CN210405611U - Intelligent wireless earphone - Google Patents
Intelligent wireless earphone Download PDFInfo
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- CN210405611U CN210405611U CN201921636071.5U CN201921636071U CN210405611U CN 210405611 U CN210405611 U CN 210405611U CN 201921636071 U CN201921636071 U CN 201921636071U CN 210405611 U CN210405611 U CN 210405611U
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- circuit board
- wall
- intelligent wireless
- loudspeaker
- wireless headset
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Abstract
The utility model discloses an intelligence wireless headset relates to electro-acoustic products field, and the earphone includes the casing, and one side of this casing is provided with the earplug, is provided with loudspeaker and circuit board in the casing, and loudspeaker are close to the earplug side and set up, and the outward flange and the shells inner wall of circuit board are connected, and this circuit board seals the back sound chamber of keeping apart loudspeaker and shells inner wall and enclose. Therefore, the circuit board is used for sealing the isolated sound cavity of the intelligent wireless earphone, so that multiple utilization of the circuit board is realized; compared with the prior art, the acoustic diaphragm has the advantages that the space occupied by the partition plate is saved, and the rear acoustic cavity has a clean space with enough volume, so that the acoustic effect of bass is improved, and the tone quality is improved; the weight of the earphone is also reduced, so that the earphone is small and portable, and the wearing comfort is greatly improved.
Description
Technical Field
The utility model relates to an electroacoustic product technical field especially relates to an intelligence wireless headset.
Background
The development of science and technology is changing day by day, and particularly, consumer electronic products are all rapidly advanced; people no longer just meet the multi-function realization, and in the daily life and work at the current fast pace, people are increasingly pursuing the comfort experience of product such as small and exquisite type, portability and the like.
The main frequency band affecting the acoustic performance of the headphone is in the bass frequency band, and the main factors determining the performance of the bass frequency band are: the size of the loudspeaker body or the size of the volume of the sound cavity behind the earphone formed by the loudspeaker and the shell. Generally, the larger the speaker body size, the better the sound quality of the low frequency band; the larger the volume of the sound cavity behind the earphone is, the better the tone quality of the low frequency band is. However, in the earphone of the prior art, the tone quality and the volume are contradictory, and the compatibility is not easy.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned not enough, the utility model discloses the technical problem that will solve is: provided is an intelligent wireless headset, which enhances the acoustic effect of bass, and has the advantages of small size and portability, and a microphone which is effectively reduced in noise.
In order to solve the technical problem, the technical scheme of the utility model is that:
the utility model provides an intelligence wireless headset, includes the casing, one side of casing is provided with the earplug, be provided with loudspeaker and circuit board in the casing, loudspeaker are close to the earplug side sets up, the outward flange of circuit board with shells inner wall connects, and this circuit board seals the isolation loudspeaker with the back sound cavity that shells inner wall encloses.
Preferably, the circuit board is disposed at a position such that the volume of the rear acoustic chamber is set according to the diameter of the horn.
Preferably, the circuit board is arranged in parallel with the horn.
Preferably, the inner wall of the shell is provided with a fixed rib which is arranged along the circumferential direction of the inner wall of the shell; the outer edge of the circuit board is fixed on the fixing rib.
Preferably, two circuit boards are arranged in the shell, the two circuit boards are respectively defined as a first circuit board and a second circuit board, and the first circuit board is arranged close to the loudspeaker; the first circuit board is connected with the inner wall of the shell, and the second circuit board is fixed on the first circuit board.
Preferably, the first circuit board is glued to the fixing rib.
Preferably, the inner wall of the shell is provided with support ribs which are arranged along the circumferential direction of the inner wall of the shell; the outer edge of the horn is fixed on the support rib.
Preferably, a main microphone and an auxiliary microphone electrically connected to the second circuit board are further disposed in the housing.
Preferably, a battery is further arranged in the shell, and the battery and the second circuit board are arranged in parallel.
Preferably, the headset is a bluetooth headset.
After the technical scheme is adopted, the beneficial effects of the utility model are that:
because the utility model discloses an intelligence wireless headset, including the casing, one side of this casing is provided with the earplug, is provided with loudspeaker and circuit board in the casing, and loudspeaker are close to the earplug side and set up, and the outward flange and the shells inner wall of circuit board are connected, and this circuit board seals the back sound chamber of keeping apart loudspeaker and shells inner wall and enclosing. Therefore, the circuit board is used for sealing the isolated sound cavity of the intelligent wireless earphone, so that multiple utilization of the circuit board is realized; compared with the prior art, the acoustic diaphragm has the advantages that the space occupied by the partition plate is saved, and the rear acoustic cavity has a clean space with enough volume, so that the acoustic effect of bass is improved, and the tone quality is improved; the weight of the earphone is also reduced, so that the earphone is small and portable, and the wearing comfort is greatly improved.
The volume of the rear sound cavity is set according to the diameter of the horn due to the arrangement position of the circuit board; this mode of setting up when guaranteeing that the earphone volume is small and exquisite, sets up sufficient headroom again, and the acoustic performance of very big degree ground promotion earphone.
Because the inner wall of the shell is provided with the fixed rib, the fixed rib is arranged along the circumferential direction of the inner wall of the shell; the outer edge of the circuit board is fixed on the fixing ribs, the structure is simple, and the assembly is convenient.
Because the two circuit boards are arranged in the shell and respectively defined as a first circuit board and a second circuit board, the first circuit board is arranged close to the loudspeaker; the first circuit board is connected with the inner wall of the shell, the second circuit board is fixed on the first circuit board, and the structure enables the multifunctional earphone to improve the low-frequency effect.
Drawings
Fig. 1 is a schematic structural diagram of an intelligent wireless headset with a built-in dual circuit board;
FIG. 2 is a schematic structural diagram of an intelligent wireless headset with a built-in single circuit board;
FIG. 3 is a schematic structural diagram of the back side of the horn unit device;
in the figure: 10-shell, 101-rear shell, 102-middle shell, 103-front shell, 104-ear plug, 201-main microphone, 202-auxiliary microphone, 203-battery, 204-flexible circuit board, 205-first circuit board, 206-second circuit board, 207-signal line, 208-sound outlet hole, 210-fixing rib, 211-supporting rib, 212-rear sound cavity, 213-loudspeaker, 214-circuit board, 215-front sound cavity.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1 to fig. 3, an intelligent wireless headset includes a housing 10, an ear plug 104 is disposed on one side of the housing 10, a speaker 213 and a circuit board 214 are disposed in the housing 10, the speaker 213 is disposed near the ear plug 104, an outer edge of the circuit board 214 is connected to an inner wall of the housing 10, and the circuit board 214 encloses a rear acoustic cavity 212 enclosed by the isolation speaker 213 and the inner wall of the housing 10. The intelligent wireless earphone of the utility model utilizes the circuit board 214 to seal the isolation loudspeaker 213, thus realizing the multiple utilization of the circuit board 214; compared with the prior art, the space occupied by the isolation plate is saved, the rear sound cavity 212 has a clean space with enough volume, the low-frequency effect is improved, and the tone quality is improved; the weight of the isolation board is reduced, so that the earphone is small and portable, and the wearing comfort is greatly improved.
As shown in fig. 1 and fig. 2, the circuit board 214 is disposed at a position such that the volume of the rear acoustic cavity 212 is set according to the diameter of the speaker 213, so that the earphone keeps the advantage of small volume, and the rear acoustic cavity 212 has sufficient volume to provide sufficient "elastic space" for the sound wave generated by the sound emitted from the speaker 213, so as to prevent the signal capability from being reduced due to interference of signals in a shorter time, that is, to facilitate reducing the cut-off frequency, improving the low-frequency effect, and improving the sound quality of the earphone. Generally, the speaker sizes phi 14, phi 13, phi 10 and phi 9 (in mm), the volume of the rear acoustic cavity 212 in this embodiment can be set according to the actually configured speaker size, for example, the speaker size phi 10, and the volume of the rear acoustic cavity 212 is designed to be 0.4ml by adjusting the position of the circuit board 214.
As shown in fig. 1 and fig. 2, the circuit board 214 is disposed parallel to the speaker 213, but of course, the arrangement is not limited to the parallel arrangement, and the arrangement may be configured according to the actual structure of the earphone as long as the circuit board 214 seals and isolates the rear acoustic cavity 212.
As shown in fig. 1 and 3, the inner wall of the casing 10 is provided with a fixing rib 210, and the fixing rib 210 is arranged along the circumferential direction of the inner wall of the casing 10; the outer edge of the circuit board 214 is fixed to the fixing rib 210, and this structure makes the assembly simple and convenient. In this embodiment, two circuit boards are disposed in the housing 10 and are respectively positioned as a first circuit board 205 and a second circuit board 206, wherein the first circuit board 205 is disposed near the speaker 213, and the first circuit board 205 is glued on the fixing rib 210. The inner wall of the shell 10 is also provided with support ribs 211, and the support ribs 211 are arranged along the circumferential direction of the inner wall of the shell 10; the outer edge of the horn 213 is fixed to the support rib 211, and this structure makes the assembly simple and convenient. Of course, the connection manner of the circuit board, the speaker 213 and the inner wall of the housing 10 is not limited to the above.
The following are specifically mentioned: the intelligent wireless earphone of the embodiment is a bluetooth earphone, the housing 10 of the bluetooth earphone comprises a front shell 103, a middle shell 102 and a rear shell 101, and the earplugs 104 are arranged on the side of the front shell 103. The first circuit board 205 is connected with the inner wall of the housing 10, the second circuit board 206 is fixed on the first circuit board 205, preferably, the first circuit board 205 and the second circuit board 206 are arranged in parallel; the housing 10 is further provided with a main microphone 201 and a sub-microphone 202 which are respectively electrically connected with a second circuit board 206, in this case, the main microphone 201 and the sub-microphone 202 are arranged on a flexible circuit board 204, and are electrically connected with the second circuit board 206 through the flexible circuit board 204; the shell 10 is also provided with a battery 203 arranged at the side of the middle shell 102, the battery 203 is arranged in parallel with the second circuit board 206, the main microphone 201 is arranged between the rear shell 101 and the battery 203, and the auxiliary microphone 202 is arranged between the middle shell 102 and the battery 203; the speaker 213 is in signal communication with the first circuit board 205 through the signal line 207. A front acoustic cavity 212 is defined between the loudspeaker 213 and the inner wall of the front shell 103, and the front acoustic cavity 212 should be reduced as much as possible (L is larger than the maximum vibration amplitude of the loudspeaker diaphragm).
As shown in fig. 1 and fig. 3, the bluetooth headset of this embodiment utilizes the first circuit board 205 in multiple ways, so as to integrate the circuit board and the isolation board into one, thereby reducing the overall size and weight of the headset, and further providing the headset with the advantages of being small and light, and being more beneficial to the overall aesthetic property of the headset. The first circuit board 205 is utilized for multiple purposes, the rear sound cavity 212 of the earphone is sealed and isolated, the bass effect of the earphone is effectively improved, the transmission of sound signals sent by the sound outlet 208 behind the loudspeaker 213 body to the main microphone 201 and the auxiliary microphone 202 is avoided, the noise reduction performance of the microphones is improved, and the conversation effect and the sound quality effect of the earphone are integrally improved.
As shown in fig. 2, the utility model discloses an intelligent wireless earphone, can only set up one or more than two circuit boards 214 in its casing 10, only need design be close to the circuit board 214 and the casing 10 wall connection of loudspeaker 213 side can.
The above-mentioned preferred embodiments of the present invention are not intended to limit the present invention, and any modifications made within the spirit and principles of the present invention, equivalent to the modifications of the intelligent wireless earphone, should be included within the scope of the present invention.
Claims (10)
1. The utility model provides an intelligence wireless headset, includes the casing, one side of casing is provided with the earplug, be provided with loudspeaker and circuit board in the casing, loudspeaker are close to the earplug side sets up, its characterized in that, the outward flange of circuit board with shells inner wall connects, and this circuit board seals the isolation loudspeaker with the back sound cavity that shells inner wall encloses.
2. The intelligent wireless headset of claim 1, wherein the circuit board is positioned such that the volume of the rear acoustic cavity is set according to the horn diameter.
3. The intelligent wireless headset of claim 1, wherein the circuit board is disposed parallel to the speaker.
4. The intelligent wireless headset of any one of claims 1 to 3,
the inner wall of the shell is provided with a fixed rib which is arranged along the circumferential direction of the inner wall of the shell;
the outer edge of the circuit board is fixed on the fixing rib.
5. The intelligent wireless earphone according to claim 4, wherein two circuit boards are arranged in the housing, the two circuit boards are respectively defined as a first circuit board and a second circuit board, and the first circuit board is arranged close to the loudspeaker;
the first circuit board is connected with the inner wall of the shell, and the second circuit board is fixed on the first circuit board.
6. The intelligent wireless headset of claim 5, wherein the first circuit board is glued to the fixing ribs.
7. The intelligent wireless headset of claim 4,
the inner wall of the shell is provided with support ribs which are arranged along the circumferential direction of the inner wall of the shell;
the outer edge of the horn is fixed on the support rib.
8. The intelligent wireless headset of claim 5, wherein a primary microphone and a secondary microphone are further disposed within the housing and electrically connected to the second circuit board, respectively.
9. The intelligent wireless headset of claim 5, wherein a battery is further disposed within the housing, the battery being disposed in parallel with the second circuit board.
10. The intelligent wireless headset of claim 4, wherein the headset is a Bluetooth headset.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921636071.5U CN210405611U (en) | 2019-09-27 | 2019-09-27 | Intelligent wireless earphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921636071.5U CN210405611U (en) | 2019-09-27 | 2019-09-27 | Intelligent wireless earphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210405611U true CN210405611U (en) | 2020-04-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921636071.5U Active CN210405611U (en) | 2019-09-27 | 2019-09-27 | Intelligent wireless earphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210405611U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225641A (en) * | 2021-04-30 | 2021-08-06 | 深圳市百泰实业股份有限公司 | Intelligent noise reduction module of active self-adaptive ANC earphone |
| CN114697792A (en) * | 2020-12-31 | 2022-07-01 | 华为技术有限公司 | Earphone set |
-
2019
- 2019-09-27 CN CN201921636071.5U patent/CN210405611U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114697792A (en) * | 2020-12-31 | 2022-07-01 | 华为技术有限公司 | Earphone set |
| WO2022143279A1 (en) * | 2020-12-31 | 2022-07-07 | 华为技术有限公司 | Earphone |
| CN113225641A (en) * | 2021-04-30 | 2021-08-06 | 深圳市百泰实业股份有限公司 | Intelligent noise reduction module of active self-adaptive ANC earphone |
| CN113225641B (en) * | 2021-04-30 | 2022-12-13 | 深圳市百泰实业股份有限公司 | Intelligent noise reduction module of active self-adaptive ANC earphone |
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