CN116818504A - Test equipment for semiconductor laser chip - Google Patents
Test equipment for semiconductor laser chip Download PDFInfo
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- CN116818504A CN116818504A CN202311085452.XA CN202311085452A CN116818504A CN 116818504 A CN116818504 A CN 116818504A CN 202311085452 A CN202311085452 A CN 202311085452A CN 116818504 A CN116818504 A CN 116818504A
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- 238000012360 testing method Methods 0.000 title claims abstract description 104
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 55
- 230000007306 turnover Effects 0.000 claims abstract description 17
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 230000007723 transport mechanism Effects 0.000 claims description 5
- 230000009471 action Effects 0.000 description 19
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/82—Rotary or reciprocating members for direct action on articles or materials, e.g. pushers, rakes, shovels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
- B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
- G01N3/04—Chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/30—Investigating strength properties of solid materials by application of mechanical stress by applying a single impulsive force, e.g. by falling weight
- G01N3/303—Investigating strength properties of solid materials by application of mechanical stress by applying a single impulsive force, e.g. by falling weight generated only by free-falling weight
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- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a test device of a semiconductor laser chip, which relates to the related field of chip test and comprises a turnover transportation mechanism arranged on a test supporting table, wherein the turnover transportation mechanism consists of a first chip transportation mechanism and a second chip transportation mechanism, the first chip transportation mechanism comprises a first connecting table fixedly arranged on one side of the test supporting table, and the first connecting table is fixedly provided with a first electric push rod in an equidistant arrangement.
Description
Technical Field
The invention relates to the field of chip test, in particular to test equipment of a semiconductor laser chip.
Background
The chip is a general name of a semiconductor element product, the main function of the chip is to complete operation, processing tasks, an integrated circuit packages a circuit onto a small component, the application field of the chip is very wide, the quantity of requirements is very huge, and due to the importance of the chip in the device, the chip needs to be tested layer by layer, related values are detected, the chip often needs to be packaged to protect the chip because the bare chip is too fragile, meanwhile, pins are required to be left outside a packaging shell to facilitate the access of a subsequent chip, the chip also needs to be tested after the packaging is completed, the chip and the pins are easy to damage in the transportation process during the test, the test result is interfered, misjudgment is easy to be caused, meanwhile, larger economic loss is caused, in the prior art, the invention for testing the chip after the chip is packaged is also available, for example, the chip package durability test method and the test device are disclosed in application number of CN202210302554.1, the chip is manually placed through the impact test of free falling, the chip is basically removed or adsorbed by a sucker, the chip is transported through hands or the sucker, and the chip is possibly damaged due to the vibration of the pins during the transportation.
Disclosure of Invention
An object of the present invention is to provide a test apparatus for a semiconductor laser chip to solve the above-mentioned problems.
The technical aim of the invention is realized by the following technical scheme: the test equipment of the semiconductor laser chip comprises a turnover transportation mechanism arranged on a test supporting table, wherein the turnover transportation mechanism consists of a first chip transportation mechanism and a second chip transportation mechanism;
the first chip conveying mechanism comprises a first connecting table fixedly arranged on one side of the test supporting table, a first electric push rod is fixedly arranged on the first connecting table at equal intervals, the fixed end of the first electric push rod is fixedly connected with the first connecting table, the telescopic end of the first electric push rod is fixedly connected with a second connecting table, a first fixing plate is fixedly arranged on the second connecting table, a conveying sliding rail is fixedly arranged on the first fixing plate, the conveying sliding rail consists of a turnover sliding rail and a reset sliding rail, a sliding column is arranged in the conveying sliding rail, the other end of the sliding column is fixedly connected with a chip loading plate, chip grooves are uniformly arranged on the chip loading plate, a first clamping plate is fixedly arranged on the chip loading plate at equal intervals, each first clamping plate is fixedly connected with a motor shaft of a corresponding first motor, and the first motor is fixedly arranged on the chip loading plate;
the second chip conveying mechanism comprises a circular plate arranged on one side of the test supporting table, a second fixing plate is fixedly arranged on the circular plate, a limiting rod is fixedly arranged on the second fixing plate, a first connecting plate is fixedly arranged on the limiting rod in a sliding mode, a first screw rod is further rotationally arranged on the second fixing plate, the first screw rod is fixedly connected with a motor shaft of the second motor, the second motor is fixedly arranged on the second fixing plate, the first screw rod is in spiral transmission with the first connecting plate, a second electric push rod is fixedly arranged on the first connecting plate, the fixed end of the second electric push rod is fixedly connected with the first connecting plate, the telescopic end of the second electric push rod is fixedly connected with the third connecting plate, the third electric push rods corresponding to the second electric push rod are fixedly arranged on the third connecting plate at equal intervals, a chip conveying platform is slidingly arranged between the second conveying slide rails, the second chip conveying mechanism is identical to the first chip conveying mechanism, and the second chip conveying mechanism is identical to the first chip conveying platform, and the first chip conveying platform is identical in structure.
The turnover transportation mechanism further comprises a first fixed column fixedly arranged on the test supporting table at equal intervals, a platform connecting main body is fixedly arranged between the first fixed columns, a first chain wheel is fixedly arranged at two ends of the platform connecting main body at equal intervals, a first chain wheel is arranged outside the first chain wheel at the same side, a first chain wheel and the corresponding first chain wheel are meshed with each other, a third motor is fixedly arranged on the platform connecting main body, a motor shaft of the third motor is fixedly connected with one of the first chain wheels, a first sliding groove is fixedly arranged on the platform connecting main body at equal intervals, a chip testing platform is slidably arranged in the first sliding groove, a first connecting column is fixedly arranged at one end of the chip testing platform, one end of the first connecting column, which is far away from the chip testing platform, is fixedly arranged at the same intervals on the chip testing platform, and the chip groove is fixedly arranged on the chip testing platform.
Preferably, every all rotate on the transportation slide rail and be equipped with No. four electric putter, no. four electric putter's stiff end with the transportation slide rail rotates to be connected, no. four electric putter's flexible end is last to be fixedly equipped with the lug, every all be equipped with the slot on the traveller, still be equipped with No. two spouts on the fixed plate, no. two sliding in the spout are equipped with No. two grip blocks, no. two grip blocks and No. two screw rod screw drive, no. two screw rods and No. four motor's motor shaft fixed connection, no. four motor is fixed to be set up on the fixed plate, no. two screw rods with No. one fixed plate rotates to be connected, no. four electric putter's stiff end and No. five motor's motor shaft fixed connection, no. five motor is fixed to be set up on the fixed plate.
Preferably, a chip transport mechanism No. one the one side of No. two chip transport mechanisms all is equipped with auxiliary reset mechanism, auxiliary reset mechanism is including the equidistance fixing arrangement setting No. two spliced poles on the test supporting bench, no. two fixed electric putter that is equipped with on the spliced pole, no. five electric putter's stiff end with No. two spliced poles fixed connection, no. five electric putter's flexible end and No. two connecting plate fixed connection, it is equipped with a pair of gear to rotate on the No. two connecting plates, adjacent intermeshing between the gear, still be equipped with No. six motors on the No. two connecting plates, no. six motor's motor shaft with one of them gear fixed connection, still be fixed on the gear and be equipped with the projection, fixed No. three screw rods are equipped with on the projection, slide on the No. three screw rods and are equipped with the cooperation piece, on the transportation slide rail in reset slide rail department still be equipped with the breach, the cooperation piece can with on the transportation slide rail, the insertion groove can with the cooperation of cooperation piece.
Preferably, the test supporting bench is further fixedly provided with a second fixing column, the second fixing column is provided with a sliding plate in a sliding mode, a seventh motor is fixedly arranged on the sliding plate, a motor shaft of the seventh motor is fixedly connected with a corresponding third screw rod, the third screw rod is rotationally connected with the sliding plate, a clamping block is arranged on the third screw rod, the clamping block is in spiral transmission with the third screw rod, the clamping block is arranged in a sliding rail in a sliding mode, the sliding rail is arranged on the sliding plate, a second chain is further arranged in the sliding rail in a sliding mode, and hammering blocks are fixedly arranged below the sliding plate in an equidistant mode.
Preferably, the test supporting table is further fixedly provided with a third connecting plate, the third connecting plate is provided with second sprockets in an equidistant arrangement mode, each pair of same side of the third connecting plate is connected with the second sprockets through the second chains, the second sprockets are in meshed transmission with the second chains, the second sprockets are fixedly connected through connecting shafts, one of the second sprockets is fixedly connected with a motor shaft of the eighth motor, and the eighth motor is fixedly arranged on the third connecting plate.
Preferably, the plectane is kept away from one side of test supporting bench still is equipped with the support column, the equidistance is arranged and is rotated on the support column and is equipped with No. three sprockets, homonymy connect through same No. three chain between the No. three sprockets, no. three sprockets with the meshing transmission between the No. three chains, the equidistance is arranged fixedly on the No. three chains and is equipped with the conveyer belt board, the equidistance is arranged on the conveyer belt board and is equipped with the chip groove.
Preferably, the circular plate is fixedly connected with a motor shaft of a motor No. nine, the motor No. nine is fixedly arranged on a connection table No. four, the connection table No. four is connected with the test supporting table and the connection table No. one through the support column, and a top plate is fixedly arranged at the top end of the connection plate No. three and the top end of the fixing column No. two.
Preferably, the support column is fixedly arranged below the fourth connecting table, the base is fixedly arranged below the support column, and the control terminal is fixedly arranged on the fourth connecting table.
In summary, the invention has the following beneficial effects: according to the invention, the overturning and transporting mechanism is arranged, so that the chip to be tested on the loading plate can be completely transported to the testing platform under the condition of not being damaged by any vibration through mutual lamination of the loading plate and the testing platform, thereby ensuring the integrity of the chip, preventing the damage caused by the transportation of the chip from influencing the testing result and causing interference, and further causing economic loss.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a first external view of an embodiment of the present invention;
FIG. 2 is a second perspective view of an embodiment of the present invention;
FIG. 3 is a third external view of an embodiment of the present invention;
FIG. 4 is a first schematic diagram of an embodiment of the present invention;
FIG. 5 is a second schematic diagram of an embodiment of the present invention;
FIG. 6 is an enlarged schematic view of the embodiment of the invention at A in FIG. 1;
FIG. 7 is an enlarged schematic view of the embodiment of the invention at B in FIG. 1;
FIG. 8 is an enlarged schematic view of FIG. 2 at C in accordance with an embodiment of the present invention;
FIG. 9 is an enlarged schematic view of the embodiment of the invention at D in FIG. 4;
FIG. 10 is an enlarged schematic view of the embodiment of the invention at E in FIG. 4;
FIG. 11 is an enlarged schematic view of the embodiment of the invention at F in FIG. 4;
FIG. 12 is an enlarged schematic view of the embodiment of the invention at G in FIG. 5;
in the figure: 11. a base; 12. a support column; 13. a fourth connecting table; 14. a control terminal; 15. a test support; 16. a conveyor belt plate; 17. a third chain; 18. a third sprocket; 19. a chip slot; 20. a first electric push rod; 21. a second connecting table; 22. a chip loading plate; 23. a chip test platform; 24. a top plate; 25. a second fixing column; 26. a slide plate; 27. a first connecting table; 28. a motor No. nine; 29. a circular plate; 30. a connecting shaft; 31. hammering the block; 32. a support column; 33. a second fixing plate; 34. a limit rod; 35. a first screw; 36. a motor II; 37. a second electric push rod; 38. a first connecting plate; 39. a third connecting table; 40. a third electric push rod; 41. a chip transportation platform; 42. the platform is connected with the main body; 43. a first fixing plate; 44. a second chute; 45. a fourth motor; 46. a second screw; 47. a second clamping plate; 48. a transport slide rail; 49. resetting the slide rail; 50. overturning the sliding rail; 51. fourth electric push rod; 52. a bump; 53. a notch; 54. an insertion groove; 55. a fifth motor; 56. a spool; 57. a slot; 58. a second connecting column; 59. fifth electric push rod; 60. a motor No. six; 61. a second connecting plate; 62. a mating block; 63. a convex column; 64. a gear; 65. a motor I; 66. a motor No. eight; 67. a third connecting plate; 68. a second sprocket; 69. a second chain; 70. a slide rail; 71. a clamping block; 72. a third screw; 73. a seventh motor; 74. a first clamping plate; 75. a third motor; 76. a first sprocket; 77. a first chain; 78. a first connecting column; 79. a first chute; 80. a first fixed column; 81. a turnover transportation mechanism; 82. a first chip transportation mechanism; 83. a second chip transportation mechanism; 84. an auxiliary reset mechanism;
description of the embodiments
The test equipment for semiconductor laser chips described with reference to fig. 1-12 comprises a turnover transportation mechanism 81 arranged on a test supporting table 15, wherein the turnover transportation mechanism 81 consists of a first chip transportation mechanism 82 and a second chip transportation mechanism 83;
the first chip transporting mechanism 82 includes a first connecting table 27 fixedly disposed on one side of the test supporting table 15, a first electric push rod 20 is fixedly disposed on the first connecting table 27 in an equidistant arrangement, a fixed end of the first electric push rod 20 is fixedly connected with the first connecting table 27, a telescopic end of the first electric push rod 20 is fixedly connected with a second connecting table 21, a first fixing plate 43 is fixedly disposed on the second connecting table 21, a transporting slide rail 48 is fixedly disposed on the first fixing plate 43, the transporting slide rail 48 is composed of a turnover slide rail 50 and a reset slide rail 49, a slide column 56 is slidably disposed on the transporting slide rail 48, the other end of the slide column 56 is fixedly connected with the chip loading plate 22, a chip groove 19 is disposed on the chip loading plate 22 in an equidistant arrangement, a first clamping plate 74 is further rotatably disposed on the chip loading plate 22 in an equidistant arrangement, each first clamping plate 74 is fixedly connected with a motor shaft 65 corresponding to the first motor 65, and the first motor 65 is fixedly disposed on the chip loading plate 22;
the second chip transporting mechanism 83 is including setting up the plectane 29 of test supporting bench 15 one side, the fixed No. two fixed plates 33 that are equipped with on the plectane 29, the fixed gag lever post 34 that is equipped with on the No. two fixed plates 33, the last sliding connection that is equipped with of gag lever post 34 No. one connecting plate 38, still rotate on the No. two fixed plates 33 and be equipped with No. one screw rod 35, no. one screw rod 35 and No. two motor 36's motor shaft fixed connection, no. two motor 36 fixed settings are in on the No. two fixed plates 33, no. one screw rod 35 with connecting plate 38 screw drive, no. one connecting plate 38 is last to be equipped with No. two electric putter 37, no. two electric putter 37's stiff end with No. one connecting plate 38 fixed connection, no. two electric putter 37's flexible end with No. three connecting plates 39 fixed connection, no. three connecting plates 39 No. two connecting plates 21 are last apart from arrange fixed No. three electric putter 40 that correspond with it, no. two chips transporting mechanism 83 are equipped with between the other transport slide rail 48 on the No. two chip transporting mechanism 83 and are equipped with chip transporting platform 41 equal to be equipped with the same with chip transporting platform 22, no. two electric putter structure and No. 41 are equal to use chip transporting platform 22.
The turnover transportation mechanism 81 further comprises a first fixed column 80 which is fixedly arranged on the test supporting table 15 in an equidistant manner, a first chain wheel 76 is fixedly arranged between the first fixed columns 80, two ends of the first fixed column 42 are fixedly arranged on the first chain wheel 76 in an equidistant manner, one same side of the first chain wheel 76 is externally provided with a same first chain 77, the first chain 77 and the corresponding first chain wheel 76 are meshed with each other, a third motor 75 is fixedly arranged on the first platform connecting body 42, a motor shaft of the third motor 75 is fixedly connected with one of the first chain wheels 76, a first sliding groove 79 is fixedly arranged on the first platform connecting body 42 in an equidistant manner, a chip test platform 23 is slidably arranged in the first sliding groove 79, one end of the chip test platform 23 is fixedly provided with a first connecting column 78, one end of the first connecting column 78, which is far away from the chip test platform 23, is fixedly connected with the corresponding first chain 77, the chip test platform 23 is fixedly provided with a chip supporting groove 19, and each chip supporting groove 19 can be used for packaging pins a.
The four-screw motor type electric pushing device comprises a conveying slide rail 48, a four-screw motor type electric pushing rod 51, a four-screw motor type electric pushing rod 43, a four-screw motor type electric pushing rod 46 and a four-screw motor type electric pushing rod, wherein the four-screw motor type electric pushing rod 51 is rotatably connected with the conveying slide rail 48, a protruding block 52 is fixedly arranged at the telescopic end of the four-screw motor type electric pushing rod 51, a slot 57 is formed in each sliding column 56, the protruding block 52 is matched with the slot 57, a two-screw chute 44 is further formed in the first-screw fixing plate 43, a two-screw clamping plate 47 is slidably arranged in the two-screw chute 44, the two-screw clamping plate 47 is in screw transmission with the two-screw motor type electric pushing rod 46, the two-screw motor type electric pushing rod 46 is fixedly connected with the motor shaft of the four-screw motor type electric pushing rod 51, the fixed end of the four-screw motor type electric pushing rod 51 is fixedly connected with the motor shaft of the five-screw motor type electric pushing rod 55, and the five-motor type electric pushing rod is fixedly arranged on the first-screw type electric motor type electric pushing rod 43.
The utility model provides a chip transport mechanism 82 No. two one side of chip transport mechanism 83 all is equipped with auxiliary reset mechanism 84, auxiliary reset mechanism 84 includes that the equidistance is arranged fixedly and is set up No. two spliced poles 58 on the test supporting bench 15, no. two spliced poles 58 are last to be fixedly equipped with No. five electric putter 59, no. five electric putter 59's stiff end with No. two spliced poles 58 fixed connection, no. five electric putter 59's flexible end and No. two connecting plates 61 fixed connection, no. two rotating on the connecting plates 61 are equipped with a pair of gear 64, adjacent intermesh between the gear 64, no. two still be equipped with No. six motors 60 on the connecting plates 61, no. six motor 60's motor shaft and one of them gear 64 fixed connection, no. 64 is last still fixedly equipped with projection 63, no. three screw rods 72 are last to be fixedly equipped with of projection 63, no. three screw rods 72 are last to slide and are equipped with the cooperation piece 62, on the transportation 48 in No. two slide rail 49 department still is equipped with breach 53, cooperation piece 62 can with the cooperation piece 53 reset slide rail 49 on the transportation piece 48 and the cooperation piece 54 can be inserted into the slide rail 54.
The test support table 15 is fixedly provided with a second fixing column 25, the second fixing column 25 is slidably provided with a slide plate 26, a seventh motor 73 is fixedly arranged on the slide plate 26, motor shafts of the seventh motor 73 are fixedly connected with corresponding third screws 72, the third screws 72 are rotationally connected with the slide plate 26, clamping blocks 71 are arranged on the third screws 72, the clamping blocks 71 are in spiral transmission with the third screws 72, the clamping blocks 71 are slidably arranged in slide rails 70, the slide rails 70 are arranged on the slide plate 26, a second chain 69 is slidably arranged in the slide rails 70, and hammering blocks 31 are fixedly arranged below the slide plate 26 in an equidistant arrangement mode.
The test support table 15 is fixedly provided with a third connecting plate 67, the third connecting plate 67 is equidistantly arranged and rotated to be provided with a second chain wheel 68, each pair of same-side second chain wheels 68 are connected through a second chain 69, the second chain wheels 68 are meshed with the second chain 69 for transmission, two pairs of second chain wheels 68 are fixedly connected through a connecting shaft 30, one of the second chain wheels 68 is fixedly connected with a motor shaft of an eighth motor 66, and the eighth motor 66 is fixedly arranged on the third connecting plate 67.
The test support table comprises a test support table body 15, a test strip plate 16, a chip groove 19, a chip transport platform 41, a test strip plate 16, a test strip plate, a support column 32, a third chain wheel 18, a same side, and a same third chain 17, wherein the third chain wheel 18 is connected with the same third chain 17, the third chain wheel 18 and the third chain 17 are in meshed transmission, the test strip plate 15 is fixedly provided with the test strip plate 16 in an equidistant arrangement, the chip groove 19 is arranged in the test strip plate 16 in an equidistant arrangement, and the test strip plate 16 is used for being matched with the chip transport platform 41.
The disc 29 is fixedly connected with a motor shaft of a motor No. 28, the motor No. 28 is fixedly arranged on the connecting table No. 13, the connecting table No. 13 is connected with the test supporting table 15 and the connecting table No. 27 through the support column 12, and the top of the connecting plate No. 67 and the top of the fixing column No. 25 are fixedly provided with a top plate 24.
The chip test device comprises a chip test platform 23, a chip loading plate 22, a chip groove 19, a second connecting platform 21, a fourth connecting platform 13, a base 11, a control terminal 14, a chip loading plate 22, a balancing weight, a second connecting platform 21 and a control terminal 14, wherein the base 12 is fixedly arranged below the fourth connecting platform 13, the control terminal 14 is used for controlling all motors and electric pushing rods, the balancing weight is arranged on one surface of the chip loading plate 22, which is far away from the chip groove 19, of the chip transport platform 41, and the weight is certain.
The application method of the invention comprises the following steps:
the initial state is as follows: the clamping block 71 is attached to the second chain 69, and clamps the second chain 69, the first electric push rod 20, the second electric push rod 37 and the fifth electric push rod 59 are in a contracted state, the matching block 62 is not matched with the insertion groove 54, the chip loading plate 22 is located at the bottommost part in the transportation slide rail 48, the chip transportation platform 41 is located at the topmost part in the transportation slide rail 48, the second clamping plate 47 is not contacted with the slide column 56, the fourth electric push rod 51 in the first chip transportation mechanism 82 is in a contracted state, the fourth electric push rod 51 in the second chip transportation mechanism 83 is in an expanded state, the protruding block 52 is inserted into the insertion groove 57 of the slide column 56 at both sides of the chip transportation platform 41, the first clamping plate 74 is identical to the top surface of the chip loading plate 22, and the first clamping plate 74 on the chip transportation platform 41 is identical.
When the user needs to use the invention, the user needs to prepare the chip a to be tested in advance, stand near the control terminal 14 and face the chip loading plate 22, the prepared chip a is loaded onto the chip loading plate 22 by a tool and uniformly faces the chip loading plate 22, the invention can be started after the placement is finished, after the invention is started, the control terminal 14 drives the motor No. three 75 to be started, the motor shaft of the motor No. three 75 drives the sprocket No. one 76 to rotate after the motor No. three 75 is started, the sprocket No. one 76 rotates to drive the chain No. one 77 to rotate, thereby driving the chip testing platform 23 to move on the chute No. one 79 until the chip testing platform 23 rotates to the bottom surface of the platform connecting main body 42, at the moment, the motor No. four 45 is started under the action of the control terminal 14, thereby, the motor shaft drives the second screw 46 to rotate, so that the second clamping plate 47 moves to clamp the slide column 56, thereby preventing the chip loading plate 22 from shaking, then the first electric push rod 20 is started under the action of the control terminal 14, after the first electric push rod 20 is started, the second connecting table 21 is driven to stretch, the first electric push rod 20 drives the second connecting table 21 to move with the chip loading plate 22, until the first electric push rod 20 is completely stretched, the chip loading plate 22 also moves below the chip testing platform 23 to align with the chip testing platform 23, then the control terminal 14 starts the third electric push rod 40 below the chip loading plate 22, after the third electric push rod 40 is started, the chip loading plate 22 is lifted, simultaneously, the motor 45 on one side of the chip loading plate 22 is started again, the clamping plate 47 on the first side is driven to reset, the sliding column 56 is not clamped any more, the lifting of the electric push rod 40 on the third side is facilitated until the top surface of the chip loading plate 22 contacts with one surface of the chip testing platform 23, which is provided with the chip slot 19, then the motor 65 is started under the action of the control terminal 14, the motor shaft of the motor 65 drives the clamping plate 74 on the chip loading plate 22 to rotate, the rotation of the clamping plate 74 on the clamping plate 74 clamps the chip testing platform 23 at this time, the chip slot 19 on the chip loading plate 22 is aligned with the chip slot 19 on the chip testing platform 23 at this time, when the chip testing platform 23 is attached to the chip slot 19 between the chip loading plate 22 and the connecting plate 21 on the second side, a space between the chip and the chip is not rocked, the chip a is exchanged under the action of the control terminal 14, the motor shaft of the motor is driven to drive the chip a, the chip a is driven to rotate, the sliding rail 22 is driven to return to the sliding rail 75 along with the sliding column 22 on the first side, the sliding rail 50 is driven by the sliding plate 22, the sliding rail 50 is driven to the sliding plate 22 to the sliding along with the chip testing platform 22 at this moment, the sliding plate 22 is locked by the sliding plate 75, the sliding plate 50 is driven to move the chip 22, and the chip is lifted up along with the chip slot 19 on the chip testing platform 22, and the chip slot 19 between the chip testing plate 22, and the chip is moved. The chip loading plate 22 will turn over, the side provided with the chip slot 19 will face the direction of the base 11, and the chip a in the chip loading plate 22 will have fallen onto the chip slot 19 of the chip testing platform 23 under the action of gravity, the internal chip a will change the supporting point and stably fall onto the chip testing platform 23, at this time, the fourth electric push rod 51 in the direction of the chip loading plate 22 will be started under the action of the control terminal 14 to stretch, and as the fourth electric push rod 51 stretches, the bump 52 will be inserted into the slot 57 of the slide post 56 to upwards prop up the slot 57, while the bump 52 is inserted into the slot 57, the first motor 65 will be started to reset the first clamping plate 74 on the chip loading plate 22, the chip loading board 22 is not locked with the chip testing platform 23 any more, so that the chip loading board 22 is smoothly supported by the fourth electric push rod 51 and moves to the highest point on the transportation slide rail 48, then, the first electric push rod 20 is retracted and reset under the action of the control terminal 14, so as to drive the second connecting table 21 to reset, after the first electric push rod 20 is retracted, the third electric push rod 40 on the second connecting table 21 is reset, meanwhile, the auxiliary reset mechanism 84 on one side of the chip loading board 22 is started, the fifth electric push rod 59 on one side of the chip loading board 22 is extended under the action of the control terminal 14, so that the matching block 62 is pushed to the notch 53, so that the matching block 62 is matched with the insertion groove 54, with the continuous extension of the No. five electric push rod 59, the No. three screw rod 72 will disengage from the matching block 62, then the No. six motor 60 is started under the action of the control terminal 14, so as to drive the boss 63 to rotate, the No. three screw rod 72 is disengaged from the range of the matching block 62, then the No. five electric push rod 59 is reset, then the No. five motor 55 on one side of the chip loading plate 22 is started, the motor shaft thereof will drive the No. four electric push rod 51, with the rotation of the No. four electric push rod 51, the No. four electric push rod 51 carries the slide post 56 to slide in the reset slide rail 49, thereby completing the reset of the slide post 56, the No. four electric push rod 51 can be reset under the action of the control terminal 14, the No. four motor 45 will be started again under the action of the control terminal 14 to drive the No. two clamping plates 47 to clamp the slide post 56, the No. four electric push rod 51 is contracted, the No. five motor 55 will drive the No. four electric push rod 51 to reset, the No. five electric push rod 51 will be inserted into the range of the No. five electric push rod 55, then the No. five electric push rod 51 is driven to rotate again, the No. five push rod 62 is inserted again, and the boss 63 is reset after the No. five push rod 62 is disengaged from the range of the boss 59 is reset, and the boss is reset again, the boss is completely driven, and the boss 63 is reset after the boss is completely is disengaged from the boss 62 is completely, and the boss is reset, and the boss is completely reset.
Meanwhile, the chip a placed on the chip test platform 23 will receive the test, the user starts the No. eight motor 66 in advance through the control terminal 14, drives the transmission of the No. two chains 69 through the motor shaft of the No. eight motor 66, drives the slide plate 26 to lift to a proper position, at this time, the control terminal 14 will drive the No. seven motor 73 to start, after the No. seven motor 73 starts, the motor shaft will drive the No. three screw 72 to rotate, thereby drive the clamping block 71 to slide, so that the clamping block 71 no longer clamps the No. two chains 69, and after the slide plate 26 loses the locking with the No. two chains 69, the slide plate 26 will fall down along the No. two fixed columns 25 by itself, and the hammering block 31 will impact the package housing of the chip a on the chip test platform 23, thereby completing the test, after the slide plate 26 is finished, the No. seven motor 73 will start again, so that the clamping block 71 clamps the No. two chains 69, so that the No. two motors are locked again, and the No. eight motor 26 will drive the slide plate 26 to lift to the proper position again after the control terminal 26 is started again.
And then the second chip transporting mechanism 83 will be started, after the second chip transporting mechanism 83 is started, the second electric push rod 37 will be started under the action of the control terminal 14, the second electric push rod 37 will drive the third connecting table 39 to stretch, so that the chip transporting platform 41 aligns with the chip testing platform 23 carrying the tested chip a, after the second electric push rod 37 stretches, the fourth electric push rod 51 in the second chip transporting mechanism 83 will be started under the action of the control terminal 14 to shrink, so that the side of the chip transporting platform 41 with the chip slot 19 is attached to the side of the chip testing platform 23 with the chip slot 19, and as the fourth electric push rod 51 continues to shrink, the bump 52 will be separated from the slot 57, the first motor 65 on the chip transporting platform 41 will be started under the action of the control terminal 14, so as to drive the first clamping plate 74 on the chip transporting platform 41 to rotate, so as to clamp the chip testing platform 23, so as to lock the two, and the third motor 75 is locked, so as to drive the first chain 77 to drive the chip testing platform 23 to slide, so that the surface of the chip testing platform 23 provided with the chip slot 19 faces the base 11, the slide column 56 in the second chip transporting mechanism 83 will slide along the turnover slide rail 50, and when the surface of the chip testing platform 23 provided with the chip slot 19 faces the base 11 and is parallel to the base 11, the slide column 56 slides to the bottom of the turnover slide rail 50, at this time, the control terminal 14 will drive the first motor 65 on the chip transportation platform 41 to drive the first clamping plate 74 to reset, so that the two clamping plates are not locked, and as the chip test platform 23 and the chip transportation platform 41 are turned over, the chip a will fall onto the chip transportation platform 41, while the first clamping plate 74 is unlocked, the third electric push rod 40 on the third connecting platform 39 will be started under the action of the control terminal 14 to stretch, so as to lift the unlocked chip transportation platform 41, then the third electric push rod 40 will be slowly reset, drive the chip transportation platform 41 to stably descend until the slide post 56 on the chip transportation platform 41 falls onto the lowest point in the transportation slide rail 48, then the fourth motor 45 will be started, the motor shaft thereof drives the second screw rod 46 to rotate, so that the slide column 56 is stably clamped by the second clamping plate 47 to be stable, the second motor 36 is started under the action of the control terminal 14, the first screw rod 35 is driven to rotate by the motor shaft of the second motor 36, the first connecting plate 38 moves towards the second fixing plate 33, the ninth motor 28 is started under the action of the control terminal 14, the motor shaft of the ninth motor drives the circular plate 29 to rotate until the circular plate is stopped after rotating for a certain angle, the surface of the chip conveying platform 41 provided with the chip groove 19 is aligned with the surface of the conveying belt plate 16 provided with the chip groove 19, the surface of the conveying belt plate 16 provided with the chip groove 19 faces the ground, the chip a on the chip conveying platform 41 is transferred onto the conveying belt plate 16, the steps are consistent with that of transferring the chip a on the first chip transporting mechanism 82 to the chip testing platform 23, and the chip a falling on the conveying belt plate 16 is transported to a subsequent detection place, after the transfer of the chip a is completed, the second chip transporting mechanism 83 resets under the action of the control terminal 14, the second motor 36 is started, so that the first connecting plate 38 is separated from the second fixing plate 33, and is rotated and reset under the action of the ninth motor 28, and after the transfer of the chip a is completed by the second chip transporting mechanism 83, the chip a returns to an initial state, thus facilitating the next work and so on.
The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the present invention and implement it without limiting the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (8)
1. The utility model provides a test equipment of semiconductor laser chip, includes upset transport mechanism (81) that sets up on test supporting bench (15), its characterized in that: the turnover conveying mechanism (81) consists of a first chip conveying mechanism (82) and a second chip conveying mechanism (83);
the first chip conveying mechanism (82) comprises a first connecting table (27) fixedly arranged on one side of the test supporting table (15), a first electric push rod (20) is fixedly arranged on the first connecting table (27) in an equidistant mode, the fixed end of the first electric push rod (20) is fixedly connected with the first connecting table (27), the telescopic end of the first electric push rod (20) is fixedly connected with a second connecting table (21), a first fixing plate (43) is fixedly arranged on the second connecting table (21), a conveying sliding rail (48) is fixedly arranged on the first fixing plate (43), the conveying sliding rail (48) is composed of a turnover sliding rail (50) and a reset sliding rail (49), a sliding column (56) is arranged in the conveying sliding rail (48), the other end of the sliding column (56) is fixedly connected with a chip loading plate (22), a chip groove (19) is formed in the chip loading plate (22) in an equidistant mode, a first clamping plate (74) is further fixedly arranged on the chip loading plate (22), a first motor (74) is fixedly arranged on the motor shaft (74), and the first motor (74) is fixedly connected with the first motor shaft (65) in an equidistant mode;
the second chip conveying mechanism (83) comprises a circular plate (29) arranged on one side of the test supporting table (15), a second fixing plate (33) is fixedly arranged on the circular plate (29), a limiting rod (34) is fixedly arranged on the second fixing plate (33), a first connecting plate (38) is slidably arranged on the limiting rod (34), a first screw rod (35) is further rotationally arranged on the second fixing plate (33), the first screw rod (35) is fixedly connected with a motor shaft of a second motor (36), the second motor (36) is fixedly arranged on the second fixing plate (33), the first screw rod (35) and the first connecting plate (38) are in spiral transmission, a second electric push rod (37) is fixedly arranged on the first connecting plate (38), a fixed end of the second electric push rod (37) is fixedly connected with the first connecting plate (38), a telescopic end of the second electric push rod (37) is fixedly connected with a third connecting table (39), the third connecting table (39) is fixedly connected with a second electric push rod (21) and a second electric push rod (40) is correspondingly arranged on the second connecting table (21) and is fixedly arranged on the third connecting table (40), the second chip transporting mechanism (83) and the first chip transporting mechanism (82) are the same in other structures, and the chip transporting platform (41) and the chip loading plate (22) are the same in structure;
the turnover transportation mechanism (81) further comprises a first fixed column (80) fixedly arranged on the test supporting table (15) in an equidistant manner, a first fixed column (80) is fixedly provided with a first sliding groove (79) fixedly arranged between the first fixed column (80), two ends of the first fixed column (42) are fixedly provided with a first chain wheel (76) in an equidistant manner, the same side of the first chain wheel (76) is externally provided with a same first chain (77), the first chain (77) is meshed with the corresponding first chain wheel (76) in an intermeshing manner, a third motor (75) is fixedly arranged on the first fixed column (42), a motor shaft of the third motor (75) is fixedly connected with one of the first chain wheels (76), a first sliding groove (79) is fixedly arranged on the first fixed column (42) in an equidistant manner, one end of the first sliding groove (79) is fixedly provided with a chip test platform (23), one end of the first chain (78) is far away from the first chain (77) of the chip test platform (23), and the corresponding first chain (77) is fixedly provided with a first sliding groove (19) of the chip test platform (23).
2. The test apparatus for a semiconductor laser chip as defined in claim 1, wherein: every all rotate on transport slide rail (48) and be equipped with No. four electric putter (51), no. four electric putter's (51) stiff end with transport slide rail (48) rotate and are connected, fixed being equipped with lug (52) on the flexible end of No. four electric putter (51), every all be equipped with slot (57) on slide column (56), still be equipped with No. two spout (44) on No. one fixed plate (43), no. two spout (44) sliding is equipped with No. two grip blocks (47), no. two grip blocks (47) and No. two screw rods (46) screw drive, no. two screw rods (46) and No. four motor's (45) motor shaft fixed connection, no. four motor (45) are fixed to be set up on No. one fixed plate (43), no. two screw rods (46) with No. one fixed plate (43) rotate and are connected, no. four electric putter's (51) stiff end is fixed connection with No. five motor shaft (55), no. five motor (55) are fixed to be set up on No. one fixed plate (43).
3. The test apparatus for a semiconductor laser chip as defined in claim 1, wherein: the utility model discloses a chip conveying mechanism (82) one side of No. two chip conveying mechanisms (83) all is equipped with auxiliary reset mechanism (84), auxiliary reset mechanism (84) are including equidistance arrangement fixed setting No. two spliced pole (58) on test supporting bench (15), no. two fixed electric putter (59) that are equipped with on spliced pole (58), no. five fixed end of electric putter (59) with No. two spliced pole (58) fixed connection, the flexible end and No. two connecting plate (61) fixed connection of No. five electric putter (59), rotate on No. two connecting plate (61) and be equipped with a pair of gear (64), adjacent gear (64) are intermeshing, no. two still be equipped with No. six motor (60) on connecting plate (61), no. six motor (60) motor shaft and one of them gear (64) fixed connection, still be equipped with projection (63) on gear (64), be equipped with on projection (63) three screw rods (72) fixed connection, be equipped with on three screw rods (72) sliding block (62) and be equipped with in cooperation in slider (49) on the slider (53) can be equipped with notch (53), an insertion groove (54) is formed in the conveying sliding rail (48) on the reset sliding rail (49), and the insertion groove (54) can be matched with the matching block (62).
4. A test apparatus for a semiconductor laser chip as defined in claim 3, wherein: the test supporting table (15) is further fixedly provided with a second fixing column (25), the second fixing column (25) is slidably provided with a sliding plate (26), a seventh motor (73) is fixedly arranged on the sliding plate (26), a motor shaft of the seventh motor (73) is fixedly connected with a corresponding third screw (72), the third screw (72) is rotationally connected with the sliding plate (26), a clamping block (71) is arranged on the third screw (72), the clamping block (71) is in spiral transmission with the third screw (72), the clamping block (71) is slidably arranged in a sliding rail (70), the sliding rail (70) is arranged on the sliding plate (26), a second chain (69) is further slidably arranged in the sliding rail (70), and hammering blocks (31) are fixedly arranged below the sliding plate (26) in an equidistant mode.
5. The test apparatus for a semiconductor laser chip as defined in claim 4, wherein: the test supporting table (15) is further fixedly provided with a third connecting plate (67), the third connecting plate (67) is equidistantly arranged to rotate and is provided with a second sprocket (68), each pair of identical sides of the third connecting plate is connected with the second sprocket (68) through a second chain (69), the second sprocket (68) is meshed with the second chain (69) to drive, the second sprockets (68) are fixedly connected with each other through a connecting shaft (30), one of the second sprockets (68) is fixedly connected with a motor shaft of an eighth motor (66), and the eighth motor (66) is fixedly arranged on the third connecting plate (67).
6. The test apparatus for a semiconductor laser chip as defined in claim 1, wherein: the test supporting table is characterized in that a supporting column (32) is further arranged on one side, far away from the test supporting table (15), of the supporting column (32), a third chain wheel (18) is arranged on the supporting column (32) in an equidistant arrangement mode, the third chain wheels (18) on the same side are connected through a third chain (17), the third chain wheels (18) and the third chain (17) are in meshed transmission, a conveying belt plate (16) is fixedly arranged on the third chain (17) in an equidistant arrangement mode, and chip grooves (19) are formed in the conveying belt plate (16) in an equidistant arrangement mode.
7. The test apparatus for a semiconductor laser chip as defined in claim 6, wherein: the utility model discloses a motor shaft fixed connection of plectrum (29) and No. nine motor (28), no. nine motor (28) are fixed to be set up on No. four connection platform (13), no. four connection platform (13) with test supporting bench (15) connect through between No. one connection platform (27) support column (12) are connected, no. three connecting plate (67) No. two fixed column (25) top is fixed and is equipped with roof (24).
8. The test apparatus for a semiconductor laser chip as defined in claim 7, wherein: the four-connection-table (13) is characterized in that a support column (12) is fixedly arranged below the four-connection-table (13), a base (11) is fixedly arranged below the support column (12), and a control terminal (14) is further fixedly arranged on the four-connection-table (13).
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| CN202311085452.XA CN116818504B (en) | 2023-08-28 | 2023-08-28 | Test equipment for semiconductor laser chip |
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| CN202311085452.XA CN116818504B (en) | 2023-08-28 | 2023-08-28 | Test equipment for semiconductor laser chip |
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| CN116818504B CN116818504B (en) | 2023-12-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118191561A (en) * | 2024-04-18 | 2024-06-14 | 陕西理工大学 | Test equipment for semiconductor laser chip |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201145728Y (en) * | 2007-11-27 | 2008-11-05 | 比亚迪股份有限公司 | Apparatus for testing chip |
| KR20090081720A (en) * | 2008-01-25 | 2009-07-29 | 세크론 주식회사 | Method of transferring customer trays, unit for transferring customer trays, and test handler having the unit for transferring customer trays |
| KR20090132224A (en) * | 2008-06-20 | 2009-12-30 | (주)테크윙 | Loading element for test handler |
| CN110411942A (en) * | 2019-07-23 | 2019-11-05 | 黄娉 | A kind of stable type chip detecting system picked up convenient for chip |
| CN110877349A (en) * | 2019-11-13 | 2020-03-13 | 桐乡市恒泰精密机械有限公司 | Anticollision arresting gear of manipulator |
| CN111081608A (en) * | 2019-12-25 | 2020-04-28 | 上海天马微电子有限公司 | Chip transfer method, chip and display panel |
| CN217112617U (en) * | 2022-04-02 | 2022-08-02 | 深圳沐矽昕电子科技有限公司 | Integrated circuit chip test fixture |
-
2023
- 2023-08-28 CN CN202311085452.XA patent/CN116818504B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201145728Y (en) * | 2007-11-27 | 2008-11-05 | 比亚迪股份有限公司 | Apparatus for testing chip |
| KR20090081720A (en) * | 2008-01-25 | 2009-07-29 | 세크론 주식회사 | Method of transferring customer trays, unit for transferring customer trays, and test handler having the unit for transferring customer trays |
| KR20090132224A (en) * | 2008-06-20 | 2009-12-30 | (주)테크윙 | Loading element for test handler |
| CN110411942A (en) * | 2019-07-23 | 2019-11-05 | 黄娉 | A kind of stable type chip detecting system picked up convenient for chip |
| CN110877349A (en) * | 2019-11-13 | 2020-03-13 | 桐乡市恒泰精密机械有限公司 | Anticollision arresting gear of manipulator |
| CN111081608A (en) * | 2019-12-25 | 2020-04-28 | 上海天马微电子有限公司 | Chip transfer method, chip and display panel |
| CN217112617U (en) * | 2022-04-02 | 2022-08-02 | 深圳沐矽昕电子科技有限公司 | Integrated circuit chip test fixture |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118191561A (en) * | 2024-04-18 | 2024-06-14 | 陕西理工大学 | Test equipment for semiconductor laser chip |
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