CN116793565A

CN116793565A - Sensor for detecting a position of a body

Info

Publication number: CN116793565A
Application number: CN202310467565.XA
Authority: CN
Inventors: 请求不公布姓名; 吴云岗; 黄隆重
Original assignee: Hangzhou Sanhua Research Institute Co Ltd
Current assignee: Hangzhou Sanhua Research Institute Co Ltd
Priority date: 2023-04-27
Filing date: 2023-04-27
Publication date: 2023-09-22

Abstract

A sensor includes a housing, a pressure sensing chip, and a circuit board. The shell comprises a sensing part and a matching part, the sensing part is provided with a channel, the channel is communicated with the outside of the sensor, the pressure sensing chip is provided with a groove, and the groove is communicated with the channel. The sensing part and the matching part are respectively positioned at two sides of the pressure sensing chip along the height direction of the sensor; the sensing part and the matching part are tightly matched with the pressure sensing chip, so that the sensing part is in sealing connection with the pressure sensing chip. The plane perpendicular to the height direction of the sensor is taken as a projection plane, the orthographic projection of the main body part on the projection plane is taken as a first projection along the height direction of the sensor, the orthographic projection of the matching part on the projection plane is taken as a second projection, and the second projection is at least partially overlapped with the first projection. The application can reduce the dislocation between the matching part and the pressure sensing chip, further reduce the dispersion of the acting force of the matching part on the pressure sensing chip, and improve the reliability of the sealing connection between the pressure sensing chip and the sensing part.

Description

Sensor for detecting a position of a body

Technical Field

The application relates to the field of detection, in particular to a sensor.

Background

In the related art, the sensor includes a chip for detecting fluid pressure, a circuit board, and a housing, the chip having a groove. The housing includes a sensing portion having a channel in fluid communication with an exterior of the sensor, and a mating portion, the channel in communication with the recess. The pressure sensing chip needs to be in sealing connection with the sensing part so as to prevent external fluid from entering the sensor to influence the internal structure of the sensor. For this reason, in the related art, the mating portion is abutted with the circuit board, the circuit board is abutted with the pressure sensing chip, and the pressure sensing chip is tightly mated with the sensing portion, so as to realize the sealing connection between the pressure sensing chip and the sensing portion. That is, the mating portion indirectly applies a force to the pressure sensing chip through the circuit board.

Because the matching part and the pressure sensing chip are misplaced, the acting force applied by the matching part to the pressure sensing chip can be dispersed by the circuit board, and the stress of the pressure sensing chip can be caused to be insufficient to enable the pressure sensing chip to be in sealing connection with the sensing part, so that the sealing connection between the chip and the sensing part is unreliable. For this reason, an improvement in the structure of the sensor is required.

Disclosure of Invention

In order to solve the above problems, the present application provides a sensor capable of realizing reliable sealing connection between a chip and a sensing portion.

The application provides a sensor, which comprises a shell, a pressure sensing chip and a circuit board, wherein the pressure sensing chip is arranged on the circuit board;

the shell comprises a sensing part and a matching part, the sensing part is provided with a channel, the channel is communicated with the outside of the sensor, the pressure sensing chip is provided with a groove, and the groove is communicated with the channel;

the sensing part and the matching part are respectively positioned at two sides of the pressure sensing chip along the height direction of the sensor; the sensing part and the matching part are tightly matched with the pressure sensing chip, so that the sensing part is in sealing connection with the pressure sensing chip;

and taking a plane perpendicular to the height direction of the sensor as a projection plane, and taking the orthographic projection of the main body part on the projection plane as a first projection along the height direction of the sensor, wherein the orthographic projection of the matching part on the projection plane is a second projection, and the second projection is at least partially overlapped with the first projection.

In the application, a plane perpendicular to the height direction of the sensor is taken as a projection plane, the orthographic projection of the main body part on the projection plane along the height direction of the sensor is taken as a first projection, the orthographic projection of the matching part on the projection plane is taken as a second projection, and the second projection is at least partially overlapped with the first projection. Therefore, dislocation between the matching part and the pressure sensing chip is reduced, and further, the dispersion of acting force of the matching part on the pressure sensing chip is reduced, and the reliability of sealing connection between the pressure sensing chip and the sensing part is improved.

Drawings

FIG. 1 is a schematic diagram of a sensor provided in one embodiment of the application;

FIG. 2 is an exploded schematic view of a sensor provided in one embodiment of the present application;

FIG. 3 is a schematic cross-sectional view of a sensor provided in one embodiment of the application;

FIG. 4 is a perspective view of a pressure sensing die provided in one embodiment of the present application;

FIG. 5 is a perspective view of another angled pressure sensing die provided by one embodiment of the present application;

FIG. 6 is a schematic view of a projection of a pressure sensor chip, a seal and a mating portion on a projection surface according to an embodiment of the present application;

FIG. 7 is a schematic diagram of the cooperation of the sensing portion, the pressure sensing chip, the circuit board and the cooperation portion according to another embodiment of the present application;

FIG. 8 is a schematic diagram of the cooperation of a sensing portion, a pressure sensing chip, a circuit board and a cooperation portion according to another embodiment of the present application;

FIG. 9 is a schematic diagram of the relative positions of a seal, a pressure sensing die, and a circuit board provided by one embodiment of the present application;

FIG. 10 is a perspective view of a first housing provided in one embodiment of the present application;

FIG. 11 is a perspective view of a further angle of the first housing provided by an embodiment of the present application;

FIG. 12 is a top view of a first housing provided in one embodiment of the application;

FIG. 13 is a cross-sectional view of a first housing provided in one embodiment of the application;

FIG. 14 is a perspective view of a second housing provided in one embodiment of the present application;

fig. 15 is a cross-sectional view of a second housing provided in one embodiment of the present application.

Detailed Description

For a better understanding of the technical solution of the present application, the following detailed description of the embodiments of the present application refers to the accompanying drawings.

It should be understood that the described embodiments are merely some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The sensor 1000 is used to detect fluid pressure. The sensor 1000 includes a sensing module 100, and the sensing module 100 includes a circuit board 6, a pressure detecting chip and a conditioning chip, which are respectively mounted on the circuit board 6. When the fluid pressure is detected, the pressure detection chip generates a pressure detection signal according to the fluid pressure, and then outputs the pressure detection signal to the conditioning chip. The conditioning chip conditions the pressure detection signal. Because the pressure detecting chip and the conditioning chip are respectively arranged, a complex circuit structure is required to be arranged on the circuit board 6 to connect the pressure detecting chip and the conditioning chip, so that the circuit board 6 is larger, and the whole volume of the sensor 1000 is larger.

To this end, a first aspect of the application provides a sensor 1000 comprising a sensing module 100, the sensing module 100 comprising a pressure sensing chip 4 and a circuit board 6, the pressure sensing chip 4 being mounted to the circuit board 6. The pressure sensing chip 4 includes a main body 41 and a pin 42, the main body 41 is connected with the pin 42, the main body 41 has a groove 411, the groove 411 has an opening 412, the opening 412 is located on the surface of the main body 41, the opening 412 is communicated with the outside of the sensor 1000, and the pin 42 is electrically connected with the circuit board 6. The pressure sensing chip 4 is capable of generating a pressure detection signal from the ambient fluid pressure of the sensor 1000, and the pressure sensing chip 4 is capable of conditioning the pressure detection signal, as shown for example in fig. 2 and 3.

In the present application, the sensor 1000 includes a sensing module 100, the sensing module 100 includes a pressure sensing chip 4, the pressure sensing chip 4 is capable of generating a pressure detection signal according to an external fluid pressure of the sensor 1000, and the pressure sensing chip 4 is also capable of conditioning the pressure detection signal. The pressure sensing chip 4 integrates the functions of a pressure detection chip and a conditioning chip, and a circuit structure for connecting the pressure detection chip and the conditioning chip is also integrated in the pressure sensing chip 4, so that the volume of the circuit board 6 is reduced, and the volume of the sensor 1000 is further reduced.

In some embodiments, the body portion 41 has a first surface 43 and a second surface 44, the first surface 43 and the second surface 44 being located on both sides of the body portion 41, respectively, along the height direction H of the sensor 1000, and the opening 412 being located on the first surface 43, as shown in fig. 4 and 5, for example. In some embodiments, first surface 43 and second surface 44 are both planar, and first surface 43 is parallel to the second surface. The circuit board 6 has substantially planar surfaces on both sides, and the pressure sensor chip 4 has planar surfaces on both sides, so that interference between the pressure sensor chip 4 and the circuit board 6 can be reduced when the pressure sensor chip is mounted on the circuit board.

In some embodiments, the pressure sensing die 4 is located outside the circuit board 6, or the pressure sensing die 4 is located at least partially within the circuit board 6.

For the case where the pressure sensing die 4 is located outside the circuit board 6, in particular, in some embodiments, the first surface 43 is remote from the circuit board 6 relative to the second surface 44 in the height direction H of the sensor 1000, as shown for example in fig. 3. As such, fluid outside of sensor 1000 does not need to pass through circuit board 6 to enter recess 411. In other embodiments, the first surface 43 is adjacent to the circuit board 6 relative to the second surface 44 along the height direction H of the sensor 1000, and the circuit board 6 has a through hole 61, and the through hole 61 communicates with the opening 412, as shown in fig. 7, for example. In this way, fluid outside the sensor 1000 passes through the through hole 61 provided in the circuit board 6 before entering the recess 411.

For the case where the pressure sensing die 4 is at least partially located on the circuit board 6, in some embodiments, the circuit board 6 has a through hole 61, the pressure sensing die 4 is at least partially located on the through hole 61, and the first surface 43 is located on the through hole 61, as shown in fig. 8, for example. At this time, the fluid outside the sensor 1000 may first pass through the through hole 61 of the circuit board 6 and then enter the groove 411, or the air inlet channel 201 may be communicated with the groove 411 in the through hole 61, so that the fluid outside the sensor 1000 directly enters the groove 411 through the air inlet channel 201.

In some embodiments, the pressure sensing die 4 is a unitary piece, and the pressure sensing die 4 is injection molded by insert molding. For example, the pressure sensing chip 4 includes a pressure detecting portion, a signal conditioning portion, and a signal conditioning circuit manufactured from a wafer, and an injection-molded case. The pressure sensing chip 4 is formed by insert molding of a pressure detection part, a signal conditioning part and a signal conditioning circuit.

The sensor 1000 further comprises a housing 11 for housing the sensing module 100, the housing 11 having a channel 201, the channel 201 being in fluid communication with the outside of the sensor 1000. The external fluid can flow into the recess 411 of the pressure sensing chip 4 through the channel 201, so that the pressure sensing chip 4 can detect the pressure of the external fluid.

In some embodiments, the pressure sensing die 4 is sealingly connected to the housing 11, and the channel 201 communicates with the opening 412. The pressure sensor chip 4 is connected to the housing 11 in a sealing manner, for example, by bonding, welding, or by sealing means (e.g., elastic sealing rings, rigid gaskets, etc.). Along the height direction of the sensor 1000, the circuit board 6 is distant from the channel 201 with respect to the pressure sensing chip 4. Alternatively, the housing 11 is at least partially located in the through hole 61, the pressure sensing chip 4 is at least partially located in the through hole 61, and the opening 412 is located in the through hole 61. Specifically, the pressure sensing chip 4 is located outside the circuit board 6, the pressure sensing chip 4 is located below the circuit board 6, and the channel 201 is located below the pressure sensing chip 4; the first surface 43 of the pressure sensing die 4 is sealingly connected to the housing 11 below the circuit board 6, as shown for example in fig. 3. Alternatively, in other embodiments, such as shown in fig. 8, the circuit board 6 has a through hole 61, a portion of the housing 11 is located in the through hole 61, the pressure sensing die 4 is located at least partially in the through hole 61, and the opening 412 is located in the through hole 61, and the housing 11 is sealingly connected to the first surface 43 of the pressure sensing die 4 at the circuit board through hole 61.

In other embodiments, such as shown in fig. 7, the pressure sensing die 4 is sealingly connected to the circuit board 6, and the circuit board 6 is sealingly connected to the housing 11. Along the height direction H of the sensor 1000, the pressure sensing chip 4 is far from the channel 201 relative to the circuit board 6, and the pressure sensing chip 4 and the channel 201 are respectively located at two sides of the circuit board 6. The circuit board 6 has a through hole 61, the through hole 61 communicates with the passage 201, and the through hole 61 communicates with the opening 412. Specifically, as shown in fig. 7, for example, the circuit board 6 includes a third surface 62 and a fourth surface 63, the third surface 62 and the fourth surface 63 being located on both sides of the circuit board 6, respectively, in the height direction of the sensor 1000, the third surface 62 being close to the pressure sensing chip 4 with respect to the fourth surface 63. The first surface 43 of the pressure sensing chip 4 is sealingly connected to the third surface 62 of the circuit board 6, and the fourth surface 63 of the circuit board 6 is sealingly connected to the housing 11.

In some embodiments, the sensing module 100 includes a temperature detecting element 8, the temperature detecting element 8 including a thermistor 81 and at least one pair of lead-out portions 82. The thermistor 81 may be, for example, a PTC thermistor 81, an NTC thermistor 81, or the like. The lead-out portion 82 includes a first connection portion 821, a second connection portion 822, and a transition portion 823, and both the first connection portion 821 and the second connection portion 822 are connected to the transition portion 823. The first connection portion 821 is electrically connected to the circuit board 6, and the second connection portion 822 is connected to the thermistor 81. Along a height direction perpendicular to the sensor 1000, for example, as shown in fig. 3, along a width direction W of the sensor 1000, the first connection portion 821 is distant from the pressure sensing chip 4 with respect to the second connection portion 822; along the height direction L of the sensor 1000, the second connection portion 822 is distant from the circuit board 6 with respect to the first connection portion 821, and the pressure sensing chip 4 is at least partially located between the circuit board 6 and the second connection portion 822, as shown in fig. 2 and 3, for example. Compared with the scheme that the transition part 823 is coaxial with the second connection part 822, and the transition part 823 and the second connection part 822 extend outwards from the first connection part 821 along the height direction of the sensor 1000, the application bends the transition part 823 at least partially relative to the first connection part 821 along the direction approaching the pressure sensing chip 4, so that the distance between the second connection part 822 and the thermosensitive circuit and the pressure sensing chip 4 along the height direction perpendicular to the sensor 1000 is reduced, and the structure of the sensor 1000 is more compact.

In some embodiments, the first connection 821 is connected to the circuit board 6 by way of a through-hole solder. Specifically, the circuit board 6 has mounting holes (not shown) provided through the circuit board 6. The first connection portion 821 is at least partially located in the mounting hole, and the first connection portion 821 is fixedly connected or limited to a hole wall corresponding to the mounting hole.

In some embodiments, the sensing module 100 includes a lead-out portion 7, and the lead-out portion 7 is electrically connected to the circuit board 6. In some embodiments, the lead-out portion 7 includes a spring piece portion 72 and a lead pin portion 71 connected to each other, and the spring piece portion 72 is close to the circuit board 6 with respect to the lead pin portion 71 in the height direction of the sensor 1000. The spring piece 72 abuts against the circuit board 6. In some embodiments, the pin portion 71 is embedded in the housing, and the pin portion 71 is sealingly connected to the housing, as shown in fig. 15, for example.

In some embodiments, the temperature detecting element 8 and the lead-out portion 7 are located on both sides of the circuit board 6, respectively, in the height direction of the sensor 1000. For example, as shown in fig. 2 and 3, the second connection portion 822 extends from the transition portion 823 in a direction away from the circuit board 6 below the circuit board 6, and the lead portion 71 extends in a direction away from the circuit board 6 above the circuit board 6. The pin portion 71 and the second connection portion 822 are parallel to the height direction of the sensor 1000, and the circuit board 6 and the main body portion 41 of the pressure sensor chip 4 are perpendicular to the height direction of the sensor 1000.

In some embodiments, the housing 11 has a first cavity 110 and a second cavity 202, the circuit board 6, the pressure sensing chip 4, and the spring portion 72 are all located in the first cavity 110, the thermistor 81 is located in the second cavity 202, and the lead portion 82 is located at least partially in the second cavity 202. The first volume 110 and the second volume 202 are both fluidly isolated from the outside of the sensor. In some embodiments, channel 201 is on the same side of first cavity 110 as second cavity 202 along the height of sensor 1000.

In some embodiments, the housing 11 has a third cavity 103, the third cavity 103 is far from the second cavity 202 relative to the first cavity 110 along the height direction of the sensor 1000, the third cavity 103 and the second cavity 202 are respectively located at two sides of the first cavity 110, and the guide pin portion 71 is at least partially located in the third cavity 103. The third volume 103 communicates with the outside of the sensor.

In some embodiments, housing 11 has an inner surface at least partially exposed to first cavity 110 and an outer surface at least partially exposed to the exterior of sensor 1000, through which channel 201 extends. The housing 11 has a protrusion 111, the protrusion 111 protrudes outward from the housing 11 in the height direction of the sensor 1000, the protrusion 111 has a cavity 1110, and the second accommodating cavity 202 includes the cavity 1110, and the thermistor 81 is located in the cavity 1110. The sensing portion includes a top surface 203 and a bottom surface 204, such as shown in fig. 3, the inner surface includes the top surface 203 and the outer surface includes the bottom surface 204. The axis of the channel 201 is parallel to the height direction of the sensor 1000; along the height of the sensor 1000, the top surface 203 and the bottom surface 204 are located on both sides of the channel 201, respectively, and the channel 201 penetrates the top surface 203 and the bottom surface 204. The top surface 203 and the bottom surface 204 are planes perpendicular to the height direction of the sensor 1000, and the protruding portion 111 protrudes outward from the bottom surface 204.

In some embodiments, the housing 11 has an inner wall 206, the inner wall 206 being located at the periphery of the second cavity 202, and a space being provided between the inner wall 206 and the second connecting portion 822. In this way, heat generated during operation of the electronic components mounted on the circuit board 6 is reduced from being transferred to the thermistor 81 through the housing 11, affecting temperature detection. In some embodiments, the cavity 1110 is filled with a thermally conductive material (not shown) within which the thermistor 81 is at least partially embedded, the thermally conductive material being at least partially in contact with the protrusion 111. The cavity 1110 of the protruding portion is filled with a material having good heat conducting property, so that heat of the external environment can be better transferred to the thermistor 81 through the housing 11 and the heat conducting material, and the sensitivity of the temperature detecting element 8 is improved.

As described above, the sensor 1000 includes the pressure sensing chip 4, the circuit board 6, and the housing 11, and the pressure sensing chip 4 is mounted to the circuit board 6. The housing 11 includes a sensing portion 2 on the lower side and a fitting portion 10a on the upper side, the sensing portion 2 having a passage 201. The pressure sensing chip 4 needs to be in sealing connection with the sensing part 2, so that when the fluid outside the sensor flows into the groove through the channel 201, the fluid cannot leak into the sensor to affect the internal structure (such as a circuit board, an electronic component mounted on the circuit board, etc.) of the sensor. For this purpose, the mating portion 10a is abutted against the circuit board 6 from top to bottom, the circuit board 6 is abutted against the pressure sensing chip 4, and the pressure sensing chip 4 is tightly mated with the sensing portion 2, so as to realize a sealed connection between the pressure sensing chip 4 and the sensing portion 2. For example, the sensor 1000 includes a seal 5, the seal 5 being located between the sensing portion 2 and the pressure sensing chip 4. The fitting portion 10a and the sensing portion 2 apply opposing forces to the sealing member 5, respectively, so that the sealing member 5 is pressed to elastically deform, the elastically deformed sealing member 5 is in sealing connection with the pressure sensing chip 4, and the sealing member 5 is in sealing connection with the sensing portion 2, thereby realizing sealing connection of the pressure sensing chip 4 and the sensing portion 2. The mating portion 10a transmits force to the pressure sensing die 4 through the circuit board 6, and the pressure sensing die 4 transmits force to the sealing member 5.

The upper side of the circuit board 6 receives a downward force from the fitting portion 10a at the outer edge portion, the lower side of the circuit board 6 receives an upward force from the pressure sensing chip 4 at the middle portion, and the portion receiving the downward force and the portion receiving the upward force are located at different positions of the circuit board 6, resulting in that the circuit board 6 is easily deformed, for example, the middle portion of the circuit board 6 bulges and the outer edge sinks. The deformation of the circuit board 6 may cause unstable connection of the electronic components mounted thereon with the circuit board 6. That is, in order to achieve the sealed connection of the pressure sensing chip 4 and the sensing portion 2, bending deformation of the circuit board 6 may be caused. Therefore, an improvement in the structure of the sensor 1000 is required.

Furthermore, the sealing connection of the pressure sensor chip 4 to the sensing portion 2 depends on the force of the mating portion 10a on the pressure sensor chip 4. In the related art, the matching portion 2 indirectly applies a force to the sensing portion 2 through the circuit board 6, and the matching portion 2 and the pressure sensing chip 4 are dislocated, so that the circuit board 6 is easily deformed, and meanwhile, the pressure sensing chip 4 may not be stressed enough to be connected with the sensing portion 2 in a sealing manner.

To this end, a second aspect of the application provides a sensor 1000, the sensor 1000 comprising a housing 11, a pressure sensing die 4 and a circuit board 6, the pressure sensing die 4 and the circuit board 6 being both located within the housing 11. The housing 11 includes a sensing portion 2 and a fitting portion 10a. The sensing part 2 has a channel 201, the channel 201 communicates with the outside of the sensor 1000, the pressure sensing chip 4 has a recess 411, and the recess 411 communicates with the channel 201. The sensing portion 2 and the fitting portion 10a are located on both sides of the pressure sensing chip 4, respectively, in the height direction of the sensor 1000. The sensing part 2 and the matching part 10a are tightly matched with the pressure sensing chip 4, and the sensing part 2 is in sealing connection with the pressure sensing chip 4. The plane perpendicular to the height direction of the sensor 1000 is taken as a projection plane P, the front projection of the pressure sensing chip 4 on the projection plane P along the height direction of the sensor 1000 is taken as a first projection S1, the front projection of the fitting portion 10a on the projection plane P is taken as a second projection S2, and the second projection S2 is at least partially overlapped with the first projection S1, as shown in fig. 6, for example.

In some embodiments, the mating portion 10a abuts the pressure sensing die 4; alternatively, the fitting portion 10a is in contact with the circuit board 6, and the circuit board 6 is in contact with the pressure sensor chip 4.

In the application, the sensing part 2 is tightly matched with the pressure sensing chip 4; the pressure sensing chip 4 is abutted against the mating portion 10a, or the pressure sensing chip 4 is abutted against the circuit board 6, the circuit board 6 is abutted against the mating portion 10a, a plane perpendicular to the height direction of the sensor 1000 is taken as a projection plane P, the orthographic projection of the pressure sensing chip 4 on the projection plane P is taken as a first projection S1 along the height direction of the sensor 1000, the orthographic projection of the mating portion 10a on the projection plane P is taken as a second projection S2, and the second projection S2 is at least partially overlapped with the first projection S1. When the pressure sensor chip 4 is in contact with the mating portion 10a, the mating portion 10a directly applies a force to the pressure sensor chip 4, not through the circuit board 6, and the circuit board 6 is not subjected to the force from the mating portion 10a and the pressure sensor chip 4. When the pressure sensor chip 4 is in contact with the circuit board 6 and the circuit board 6 is in contact with the mating portion 10a, the mating portion 10a applies a force to the pressure sensor chip 4 through the circuit board 6, and at this time, since the second projection S2 at least partially overlaps the first projection S1, opposing forces from the mating portion 10a and the pressure sensor chip 4 cancel each other at a portion corresponding to the overlapping of the circuit board 6 and the projection. In this way, the bending deformation of the circuit board 6 caused to achieve the sealing connection of the pressure sensing chip 4 and the sensing portion 2 is reduced.

In some embodiments, sensor 1000 includes a seal 5, seal 5 being located within housing 11. The sealing element 5 is at least partially clamped between the pressure sensing chip 4 and the sensing part 2, the pressure sensing chip 4 and the sensing part 2 are respectively abutted against the sealing element 5, and the pressure sensing chip 4 and the sensing part 2 are both in sealing connection with the sealing element 5. That is, the pressure sensor chip 4 is connected to the sensor section 2 by the seal 5 in a sealing manner. In the height direction of the sensor 1000, the front projection of the sealing element 5 on the projection plane P is a third projection, and the second projection S2 at least partially coincides with the third projection. One side of the pressure sensing chip 4 receives a force directly or indirectly applied by the fitting portion 10a, and the other side thereof receives a force applied thereto by the sensing portion 2 through the sealing member 5. The pressure sensing chip 4 receives opposite forces applied by the matching portion 10a and the sensing portion 2, the second projection S2 is at least partially overlapped with the third projection, the two forces cancel each other at the portion where the pressure sensing chip 4 is overlapped with the projection, and stress deformation of the pressure sensing chip 4 is reduced.

In some embodiments, the seal 5 has perforations 51, the perforations 51 being disposed through the seal 5. The recess 411 communicates with the perforation 51, and the perforation 51 communicates with the channel 201. Along the height of the sensor 1000, the recess 411 and the channel 201 are located on either side of the perforation 51. The diameter of the perforations 51 is equal to the diameter of the channels 201. In some embodiments, the sensing portion 2 has a receiving groove 205 for receiving the seal 5, the seal 5 being at least partially located in the receiving groove 205. The accommodating groove 205 is a groove in which the top surface 203 of the sensing portion 2 is recessed toward the inside of the sensing portion 2, the accommodating groove 205 communicates with the passage 201, and the accommodating groove 205 has a columnar shape, as shown in fig. 11 to 12, for example. The receiving groove 205 is a portion of the first receiving chamber 110 of the housing 11.

In some embodiments, the orthographic projection of the corresponding sidewall of the channel 201 on the pressure sensing chip 4 is located at the periphery of the opening 412 along the height direction of the pressure sensor, for example, as shown in fig. 3.

In some embodiments, the mating portion 10a abuts at least one of the pressure sensing chip 4 and the circuit board 6. The housing 11 includes a limiting portion 305, and the limiting portion 305 is connected to the sensing portion 2, as shown in fig. 11 and 12, for example. Along the height direction of the sensor 1000, the limiting part 305 and the sensing part 2 are located on the same side of the circuit board 6, the limiting part 305 is close to the circuit board 6 relative to the sensing part 2, the limiting part 305 and the matching part 10a are at least partially located on two sides of the circuit board 6 respectively, and the circuit board 6 is at least partially clamped between the limiting part 305 and the matching part 10a. The limiting portion 305 at least partially abuts against the circuit board 6, and the mating portion 10a at least partially abuts against the circuit board 6, as shown in fig. 3, for example. In this way, the engagement portion 10a and the stopper portion 305 are engaged to restrict the displacement of the circuit board 6 in the housing 11.

In some embodiments, such as shown in fig. 14, the mating portion 10a includes a first mating portion 101 and a second mating portion 102, the first mating portion 101 being connected to the second mating portion 102, the first mating portion 101 protruding from the second mating portion 102 toward the cavity 104. On the projection plane P perpendicular to the height direction of the sensor 1000, the front projection S21 of the first fitting portion 101 coincides with the front projection S1 of the pressure sensor chip 4, and the front projection S22 of the second fitting portion 102 is located outside the front projection S1 of the pressure sensor chip 4, as shown in fig. 6, for example.

In some embodiments, the stop portion 305 has a stop surface 3051, the stop surface 3051 being in contact with the circuit board 6, the stop surface 3051 being located in a plane perpendicular to the height direction of the sensor 1000, as shown in fig. 13, for example. In some embodiments, the orthographic projection of the limiting surface 3051 on the projection surface P coincides with the orthographic projection of the second fitting portion 102 on the projection surface P along the height direction of the sensor. In this way, the deformation of the circuit board 6 due to the clamping of the limiting surface 3051 and the second fitting portion 102 is reduced. The distance between the limiting surface 3051 and the bottom of the accommodating groove 205 is greater than the distance between the first surface 43 and the second surface 44 along the height direction of the sensor 1000. That is, the distance between the stopper surface 3051 and the bottom of the accommodating groove 205 is greater than the thickness of the pressure sensing chip 4. In some embodiments, the thickness of the pressure sensor chip 4 is H1, the thickness of the sealing member 5 in the undeformed state is H2, the distance between the limiting surface 3051 and the bottom of the accommodating groove 205 is H3, h3=h1+a×h2, and 0.7+.a+.0.8, as shown in fig. 9.

In some embodiments, the housing 11 includes a first housing 1 and a second housing 10, where the first housing 1 and the second housing 10 are both located at the periphery of the first cavity 110. The first housing 1 includes a sensing portion 2 and a limiting portion 305, as shown in fig. 10 to 13, for example. The second housing 10 includes a fitting portion 10a, as shown in fig. 14 and 15, for example. The first housing 1 is tightly matched with the second housing 10, and the first housing 1 is in sealing connection with the second housing 10.

Specifically, the first housing 1 includes a fitting portion 3, and the fitting portion 3 is connected to the sensing portion 2. The assembly part 3 is provided with an inner cavity 306, and the inner cavity 306 at least partially forms the first accommodating cavity 110; the second housing 10 is at least partially located in the inner first cavity. The fitting portion 3 includes a wall portion 303, a locking portion 304, and a stopper portion 305, the locking portion 304 and the stopper portion 305 protrude from the wall portion 303 to the inside of the fitting portion 3, respectively, and the locking portion 304 has a free end 3041. The wall portion 303, the buckling portion 304 and the limiting portion 305 are all located at the periphery of the inner cavity 306, and along the height direction of the sensor 1000, the buckling portion 304 is far away from the sensing portion 2 relative to the limiting portion 305, and a space is reserved between the buckling portion 304 and the limiting portion 305. The second housing 10 is at least partially located between the limiting portion 305 and the buckling portion 304, the second housing 10 is at least partially tightly matched with the buckling portion 304, and the second housing 10 is tightly matched with the limiting portion 305. For example, as shown in fig. 2, a part of the mating portion 10a of the second housing 10 is sandwiched between the engaging portion 304 and the circuit board 6. Along the height direction of the sensor 1000, one side of the mating portion 10a is in contact with the fastening portion 304, and the other side is in contact with the circuit board 6; at least part of the circuit board 6 is clamped between the matching part 10a and the limiting part 305, one side of the circuit board 6 is abutted against the matching part 10a, and the other side of the circuit board 6 is abutted against the limiting part 305.

In some embodiments, the housing 11 comprises a fitting 9, the fitting 9 being nested outside the second housing 10, the fitting 9 being in sealing connection with the second housing 10, and the fitting 9 being in sealing connection with the first housing 1, as shown for example in fig. 2 and 3. In other embodiments, the first housing 1 and the second housing 10 may also be sealed by a sealant. For example, after the first casing 1 and the second casing 10 are press-riveted, a sealant is applied to the joint of the first casing 1 and the second casing 10. The first shell 1 and the second shell 10 are in sealing connection, so that the first containing cavity 110 is better isolated from the outside, and the external impurities are reduced from entering the first containing cavity 110, so that the influence on the circuit board 6 and electronic components in the first containing cavity 110 is caused.

In some embodiments, the lumen 306 comprises a first lumen 301 and a second lumen 302, the first lumen 301 being in communication with the second lumen 302, the first lumen 301 being proximal to the sensing portion 2 relative to the second lumen 302 along the height of the sensor 1000. The pressure sensing chip 4 is at least partially positioned in the first inner cavity 301, the circuit board 6 is at least partially positioned in the first inner cavity 301, and the second shell 10 is at least partially positioned in the second inner cavity 302; the wall portion 303 includes a first wall portion 3031 and a second wall portion 3032, and the first wall portion 3031 is adjacent to the stopper portion 305 with respect to the second wall portion 3032 in the height direction of the sensor 1000; the first wall portion 3031 is located at the periphery of the first inner cavity 301, the second wall portion 3032 is located at the periphery of the second inner cavity 302, the first wall portion 3031 protrudes from the second wall portion 3032 toward the inner cavity 306, the first wall portion 3031 and the second wall portion 3032 form a step, the mating portion 10a is at least partially abutted against the first wall portion 3031, and the second wall portion 3032 is at least partially located at the periphery of the mating portion 10a, for example, as shown in fig. 13. For example, as shown in fig. 3, one side of the fitting portion 10a of the second case 10 abuts against the first wall portion 3031 and the circuit board 6, and the other side abuts against the engagement portion 304. In some embodiments, the height of the first wall portion 3031 is approximately equal to the thickness of the circuit board 6 along the height direction of the sensor 1000. In this way, the fitting portion 10a can be brought into contact with both the first wall portion 3031 and the circuit board 6.

In some embodiments, the second housing 10 includes a cavity 104, with the mating portion 10a located at a periphery of the cavity 104, as shown, for example, in fig. 14 and 15. Alternatively, the fitting portion 10a has a fitting surface 10b, the fitting surface 10b being a plane perpendicular to the height direction of the sensor 1000, the fitting surface abutting at least one of the pressure sensor chip 4 and the circuit board 6; the cavity 104 is recessed from the mating surface 10b toward the interior of the second housing 10. The cavity 104 is part of the first cavity 110. In some embodiments, the spring portion 72 of the lead-out portion 7 is located at least partially in the cavity 104.

In some embodiments, for example, as shown in fig. 15, the second housing 10 includes a first body portion 105 and a second body portion 106, the first body portion 105 is connected to the mating portion 10a, the second body portion 106 is connected to the first body portion 105, and the second body portion 106 is distant from the mating portion 10a with respect to the first body portion 105 in the height direction H of the sensor. The second body portion 106 is located at the periphery of the third cavity 103, the guide pin portion 71 is at least partially located in the third cavity 103, and the guide pin portion 71 is at least partially embedded in the first body portion 105.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A sensor, characterized in that: the sensor comprises a shell (11), a pressure sensing chip (4) and a circuit board (6), wherein the pressure sensing chip (4) is arranged on the circuit board (6);

the housing (11) comprises a sensing part (2) and a matching part (10 a), the sensing part (2) is provided with a channel (201), the channel (201) is communicated with the outside of the sensor, the pressure sensing chip (4) is provided with a groove (411), and the groove (411) is communicated with the channel (201);

the sensing part (2) and the matching part (10 a) are respectively positioned at two sides of the pressure sensing chip (4) along the height direction of the sensor; the sensing part (2) and the matching part (10 a) are tightly matched with the pressure sensing chip (4) so as to enable the sensing part (2) to be connected with the pressure sensing chip (4) in a sealing way;

the plane perpendicular to the height direction of the sensor is taken as a projection plane (P), the orthographic projection of the main body part (41) on the projection plane (P) is taken as a first projection (S1) along the height direction of the sensor, the orthographic projection of the matching part (10 a) on the projection plane is taken as a second projection (S2), and the second projection (S2) is at least partially overlapped with the first projection (S1).

2. The sensor of claim 1, wherein: the pressure sensing chip (4) is abutted with the matching part (10 a); or, the pressure sensing chip (4) is abutted against the circuit board (6), and the circuit board (6) is abutted against the matching part (10 a);

the sensor (1000) comprises a sealing element (5), wherein the sealing element (5) is at least partially clamped between the pressure sensing chip (4) and the sensing part (2), the pressure sensing chip (4) and the sensing part (2) are respectively abutted to the sealing element (5), and the pressure sensing chip (4) and the sensing part (2) are in sealing connection with the sealing element (5);

in the height direction of the sensor, the orthographic projection of the sealing element (5) on the projection surface (P) is a third projection (S3), and the second projection (S2) is at least partially overlapped with the third projection (S3).

3. The sensor of claim 2, wherein: the sealing element (5) is provided with a perforation (51), the perforation (51) penetrates through the sealing element (5), the groove (411) is communicated with the perforation (51), the perforation (51) is communicated with the channel (201), and the groove (411) and the channel (201) are respectively positioned at two sides of the perforation (51) along the height direction of the sensor;

the diameter of the perforations (51) is equal to the diameter of the channels (201).

4. The sensor of claim 2, wherein: the shell (11) comprises a limiting part (305), and the limiting part (305) is connected with the sensing part (2);

along the height direction of the sensor, the limiting part (305) and the matching part (10 a) are at least partially located at two sides of the circuit board (6) respectively, the limiting part (305) and the matching part (10 a) are at least partially abutted with the circuit board (6) respectively, and the circuit board (6) is at least partially clamped between the limiting part (305) and the matching part (10 a).

5. A sensor according to claim 3, wherein: the limiting part (305) is provided with a limiting surface (3051), and the limiting surface (3051) is abutted with the circuit board (6);

the sensing part (2) is provided with a top surface (203) and a bottom surface (204), the top surface (203) and the bottom surface (204) are respectively positioned at two sides of the channel (201) along the height direction of the sensor, and the channel (201) penetrates through the top surface (203) and the bottom surface (204); the sensing part (2) is provided with a containing groove (205), the containing groove (205) is concavely formed from the top surface (203) to the inside of the sensing part (2), and the sealing piece (5) is at least partially positioned in the containing groove (205);

along the height direction of the sensor, the distance between the limiting surface (3051) and the bottom of the accommodating groove (205) is H, the thickness of the pressure sensing chip (4) is H1, the thickness of the sealing piece (5) in an undeformed state is H2, H=H2+a.H2, and a is more than or equal to 0.7 and less than or equal to 0.8.

6. A sensor according to any one of claims 1 to 5, wherein: the shell (11) is provided with a first containing cavity (110), and the pressure sensing chip (4), the circuit board (6) and the sealing piece (5) are all positioned in the first containing cavity (110);

the shell comprises a first shell (1) and a second shell (10), and the first shell (1) and the second shell (10) are positioned at the periphery of the first accommodating cavity (110); the first housing (1) comprises the sensing portion (2), and the second housing (10) comprises the mating portion (10 a);

the first shell (1) is tightly matched with the second shell (10), and the first shell (1) and the second shell (10) are connected in a sealing mode.

7. The sensor of claim 6, wherein: the first shell (1) comprises a fitting part (3), and the fitting part (3) is connected with the sensing part (2);

the fitting part (3) has an inner cavity (303), the inner cavity (303) at least partially forming the first receptacle (110); -said second housing (10) is at least partially located in said inner cavity (303);

the assembly part (3) comprises a wall part (303), a buckling part (304) and a limiting part (305), the buckling part (304) and the limiting part (305) respectively protrude from the wall part (303) to the inside of the assembly part (3), the buckling part (304) is provided with a free end (3041), the wall part (303), the buckling part (304) and the limiting part (305) are all positioned at the periphery of the inner cavity (303), and along the height direction of the sensor, the buckling part (304) is far away from the sensing part (2) relative to the limiting part (305), and a space is reserved between the buckling part (304) and the limiting part (305);

the second shell (10) is at least partially located between the limiting part (305) and the buckling part (304), the second shell (10) is at least partially tightly matched with the buckling part (304), and the second shell (10) is tightly matched with the limiting part (305).

8. The sensor of claim 7, wherein: the inner cavity (303) comprises a first inner cavity (301) and a second inner cavity (302), the first inner cavity (301) is communicated with the second inner cavity (302), and the first inner cavity (301) is close to the sensing part (2) relative to the second inner cavity (302) along the height direction of the sensor;

the pressure sensing chip (4) is at least partially positioned in the first inner cavity (301), the circuit board (6) is at least partially positioned in the first inner cavity (301), and the second shell is at least partially positioned in the second inner cavity (302);

the wall part (303) comprises a first wall part (3031) and a second wall part (3032), and the first wall part (3031) is close to the limit part (305) relative to the second wall part (3032) along the height direction of the sensor; the first wall part (3031) and the limiting part (305) are both positioned on the periphery of the first inner cavity (301), the second wall part (3032) is positioned on the periphery of the second inner cavity (302), the first wall part (3031) protrudes from the second wall part (3032), the first wall part (3031) and the second wall part (3032) form a step, and the second shell (10) is at least partially abutted to the first wall part (3031).

9. The sensor of claim 1, wherein: the sensor comprises a temperature detection element (8), wherein the temperature detection element (8) is connected with the circuit board (6);

the temperature detection element (8) comprises a thermistor (81) and at least one pair of extraction parts (82), the sensing part (2) is provided with a second containing cavity (202), the shell (11) is provided with a first containing cavity (110), the circuit board and the pressure sensing chip are both positioned in the first containing cavity (110), and the sensing part (2) is positioned at the periphery of the first containing cavity (110);

along the height direction of the sensor, the second accommodating cavity (202) and the channel (201) are positioned on the same side of the first accommodating cavity (110), the thermistor (81) is positioned in the second accommodating cavity (202), and the extraction part (82) is at least partially positioned in the second accommodating cavity (202).

10. The sensor of claim 9, wherein: the sensor (1000) has a protrusion (111), the protrusion (111) protruding outwards from the sensing part (2), the protrusion (111) having a cavity (1110), the second cavity (202) comprising the cavity (1110), the thermistor (81) being located in the cavity (1110);

the sensing part (2) is provided with an inner wall (206), the inner wall (206) is positioned at the periphery of the second containing cavity (202), and a space is reserved between the inner wall (206) and the second connecting part (822); the cavity (1110) is filled with a thermally conductive material, and the thermistor (81) is at least partially embedded in the thermally conductive material, and the thermally conductive material is at least partially in contact with the protrusion (111).