CN116761123B - Speaker module and electronic equipment - Google Patents

Speaker module and electronic equipment Download PDF

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Publication number
CN116761123B
CN116761123B CN202311059876.9A CN202311059876A CN116761123B CN 116761123 B CN116761123 B CN 116761123B CN 202311059876 A CN202311059876 A CN 202311059876A CN 116761123 B CN116761123 B CN 116761123B
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China
Prior art keywords
shell
cavity
groove
sub
main body
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CN202311059876.9A
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Chinese (zh)
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CN116761123A (en
Inventor
吴江
张羽
石伟杰
罗晶
王传果
于利刚
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Honor Device Co Ltd
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Honor Device Co Ltd
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Priority to CN202311059876.9A priority Critical patent/CN116761123B/en
Publication of CN116761123A publication Critical patent/CN116761123A/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00Loudspeakers
    • H04R2400/11Aspects regarding the frame of loudspeaker transducers

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)

Abstract

The application provides a loudspeaker module and electronic equipment. The loudspeaker module comprises a shell component and a loudspeaker body arranged in the shell component, wherein a front cavity, a rear cavity, a resonant tube and a sound guide hole are arranged in the shell component. The front cavity is configured to communicate with an exterior of the housing assembly. The rear cavity is separated from the front cavity by a speaker body. The resonance tube is communicated between the resonance cavity and the rear cavity. The sound guiding hole is configured to communicate between a cavity and a rear cavity of an electronic device. The resonator tube and the sound guide hole form two independent paths for sound waves generated by the loudspeaker body to be conducted from the rear cavity to the resonator cavity and the cavity, so that sound wave energy generated by the loudspeaker body enters the resonator tube and the resonator cavity before being diffused to the whole cavity, and the resonator tube and the resonator cavity absorb the sound wave energy, so that the sound wave energy entering the cavity of the shell is reduced, and the vibration amplitude of the shell is further reduced.

Description

Speaker module and electronic equipment
Technical Field
The embodiment of the application relates to the technical field of terminals, in particular to a loudspeaker module and electronic equipment.
Background
In the prior art, the internal cavity of the electronic equipment is used as the rear cavity of the loudspeaker, so that the volume of the rear cavity of the loudspeaker is increased, the loudspeaker obtains better audio effect, but the electronic equipment with an open sound cavity easily causes the shell to vibrate, and the user experience is influenced.
Disclosure of Invention
In view of the above, the present application provides a speaker module for reducing vibration of an electronic device.
In a first aspect, the present application provides a speaker module. The loudspeaker module comprises a shell component and a loudspeaker body arranged in the shell component, wherein a front cavity, a rear cavity, a resonant tube and a sound guide hole are arranged in the shell component. The front and rear chambers are separated by a speaker body, and the front chamber is configured to communicate with an exterior of the housing assembly. The resonance tube is communicated between the resonance cavity and the rear cavity. The sound guide hole is configured to be communicated between a cavity and a rear cavity of an electronic device, and the resonator tube and the sound guide hole form two independent paths for sound waves generated by the speaker body to be conducted from the rear cavity to the resonator cavity and the cavity.
The loudspeaker module forms two independent paths of sound wave conduction through the resonance tube and the sound guide hole, so that sound wave energy generated by the loudspeaker body enters the resonance tube and the resonance cavity before being diffused to the whole cavity, the resonance tube and the resonance cavity absorb the sound wave energy, and further the sound wave energy of the entering cavity is reduced, so that the vibration amplitude of the electronic equipment is reduced.
In one possible embodiment, the resonant cavity is located within the rear cavity.
Obviously, in the above embodiment, the resonant cavity occupies a part of the space of the rear cavity in the housing assembly, and the volume of the resonant cavity is smaller than the volume of the total space formed by the rear cavity and the cavity, so that the influence on the sound effect of the speaker body is small and can be ignored. A resonant cavity is additionally arranged in the loudspeaker module, so that other spaces in the electronic equipment outside the shell assembly are not occupied.
In one possible embodiment, the housing assembly comprises a first shell provided with an inner cavity and a second shell provided with an acoustic guiding hole. The loudspeaker body is arranged in the inner cavity and divides the inner cavity into a front cavity and a rear cavity which are not communicated with each other. The second shell is arranged in the inner cavity, and the second shell is provided with a resonant tube and a resonant cavity.
Obviously, in the above embodiment, the second shell is disposed in the inner cavity of the housing assembly, and the resonant cavity and the resonant tube are formed on the second shell, so that the resonant cavity is located in the rear cavity, and the second shell does not occupy the space outside the housing assembly, so as to avoid occupying the layout space of other structures in the electronic device.
In a possible embodiment, the second shell is directed towards the speaker body, the inlet of the sound wave into the resonator tube being closer to the speaker body than the outlet of the sound wave out of the resonator tube.
In one possible embodiment, the acoustic energy of the speaker body diffuses into the back chamber, the acoustic energy decreases in energy density with distance from the speaker body, the density of acoustic energy near the speaker body is greater, the entrance of the acoustic wave into the resonator tube is closer to the speaker body than the exit of the acoustic wave out of the resonator tube, the resonator tube is advantageously disposed on one side of the speaker body in the chamber, and the entrance into the resonator tube is advantageously closer to the region of greater acoustic energy density near the speaker body, increasing the amount of acoustic energy entering the resonator chamber.
In one possible embodiment, the second shell includes a first main body shell and a first sub-shell. The first body case is formed on the first case. The first main body shell is provided with a first groove and a second groove which are spaced, the first main body shell is also provided with a first through hole, and the first groove and the second groove are communicated through the first through hole. The first sub-shell is provided with a second through hole, the first sub-shell cover is arranged on the first main body shell and surrounds the groove wall of the first groove to form a resonance tube, and the first groove is communicated with the rear cavity through the second through hole. The first sub-shell and the groove wall of the second groove are surrounded to form a resonant cavity.
Obviously, in the above embodiment, the first sub-shell is connected with the first main body shell and forms the resonant cavity and the resonant tube, and the first main body shell may be manufactured by injection molding, casting, machining or other processes, for example, the first groove and the second groove for forming the resonant cavity and the resonant tube may be machined at the side of the first main body shell, so as to reduce the machining difficulty of the first main body shell, or reduce the manufacturing difficulty of injection molding or casting, such as demolding.
In one possible embodiment, the first main body case includes a second sub-case and a third sub-case, the first groove, the second groove and the first through hole are respectively disposed in the second sub-case, the third sub-case is disposed in the second sub-case, and one side of the second groove facing away from the first groove is closed.
Obviously, in the above embodiment, the first main body shell is of a non-integral molding structure, and the first groove and the second groove can be processed or molded on two sides of the second sub-shell, so that the processing of the second sub-shell is facilitated.
In one possible embodiment, the second sub-housing comprises a main body portion and an extension portion, the main body portion being provided with a second recess. The extension extends from the side wall of the second groove to the inside of the second groove, and is arranged at intervals with the bottom wall of the second groove, and the extension is provided with a first groove.
Obviously, in the above embodiment, the volume of the resonant tube is generally smaller than that of the resonant cavity, and the first groove for forming the resonant tube is disposed close to the rear cavity, so that the first groove and the second groove are sealed in the first main body shell through the same first sub-shell cover to form the resonant tube and the resonant cavity, thereby simplifying the structure and the installation steps.
In one possible embodiment, the resonator tube extends diagonally from the outer wall of the second housing until it communicates with the resonator chamber.
Obviously, in the above embodiment, the resonator tube extends in an oblique direction, and may be formed on the second shell by drilling, injection molding, or the like. The resonance tube does not need two or more structures to enclose and form, but forms on an independent structure to promote the dimensional accuracy of resonance tube, and then the accuracy of cross-section area and length of resonance tube is favorable to improving the effect that reduces the amplitude of electronic equipment casing.
In one possible embodiment, the second case includes a second main body case and a fourth sub-case, the second main body case being formed at the first case and provided with a third groove. The fourth sub-shell is arranged on the second main body shell and forms a resonant cavity with the wall of the third groove. The resonator tubes extend diagonally from the second main body shell toward the fourth sub-shell.
Obviously, in the above embodiment, the second shell is of a non-integral structure, and the third grooves and the inclined resonance tubes may be formed on both sides of the second body shell, so as to facilitate the processing of the second body shell.
In one possible embodiment, the second housing comprises a third body housing and a connection piece, the third body housing being provided with a resonant cavity and a third through hole. The connecting piece is connected to the third main body shell and is provided with a through resonant tube, and the resonant tube is communicated with the resonant cavity through a third through hole.
Obviously, in the above embodiment, the resonator tube is simply machined on the connecting piece, and the machining precision of the resonator tube is easy to ensure, so that the accuracy of the cross-sectional area and the length of the resonator tube is improved, and the effect of reducing the amplitude of the electronic equipment shell is improved.
In one possible embodiment, the outer side of the third body case is provided with a mounting groove, and the third through hole penetrates through the bottom wall of the mounting groove. The resonator tube includes a first pipe extending in an axial direction of the connection member and a second pipe extending in a radial direction of the connection member. The connecting piece is located the mounting groove, and the glue is filled in the mounting groove, and the second pipeline is relative and the intercommunication with the third through hole.
Obviously, in the above embodiment, the fixing connection piece can be realized by filling glue in the mounting groove, and the connection piece is in sealing connection with the third main body shell, so that the connection tightness of the resonant tube and the resonant cavity is improved.
In one possible embodiment, the third main body case includes a fifth sub-case and a sixth sub-case, the fifth sub-case being molded to the first case. The fifth sub-shell is provided with a fourth groove, a third through hole and a mounting groove, and the mounting groove is communicated with the fourth groove through the third through hole. The sixth sub-shell is arranged on the fifth sub-shell and forms a resonant cavity with the wall of the fourth groove.
Obviously, in the above embodiment, the third main body shell is of a non-integral structure, and the mounting groove, the fourth groove and the third through hole can be machined on two sides of the fifth sub-shell, so that the machining of the third main body shell is facilitated.
In one possible embodiment, the housing assembly comprises a first shell provided with an inner cavity and a second shell provided with an acoustic guiding hole. The loudspeaker body is arranged in the inner cavity and divides the inner cavity into a front cavity and a rear cavity which are not communicated with each other. The second shell is arranged outside the inner cavity and connected with the first shell, and the second shell is provided with a resonant tube and a resonant cavity.
Obviously, in the above embodiment, the resonator tube and the sound guide hole provided on the first shell are communicated with the rear cavity together, so that the resonator cavity and the cavity of the shell are communicated with the rear cavity together, and the resonator tube and the resonator cavity act on the sound wave to weaken the sound wave energy before the sound wave energy generated by the speaker body is diffused to the whole cavity, thereby reducing the sound wave energy entering the cavity of the shell and reducing the vibration amplitude of the shell.
In one possible embodiment, the first shell includes a base and a cover disposed on the base and surrounding the base to form an inner cavity, the cover being disposed on one side of the rear cavity, and the second shell being disposed at a distance from the cover.
Obviously, in the above embodiment, the first shell comprises two structures of the base body and the cover body, so that the second shell is conveniently installed or molded in the inner cavity, that is, the manufacturing and installation of the shell assembly are facilitated.
In a second aspect, the application provides an electronic device, which comprises a housing and a speaker module, wherein a cavity is formed in the housing, the speaker module is arranged in the housing, the speaker module comprises a housing assembly and a speaker body arranged in the housing assembly, and a front cavity, a rear cavity, a resonant tube and a sound guide hole are arranged in the housing assembly. The sound guide hole is communicated with the cavity. The front cavity is configured to communicate with an exterior of the housing assembly. The rear cavity is separated from the front cavity by a speaker body. The resonance tube is communicated between the resonance cavity and the rear cavity. The sound guide hole is configured to be communicated between a cavity of an electronic device and the rear cavity, and the resonance tube and the sound guide hole form two independent paths for conducting sound waves generated by the loudspeaker body from the rear cavity to the resonance cavity and the cavity.
The electronic equipment forms two independent paths of sound wave conduction communicated with the rear cavity through the resonance tube and the sound guide hole, sound wave energy generated by the loudspeaker body enters the resonance tube and the resonance cavity before being diffused to the whole cavity, and the resonance tube and the resonance cavity absorb the sound wave energy, so that the sound wave energy entering the cavity of the shell is reduced, and the vibration amplitude of the shell is reduced.
Drawings
Fig. 1 is a simplified schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 2 is a schematic diagram of an effect of a resonator tube and a resonator cavity on an amplitude of a housing of an electronic device according to an embodiment of the application.
Fig. 3 is a schematic structural diagram of a speaker module in the electronic device shown in fig. 1.
Fig. 4 is an exploded view of the speaker module shown in fig. 3.
Fig. 5 is a partially exploded view of the speaker module shown in fig. 4 at another view angle.
Fig. 6 is a schematic sectional view of the speaker module shown in fig. 3.
Fig. 7 is a schematic structural diagram of the speaker module shown in fig. 1 when the cover is detached from the base in another embodiment.
Fig. 8 is an exploded view of the speaker module shown in fig. 7.
Fig. 9 is a schematic sectional view of the speaker module shown in fig. 7.
Fig. 10 is an exploded view of the speaker module shown in fig. 1 in a further embodiment.
Fig. 11 is a schematic sectional view of the speaker module shown in fig. 10.
Fig. 12 is a simplified schematic diagram of the electronic device shown in fig. 1 in another embodiment.
Description of the main reference signs
Electronic equipment: 200 200c; a shell: 201; and (3) a cavity: 2011; speaker module: 100 100a,100b; a housing assembly: 10; front cavity: 101; rear cavity: 102, a step of; a resonant cavity: 103; a resonator tube: 104 104a,104b; a first pipeline: 1041; and a second pipeline: 1043; sound guiding hole: 105; second sound outlet hole: 106. A first shell: 11; an inner cavity: 1101; a substrate: 111; mounting part: 1111; cover body: 113; and a second shell: 1313 a,13b,13c; first body shell: 131; first groove: 1301; and a second groove: 1302, a step of detecting a position of a target; a first through hole: 1303; main body: 1304; extension: 1305; a second sub-shell: 1311; third sub-shell: 1313; a first sub-shell: 132, a part of the material; and a second through hole: 1306; second body shell: 133; third groove: 1307; fourth sub-shell: 134; third body shell: 135; third through hole: 1308; fifth sub-shell: 1351; fourth groove: 1310; sixth sub-shell: 1353; and (3) a mounting groove: 1309; and (3) a connecting piece: 136; speaker body: 20.
the application will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
In order to further illustrate the technical means and effects adopted by the present application to achieve the purpose of the predetermined application, the following description is made with reference to the accompanying drawings and the implementation, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Some embodiments of the present application are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
Referring to fig. 1, an embodiment of the application provides a speaker module 100 and an electronic device 200 including the speaker module 100. The electronic device 200 further comprises a housing 201. The speaker module 100 is disposed in the housing 201. The electronic device 200 may be a mobile terminal or a fixed terminal device having a speaker module 100, such as a cell phone, a tablet computer, a wearable device, a vehicle-mounted device, an Augmented Reality (AR)/Virtual Reality (VR) device, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (personal digital assistant, PDA), etc.
The following description will take the electronic device 200 as an example of a mobile phone.
The speaker module 100 includes a housing assembly 10 and a speaker body 20. The housing assembly 10 is provided with a front cavity 101, a rear cavity 102, a resonant cavity 103, a resonant tube 104 and an acoustic port 105. The front chamber 101 and the rear chamber 102 are partitioned by the speaker body 20. The resonant cavity 103 communicates with the rear cavity 102 through a resonant tube 104.
The cavity 2011 is formed in the housing 201, the cavity 2011 is used as an open sound cavity of the speaker module 100, and the cavity 2011 is communicated with the rear cavity 102 through the sound guide hole 105, so that the volume of the total space of the speaker body 20 is increased, and the rear cavity 102 has the functions of preventing middle-low frequency sound short circuit and further improving the smoothness of sound. Accordingly, the volume of the total space formed by the cavity 2011 and the rear cavity 102 increases, contributing to an improvement in the audio effect of the electronic apparatus 200. For example, the rear cavity 102 in the housing assembly 10 is limited by the layout of the devices inside the electronic device 200, and the volume of the rear cavity 102 is generally smaller than 1cc, and the rear cavity 102 is communicated with the open type sound cavity (cavity 2011), so that the volume of the total space formed by the cavity 2011 and the rear cavity 102 can reach 6cc-22cc, and further, the audio effect is improved.
The speaker body 20 is disposed within the housing assembly 10. The speaker body 20 vibrates through sound production by an internal diaphragm (not shown), thereby driving air in the front chamber 101 to vibrate and thus to generate sound.
The front cavity 101 is configured to communicate with the exterior of the housing assembly 10. In one embodiment, the housing 201 is further provided with a first sound outlet (not shown), and the housing assembly 10 is provided with a second sound outlet 106, as shown in fig. 3. The front cavity 101 is communicated with the first sound outlet through the second sound outlet 106, so that sound formed by vibration of the speaker body 20 is transmitted out of the shell 201 through the second sound outlet 106.
When the speaker body 20 is in operation, the housing 201 of the electronic device 200 and devices in the housing 201 vibrate due to acoustic wave conduction, etc., the housing 201 vibration affects the user's holding experience, and the devices (e.g., sensors, circuit boards, etc.) in the housing 201 vibration may affect performance.
The resonant cavity 103 communicates with the rear cavity 102 through a resonant tube 104. The resonator tube 104 and the sound guide aperture 105 communicate with the rear cavity 102, respectively, to form two independent paths for the conduction of sound wave energy from the rear cavity 102 to the resonator 103 and the cavity 2011. The acoustic energy conduction generated by the speaker body 20 includes two paths, path one and path two, in addition to the path conducted to the front chamber. Path one: the sound wave enters the rear cavity 102 and enters the resonant cavity 103 through the resonant tube 104; path two: sound waves pass from the rear cavity 102 through the sound guide hole 105 and enter the cavity 2011.
The sound wave energy generated by the speaker body 20 enters the resonant cavity 103 through the resonant tube 104 before being diffused into the whole cavity 2011, and the resonant tube 104 and the resonant cavity 103 absorb the sound wave energy, so that the sound wave energy entering the cavity 2011 of the housing 201 is reduced, and the vibration amplitude of the housing 201 is further reduced.
When the resonance frequency of the resonance chamber 103 is close to or equal to the vibration frequency corresponding to the maximum amplitude of the housing 201, the amplitude of the housing 201 is effectively reduced.
In one embodiment, the cross section of the resonator tube 104 is square, and the resonator tube 104 is a straight tube, but is not limited thereto. For example, in other embodiments, the cross section of the resonator tube 104 may be circular, elliptical, or other shaped, and the resonator tube 104 may be a curved tube.
In one embodiment, the cavity 103 has a substantially cubic cavity structure, but is not limited thereto, and in other embodiments, the cavity 103 may have a cavity structure such as a sphere, a semicircular column, or the like.
In one embodiment, the volume of the resonator tube 104 is smaller than the volume of the resonator 103. According to Helmholtz resonator design theory, the resonance frequency is changed by setting the size parameters of the resonance tube 104 and the resonance cavity 103 so that the resonance frequency is the same as the frequency of the maximum amplitude of the housing 201, thereby reducing the amplitude of the housing 201. The formula of the resonant frequency f is:
wherein S is the cross-sectional area of the resonator tube 104, C 0 Is the propagation velocity of sound waves in air, L is the length of the resonator tube 104, and V is the volume of the resonator 103.
The cross-sectional area, length of the resonator tube 104 and the volume of the resonator cavity 103 influence the resonance frequency f of the resonator tube 104 and the resonator cavity 103.
In one embodiment, s=0.25 mm is set 2 L=3mm, v=0.2 cc, and the total volume of the speaker body 20 is approximately 10cc, resulting in the effect of the resonance tube 104 and the resonance cavity 103 in the electronic device 200 on the amplitude of the housing 201 of the electronic device 200 as shown in fig. 2, wherein the abscissa represents the electricityA vibration frequency value of the sub-device 200 housing 201; the vibration of the housing 201 is affected by factors such as materials, layout of devices in the housing 201, etc., so that vibration amplitudes at different positions of the housing 201 are different, and an ordinate represents an acceleration value corresponding to a maximum vibration amplitude on the housing 201 of the electronic apparatus 200.
The curve shown by the broken line in fig. 2 is the correspondence between the vibration acceleration and the frequency of the case 201 when the electronic apparatus 200 is not provided with the resonator tube 104 and the resonator 103.
The curve shown by the solid line in fig. 2 is the corresponding relationship between the vibration acceleration and the frequency of the housing 201 when the resonator 104 and the sound guiding hole 105 in the electronic device 200 are not commonly connected to the rear cavity 102. For example, the resonator tube 104 and the resonator 103 are located in the cavity 2011 of the electronic device 200, and the sound wave enters the resonator tube 104 after passing through the sound guiding hole 105, and the resonator tube 104 and the sound guiding hole 105 are not commonly connected to the rear cavity 102.
The curve shown by the dashed line in fig. 2 is the correspondence between the vibration acceleration and the frequency of the housing 201 when the resonator tube 104 and the sound guiding hole 105 in the electronic device 200 are commonly connected to the rear cavity 102.
Referring to fig. 2, at the peaks of the three curves, the curve shown by the dash-dot line is located at the lowest, and at a frequency f between about 850Hz and 1800Hz, the curve shown by the dash-dot line is located at the lowest. Compared with the scheme that the resonance tube 104 and the sound guide hole 105 are communicated with the rear cavity 102 together, the scheme that the resonance tube 104 and the sound guide hole 105 are not communicated with the rear cavity 102 together has more obvious effect of reducing the amplitude, and is beneficial to further improving the use experience of users.
In one embodiment, the number of the resonator tubes 104 and the resonator cavities 103 is one, but not limited thereto. For example, in other embodiments, the number of the resonator tubes 104 and the resonator cavities 103 is equal to two or more, and each resonator tube 104 is connected between the resonator cavity 103 and the rear cavity 102 and is common to the rear cavity 102 with the sound guiding hole 105.
Referring to fig. 1, in one embodiment, the resonant cavity 103 is located in the rear cavity 102. The resonant cavity 103 occupies a part of the space of the rear cavity 102 in the housing assembly 10, the volume of the resonant cavity 103 is smaller than the total space of the rear cavity 102 and the cavity 2011, and the influence on the sound effect of the loudspeaker body 20 is small and can be ignored; a resonant cavity 103 is added to the speaker module 100, so that other space in the electronic device 200 outside the housing assembly 10 is not occupied.
Referring to fig. 3 and 4, in one embodiment, the housing assembly 10 includes a first shell 11 and a second shell 13. The first housing 11 is provided with an inner cavity 1101. The speaker body 20 is disposed in the cavity 2011, and partitions the inner cavity 1101 into a front cavity 101 and a rear cavity 102 that are not in communication with each other. The sound guiding hole 105 and the second sound outlet hole 106 are provided in the first housing 11, so that the front cavity 101 is communicated with the outside of the housing assembly 10 through the second sound outlet hole 106, and the rear cavity 102 is communicated with the cavity 2011 through the sound guiding hole 105.
In one embodiment, the second housing 13 is disposed in the inner cavity 1101 of the first housing 11, and the second housing 13 is provided with a resonator tube 104 and a resonator 103. The second shell 13 is disposed in the inner cavity 1101 of the first shell 11, and the resonant cavity 103 and the resonant tube 104 are formed on the second shell 13, so that the resonant cavity 103 is located in the rear cavity 102, and the second shell 13 does not occupy the space outside the housing assembly 10, so as to avoid occupying the layout space of other devices in the electronic apparatus 200.
The acoustic energy of the speaker body 20 diffuses into the rear chamber 102, the acoustic energy decreasing in energy density with distance from the speaker body 20, the density of acoustic energy being greater near the speaker body 20; when the sound wave enters the inlet of the resonance tube 104 and approaches the speaker body 20, the sound wave energy entering the resonance tube 104 is increased, so that the sound wave energy absorbed by the resonance tube 104 and the resonance cavity 103 is increased, which is beneficial to reducing the sound wave energy entering the cavity 2011, and further reducing the amplitude of the housing 201.
In an embodiment, the second shell 13 faces the direction of the speaker body 20, the inlet of the sound wave into the resonance tube 104 is closer to the speaker body 20 than the outlet of the sound wave from the resonance tube 104, so that the resonance tube 104 is arranged at one side of the speaker body 20 in the inner cavity 1101, and the inlet of the resonance tube 104 is closer to the area with higher sound wave energy density near the speaker body 20, and the amount of sound wave energy entering the resonance cavity 103 is increased.
It will be appreciated that in other embodiments, the inlet into the resonator 104 may be located in other areas of greater acoustic energy density within the housing assembly 10. For example, the cross-section of sound guiding hole 105 is smaller than the cross-section of rear cavity 102, resulting in a greater energy density of sound waves entering sound guiding hole 105 from rear cavity 102, i.e. a greater energy density of sound waves near sound guiding hole 105. The inlet into the resonator tube 104 may also be set near the sound guiding hole 105.
In one embodiment, the sound guide 105 and the resonance tube 104 are located on the same side of the speaker body 20 in the direction of the conduction of the sound waves.
It will be appreciated that in other embodiments, the sound guide 105 and the resonator 104 may be located on different sides of the speaker body 20, such as on opposite sides of the speaker body 20, so that sound waves emitted from the speaker body 20 are conducted in two different directions through the rear cavity 102 and enter the sound guide 105 and the resonator 104, respectively.
With continued reference to fig. 4, 5 and 6, in one embodiment, the first shell 11 includes a base 111 and a cover 113, but is not limited thereto. The cover 113 is disposed on the base 111, and encloses an inner cavity 1101 with the base 111. The cover 113 is located at one side of the rear cavity 102. The speaker body 20 is mounted on the base 111. The base 111 is provided with a second sound outlet hole 106.
The first housing 11 includes two structures, a base 111 and a cover 113, to facilitate the installation or molding of the second housing 13 within the interior cavity 1101, as well as the manufacture and installation of the housing assembly 10.
In one embodiment, the cover 113 covers a portion of the base 111 to form the sound guiding hole 105 on one side of the cover 113, and the sound guiding hole 105 communicates with the rear cavity 102 that is not covered by the cover 113, but is not limited thereto. The sound guide hole 105 can be formed by connecting the cover 113 and the base 111 without requiring additional manufacturing process.
It can be understood that in other embodiments, the cover 113 covers all of the base 111 on the rear cavity 102 side, and the sound guiding holes 105 are formed in the cover 113, so that the sound guiding holes 105 can be communicated with the rear cavity 102, and the connection area of the cover 113 to the base 111 is increased, so as to improve the connection strength between the cover 113 and the base 111.
It will be appreciated that in other embodiments, the first housing 11 may also include and be connected by three structures, for example, the first housing 11 includes three structures: a base 111 and two covers 113.
Alternatively, the first shell 11 and the second shell 13 may be integrally formed, and the housing assembly 10 is formed with the inner cavity 1101, the resonator tube 104, the resonator 103, and the sound guiding hole 105 by 3D printing.
In one embodiment, the second case 13 includes a first main case 131 and a first sub case 132. The first body case 131 is provided with first and second grooves 1301 and 1302 spaced apart. The first body case 131 is molded to the base 111 of the first case 11. The first sub-shell 132 is covered on the first main body shell 131, so that the walls of the first sub-shell 132 and the first groove 1301 enclose the resonant tube 104, and the walls of the first sub-shell 132 and the second groove 1302 enclose the resonant cavity 103. The first body case 131 is further provided with a first through hole 1303. The first recess 1301 and the second recess 1302 communicate through the first through hole 1303, so that the resonant cavity 103 communicates with the resonant tube 104. The first sub-housing 132 is provided with a second through hole 1306 to allow the second recess 1302 to communicate with the rear cavity 102, thereby allowing the resonator tube 104 to communicate with the rear cavity 102.
The first sub-housing 132 is connected to the first main housing 131 and forms the resonant cavity 103 and the resonant pipe 104, and the first main housing 131 may be manufactured by injection molding, casting, or machining, for example, a first groove 1301 and a second groove 1302 for forming the resonant cavity 103 and the resonant pipe 104 may be machined at sides of the first main housing 131, thereby reducing the machining difficulty of the first main housing 131, or reducing the manufacturing difficulty of injection molding or casting, demoulding, and the like.
In one embodiment, the first body case 131 includes a second sub-case 1311 and a third sub-case 1313. The second sub-housing 1311 is molded to the base 111 of the first housing 11. The first groove 1301, the second groove 1302, and the first through hole 1303 are disposed in the second sub-housing 1311, respectively. The third sub-housing 1313 is disposed on the second sub-housing 1311 and encloses a side of the second recess 1302 facing away from the first recess 1301.
The first body case 131 is a non-integral molding structure, and the first groove 1301 and the second groove 1302 can be machined or molded at both sides of the second sub-case 1311, facilitating the machining of the second body case 133.
In one embodiment, the second sub-housing 1311 includes a main body portion 1304 and an extension portion 1305. The body portion 1304 is provided with a second recess 1302. An extension 1305 is formed at a sidewall of the second recess 1302 and extends toward the inside of the second recess 1302. The extension 1305 is spaced from the bottom wall of the second recess 1302, the volume of the resonator tube 104 is generally smaller than the volume of the resonator cavity 103, and the first recess 1301 for forming the resonator tube 104 is disposed close to the rear cavity 102, so that the first recess 1301 and the second recess 1302 are sealed to the first main body housing 131 through the same first sub-housing 132 to form the resonator tube 104 and the resonator cavity 103, thereby simplifying the structure and the installation steps.
In an embodiment, the base 111 and the cover 113, the second sub-housing 1311 and the third sub-housing 1313, and the second sub-housing 1311 and the first sub-housing 132 are respectively bonded or ultrasonically welded to achieve a sealed connection.
In one embodiment, the base 111 is provided with a mounting portion 1111 protruding toward the cavity 1101. The speaker body 20 is adhered to the mounting portion 1111, but is not limited thereto. For example, the speaker body 20 may be coupled to the base 111 by a mechanical coupling such as a screw.
In the speaker module 100a shown in fig. 6, the resonator tube 104a is formed by surrounding the second sub-housing 1311 and the first sub-housing 132, but is not limited thereto. For example, referring to fig. 7, 8 and 9, in another embodiment, the structure of the speaker module 100a is substantially the same as that of the speaker module 100 shown in fig. 6, except that: the structure of the second case 13a is different from that of the second case 13 shown in fig. 6. The second housing 13a includes a third main body housing 135 and a connection member 136. The third body housing 135 is provided with a resonant cavity 103 and a third through hole 1308. The connection 136 is connected to the third body case 135. The connector 136 is provided with a through resonator tube 104a. The resonator tube 104a and the resonator 103 communicate through the third through hole 1308.
The resonator tube 104a is simply machined on the connecting piece 136, and the machining precision of the resonator tube 104a is easy to ensure, so that the accuracy of the cross-sectional area and the length of the resonator tube 104a is improved, and the effect of reducing the amplitude of the housing 201 of the electronic device 200 is improved.
In one embodiment, the connector 136 is bonded to the third body housing 135. The outer side of the third body case 135 is provided with a mounting groove 1309, and a third through hole 1308 penetrates the bottom wall of the mounting groove 1309. The resonator tube 104a includes a first tube 1041 extending axially along the connector 136 and a second tube 1043 extending radially along the connector 136. The connector 136 is disposed within the mounting groove 1309. The second conduit 1043 is opposite and in communication with the third through bore 1308.
In an embodiment, the mounting groove 1309 is filled with glue, so that the connecting piece 136 is in sealing connection with the third main body shell 135, but not limited thereto, for example, a sealing gasket (not shown) is added at the joint of the second pipeline 1043 and the third through hole 1308, and the connecting piece 136 is fastened and mounted in the mounting groove 1309 of the third main body shell 135 by a pressing buckle or the like structure or by a welding manner, so that the sealing connection of the connecting piece 136 with the third main body can be realized, and the sealing performance in the housing assembly 10 can be further improved.
The mounting groove 1309 is filled with glue, so that the connecting piece 136 can be fixed, the connecting piece 136 is in sealing connection with the third main body shell 135, and the connection tightness of the resonant tube 104a and the resonant cavity 103 is improved.
In one embodiment, the third body case 135 includes a fifth sub-case 1351 and a sixth sub-case 1353. The fifth sub-housing 1351 is molded to the base 111 of the first housing 11. The fifth sub-housing 1351 is provided with a fourth recess 1310, a third through-hole 1308, and a mounting groove 1309. The mounting groove 1309 communicates with the fourth groove 1310 via the third through-hole 1308. The sixth sub-housing 1353 is disposed on the fifth sub-housing 1351 and encloses the resonant cavity 103 with the wall of the fourth recess 1310.
The third main body case 135 is a non-integral structure, and the mounting groove 1309, the fourth groove 1310, and the third through hole 1308 can be formed at both sides of the fifth sub-case 1351, so that the third main body case 135 can be easily formed.
In one embodiment, the fifth sub-housing 1351 and the sixth sub-housing 1353 are adhesively fixed, but not limited thereto, for example, the sixth sub-housing 1353 is welded to the fifth sub-housing 1351.
Referring to fig. 10 and 11, in yet another embodiment, the structure of the speaker module 100b is substantially the same as that of the speaker module 100 shown in fig. 6, except that: the structure of the second case 13b is different from that of the second case 13 shown in fig. 6. The resonance tube 104b extends obliquely from the outer wall of the second housing 13b until communicating with the resonance chamber 103. The resonator tube 104b may be formed on the second housing 13b by drilling or injection molding, etc. The resonator tube 104b is not required to be formed by surrounding two or more structures, but is formed on an independent structure, so that the dimensional accuracy of the resonator tube 104b is improved, and the accuracy of the cross-sectional area and the length of the resonator tube 104b is improved, thereby being beneficial to improving the effect of reducing the amplitude of the shell 201.
Referring to fig. 11, in one embodiment, the second case 13b includes a second main case 133 and a fourth sub-case 134. The second body case 133 is formed at the first case 11. The second body case 133 is provided with a third groove 1307. The fourth sub-housing 134 is disposed in the second main housing 133 and forms the resonant cavity 103 with the groove wall of the third groove 1307. The resonance tube 104b extends diagonally from the second main body case 133 toward the fourth sub-case 134.
The second housing 13b is a non-integral structure, and the third grooves 1307 and the inclined resonance tube 104b may be formed at both sides of the second body housing 133 to facilitate the processing of the second housing 13b.
It will be appreciated that in other embodiments, the second housing 13 may be disposed outside the interior 1101 of the first housing 11. For example, as shown in fig. 12, in another embodiment, the second housing 13c is located in the cavity 2011 of the electronic device 200c, and the second housing 13c is provided with the resonance tube 104 and the resonance cavity 103. The resonance tube 104 and the sound guide hole 105 arranged on the first shell 11 are communicated with the rear cavity 102 together, so that the resonance cavity 103 and the cavity 2011 of the shell 201 are communicated with the rear cavity 102 together, and the sound wave energy generated by the loudspeaker body 20 acts on the sound wave to weaken the sound wave energy before being diffused to the whole cavity 2011, so that the sound wave energy entering the cavity 2011 of the shell 201 is reduced, and the vibration amplitude of the shell 201 is reduced.
The speaker module 100 is connected to the rear cavity 102 through the resonator 104, and the resonant frequency of the resonator 103 can be set within the range of the vibration frequency of the housing 201, so as to absorb the sound wave energy of the speaker body 20, thereby reducing the amplitude of the housing 201 of the electronic device 200. And the resonance tube 104 and the sound guide hole 105 are communicated with the rear cavity 102 together, so that the resonance cavity 103 and the cavity 2011 of the shell 201 are communicated with the rear cavity 102 together, and the sound wave energy generated by the loudspeaker body 20 acts on the sound wave to weaken the sound wave energy before being diffused to the whole cavity 2011, so that the sound wave energy entering the cavity 2011 of the shell 201 is reduced, and the vibration amplitude of the shell 201 is further reduced.
The above embodiments are only for illustrating the technical solution of the present application and not for limiting the same, and it should be understood by those skilled in the art that modifications and equivalents may be made to the technical solution of the present application without departing from the spirit and the essence of the technical solution of the present application.

Claims (13)

1. The utility model provides a speaker module, includes the shell subassembly with set up in the speaker body in the shell subassembly, its characterized in that is equipped with in the shell subassembly:
a front cavity and a rear cavity, the front cavity and the rear cavity being separated by the speaker body, and the front cavity being in communication with an exterior of the housing assembly;
the resonant cavity is positioned in the rear cavity;
the resonant tube is communicated between the resonant cavity and the rear cavity;
the sound guide hole is configured to be communicated between a cavity of electronic equipment and the rear cavity;
the resonator tube and the sound guide aperture form two independent paths for sound waves generated by the speaker body to be conducted from the rear cavity to the resonator cavity and the cavity.
2. A loudspeaker module according to claim 1, wherein: the shell assembly comprises a first shell and a second shell, wherein the first shell is provided with an inner cavity, and the first shell is provided with the sound guide hole;
the loudspeaker body is arranged in the inner cavity and divides the inner cavity into the front cavity and the rear cavity which are not communicated with each other;
the second shell is disposed in the inner cavity, and the second shell is provided with the resonance tube and the resonance cavity.
3. A loudspeaker module according to claim 2, wherein: the second shell faces the direction of the loudspeaker body, and the inlet of sound waves entering the resonance tube is closer to the loudspeaker body than the outlet of sound waves led out from the resonance tube.
4. A loudspeaker module according to claim 2, wherein: the second shell includes a first main body shell and a first sub-shell; the first main body shell is formed on the first shell;
the first main body shell is provided with a first groove and a second groove which are spaced, the first main body shell is also provided with a first through hole, and the first groove and the second groove are communicated through the first through hole;
the first sub-shell is provided with a second through hole, the first sub-shell cover is arranged on the first main body shell, the first sub-shell cover and the groove wall of the first groove are surrounded to form the resonance tube, and the first groove is communicated with the rear cavity through the second through hole; and the first sub-shell and the groove wall of the second groove are surrounded to form the resonant cavity.
5. A loudspeaker module according to claim 4, wherein: the first main body shell comprises a second sub-shell and a third sub-shell, the first groove, the second groove and the first through hole are respectively arranged in the second sub-shell, the third sub-shell is arranged in the second sub-shell, and one side, deviating from the first groove, of the second groove is sealed.
6. A loudspeaker module according to claim 5, wherein: the second sub-shell comprises a main body part and an extension part, and the main body part is provided with the second groove;
the extension portion extends from the side wall of the second groove to the inside of the second groove, and is arranged at intervals with the bottom wall of the second groove, and the extension portion is provided with the first groove.
7. A loudspeaker module according to claim 2, wherein: the resonance tube extends from the outer wall of the second shell along an inclined direction until being communicated with the resonance cavity.
8. A loudspeaker module according to claim 7, wherein: the second shell comprises a second main body shell and a fourth sub-shell, and the second main body shell is formed on the first shell and is provided with a third groove;
the fourth sub-shell is arranged on the second main body shell and forms the resonant cavity with the groove wall of the third groove;
the resonance tube extends obliquely from the second main body case toward the fourth sub-case.
9. A loudspeaker module according to claim 2, wherein: the second shell comprises a third main body shell and a connecting piece, and the third main body shell is provided with the resonant cavity and a third through hole;
the connecting piece is connected to the third main body shell, and is provided with a through resonant tube, and the resonant tube is communicated with the resonant cavity through the third through hole.
10. A loudspeaker module according to claim 9, wherein: the outer side of the third main body shell is provided with a mounting groove, and the third through hole penetrates through the bottom wall of the mounting groove;
the resonance tube comprises a first pipeline extending along the axial direction of the connecting piece and a second pipeline extending along the radial direction of the connecting piece;
the connecting piece is located in the mounting groove, glue is filled in the mounting groove, and the second pipeline is opposite to and communicated with the third through hole.
11. A loudspeaker module according to claim 10, wherein: the third main body shell comprises a fifth sub-shell and a sixth sub-shell, and the fifth sub-shell is formed on the first shell;
the fifth sub-shell is provided with a fourth groove, the third through hole and the mounting groove, and the mounting groove is communicated with the fourth groove through the third through hole;
the sixth sub-shell is arranged on the fifth sub-shell, and the sixth sub-shell and the groove wall of the fourth groove are surrounded to form the resonant cavity.
12. A loudspeaker module according to any one of claims 3 to 11, wherein: the first shell comprises a base body and a cover body, the cover body is arranged on the base body and surrounds the base body to form the inner cavity, the cover body is located on one side of the rear cavity, and the second shell is arranged at intervals with the cover body.
13. The utility model provides an electronic equipment, includes casing and speaker module, be formed with the cavity in the casing, speaker module set up in the casing, its characterized in that: the speaker module is a speaker module according to any one of claims 1 to 12, and the sound guiding hole is communicated with the cavity.
CN202311059876.9A 2023-08-22 2023-08-22 Speaker module and electronic equipment Active CN116761123B (en)

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Application Number Priority Date Filing Date Title
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207070330U (en) * 2017-06-26 2018-03-02 歌尔科技有限公司 Loudspeaker module and electronic equipment
EP3840399A1 (en) * 2019-12-20 2021-06-23 GN Audio A/S Loudspeaker and soundbar
CN113596672A (en) * 2020-04-30 2021-11-02 华为技术有限公司 Loudspeaker module and electronic equipment
CN218041770U (en) * 2022-07-28 2022-12-13 北京小米移动软件有限公司 Loudspeaker module and mobile terminal

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7578367B2 (en) * 2007-03-07 2009-08-25 Foxconn Technology Co., Ltd. Speaker set and electronic product incorporating the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207070330U (en) * 2017-06-26 2018-03-02 歌尔科技有限公司 Loudspeaker module and electronic equipment
EP3840399A1 (en) * 2019-12-20 2021-06-23 GN Audio A/S Loudspeaker and soundbar
CN113596672A (en) * 2020-04-30 2021-11-02 华为技术有限公司 Loudspeaker module and electronic equipment
CN218041770U (en) * 2022-07-28 2022-12-13 北京小米移动软件有限公司 Loudspeaker module and mobile terminal

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