CN112019984A

CN112019984A - Electronic device

Info

Publication number: CN112019984A
Application number: CN201910472396.2A
Authority: CN
Inventors: 李言勇; 宋子平
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2019-05-31
Filing date: 2019-05-31
Publication date: 2020-12-01

Abstract

The disclosure relates to an electronic device, and belongs to the technical field of electronic devices. The electronic equipment provided by the present disclosure includes a headphone jack, and a first speaker module. Wherein, an earphone interface is arranged in the earphone jack. The first loudspeaker module is arranged in the electronic equipment and comprises a sound outlet channel communicated with the earphone jack. The electronic equipment provided by the embodiment of the disclosure takes the earphone jack as the sound outlet of the first loudspeaker module. Therefore, the sound outlet hole matched with the first loudspeaker module is not required to be arranged, the number of holes in the electronic equipment is effectively reduced, and the appearance and the structural quality of the electronic equipment are improved.

Description

Electronic device

Technical Field

The present disclosure relates to the field of terminal technologies, and in particular, to an electronic device.

Background

Generally, a speaker module is disposed in an electronic device, so that the electronic device has an audio playing function. In addition, in order to be used in cooperation with the speaker module, the electronic device is provided with a sound outlet through which sound waves output by the speaker module pass.

In the related art, the sound outlet has a single function and is only used for being matched with the loudspeaker module. In such a way, the number of the holes on the electronic device is difficult to reduce, and the appearance quality of the electronic device is affected.

Disclosure of Invention

The present disclosure provides an electronic device and addresses deficiencies in the related art.

According to the electronic equipment that this disclosure provided, the electronic equipment includes: the earphone jack is internally provided with an earphone interface; and the first loudspeaker module is arranged in the electronic equipment and comprises a sound outlet channel communicated with the earphone jack.

In one embodiment, the headphone jack includes a sound opening located inside the electronic device, the sound opening communicating with the sound outlet channel.

In one embodiment, a first acoustic seal is provided where the sound outlet channel and the sound passage opening communicate; the first acoustic seal includes a first sound passage aperture disposed in correspondence with the sound passage opening and the sound outlet channel.

In one embodiment, the first acoustic seal further comprises a dust seal covering the first sound passage aperture.

In one embodiment, the first speaker module includes: the shell is provided with an accommodating cavity and the sound outlet channel which are communicated; and the loudspeaker main body is arranged in the accommodating cavity.

In one embodiment, the accommodating cavity comprises a mounting cavity for mounting the loudspeaker main body and a sound cavity communicated with the mounting cavity; the sound cavity is also communicated with the sound outlet channel.

In one embodiment, the vibrating sounding element of the speaker body is disposed toward the sound cavity.

In one embodiment, the sound outlet channel comprises an inlet in communication with the sound cavity and an outlet in communication with the headphone jack; the cross-sectional area of the inlet is smaller than the cross-sectional area of the outlet.

In one embodiment, a second acoustic seal is disposed at an opening of the headset jack that communicates with an exterior of the electronic device; the second acoustic seal includes a second vent disposed in correspondence with the earphone jack.

In one embodiment, the electronic device further comprises a second speaker module, and a sound outlet hole matched with the second speaker module; one of the sound outlet hole and the earphone jack is arranged on the upper part of the electronic equipment, and the other one of the sound outlet hole and the earphone jack is arranged on the lower part of the electronic equipment.

In one embodiment, the sound outlet and the headphone jack face away from each other toward the outside of the electronic device.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

The electronic equipment provided by the embodiment of the disclosure has at least the following beneficial effects:

in the embodiment of the present disclosure, the sound outlet channel of the first speaker module is communicated with the earphone jack, so that the earphone jack is used as a sound outlet of the first speaker module in addition to being used for connecting with an external earphone. Adopt such mode, need not to set up alone on electronic equipment with first speaker module complex phonate hole, effectively reduce trompil quantity on the electronic equipment, improve electronic equipment's outward appearance quality and fuselage structural stability.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a partial cross-sectional structural view of an electronic device provided in accordance with an exemplary embodiment;

FIG. 2 is a schematic diagram illustrating a speaker module in an electronic device according to another exemplary embodiment;

FIG. 3 is a schematic diagram illustrating a partial structure of a speaker module in an electronic device according to an exemplary embodiment;

fig. 4 is a schematic partial structure diagram of a speaker module in an electronic device according to another exemplary embodiment;

fig. 5 is a schematic structural diagram of an electronic device provided in accordance with an example embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

In the related art, the body of the electronic device is provided with a plurality of holes, such as a headphone jack, a key opening, a sound outlet matched with the headphone module, and a sound outlet matched with the speaker module. However, with the increase of the number of the openings, the appearance quality of the electronic equipment is affected, the interior of the electronic equipment is easier to communicate with the outside, and the structural stability, dust prevention and water resistance of the body of the electronic equipment are weakened. Therefore, there is a need to reduce the number of holes in electronic devices.

Based on the above situation, the embodiment of the present disclosure provides an electronic device. Fig. 1-4 are schematic structural diagrams of an electronic device shown in whole or in part according to various embodiments. The drawings only show a mobile phone as an example, and in the embodiment of the present disclosure, the electronic device may be selected as: a mobile phone, a tablet computer, a wearable device, a vehicle-mounted device, or a medical device, etc.

As described in fig. 1 to 5, an electronic device 100 provided by an embodiment of the present disclosure includes a headphone jack 110.

In one embodiment, the headphone jack 110 includes an insertion opening 111 facing the outside of the electronic device 100, and an inner wall 113 connected to the insertion opening 111. A signal interface is provided on the inner wall 113 for cooperation with an external headset. When the earphone is used, the connector of an external earphone is inserted into the earphone jack 110 through the insertion hole 111, and the signal interface of the external earphone is connected with the signal interface on the inner wall 113, so that the signal communication between the electronic device 100 and the external earphone is realized.

The type of the headphone jack 110 is not particularly limited, and the headphone jack is a headphone jack with a diameter of 3.5mm or 2.5mm, for example. Or the earphone jack is a three-section earphone jack or a four-section earphone jack, and the like.

Also, the headphone jack 110 also includes a sound opening 112 located within the electronic device 100. Illustratively, the sound passage opening 112 is disposed in parallel with the insertion port 111; or the sound opening 112 is provided on the inner wall 113 of the earphone jack 110.

The sound through opening 112 is configured to cooperate with the first speaker module 200 in the electronic device 100, so that the sound waves output by the first speaker module 200 enter the earphone jack 110 through the sound through opening 112 and are further transmitted to the outside of the electronic device 100.

Based on this, optionally, a second acoustic seal (e.g. an acoustic sealing ring) is provided at the receptacle 111 of the earphone jack 110. The second acoustic seal includes a second vent disposed in correspondence with the receptacle 111. By having the sound waves propagate along the headphone jack 110 and from the jack 111 to the outside of the electronic device 100 through the second acoustic seal, the audio playback effect of the electronic device 100 is optimized.

In one embodiment, the first speaker module 200 is disposed in the electronic device 100, and includes a sound outlet channel 210, and the sound outlet channel 210 communicates with the sound through opening 112 of the earphone jack 110. In this way, the sound wave signal output by the first speaker module 200 can be propagated to the outside of the electronic device 100 through the sound outlet channel 210 and the earphone jack 110 in sequence, thereby implementing an audio output function.

In this case, the earphone jack 110 is compatible with the function of connecting the external earphone and the speaker module sound outlet. Therefore, it is not necessary to separately provide the sound outlet hole to be fitted to the first speaker module 200 on the electronic apparatus 100. Furthermore, the number of holes on the electronic device 100 is reduced, which is helpful for improving the appearance quality of the electronic device and optimizing the structural stability of the body of the electronic device.

In one embodiment, as shown in fig. 2, the first speaker module 200 includes a housing 220 and a speaker body 230. The housing 220 has a receiving cavity 221 and a sound outlet channel 210 which are communicated with each other. The speaker main body 230 includes a vibration sounding member, and outputs a sound wave signal by vibrating the vibration sounding member. Also, the speaker body 230 is installed in the receiving cavity 221, whereby the sound wave signal output from the speaker body 230 is propagated into the earphone jack 110 through the sound outlet channel 210 communicating with the receiving cavity 221.

Regarding the structure of the receiving cavity 221, in one embodiment, as shown in fig. 3 and 4, the receiving cavity 221 of the housing 220 includes a mounting cavity 221a for mounting the speaker main body 230. The accommodation chamber 221 further includes a sound chamber 221b communicating with the mounting chamber 221a and the sound outlet passage 210. The sound cavity 221b is used for enhancing the sound wave signal output by the speaker main body 230, and optimizing the playing effect of the first speaker module 200.

Alternatively, as shown in fig. 3, the mounting cavity 221a and the sound cavity 221b are through cavities. Receiving cavity 221 includes side wall 2211 and end wall 2212 connected to side wall 2211. When assembled, the speaker body 230 is connected to the side wall 2211 of the receiving cavity 221. And the speaker body 230 has a predetermined interval from the end wall 2212. At this time, the portion occupied by the speaker main body 230 in the accommodation chamber 221 is a mounting chamber 221 a. A space, namely, the sound cavity 221b, is left between the speaker body 230 and the accommodating cavity 221 by the predetermined distance.

Alternatively, as shown in fig. 4, the housing 220 includes a stopper 222 disposed in the receiving cavity 221, and the stopper 222 is connected to a side wall 2211 of the receiving cavity 221 for connecting with the speaker body 230. At this time, one side of the stopper 222 is the mounting cavity 221a, and the other side of the stopper 222 is the sound cavity 221 b. When assembled, and with reference to fig. 3, the speaker body 230 is secured to the stoppers 222. In this way, on the one hand, the speaker body 230 is easy to mount, and on the other hand, the mounting cavity 221a and the acoustic cavity 221b are relatively independent, so that acoustic wave signal propagation is convenient.

As an example, the housing 220 includes two stoppers 222 disposed opposite to each other in the receiving cavity 221. The two oppositely disposed stoppers 222 abut against two sides of the speaker main body 230, respectively, thereby ensuring stable mounting of the speaker main body 230.

The speaker main body 230 is attached to the mounting cavity 221a so that the vibration sound generating member faces the sound cavity 221 b. In this way, the sound wave signal of the vibration output of the vibration sound production member directly propagates into the sound emission channel 210 through the sound cavity 221 b.

In one embodiment, as shown in fig. 4, the sound emitting channel 210 includes an inlet 211 communicating with the sound cavity 221b, and an outlet 212 communicating with the headphone jack 110. Wherein the cross-sectional area of the inlet 211 is smaller than the cross-sectional area of the outlet 212.

Illustratively, the cross-sectional area of the sound outlet channel 210 gradually becomes larger in a direction along the inlet 211 to the outlet 212. Alternatively, a portion of the sound outlet channel 210 may have a gradually increasing cross-sectional area in a direction along the inlet 211 to the outlet 212. In this way, at least a portion of the sound outlet channel 210 is flared to facilitate sound transmission and optimize the playing effect of the first speaker module 200.

In one embodiment, a first acoustic seal 310 (e.g., an acoustic gasket) is disposed at the point where the sound outlet channel 210 communicates with the sound outlet opening 112. The first acoustic seal 310 includes a first sound passage hole 311 disposed in correspondence with the sound passage opening 112 and the sound outlet channel 210. The acoustic signal is secured by the first acoustic seal 310 against propagation along the acoustic channel 210 and through the acoustic opening 112, reducing losses of the acoustic signal during propagation.

The first sound through hole 311 is disposed corresponding to the sound through opening 112 and the sound outlet channel 210, that is, the three holes have overlapping portions in the radial direction. Accordingly, the acoustic wave signal is allowed to pass through the sound emitting channel 210, the first sound passing hole 311, and the sound passing opening 112 in this order.

Preferably, the sound outlet channel 210, the first sound through hole 311 and the sound through opening 112 completely coincide in the radial direction, so as to ensure smooth propagation of the sound wave signal.

In one embodiment, the first acoustic seal 310 further comprises a dust seal covering the first sound passage hole 311. By adopting the mode, the external earphone interface is ensured to be smoothly inserted into the earphone jack 110, the dustproof performance of the first loudspeaker module 200 is also considered, and impurities are prevented from falling into the sound outlet channel 210 to influence the use of the first loudspeaker module 200. The implementation manner of the dust-proof member is not particularly limited, and examples of the implementation manner include a dust-proof net and a dust-proof partition plate.

In one embodiment, as shown in FIG. 5, the electronic device 100 further comprises a second speaker module 300. The electronic device 100 is provided with a sound outlet 120 that fits the second speaker module 300. The sound outlet 120 and the earphone jack 110 are respectively disposed on different sides of the electronic device 100. In this manner, the electronic device 100 is able to achieve a stereo effect.

Taking the lengthwise direction of the electronic device 100 as an example, the electronic device 100 may be divided into an upper portion and a lower portion along the lengthwise direction.

As an example, the earphone jack 110 and the first speaker module 200 are disposed at an upper portion of the electronic apparatus 100, and the sound outlet hole 120 and the second speaker module 300 are disposed at a lower portion of the electronic apparatus 100.

As another example, the earphone jack 110 and the first speaker module 200 are disposed at a lower portion of the electronic apparatus 100, and the sound outlet hole 120 and the second speaker module 300 are disposed at an upper portion of the electronic apparatus 100.

In such a case, the sound outlet 120 may be selected to be a sound outlet common to the second speaker module 300 and the earpiece module in the electronic device 100. In this way, the number of holes in the electronic device 100 is further reduced, and the appearance and structural quality of the electronic device 100 are optimized.

Further, the sound outlet 120 and the earphone jack 110 face away from each other toward the outside of the electronic device 100. Accordingly, the stereo effect of the electronic device 100 is optimized by the cooperation of the first speaker module 200 and the second speaker module 300.

The electronic device 100 provided by the embodiment of the present disclosure uses the earphone jack 110 as the sound outlet of the first speaker module 200, so as to reduce the number of holes on the electronic device 100 and optimize the appearance and structural quality of the electronic device 100.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electronic device, characterized in that the electronic device comprises:

the earphone jack is internally provided with an earphone interface; and

the first loudspeaker module is arranged in the electronic equipment and comprises a sound outlet channel communicated with the earphone jack.

2. The electronic device of claim 1, wherein the headphone jack comprises a sound opening located inside the electronic device, the sound opening communicating with the sound outlet channel.

3. The electronic device of claim 2, wherein a first acoustic seal is disposed where the sound outlet channel and the sound passage opening communicate;

the first acoustic seal includes a first sound passage aperture disposed in correspondence with the sound passage opening and the sound outlet channel.

4. The electronic device of claim 3, wherein the first acoustic seal further comprises a dust seal covering the first sound passage aperture.

5. The electronic device of claim 1, wherein the first speaker module comprises:

the shell is provided with an accommodating cavity and the sound outlet channel which are communicated; and

the loudspeaker main body is arranged in the accommodating cavity.

6. The electronic device according to claim 5, wherein the housing chamber includes a mounting chamber for mounting the speaker main body, and a sound chamber communicating with the mounting chamber; the sound cavity is also communicated with the sound outlet channel.

7. The electronic device according to claim 6, wherein the vibrating sound emitting piece of the speaker main body is disposed toward the sound chamber.

8. The electronic device of claim 6, wherein the sound outlet channel comprises an inlet in communication with the sound cavity and an outlet in communication with the headphone jack; the cross-sectional area of the inlet is smaller than the cross-sectional area of the outlet.

9. The electronic device of claim 1, wherein a second acoustic seal is disposed at an opening of the headphone jack that communicates with an exterior of the electronic device; the second acoustic seal includes a second vent disposed in correspondence with the earphone jack.

10. The electronic equipment according to any one of claims 1-9, further comprising a second speaker module, and a sound outlet hole matched with the second speaker module;

one of the sound outlet hole and the earphone jack is arranged on the upper part of the electronic equipment, and the other one of the sound outlet hole and the earphone jack is arranged on the lower part of the electronic equipment.

11. The electronic device of claim 10, wherein the sound outlet and the headphone jack face away from each other toward an exterior of the electronic device.