CN210579210U

CN210579210U - Loudspeaker module and electronic equipment

Info

Publication number: CN210579210U
Application number: CN201921688525.3U
Authority: CN
Inventors: 郑宁杰; 李凤亮
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2019-10-10
Filing date: 2019-10-10
Publication date: 2020-05-19
Anticipated expiration: 2029-10-10

Abstract

The utility model discloses a speaker module (100), be applied to electronic equipment, speaker module (100) disclosed include speaker casing (110) and speaker body (120), speaker body (120) are including the vibrating diaphragm, speaker casing (110) have the speaker inner chamber, speaker body (120) set up in the speaker inner chamber, speaker body (120) separate into speaker front chamber (A) and speaker back chamber (B) with the speaker inner chamber, speaker casing (110) are seted up amortization through-hole (111a) that runs through the inner wall of speaker casing (110), form anechoic chamber (C) between speaker casing (110) and electronic equipment's equipment casing (200), anechoic chamber (C) communicate with speaker front chamber (A) through amortization through-hole (111 a). Above-mentioned scheme can be solved current speaker module and have the relatively poor problem of low frequency performance.

Description

Loudspeaker module and electronic equipment

Technical Field

The utility model relates to an electronic equipment technical field especially relates to a speaker module and electronic equipment.

Background

The speaker module is an acoustic module applied to electronic equipment such as mobile phones, flat panels and notebooks, and in order to improve the appearance integrity and the aesthetic property of the electronic equipment, the existing speaker module is generally arranged on the side of the electronic equipment, and accordingly, the speaker module is generally designed into a structure with sound coming out from the side.

The speaker module of present side play sound includes speaker body and speaker housing, and the speaker body includes the vibrating diaphragm, and at the in-process of work, the vibrating diaphragm realizes the sound production through the vibration. The diaphragm divides the speaker housing into a front cavity and a back cavity. The sound wave generated by the vibration of the diaphragm is transmitted to the sound outlet of the equipment shell of the electronic equipment through the front cavity and finally transmitted to the external environment of the electronic equipment. Due to the cavity resonance of the front cavity, a larger sound pressure level is generated at the resonance frequency point. The front cavity resonance frequency point occurs at a high frequency, and thus, an unpleasant feeling such as sharpness and a heavy tooth sound is generated.

In order to solve the problem, the existing loudspeaker module adopts a mode of arranging a front cavity filter in a front cavity, namely, a side branch cavity is added in the front cavity, and the resonance frequency point of the side branch cavity is the same as that of the front cavity, so that the effect of filtering can be achieved, and finally the tooth sound component on sound listening sensation is reduced. However, the arrangement of the side branch cavity occupies a larger inner cavity space of the speaker housing, and particularly has a larger influence on the volume of the rear cavity of the speaker module.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a speaker module and electronic equipment to there is the relatively poor problem of low frequency performance in solving present speaker module.

In order to solve the above problem, the utility model adopts the following technical scheme:

the utility model provides a speaker module, is applied to electronic equipment, speaker module includes speaker casing and speaker body, the speaker body includes the vibrating diaphragm, speaker casing has the speaker inner chamber, the speaker body sets up in the speaker inner chamber, just the speaker body will speaker inner chamber separates into speaker front chamber and speaker back chamber, speaker casing sets up and runs through the amortization through-hole of speaker casing's inner wall, speaker casing with form the chamber of muffling between electronic equipment's the equipment casing, the chamber of muffling passes through the amortization through-hole with speaker front chamber intercommunication.

The utility model provides an electronic equipment, equipment casing and the preceding speaker module, the speaker module sets up in the equipment casing, first phonate hole has been seted up to the equipment casing, the speaker module has the second phonate hole, first phonate hole with the second phonate hole is linked together.

The utility model discloses a technical scheme can reach following beneficial effect:

the loudspeaker module disclosed by the embodiment of the utility model improves the structure of the existing loudspeaker module, and through arranging the silencing through hole on the loudspeaker shell, meanwhile, a silencing cavity is formed between the loudspeaker shell and the equipment shell of the electronic equipment, and finally the front cavity of the loudspeaker and the silencing cavity form a resonance structure, according to the principle of the Helmholtz resonator, the silencing cavity can achieve the purpose of reducing the high-frequency resonance frequency of the front cavity of the loudspeaker, compared with the background technology that the high-frequency resonance frequency is reduced by adding a side branch cavity into the front cavity of the loudspeaker, the silencing cavity formed by the loudspeaker module disclosed by the embodiment of the utility model is formed by the loudspeaker shell and the equipment shell of the electronic equipment, therefore, the space of the inner cavity of the loudspeaker shell cannot be influenced, the size of the rear cavity of the loudspeaker cannot be reduced, and finally the low-frequency performance of the loudspeaker module cannot be influenced.

Drawings

The accompanying drawings, which are described herein, serve to provide a further understanding of the invention and constitute a part of this specification, and the exemplary embodiments and descriptions thereof are provided for explaining the invention without unduly limiting it. In the drawings:

fig. 1 is an exploded schematic view of a speaker module according to an embodiment of the present invention;

fig. 2 is a cross-sectional view of a speaker module according to an embodiment of the present invention;

fig. 3 is a schematic view of a partial structure of an electronic device according to an embodiment of the present invention;

fig. 4 is a cross-sectional view of a part of the structure of an electronic device disclosed in an embodiment of the present invention;

fig. 5 is a schematic view of an assembly structure of a speaker module and a groove-shaped structure according to an embodiment of the present invention.

Description of reference numerals:

100-loudspeaker module, 110-loudspeaker shell, 111-loudspeaker upper shell, 111 a-silencing through hole, 112-loudspeaker lower shell, 120-loudspeaker body,

200-equipment shell, 210-first groove, 220-first sound outlet,

300-sealing element,

400-groove-shaped structural part,

A-front loudspeaker cavity, B-rear loudspeaker cavity, C-anechoic cavity and D-second sound outlet.

Detailed Description

To make the purpose, technical solution and advantages of the present invention clearer, the following will combine the embodiments of the present invention and the corresponding drawings to clearly and completely describe the technical solution of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

Referring to fig. 1-5, an embodiment of the present invention discloses a speaker module applied to an electronic device, which includes a device housing 200. The disclosed speaker module includes a speaker housing 110 and a speaker body 120.

The speaker housing 110 is an outer shell of the speaker module, and the speaker housing 110 has a speaker inner cavity. The speaker body 120 is a main body of the speaker module, and the speaker body 120 includes a diaphragm, and in a specific working process, vibration of the diaphragm finally makes the speaker module generate sound. The speaker body 120 is disposed in a speaker inner cavity, and the diaphragm divides the speaker inner cavity into a speaker front cavity a and a speaker rear cavity B.

The speaker housing 110 has a sound deadening through-hole 111a penetrating through an inner wall of the speaker housing 110, and the sound deadening through-hole 111a communicates with the speaker front chamber a.

A sound-deadening chamber C is formed between the speaker housing 110 and the device housing 200 of the electronic device, and communicates with the speaker front chamber a through the sound-deadening through-hole 111 a. The anechoic cavity C and the front cavity A of the loudspeaker form a resonance structure, and according to the principle of a Helmholtz resonator, the resonance frequency of the anechoic cavity C is Fc, and according to the following formula:

where C is the propagation velocity of the acoustic wave, S is the cross-sectional area of the silencing through-hole 111a, L is the length of the silencing through-hole 111a, and V is the volume of the silencing chamber C. By controlling the values of S, L and V, the resonant frequency Fc of the anechoic cavity C is equal to the resonant frequency Fh of the front cavity A of the loudspeaker, and finally the filtering effect can be achieved.

In the embodiment of the present invention, the silencing through hole 111a may be directly provided on the speaker housing 110, or may be provided on a component of the speaker housing 110. Based on this, in a preferable scheme, the speaker housing 110 may be provided with a short metal pipe, the short metal pipe communicates the speaker front cavity a and the muffling cavity C, and a pipe cavity of the short metal pipe forms the muffling through hole 111 a. In this case, the design of S and L can be more easily realized by adjusting the size of the metal short tube, and the resonance frequency Fc of the muffling cavity C is more easily equal to the resonance frequency Fh of the front cavity a of the speaker.

The speaker module 100 disclosed in the embodiment of the present invention improves the structure of the existing speaker module by forming the sound-deadening through-hole 111a in the speaker housing 110, and simultaneously forming the sound-deadening chamber C between the speaker housing 110 and the device housing 200 of the electronic device, and finally forming the resonance structure between the speaker front chamber a and the sound-deadening chamber C, and according to the principle of the helmholtz resonator, the sound-deadening chamber C can achieve the purpose of reducing the high-frequency resonance frequency of the speaker front chamber a, compared with the case of reducing the high-frequency resonance frequency by adding the side branch chamber in the speaker front chamber a in the background art, the sound-deadening chamber C formed by the speaker module 100 disclosed in the embodiment of the present invention is formed by the speaker housing and the device housing 200 of the electronic device, so that the inner chamber space of the speaker housing is not affected, and the volume of the speaker rear chamber is not reduced, and finally, the low-frequency performance of the loudspeaker module is not influenced.

As described above, the muffling chamber C is formed by the speaker housing 110 and the device housing 200 of the electronic device, and there are various ways of forming the muffling chamber C. Referring to fig. 1, in a specific embodiment, a first groove 210 may be formed on an inner wall of the device housing 200, and the speaker housing 110 covers a notch of the first groove 210. The speaker housing 110 forms an anechoic chamber C with the first recess 210 of the device housing 200. The above structure only needs to open the first groove 210 on the inner wall of the device housing 200, so that the first groove 210 and the speaker housing 110 form the muffling cavity C, and the muffling cavity C can be formed by the device housing 200, so that the existing structure of the electronic device is fully utilized, and the advantage of simple structure is achieved.

In a more preferable scheme, a sealing member 300 arranged around a notch of the first groove 210 may be arranged between the speaker housing 110 and the device housing 200, and the first groove 210, the sealing member 300 and the speaker housing 110 form a muffling cavity C, so that the muffling cavity C can be better sealed under the sealing action of the sealing member 300, which is beneficial to improving the muffling effect.

Of course, there are various ways to form the muffling chamber C, please refer to fig. 5, in another speaker module 100 disclosed in the present invention, the device case 200 of the electronic device includes a case main body and a groove-shaped structure 400, and the groove-shaped structure 400 is disposed on the case main body. The groove-shaped structure 400 is arranged on the outer side of the speaker housing 110, the notch of the groove-shaped structure 400 is in sealing fit with the outer side surface of the speaker housing 110, and the groove-shaped structure 400 and the speaker housing 110 form an anechoic cavity C. The groove-shaped structure 400 and the housing main body can be of a split structure, and in the assembling process, the groove-shaped structure 400 can be fixed on the loudspeaker housing 110 in advance and then assembled on the housing main body, so that the advantage of convenient operation is achieved.

In order to improve the compactness of the assembly, in a preferred embodiment, the housing body may be provided with a second groove, and the channel-shaped structural member 400 is located in the second groove.

The embodiment of the utility model provides an in, amortization through-hole 111a can set up with the center of vibrating diaphragm relatively to ensure the equilibrium of air current business turn over in the speaker antechamber A, be favorable to vibrating diaphragm vibration more balancedly.

The embodiment of the utility model discloses in loudspeaker module 100, loudspeaker housing 110 is preferred to be including loudspeaker epitheca 111 and loudspeaker inferior valve 112, and loudspeaker epitheca 111 and loudspeaker inferior valve 112 dock and form the speaker inner chamber, and loudspeaker epitheca 111 constitutes speaker antechamber A with the vibrating diaphragm, and loudspeaker inferior valve 112, speaker body 120 and loudspeaker epitheca 111 constitute speaker back chamber B, and amortization through-hole 111a can be seted up on one side that loudspeaker epitheca 111 deviates from speaker body 120. The speaker housing 110 of the above-described split structure facilitates the assembly of the speaker module 100.

In a more preferable scheme, the number of the silencing through holes 111a may be at least two, the number of the silencing cavities C is equal to the number of the silencing through holes 111a, each silencing through hole 111a is correspondingly communicated with one silencing cavity C, and by differentially designing each silencing through hole 111a and the corresponding silencing cavity C, filtering of sounds in different frequency bands can be achieved.

Based on the utility model discloses speaker module 100, the embodiment of the utility model discloses an electronic equipment, disclosed electronic equipment include equipment housing 200 and above embodiment speaker module 100, speaker module 100 sets up in equipment housing 200, equipment housing 200 has seted up first phonate hole 220, speaker module 100 has second phonate hole D, first phonate hole 220 is linked together with second phonate hole D.

The embodiment of the utility model provides an electronic equipment can be cell-phone, panel computer, electronic book reader, game machine, wearable equipment (for example intelligent wrist-watch) etc. electronic equipment, the embodiment of the utility model provides a do not restrict electronic equipment's specific kind.

The utility model discloses what the key description in the above embodiment is different between each embodiment, and different optimization characteristics are as long as not contradictory between each embodiment, all can make up and form more preferred embodiment, consider that the literary composition is succinct, then no longer describe here.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A speaker module (100) for electronic equipment, wherein the speaker module (100) comprises a speaker housing (110) and a speaker body (120), the speaker body (120) includes a diaphragm, the speaker housing (110) has a speaker cavity, the speaker body (120) is disposed in the speaker cavity, the loudspeaker body (120) divides the inner cavity of the loudspeaker into a front loudspeaker cavity (A) and a rear loudspeaker cavity (B), the loudspeaker shell (110) is provided with a silencing through hole (111a) penetrating through the inner wall of the loudspeaker shell (110), an anechoic chamber (C) is formed between the loudspeaker housing (110) and a device housing (200) of the electronic device, the silencing cavity (C) is communicated with the front cavity (A) of the loudspeaker through the silencing through hole (111 a).

2. The loudspeaker module (100) according to claim 1, wherein the inner wall of the device housing (200) defines a first groove (210), the loudspeaker housing (110) covers a notch of the first groove (210), a sealing member (300) is disposed between the loudspeaker housing (110) and the device housing (200) and surrounds the notch, and the first groove (210), the sealing member (300) and the loudspeaker housing (110) form the muffling chamber (C).

3. The speaker module (100) of claim 2 wherein the seal (300) is a foam gasket.

4. The loudspeaker module (100) according to claim 1, wherein the device housing (200) comprises a housing body and a channel structure (400) arranged on the housing body, the channel structure (400) is arranged on the outer side of the loudspeaker housing (110), the notch of the channel structure (400) is in sealing fit with the outer side surface of the loudspeaker housing (110), and the channel structure (400) and the loudspeaker housing (110) form the muffling cavity (C).

5. The speaker module (100) of claim 4 wherein the housing body defines a second recess, the channel structure (400) being positioned in the second recess.

6. The loudspeaker module (100) according to claim 1, wherein the sound deadening through-hole (111a) is disposed opposite to the center of the diaphragm.

7. The speaker module (100) according to claim 1, wherein the speaker housing (110) comprises a speaker upper shell (111) and a speaker lower shell (112), the speaker upper shell (111) and the speaker lower shell (112) are butted to form the speaker inner cavity, the speaker upper shell (111) and the diaphragm form the speaker front cavity (a), the speaker lower shell (112), the speaker body (120) and the speaker upper shell (111) form the speaker rear cavity (B), and the sound deadening through hole (111a) is formed on a side of the speaker upper shell (111) away from the speaker body (120).

8. A loudspeaker module (100) according to claim 1, wherein the loudspeaker housing (110) is provided with a metal stub, the metal stub communicating the loudspeaker front cavity (a) with the sound-deadening chamber (C), a lumen of the metal stub forming the sound-deadening through-hole (111 a).

9. The speaker module (100) of claim 1, wherein the number of the sound deadening through holes (111a) is at least two, the number of the sound deadening chambers (C) is equal to the number of the sound deadening through holes (111a), and each of the sound deadening through holes (111a) communicates with one of the sound deadening chambers (C) correspondingly.

10. An electronic device, comprising a device housing (200) and the speaker module (100) as claimed in any one of claims 1 to 9, wherein the speaker module (100) is disposed in the device housing (200), the device housing (200) defines a first sound outlet (220), the speaker module (100) defines a second sound outlet (D), and the first sound outlet (220) is in communication with the second sound outlet (D).