CN116759884A - Semiconductor laser fixing device - Google Patents
Semiconductor laser fixing device Download PDFInfo
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- CN116759884A CN116759884A CN202311048724.9A CN202311048724A CN116759884A CN 116759884 A CN116759884 A CN 116759884A CN 202311048724 A CN202311048724 A CN 202311048724A CN 116759884 A CN116759884 A CN 116759884A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 76
- 238000009434 installation Methods 0.000 claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims description 19
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 230000002457 bidirectional effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention relates to the technical field of semiconductor lasers and discloses a semiconductor laser fixing device, which comprises a base, a bottom plate, four connecting columns, a top plate and a semiconductor laser body, wherein the four connecting columns are fixedly connected between the bottom plate and the top plate; the semiconductor laser fixing device can be effectively installed and fixed through the attached installation structure, and the semiconductor laser fixing device can be conveniently and rapidly installed and clamped and fixed, so that the use stability of the semiconductor laser is guaranteed.
Description
Technical Field
The invention belongs to the technical field of semiconductor lasers, and particularly relates to a semiconductor laser fixing device.
Background
The semiconductor laser is an electroluminescent device and is widely applied to the aspects of laser communication, laser printing, ranging, laser radar, laser interference and the like; the semiconductor laser is also called as laser diode, which uses semiconductor material as working substance, and the specific process of producing laser light is special, and the semiconductor diode laser is the most practical and important laser, and its volume is small, service life is long, and it can be pumped by adopting simple injection current mode, and its working voltage and current are compatible with integrated circuit, so that it can be monolithically integrated with it.
The semiconductor laser needs to keep the stability of laser emission when in use, therefore, the semiconductor laser needs to be fixed when in use, the common semiconductor laser is only provided with a mounting piece which can be fixed by bolts at the bottom, the assembly structure of the mounting piece needs to be provided with a threaded mounting hole on a device bedplate for placing the semiconductor laser to fix the semiconductor laser, the mounting operation is troublesome, meanwhile, the semiconductor laser needs to control the height when in use, the conventional semiconductor laser is usually provided with a height adjusting mechanism, the height of the mechanism is completely determined by the height of the device for placing the semiconductor laser, and the height of the laser is difficult to adjust when in use; thus, improvements are now needed for the current situation.
Disclosure of Invention
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a semiconductor laser fixing device, includes base, bottom plate, four spliced pole, roof and semiconductor laser body, four spliced pole fixed connection is between bottom plate and roof, the bottom plate is located the top of base, four sides at roof top all are equipped with two chucking fixed part, semiconductor laser body is located the top of roof, eight chucking fixed part all with the semiconductor laser body chucking contact mutually, the bottom of bottom plate rotates and is connected with big worm wheel, big worm wheel all is connected with eight chucking fixed part's lower part transmission, the circular slot has been seted up at the top of base, square slot has been seted up at the middle part of circular slot bottom, square slot's bottom just is located square slot's internally mounted and goes up and down to adjust the part, go up and down to adjust the part and be connected with the bottom of bottom plate, the drive part of being connected with the transmission of going up and down to adjust the part is installed to the bottom of circular slot, installation fixed part is installed to the lower part of base.
Preferably, eight the chucking fixed part all includes first connecting pin, and the equal fixedly connected with of four sides at roof top is first connecting pin, and the top of first connecting pin is all rotated and is connected with the dwang, and the one end fixedly connected with T shape fixture block of dwang, the middle part fixedly connected with T shape rubber chucking cover of T shape fixture block, the upper portion of T shape rubber chucking cover is slope inclined plane structure to can effectually carry out the chucking fixedly to the semiconductor laser body.
Preferably, the other end of the rotating bar is provided with a first sliding groove, four sides of the top plate are provided with two second sliding grooves, the second sliding grooves are positioned on one side of the first connecting pin, and T-shaped toggle pins are connected between the first sliding grooves and the second sliding grooves, so that the rotating bar can be rotated and adjusted.
Preferably, the four sides of roof bottom are all fixedly connected with a pair of lantern ring, all movable grafting has the movable strip between the middle part of four pairs of lantern rings, and the bottom of two T shape toggle pins of four sides of roof all with the top fixed connection of the movable strip of four sides of roof bottom, the equal fixedly connected with fixed block in middle part of movable strip bottom, the transmission groove has been seted up to the bottom of fixed block, four movable grafting in the inside toggle pins of four transmission grooves of top fixedly connected with of big worm wheel.
Preferably, the bottom of roof rotates and is connected with the first worm of being connected with big worm wheel meshing, and the one end fixedly connected with of first worm is adjusted the wheel to can effectually adjust the operation.
Preferably, the lifting adjusting component comprises four second connecting pins, the four second connecting pins are annularly and equidistantly connected to the bottom of the circular groove in a rotating mode, the four second connecting pins are located at the first connecting rotating arms of the end portions inside the square groove and are fixedly connected with each other, one ends of the first connecting rotating arms are rotatably connected with the second connecting rotating arms, one ends, far away from the first connecting rotating arms, of the second connecting rotating arms are rotatably connected with connecting blocks, and the tops of the connecting blocks are fixedly connected with the bottom of the bottom plate, so that the bottom plate can be effectively connected.
Preferably, the four second connecting pins are positioned at the end parts inside the circular grooves and are fixedly connected with gears, the bottoms of the circular grooves are provided with ring grooves, the inside of each ring groove is movably provided with a rotating ring, and the tops of the rotating rings are fixedly connected with gear rings which are meshed with the four gears.
Preferably, the upper portion fixedly connected with worm wheel circle of circle periphery, one side rotation of circular slot bottom is connected with the second worm that is connected with the worm wheel circle meshing, and one end of second worm extends to outside one side of base and fixedly connected with second regulating wheel to can effectually adjust the use height of semiconductor laser body.
Preferably, the installation fixed part is including rotating the two-way threaded rod of connection in the base lower part, and the one end fixedly connected with third regulating wheel of two-way threaded rod, the equal fixedly connected with of lower part of base both sides is a pair of slide bar, equal slidable mounting has the movable plate between the surface of two pairs of slide bars, the middle part of two movable plates respectively with the both sides threaded connection of two-way threaded rod, the equal fixedly connected with of bottom of two movable plates falls L shape cardboard to can be convenient install own equipment on the platen.
Compared with the prior art, the invention has the beneficial effects that:
(1) In operation, through being provided with the base, the bottom plate, the connecting column, the top plate, the semiconductor laser body, the large worm wheel, the circular groove, the square groove, the clamping fixing part, the lifting adjusting part, the transmission part and the installation fixing part, the semiconductor laser fixing device can be effectively installed and fixed for use through the additional installation structure, the fixing device can be used for conveniently installing and clamping the semiconductor laser, the use stability of the semiconductor laser is ensured, and meanwhile, the fixing device has the lifting height adjusting function, the use height of the semiconductor laser can be adjusted, so that the use performance of the semiconductor laser is effectively improved, the fixing device is simple in design, convenient to use and operate, and stable and reliable in installation and adjustment, and the use requirement of the semiconductor laser installation can be met through the performance of the fixing device;
when the semiconductor laser body is required to be installed and fixed on the top of the top plate, the semiconductor laser body is firstly placed in the middle of the top plate, then the first regulating wheel is rotated to enable the first worm to rotate, the rotation of the first worm drives the big worm wheel to rotate, the rotation of the big worm wheel drives the four poking pins to rotate, the movement of the four poking pins moves in the transmission groove and drives the moving strip to move in the lantern ring through the fixing block, the movement of the moving strip drives the two T-shaped poking pins on the moving strip to move in the second sliding groove, the rotating strip is rotated and regulated through the first sliding groove, the rotation of the rotating strip drives the T-shaped clamping block and the T-shaped rubber clamping sleeve to move towards the side edge of the semiconductor laser body, and then the upper part and the side edge of the semiconductor laser body are clamped and fixed through the T-shaped clamping block and the T-shaped rubber clamping sleeve, so that the semiconductor laser body can be firmly and stably installed on the top of the top plate;
the semiconductor laser body is installed at the top of roof after, rotate the second worm through the second regulating wheel, the rotation of second worm can carry out the transmission to the worm wheel circle and rotate, the rotation of worm wheel circle can drive the rotation circle and rotate in the inside of circle groove, the rotation of rotation circle can drive the ring gear and rotate, the rotation of ring gear can carry out the transmission rotation to four gears, the rotation of four gears can drive four second connecting pins and rotate, the rotation of four second connecting pins can drive the first connection swivel arm of its tip and rotate, the rotation of first connection swivel arm can drive the second connection swivel arm and go up and down and rotate, the lift rotation of second connection swivel arm can drive the bottom plate through the connecting block and go up and down the removal, the lift of bottom plate can drive roof and semiconductor laser body through four spliced poles and go up and down the regulation, thereby the service height of semiconductor laser body is adjusted.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention.
In the drawings:
FIG. 1 is a schematic top view of a semiconductor laser of the present invention;
FIG. 2 is a schematic diagram of a partial top view of the structure of FIG. 1 according to the present invention;
FIG. 3 is a schematic view of the partial structure of FIG. 2 according to the present invention;
FIG. 4 is a schematic view of the partial structure of FIG. 3 according to the present invention;
FIG. 5 is a schematic diagram of a partial top view of FIG. 1 according to the present invention;
FIG. 6 is a schematic diagram of a partial front view of the structure of FIG. 5 in accordance with the present invention;
FIG. 7 is a schematic view showing the bottom view of the rotating bar, T-shaped clamping block and T-shaped rubber clamping sleeve of the present invention;
FIG. 8 is a schematic view of the bottom structure of FIG. 5 according to the present invention;
FIG. 9 is a schematic view of the partial structure of FIG. 8 in accordance with the present invention;
FIG. 10 is a schematic view of the partial structure of FIG. 9 according to the present invention;
FIG. 11 is a schematic view of the partial structure of FIG. 10 according to the present invention;
FIG. 12 is a schematic diagram of a partial side view of the structure of FIG. 1 in accordance with the present invention;
in the figure: 1. a base; 2. a bottom plate; 3. a connecting column; 4. a top plate; 5. a semiconductor laser body; 6. a large worm wheel; 7. a circular groove; 8. a square groove; 9. a first connecting pin; 10. rotating the strip; 11. a T-shaped clamping block; 12. t-shaped rubber clamping sleeve; 13. a first chute; 14. a second chute; 15. a T-shaped toggle pin; 16. a collar; 17. moving the bar; 18. a fixed block; 19. a transmission groove; 20. a toggle pin; 21. a first worm; 22. a first adjustment wheel; 23. a second connecting pin; 24. a first connecting swivel arm; 25. the second connecting rotating arm; 26. a connecting block; 27. a gear; 28. a ring groove; 29. a rotating ring; 30. a gear ring; 31. a scroll wheel rim; 32. a second worm; 33. a second adjustment wheel; 34. a two-way threaded rod; 35. a third adjustment wheel; 36. a slide bar; 37. a moving plate; 38. an inverted L-shaped clamping plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention; all other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The first embodiment is given by fig. 1 to 12, the invention comprises a base 1, a bottom plate 2, four connecting columns 3, a top plate 4 and a semiconductor laser body 5, wherein the four connecting columns 3 are fixedly connected between the bottom plate 2 and the top plate 4, the bottom plate 2 is positioned at the top of the base 1, two clamping fixing parts are arranged on four sides of the top plate 4, the semiconductor laser body 5 is positioned at the top of the top plate 4, eight clamping fixing parts are in clamping contact with the semiconductor laser body 5, the bottom of the bottom plate 2 is rotationally connected with a worm wheel 6, the worm wheel 6 is in transmission connection with the lower parts of the eight clamping fixing parts, a circular groove 7 is formed in the top of the base 1, a square groove 8 is formed in the middle of the bottom of the circular groove 7, a lifting adjusting part is arranged in the bottom of the circular groove 7 and is connected with the bottom of the bottom plate 2, a transmission part connected with the lifting adjusting part is arranged at the bottom of the circular groove 7, and a mounting fixing part is arranged at the lower part of the base 1; the mounting and fixing part comprises a bidirectional threaded rod 34 rotatably connected to the lower part of the base 1, one end of the bidirectional threaded rod 34 is fixedly connected with a third adjusting wheel 35, the lower parts of two sides of the base 1 are fixedly connected with a pair of sliding rods 36, a movable plate 37 is slidably arranged between the surfaces of the two pairs of sliding rods 36, the middle parts of the two movable plates 37 are respectively in threaded connection with the two sides of the bidirectional threaded rod 34, and the bottoms of the two movable plates 37 are fixedly connected with an inverted L-shaped clamping plate 38, so that the device can be conveniently mounted on a bedplate;
by rotating the third adjusting wheel 35, the bidirectional threaded rod 34 rotates, the rotation of the bidirectional threaded rod 34 drives the two moving plates 37 to drive the two inverted-L-shaped clamping plates 38 to move oppositely, and then the device is placed on the bedplate, so that the end parts of the two inverted-L-shaped clamping plates 38 are positioned at the outer side of the bedplate; and then the third adjusting wheel 35 is continuously rotated to enable the bidirectional threaded rod 34 to rotate, and the rotation of the bidirectional threaded rod 34 enables the two moving plates 37 to drive the two inverted-L-shaped clamping plates 38 to relatively move, so that the connection parts of the end parts of the two inverted-L-shaped clamping plates 38 and the side edges of the bedplate are clamped and fixed.
In the second embodiment, on the basis of the first embodiment, the eight clamping and fixing components comprise first connecting pins 9, two first connecting pins 9 are fixedly connected to four sides of the top plate 4, a rotating strip 10 is rotatably connected to the top of the first connecting pins 9, one end of the rotating strip 10 is fixedly connected with a T-shaped clamping block 11, the middle part of the T-shaped clamping block 11 is fixedly connected with a T-shaped rubber clamping sleeve 12, and the upper part of the T-shaped rubber clamping sleeve 12 is of an inclined surface structure, so that the semiconductor laser body 5 can be effectively clamped and fixed; the other end of the rotating bar 10 is provided with a first sliding groove 13, four sides of the top plate 4 are provided with two second sliding grooves 14, the second sliding grooves 14 are positioned on one side of the first connecting pin 9, and T-shaped toggle pins 15 are connected between the first sliding grooves 13 and the second sliding grooves 14, so that the rotating bar 10 can be rotated and adjusted; the four sides of the bottom of the top plate 4 are fixedly connected with a pair of lantern rings 16, moving strips 17 are movably inserted between the middle parts of the four pairs of lantern rings 16, the bottoms of two T-shaped toggle pins 15 on the four sides of the top plate 4 are fixedly connected with the tops of the moving strips 17 on the four sides of the bottom of the top plate 4, the middle parts of the bottoms of the moving strips 17 are fixedly connected with fixed blocks 18, the bottoms of the fixed blocks 18 are provided with transmission grooves 19, and the tops of the big worm gears 6 are fixedly connected with four toggle pins 20 movably inserted in the four transmission grooves 19; the bottom of the top plate 4 is rotatably connected with a first worm 21 meshed with the large worm wheel 6, and one end of the first worm 21 is fixedly connected with a first adjusting wheel 22, so that the adjustment operation can be effectively performed;
when the semiconductor laser body 5 is required to be installed and fixed at the top of the top plate 4, the semiconductor laser body 5 is firstly placed in the middle of the top plate 4, then the first adjusting wheel 22 is rotated to enable the first worm 21 to rotate, the large worm wheel 6 is driven to rotate by the rotation of the first worm 21, the large worm wheel 6 can drive the four stirring pins 20 to rotate, the four stirring pins 20 can move in the transmission groove 19 and drive the movable strip 17 to move in the collar 16 through the fixing block 18, the movable strip 17 can drive the two T-shaped stirring pins 15 on the movable strip 17 to move, the movement of the T-shaped stirring pins 15 can move in the second sliding groove 14 and rotate and adjust the movable strip 10 through the first sliding groove 13, the rotation of the movable strip 10 can drive the T-shaped clamping block 11 and the T-shaped rubber sleeve 12 to move towards the side edge of the semiconductor laser body 5, and then the upper part and the side edge of the semiconductor laser body 5 can be fixed through the T-shaped clamping block 11 and the T-shaped rubber sleeve 12, and the semiconductor laser body 5 can be firmly installed at the top plate 4.
In the third embodiment, on the basis of the first embodiment, the lifting adjusting component comprises four second connecting pins 23, the four second connecting pins 23 are rotationally connected at the bottom of the circular groove 7 in an annular equidistant manner, the end parts of the four second connecting pins 23, which are positioned in the square groove 8, are fixedly connected with first connecting rotating arms 24, one ends of the first connecting rotating arms 24 are rotationally connected with second connecting rotating arms 25, one ends of the second connecting rotating arms 25, which are far away from the first connecting rotating arms 24, are rotationally connected with connecting blocks 26, and the top parts of the connecting blocks 26 are fixedly connected with the bottom of the bottom plate 2, so that the bottom plate 2 can be effectively connected; the end parts of the four second connecting pins 23 positioned in the circular groove 7 are fixedly connected with gears 27, the bottom of the circular groove 7 is provided with a ring groove 28, a rotating ring 29 is movably arranged in the ring groove 28, and the top of the rotating ring 29 is fixedly connected with a gear ring 30 which is meshed with the four gears 27; the upper part of the circumferential surface of the rotating ring 29 is fixedly connected with a worm wheel ring 31, one side of the bottom of the circular groove 7 is rotationally connected with a second worm 32 meshed with the worm wheel ring 31, one end of the second worm 32 extends out of one side of the base 1 and is fixedly connected with a second adjusting wheel 33, so that the using height of the semiconductor laser body 5 can be effectively adjusted;
after the semiconductor laser body 5 is mounted on the top of the top plate 4, the second worm 32 is rotated through the second adjusting wheel 33, the worm wheel ring 31 is driven to rotate by rotation of the second worm 32, the rotating ring 29 is driven to rotate in the ring groove 28 by rotation of the worm wheel ring 31, the gear ring 30 is driven to rotate by rotation of the rotating ring 29, the four gears 27 are driven to rotate by rotation of the gear ring 30, the four second connecting pins 23 are driven to rotate by rotation of the four gears 27, the first connecting rotating arm 24 at the end of the four second connecting pins 23 is driven to rotate by rotation of the four second connecting pins 23, the second connecting rotating arm 25 is driven to lift and rotate by rotation of the first connecting rotating arm 24, the bottom plate 2 is driven to lift and move by lifting rotation of the second connecting rotating arm 25 through the connecting block 26, the top plate 4 and the semiconductor laser body 5 are driven to lift and adjust by lifting movement of the bottom plate 2, and therefore the using height of the semiconductor laser body 5 is adjusted.
This semiconductor laser fixing device can effectually install fixedly use through subsidiary mounting structure, and this fixing device can be convenient the semiconductor laser installation chucking fixed, has guaranteed the stability that semiconductor laser used, and this fixing device has the height-adjusting function that goes up and down simultaneously, can use high regulation to semiconductor laser, thereby effectually improved semiconductor laser performance, and this fixing device design is simple, uses and convenient operation, and installation and regulation are reliable and stable, and the performance that it had can satisfy the user demand of semiconductor laser installation.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a semiconductor laser fixing device, includes base (1), bottom plate (2), four spliced pole (3), roof (4) and semiconductor laser body (5), its characterized in that: four spliced pole (3) fixed connection is between bottom plate (2) and roof (4), bottom plate (2) are located the top of base (1), four sides at roof (4) top all are equipped with two chucking fixed part, semiconductor laser body (5) are located the top of roof (4), eight chucking fixed part all are in chucking contact with semiconductor laser body (5), the bottom rotation of bottom plate (2) is connected with big worm wheel (6), big worm wheel (6) all are connected with eight chucking fixed part's lower part transmission, circular slot (7) have been seted up at the top of base (1), square slot (8) have been seted up at the middle part of circular slot (7) bottom, the bottom of circular slot (7) just be located square slot (8) internally mounted have lift adjustment part, lift adjustment part is connected with the bottom of bottom plate (2), the transmission part of being connected with the lift adjustment part transmission is installed to the bottom of circular slot (7), install fixed part in the lower part of base (1).
2. A semiconductor laser fixture according to claim 1, wherein: eight chucking fixed part all includes first connecting pin (9), and the equal fixedly connected with in four sides at roof (4) top is two first connecting pin (9), and the equal rotation in top of first connecting pin (9) is connected with rotor bar (10), and the one end fixedly connected with T shape fixture block (11) of rotor bar (10), the middle part fixedly connected with T shape rubber chucking cover (12) of T shape fixture block (11), the upper portion of T shape rubber chucking cover (12) is slope inclined plane structure.
3. A semiconductor laser fixture according to claim 2, wherein: the other end of the rotating strip (10) is provided with a first sliding groove (13), four sides of the top plate (4) are provided with two second sliding grooves (14), the second sliding grooves (14) are positioned on one side of the first connecting pin (9), and T-shaped toggle pins (15) are connected between the first sliding grooves (13) and the second sliding grooves (14).
4. A semiconductor laser fixture according to claim 3, wherein: four sides of roof (4) bottom are all fixedly connected with a pair of lantern ring (16), all movable grafting has movable strip (17) between the middle part of four pairs of lantern rings (16), the bottom of two T shape toggle pins (15) of roof (4) four sides all with the top fixed connection of movable strip (17) of roof (4) bottom four sides, the equal fixedly connected with fixed block (18) in middle part of movable strip (17) bottom, transmission groove (19) have been seted up to the bottom of fixed block (18), four movable toggle pins (20) of pegging graft in four transmission grooves (19) of top fixedly connected with of big worm wheel (6).
5. A semiconductor laser mounting apparatus as defined in claim 4, wherein: the bottom of the top plate (4) is rotationally connected with a first worm (21) meshed with the big worm wheel (6), and one end of the first worm (21) is fixedly connected with a first adjusting wheel (22).
6. A semiconductor laser fixture according to claim 1, wherein: the lifting adjusting component comprises four second connecting pins (23), the four second connecting pins (23) are rotationally connected to the bottom of the circular groove (7) at equal distances in an annular mode, the four second connecting pins (23) are located at the end portions inside the square groove (8) and fixedly connected with first connecting rotating arms (24), one ends of the first connecting rotating arms (24) are rotationally connected with second connecting rotating arms (25), one ends, far away from the first connecting rotating arms (24), of the second connecting rotating arms (25) are rotationally connected with connecting blocks (26), and the tops of the connecting blocks (26) are fixedly connected with the bottom of the bottom plate (2).
7. A semiconductor laser mounting apparatus as defined in claim 6, wherein: the four second connecting pins (23) are located at the end parts inside the circular grooves (7) and are fixedly connected with gears (27), ring grooves (28) are formed in the bottoms of the circular grooves (7), rotating rings (29) are movably mounted inside the ring grooves (28), and gear rings (30) meshed with the four gears (27) are fixedly connected to the tops of the rotating rings (29).
8. A semiconductor laser mounting apparatus as defined in claim 7, wherein: the upper part of the circumferential surface of the rotating ring (29) is fixedly connected with a worm wheel ring (31), one side of the bottom of the circular groove (7) is rotationally connected with a second worm (32) which is meshed with the worm wheel ring (31), and one end of the second worm (32) extends out of one side of the base (1) and is fixedly connected with a second adjusting wheel (33).
9. A semiconductor laser fixture according to claim 1, wherein: the installation fixed part is including rotating the two-way threaded rod (34) of connection in base (1) lower part, and the one end fixedly connected with third regulating wheel (35) of two-way threaded rod (34), the equal fixedly connected with of lower part of base (1) both sides is a pair of slide bar (36), equal slidable mounting has movable plate (37) between the surface of two pairs of slide bar (36), the middle part of two movable plates (37) respectively with the both sides threaded connection of two-way threaded rod (34), the equal fixedly connected with of bottom of two movable plates (37) falls L shape cardboard (38).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311048724.9A CN116759884B (en) | 2023-08-21 | 2023-08-21 | Semiconductor laser fixing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311048724.9A CN116759884B (en) | 2023-08-21 | 2023-08-21 | Semiconductor laser fixing device |
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| CN116759884A true CN116759884A (en) | 2023-09-15 |
| CN116759884B CN116759884B (en) | 2023-11-24 |
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