111 and the second metal frame 112 are of a unitary structure. By arranging the first metal frame 111 and the second metal frame 112 as an integral structure, the heat dissipation area of the power module 100 can be increased, the thermal resistance of the power module 100 can be reduced, and the heat dissipation performance can be improved.

It should be noted that, fig. 3 is a schematic diagram of one surface of the power module 100 where the first metal frame 111 and the second metal frame 112 are exposed, or may be a schematic diagram of a back surface of the power module 100, and when in use, the back surface of the power module 100 may be connected to a radiator, so that the radiator may radiate heat from the first metal frame 111 and the second metal frame 112 of the power module 100, and further radiate heat from the power module 100.

In other embodiments, as shown in fig. 4, the first metal frame 111 and the second metal frame 112 may be spaced apart, that is, a spacer 180 is disposed between the first metal frame 111 and the second metal frame 112, and a portion of the plastic package case 130 is disposed in the spacer 180. So that the first metal frame 111 and the second metal frame 112 are arranged in an insulating manner. Illustratively, the via structure 170 extends through the spacer 180. By penetrating the via structure 170 through the spacer 180, the difficulty of processing the via structure 170 can be reduced because there is no metal frame 110 within the spacer 180.

By arranging the first metal frame 111 and the second metal frame 112 at intervals, electrical connection between the first power component 191 and the second power component 192 is not provided, so that the power module 100 can be applied to a scene where the two power components do not need to be connected, and flexibility of application scenes of the power module 100 is improved.

In the embodiment of the present application, the distance between the first metal frame 111 and the second metal frame 112 is not further limited, so long as the first metal frame 111 and the second metal frame 112 can be separated, that is, the first metal frame 111 and the second metal frame 112 can be insulated.

The connection relationship between the drain lead 140, the gate lead 150, and the source lead 160 of the plastic package module 100 and the metal frame 110 and the chip 120 is described below with reference to the accompanying drawings.

In one possible implementation, at least some of the chips 120 of the at least two chips 120 are separated from the metal frame 110 by the drain leads 140, and one end of the drain leads 140 located in the plastic package 130 is connected to the chips 120 by the bonding wires 171; at least part of the metal frames 110 corresponding to the chips 120 comprise source pins 160, and one ends of the source pins 160 positioned in the plastic package shell 130 are contacted with the side edges of the metal frames 110; at least part of the corresponding gate pins 150 of the chip 120 are separated from the metal frame 110, and one end of the gate pins 150 located in the plastic package 130 is connected with the chip 120.

By placing the source lead 160 at one end in the plastic package 130 in contact with the side of the metal frame 110, the metal frame 110 is electrically conductive, so that the metal frame 110 can be used as a part of the source after the source lead 160 is connected with the metal frame 110, and the purpose of heat dissipation through the source is achieved, and the area of the metal frame 110 is much larger than that of the source lead 160, so that the heat dissipation effect of the power module 100 can be improved. In addition, by setting the first power component 191 to be a structure that dissipates heat through the source, the power module 100 can be applied in different scenarios, and the applicability of the power module 100 is improved.

At least part of the source pins 160 corresponding to at least part of the chips 120 in the at least two chips 120 are separated from the metal frame 110, and one end of the source pins 160 positioned in the plastic package shell 130 is connected with the chips 120 through bonding wires 171; at least part of the metal frames 110 corresponding to the chips 120 comprise drain pins 140, and one ends of the drain pins 140 positioned in the plastic package shell 130 are contacted with the side edges of the metal frames 110; at least part of the corresponding gate leads 150 of the chip 120 are separated from the metal frame 110, and one end of the gate lead 150 located in the plastic package 130 is connected to the chip 120 through a bonding wire 171.

By placing the drain lead 140 at one end in the plastic package 130 in contact with the side edge of the metal frame 110, the metal frame 110 is electrically conductive, so that after the drain lead 140 is connected with the metal frame 110, the metal frame 110 can be used as a part of the drain, thereby achieving the purpose of heat dissipation through the drain, and the area of the metal frame 110 is much larger than that of the drain lead 140, so that the heat dissipation effect of the power assembly can be improved. In addition, the power module can be applied to different scenes by arranging the second power component to be in a structure radiating through the drain electrode, so that the applicability of the power module is improved.

It should be noted that, the power component may dissipate heat through the source and may dissipate heat through the drain, where the power component connected by the source lead and the metal frame is a power component that dissipates heat through the source, and the power component connected by the drain lead and the metal frame is a power component that dissipates heat through the drain. In some embodiments, the power module may include all power components that dissipate heat through the source, all power components that dissipate heat through the drain, or some power components that dissipate heat through the source, and some power components that dissipate heat through the drain, where the power components may be specifically set according to the specific situation.

For example, when the power module 100 includes the first power component 191 and the second power component 192, the first power component 191 and the second power component 192 may both dissipate heat through the source and also through the drain. In still other embodiments, one of the first power component 191 and the second power component 192 dissipates heat through the source and the other of the first power component 191 and the second power component 192 dissipates heat through the drain.

The following description will take the power components of the first power component 191 and the second power component 192, which have the same structure and are all power components with their sources facing downward as examples. The first power component 191 and the second power component 192 have the same shape, wherein the first drain pin 141 of the first power component 191 and the second gate pin 152 of the second power component 192 are disposed adjacent to each other.

As an example, with continued reference to fig. 1 and 2, the first drain lead 141 is disposed at one side of the first metal frame 111 along the x-direction, the first drain lead 141 is separated from the first metal frame 111, and one end of the first drain lead 141 located in the plastic package case 130 is connected to the first chip 121 through the bonding wire 171, and the other end extends out of the plastic package case 130 in a direction away from the first metal frame 111. The second drain lead 142 is disposed at one side of the second metal frame 112 along the x-direction, the second drain lead 142 is separated from the second metal frame 112, and one end of the second drain lead 142 located in the plastic package housing 130 is connected with the second chip 122 through the bonding wire 171, and the other end extends out of the plastic package housing 130 in a direction away from the second metal frame 112.

One end of the first drain lead 141 near the first metal frame 111 is wrapped inside the plastic package housing 130. The end of the first drain lead 141 away from the first metal frame 111 extends out of the plastic package 130. When the power module 100 is packaged, the end of the first drain lead 141 near the first metal frame 111 can be directly packaged in the plastic package housing 130. One end of the second drain lead 142, which is close to the second metal frame 112, is wrapped inside the plastic package housing 130. The end of the second drain lead 142 away from the second metal frame 112 extends out of the plastic package 130. For example, when the power module 100 is packaged, an end of the second drain lead 142 near the second metal frame 112 may be directly packaged in the plastic package 130.

By wrapping the end of the first drain lead 141 near the first metal frame 111 inside the plastic package case 130, a short circuit between the drain and the source can be prevented. The first drain lead 141 is conveniently connected with other devices by extending an end of the first drain lead 141 away from the first metal frame 111 to outside the plastic package case 130. By wrapping the end of the second drain lead 142 near the second metal frame 112 inside the plastic package case 130, a short circuit between the drain and the source can be prevented. The second drain lead 142 is conveniently connected to other devices by extending an end of the second drain lead 142 away from the second metal frame 112 out of the plastic package body 130.

The first metal frame 111 includes a first source lead 161, and one end of the first source lead 161 located in the plastic package case 130 contacts with a side edge of the first metal frame 111, and the other end extends out of the plastic package case 130 in a direction away from the first metal frame 111. For example, the number of the first source pins 161 may be two, and the two first source pins 161 are spaced apart in the y-direction. In some embodiments, the first metal frame 111 and the first source lead 161 may be fixedly connected by welding, riveting, or integrally forming. The connection relationship between the first source lead 161 and the first metal frame 111 is not further limited.

The second metal frame 112 includes a second source lead 162, and one end of the second source lead 162 located in the plastic package body 130 contacts with a side edge of the second metal frame 112, and the other end extends out of the plastic package body 130 in a direction away from the second metal frame 112. For example, the number of the second source pins 162 may be two, and the two second source pins 162 are spaced apart in the y-direction. In some embodiments, the second metal frame 112 and the second source lead 162 may be fixedly connected by welding, riveting, or integrally forming. The connection relationship between the second source lead 162 and the second metal frame 112 is not further limited.

The first gate lead 151 is separated from the first metal frame 111, and one end of the first gate lead 151 located in the plastic package 130 is connected to the first chip 121 through the first gate boss 1512, while the other end extends out of the plastic package 130 in a direction away from the first metal frame 111. By wrapping the end of the first gate lead 151 near the first metal frame 111 inside the plastic package body 130, the first gate lead 151 and the first metal frame 111 can be insulated, so that the insulation between the first gate lead 151 and the first source lead 161 is ensured.

The second gate lead 152 is separated from the second metal frame 112, and one end of the second gate lead 152 located in the plastic package 130 is connected to the second chip 122 through the second gate boss 1522, and the other end extends out of the plastic package 130 in a direction away from the second metal frame 112. By wrapping the end of the second gate lead 152 near the second metal frame 112 inside the plastic package body 130, insulation between the second gate lead 152 and the second metal frame 112 can be provided, and insulation between the second gate lead 152 and the second source lead 162 can be ensured, so that the power module 100 can be used normally.

In one possible implementation, the end of the gate lead 150 near the metal frame 110 may further include a connection portion 1501, where a gap is formed between the connection portion 1501 and the metal frame 110, and a portion of the structure of the plastic package 130 is located in the gap, so as to insulate the gate lead 150 and the metal frame 110 from each other.

By providing insulation between the gate pins 150 and the metal frame 110, insulation between the gate pins 150 and other pins is provided, and short circuits between different pins of the power module can be prevented, so that the power module can be used normally.

In one possible implementation, the metal frame 110 may be provided with a mounting notch 1102, where a projection of the mounting notch 1102 in the thickness direction of the power module overlaps a projection of the chip 120 in the thickness direction of the power module, and the connection portion 1501 of the gate pin 150 is located in the mounting notch 1102.

For example, the mounting notch 1102 may be a rectangular notch formed on a side wall of the metal frame 110 near the gate pin 150, the rectangular notch extending in the x-direction away from the gate pin 150, and a projection of the rectangular notch in the x-direction being greater than a projection of the connection portion 1501 of the gate pin 150 in the x-direction. Of course, in other embodiments, the mounting notch 1102 may have other shapes, and may be specifically determined according to the shape of the connection portion 1501, which is not further described in the embodiments of the present application.

Through set up the installation breach 1102 on metal frame 110 to for the connecting portion 1501 of grid pin 150 provides the setting space, so that this power module is whole to form the cuboid structure of one side area pin, reduces the volume of plastic envelope module, convenient assembly.

As shown in fig. 5, an end of the first gate lead 151 near the first metal frame 111 has a first connection portion 1511, a gap is formed between the first connection portion 1511 and the first metal frame 111, and a part of the plastic package 130 is located in the gap to insulate the first gate lead 151 and the first metal frame 111 from each other. The second gate lead 152 has a second connection portion 1521 near the end of the second metal frame 112, a gap is formed between the second connection portion 1521 and the second metal frame 112, and a part of the structure of the plastic package 130 is located in the gap, so that the second gate lead 152 and the second metal frame 112 are insulated from each other.

For example, the first connection portion 1511 may be welded or integrally formed on the first gate pin 151, and the shape of the first connection portion 1511 is not further limited in the embodiment of the present application, for example, the first connection portion 1511 may have a rectangular parallelepiped structure, a cylindrical structure, or other structures. Similarly, in the embodiment of the present application, the shape of the second connection portion 1521 and the connection manner with the second gate pin 152 are not further limited.

As shown in fig. 6, a first mounting notch 1112 is disposed on one side of the first metal frame 111, a first connection portion 1511 of the first gate pin 151 is disposed in the first mounting notch 1112, and a projection of the first mounting notch 1112 in the z direction overlaps a projection of the first chip 121 in the z direction, where a gap is formed between a sidewall of the first connection portion 1511 of the first gate pin 151 and a sidewall opposite to the first mounting notch 1112. A second mounting notch 1122 is disposed on one side of the second metal frame 112, the second connection portion 1521 of the second gate pin 152 is disposed in the second mounting notch 1122, and a projection of the second mounting notch 1122 in the z direction coincides with a projection of the second chip 122 in the z direction, wherein a gap is formed between a sidewall of the second connection portion 1521 of the second gate pin 152 and a sidewall opposite to the second mounting notch 1122.

In an embodiment of the present application, the second mounting notch 1122 may be located at an end of the second metal frame 112 near the first metal frame 111, and of course, in other embodiments, the second mounting notch 1122 may be located at other positions, for example, the second mounting notch 1122 may be located at an end of the second metal frame 112 far from the first metal frame 111.

Illustratively, one side of the first metal frame 111 in the y-direction is provided with a first mounting notch 1112, and the dimension of the first mounting notch 1112 in the x-direction is smaller than the dimension of the first metal frame 111 in the x-direction. In the x direction, a gap b is provided between a sidewall of the first connection portion 1511 of the first gate pin 151 and a sidewall of the first mounting recess 1112 opposite to the sidewall. In the y direction, a gap a is provided between a sidewall of the first connection portion 1511 of the first gate pin 151 and a sidewall of the first mounting recess 1112 opposite to the sidewall.

A second mounting notch 1122 is provided on a side of the second metal frame 112 adjacent to the first metal frame 111 in the y-direction, and the size of the second mounting notch 1122 in the x-direction is smaller than the size of the second metal frame 112 in the x-direction. In the x direction, a gap d is provided between a sidewall of the second connection portion 1521 of the second gate pin 152 and a sidewall of the second mounting recess 1122 opposite to the sidewall. In the y-direction, a gap c is provided between a sidewall of the second connection portion 1521 of the second gate pin 152 and a sidewall of the second mounting recess 1122 opposite to the sidewall.

The values of the gap a, the gap b, the gap c, and the gap d may be the same or different, and in the embodiment of the present application, the numerical relationship of the gap a, the gap b, the gap c, and the gap d is not limited.

With continued reference to fig. 1, after the first power component 191 and the second power component 192 are packaged, the first connection portion 1511 of the first gate pin 151, the first metal frame 111, the plastic package case 130, the second connection portion 1521 of the second gate pin 152, the second metal frame 112, and the plastic package case 130 together form a rectangular parallelepiped structure. The whole power module 100 has a structure in which one end is a cuboid structure and the other end is provided with a plurality of pins.

In the embodiment of the present application, the dimensions of the first mounting notch 1112 and the second mounting notch 1122 are not further limited. The dimensions of the gaps a, b, c, and d are not limited, and may be specifically set according to the powers of the first power component 191 and the second power component 192, for example, the first power component 191 may be set to have a larger size of the gaps a and b, the first power component 191 may be set to have a smaller size of the gaps a and b. The dimensions of the gaps a, b, c, d are determined according to the power of the first and second power components 191, 192, and are not further described in the embodiments of the present application.

In one possible implementation, as shown in fig. 7, in the thickness direction of the power module, the thickness of the connection portion 1501 is smaller than the thickness of the metal frame 110.

In one possible implementation, in the thickness direction of the power module, one side of the connection portion 1501 is in electrical contact with the chip 120, and a side of the connection portion 1501 facing away from the chip 120 is provided with a part of the structure of the plastic package case 130.

By setting the thickness of the connection portion 1501 to be smaller than the thickness of the metal frame 110, a space can be reserved for the plastic package case 130 located on the side of the connection portion 1501 away from the chip 120, and the side of the plastic package case 130 located on the connection portion 1501 of the gate pin 150 away from the chip 120 can be flush with the side of the metal frame 110 away from the chip 120 for subsequent assembly with other devices. By covering the part of the structure of the plastic package housing 130 on the surface of the connection portion 1501 away from the chip 120, the connection portion 1501 can be wrapped inside the plastic package housing 130, so as to prevent the power module 100 from shorting between the source and the gate of the power module when the power module is connected to the heat sink.

Illustratively, a side of the first connection portion 1511 of the first gate pin 151 facing the first chip 121 may be in electrical contact with the first chip 121 in the z-direction. Referring to fig. 7, the thickness H of the first connection portion 1511 of the first gate pin 151 is smaller than the thickness H of the first metal frame 111. The part of the structure of the plastic package 130 covers a surface of the first connection portion 1511 of the first gate pin 151, which is away from the first chip 121.

Likewise, in the z-direction, a side of the second connection portion 1521 of the second gate pin 152 facing the second chip 122 may be in electrical contact with the second chip 122. The thickness N of the second connection portion 1521 of the second gate pin 152 is smaller than the thickness N of the second metal frame 112. The part of the structure of the plastic package 130 covers a surface of the second connection portion 1521 of the second gate pin 152, which faces away from the second chip 122.

By setting the thickness of the first connection portion 1511 of the first gate pin 151 to be smaller than the thickness of the first metal frame 111, a space can be reserved for the plastic package housing 130 located on the side of the first connection portion 1511 facing away from the first chip 121, so as to ensure that the first surface of the plastic package housing 130 is flush with the side of the first metal frame 111 facing away from the first chip 121 for subsequent assembly with other devices. By covering a part of the structure of the plastic package body 130 on the surface of the first connection portion 1511 facing away from the first chip 121, the first connection portion 1511 can be wrapped inside the plastic package body 130, so as to prevent a short circuit between the source and the gate of the first power component 191 when the power module 100 is connected with the heat sink.

Similarly, by setting the thickness of the second connection portion 1521 of the second gate pin 152 to be smaller than the thickness of the second metal frame 112, a space can be reserved for the plastic package housing 130 located on the side of the second connection portion 1521 facing away from the second chip 122, so as to ensure that the first surface of the plastic package housing 130 is flush with the side of the second metal frame 112 facing away from the second chip 122, so as to facilitate subsequent assembly with other devices. By covering a part of the structure of the plastic package housing 130 on a surface of the second connection portion 1521 facing away from the second chip 122, the second connection portion 1521 can be wrapped inside the plastic package housing 130, so as to prevent a short circuit between the source and the gate of the second power component 192 when the power module 100 is connected with the heat sink.

Fig. 2 shows only one structure of the first gate lead 151, the first metal frame 111, the second gate lead 152, and the second metal frame 112, and in other embodiments, the shapes of the first gate lead 151, the first metal frame 111, the second gate lead 152, and the second metal frame 112 may be other shapes.

As an example, as shown in fig. 8, the first gate lead 151 may have an elongated lead structure, and the first gate lead 151 may be located at a side of the first metal frame 111 where the first source lead 161 is located, and may be spaced apart from a side of the first metal frame 111 facing the first source lead 161, and the first gate lead 151 and the first chip 121 may be connected by a bonding wire 171. The second gate lead 152 may be an elongated lead structure, and the second gate lead 152 may be located on a side of the second metal frame 112 where the second source lead 162 is located, and separately located from a side of the second metal frame 112 facing the second source lead 162, where the second gate lead 152 and the second chip 122 may be connected by a bonding wire 171.

It should be noted that, in the embodiment shown in fig. 8, the first metal frame 111 and the second metal frame 112 are formed as a single structure, and in other embodiments, the first metal frame 111 and the second metal frame 112 may be formed as separate structures.

As shown in fig. 9, the first metal frame 111 and the second metal frame 112 may also be a split structure, with a spacer 180 between the first metal frame 111 and the second metal frame 112, and the through hole structure 170 penetrating the spacer. The first connection portion 1511 of the first gate lead 151 is located at one side of the first metal frame 111 in the y direction, the length of the first connection portion 1511 in the x direction is equal to the length of the first metal frame 111 in the x direction, and a gap is provided between the first connection portion 1511 of the first gate lead 151 and the first metal frame 111 in the y direction, and a portion of the plastic package case 130 (not shown) may be disposed in the gap.

The second connection portion 1521 of the second gate lead 152 is located at one side of the second metal frame 112 in the y-direction, and the length of the second wheel connection portion 1501 in the x-direction is the same as the length of the second metal frame 112 in the x-direction, and in the y-direction, there is a gap between the second connection portion 1521 of the second gate lead 152 and the second metal frame 112, and a portion of the plastic package case 130 (not shown) may be disposed in the gap.

In the above embodiments, the first power component 191 and the second power component 192 have the same structure. In some embodiments, the first power component 191 and the second power component 192 may also be configured differently, and illustratively, the configuration of the first connection portion 1511 of the first gate pin 151 and the configuration of the second connection portion 1521 of the second gate pin 152 may be configured differently, or the size of the first mounting notch 1112 of the first power component 191 and the second mounting notch 1122 of the second power component 192 may be configured differently.

With continued reference to fig. 1, a bonding wire 171 is disposed between the first drain lead 141 and the first chip 121, and one end of the bonding wire 171 is connected to the first chip 121 and the other end is connected to the first drain lead 141. For example, the bonding wire 171 may be connected to the first chip 121 and the first metal frame 111 by soldering. Of course, in other embodiments, the first drain pin 141 and the first chip 121 may be connected by other manners, and in embodiments of the present application, the connection manner between the first drain pin 141 and the first chip 121 is not further limited.

Similarly, a bonding wire 171 is also disposed between the second drain lead 142 and the second chip 122, and one end of the bonding wire 171 is connected to the second chip 122, and the other end is connected to the second drain lead 142. For example, the bonding wire 171 may be connected to the second chip 122 and the second metal frame 112 by soldering. Of course, in other embodiments, the second drain pin 142 and the second chip 122 may be connected by other manners, and in embodiments of the present application, the connection manner between the second drain pin 142 and the second chip 122 is not further limited.

In the embodiment of the present application, the first chip 121 and the first drain lead 141 may be conveniently connected by providing the bonding wire 171. It may also be convenient to connect the second chip 122 to the second drain pin 142.

The shapes of the gate lead 150 and the drain lead 140 in the above embodiments are different, and it is understood that in some embodiments, the shapes of the first gate lead 151 and the first drain lead 141 may be set to be the same, for example, in some embodiments, the shape of the first gate lead 151 shown in fig. 2 in which the shape of the first drain lead 141 is set may be the same, and in other embodiments, the shape of the first gate lead 151 and the shape of the first drain lead 141 may be set to be the same, as shown in fig. 8. Therefore, in the embodiment of the present application, the shape of the first drain lead 141 and the shape of the second drain lead 142 are not further limited, and may be set according to the specific situation.

In some embodiments, with continued reference to fig. 7, the side of the first metal frame 111 facing away from the first chip 121, the side of the second metal frame 112 facing away from the second chip 122, and the first surface of the plastic package housing 130 may be flush in the z-direction.

Through the mutual parallel and level of the first surface of the power module 100 that is set on the surface of the first metal frame 111 facing away from the first chip 121, the surface of the second metal frame 112 facing away from the second chip 122, and the first surface of the plastic package housing 130, the first surface of the power module 100 is a plane, so that the assembly is convenient when in use. In addition, when the radiator is connected, the exposed surfaces of the first metal frame 111 and the second metal frame 112 can be bonded with the radiator, so that the heat dissipation effect of each position of the power module 100 is guaranteed to be in a good state.

In the embodiment of the present application, the first source lead 161 is electrically connected to the metal frame 111, and since the first metal frame 111 is also of a conductive structure, after the first source lead 161 is electrically connected to the first metal frame 111, the first metal frame 111 can be made to serve as a part of the source, and thus the purpose of heat dissipation through the source is achieved, and since the area of the first metal frame 111 is significantly larger than that of the source lead, the heat dissipation effect of the first power component 191 can be improved. In addition, by setting the first power component 191 to be a structure that dissipates heat through the source, the power module 100 can be applied in different scenarios, and the applicability of the power module 100 is improved.

Similarly, by electrically connecting the second source lead 162 to the second metal frame 112, since the second metal frame 112 is also electrically conductive, after the second source lead 162 is electrically connected to the second metal frame 112, the second metal frame 112 can be made to serve as a part of the source, and the purpose of heat dissipation through the source can be achieved, and since the area of the second metal frame 112 is significantly larger than the source lead, the heat dissipation effect of the second power component 192 can be improved. In addition, by setting the second power component 192 to be a structure that dissipates heat through the source, the power module 100 can be applied in different scenarios, and the applicability of the power module 100 is improved.

In one possible implementation, the power module 100 further includes a gate boss; the gate boss is disposed between the connection portion 1501 of the gate lead 150 and the chip 120, and one end of the gate boss, which is close to the chip 120, is higher than one surface of the connection portion 1501 of the gate lead 150, which is close to the chip 120, and is used for connecting the connection portion 1501 of the gate lead 150 and the chip 120.

Through set up the grid boss between connecting portion 1501 of grid pin 150 and chip 120, can be at certain distance between connecting portion 1501 and the chip 120, can increase the processing space between connecting portion 1501 and the chip 120 like this to connect connecting portion 1501 and chip 120, reduce the connection degree of difficulty between chip 120 and the connecting portion 1501, and then reduce cost.

In one possible implementation, the power module 100 further includes a metal frame boss; wherein, the metal frame boss is located between the metal frame 110 and the chip 120, one end of the metal frame boss, which is close to the chip 120, is higher than one surface of the metal frame, which is close to the chip 120, and the metal frame boss is used for connecting the metal frame 110 and the chip 120.

Through setting up the metal frame boss, can be with certain distance between metal frame 110 and the chip 120, when connecting chip 120 and metal frame 110 like this, can increase the processing space, conveniently connect chip 120 and metal frame 110, can reduce the processing degree of difficulty, and then reduce cost.

In one possible implementation, the gate bosses and the metal frame bosses corresponding to the same chip 120 have the same height in the thickness direction of the power module 100.

Through the same height setting of the grid boss and the metal frame boss corresponding to the same chip 120, one surface of the chip 120 deviating from the metal frame 110 is parallel to the metal frame 110, so that stress at the connection part of the chip 120 and the metal frame 110 and the connection part of the chip 120 and the grid pin 150 is uniform, and further, the risk of cracking at the connection position between the chip 120 and the metal frame 110 or the grid pin 150 can be prevented, so that the service life of the power module 100 is prolonged.

As an example, with continued reference to fig. 2 and 7, the first power component 191 includes a first gate boss 1512 and a first metal frame boss 1111.

The first gate boss 1512 is disposed between the first connection portion 1511 of the first gate pin 151 and the first chip 121, one end of the first gate boss 1512 is connected to the first chip 121, the other end is connected to the first connection portion 1511 of the first gate pin 151, and one end of the first gate boss 1512, which is close to the first chip 121, is higher than one surface of the first connection portion 1511, which is close to the first chip 121.

The first metal frame boss 1111 is disposed between the first metal frame 111 and the first chip 121, one end of the first metal frame boss 1111 is connected to the first metal frame 111, the other end is connected to the first chip 121, and one end of the first metal frame boss 1111, which is close to the first chip 121, is higher than one surface of the first metal frame 111, which is close to the first chip 121.

Illustratively, the first gate boss 1512 and the first metal frame boss 1111 are both conductive structures, e.g., the first gate boss 1512 and the first metal frame boss 1111 may be pads.

Through setting up first metal frame boss 1111 and first grid boss 1512, can be with certain distance of interval between first chip 121 and the first metal frame 111 to increased the assembly space, conveniently connected first chip 121 and first grid pin 151 and first metal frame 111, reduce the processing degree of difficulty, and then reduce cost.

Likewise, the second power component 192 includes a second metal frame boss 1121 and a second gate boss 1522.

The second metal frame boss 1121 is disposed between the second metal frame 112 and the second chip 122, and one end of the second metal frame boss 1121 is connected to the second metal frame 112, and the other end is connected to the second chip 122. And one end of the second metal frame boss 1121, which is close to the second chip 122, is higher than one surface of the second metal frame 112, which is close to the second chip 122.

The second gate boss 1522 is disposed between the second chip 122 and the second connection portion 1521 of the second gate lead 152, one end of the second gate boss 1522 is connected to the second gate lead 152, the other end is connected to the second chip 122, and one end of the second metal frame boss 1121, which is close to the second chip 122, is higher than one surface of the second metal frame 112, which is close to the second chip 122.

Illustratively, the second gate mesa 1522 and the second metal frame mesa 1121 are both conductive structures, e.g., the second gate mesa 1522 and the second metal frame mesa 1121 are both pads.

Through setting up second metal frame boss 1121, can be with certain distance between second chip 122 and the second metal frame 112, and then increased the assembly space, conveniently be connected second chip 122 and second metal frame 112 and second grid pin 152, reduce the processing degree of difficulty, and then reduce cost.

Wherein, in the z-direction, the first gate boss 1512 and the first metal frame boss 1111 have the same thickness, and the second gate boss 1522 and the second metal frame boss 1121 have the same thickness.

By setting the thicknesses of the first gate boss 1512 and the first metal frame boss 1111 to be the same, the first chip 121 can be located on a horizontal plane, so that the connection positions of the first chip 121 and the first metal frame 111 and the first gate pins 151 are stressed uniformly, and further, a crack gap formed at the connection position between the first chip 121 and the first metal frame 111 or the first gate pins 151 can be prevented, thereby prolonging the service life of the power module 100.

By setting the thicknesses of the second gate boss 1522 and the second metal frame boss 1121 to be the same, the second chip 122 can be located on a horizontal plane, so that the connection position of the second chip 122 and the second metal frame 112 as well as the second gate pin 152 can be stressed uniformly, and further, a crack can be prevented from occurring at the connection position between the second chip 122 and the second metal frame 112 or the second gate pin 152, thereby prolonging the service life of the power module 100.

In some embodiments, the thicknesses of the first gate boss 1512, the first metal frame boss 1111, the second gate boss 1522, and the second metal frame boss 1121 in the z-direction may be set to be the same, which may facilitate the processing. Of course, in other embodiments, the thicknesses of the first gate boss 1512, the first metal frame boss 1111, the second gate boss 1522 and the second metal frame boss 1121 in the z direction may be set differently, and the thicknesses of the first gate boss 1512, the first metal frame boss 1111, the second gate boss 1522 and the second metal frame boss 1121 are not further limited in the embodiments of the present application.

In the embodiment of the present application, the shapes of the gate boss and the metal frame boss are not limited, and the gate boss is exemplified by a cylindrical structure, a triangular prism structure or a quadrangular prism structure; the metal frame boss is of a cylindrical structure, a triangular prism-shaped structure or a quadrangular prism-shaped structure.

For example, referring to fig. 2 and 10, the first gate boss 1512, the first metal frame boss 1111, the second gate boss 1522, and the second metal frame boss 1121 may each be a quadrangular prism structure, and in other embodiments, as shown in fig. 11, the first gate boss 1512, the first metal frame boss 1111, the second gate boss 1522, and the second metal frame boss 1121 may also be cylindrical structures, although in other embodiments, the first gate boss 1512, the first metal frame boss 1111, the second gate boss 1522, and the second metal frame boss 1121 may also be triangular prism structures, or the like.

In one possible implementation, the power module 100 further includes a temperature measurement terminal 193; one end of the temperature measuring terminal 193 is located inside the plastic package housing 130, and the other end extends in a direction away from the plastic package housing 130; an extension line of the temperature measurement terminal 193 in a first direction passes through the through hole structure, wherein the first direction is a length direction of the temperature measurement terminal 193, and the first direction is an x direction in the figure.

In some embodiments, the temperature measuring terminal 193 may have a long bar-shaped structure, and the temperature measuring terminal 193 may include a plurality of temperature measuring terminals, and the specific number of the temperature measuring terminals 193 is not limited.

By providing the temperature measuring terminal 193 on the power module, the temperature of the power module can be measured in real time, with respect to later maintenance.

For example, the temperature measuring terminal 193 may be disposed between the first power component 191 and the second power component 192. In the above embodiment, the first power component 191 and the second power component 192 are both configured to dissipate heat through the source, and are suitable for use in a power conversion device having a bridge circuit with a cross bridge. Of course, in other embodiments, the first power component 191 and the second power component 192 may have other structures. For example, the first power component 191 is a power component that dissipates heat through the drain, and the second power component 192 is a power component that dissipates heat through the source.

The structure of the first power component 191 and the second power component 192 in the power module 100 will be described with reference to the accompanying drawings.

As shown in fig. 12, the power module 100 includes a first power component 191 and a second power component 192, where the first power component 191 and the second power component 192 are tiled along the y direction.

The structure of the first power component 191 may be the same as the embodiment of fig. 1, except that the connection relationship between the first drain lead 141 and the first source lead 161 and the first metal frame 111 and the first chip 121 is different. The connection relationship between the first drain lead 141 and the first source lead 161 and the first metal frame 111 and the first chip 121 is described below with reference to the drawings.

As shown in fig. 12, the first metal frame 111 of the first power component 191 includes a first drain lead 141, and one end of the first drain lead 141 located in the plastic package housing 130 contacts with a sidewall of the first metal frame 111, and the other end extends out of the plastic package housing 130 in a direction away from the first metal frame 111. One end of the first source lead 161 located in the plastic package body 130 is separated from the first metal frame 111, and one end of the first source lead 161 located in the plastic package body 130 is connected with the first chip 121 through a bonding wire 171, and the other end extends out of the plastic package body 130 in a direction away from the first metal frame 111. The first gate lead 151 is separated from the first metal frame 111, one end of the first gate lead 151 located in the plastic package 130 is connected to the first chip 121 through a bonding wire 171, and the other end extends out of the plastic package 130 in a direction away from the first metal frame 111.

Wherein, the surface of the first metal frame 111 facing away from the first chip 121 and the surface of the second metal frame 112 facing away from the first chip 121 are located on the same plane.

In the embodiment of the present application, the first drain lead 141 in the first power component 191 may be fixedly connected to the first metal frame 111 by welding, integrally forming, or the like. A first metal frame boss 1111 may be disposed between the first metal frame 111 and the first chip 121, and one end of the first metal frame boss 1111 is connected to the first metal frame 111 and the other end is connected to the first chip 121. The shape of the first metal frame boss 1111 may be referred to as a structure shown in fig. 2, and will not be described in detail in the embodiment of the present application. Of course, in other embodiments, the first metal frame 111 and the first chip 121 may be connected by other manners, and in the embodiments of the present application, the connection manner between the first metal frame 111 and the first chip 121 is not further limited.

In the embodiment of the present application, the first source lead 161, the first drain lead 141 and the first gate lead 151 are all elongated lead structures. Of course, in other embodiments, the first source lead 161, the first drain lead 141 and the first gate lead 151 may have other structures, for example, the structures of the first gate lead 151 and the first metal frame 111 may be the same as those of the first gate lead 151 and the first metal frame 111 in fig. 2.

It should be noted that, the structure of the second power component 192 is the same as that of the embodiment in fig. 1, and the specific structure may refer to the description of the second power component 192 in fig. 1, which is not repeated in the embodiment of the present application.

In the embodiment of the present application, as shown in fig. 13, fig. 13 is a schematic structural diagram of an exposed surface of the first metal frame 111 and the second metal frame 112 of the power module 100. The first metal frame 111 and the second metal frame 112 may be in a unitary structure, and a through hole structure 170 may be disposed between the first power component 191 and the second power component 192, so that the power module 100 may be connected with other devices, for example, to a circuit board.

It should be noted that, in the power module 100 shown in fig. 13, since the first drain lead 141 is connected to the first metal frame 111, the second source lead 162 is connected to the second metal frame 112, and the first metal frame 111 and the second metal frame 112 are in an integral structure, that is, the first drain lead 141 and the second source lead 162 are connected to each other, in some embodiments, the first drain lead 141 and the second source lead 162 may be made into one lead, which may save costs.

According to the power module 100 provided by the embodiment of the application, the first metal frame 111 and the second metal frame 112 are arranged into the integrated structure, so that the processing is convenient, the heat dissipation area can be increased, the thermal resistance from the power module 100 to a radiator is reduced, and the power module 100 can be suitable for a power conversion device with a circuit being a bridge circuit with a vertical bridge.

In other embodiments, the first metal frame 111 and the second metal frame 112 may be provided as a split structure, as shown in fig. 14, where a spacer 180 is provided between the first metal frame 111 and the second metal frame 112, a part of the plastic package case 130 is provided in the spacer 180, and a through hole structure 170 is also provided between the first power component 191 and the second power component 192.

The power module 100 in fig. 14 has no electrical connection between the first power component 191 and the second power component 192, and is suitable for use in circuits of various power conversion devices. That is, by changing the connection relationship between the first metal frame 111 and the second metal frame 112, the applicable scenario of the power module 100 can be increased.

However, in other embodiments, the first drain lead 141 of the first power device 191 and the second gate lead 152 of the second power device 192 may be disposed adjacent to each other, and in embodiments of the present application, the disposition positions of the first drain lead 141, the first gate lead 151, and the first source lead 161 of the first power device 191 are not further limited. It is understood that the number of the first gate pins 151, the first drain pins 141, the second gate pins 152, and the second drain pins 142 is not limited in the embodiment of the present application as in the embodiment shown in fig. 1.

In other embodiments, both the first power component 191 and the second power component 192 may also be configured as power components that dissipate heat through the drain.

As shown in fig. 15, the first metal frame 111 of the first power component 191 includes a first drain lead 141, and one end of the first drain lead 141 located in the plastic package housing 130 contacts with a sidewall of the first metal frame 111, and the other end extends out of the plastic package housing 130 in a direction away from the first metal frame 111. One end of the first source lead 161 located in the plastic package body 130 is separated from the first metal frame 111, and one end of the first source lead 161 located in the plastic package body 130 is connected with the first chip 121 through a bonding wire 171, and the other end extends out of the plastic package body 130 in a direction away from the first metal frame 111. The first gate lead 151 is separated from the first metal frame 111, one end of the first gate lead 151 located in the plastic package 130 is connected to the first chip 121 through a bonding wire 171, and the other end extends out of the plastic package 130 in a direction away from the first metal frame 111.

The first power component 191 and the second power component 192 have the same structure, and the second power component 192 may be referred to the description of the first power component 191 herein, which is not repeated in the embodiment of the present application.

As shown in fig. 16, a spacer 180 is disposed between the first metal frame 111 and the second metal frame 112, a part of plastic package housing 130 is disposed in the spacer 180, and a through hole structure 170 is also disposed between the first power component 191 and the second power component 192, so that the power module 100 can be conveniently connected with a circuit board, and no electrical connection exists between the first power component 191 and the second power component 192 in the power module 100, which can be suitable for circuits of different power conversion devices.

Of course, in other embodiments, electrical connections may be made between pins of the first power component 191 and the second power component 192, and then in circuits used in different power conversion devices. For example, one of the first source pins 161 of the first power component 191 and the second drain pin 142 of the second power component 192 may be electrically connected (not shown), which may make the power module 100 suitable for use in a power conversion device having a bridge circuit with a vertical bridge.

In the embodiment of the present application, the connection manner between one of the first source pins 161 of the first power device 191 and the second drain pin 142 of the second power device 192 is not further limited, so long as the connection can be insulated from the first gate pin 151 and the second gate pin 152, respectively.

In other embodiments, an electrical connection (not shown) between one of the first source pins 161 of the first power component 191 and one of the second source pins 162 of the second power component 192 may also be provided, which may make the power module 100 suitable for use in a power conversion device having a bridge circuit with a cross bridge.

In other embodiments, the first gate lead 151, the first source lead 161, the first drain lead 141, the second gate lead 152, the second source lead 162, and the second drain lead 142 may be further adjusted for subsequent connection in a circuit, which is not further limited in the embodiments of the present application.

The power module 100 provided in the embodiment of the application is suitable for power conversion equipment such as an inverter, an uninterruptible power supply (uninterruptible power system, UPS), a rectifier module, a charging module, a vehicle-mounted field and the like. The power module can be applied to photovoltaic inverters, energy storage converters, data center UPS, charging station modules, intelligent electric power modules and the like. In addition, the power MOS device can be used for series-parallel combination of power MOS devices, and can be expanded for mutual combination and integration of power MOS devices, high-power diodes, IGBT devices and other power devices, so that the design of a circuit of the power conversion device is simplified.

It should be noted that, in some cases, two power components in the power module of the embodiment of the present application may be used separately, in which case the arrangement may include only one power component, for example, only the first power component 191 shown in fig. 2, or only the first power component 191 shown in fig. 12. The first power device 191 in fig. 2 is a power device that dissipates heat through the source, and the first power device 191 in fig. 12 is a power device that dissipates heat through the drain.

In some examples, an embodiment of the present application provides a power conversion apparatus 1000, where the power conversion apparatus 1000 is provided with the power module 100 described above. As shown in fig. 17, the power conversion device 1000 further includes a circuit board 300 and a heat sink 400, wherein the power module 100 is disposed on the circuit board 300, the heat sink 400 is connected to the power module 100, and the heat sink 400 is used for dissipating heat of the power module 100.

Illustratively, the exposed surface of the metal frame 110 of the power module 100 is connected to the heat sink 400, the exposed surface of the power module 100 facing away from the metal frame 110 is connected to the circuit board 300, and the circuit board 300 is connected to the through hole structure 170 of the power module 100 by the screws 500.

According to the power conversion device provided by the embodiment of the application, the power module of the first aspect is arranged, so that the structure can be simplified, the assembly difficulty can be reduced, and compared with the technical scheme that the power assembly is fixed through the mounting seat in the related art, the technical scheme of the application can reduce the cost.

In some embodiments, the power conversion device may be an inverter, which may be a photovoltaic inverter, for example, although other devices, such as an energy storage converter, a rectifier, etc., may be used in other embodiments.

As shown in fig. 18, fig. 18 is a circuit schematic of a photovoltaic inverter. The circuit diagram is an exemplary T-type three-level inverter topology, and the circuit 200 can obtain three-phase ac output through dc input. The circuit 200 includes a half-bridge arm 210 (vertical bridge) and a neutral-point-clamped bridge arm 220 (horizontal bridge), where the half-bridge arm 210 and the neutral-point-clamped bridge arm 220 are formed by combining a plurality of power devices in series and parallel, respectively.

The power module 100 provided in the embodiment of the present application may be used in both the vertical bridge and the horizontal bridge in the circuit 200. By providing the power module 100, the circuit 200 of the photovoltaic inverter can be simpler, and the cost of the photovoltaic inverter can be reduced.

Note that the right side in fig. 18 represents the dc input terminal, and the input circuit 200 is denoted as u _dc The input circuit 200 is i _dc And C1 and C2 are two capacitors, three parallel inductors L1, L2 and L3 are arranged on the left side, each inductor is respectively connected with one resistor, wherein the inductor L1 is connected with the resistor R1, the inductor L2 is connected with the resistor R2, and the inductor L3 is connected with the resistor R3.

The structure of the power module 100 shown in fig. 1 provided by the present application, or the structure of the power module 100 shown in fig. 15 and 16, may be applied in the bridge of fig. 18, for example. The power module 100 structure shown in fig. 12 may be applied in the vertical bridge in fig. 18. Of course, in other embodiments, other power modules 100 may be selected. And will not be further described in the examples of the present application.

The circuit in fig. 18 is only used to illustrate that the power module according to the embodiment of the present application can be applied to the circuit of the inverter, and the specific principle of the circuit is not further described.

It should be noted that, the power conversion device provided in the embodiment of the present application includes, but is not limited to, an inverter, and may be other devices, and in the embodiment of the present application, the power conversion device is not further limited.

It should be understood that "electrically connected" in the present application may be understood as that components are in physical contact and electrically conducted, and may be understood as that different components in a circuit configuration are connected by physical circuits such as copper foils or wires of a printed circuit board (printed circuit board, PCB) that can transmit electrical signals. "fixed electrical connection" is understood to mean a physical fixed connection between components and may be electrically conductive.

In describing embodiments of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "coupled" may refer to a mechanical or physical connection, for example, whether fixedly, indirectly, through intermediaries, or in communication with one another or in interaction with one another. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to specific circumstances. That is, a and B are connected or a and B are connected may mean that there is a fastening member (such as a screw, a bolt, a rivet, etc.) between a and B, or a and B are in contact with each other and a and B are difficult to be separated. Relative/relative settings: the opposite arrangement of a and B may refer to an opposite to (or face to face) arrangement of a and B.

The terms first, second, third, fourth and the like in the description and in the claims and in the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Claims

1. The power module is characterized by comprising a metal frame, at least two chips, a plastic package shell and a through hole structure; wherein,

The at least two chips are arranged on the metal frame, the plastic package shell is enclosed on the metal frame and the outer sides of the at least two chips, and one surface of the metal frame, which is away from the chips, is exposed out of the plastic package shell;

one surface of the plastic package shell, which is exposed out of the metal frame, is a first surface of the plastic package shell, the first surface of the plastic package shell is flush with one surface of the metal frame, which is away from the chip, and the first surface of the plastic package shell is used for being connected with a radiator;

the second surface of the plastic package shell is used for being connected with the circuit board, and the second surface of the plastic package shell is deviated from the first surface of the plastic package shell;

the through hole structure penetrates through the plastic package shell along the thickness direction of the power module, and the through hole structure is located between two adjacent chips.

2. The power module of claim 1, wherein at least two metal frames are provided, a spacer is provided between adjacent metal frames, a part of the plastic package casing is provided in the spacer, so that adjacent metal frames are insulated from each other, and the through hole structure penetrates through the spacer.

3. The power module of claim 1 or 2, further comprising a drain pin, a gate pin, and a source pin; wherein,

the drain electrode pin, the gate electrode pin and the source electrode pin are all arranged on the same side of the power module;

one ends of the drain electrode pin, the gate electrode pin and the source electrode pin are all positioned in the plastic package shell, and the other ends of the drain electrode pin, the gate electrode pin and the source electrode pin extend out of the plastic package shell in a direction away from the plastic package shell.

4. A power module according to claim 3, wherein each of said chips corresponds to at least one of said drain leads, at least one of said source leads and one of said gate leads.

5. The power module of claim 3 or 4, wherein at least some of the chips are separated from the metal frame by the drain leads, and one end of the drain leads in the plastic package is connected to the chips by bonding wires;

the metal frame corresponding to at least part of the chips comprises the source pins, and one end of the source pins, which is positioned in the plastic package shell, is contacted with the side edge of the metal frame;

And the grid pins corresponding to at least part of the chips are separated from the metal frame, and one end of the grid pins in the plastic package shell is connected with the chips.

6. The power module of any one of claims 3-5, wherein at least some of the source leads of the chips are separated from the metal frame, and one end of the source leads within the plastic package is connected to the chips by bonding wires;

the metal frame corresponding to at least part of the chips comprises the drain electrode pins, and one end of the drain electrode pins, which is positioned in the plastic package shell, is contacted with the side edge of the metal frame;

and the grid pins corresponding to at least part of the chips are separated from the metal frame, and one end of the grid pins positioned in the plastic package shell is connected with the chips through bonding wires.

7. The power module of any one of claims 3-6, wherein an end of the gate pin adjacent to the metal frame includes a connection portion, a gap is provided between the connection portion and the metal frame, and a portion of the plastic package housing is positioned in the gap to insulate the gate pin and the metal frame from each other.

8. The power module of claim 7, wherein the metal frame is provided with a mounting notch, a projection of the mounting notch in a thickness direction of the power module overlaps a projection of the chip in the thickness direction of the power module, and the connection portion of the gate pin is located in the mounting notch.

9. The power module according to claim 7 or 8, wherein a thickness of the connection portion is smaller than a thickness of the metal frame in a thickness direction of the power module.

10. The power module according to any one of claims 7-9, characterized in that in the thickness direction of the power module one side of the connection is in electrical contact with the chip and one side of the connection facing away from the chip is provided with a partial structure of the plastic package housing.

11. The power module of any one of claims 7-10, further comprising a gate boss; wherein,

the grid lug boss is arranged between the connecting part of the grid pin and the chip, one end of the grid lug boss, which is close to the chip, is higher than one surface of the connecting part of the grid pin, which is close to the chip, and the grid lug boss is used for connecting the connecting part of the grid pin and the chip.

12. The power module of claim 11, further comprising a metal frame boss; wherein,

the metal frame boss is located between the metal frame and the chip, one end of the metal frame boss, which is close to the chip, is higher than one surface of the metal frame, which is close to the chip, and the metal frame boss is used for connecting the metal frame and the chip.

13. The power module of claim 12, wherein the gate bosses and the metal frame bosses corresponding to the same chip have the same height in the thickness direction of the power module.

14. The power module of any one of claims 11-13, wherein the gate bosses are cylindrical, triangular prism, or quadrangular prism;

the metal frame boss is of a cylindrical structure, a triangular prism-shaped structure or a quadrangular prism-shaped structure.

15. The power module of any one of claims 1-14, further comprising a temperature measurement terminal; wherein,

one end of the temperature measuring terminal is positioned in the plastic package shell, and the other end extends in a direction away from the plastic package shell; and an extension line of the temperature measuring terminal in a first direction passes through the through hole structure, and the first direction is the length direction of the temperature measuring terminal.

16. The power conversion device is characterized by comprising the power module, a circuit board and a radiator according to any one of claims 1-15, wherein the power module is arranged on the circuit board, the radiator is connected with the power module, and the radiator is used for radiating heat for the power module.