CN116780941A - Electrostatic adsorption device with different surface configurations and preparation method thereof - Google Patents
Electrostatic adsorption device with different surface configurations and preparation method thereof Download PDFInfo
- Publication number
- CN116780941A CN116780941A CN202310754002.9A CN202310754002A CN116780941A CN 116780941 A CN116780941 A CN 116780941A CN 202310754002 A CN202310754002 A CN 202310754002A CN 116780941 A CN116780941 A CN 116780941A
- Authority
- CN
- China
- Prior art keywords
- layer
- electrode
- dielectric layer
- dielectric
- electrode layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001179 sorption measurement Methods 0.000 title claims abstract description 80
- 238000002360 preparation method Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 claims abstract description 19
- 239000010410 layer Substances 0.000 claims description 535
- 239000007772 electrode material Substances 0.000 claims description 65
- 239000012790 adhesive layer Substances 0.000 claims description 62
- 238000005520 cutting process Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 2
- 210000001519 tissue Anatomy 0.000 claims 4
- 210000000438 stratum basale Anatomy 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 12
- 239000010408 film Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- -1 and the like Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The application provides an electrostatic adsorption device with different surface configurations, which relates to the field of electrostatic adsorption and comprises an insulating basal layer, a first electrode layer, a first dielectric layer, a spiral second electrode layer and a second dielectric layer which are sequentially and fixedly connected, wherein the first dielectric layer can completely separate the first electrode layer from the second electrode layer, and the second dielectric layer can completely cover the second electrode layer. The application also provides a manufacturing method of the application: the method comprises the steps of obtaining an insulating substrate layer, a first electrode layer, a first dielectric layer, a spiral second electrode layer and a second dielectric layer, enabling the first dielectric layer to completely separate the first electrode layer and the second electrode layer, enabling the size of the second dielectric layer to be not smaller than that of the second electrode layer, connecting the substrate layer, the first electrode layer, the first dielectric layer, the second electrode layer and the second dielectric layer to obtain the electrostatic adsorption device with different surface configurations, and sequentially arranging the substrate layer, the first electrode layer, the first dielectric layer, the second electrode layer and the second dielectric layer in sequence. The adsorption effect is better, and the service life is longer.
Description
Technical Field
The application relates to the technical field of electrostatic adsorption, in particular to an electrostatic adsorption device with different surface configurations and a preparation method thereof.
Background
As an existing advanced adsorption mechanism, the electrostatic adsorption device has been studied more and more due to its unique adsorption principle and excellent environmental adaptability. The basic principle of electrostatic adsorption is that when a dielectric film material contacts a target adsorption system by loading high voltage on an electrode, opposite charges are generated on the surface of the target due to the dielectric action, and different charges acting on the same contact position are attracted to each other, namely, charge attraction force is generated between the adsorption target and the high-voltage electrode in the electrostatic adsorption device, so that the adsorption target is adsorbed on the surface of the dielectric film material of the electrostatic adsorption device.
At present, the electrostatic adsorption technology is widely focused in the industry, and particularly, the design, the manufacture and the research of a flexible film electrostatic adsorption device are focused. The existing coplanar flexible electrostatic adsorption device is difficult to realize ideal adsorption effect, and a large-area unipolar electrode design or a tooth comb-shaped staggered electrode design scheme is often adopted for improving adsorption force, wherein the unipolar electrode can realize effective adsorption by loading larger voltage; the design of tooth comb-like has improved electrostatic adsorption capacity, but because positive polarity electrode and negative polarity electrode coplane in the flexible electrostatic adsorption equipment of coplane need leave the electric gap between positive polarity electrode and the negative polarity electrode, the electric gap is too little then easily leads to electrostatic adsorption equipment to break down inefficacy, and the adsorption capacity is weaker when the electric gap is too big, so can't realize better adsorption effect.
The flexible electrostatic adsorption device with the different surface configurations generally comprises a positive electrode, a first dielectric layer, a negative electrode and a second dielectric layer which are sequentially arranged, namely, the positive electrode and the negative electrode are of a non-coplanar (different surface) structure, and the first dielectric layer is arranged between the positive electrode and the negative electrode, so that the defect of short service life caused by easy breakdown failure of the coplanar flexible electrostatic adsorption device under high voltage is overcome, the gap between the positive electrode and the negative electrode can be set smaller, and the electrostatic adsorption force of the coplanar flexible electrostatic adsorption device under the same voltage is stronger than that of the coplanar flexible electrostatic adsorption device. In the flexible electrostatic adsorption device with the different surface configurations, the design of the comb-shaped electrode pairs is generally adopted to improve the adsorption effect, but in the flexible electrostatic adsorption device with the different surface configurations, each tooth of the positive electrode and each tooth of the negative electrode are equivalent to one electrode pair, the whole positive electrode and the negative electrode are composed of multiple sections of electrode pairs, the continuity of an electric field generated between the multiple sections of electrode pairs is poor, so that the electrostatic charge on the adsorption surface of the flexible electrostatic adsorption device with the different surface configurations is unevenly distributed, and the adsorption effect is poor.
Disclosure of Invention
The application aims to provide an electrostatic adsorption device with different surface configurations and a preparation method thereof, so as to solve the problems in the prior art, have a good adsorption effect and are beneficial to prolonging the service life of the device.
In order to achieve the above object, the present application provides the following solutions:
the application provides an electrostatic adsorption device with different surface configurations, which comprises a substrate layer, a first electrode layer, a first dielectric layer, a second electrode layer and a second dielectric layer which are sequentially and fixedly connected, wherein the second electrode layer is spiral, the substrate layer is an insulating layer, the first dielectric layer can completely separate the first electrode layer and the second electrode layer, and the second dielectric layer can completely cover the second electrode layer.
Preferably, the adhesive layer is arranged between the substrate layer and the first electrode layer, the projection of the first electrode layer on the plane where the adhesive layer is located in the adhesive layer, the first electrode layer and the substrate layer can be bonded through the adhesive layer, and the part of the first dielectric layer exceeding the first electrode layer and the substrate layer can be bonded through the adhesive layer.
Preferably, the adhesive layer comprises a first adhesive layer, a tissue layer and a second adhesive layer, and the first adhesive layer and the second adhesive layer are respectively adhered to two sides of the tissue layer.
Preferably, the substrate layer, the first electrode layer, the first dielectric layer, the second electrode layer and the second dielectric layer are all flexible material layers, the first dielectric layer and the second dielectric layer are all thin film dielectric layers, and the first electrode layer and the second electrode layer are all made of metal.
The application also provides a preparation method of the electrostatic adsorption device with different surface configurations, which comprises the following steps:
obtaining an insulating substrate layer, a first electrode layer, a first dielectric layer, a spiral second electrode layer and a second dielectric layer, and enabling the first dielectric layer to completely separate the first electrode layer and the second electrode layer, enabling the size of the second dielectric layer to be not smaller than that of the second electrode layer, and enabling the second dielectric layer to completely cover the second electrode layer; and fixedly connecting the substrate layer, the first electrode layer, the first dielectric layer, the second electrode layer and the second dielectric layer to obtain the electrostatic adsorption device with the different-surface configuration, wherein the sequence of the constituent layers of the electrostatic adsorption device with the different-surface configuration is the substrate layer, the first electrode layer, the first dielectric layer, the second electrode layer and the second dielectric layer in sequence.
Preferably, the method for manufacturing the second electrode layer and the method for connecting the second electrode layer and the second dielectric layer include: obtaining a sheet-shaped second electrode material layer and a second dielectric layer with specific sizes, and cutting a tearing line on the second electrode material layer along a set cutting path, wherein the area surrounded by the tearing line is the spiral second electrode layer; attaching and connecting the cut second electrode material layer with the second dielectric layer, and removing materials except the second electrode layer on the second electrode material layer along the tearing line to obtain a first combined body formed by combining the second electrode layer and the second dielectric layer;
further comprises: and fixedly connecting the first combination body with the basal layer, the first electrode layer and the first dielectric layer.
Preferably, the method for connecting the second electrode layer and the second dielectric layer further includes:
if the size of the second dielectric layer is equal to the size of the second electrode material layer, aligning the outer edge of the cut second electrode material layer with the outer edge of the second dielectric layer, connecting the two, and removing materials except the second electrode layer on the second electrode material layer along the tearing line;
and if the size of the second dielectric layer is larger than that of the second electrode material layer, removing the part of the second dielectric layer exceeding the second electrode material layer after the cut second electrode material layer is connected with the second dielectric layer, and removing materials except the second electrode layer on the second electrode material layer along the tearing line.
Preferably, the method further comprises: sequentially connecting the substrate layer, the first electrode layer and the first dielectric layer into a whole to form a second combination, and attaching and connecting the second electrode layer in the first combination with the first dielectric layer in the second combination;
the manufacturing method of the second combination body comprises the following steps: obtaining a substrate layer, a first electrode material layer and an adhesive layer which are identical in shape and size, and obtaining the first dielectric layer, wherein the size of the first dielectric layer is selected to be capable of completely covering the substrate layer, one side of the adhesive layer is completely adhered to the substrate layer, and the first electrode material layer is completely adhered to the other side of the adhesive layer; the adhesive layer comprises a first adhesive layer, a tissue layer and a second adhesive layer, and the first adhesive layer and the second adhesive layer are respectively adhered to two sides of the tissue layer;
cutting the first electrode material layer, cutting the first electrode material layer into the first electrode layer in the middle and an annular outer ring part, and stripping the annular outer ring part from the adhesive layer to obtain a third combined body formed by combining the first electrode layer and the substrate layer;
and fixedly connecting the third combination body with the first dielectric layer.
Preferably, the method for fixedly connecting the third combination body and the first dielectric layer includes:
if the size of the first dielectric layer is equal to the size of the basal layer, aligning the outer edge of the first dielectric layer with the outer edge of the basal layer and connecting the two;
and if the size of the first dielectric layer is larger than that of the substrate layer, removing the part of the first dielectric layer beyond the substrate layer after connecting the outer edge of the first dielectric layer with the substrate layer.
Preferably, the method further comprises: before the base layer, the first electrode layer, the first dielectric layer, the second electrode layer and the second dielectric layer are prepared, the dimensions of the base layer, the first electrode layer, the first dielectric layer, the second electrode layer and the second dielectric layer are obtained according to the dimensions of an adsorption target and the required adsorption force, and the cutting path is obtained according to the dimensions of the second electrode layer.
Compared with the prior art, the application has the following technical effects:
the application provides an electrostatic adsorption device with different surface configurations and a preparation method thereof, comprising a basal layer, a first electrode layer, a first dielectric layer, a second electrode layer and a second dielectric layer which are sequentially and fixedly connected, wherein the second electrode layer is in a spiral shape, is a spiral and continuous whole, has a relatively uniform electric field with the first electrode layer, has relatively uniform electrostatic charge distribution on the second dielectric layer, and has relatively good adsorption effect; meanwhile, the first dielectric layer is arranged between the first electrode layer and the second electrode layer, and is not easy to break down relative to the coplanar flexible electrostatic adsorption device, so that the service life of the device is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of an electrostatic adsorbing apparatus of an out-of-plane configuration in example 1;
fig. 2 is a cross-sectional view in the thickness direction of the electrostatic adsorbing apparatus of the hetero-planar configuration in example 2;
in the figure: 100. electrostatic adsorption device with different surface shape; 1. a base layer; 2. an adhesive layer; 3. a first electrode layer; 4. a first dielectric layer; 5. a second electrode layer; 6. a second dielectric layer.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The application aims to provide an electrostatic adsorption device with different surface configurations and a preparation method thereof, so as to solve the problems in the prior art, have a good adsorption effect and are beneficial to prolonging the service life of the device.
In order that the above-recited objects, features and advantages of the present application will become more readily apparent, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description.
Example 1
As shown in fig. 1-2, the present embodiment provides an electrostatic adsorbing apparatus 100 with a different-surface configuration, which includes a base layer 1, a first electrode layer 3, a first dielectric layer 4, a second electrode layer 5 and a second dielectric layer 6 that are sequentially and fixedly connected, where the second electrode layer 5 is spiral, the base layer 1 is an insulating layer, the first dielectric layer 4 can completely separate the first electrode layer 3 and the second electrode layer 5, and complete isolation between the first electrode layer 3 and the second electrode layer 5 is achieved by setting the first dielectric layer 4 so as to completely cover the first electrode layer 3 and the second electrode layer 5, and the second dielectric layer 6 can completely cover the second electrode layer 5. The second electrode layer 5 is spiral, the second electrode layer 5 is a spiral continuous whole, an electric field between the second electrode layer 5 and the first electrode layer 3 is uniform, electrostatic charge on the second dielectric layer 6 is uniformly distributed, and the adsorption effect is good; meanwhile, the first dielectric layer 4 is arranged between the first electrode layer 3 and the second electrode layer 5, so that the first dielectric layer 4 is not easy to break down relative to the coplanar flexible electrostatic adsorption device 100, and the service life of the device is prolonged. The first electrode layer 3 and the second electrode layer 5 of the electrostatic adsorbing device provided in this embodiment are of non-coplanar (non-planar) structure, i.e. the electrostatic adsorbing device 100 with a non-planar configuration is formed.
The second dielectric layer 6 is preferably a circular spiral structure, but may have a spiral structure of other shapes such as a square shape as shown in fig. 1.
The electrostatic adsorption device 100 with the different-surface configuration provided in this embodiment further includes an adhesive layer 2, the adhesive layer 2 is disposed between the substrate layer 1 and the first electrode layer 3, a projection of the first electrode layer 3 on a plane where the adhesive layer 2 is located in the adhesive layer 2, that is, an entire outer edge of the first adhesive layer 2 exceeds an outer edge of the first electrode layer 3, the first electrode layer 3 and the substrate layer 1 can be bonded through the adhesive layer 2, and a portion of the first dielectric layer 4 exceeding the first electrode layer 3 and the substrate layer 1 can be bonded through the adhesive layer 2. The present embodiment achieves a tight, zero-gap, adhesive connection between the substrate layer 1, the first electrode layer 3 and the first dielectric layer 4 by means of the adhesive layer 2. Wherein the insulating dielectric properties of the adhesive material are not required.
As a preferred embodiment, the adhesive layer 2 comprises a first glue layer, a tissue layer and a second glue layer, which are glued to both sides of the tissue layer, respectively. As a more preferred embodiment, a tissue-based double sided tape having a thickness of 0.1mm was selected as the flexible adhesive material. It should be noted that the substrate of the adhesive layer 2 of the present application is not limited to tissue paper, and double-sided tape of other substrates may be used.
The substrate layer 1, the first electrode layer 3, the first dielectric layer 4, the second electrode layer 5 and the second dielectric layer 6 are all flexible material layers, the first dielectric layer 4 and the second dielectric layer 6 are all thin film dielectric layers, and the materials of the first electrode layer 3 and the second electrode layer 5 are all metals.
As a preferred embodiment, the substrate layer 1 is a flexible non-dielectric insulating material having a lightweight sheet shape that acts to prevent the operating voltage from breaking down the substrate and causing damage to other system bodies. More preferably, the insulating base layer 1 is made of a transparent PVC sheet material having a thickness of 0.02 mm.
As a preferred embodiment, the first electrode layer 3 is a thin sheet metal electrode of arbitrary polarity having the same shape as the insulating base layer 1 and an area slightly smaller than the base layer 1, and the metal material should be selected to have good conductivity and ductility. The second electrode layer 5 is a thin sheet metal electrode of equidistant and equal width (electrode width is the same as the spiral gap width; the polarity is opposite to that of the first electrode layer 3), and the selected metal material has good conductivity and ductility. The positive and negative polarities of the first electrode layer 3 and the second electrode layer 5 are not required to be hard. More preferably, brass sheets with a thickness of 0.02mm are selected to make the first electrode layer 3 and the second electrode layer 5.
As a preferred embodiment, the first dielectric layer 4 is a flexible dielectric film having good dielectric properties and the same shape and area as the insulating base layer 1, and its main function is to avoid breakdown short circuit caused by high voltage between the first electrode layer 3 and the second electrode layer 5 and to generate good dielectric function. The second dielectric layer 6 is a flexible dielectric film with good dielectric performance and the same shape and area as those of the insulating base layer 1, and the main function of the second dielectric layer is to avoid the second electrode layer 5 from directly contacting with the target surface and generating ideal dielectric function, so as to realize electrostatic adsorption. More preferably, transparent PET film material with a thickness of 0.05mm is selected to make the first dielectric layer 4 and the second dielectric layer 6.
As a more preferable embodiment, the electrode width of the second electrode layer 5 is d, the interval width between the electrode spiral shapes is d, the distance between the edge of the second electrode layer 5 and the edge of the first electrode layer 3 is d, the distance between the edge of the first electrode layer 3 and the edge of the insulating base layer 1 is d, the specific value of d and the number of spiral turns are designed according to the required adsorption force and the required adsorption target size, if the required adsorption force is larger and the target is larger, the d is designed to be larger, and if the required adsorption force is smaller and the target is smaller, the d is designed to be smaller. In this embodiment, d=10mm is selected, and the number of spiral turns of the second electrode layer 5 is 4.
In the embodiment, in order to facilitate understanding of the structure and the relative position of each layer of tissue, the electrical connection pins of the first electrode layer 3 and the second electrode layer 5 are omitted, and in practical application, the electrical connection pins of the first electrode layer 3 and the second electrode layer 5 can be freely designed according to design requirements and structural parameters, and the first electrode layer 3 and the second electrode layer 5 have no positive and negative requirements. In this embodiment, in order to ensure the flatness of the working surface of the electrostatic adsorbing device 100 with different surface configurations, the power-on pins are led out from the opposite directions of the first electrode layer 3 and the second electrode layer 5 respectively, the lengths of the power-on pins exceed the insulating substrate layer 1, and then the power-on pins are bent to be closely attached to the bottom of the insulating substrate layer 1, so as to connect the positive and negative electrodes of the high-voltage direct-current power supply.
Example 2
The embodiment provides a method for preparing an electrostatic adsorption device 100 with different surface configurations, which comprises the following steps:
obtaining an insulating substrate layer 1, a first electrode layer 3, a first dielectric layer 4, a spiral second electrode layer 5 and a second dielectric layer 6, and enabling the first dielectric layer 4 to completely separate the first electrode layer 3 and the second electrode layer 5, enabling the size of the second dielectric layer 6 to be not smaller than that of the second electrode layer 5, and enabling the second dielectric layer 6 to completely cover the second electrode layer 5; the substrate layer 1, the first electrode layer 3, the first dielectric layer 4, the second electrode layer 5 and the second dielectric layer 6 are fixedly connected to obtain the electrostatic adsorption device 100 with the different surface configuration, and the order of the component layers of the electrostatic adsorption device 100 with the different surface configuration is that the substrate layer 1, the first electrode layer 3, the first dielectric layer 4, the second electrode layer 5 and the second dielectric layer 6 are sequentially arranged.
Further, the manufacturing method of the second electrode layer 5 and the connection method of the second electrode layer and the second dielectric layer 6 include: obtaining a sheet-shaped second electrode material layer and a second dielectric layer with specific sizes, cutting a tearing line on the second electrode material layer along a set cutting path, and forming a second electrode layer 5 with a spiral area surrounded by the tearing line; attaching and connecting the cut second electrode material layer with the second dielectric layer 6, and removing materials except the second electrode layer 5 on the second electrode material layer along a tearing line to obtain a first combined body formed by combining the second electrode layer 5 and the second dielectric layer 6;
the method for manufacturing the electrostatic adsorption device 100 with different surface configurations provided in this embodiment further includes: the first assembly is fixedly connected to the base layer 1, the first electrode layer 3 and the first dielectric layer 4.
If the spiral second electrode layer 5 and the second dielectric layer 6 are directly fixed, the second electrode layer 5 is easy to deform, the processing difficulty is high, and the processing precision is difficult to ensure; in the embodiment, the second electrode material layer is firstly cut, the redundant part on the second electrode material layer is still ensured to be connected with the spiral second electrode layer 5, and then the second electrode material layer which is not stripped from the redundant material is fixed with the second dielectric layer 6, so that the positioning is convenient, the processing difficulty is reduced, and the processing precision is ensured; compared with the method of connecting the second electrode material layer with the second electrode layer 5 and then cutting the second electrode material layer, the processing method of the embodiment can avoid the second dielectric layer from being broken down due to scratches caused on the second dielectric layer when cutting the second electrode material layer.
As a preferred embodiment, the second electrode material layer is cut along the preset graph line by using a laser cutting and engraving machine, and appropriate cutting parameters are set, so that the insulation base layer 1 and the adhesive layer 2 are not damaged, and are convenient to separate, the redundant part on the second electrode material layer is ensured to be stripped, and the second electrode layer 5 is formed. As a more preferred embodiment, the setting of the cutting parameters is required to ensure that the edge portion of the second electrode material layer can be cut through, so that the surplus portion is easily torn off starting from the edge position.
As a preferred embodiment, the cut second electrode material layer and the second dielectric layer 6 are connected by a hot press molding process, specifically: and (3) tightly attaching the cut second electrode material layer to the second dielectric layer 6, exhausting redundant air between the cut second electrode material layer and the second dielectric layer 6, and then tightly and thermally pressing and attaching the cut second electrode material layer and the second dielectric layer 6 together by using a hot press.
Further, the method for connecting the second electrode layer 5 and the second dielectric layer 6 further includes:
mode one: if the size of the second dielectric layer 6 is equal to the size of the second electrode material layer, aligning the outer edge of the cut second electrode material layer with the outer edge of the second dielectric layer 6, connecting the two, and removing the materials except the second electrode layer 5 on the second electrode material layer along the tearing line; the second dielectric layer 6 and the second electrode material layer have the same size, and can directly position the edges of the two layers, thereby being convenient for positioning and easily ensuring the precision.
Mode two: if the size of the second dielectric layer 6 is larger than the size of the second electrode material layer, after the cut second electrode material layer is connected with the second dielectric layer 6, the part of the second dielectric layer 6 beyond the second electrode material layer is removed first, and then the materials except the second electrode layer 5 on the second electrode material layer are removed along the tearing line. The second embodiment is preferable to manufacture the electrostatic adsorbing apparatus 100 so that the accuracy of the whole of the electrostatic adsorbing apparatus 100 having the different surface configuration can be better ensured.
Further, the method for manufacturing the electrostatic adsorption device 100 with a different surface configuration according to the present embodiment further includes: sequentially connecting the substrate layer 1, the first electrode layer 3 and the first dielectric layer 4 into a whole to form a second combination, and attaching and connecting the second electrode layer 5 in the first combination with the first dielectric layer 4 in the second combination;
the manufacturing method of the second combination body comprises the following steps: obtaining a substrate layer 1, a first electrode material layer and an adhesive layer 2 with the same shape and size, and obtaining a first dielectric layer 4, wherein the size of the first dielectric layer 4 is selected to be required to completely cover the substrate layer 1, one side of the adhesive layer 2 is completely adhered to the substrate layer 1, and the first electrode material layer is completely adhered to the other side of the adhesive layer 2; the adhesive layer 2 comprises a first adhesive layer, a tissue layer and a second adhesive layer, and the first adhesive layer and the second adhesive layer are respectively adhered to two sides of the tissue layer; cutting the first electrode material layer, cutting the first electrode material layer into a first electrode layer 3 in the middle and an annular outer ring part, and stripping the annular outer ring part from the adhesive layer 2 to obtain a third combined body formed by combining the first electrode layer 3 and the substrate layer 1; the third assembly is fixedly connected to the first dielectric layer 4.
Thanks to the unique properties of the double sided adhesive tape of the tissue paper substrate, when the redundant part of the first electrode material layer is peeled off from the adhesive layer 2, the thickness of the tissue paper substrate is slightly increased, so that the tissue paper substrate is easier to adhere to the first dielectric layer 4 or the first dielectric layer 4, which is beneficial to improving the overall flatness.
As a preferred embodiment, the first electrode material layer of the third assembly is cut along the designed cutting path by setting appropriate cutting parameters by a laser dicing saw, and the formed insulating base layer 1 and other adhesion-waiting parts are obtained after removing the redundant parts. The setting of the cutting parameters needs to meet the requirement of completely cutting through the first electrode material layer while not damaging the insulating substrate and the adhesive layer 2, so that the redundant part of the first electrode material layer can be well peeled off to form the first electrode layer 3.
As a preferred embodiment, the substrate layer 1, the adhesive layer 2 and the first electrode material layer are tightly compacted and adhered together by using a laminator to form a three-layer composite whole;
as a preferred embodiment, the thermal compression bonding and fixing of the first dielectric layer 4, the first electrode layer 3 and the base layer 1 are achieved by self-weight heating at 100 ℃ for 30 s.
As a preferred embodiment, the second dielectric layer 6 in the first assembly and the base layer 1 have the same size and shape, and the two can be positioned by aligning the outer edges of the first dielectric layer 4 in the second assembly and the second dielectric layer 6 in the first assembly, tightly and firmly pressed together by a laminator, and then the electrostatic adsorbing device 100 in a heterogeneous shape is integrally thermally pressed and bonded together by a hot press. In this embodiment, the self-weight heating at 100 ℃ is adopted for 30s to realize the hot-press bonding and the fixation, so as to obtain the final electrostatic adsorption device 100 with different-surface flexible and different-surface configuration. The self-weight heating is that the first combination body and the second combination body are pressed tightly by the gravity of the hot press and are bonded by hot pressing.
Further, the method for fixedly connecting the third combination body with the first dielectric layer 4 includes:
mode one: if the size of the first dielectric layer 4 is equal to the size of the substrate layer 1, aligning the outer edge of the first dielectric layer 4 with the outer edge of the substrate layer 1 and connecting the two;
mode two: if the size of the first dielectric layer 4 is larger than the size of the base layer 1, the outer edge of the first dielectric layer 4 is connected with the base layer 1, and then the part of the first dielectric layer 4 beyond the base layer 1 is removed. The second embodiment is preferable to manufacture the electrostatic adsorbing apparatus 100 so that the accuracy of the whole of the electrostatic adsorbing apparatus 100 having the different surface configuration can be better ensured.
Further, the method for manufacturing the electrostatic adsorption device 100 with a different surface configuration according to the present embodiment further includes: before the base layer 1, the first electrode layer 3, the first dielectric layer 4, the second electrode layer 5 and the second dielectric layer 6 are prepared, the dimensions of the base layer 1, the first electrode layer 3, the first dielectric layer 4, the second electrode layer 5 and the second dielectric layer 6 are obtained according to the dimensions of the adsorption target and the required adsorption force, and the dicing paths are obtained according to the dimensions of the second electrode layer 5.
As a preferred embodiment, the second dielectric layer 6 is a dielectric film, the second electrode material layer is a sheet metal, and the two layers have good thermocompression bonding property, so that the connection is performed by adopting a thermocompression molding process, and the dielectric film can adaptively generate corresponding deformation while thermocompression bonding, so that the finally molded electrostatic adsorption device 100 with a different surface configuration shows smoothness. Similarly, the first dielectric layer 4 is a dielectric film, the second electrode layer 5 is tightly attached to the first dielectric layer 4, redundant air between the two layers is discharged, and then the first dielectric layer 4, the second electrode layer 5 and the second dielectric layer 6 are bonded together by hot pressing through a hot press, so that the manufacturing of the electrostatic adsorption device 100 with the flexible heterofacial configuration is completed, and the finally formed heterofacial electrostatic adsorption device 100 with the heterofacial configuration can be smooth in surface.
The first electrode layer 3 and the second electrode layer 5 are respectively connected with the positive electrode and the negative electrode of the direct-current high-voltage power supply, so that the electrostatic adsorption effect on the adhesion target can be realized through the dielectric effect.
The first dielectric layer 4 and the second dielectric layer 6 provided in this embodiment may be plastic materials such as PVC or tissue materials; the first electrode layer 3 and the second electrode layer 5 provided in this embodiment are conductive materials with better ductility and plasticity, for example, may be metal materials such as copper, aluminum, iron, silver, gold, and the like, and alloy materials.
The principles and embodiments of the present application have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present application; also, it is within the scope of the present application to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the application.
Claims (10)
1. An electrostatic adsorption device with different surface configurations, which is characterized in that: including stratum basale, first electrode layer, first dielectric layer, second electrode layer and the second dielectric layer of fixed connection in proper order, the second electrode layer is the heliciform, the stratum basale is the insulating layer, first dielectric layer can separate completely first electrode layer with the second electrode layer, the second dielectric layer can cover completely the second electrode layer.
2. The electrostatic chuck of a heteroplanar configuration of claim 1, wherein: the adhesive layer is arranged between the substrate layer and the first electrode layer, the projection of the first electrode layer on the plane where the adhesive layer is located in the adhesive layer, the first electrode layer and the substrate layer can be bonded through the adhesive layer, and the part of the first dielectric layer exceeding the first electrode layer and the substrate layer can be bonded through the adhesive layer.
3. The electrostatic chuck of a heteroplanar configuration of claim 2, wherein: the adhesive layer comprises a first adhesive layer, a tissue layer and a second adhesive layer, wherein the first adhesive layer and the second adhesive layer are respectively adhered to two sides of the tissue layer.
4. The electrostatic chuck of a heteroplanar configuration of claim 2, wherein: the substrate layer, the first electrode layer, the first dielectric layer, the second electrode layer and the second dielectric layer are flexible material layers, the first dielectric layer and the second dielectric layer are thin film dielectric layers, and the first electrode layer and the second electrode layer are made of metal.
5. A preparation method of an electrostatic adsorption device with different surface configurations is characterized by comprising the following steps: the method comprises the following steps:
obtaining an insulating substrate layer, a first electrode layer, a first dielectric layer, a spiral second electrode layer and a second dielectric layer, and enabling the first dielectric layer to completely separate the first electrode layer and the second electrode layer, enabling the size of the second dielectric layer to be not smaller than that of the second electrode layer, and enabling the second dielectric layer to completely cover the second electrode layer; and fixedly connecting the substrate layer, the first electrode layer, the first dielectric layer, the second electrode layer and the second dielectric layer to obtain the electrostatic adsorption device with the different-surface configuration, wherein the sequence of the constituent layers of the electrostatic adsorption device with the different-surface configuration is the substrate layer, the first electrode layer, the first dielectric layer, the second electrode layer and the second dielectric layer in sequence.
6. The method for manufacturing the electrostatic adsorbing device with different surface configurations according to claim 5, wherein:
the manufacturing method of the second electrode layer and the connecting method of the second electrode layer and the second dielectric layer comprise the following steps: obtaining a sheet-shaped second electrode material layer and a second dielectric layer with specific sizes, and cutting a tearing line on the second electrode material layer along a set cutting path, wherein the area surrounded by the tearing line is the spiral second electrode layer; attaching and connecting the cut second electrode material layer with the second dielectric layer, and removing materials except the second electrode layer on the second electrode material layer along the tearing line to obtain a first combined body formed by combining the second electrode layer and the second dielectric layer;
further comprises: and fixedly connecting the first combination body with the basal layer, the first electrode layer and the first dielectric layer.
7. The method for manufacturing the electrostatic adsorbing device with different surface configurations according to claim 6, wherein: the method for connecting the second electrode layer and the second dielectric layer further comprises the following steps:
if the size of the second dielectric layer is equal to the size of the second electrode material layer, aligning the outer edge of the cut second electrode material layer with the outer edge of the second dielectric layer, connecting the two, and removing materials except the second electrode layer on the second electrode material layer along the tearing line;
and if the size of the second dielectric layer is larger than that of the second electrode material layer, removing the part of the second dielectric layer exceeding the second electrode material layer after the cut second electrode material layer is connected with the second dielectric layer, and removing materials except the second electrode layer on the second electrode material layer along the tearing line.
8. The method for manufacturing the electrostatic adsorbing device with different surface configurations according to claim 7, wherein: further comprises: sequentially connecting the substrate layer, the first electrode layer and the first dielectric layer into a whole to form a second combination, and attaching and connecting the second electrode layer in the first combination with the first dielectric layer in the second combination;
the manufacturing method of the second combination body comprises the following steps: obtaining a substrate layer, a first electrode material layer and an adhesive layer which are identical in shape and size, and obtaining the first dielectric layer, wherein the size of the first dielectric layer is selected to be capable of completely covering the substrate layer, one side of the adhesive layer is completely adhered to the substrate layer, and the first electrode material layer is completely adhered to the other side of the adhesive layer; the adhesive layer comprises a first adhesive layer, a tissue layer and a second adhesive layer, and the first adhesive layer and the second adhesive layer are respectively adhered to two sides of the tissue layer;
cutting the first electrode material layer, cutting the first electrode material layer into the first electrode layer in the middle and an annular outer ring part, and stripping the annular outer ring part from the adhesive layer to obtain a third combined body formed by combining the first electrode layer and the substrate layer;
and fixedly connecting the third combination body with the first dielectric layer.
9. The method for manufacturing the electrostatic adsorbing device with different surface configurations according to claim 8, wherein:
the method for fixedly connecting the third combination body and the first dielectric layer comprises the following steps:
if the size of the first dielectric layer is equal to the size of the basal layer, aligning the outer edge of the first dielectric layer with the outer edge of the basal layer and connecting the two;
and if the size of the first dielectric layer is larger than that of the substrate layer, removing the part of the first dielectric layer beyond the substrate layer after connecting the outer edge of the first dielectric layer with the substrate layer.
10. The method for manufacturing the electrostatic adsorbing device with different surface configurations according to claim 6, wherein: further comprises: before the base layer, the first electrode layer, the first dielectric layer, the second electrode layer and the second dielectric layer are prepared, the dimensions of the base layer, the first electrode layer, the first dielectric layer, the second electrode layer and the second dielectric layer are obtained according to the dimensions of an adsorption target and the required adsorption force, and the cutting path is obtained according to the dimensions of the second electrode layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310754002.9A CN116780941A (en) | 2023-06-25 | 2023-06-25 | Electrostatic adsorption device with different surface configurations and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310754002.9A CN116780941A (en) | 2023-06-25 | 2023-06-25 | Electrostatic adsorption device with different surface configurations and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116780941A true CN116780941A (en) | 2023-09-19 |
Family
ID=87985587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310754002.9A Pending CN116780941A (en) | 2023-06-25 | 2023-06-25 | Electrostatic adsorption device with different surface configurations and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116780941A (en) |
-
2023
- 2023-06-25 CN CN202310754002.9A patent/CN116780941A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101806926B1 (en) | Both surfaces attracting structure, fabricating method for both surfaces attracting structure, and method for attracting object to be attracted using both surfaces attracting structure | |
| JP5348439B2 (en) | Electrostatic chuck | |
| JPH06251874A (en) | Electroluminescent light and its manufacture | |
| KR101343456B1 (en) | Electrostatic chuck | |
| JP2008112763A (en) | Electrostatic chuck | |
| TWI242256B (en) | Electrode sheet for electrostatic chucking device, electrostatic chucking device and method of adsorption | |
| JP2009124791A (en) | Vibrator and vibration wave actuator | |
| CN113851550A (en) | Solar cell string and preparation method and application thereof | |
| CN102646799A (en) | Lead member | |
| CN116780941A (en) | Electrostatic adsorption device with different surface configurations and preparation method thereof | |
| WO2024087667A1 (en) | Conductive wire membrane and photovoltaic cell assembly | |
| CN106299098B (en) | The manufacturing method of the outer electrode of COMMB-LED light sources | |
| JP7249047B2 (en) | Electrostatic adsorption body | |
| CN109671549B (en) | Magnetic conductive sheet for wireless charger and preparation method thereof | |
| CN112976042A (en) | Charging type semi-permanent electrostatic adsorption device | |
| TW200402071A (en) | Anisotropic conduction board and its manufacturing method | |
| CN215395287U (en) | Charging type semi-permanent electrostatic adsorption device | |
| CN116853378A (en) | Flexible electrostatic adsorption device with coplanar configuration and manufacturing method thereof | |
| JP2011155135A (en) | Jig for semiconductor element transfer and method of transferring semiconductor element | |
| CN109068489B (en) | Self-heating mirror plate for laminating circuit board | |
| JPS58151077A (en) | Piezoelectric effect device | |
| CN108925052B (en) | Self-heating insulating mirror plate | |
| JP2000348983A (en) | Electrolytic capacitor, anode body and manufacture thereof | |
| JPH03129786A (en) | Laminated electrostrictive element | |
| JPH11195818A (en) | Laminated type piezoelectric actuator and manufacture therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |