CN116815010A - Micro-nano particle hybrid reinforced high-strength high-conductivity Cu-Ni-Si-X alloy and preparation method thereof - Google Patents
Micro-nano particle hybrid reinforced high-strength high-conductivity Cu-Ni-Si-X alloy and preparation method thereof Download PDFInfo
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 107
- 239000000956 alloy Substances 0.000 title claims abstract description 107
- 239000002105 nanoparticle Substances 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title abstract description 27
- 230000032683 aging Effects 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims description 32
- 239000002994 raw material Substances 0.000 claims description 25
- 238000003723 Smelting Methods 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 238000004321 preservation Methods 0.000 claims description 17
- 238000000137 annealing Methods 0.000 claims description 12
- 238000005096 rolling process Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000005303 weighing Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052735 hafnium Inorganic materials 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 238000000746 purification Methods 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 21
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 17
- 238000005728 strengthening Methods 0.000 abstract description 11
- 229910018098 Ni-Si Inorganic materials 0.000 abstract description 6
- 229910018529 Ni—Si Inorganic materials 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 6
- 230000002195 synergetic effect Effects 0.000 abstract description 3
- 229910008332 Si-Ti Inorganic materials 0.000 description 43
- 229910006749 Si—Ti Inorganic materials 0.000 description 43
- 238000012545 processing Methods 0.000 description 17
- 238000005098 hot rolling Methods 0.000 description 16
- 238000001816 cooling Methods 0.000 description 14
- 238000003801 milling Methods 0.000 description 12
- 238000010791 quenching Methods 0.000 description 10
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- 229910008329 Si-V Inorganic materials 0.000 description 8
- 229910006768 Si—V Inorganic materials 0.000 description 8
- 238000005097 cold rolling Methods 0.000 description 8
- 239000000155 melt Substances 0.000 description 8
- 229910008341 Si-Zr Inorganic materials 0.000 description 7
- 229910006682 Si—Zr Inorganic materials 0.000 description 7
- 239000006104 solid solution Substances 0.000 description 7
- 239000003610 charcoal Substances 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 230000018109 developmental process Effects 0.000 description 6
- 238000011056 performance test Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910001610 cryolite Inorganic materials 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
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- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 1
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 1
- 229910018100 Ni-Sn Inorganic materials 0.000 description 1
- 229910018532 Ni—Sn Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
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Abstract
The invention provides a micro-nano particle hybrid reinforced high-strength high-conductivity Cu-Ni-Si-X alloy and a preparation method thereof, belonging to the technical field of copper alloy preparation. The Cu-Ni-Si-X high-strength high-conductivity copper alloy is mainly characterized by comprising submicron to micron grade Ni-Si-X intermetallic compound particles, and nano ageing strengthening phases Ni-Si-X intermetallic compound and Ni-Si binary intermetallic compound, wherein the Cu-Ni-Si-X alloy has excellent comprehensive performance due to the synergistic effect of the micron grade Ni-Si-X intermetallic compound particles and the timely precipitated Ni-Si-X intermetallic compound, the tensile strength reaches 450-1150 MPa, the conductivity reaches 25% -85% IACS, and the high-temperature softening resistance is higher than 450 ℃.
Description
Technical Field
The invention relates to the technical field of copper alloy preparation, in particular to a micro-nano particle hybrid reinforced high-strength high-conductivity Cu-Ni-Si-X alloy and a preparation method thereof.
Background
Copper and its alloy are important basic materials for national economy and technological development, and are widely applied to the fields of mechanical manufacture, transportation, electric and electronic, aerospace, ocean engineering and the like due to high electric conductivity, heat conductivity, high corrosion resistance, easy processing and good mechanical properties. The high-strength high-conductivity copper alloy has the characteristics of high strength, high hardness, high elasticity, high electric conductivity, high thermal conductivity and the like, and is a key supporting material for industrial development of integrated circuits, network communication, high-speed rail transit, aerospace, precise instruments, military industry and the like.
For metallic materials, strength and conductivity are a pair of contradictors, i.e., strength increases often at the expense of conductivity, and vice versa. Therefore, how to effectively coordinate the contradiction between strength and conductivity is the key to develop high-strength and high-conductivity copper alloys.
Alloying is a main mode for improving the mechanical property of the alloy and preparing the high-strength high-conductivity copper alloy. Among them, aging strengthening is an effective means for obtaining high strength of an alloy while maintaining high conductivity. The alloy elements in solid solution are precipitated through ageing treatment, and form ageing strengthening phases in dispersion distribution, the alloy strength can be obviously improved through the strengthening effect, and meanwhile, the adverse effect on conductivity after the alloy elements are in solid solution in a copper alloy matrix can be overcome through precipitation of the ageing strengthening phases, so that the conductivity of the alloy is effectively improved. Therefore, most of the high-strength and high-conductivity copper alloys are age-strengthened alloys, such as Cu-Cr-Zr, cu-Ni-Si, cu-Fe-P, cu-Ni-Sn, etc.
In recent years, with the continuous development of large-scale integrated circuits, 5G communication and other industries, the requirements on the comprehensive performance of the high-strength and high-conductivity copper alloy are higher and higher. As the integration level of large-scale integrated circuits increases, the number of terminals required is increasing, and higher requirements are put on the electrical conductivity and thermal conductivity of the alloy. Meanwhile, as the number of terminals increases, the width and pitch of the leads of the integrated circuit are further reduced, the thickness of the leads is further reduced, and higher requirements are also put on the strength of copper alloy for the lead frame of the integrated circuit. For another example, the 5G communication base station generates more heat, so the copper alloy used is required to have better heat conduction capability and higher high-temperature softening resistance.
Therefore, the development of a new high-strength high-conductivity copper alloy with better comprehensive performance has positive significance for the development of the copper alloy industry and can provide more powerful support for the development of related downstream industries.
Disclosure of Invention
In order to solve the problems, the invention provides a micro-nano particle hybrid reinforced high-strength high-conductivity Cu-Ni-Si-X alloy, which can form submicron to micron grade Ni-Si-X intermetallic compound particles in the solidification process and the rolling process, and meanwhile, a nano grade ageing strengthening phase is separated out after solid solution and ageing heat treatment, wherein the time-effect strengthening phase mainly comprises Ni-Si-X intermetallic compounds and Ni-Si binary intermetallic compounds. Based on the synergistic effect of micron-sized Ni-Si-X intermetallic compound particles and timely precipitated Ni-Si-X intermetallic compound and Ni-Si binary intermetallic compound, the prepared Cu-Ni-Si-X alloy has excellent comprehensive performance, wherein the tensile strength reaches 450-1150 MPa, the conductivity reaches 25-85% IACS, and the high-temperature softening resistance is more than 450 ℃.
The micro-nano particle hybrid enhanced high-strength high-conductivity Cu-Ni-Si-X alloy comprises the following elements in percentage by weight:
0.5 to 10.00 percent of Ni, 0.01 to 4.00 percent of Si, 0.01 to 5.00 percent of X, and the balance of Cu and unavoidable impurities;
and X is one or more of Ti, zr, V, nb, cr and Hf elements.
The invention is not limited to Ni, si, X, cu sources, but preferably, the preparation of the alloy is carried out using pure Cu, pure Ni, pure Si, pure Ti as raw materials.
The invention also provides a preparation process of the micro-nano particle hybrid reinforced high-strength high-conductivity Cu-Ni-Si-X alloy, which specifically comprises the following steps:
s1, preparing raw materials: weighing the raw materials according to the mass percentage;
s2, preparing an as-cast Cu-Ni-Si-X alloy: smelting pure copper in a smelting furnace to form a copper-based melt, adding other raw materials to form a Cu-Ni-Si-X alloy melt, preserving heat, and pouring to obtain an as-cast Cu-A-M-Si-X alloy;
s3, heat treatment of Cu-Ni-Si-X alloy: and carrying out heat treatment on the as-cast Cu-Ni-Si-X alloy to enable an aging precipitation strengthening phase in a matrix to obtain the micro-nano particle hybrid strengthening high-strength high-conductivity Cu-Ni-Si-X alloy.
Furthermore, the smelting temperature is 1150-1250 ℃, the smelting condition is not limited, and the method can adopt the modes of vacuum smelting, covering agent adding, inert gas filling and the like to protect the melt according to the needs in the actual preparation process.
Further, after the metal melt is insulated, the melt purification treatment is carried out.
Further, the solid solution and aging heat treatment is performed before or during or after deformation of the alloy.
Further, the alloy deformation process is one or two of rolling and drawing.
Further, homogenizing annealing treatment is carried out on the alloy before the alloy is deformed, wherein the annealing temperature is 850-1000 ℃, and the heat preservation time is 4-8 hours.
Further, the heat treatment is one or both of solution treatment and aging treatment.
Further, the solution treatment temperature is 850-950 ℃, and the heat preservation time is 2-4 h.
Further, the aging temperature treatment temperature is 425-525 ℃ and the heat preservation time is 0.5-6 h.
The Cu-Ni-Si-X alloy can form submicron-micron grade Ni-Si-X intermetallic compound particles in the solidification process and the rolling process. Meanwhile, a nano-scale aging strengthening phase can be separated out after solid solution and aging heat treatment, and the aging strengthening phase mainly comprises a Ni-Si-X intermetallic compound and a Ni-Si binary intermetallic compound. The micron-sized Ni-Si-X intermetallic compound particles in the Cu-Ni-Si-X alloy timely precipitate the synergistic effect of the Ni-Si-X intermetallic compound and the Ni-Si binary intermetallic compound, so that the Cu-Ni-Si-X alloy has excellent comprehensive performance, wherein the tensile strength reaches 450-1150 MPa, the conductivity reaches 25-85% IACS, and the high-temperature softening resistance is more than 450 ℃.
Drawings
FIG. 1 is a scanning electron microscope image of an as-cast microstructure of a Cu-Ni-Si-Ti high-strength and high-conductivity copper alloy prepared in example 1 of the present invention;
FIG. 2 is a scanning electron microscope image of an as-cast microstructure of a Cu-Ni-Si-Ti high-strength and high-conductivity copper alloy prepared in example 2 of the present invention.
Detailed Description
The invention is further illustrated below with reference to examples.
Example 1
A preparation method of Cu-Ni-Si-Ti high-strength high-conductivity copper alloy comprises the following steps:
(1) Raw material preparation: according to the weight ratio of Cu to Ni to Si to Ti of 95.15:3.20:0.67: weighing pure Cu, pure Ni, pure Si and pure Ti according to the proportion of 0.98 as raw materials for standby;
(2) Preparation of as-cast Cu-Ni-Si-Ti alloy: placing pure copper in a smelting furnace, adding charcoal to cover under Ar environment condition for smelting to form copper-based melt, adding other raw materials when the temperature of the melt reaches 1200 ℃, forming Cu-Ni-Si-Ti alloy melt, preserving heat for 10min, adding cryolite for deslagging treatment, and pouring to obtain as-cast Cu-Ni-Si-Ti alloy;
(3) Deformation of Cu-Ni-Si-Ti alloy: heating the alloy ingot to the temperature of homogenizing annealing for heat preservation treatment, then carrying out hot rolling and online quenching, milling the surface of the hot rolled product, and finally carrying out cold rolling treatment to obtain the rolled Cu-Ni-Si-Ti alloy;
the temperature of the homogenizing annealing is 900 ℃, and the heat preservation treatment time is 4 hours; the initial rolling temperature of the hot rolling is 900 ℃, the final rolling temperature of the hot rolling is 750 ℃, the pass processing rate of the hot rolling is 20-30%, and the total processing rate is 80%; the quenching cooling mode is water cooling; the single-side milling amount of the milling surface is 0.5mm; the pass processing rate of the cold rolling is 20-30%, and the total processing rate is 60%;
(4) Heat treatment of Cu-Ni-Si-Ti alloy: and (3) carrying out aging treatment on the rolled Cu-Ni-Si-Ti alloy, wherein the aging temperature is 450 ℃, the heat preservation is carried out for 4 hours, and the air cooling is carried out to room temperature after the aging is finished, so that the high-strength high-conductivity Cu-Ni-Si-Ti alloy is obtained.
Through performance test, the prepared Cu-Ni-Si-Ti alloy has the hardness of 165.5HV, the tensile strength of 480.6MPa and the conductivity of 52 percent IACS.
Example 2
A preparation method of Cu-Ni-Si-Ti high-strength high-conductivity copper alloy comprises the following steps:
(1) Raw material preparation: according to the weight ratio of Cu to Ni to Si to Ti of 95.15:3.20:0.67: weighing pure Cu, pure Ni, pure Si and pure Ti according to the proportion of 0.98 as raw materials for standby;
(2) Preparation of as-cast Cu-Ni-Si-Ti alloy: placing pure copper in a smelting furnace, adding charcoal to cover under Ar environment condition for smelting to form copper-based melt, adding other raw materials when the temperature of the melt reaches 1200 ℃, forming Cu-Ni-Si-Ti alloy melt, preserving heat for 10min, adding cryolite for deslagging treatment, and pouring to obtain as-cast Cu-Ni-Si-Ti alloy;
(3) Deformation of Cu-Ni-Si-Ti alloy: heating the alloy ingot to the temperature of homogenizing annealing for heat preservation treatment, then carrying out hot rolling and online quenching, milling the surface of the hot rolled product, and finally carrying out cold rolling treatment to obtain the rolled Cu-Ni-Si-Ti alloy;
the temperature of the homogenizing annealing is 975 ℃, and the heat preservation treatment time is 4 hours; the initial rolling temperature of the hot rolling is 975 ℃, the final rolling temperature of the hot rolling is 800 ℃, the pass processing rate of the hot rolling is 20-30%, and the total processing rate is 80%; the quenching cooling mode is water cooling; the single-side milling amount of the milling surface is 0.5mm; the pass processing rate of the cold rolling is 20-30%, and the total processing rate is 60%;
(4) Heat treatment of Cu-Ni-Si-Ti alloy: and (3) carrying out aging treatment on the rolled Cu-Ni-Si-Ti alloy, wherein the aging temperature is 450 ℃, preserving heat for 16 hours, and air cooling to room temperature after aging is finished to obtain the high-strength high-conductivity Cu-Ni-Si-Ti alloy.
Through performance test, the hardness of the prepared Cu-Ni-Si-Ti alloy reaches 185.6HV, the tensile strength reaches 536.3MPa, and the conductivity is kept at 54% IACS.
Example 3
A preparation method of Cu-Ni-Si-Ti high-strength high-conductivity copper alloy comprises the following steps:
(1) Raw material preparation: according to the weight ratio of Cu to Ni to Si to Ti of 95.59:3.20:0.71: weighing pure Cu, pure Ni, pure Si and pure Ti according to the proportion of 0.50 as raw materials for standby;
(2) Preparation of as-cast Cu-Ni-Si-Ti alloy: placing pure copper in a smelting furnace, adding charcoal to cover under Ar environment condition for smelting to form copper-based melt, adding other raw materials when the temperature of the melt reaches 1200 ℃, forming Cu-Ni-Si-Ti alloy melt, preserving heat for 10min, adding cryolite for deslagging treatment, and pouring to obtain as-cast Cu-Ni-Si-Ti alloy;
(3) Deformation of Cu-Ni-Si-Ti alloy: heating the alloy cast ingot to a homogenizing annealing temperature for heat preservation treatment, then carrying out hot rolling and online quenching, milling the surface of a hot rolled product, and finally carrying out cold rolling treatment to obtain a rolled Cu-Ni-Si-Ti alloy;
the temperature of the homogenizing annealing is 975 ℃, and the heat preservation treatment time is 4 hours; the initial rolling temperature of the hot rolling is 975 ℃, the final rolling temperature of the hot rolling is 800 ℃, the pass processing rate of the hot rolling is 20-30%, and the total processing rate is 80%; the quenching cooling mode is water cooling; the single-side milling amount of the milling surface is 0.5mm; the pass processing rate of the cold rolling is 20-30%, and the total processing rate is 60%;
(4) Heat treatment of Cu-Ni-Si-Ti alloy: and (3) carrying out aging treatment on the rolled Cu-Ni-Si-Ti alloy, wherein the aging temperature is 450 ℃, the heat preservation is carried out for 1h, and the air cooling is carried out to room temperature after the aging is finished, so that the high-strength high-conductivity Cu-Ni-Si-Ti alloy is obtained.
Through performance test, the hardness of the prepared Cu-Ni-Si-Ti alloy reaches 226.1HV, the tensile strength reaches 632.8MPa, and the conductivity is kept at 40% IACS.
Example 4
A preparation method of Cu-Ni-Si-Ti high-strength high-conductivity copper alloy comprises the following steps:
(1) Raw material preparation: the weight ratio of Cu to Ni to Si to Ti is 95.95:3.20:0.75: weighing pure Cu, pure Ni, pure Si and pure Ti according to the proportion of 0.10 as raw materials for standby;
(2) Preparation of as-cast Cu-Ni-Si-Ti alloy: placing pure copper in a smelting furnace, adding charcoal to cover under Ar environment condition for smelting to form copper-based melt, adding other raw materials when the temperature of the melt reaches 1200 ℃, forming Cu-Ni-Si-Ti alloy melt, preserving heat for 10min, adding cryolite for deslagging treatment, and pouring to obtain as-cast Cu-Ni-Si-Ti alloy;
(3) Deformation of Cu-Ni-Si-Ti alloy: heating the alloy cast ingot to a homogenizing annealing temperature for heat preservation treatment, then carrying out hot rolling and online quenching, milling the surface of a hot rolled product, and finally carrying out cold rolling treatment to obtain a rolled Cu-Ni-Si-Ti alloy;
the temperature of the homogenizing annealing is 900 ℃, and the heat preservation treatment time is 4 hours; the initial rolling temperature of the hot rolling is 900 ℃, the final rolling temperature of the hot rolling is 750 ℃, the pass processing rate of the hot rolling is 20-30%, and the total processing rate is 80%; the quenching cooling mode is water cooling; the single-side milling amount of the milling surface is 0.5mm; the pass processing rate of the cold rolling is 20-30%, and the total processing rate is 60%;
(4) Heat treatment of Cu-Ni-Si-Ti alloy: and (3) carrying out aging treatment on the rolled Cu-Ni-Si-Ti alloy, wherein the aging temperature is 450 ℃, preserving heat for 2 hours, and air cooling to room temperature after aging is finished to obtain the high-strength high-conductivity Cu-Ni-Si-Ti alloy.
Through performance test, the prepared Cu-Ni-Si-Ti alloy has the hardness of 261.8HV, the tensile strength of 761.5MPa and the conductivity of 40 percent IACS.
Example 5
A preparation method of Cu-Ni-Si-Zr high-strength high-conductivity copper alloy comprises the following steps:
(1) Raw material preparation: according to the weight ratio of Cu to Ni to Si to Zr of 95.72:3.20:0.70: weighing pure Cu, pure Ni, pure Si and Cu-40Zr intermediate alloy in a proportion of 0.38 as raw materials for standby;
(2) Preparation of as-cast Cu-Ni-Si-Zr alloy: placing pure copper in a smelting furnace, adding charcoal to cover under Ar environment condition for smelting to form copper-based melt, adding other raw materials when the temperature of the melt reaches 1200 ℃, forming Cu-Ni-Si-Zr alloy melt, preserving heat for 10min, and pouring to obtain as-cast Cu-Ni-Si-Zr alloy;
(3) Heat treatment of Cu-Ni-Si-Zr alloy: carrying out solution treatment and aging treatment on the as-cast Cu-Ni-Si-Zr alloy;
the solid solution temperature is 950 ℃, the temperature is kept for 2 hours, and then water cooling quenching is carried out; the aging temperature is 475 ℃, the heat is preserved for 8 hours, and the temperature is cooled to room temperature after the aging is finished, so that the high-strength high-conductivity Cu-Ni-Si-Zr alloy is obtained.
Through performance test, the prepared Cu-Ni-Si-Ti alloy has the hardness of 234.7HV, the tensile strength of 700.5MPa and the conductivity of 41 percent IACS.
Example 5
A preparation method of Cu-Ni-Si-V high-strength high-conductivity copper alloy comprises the following steps:
(1) Raw material preparation: the weight ratio of Cu to Ni to Si to V is 95.00:4.00:0.95: weighing pure Cu, pure Ni, pure Si and Cu-20V intermediate alloy according to the proportion of 0.05 as raw materials for standby;
(2) Preparation of as-cast Cu-Ni-Si-V alloy: placing pure copper in a smelting furnace, adding charcoal to cover under Ar environment condition for smelting to form copper-based melt, adding other raw materials when the temperature of the melt reaches 1200 ℃, forming Cu-Ni-Si-V alloy melt, preserving heat for 10min, and pouring to obtain as-cast Cu-Ni-Si-V alloy;
(3) Heat treatment of Cu-Ni-Si-V alloy: carrying out solution treatment and aging treatment on the as-cast Cu-Ni-Si-V alloy;
the solid solution temperature is 950 ℃, the temperature is kept for 2 hours, and then water cooling quenching is carried out; the aging temperature is 475 ℃, the heat is preserved for 1h, and the temperature is cooled to room temperature after the aging is finished, so that the high-strength high-conductivity Cu-Ni-Si-V alloy is obtained.
Through performance test, the prepared Cu-Ni-Si-V alloy has the hardness of 261.5HV, the tensile strength of 807.5MPa and the conductivity of 34 percent IACS.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (10)
1. The micro-nano particle hybrid reinforced high-strength high-conductivity Cu-Ni-Si-X alloy is characterized by comprising the following elements in percentage by weight:
0.5 to 10.00 percent of Ni, 0.01 to 4.00 percent of Si, 0.01 to 5.00 percent of X, and the balance of Cu and unavoidable impurities;
and X is one or more of Ti, zr, V, nb, cr and Hf elements.
2. The process for preparing the micro-nano particle hybrid enhanced high-strength high-conductivity Cu-Ni-Si-X alloy according to claim 1, which is characterized by comprising the following steps:
s1, preparing raw materials: weighing the raw materials according to the mass percentage;
s2, preparing an as-cast Cu-Ni-Si-X alloy: smelting pure copper in a smelting furnace to form a copper-based melt, adding other raw materials to form a Cu-Ni-Si-X alloy melt, preserving heat, and pouring to obtain an as-cast Cu-A-M-Si-X alloy;
s3, heat treatment of Cu-Ni-Si-X alloy: and carrying out heat treatment on the as-cast Cu-Ni-Si-X alloy to obtain the micro-nano particle hybrid reinforced high-strength high-conductivity Cu-Ni-Si-X alloy.
3. The process for preparing the micro-nano particle hybrid enhanced high-strength high-conductivity Cu-Ni-Si-X alloy according to claim 2, wherein the smelting temperature is 1150-1250 ℃.
4. The process for preparing the micro-nano particle hybrid enhanced high-strength high-conductivity Cu-Ni-Si-X alloy according to claim 2, wherein the metal melt is subjected to melt purification treatment after heat preservation.
5. The process for preparing a micro-nano particle hybrid enhanced high-strength high-conductivity Cu-Ni-Si-X alloy according to claim 2, wherein the heat treatment process is performed before or during or after deformation of the alloy.
6. The process for preparing the micro-nano particle hybrid enhanced high-strength high-conductivity Cu-Ni-Si-X alloy according to claim 5, wherein the alloy deformation process is one or two of rolling and drawing.
7. The process for preparing the micro-nano particle hybrid enhanced high-strength high-conductivity Cu-Ni-Si-X alloy according to claim 5, wherein the alloy is subjected to homogenizing annealing treatment before deformation, the annealing temperature is 850-1000 ℃, and the heat preservation time is 4-8 h.
8. The process for preparing a micro-nano particle hybrid enhanced high-strength high-conductivity Cu-Ni-Si-X alloy according to claim 2, wherein the heat treatment is one or both of solution treatment and aging treatment.
9. The process for preparing the micro-nano particle hybrid enhanced high-strength high-conductivity Cu-Ni-Si-X alloy according to claim 2, wherein the solution treatment temperature is 850-950 ℃ and the heat preservation time is 2-4 h.
10. The process for preparing the micro-nano particle hybrid enhanced high-strength high-conductivity Cu-Ni-Si-X alloy according to claim 2, wherein the aging temperature treatment temperature is 425-525 ℃ and the heat preservation time is 0.5-6 h.
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