CN212209457U - Semiconductor laser fixing device - Google Patents
Semiconductor laser fixing device Download PDFInfo
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- CN212209457U CN212209457U CN202021237367.2U CN202021237367U CN212209457U CN 212209457 U CN212209457 U CN 212209457U CN 202021237367 U CN202021237367 U CN 202021237367U CN 212209457 U CN212209457 U CN 212209457U
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Abstract
The utility model discloses a semiconductor laser fixing device, the on-line screen storage device comprises a base, be equipped with laser positioning mechanism on the base, laser positioning mechanism cooperatees with laser clamping mechanism, and laser clamping mechanism slides through pushing mechanism and sets up on the base, and pushing mechanism is connected with the base. The utility model discloses simple structure rotates pushing mechanism, can fix a position semiconductor laser through laser positioning mechanism and laser clamping mechanism together, and after the bonding technology was accomplished, reverse rotation pushing mechanism directly take out semiconductor laser can again, and operating method is simple, and can once only carry out the operation to a plurality of semiconductor laser, has improved production efficiency, is favorable to extensive expanding production, is showing promotion economic benefits, is suitable for the mill and uses widely.
Description
Technical Field
The utility model belongs to the technical field of the optical communication, concretely relates to semiconductor laser fixing device.
Background
In the field of optical communication, a gold wire bonding process is a very important process in the packaging process of a TO semiconductor laser, and directly determines the performance of the laser. At present, the common gold wire bonding process is TO operate the TO semiconductor laser, the efficiency is low, the TO semiconductor laser needs TO be disassembled every time, and the production efficiency of a factory is seriously influenced.
SUMMERY OF THE UTILITY MODEL
TO the problem of TO semiconductor laser gold wire bonding inefficiency, the utility model provides a semiconductor laser gold wire bonding device has solved the problem of the low poor stability of current TO semiconductor laser coupling efficiency.
For solving the above technical problem, the utility model discloses the technical scheme who adopts as follows:
the utility model provides a semiconductor laser fixing device, includes the base, be equipped with laser positioning mechanism on the base, laser positioning mechanism cooperatees with laser clamping mechanism to fix semiconductor laser, laser clamping mechanism slides through pushing mechanism and sets up on the base, and pushing mechanism rotates with the base to be connected. The laser clamping mechanism can be pushed to move towards the direction close to or far away from the laser positioning mechanism along the base by rotating the pushing mechanism.
Laser instrument positioning mechanism is equipped with the draw-in groove that is used for inserting semiconductor laser including the dog that is used for fixing a position semiconductor laser on the base, and the dog is arranged in proper order along the direction of draw-in groove, dog and base fixed connection, and laser instrument clamping mechanism slides and cooperatees with the dog along the direction of draw-in groove.
And one side of the stop block is provided with a positioning groove matched with the semiconductor laser.
A magnetic block used for adsorbing the semiconductor laser is arranged in the clamping groove, and the distance from the upper surface of the magnetic block to the top of the clamping groove is consistent with the length of a pin of the semiconductor laser.
The laser clamping mechanism comprises a sliding plate, the sliding plate is arranged on the upper portion of the base in a sliding mode, clamping blocks are symmetrically and fixedly arranged on two sides of the sliding plate, the clamping blocks correspond to the stop blocks one to one, and the sliding plate is connected with the base through a pushing mechanism.
The pushing mechanism comprises a pushing block and an adjusting bolt, the pushing block is fixedly arranged on the lower portion of the sliding plate, and the adjusting bolt penetrates through the pushing block and then is in threaded connection with the base.
The middle part of base is equipped with the spout, and it connects canceling release mechanical system to slide in the spout, connects canceling release mechanical system and contacts with pushing mechanism, and connects canceling release mechanical system and laser clamping mechanism fixed connection, and the slip direction of just connecting canceling release mechanical system is unanimous with laser clamping mechanism's slip direction.
The connecting and resetting mechanism comprises a sliding block and an elastic piece, the sliding block and the elastic piece are respectively arranged on two sides of the sliding groove, one end of the elastic piece is fixedly connected with the side wall of the sliding groove, the other end of the elastic piece is fixedly connected with one end of the sliding block, and the other end of the sliding block is contacted with the pushing mechanism; the upper part of the sliding block is fixedly connected with the laser clamping mechanism through a connecting piece, and the sliding direction of the sliding block is consistent with that of the laser clamping mechanism.
The sliding groove is internally and fixedly provided with a guide rail, and the sliding block and the elastic piece are sleeved on the guide rail.
The connecting piece comprises at least two first fastening pieces, the two first fastening pieces are symmetrically arranged in the middle of the laser clamping mechanism, and the laser clamping mechanism is fixedly connected with the sliding block through the first fastening pieces.
The utility model has the advantages that:
the utility model has the advantages that the structure is simple, the pushing mechanism is rotated, the semiconductor laser can be positioned through the laser positioning mechanism and the laser clamping mechanism, after the bonding process is completed, the pushing mechanism is rotated reversely, and the semiconductor laser can be directly taken out, the operation method is simple, and a plurality of semiconductor lasers can be operated at one time, so that the production efficiency is improved, the large-scale production expansion is facilitated, the economic benefit is obviously improved, and the device is suitable for being popularized and used in factories; the magnetic block synchronously fixes the semiconductor laser, so that the position of the semiconductor laser is stable and does not shake, and the stable implementation of the gold wire bonding process is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a disassembly schematic view of the present invention.
Fig. 2 is a schematic structural diagram of the present invention.
FIG. 3 is a schematic view of the laser positioning mechanism and the position of the spring assembly on the base.
Fig. 4 is a schematic structural diagram of the base.
Fig. 5 is a schematic structural view of the stopper.
In the figure, 1 is a base, 1-1 is a fixing hole, 1-2 is a clamping groove, 1-3 is a fourth fastening piece, 1-4 is a sliding groove, 1-5 is a first threaded hole, 1-6 is a second threaded hole, 1-7 is a third threaded hole, 1-8 is a through hole of a sliding rail, 2 is a push block, 3 is an adjusting bolt, 4 is a magnetic block, 5 is a sliding plate, 5-1 is a clamping block, 6 is a fixing piece, 7 is a first fastening piece, 8 is a semiconductor laser, 9 is a stop block, 9-1 is a positioning groove, 10 is a second fastening piece, 11 is an elastic piece, 12 is a sliding block, 13 is a sliding rail, and 14 is a positioning piece.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without any creative effort belong to the protection scope of the present invention.
A semiconductor laser fixing device is shown in figure 4 and comprises a base 1, wherein four corners of the base 1 are provided with fixing holes 1-1, so that the base 1 can be conveniently fixed on a machine during a gold wire bonding process; clamping grooves 1-2 for inserting a semiconductor laser 8 are symmetrically formed in the front side and the rear side of the base 1, a plurality of third threaded holes 1-7 are symmetrically formed in the front side and the rear side of each clamping groove 1-2, and the third threaded holes 1-7 are sequentially arranged along the clamping grooves 1-2; the clamping groove 1-2 is provided with a laser positioning mechanism, the laser positioning mechanism is fixedly arranged at the upper part of the clamping groove 1-2 through a third threaded hole 1-7 and is used for positioning the semiconductor laser 8, and the laser positioning mechanism is matched with the laser clamping mechanism so as to clamp the semiconductor laser 8 together and fix the semiconductor laser; the laser clamping mechanism is arranged between the two clamping grooves 1-2, the laser clamping mechanism is arranged on the base 1 in a sliding mode through the pushing mechanism, and the pushing mechanism is connected with the base 1. Through pushing mechanism, can promote laser instrument clamping mechanism and slide from side to side along base 1, and then realize fixing semiconductor laser 8.
As shown in fig. 1 and 2, the laser positioning mechanism includes a plurality of stoppers 9, each stopper 9 is fixedly disposed on an upper portion of the card slot 1-2 through a third fastener 10 and a third threaded hole 1-7, and the stopper 9 is perpendicular to the card slot 1-2; as shown in fig. 5, a positioning groove 9-1 is formed on one side of the stopper 9, and the positioning groove 9-1 is matched with the side wall of the semiconductor laser 8 to better fix the semiconductor laser 8; the laser clamping mechanism comprises a sliding plate 5, the sliding plate 5 is arranged on the upper portion of the base 1 in a sliding mode along the direction of the clamping groove 1-2, a plurality of clamping blocks 5-1 are symmetrically and fixedly arranged on the front side and the rear side of the sliding plate 5, the clamping blocks 5-1 correspond to the stop blocks 9 one to one, and the sliding plate 5 is connected with the base 1 through a pushing mechanism. After the semiconductor laser 8 is inserted into the clamping groove 1-2, the pushing mechanism pushes the sliding plate 5 to move left, the clamping block 5-1 moves synchronously, and the clamping block 5-1 is matched with the stop block 9 to fix the semiconductor laser 8.
A magnetic block 4 used for adsorbing the semiconductor laser 8 is arranged in the clamping groove 1-2, the distance from the upper surface of the magnetic block 4 to the top of the clamping groove 1-2 is consistent with the length of a pin of the semiconductor laser 8, and the pin of the semiconductor laser 8 is adsorbed with the magnetic block 4 so as to fix the semiconductor laser. The left side and the right side of the clamping groove 1-2 are symmetrically provided with fourth fastening pieces 1-3, and the fourth fastening pieces 1-3 are arranged on the left side wall and the right side wall of the base 1 so as to fix two ends of the magnetic block 4; the clamping block 5-1, the magnetic block 4 and the stop block 9 are used for fixing the semiconductor laser together, so that the semiconductor laser 8 is prevented from shaking in the gold wire bonding process, and the accuracy of process data is ensured.
The right side wall of the base 1 is provided with first threaded holes 1-5, the first threaded holes 1-5 are arranged between the two fourth fasteners 1-3, the pushing mechanism comprises a pushing block 2 and an adjusting bolt 3, the pushing block 2 is fixedly arranged on the lower portion of the sliding plate 5 through a fixing piece 6, and the adjusting bolt 3 penetrates through the pushing block 2 and then is in threaded connection with the base 1. The adjusting bolt 3 is screwed to push the clamping block 5-1 to synchronously approach the stop block 9.
A sliding chute 1-4 is arranged between the two clamping grooves 1-2, the sliding chute 1-4 is arranged in the middle of the base 1, and a connecting reset mechanism is arranged in the sliding chute 1-4; the middle part of the sliding plate 5 is provided with a connecting hole which is arranged in parallel with the clamping groove 1-2; the upper part of the connection resetting mechanism is fixedly connected with the sliding plate 5 through a connecting hole, the lower part of the connection resetting mechanism is arranged in the sliding grooves 1-4 in a sliding mode, the connection resetting mechanism is in contact with the adjusting bolt 3, the adjusting bolt 3 is rotated to push the connection resetting mechanism to slide in the sliding grooves 1-4, the sliding plate 5 is driven to synchronously slide along the base 1, the semiconductor laser is further fixed, and the sliding direction of the connection resetting mechanism is consistent with the sliding direction of the sliding plate 5.
As shown in fig. 3, the connection resetting mechanism includes a sliding block 12 and an elastic member 11, the elastic member 11 and the sliding block 12 are respectively disposed at the left and right sides of the sliding slot 1-4, one end of the elastic member 11 is fixedly connected with the left side wall of the sliding slot 1-4, the other end of the elastic member 11 is fixedly connected with one end of the sliding block 12, and the other end of the sliding block 12 is in contact with the adjusting bolt 3 through the first threaded hole 1-5, so that the sliding block 12 is conveniently pushed to move by adjusting the adjusting bolt 3; the upper part of the sliding block 12 is fixedly connected with the sliding plate 5 through a connecting piece, the connecting piece comprises at least two first fastening pieces 7, the two first fastening pieces 7 are symmetrically arranged along the sliding direction of the sliding plate 5, and the sliding plate 5 and the sliding block 12 are fixed after the two first fastening pieces 7 are inserted into the connecting holes. When the semiconductor laser 8 needs to be fixed, the adjusting bolt 3 is screwed to push the sliding block 12, the first fastening piece 7, the sliding plate 5 and the clamping block 5-1 to synchronously slide along the direction parallel to the clamping groove 1-2, and the elastic piece 11 is compressed; when the semiconductor laser 8 needs to be disassembled, the adjusting bolt 3, the sliding block 12, the first fastening piece 7, the sliding plate 5 and the clamping block 5-1 are reversely adjusted to move rightwards under the elastic action of the elastic piece 11, and the semiconductor laser 8 is taken out.
A guide rail 13 is fixedly arranged in the sliding chute 1-4, the left side and the right side of the sliding chute 1-4 are symmetrically provided with a sliding rail through hole 1-8 and a sliding rail groove, the sliding rail through hole 1-8 and the sliding rail groove are communicated with the sliding chute 1-4, the guide rail 13 is conveniently inserted into the sliding chute 1-4 and the sliding rail groove from the sliding rail through hole 1-8, the guide rail 13 is arranged along the direction parallel to the clamping groove 1-2, the left side and the right side of the sliding chute 1-4 are symmetrically provided with a second threaded hole 1-6, and the guide rail 13 is fixed with the base 1 through a positioning piece 14 and the second threaded hole 1-6; the sliding block 12 and the elastic piece 11 are sleeved on the guide rail 13, and the guide rail 13 plays a role in guiding the sliding block 12 and the elastic piece 11; the sliding block 12, the sliding rail groove and the first threaded hole 1-5 are arranged on the same side of the base 1, and the adjusting bolt 3 is in threaded connection with the first threaded hole 1-5, so that the position of the sliding block 12 can be conveniently adjusted by adjusting the adjusting bolt 3.
In this embodiment, the fourth fastening members 1 TO 3, the fixing member 6, the first fastening member 7, and the second fastening member 10 are all bolts, the elastic member 11 is a spring, the positioning member 14 is a jackscrew, and the semiconductor laser 8 is a TO laser.
When a gold wire bonding process is required TO be carried out, the adjusting bolt 3 is rotated TO move the sliding plate 5 outwards, the TO laser is sequentially inserted into the clamping groove 1-2 and just placed on the upper surface of the magnet 4, then the adjusting bolt 3 is screwed TO enable the clamping block 5-1 TO tightly prop the upper part of the TO laser in the positioning groove 9-1 of the stop block 9, so that the position of the TO laser is stable and does not shake, and the stable operation of the gold wire bonding process is ensured; after the process is finished, the adjusting bolt 3 is rotated reversely, the clamping block 5-1 is separated from the TO laser, and finally the TO laser is taken out one by one.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a semiconductor laser fixing device, includes base (1), its characterized in that, be equipped with laser positioning mechanism on base (1), laser positioning mechanism cooperatees with laser clamping mechanism, and laser clamping mechanism slides through pushing mechanism and sets up on base (1), and pushing mechanism is connected with base (1).
2. The semiconductor laser fixing device according to claim 1, wherein the laser positioning mechanism comprises a stopper (9) for positioning the semiconductor laser (8), the base (1) is symmetrically provided with slots (1-2) for inserting the semiconductor laser (8), the stoppers (9) are sequentially arranged along the direction of the slots (1-2), the stopper (9) is fixedly connected with the base (1), and the laser clamping mechanism slides along the direction of the slots (1-2) and is matched with the stopper (9).
3. A semiconductor laser fixing device according to claim 2, characterized in that one side of the stopper (9) is provided with a positioning groove (9-1) matching with the semiconductor laser (8).
4. A semiconductor laser fixing device according to claim 3, characterized in that a magnetic block (4) for adsorbing the semiconductor laser (8) is laid at the bottom of the card slot (1-2), and the distance from the upper surface of the magnetic block (4) to the top of the card slot (1-2) is consistent with the length of the pin of the semiconductor laser (8).
5. The semiconductor laser fixing device according to any one of claims 2 to 4, wherein the laser clamping mechanism comprises a sliding plate (5), the sliding plate (5) is slidably arranged on the upper portion of the base (1), clamping blocks (5-1) are symmetrically and fixedly arranged on two sides of the sliding plate (5), the clamping blocks (5-1) correspond to the stop blocks (9) in a one-to-one mode, and the sliding plate (5) is connected with the base (1) through a pushing mechanism.
6. The semiconductor laser fixing device according to claim 5, wherein the pushing mechanism comprises a pushing block (2) and an adjusting bolt (3), the pushing block (2) is fixedly arranged at the lower part of the sliding plate (5), and the adjusting bolt (3) penetrates through the pushing block (2) and then is in threaded connection with the base (1).
7. A semiconductor laser fixing device according to claim 1 or 6, characterized in that a sliding groove (1-4) is formed in the middle of the base (1), a connection resetting mechanism is slidably arranged in the sliding groove (1-4), the connection resetting mechanism is in contact with the pushing mechanism, the connection resetting mechanism is fixedly connected with the laser clamping mechanism, and the sliding direction of the connection resetting mechanism is consistent with the sliding direction of the laser clamping mechanism.
8. The semiconductor laser fixing device according to claim 7, wherein the connection resetting mechanism comprises a sliding block (12) and an elastic member (11), the sliding block (12) and the elastic member (11) are respectively arranged at two sides of the sliding grooves (1-4), one end of the elastic member (11) is fixedly connected with the side walls of the sliding grooves (1-4), the other end of the elastic member (11) is fixedly connected with one end of the sliding block (12), and the other end of the sliding block (12) is contacted with the pushing mechanism; the upper part of the sliding block (12) is fixedly connected with the laser clamping mechanism through a connecting piece, and the sliding direction of the sliding block (12) is consistent with that of the laser clamping mechanism.
9. The semiconductor laser fixing device according to claim 8, wherein a guide rail (13) is fixedly arranged in the sliding groove (1-4), and the sliding block (12) and the elastic member (11) are sleeved on the guide rail (13).
10. A semiconductor laser fixing device according to claim 8 or 9, characterized in that the connecting member comprises at least two first fastening members (7), the two first fastening members (7) are symmetrically arranged in the middle of the laser clamping mechanism, and the laser clamping mechanism is fixedly connected with the sliding block (12) through the first fastening members (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021237367.2U CN212209457U (en) | 2020-06-30 | 2020-06-30 | Semiconductor laser fixing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021237367.2U CN212209457U (en) | 2020-06-30 | 2020-06-30 | Semiconductor laser fixing device |
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| Publication Number | Publication Date |
|---|---|
| CN212209457U true CN212209457U (en) | 2020-12-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021237367.2U Active CN212209457U (en) | 2020-06-30 | 2020-06-30 | Semiconductor laser fixing device |
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| CN (1) | CN212209457U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113793830A (en) * | 2021-08-03 | 2021-12-14 | 恩纳基智能科技无锡有限公司 | Equipment is transplanted to intelligence of automatic alignment based on chip production |
| CN116759884A (en) * | 2023-08-21 | 2023-09-15 | 中久光电产业有限公司 | Semiconductor laser fixing device |
-
2020
- 2020-06-30 CN CN202021237367.2U patent/CN212209457U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113793830A (en) * | 2021-08-03 | 2021-12-14 | 恩纳基智能科技无锡有限公司 | Equipment is transplanted to intelligence of automatic alignment based on chip production |
| CN113793830B (en) * | 2021-08-03 | 2023-07-14 | 恩纳基智能科技无锡有限公司 | Automatic alignment intelligent transplanting equipment based on chip production |
| CN116759884A (en) * | 2023-08-21 | 2023-09-15 | 中久光电产业有限公司 | Semiconductor laser fixing device |
| CN116759884B (en) * | 2023-08-21 | 2023-11-24 | 中久光电产业有限公司 | Semiconductor laser fixing device |
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