CN116801505A - Repairing method and device suitable for LGA packaging device - Google Patents
Repairing method and device suitable for LGA packaging device Download PDFInfo
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- CN116801505A CN116801505A CN202310707507.XA CN202310707507A CN116801505A CN 116801505 A CN116801505 A CN 116801505A CN 202310707507 A CN202310707507 A CN 202310707507A CN 116801505 A CN116801505 A CN 116801505A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000007650 screen-printing Methods 0.000 claims abstract description 47
- 230000008439 repair process Effects 0.000 claims abstract description 42
- 238000003466 welding Methods 0.000 claims abstract description 39
- 238000007781 pre-processing Methods 0.000 claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims description 32
- 230000007246 mechanism Effects 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000003973 paint Substances 0.000 claims description 7
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 229920006335 epoxy glue Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 description 14
- 238000005476 soldering Methods 0.000 description 11
- 238000001514 detection method Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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Abstract
The application discloses a repairing method and a device suitable for an LGA packaging device, which belong to the technical field of repairing packaging devices, wherein the repairing method comprises the following steps: detecting an LGA packaging device to be repaired and determining a fault component; preprocessing the LGA packaging device to be reworked and the replacement component corresponding to the fault component; removing the fault components on the LGA packaging device to be repaired; performing silk screen printing on the replaced components; welding the replacement component to the printed board to obtain a modified LGA packaging device; the finished LGA package device is inspected. A repair device corresponding to the repair method is also disclosed. The application provides a repair method and a repair device suitable for an LGA packaging device, which can be accurately adapted to LGA packaging to be repaired with different structural sizes, accurately realize efficient and accurate replacement of the components to be repaired aiming at the components to be repaired existing on a printed board with denser components, and obviously reduce repair cost of the LGA packaging device while ensuring repair quality of the LGA packaging device.
Description
Technical Field
The application belongs to the technical field of repairing of packaging devices, and particularly relates to a repairing method and device suitable for an LGA packaging device.
Background
With the development of electronic packaging technology, high-density array devices such as LGA packages and the like are becoming more and more popular today, and even though stable and improved production quality is obtained by using high-precision machine equipment and strict quality control means, rework cannot be eliminated 100%. In addition, the space product has a complex use environment, so that the condition that the printed board assembly is unqualified in the screening process is inevitably required to be repaired.
The printed board and the components have the practical problem of secondary heating in the repairing process, so that how to ensure the repairing qualification and reduce the damage of the printed board is very important in the repairing process.
For the LGA packaging device, no solder balls exist at the bottom, the number of bottom bonding pads is large, the space is compact, the repairing difficulty is high, and welding defects such as tin connection, surplus and the like are easy to occur.
At present, the common method for repairing the LGA packaging device is as follows: and (3) performing moisture removal treatment and tin coating and gold removing treatment on pins of the components packaged by the LGA, then manually applying soldering paste to bonding pads of the components at the soldering positions on the printed board one by using a semi-automatic dispensing machine, then placing the components on the printed board in an aligned manner, and welding the components on the printed board by using a repair workstation. When the soldering paste is manually applied to the component one by one, the soldering paste consumption and the form consistency of each soldering pad cannot be controlled, so that defects such as insufficient soldering point pads, soldering point bridging and the like can occur after the component is repaired, and the product performance is further affected.
Disclosure of Invention
Aiming at one or more of the defects or improvement requirements of the prior art, the application provides a repairing method and a repairing device suitable for an LGA packaging device, which can be accurately adapted to LGA packaging to be repaired with different structural sizes, accurately realize efficient and accurate replacement of the components to be repaired aiming at the components to be repaired existing on a printed board with denser components, and obviously reduce the repairing cost of the LGA packaging device while ensuring the repairing quality of the LGA packaging device.
In order to achieve the above object, the present application provides a repair method and apparatus for an LGA package device, for repairing and replacing part or all of components on the LGA package device to be repaired, comprising the steps of:
detecting the LGA packaging device to be repaired and determining a fault component on the LGA packaging device to be repaired;
preprocessing the LGA packaging device to be repaired and the replacement component corresponding to the fault component;
removing the fault component on the LGA packaging device to be repaired;
performing silk screen printing on the replacement component to obtain a silk screen printing replacement component;
welding the silk-screen replacement component onto the printed board of the to-be-repaired LGA packaging device and dismantling the fault component to obtain the repaired LGA packaging device;
detecting the modified LGA package device and judging whether the modified LGA package device meets the requirement; if yes, finishing repairing; if not, replacing and/or welding the replacement component.
As a further preferred aspect of the present application, the pretreatment of the LGA packaged device to be reworked includes the steps of:
reinforcing local components around the fault component;
and removing the moistureproof paint on the LGA packaging device to be repaired corresponding to the fault component area.
As a further preferred aspect of the present application, the reinforcement of the local component includes: and reinforcing the periphery of the local component by using spot-coating epoxy glue or silicone rubber.
As a further preferred aspect of the present application, the preprocessing of the replacement component corresponding to the faulty component includes the steps of:
removing water vapor in the replacement component by adopting drying equipment; gold removing treatment is carried out on the pins of the replacement component; and cleaning the silicon rubber on the replacement component.
The application also discloses a repairing device suitable for the LGA packaging device, which adopts the repairing method suitable for the LGA packaging device to realize the repairing of the LGA packaging device to be repaired, and comprises the following steps:
the welding mechanism comprises a welding member and a plurality of heating modules which are independently controlled to operate, wherein the heating modules are used for heating areas to be disassembled and/or welded on the LGA packaging device; the welding component is used for disassembling or welding the fault component and the replacement component;
the component alignment mechanism is used for accurately aligning and mounting the replacement component and the printed board;
the silk-screen printing mechanism comprises a positioning member and a silk-screen printing member, wherein the positioning member is used for positioning the replacement components with different structural sizes; the silk screen member is arranged on the top end face of the positioning member, and at least one solder paste through hole is further formed in the silk screen member, and the solder paste coated on the silk screen member is partially or completely coated on the replacement component through the solder paste through hole.
As a further preferred aspect of the present application, the positioning member includes a positioning surface facing the screen printing member, the positioning surface includes at least two support modules and at least one guide module, and at least one support module is slidably disposed in each guide module, so as to adjust a limit range between the support modules according to a size and a shape of the replacement component.
As a further preferred aspect of the present application, the support module further includes a locking unit for fixing the support module to the positioning surface after the support module is adjusted in place.
As a further preferred aspect of the application, the guiding module is a cross groove formed on the positioning surface, and at least one supporting module is arranged on each branch of the cross groove.
As a further preferable mode of the application, the screen printing component comprises a first shell and a screen printing plate, wherein the first shell is provided with an opening penetrating through the top end face and the bottom end face of the first shell, the screen printing plate is provided with at least one solder paste through hole, and the screen printing plate is detachably limited on the top end face of the positioning component by the first shell.
As a further preferred aspect of the present application, the screen printing member further includes a second housing disposed at the other side of the screen printing plate with respect to the first housing, the second housing is provided with an opening corresponding to the solder paste through hole, and a limiting assembly is disposed between the second housing and the positioning member.
The above-mentioned improved technical features can be combined with each other as long as they do not collide with each other.
In general, the above technical solutions conceived by the present application have the beneficial effects compared with the prior art including:
(1) The application relates to a repair method and a repair device suitable for an LGA packaging device, which are used for determining a fault component by detecting the LGA packaging device to be repaired; preprocessing the LGA packaging device to be reworked and the replacement component corresponding to the fault component; removing the fault components on the LGA packaging device to be repaired; performing silk screen printing on the replaced components; welding the replacement component to the printed board to obtain a modified LGA packaging device; the finished LGA package device is inspected. The method is matched with the repairing equipment corresponding to the repairing method, so that the method can be accurately suitable for LGA packaging to be repaired with different structural sizes, and aims at the components to be repaired existing on the printed board with denser components, so that the components to be repaired can be accurately replaced with each other, the repairing quality of the LGA packaging components is ensured, and the repairing cost of the LGA packaging components is obviously reduced.
(2) The application relates to a repairing method and a repairing device suitable for an LGA packaging device, which are characterized in that a plurality of T-shaped guide modules and T-shaped support modules correspondingly arranged in the guide modules are arranged on a positioning surface, so that the positioning of replacement components suitable for different structural forms and different sizes can be formed through the mutual matching of the support modules. And through the locking component who sets up on supporting module for supporting module can be accurate stable locking on the locating surface, avoid replacing the removal of components and parts appear in the silk screen printing in-process of replacing components and parts, and then effectively ensured the silk screen printing accuracy of replacing components and parts.
(3) The repair method and the repair device suitable for the LGA packaging device are simple and convenient in steps, wide in applicability and high in accuracy, the fault component is determined through accurate detection of the LGA packaging device to be repaired, the fault component is accurately removed from the printed board, and solder paste silk-screen printing of the replacement component in any structural form is realized by adopting a silk-screen printing mechanism, so that the replacement component can be stably welded on the printed board, and reliable guarantee is provided for repairing the repair component. Meanwhile, the positioning member can be accurately adapted to replacement components in different structural forms by the aid of the guiding die and the supporting module which are matched in a sliding manner on the positioning member, and the silk-screen printing plate with at least one solder paste through hole is matched, so that the silk-screen printing mechanism can be used for paving solder paste on the end faces of pins of the replacement components in any structural form. And through setting up the welding mechanism and the unit ware counterpoint mechanism that have a plurality of heating regions, ensure the accurate dismantlement and the stable welding of components and parts on the different structural style printing boards as far as possible, showing and having promoted the repair quality and the repair qualification rate of this repair method and device that are applicable to LGA encapsulation device, having good economic benefits and spreading value.
Drawings
FIG. 1 is a flow chart of a rework method of the present application for an LGA packaged device;
FIG. 2 is a perspective view of the overall structure of a rework device of the present application suitable for use with an LGA package;
FIG. 3 is a perspective view of a locating member of a rework apparatus for LGA packages in accordance with the present application;
FIG. 4 is a perspective view of a support module in a rework apparatus for LGA packaged devices in accordance with the present application;
FIG. 5 is a perspective view of a first housing of a rework device of the present application for an LGA package;
FIG. 6 is a perspective view of a screen printing plate in a rework device for LGA packages in accordance with the present application;
FIG. 7 is a front view of a screen printing plate in a rework device for LGA packages in accordance with the present application;
fig. 8 is a perspective view of a second housing of a rework device of the application suitable for use with an LGA package device.
Like reference numerals denote like technical features throughout the drawings, in particular:
1. a positioning member; 101. a positioning surface; 102. a support module; 103. a guide module; 104. a locking assembly; 105. a base; 106. a connecting piece;
2. a screen printing member; 201. a first housing; 202. a second housing; 203. a silk screen plate; 204. solder paste through holes; 205. and a limiting component.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application. In addition, the technical features of the embodiments of the present application described below may be combined with each other as long as they do not collide with each other.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
Examples:
as shown in fig. 1 to 8, the repair method and the repair device for the LGA packaging device in the preferred embodiment of the application can be accurately adapted to LGA packaging to be repaired with different structural sizes, accurately realize efficient and accurate replacement of components to be repaired aiming at the components to be repaired existing on a printed board with denser components, and obviously reduce the repair cost of the LGA packaging device while ensuring the repair quality of the LGA packaging device.
Specifically, as shown in fig. 1, the repair method adapted to an LGA package includes the steps of:
s1, detecting an LGA packaging device to be repaired and determining a fault component on the LGA packaging device to be repaired;
s2, preprocessing the LGA packaging device to be repaired and the replacement component corresponding to the fault component;
s3, removing the fault components on the LGA packaging device to be repaired;
s4, performing silk screen printing on the replacement component to obtain a silk screen printing replacement component;
s5, welding the silk-screen replacement component onto a printed board of the to-be-repaired LGA packaging device dismantling fault component to obtain a repaired LGA packaging device;
s6, detecting the repaired LGA packaging device and judging whether the repaired LGA packaging device meets the requirement; if yes, finishing repairing; if not, the replacement component is replaced and/or soldered.
Further, in a preferred embodiment of the present application, the pretreatment of the LGA package device to be reworked includes the steps of:
reinforcing local components around the fault components;
and removing the moistureproof paint on the LGA packaging device to be reworked corresponding to the fault component area.
Because the LGA packaging device can be coated with the dampproof paint in the production and preparation process, the influence of moist air or water vapor on the LGA packaging device is avoided. In the overhauling process of the LGA packaging device with repairing, the existence of the moistureproof paint can influence the melting effect of welding spots, so that the LGA packaging device is not qualified in repairing.
Further preferably, in a preferred embodiment of the present application, a paint remover is used to remove moisture resistant paint from the LGA package to be reworked.
Further, in the preferred embodiment of the application, the local component is reinforced by the way of dispensing epoxy glue or silicone rubber around the local component, so that the problem that the LGA packaging device is failed to repair due to displacement or collapse of the welding spot caused by the influence on the local component after the welding spot of the fault component is melted in the repair process is effectively avoided.
Still preferably, in a preferred embodiment of the present application, the preprocessing of the replacement component corresponding to the failed component includes the steps of: removing water vapor in the replacement components by adopting drying equipment; gold removing treatment is carried out on pins of the replacement component; and cleaning the silicon rubber on the replaced component.
More specifically, in the preferred embodiment of the present application, the replacement component is baked using a vacuum oven to remove moisture from the replacement component.
Further, in the preferred embodiment of the present application, the gold removal process for replacing the component pins is accomplished using a solder pot or an electric soldering iron.
Further preferably, in the preferred embodiment of the present application, after the removal of the faulty component is completed, the surplus solder on the printed board needs to be removed, so as to ensure that the replacement component can be accurately soldered to the printed board.
More specifically, in the preferred embodiment of the present application, after the completion of the soldering of the replacement component on the printed board, the finished LGA package device is inspected, thereby ensuring the inspection accuracy of the LGA package device. Preferably, the detection of the modified LGA encapsulator uses X-ray detection.
Further, as shown in fig. 2 to 8, in a preferred embodiment of the present application, a repair apparatus for an LGA package device is also disclosed, which is capable of implementing efficient and accurate repair of an LGA package device using the above repair method for an LGA package device.
Specifically, in a preferred embodiment of the present application, the rework device includes a welding mechanism, a component pair mechanism, and a screen printing mechanism.
The welding mechanism is used for realizing the dismantling of the fault components on the printed board or the welding of the replacement components on the printed board, and comprises a welding member and a plurality of heating modules which can be controlled independently, wherein the welding member can move at any position in space in a plurality of degrees of freedom in a manual or automatic mode, and the dismantling of the fault components or the welding of the replacement components is realized through the welding end arranged on the welding member. And a plurality of individually controllable heating modules form an entire heating zone. In the actual use process, the corresponding heating module can be flexibly controlled to work according to the area of the fault component to be replaced in the printed board or the area of the replacement component on the printed board, so that the adaptability of the repairing device to the repairing of LGA packaging devices in different structural forms or different sizes and shapes is improved. Preferably, the heating module employs infrared heating.
Further, in the preferred embodiment of the application, the welding mechanism further comprises a temperature measuring component, the temperature measuring component is used for accurately detecting the temperature in the welding process in real time, and whether the welding parameters of the welding mechanism meet the regulations or not is judged according to the temperature measured by the temperature measuring component, so that the welding process of the reflow oven can be simulated as much as possible. Further preferably, the soldering parameters are determined according to the thickness of the soldering component, the thickness of the printed board, the grounding condition of the LGA package device, and the solder paste specification.
Further, in the preferred embodiment of the application, the component alignment mechanism is used for realizing rapid and accurate alignment and mounting between the replacement component and the printed board in the stable welding process between the replacement component and the printed board. Preferably, the component alignment mechanism comprises a semiautomatic optical alignment member which can realize the movement of any position in space, and a vacuum adsorption unit is further arranged at the movement end of the semiautomatic optical alignment member, so that the semiautomatic optical alignment member can realize the accurate alignment and the lamination of the replacement component and the printed board.
Further, in the preferred embodiment of the application, the silk-screen mechanism is used for accurately and stably coating the solder paste on the end face of the pin of the replacement component, so that the welding accuracy between the replacement component and the printed board is ensured. The screen printing mechanism comprises a positioning member 1 and a screen printing member 2. The positioning component 1 is used for realizing accurate positioning of replacement components with different structural sizes, and ensuring that the replacement components can be kept stable at accurate positions when solder paste screen printing is performed. The screen printing member 2 is arranged on the top end surface of the positioning member 1, and at least one solder paste through hole 204 is further formed in the screen printing member 2. In the actual use process, the positioning component 1 is adjusted to position the replacement component, so that pins on the replacement component can be aligned with the solder paste through holes 204, and the solder paste on the screen printing component 2 can be partially or completely coated on the replacement component.
Still preferably, in a preferred embodiment of the present application, the positioning member 1 includes a positioning surface 101, and at least two support modules 102 and at least one guide module 103 disposed on the positioning surface 101, and each guide module 103 is slidably provided with at least one support module 102, so that each support module 102 can slide on any position on the guide module 103, so as to facilitate positioning of a replacement component adapted to different structural forms, and enable pins of the replacement component to pass through the holes 204 of Ji Xigao.
More specifically, in a preferred embodiment of the present application, the positioning surface 101 is provided with a guide module 103 extending along the first direction, and since the positioning member 1 includes two support modules 102, the two support modules 102 are simultaneously slidably disposed on the guide module 103, and the positioning member 1 is adapted to the positioning of the replacement component by adjusting the spacing distance between the two support modules 102 along the first direction.
Further preferably, the arrangement of the guide modules 103 on the positioning surface 101 is not limited to the above-mentioned form, and in another preferred embodiment of the present application, the guide modules 103 with different lengths are arranged on the positioning surface 101 along multiple directions, and the directions in which the respective guide modules 103 are located are not coincident, for example, the respective guide modules 103 form one or more of a concentric zig-zag structure, a cross structure, or a polygonal structure, and the support modules 102 provided on the respective guide modules 103 construct a positioning suitable for replacing components with different structural forms.
Further, in the preferred embodiment of the present application, a cross-shaped guiding module 103 is disposed on the positioning surface 101, and at least one supporting module 102 is disposed on a branch corresponding to each cross-shaped guiding module 103.
Further preferably, in a preferred embodiment of the present application, the guiding module 103 is a guiding groove or guiding rail, and the end of the supporting module 102 facing the positioning surface 101 is provided with a sliding block or sliding groove, so as to realize a sliding connection between the guiding module 103 and the supporting module 102. Preferably, the cross section of the guide groove or the cross section of the guide rail is T-shaped, and correspondingly, the cross section of the end of the support module 102 facing the positioning surface 101 is also T-shaped.
More specifically, in the preferred embodiment of the present application, one end of the supporting module 102 facing away from the positioning surface 101 is in a rectangular structure, and a limiting notch is further provided on the rectangular structure, that is, a limiting notch is provided on the top end surface of the supporting module 102, and the limiting notch is preferably provided at an edge position of the top end of the supporting module 102 facing the center of the positioning surface 101, so that a notch with an L-shaped vertical section (the vertical direction is perpendicular to the ground) is formed on the supporting module 102, and further, the top end surface of the supporting module 102 can accurately realize limiting of the replacement component. Further preferably, the limiting notch is disposed at an edge of the top end surface of the support module 102, that is, a rectangular limiting notch is disposed at the edge. In the actual use process, the corner of the replacement component is clamped through the limiting notch, so that the support and limiting of the replacement component by the support module 102 are realized.
Further, in the preferred embodiment of the present application, a locking assembly 105 is further disposed on the support module 102, and the locking assembly 105 preferably penetrates through a screw hole of the support module 102 in a vertical direction, and in a practical use process, the bottom plate of the bolt abuts against the positioning surface 101 by screwing the bolt in the screw hole, so that the support module 102 and the guide module 103 are locked or unlocked. That is, when the bottom of the bolt abuts against the positioning surface 101, the T-shaped slider and the T-shaped chute are driven to abut against each other, so as to form a static friction force of the locking support module 102.
Further, in another preferred embodiment of the present application, the locking assembly 105 is not limited to the above-mentioned form, the guide module 103 is a cross-shaped guide groove crossing along the first direction and the second direction, a support module 102 is disposed on each cross-shaped guide groove, a strut is disposed corresponding to each support module 102, one end of each strut is away from the center point of the cross-shaped guide groove and extends beyond the positioning surface 101, the other end of each strut is provided with an external thread, and is in a conical structure at the end, correspondingly, a horizontal T-shaped tee is disposed in the middle of the support module 102, the first channel is perpendicular to the second channel and the second channel, an internal thread matching with the external thread of the strut is disposed in the first channel, and wedge blocks are disposed in the second channel and the third channel. In the actual use process, the position of the supporting module 102 is adjusted by pulling the supporting rod, and after the position reaches accuracy, the conical structure extrudes the wedge blocks in the second channel and the third channel by rotating the supporting rod, so that the wedge blocks are abutted against the inner wall of the guide groove, and further the locking of the supporting module 102 is realized.
Further, in the preferred embodiment of the present application, the positioning member 1 further comprises a base 105, at least one blind hole is formed on a top end surface of the base 105 to form a receiving cavity, and the positioning surface 101 is disposed on a bottom end surface of the receiving cavity. Preferably, at least one detachable connection 106 is provided between the base 105 and the table for enabling a detachable connection between the table and the base 105. Preferably, the connector 106 is one or more of a magnetic assembly, a bolting assembly, a clamp, or the like.
Further, in the preferred embodiment of the present application, the screen printing member 2 includes a screen printing plate 203 and a first housing 201, wherein at least one solder paste through hole 204 vertically penetrating the top and bottom surfaces is provided on the screen printing plate 203, and the first housing 201 is also provided with openings penetrating the top and bottom surfaces. In the actual use process, the screen printing plate 203 is detachably buckled on the top end surface of the positioning member 1 through the first shell 201, and the solder paste through holes 204 correspond to the openings, namely, each solder paste through hole 204 falls in the range of the opening, so that solder paste coated in the opening can be uniformly coated on the pin positions of the replacement components through each solder paste through hole 204, and the repair quality of the repair device is ensured. Preferably, the silk-screen plate 203 is made of stainless steel materials, so that tension of the silk-screen plate 203 is ensured, and silk-screen quality of replacement components is improved. Preferably, the first housing 201 is preferably a rectangular frame.
Further preferably, in the preferred embodiment of the present application, the screen printing member 2 further comprises a second housing 202, which is disposed between the screen printing plate 203 and the positioning member 1, and the second housing 202 is also provided with an opening, preferably, the shape of the opening of the second housing 202 is similar to that of the opening of the first housing 201, and the size of the opening of the second housing 202 is larger than that of the opening of the first housing 201, so as to ensure that the opening of the second housing 202 can accommodate the solder paste through holes 204 on the screen printing plate 203 while also covering the replacement components with different sizes and shapes. Preferably, the second housing 202 is preferably a rectangular frame.
Further, in the preferred embodiment of the present application, the first housing 201 and the second housing 202 are detachably connected, and in order to secure the opposing area between the first housing 201 and the second housing 202, at least one limiting assembly 205 is further provided between the first housing 201 and the second housing 202. Preferably, the stop assembly 205 is a pin and pinhole correspondingly disposed between the first housing 201 and the second housing 202. It is further preferred that through holes are further provided on the screen 203 at positions corresponding to the pin holes to ensure that the limiting assembly 205 simultaneously realizes stable limiting between the first housing 201, the screen 203 and the second housing 202. Preferably, four limiting assemblies 205 are uniformly distributed on the first housing 201 and the second housing 202 along the circumferential direction.
Further preferably, in a preferred embodiment of the present application, a limiting assembly 205 is also provided between the second housing 202 and the positioning member 1 for achieving a removable limit between the screen printing member 2 and the positioning member 1.
The repair method and the repair device suitable for the LGA packaging device are simple in steps, wide in applicability and high in accuracy, the fault component is determined through accurate detection of the LGA packaging device to be repaired, and the solder paste silk-screen of the replacement component in any structural form is realized through accurate removal of the fault component from the printed board and adoption of the silk-screen mechanism, so that the replacement component can be stably welded on the printed board, and reliable guarantee is provided for repair of the repair component. Meanwhile, by the aid of the guide die and the support module 102 which are in sliding fit on the positioning member 1, the positioning member 1 can be accurately adapted to replacement components in different structural forms, and the screen printing plate 203 provided with at least one solder paste through hole 204 is matched, so that the screen printing mechanism can be used for paving solder paste on the end faces of pins of replacement components in any structural form. And through setting up the welding mechanism and the unit ware counterpoint mechanism that have a plurality of heating regions, ensure the accurate dismantlement and the stable welding of components and parts on the different structural style printing boards as far as possible, showing and having promoted the repair quality and the repair qualification rate of this repair method and device that are applicable to LGA encapsulation device, having good economic benefits and spreading value.
It will be readily appreciated by those skilled in the art that the foregoing description is merely a preferred embodiment of the application and is not intended to limit the application, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the application are intended to be included within the scope of the application.
Claims (10)
1. A repair method for an LGA packaged device for repairing and replacing a part or all of components on the LGA packaged device to be repaired, comprising the steps of:
detecting the LGA packaging device to be repaired and determining a fault component on the LGA packaging device to be repaired;
preprocessing the LGA packaging device to be repaired and the replacement component corresponding to the fault component;
removing the fault component on the LGA packaging device to be repaired;
performing silk screen printing on the replacement component to obtain a silk screen printing replacement component;
welding the silk-screen replacement component onto the printed board of the to-be-repaired LGA packaging device and dismantling the fault component to obtain the repaired LGA packaging device;
detecting the modified LGA package device and judging whether the modified LGA package device meets the requirement; if yes, finishing repairing; if not, replacing and/or welding the replacement component.
2. The rework method of claim 1, wherein the preprocessing of the LGA packaged device to be reworked comprises the steps of:
reinforcing local components around the fault component;
and removing the moistureproof paint on the LGA packaging device to be repaired corresponding to the fault component area.
3. The rework method of claim 2, wherein the reinforcing of the local component comprises: and reinforcing the periphery of the local component by using spot-coating epoxy glue or silicone rubber.
4. The rework method of claim 1, wherein the replacement component corresponding to the failed component is preprocessed by:
removing water vapor in the replacement component by adopting drying equipment; gold removing treatment is carried out on the pins of the replacement component; and cleaning the silicon rubber on the replacement component.
5. A repair apparatus for an LGA package according to any one of claims 1 to 5, wherein repair of the LGA package to be repaired is achieved by the repair method for an LGA package, the repair apparatus comprising:
the welding mechanism comprises a welding member and a plurality of heating modules which are independently controlled to operate, wherein the heating modules are used for heating areas to be disassembled and/or welded on the LGA packaging device; the welding component is used for disassembling or welding the fault component and the replacement component;
the component alignment mechanism is used for accurately aligning and mounting the replacement component and the printed board;
the silk-screen printing mechanism comprises a positioning member and a silk-screen printing member, wherein the positioning member is used for positioning the replacement components with different structural sizes; the silk screen member is arranged on the top end face of the positioning member, and at least one solder paste through hole is further formed in the silk screen member, and the solder paste coated on the silk screen member is partially or completely coated on the replacement component through the solder paste through hole.
6. The repair method for an LGA package according to claim 5, wherein the positioning member includes a positioning surface facing the silk-screen member, the positioning surface includes at least two support modules and at least one guide module, and at least one support module is slidably disposed in each guide module, so as to adjust a limit range between the support modules according to a size and shape of the replacement component.
7. The rework method of claim 6, wherein the support module further comprises a locking unit for securing the support module to the locating surface after the support module is adjusted into place.
8. The rework method of claim 6, wherein the guide module is a cross groove formed in the locating surface, and at least one support module is provided on each branch of the cross groove.
9. The repair method for an LGA package of claim 5 wherein the silk-screened member includes a first housing and a silk-screened plate, the first housing has an opening penetrating the top and bottom surfaces of the first housing, the silk-screened plate has at least one solder paste through hole, and the first housing removably retains the silk-screened plate on the top surface of the positioning member.
10. The rework method of claim 9, wherein the screen printing member further comprises a second housing disposed on the other side of the screen printing plate relative to the first housing, the second housing being provided with an opening corresponding to the solder paste through hole, and a spacing assembly being disposed between the second housing and the positioning member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310707507.XA CN116801505A (en) | 2023-06-14 | 2023-06-14 | Repairing method and device suitable for LGA packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310707507.XA CN116801505A (en) | 2023-06-14 | 2023-06-14 | Repairing method and device suitable for LGA packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116801505A true CN116801505A (en) | 2023-09-22 |
Family
ID=88040925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310707507.XA Pending CN116801505A (en) | 2023-06-14 | 2023-06-14 | Repairing method and device suitable for LGA packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116801505A (en) |
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2023
- 2023-06-14 CN CN202310707507.XA patent/CN116801505A/en active Pending
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