CN116711061A - Wafer holding device - Google Patents
Wafer holding device Download PDFInfo
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- CN116711061A CN116711061A CN202180088991.1A CN202180088991A CN116711061A CN 116711061 A CN116711061 A CN 116711061A CN 202180088991 A CN202180088991 A CN 202180088991A CN 116711061 A CN116711061 A CN 116711061A
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Provided is a wafer holding device which can reliably hold a wafer which is likely to warp or deform in a desired posture even when only a part of the lower peripheral part of the wafer is allowed to contact. Specifically, the wafer holding device receives a wafer in a horizontal state and holds the wafer in a predetermined posture, and is characterized by comprising: a first support portion for supporting, from below, a first support portion provided in a contact allowing region of a lower portion of an outer periphery of the wafer; a second support portion that supports the second support portion from below; a third support portion that supports the third support portion; a first lifting part; a second lifting part; a negative pressure suction unit; and a control unit having at least a first support mode, a second support mode, and a third support mode, wherein the control unit switches to the third support mode after switching from the first support mode to the second support mode in a state in which the wafer received in the first support mode is sucked and held.
Description
Technical Field
The present invention relates to a wafer holding device that receives a wafer (a substantially circular thin plate) conveyed by a conveyor or the like in a horizontal state and holds the wafer in a predetermined posture. For example, the wafer holding device is used in a processing device for processing and handling wafers, an appearance inspection device for photographing and inspecting the appearance of device chips formed on wafers, and the like.
Background
As a semiconductor device, a plurality of semiconductor device circuits (i.e., a repetitive external pattern of device chips) are layered and formed on 1 semiconductor wafer, and then singulated into individual chip components, and the chip components are packaged and shipped as electronic components as individual units or assembled into an electrical product.
Then, before singulating each chip component, an inspection image obtained by photographing a repetitive appearance pattern of a device chip formed on a wafer is compared with a reference image, and inspection regarding whether each chip component is acceptable or not is performed (for example, patent document 1).
Then, the wafer to be inspected is transported from the cassette carrier or the like to the visual inspection apparatus by an automatic transport device called a carrier, and the inspected substrate is taken out and the non-inspected substrate is transferred.
In general, a wafer to be inspected by an appearance inspection device is supported by a wafer holder having a flat upper surface, and is sucked and held from a lower surface side, for example, to perform photographing and inspection (for example, patent document 2).
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2007-155610
Disclosure of Invention
Problems to be solved by the invention
However, when there are functional regions on the upper and lower surfaces of the wafer to be held, in which film formation such as wiring patterns is formed, the entire lower surface of the wafer is prevented from being supported by the flat wafer holding table. In addition, posture correction by bringing the pressing member into contact with the wafer from the upper surface side, pressurization by blowing or the like, posture correction, and the like may be inhibited.
In addition, when the wafer to be inspected is a thin plate or has residual stress, even if the outer periphery of the wafer is to be held in a flat posture, warpage or deformation is likely to occur, and therefore, a part of the outer periphery of the wafer may be in a floating state, and may not be held in a desired posture.
The present invention has been made in view of the above-described problems, and an object thereof is to provide a wafer holding device capable of reliably holding a wafer that is likely to warp or deform in a desired posture even when only a part of the lower peripheral portion of the wafer is allowed to contact.
Means for solving the problems
In order to solve the above problems, one aspect of the present invention is a wafer holding apparatus that receives a wafer in a horizontal state and holds the wafer in a predetermined posture, comprising: a first support portion that supports a first support portion from below, the first support portion being distributed and set at least at 3 places so as to surround the center of a wafer in a contact permission area set at a lower portion of an outer periphery of the wafer; a second support portion that supports a second support portion from below, the second support portion being provided at a position in the contact allowing region that supplements between the first support portions; a third support portion that supports a third support portion from below, the third support portion being provided at a position in the contact allowing region that supplements between the first support portion and the second support portion; a first lifting part which changes the relative height between the upper end of the first supporting part and the upper end of the second supporting part; a second lifting part for changing the relative height between the upper end of the second supporting part and the upper end of the third supporting part; a negative pressure suction unit for generating a negative pressure at the first support portion to suction and hold the wafer; and a control unit that controls the change of the relative height of the first lifting unit and the second lifting unit and the switching of the suction holding or releasing by the negative pressure suction unit, wherein the control unit has at least a first support mode, a second support mode, and a third support mode, and the control unit switches from the first support mode to the second support mode and then to the third support mode in a state in which the wafer received in the first support mode is held by suction, wherein the upper end of the first support unit is arranged at a position higher than the heights of the upper ends of the second support unit and the third support unit, and wherein the upper ends of the first support unit and the second support unit are arranged at the same height in the second support mode, and wherein the heights of the upper ends of the first support unit and the second support unit are arranged at the same height as the heights of the upper ends of the third support unit in the third support mode.
According to the above aspect, since the portion or the area for supporting the wafer can be increased in stages, even in the case of a wafer which is likely to be warped or deformed, the localized outer peripheral portion can be prevented from floating up, and the outer peripheral portion can be held in a desired posture.
Effects of the invention
When a wafer which is likely to be warped or deformed is held, the wafer can be reliably held in a desired posture even when only a part of the lower peripheral portion of the wafer is allowed to be in contact.
Drawings
Fig. 1 is a perspective view showing an example of a wafer holding device in an embodiment of the present invention.
Fig. 2 is a plan view showing an example of a wafer holding device in an embodiment of the present invention.
Fig. 3 is a block diagram showing an example of a wafer holding device in an embodiment of the present invention.
Fig. 4 is a cross-sectional view showing an example of a wafer holding device in an embodiment of the present invention.
Fig. 5 is a flowchart showing an example of an operation flow in the mode of implementing the present invention.
Fig. 6 is a perspective view showing an example of a wafer holding device according to another embodiment of the present invention.
Fig. 7 is a cross-sectional view showing an example of a wafer holding device according to another embodiment of the present invention.
Fig. 8 is a flowchart showing an example of an operation flow in another embodiment of the present invention.
Fig. 9 is a cross-sectional view showing an example of a wafer holding device according to still another embodiment of the present invention.
Fig. 10 is a flowchart showing an example of an operation flow in a further embodiment of the present invention.
Detailed Description
Hereinafter, modes for carrying out the present invention will be described with reference to the drawings. In the following description, the 3 axes of the orthogonal coordinate system are X, Y, Z, the horizontal direction is represented as the X direction and the Y direction, and the direction perpendicular to the XY plane (i.e., the gravity direction) is represented as the Z direction. The Z direction is expressed as an upward direction opposite to the gravity, and the direction in which the gravity acts is expressed as a downward direction.
Fig. 1 is a perspective view showing an example of a wafer holding device in an embodiment of the present invention. Fig. 2 is a plan view showing an example of a wafer holding device in an embodiment of the present invention. Fig. 1 and 2 show the respective parts and arrangement examples of the wafer holding device 1 according to the present invention. Fig. 3 is a block diagram showing an example of a wafer holding device in an embodiment of the present invention. Fig. 3 illustrates the relationship between each part and the control part constituting the wafer holding device 1 of the present invention.
The wafer holding apparatus 1 receives a wafer W, which is transported by a carrier or the like, not shown, in a horizontal state, and holds the wafer W in a predetermined posture. The wafer W to be held is not allowed to be contacted in a region where the circuit pattern is formed or a region where functional film formation is performed (a region substantially inside the outer edge and a part of the periphery thereof), so that adhesion, damage, dishing, and the like of dirt, foreign matter, and the like are prevented from occurring. On the other hand, the outer sides of these regions (the outer edges and a part of the periphery thereof) are referred to as contact allowing regions R, and allow contact for operation and the like.
Specifically, the wafer holding apparatus 1 includes a first support portion 2, a second support portion 3, a third support portion 4, a first elevating portion 5, a second elevating portion 6, a negative pressure suction portion 8, a control portion 9, and the like.
The first support portion 2 supports, from below, the first support portion S1 set at least 3 positions so as to surround the center Wc of the wafer W in the contact permission region R set at the outer peripheral lower portion Wb of the wafer W. Specifically, the first support portion 2 includes a first contact support portion 21, a strut 22, a connecting portion 23, and the like.
The first contact support portion 21 contacts the first support portion S1 of the outer peripheral lower portion Wb of the wafer W, and supports and holds the first support portion S1 from below.
Specifically, when the center Wc of the wafer W is used as a reference in a plan view, the first support portions S1 are distributed and set at 3 positions at about 120-degree intervals, and the first contact support portions 21 are disposed at 3 positions so as to correspond to the portions S1 in position.
More specifically, the first contact support portion 21 is disposed at the upper end of the first support portion 2, and is configured to have an air communication port (for example, a tubular shape) for communicating the upper end with air, and is configured to be made of metal, resin, rubber, or the like.
The support column 22 matches the upper end position of the first contact support portion 21 with a predetermined height. Specifically, the support 22 is formed of a rod-shaped member having a predetermined length in the thickness direction (Z direction) of the wafer W.
The connecting portions 23 fix the lower portions of the struts 22, respectively, and are connected to the first elevating portions 5. Specifically, the connecting portion 23 is formed of a plate-like member having a substantially Y-shape in a plan view and extending radially from the vicinity of the center.
The second support portion 3 supports the second support portion S2 from below, and the second support portion S2 is set at a position that supplements the first support portion S1 in the contact permission region R provided at the outer peripheral lower portion Wb of the wafer W. Specifically, the second support portion 3 includes a second contact support portion 31, a strut 32, a connecting portion 33, and the like.
The second contact support portion 31 contacts a second support portion S2 provided at a position for supplementing the first support portion S1 of the outer peripheral lower portion Wb of the wafer W, and supports the second support portion S2 from below.
Specifically, when the center Wc of the wafer W is set as a reference in a plan view, the second support portion S2 is set at 3 positions allocated at positions offset by about 60 degrees from the first support portion S1, and the second contact support portion 31 is arranged at positions corresponding to these portions S2.
More specifically, the second contact support portion 31 is disposed at the upper end of the second support portion 3, and is formed of metal, resin, rubber, or the like, and has a structure (for example, a cylindrical shape) having an air communication port for communicating the upper end with air.
The support post 32 matches the upper end position of the second contact support portion 31 with a predetermined height. Specifically, the support column 32 is formed of a rod-shaped member having a predetermined length in the thickness direction (Z direction) of the wafer W.
The connecting portions 33 fix the lower portions of the struts 32, respectively, and are connected to the second elevating portion 6. Specifically, the connecting portion 33 is formed of a plate-like member having a substantially Y-shape in a plan view and extending radially from the vicinity of the center.
The third support portion 4 supports the third support portion S3 from below, and the third support portion S3 is set at a position that supplements between the first support portion S1 and the second support portion S2 in the contact permission region R provided at the outer peripheral lower portion Wb of the wafer W. Specifically, the third support portion 4 includes a third contact support portion 41, a stay 42, an arc-shaped contact support portion 43, and the like.
The third contact support 41 contacts at least a part (circular area) of the third support portion S3 provided at a position for supplementing the space between the first support portion S1 and the second support portion S2 of the outer peripheral lower portion Wb of the wafer W, and supports the third support portion S3 from below.
Specifically, the third contact support portion 41 is disposed at 6 positions offset by about 30 degrees from the first contact support portion 21 or the second contact support portion 31 when the center Wc of the wafer W is used as a reference in a plan view.
More specifically, the third contact support portion 41 is disposed at the upper end of the third support portion 4, and is configured to have an air communication port (for example, a tubular shape) for communicating the upper end with air, and is configured to be made of metal, resin, rubber, or the like.
The support column 42 matches the upper end position of the second contact support portion 31 with a predetermined height.
Specifically, the support column 42 is formed of a rod-shaped member having a predetermined length in the thickness direction (Z direction) of the wafer W.
The arc-shaped contact supporting portion 43 contacts an arc-shaped region of the third supporting portion S3, and supports the region from below, and the third supporting portion S3 is set at a position that supplements between the first supporting portion S1 and the second supporting portion S2 in the contact permission region R provided at the outer peripheral lower portion Wb of the wafer W. The arc-shaped contact support portion 43 is disposed so that the upper end thereof is set to the same height as the upper end of the third contact support portion 41.
Specifically, when the center Wc of the wafer W is used as a reference in a plan view, the arc-shaped contact supporting portion 43 is provided with an arc-shaped member along the outer edge shape of the wafer W at a position (for example, at 12) where the gaps of the first contact supporting portion 21, the second contact supporting portion 31, and the third contact supporting portion 41 are filled.
More specifically, the arc-shaped contact support portion 43 is made of metal, resin, rubber, or the like, and is attached to the device frame 1f via a coupling member or the like, not shown.
The "same height" includes not only a state of the same height in micrometers but also a state considered to be the same in a range where there is no obstacle when processing the wafer W, and may include a slight error in the up-down direction (for example, an error in millimeter units due to deformation of the elastic member) (hereinafter, the same applies).
The first elevating section 5 changes the relative height between the upper end of the first support section 2 and the upper end of the second support section 3.
Specifically, the first elevating section 5 elevates the first support section 2 in the thickness direction (Z direction) of the wafer W, and includes a lever 51 for elevating the connecting member 23 of the first support section 2 in the up-down direction (Z direction), a main body 52 attached to the frame 1f, and the like.
More specifically, the first elevating section 5 is configured by a mechanism (so-called actuator) that converts rotational motion of a rack-and-pinion mechanism, a cam mechanism, or the like into linear motion, and includes a motor (a stepping motor, a servo motor, or the like) that performs rotational motion. The motor is connected to the control unit 8 and rotates at a predetermined rotational speed or is stationary at a predetermined angle. Therefore, the first elevating section 5 can move the lever 51 at a predetermined speed or at a predetermined position based on a control signal from the control section 8. Therefore, the first elevating portion 5 can move the first support portion 2 in the up-down direction or stationary at a predetermined height.
The second elevating section 6 changes the relative height between the upper end of the second support section 3 and the upper end of the third support section 4.
Specifically, the second elevating section 6 elevates the second support section 4 in the thickness direction (Z direction) of the wafer W, and includes a lever 61 for elevating the connecting member 33 of the second support section 3 in the up-down direction (Z direction), a main body 62 attached to the frame 1f, and the like.
More specifically, the second elevating section 6 has the same configuration as the first elevating section 5, and can move the lever 61 at a predetermined speed or at a predetermined position based on a control signal from the control section 8. Therefore, the second elevating portion 6 can move the second support portion 3 in the up-down direction or stationary at a predetermined height.
The negative pressure suction unit 8 generates a negative pressure in the first support portion S1, the second support portion S2, and the third support portion S3 to suction and hold the wafer W.
Specifically, the negative pressure suction unit 8 sucks and holds the wafer W by generating negative pressure at the upper ends of the first support unit 2, the second support unit 3, and the third support unit 4, which are in contact with the lower peripheral portion Wb of the wafer W.
More specifically, the negative pressure suction portion 8 is constituted by an air pipe, a switching valve, a negative pressure generating unit, and the like connected to the air communication ports of the first, second, and third contact support portions 21, 31, and 41.
The switching valve is connected to the control unit 8 so as to switch between communication between the air communication ports of the first contact support portion 21, the second contact support portion 31, and the third contact support portion 41 and the negative pressure generating means (i.e., suction holding) and communication between the air communication ports and the atmosphere (i.e., suction releasing).
Examples of the negative pressure generating means include a vacuum pump, an ejector, a pressure tank connected to them, and a pipe for connection.
The first, second, and third contact support portions 21, 31, 41 are connected to a negative pressure generating means such as a vacuum pump via a switching valve or the like. The first, second, and third contact support portions 21, 31, and 41 can be switched to a negative pressure state or an atmosphere release state by controlling a switching valve or the like by the control portion 8, and the wafer W can be held or released.
The control unit 9 controls the change of the relative heights of the first elevating unit 5 and the second elevating unit 6. Further, the control unit 9 controls switching between suction holding and release of the negative pressure suction unit 8.
Specifically, the control unit 9 controls the motors of the first elevating unit 5 and the second elevating unit 6 to change the height of the support wafer W to the upper stage position H, the middle stage position M, and the lower stage position L. The control unit 9 has a first support mode for switching to the upper stage position H, a second support mode for switching to the middle stage position M, and a third support mode for switching to the lower stage position L, and can switch to these support modes. The upper stage position H/middle stage position M/lower stage position L herein is defined by the positional relationship between the upper ends of the first support portion 2, the second support portion 3, and the third support portion 4, regardless of the difference in height at which the wafer W is supported.
More specifically, the control unit 9 is configured by a computer, a programmable logic controller, or the like (i.e., hardware), an execution program thereof, or the like (i.e., software), and is configured to input and output control signals to and from the respective units (the motors of the first elevating unit 5 and the second elevating unit 5, the switching valve of the negative pressure suction unit 8, and the like) to be controlled, and to perform predetermined control processing.
Fig. 4 is a cross-sectional view showing an example of a wafer holding device in an embodiment of the present invention. Fig. 4 (a) shows a case where the wafer W is supported at the upper stage position H.
Fig. 4 (b) shows a case where the wafer W is supported at the middle position M.
Fig. 4 (c) shows a case where the wafer W is supported at the lower stage position L.
The upper stage position is a positional relationship in which the upper end of the first support portion 2 is disposed above the height of the upper ends of the second support portion 3 and the third support portion 4. The mode of shifting to such a state and maintaining the state is referred to as a "first support mode".
Specifically, in the first support mode, the upper end of the first contact holding portion 21 is disposed at a position higher than the heights of the upper ends of the second contact holding portion 31 and the third contact holding portion 41.
When the wafer W is lowered from above in the first support mode (upper stage position) and transferred, the first contact holding portion 21 contacts the first support portion S1 of the wafer W, but the second support portion S2 is separated from the second contact holding portion 31, and the third support portion S3 and the third contact holding portion 41. At this time, the wafer W supported at the lower peripheral portion at 3 is easily deflected, and a portion of the wafer W other than the first support portion S1 (for example, the second support portion S2) often falls.
The middle position is a positional relationship in which the upper end of the first support portion 2 and the upper end of the second support portion 3 are disposed at the same level, and the upper end of the third support portion 4 is located above the upper end. The mode of shifting to such a state and maintaining the state is referred to as a "second support mode".
Specifically, in the second support mode, the upper end of the first support portion 2 and the upper end of the second support portion 3 are disposed at the same height above the height of the upper end of the third contact holding portion 41.
When the wafer W is switched from the first support mode (upper stage position) to the second support mode (middle stage position), the first support portion S1 of the wafer W is in contact with the first contact holding portion 21, and the second support portion S2 is in contact with the second contact holding portion 31. That is, the number of portions for supporting the outer peripheral lower portion Wb of the wafer W increases, and the interval between the supports becomes narrower.
At this time, the deflection of the wafer W supported at 6 on the outer peripheral lower portion is improved, and sagging of the wafer W at portions other than the first support portion S1 and the second support portion S2 (for example, the third support portion S3 and the like) is reduced.
The lower stage position is a positional relationship in which the heights of the upper ends of the first support portion 2 and the second support portion 3 are arranged at the same height as the height of the upper end of the third support portion 4. The mode of shifting to such a state and maintaining the state is referred to as a "third support mode".
Specifically, in the third support mode, the upper ends of the first and second abutment holding parts 21 and 31 are arranged to have the same height as the upper end of the third abutment holding part 41.
When the wafer W is switched from the second support mode (middle position) to the third support mode (lower position), the first support portion S1 of the wafer W is brought into contact with the first contact holding portion 21, and the second support portion S2 is brought into contact with the second contact holding portion 31, and further, the third support portion S3 is brought into contact with the third contact holding portion 41.
At this time, since the lower peripheral portion of the wafer W is supported over the entire peripheral region, the central portion Wc is recessed by its own weight, but if only the peripheral portion is focused on, sagging is improved and supported in a flat state.
< action flow >)
Fig. 5 is a flowchart showing an example of an operation flow in the mode of implementing the present invention.
First, if the wafer holding device 1 is capable of receiving the wafer W, the control unit 9 is switched to the first support mode (upper stage position) and stands by (step s 1).
Then, the wafer W is placed thereon (step S2), and the first support portion S1 of the wafer W is sucked and held (step S3).
Then, the first and second raising/lowering units 5 and 6 are controlled to switch to the second support mode (middle position) (step s 4), and then to switch to the third support mode (lower position) (step s 5). When the first support mode (upper stage position) is switched to the second support mode (middle stage position), the second support site S2 is caused to generate negative pressure to suction and hold the wafer W, and when the second support mode (middle stage position) is switched to the third support mode (lower stage position), the third support site S3 is caused to generate negative pressure to suction and hold the wafer W.
Thereafter, a desired process, inspection, or the like is performed (step s 6), and it is determined whether the process or the like is ended (step s 7). Then, if the processing or the like is not completed, the above-described step s6 is continued, and if the processing or the like is completed, a series of flows is completed.
With such a configuration, the wafer holding apparatus 1 according to the present invention can increase the area and the portion for supporting the wafer W in stages, and thus can prevent the local outer peripheral portion from floating up and hold the outer peripheral portion in a desired posture even for the wafer W that is likely to be warped or deformed. Therefore, when a wafer that is likely to be warped or deformed is held, the wafer can be reliably held in a desired posture even when only a part of the lower peripheral portion of the wafer is allowed to be contacted.
Modification example
(concerning the third supporting portion 4)
In the above description, the third support portion 4 is exemplified as a structure including the third contact support portion 41 and the arc-shaped contact support portion 43. In this case, the third support portion S3 is set to have an arc shape along the outer edge shape of the wafer W to be held.
With this configuration, most of the contact permission region R set in the lower portion Wb of the outer periphery of the wafer W can be supported, and it is more preferable to support the wafer in an extremely flat state.
However, the third support portion 4 is not limited to such a structure, and the present invention can be realized by other structures.
For example, the third contact support portion 41 may be omitted, and the arc-shaped contact support portion 43 may be disposed so as to be separated from each other at a plurality of positions. Alternatively, the arc-shaped contact support portion 43 may be omitted, and the third contact support portion 41 may be disposed at a plurality of positions so as to be separated from each other. In such a configuration, the contact permission region R set in the lower portion Wb of the outer periphery of the wafer W is supported at a plurality of locations throughout the entire periphery, so that the wafer W can be reliably held in a desired posture.
In the above, the following configuration is exemplified: when the center Wc of the wafer W is used as a reference in a plan view, the first support portion S1 and the second support portion S2 are set at positions spaced apart from each other by 60 degrees, the third support portion S3 is set at a position complementary to the first support portion S1 to the second support portion S3, and the first contact support portion 21, the second contact support portion 31, the third contact support portion 41, and the arc-shaped contact support portion 43 are disposed at positions corresponding to the portions S1 to S3. In such a configuration, the outer periphery of the wafer W is preferably distributed uniformly and supported from below, and warpage of the outer periphery of the wafer is easily improved when the supporting state is switched from the upper stage position to the middle stage position and the lower stage position. However, the first support portion S1 and the second support portion S2 are not limited to such an equal arrangement, and may be appropriately modified. The first support portion S1 may be set at four or more locations, or the second support portion S2 may be set at four or more locations. These support points may be appropriately determined according to the thickness, the deformation amount, the residual stress, and the like of the wafer W.
(concerning the negative pressure suction portion 8)
In the above description, the negative pressure suction unit 8 is exemplified by a structure in which the first support portion S1, the second support portion S2, and the third support portion S3 are subjected to negative pressure to suction and hold the wafer W. In addition, the following flow is illustrated: the control unit 9 generates negative pressure in the second support portion S2 to suction and hold the wafer W when switching to the second support mode (middle position), and generates negative pressure in the third support portion S3 to suction and hold the wafer W when switching to the third support mode (lower position).
According to this configuration, even if the contact permission region R set in the lower peripheral portion Wb of the wafer W is short in width (i.e., the length in the radial direction), the portion and the area of negative pressure suction can be increased. Therefore, even if the pressure for suction holding the wafer W is set to be low, the holding force can be improved as a whole, and the wafer W is preferably not easily detached even if an external force is applied during holding.
However, the negative pressure suction unit 8 is not limited to such a configuration, and the present invention can be realized by other configurations. For example, the arc-shaped contact support portion 43 may be made of a porous material, or a groove or a fine hole may be provided in the upper surface of the arc-shaped contact support portion 43 to communicate air, and the arc-shaped contact support portion may be connected to the negative pressure generating means in the same manner as the third contact support portion 41. This can further increase the area and the portion to be sucked by the negative pressure. Therefore, even if the pressure for suction holding the wafer W is set to be low, the holding force can be improved as a whole, and the wafer W is more preferably not easily detached even if an external force is applied during holding.
Alternatively, a structure may be employed in which only the first support portion S1 is subjected to negative pressure, or a structure in which the first support portion S1 and the second support portion S2 are subjected to negative pressure. In such a configuration, the negative pressure suction force also acts on the contact permission region R set in the outer peripheral lower portion Wb of the wafer W, so that the wafer W can be reliably held in a desired posture.
(concerning the first support portion 2 and the second support portion 3)
In the above description, the strut 32 of the second support portion 3 is longer than the strut 22 of the first support portion 2, and the coupling member 23 of the first support portion 2 is disposed above the coupling member 33 of the second support portion 3. However, the first support portion 2 and the second support portion 3 are not limited to such a structure, and the present invention can be realized by other structures. For example, the connecting member 23 of the first support portion 2 may be arranged below the connecting member 33 of the second support portion 3, so that the support column 22 of the first support portion 2 is longer than the support column 32 of the second support portion 3. At this time, the length of the stay 22 of the first support portion 2 is set in consideration of a gap in which the connecting member 23 and the connecting member 33 do not interfere with each other due to the change of the upper stage position and the middle stage position.
In the above description, the first elevating section 5 and the second elevating section 6 are independently attached to the apparatus frame 1f, and the first elevating section 5 and the second elevating section 6 are each provided with a motor. With such a configuration, the rotation angle, rotation speed, and the like of the motor can be controlled, and the positions, movement speeds, and the like of the upper ends of the first support portion 2 and the second support portion 3 can be finely controlled, which is preferable.
However, the first elevating section 5 and the second elevating section 6 are not limited to such a configuration, and the present invention can be realized even in other configurations. For example, the first elevating portion 5 may be attached to the connecting member 33 of the second support portion 3 (so-called two-stage overlapping structure). In this case, the first elevating unit 5 and the second elevating unit 6 may be elevating mechanisms based on rotation of the motor, or actuators such as cylinders may be used.
In the above description, the first elevating section 5 is configured to elevate the first support section 2 in the thickness direction (Z direction) of the wafer W, and the second elevating section 6 is configured to elevate the second support section 3 in the thickness direction (Z direction) of the wafer W. According to this configuration, the wafer W is lowered from the upper stage position H to the middle stage position M, and the wafer W is lowered from the middle stage position M to the lower stage position L, so that the center of gravity at the lower stage position can be lowered downward. In addition, since the lifting operation is performed by a unit having a relatively small number of components and a light weight, the actuators of the first lifting portion 6 and the second lifting portion 7 can be miniaturized. Therefore, the wafer holding device 1 is preferably assembled and used in an inspection device, a processing device, or the like.
However, the first elevating portion 5 and the second elevating portion 6 are not limited to such a configuration, and may be configured as described below. For example, the first support portion 3 may be fixed, the second support portion 3 may be lifted by the first lifting portion 5, and the third support portion 4 may be lifted by the second lifting portion 6 (so-called lifting structure).
In this case, the second support portion 3 and the third support portion 4 are lowered, and the state in which the upper end of the first support portion 3 is uppermost is defined as an upper stage position H. The state in which the second support portion 3 is raised while the third support portion 4 is kept lowered and the upper ends of the first support portion 3 and the second support portion 4 are located above the upper end of the third support portion 4 is defined as a middle position. The state in which the second support portion 3 and the third support portion 4 are raised and the upper ends of the first support portion 3, the second support portion 4, and the third support portion 4 are at the same height is defined as a lower stage position.
In the above, the first lifting/lowering portion 5 is exemplified by a structure in which the connecting member 23 of the first support portion 2 is lifted and lowered in the vertical direction by one actuator. According to this configuration, the plurality of sets of the first contact supporting portions 21 and the stay 22 can be lifted and lowered integrally. However, the first raising/lowering portion 5 is not limited to such a configuration, and may be configured to raise and lower the plurality of sets of the first abutment support portions 21 and the stay 22 independently. In this configuration, the coupling member 23 does not need to be provided in the first support portion 2, and the second support portion 3 can be designed without fear of interference with the coupling member 33.
In the above, the second lifting/lowering portion 6 is exemplified as a structure in which the coupling member 33 of the second support portion 3 is lifted and lowered in the up-down direction by one actuator. With this configuration, the plurality of sets of the second contact supporting portions 31 and the stay 32 can be lifted and lowered integrally. However, the second raising and lowering portion 6 is not limited to this, and may be configured to raise and lower the plurality of sets of the second contact supporting portion 31 and the stay 32 independently. In this configuration, the coupling member 33 does not need to be provided in the second support portion 3, and the first support portion 2 can be designed without fear of interference with the coupling member 23.
In the above description, the configuration having the first support portion 2, the second support portion 3, and the third support portion 4 is exemplified, and the control portion 9 is switched to the third support mode after switching from the first support mode to the second support mode. However, in addition to the application of the present invention, a plurality of support portions and a lifting portion for changing the relative height of the upper ends thereof may be provided at a finer pitch, and the wafer may be supported while increasing the number of support points by the control portion.
(the following is a national addition)
The mode in which the height of supporting and holding the wafer W is changed while increasing the number of supporting points at a plurality of levels of 3 or more is referred to as a "first lifting mode".
Second mode
In addition to the first elevation mode, the control unit 9 of the wafer holding apparatus 1 may be configured to select any one of the first elevation mode and the second elevation mode by having a "second elevation mode" described in detail below.
Fig. 6 is a perspective view showing an example of a wafer holding device according to another embodiment of the present invention. Fig. 6 shows a state in which the connecting portion 33 and the like of the second support portion 3 attached to the position shown by the broken line are removed.
Specifically, the wafer holding apparatus 1 is configured to be capable of attaching and detaching the second support portion 3, and the control portion 9 selects and executes either one of the first lifting mode and the second lifting mode depending on the attached state of the second support portion 3. More specifically, the control unit 9 executes the first lifting mode when the second support unit 3 is attached, and executes the second lifting mode when the second support unit 3 is detached.
The second lift mode has a fourth support mode and a fifth support mode, and is switched from the fourth support mode to the fifth support mode while sucking and holding the wafer W received in the fourth support mode.
The fourth support mode is a mode in which the upper end of the first support portion 2 is disposed above the height of the upper end of the third support portion 4.
Specifically, in the fourth support mode, the actuator of the first elevating section 5 is controlled to change the height at which the wafer W is supported and held so that the height of the upper end of the first contact and holding section 21 is arranged at the upper position H above the height (i.e., the lower position) of the upper end of the third contact and holding section 41.
The fifth supporting mode is a mode in which the height of the upper end of the first supporting portion 2 is set to be the same as the height of the upper end of the third supporting portion 4.
Specifically, in the fifth support mode, the actuator of the first elevating section 5 is controlled to change the height at which the wafer W is supported and held so that the height of the upper end of the first contact and holding section 21 is arranged at the same height (i.e., lower position) as the height of the upper end of the third contact and holding section 41.
Fig. 7 is a cross-sectional view showing an example of a wafer holding device according to another embodiment of the present invention. Fig. 7 (a) shows a case where the wafer W is supported at the upper stage position H in the second lift mode. Fig. 7 (b) shows a case where the wafer W is supported at the lower stage position L in the second lift mode.
Specifically, when switching to the second lifting mode, the operator removes the second contact support portion 31 or the connecting portion 33 of the second support portion 3 from the lever 61 of the second lifting portion 6, and performs an operation (for example, a switching operation) to cause the control portion 9 to execute the second lifting mode. On the other hand, when switching to the first lifting mode, the operator attaches the second contact support portion 31 or the connecting portion 33 of the second support portion 3 to the lever 61 of the second lifting portion 6, and performs an operation (for example, a switching operation) to cause the control portion 9 to execute the first lifting mode.
(modification)
In the above description, the configuration in which the operator attaches and attaches the connection portion 33 of the second support portion 3 and manually switches between the first lifting mode and the second lifting mode is exemplified.
However, in order to achieve the present invention, the operator may attach and detach the connection portion 33 of the second support portion 3 and automatically switch between the first lifting mode and the second lifting mode.
Specifically, the wafer holding apparatus 1 is configured to be capable of attaching and detaching the second support portion 3, and has a position detecting portion 7 to be capable of detaching the second support portion.
The in-place detecting unit 7 detects the mounted state of the second support unit 3.
Specifically, the position detecting unit 7 detects whether or not the second contact portion 31 to which the second support portion 3 is attached and the connecting portion 33 of the stay 32 are attached at predetermined positions.
More specifically, as shown by broken lines in fig. 1, 3, and 6, the in-place detecting unit 7 is configured by an identification mark 71, a camera 72, an image processing device 73, and the like, and is connected to the control unit 9.
The identification mark 71 is used to determine whether the second support portion 3 is attached to a predetermined position. Specifically, the identification mark 71 is marked on the connecting portion 33 of the second support portion 3. More specifically, the identification mark 71 may be a two-dimensional code, a predetermined pattern (or a pattern obtained by scribing or imprinting).
The camera 72 photographs the identification mark 71, and outputs the photographed image to the outside.
The image processing device 73 processes the image captured by the camera 72, and determines whether the identification mark 71 is included in the image.
Since the in-place detecting unit 7 has such a configuration, if the identification mark 71 is detected, it is determined that the second supporting unit 3 is attached. On the other hand, if the identification mark 71 is not detected, it is determined that the second support portion 3 is removed.
The control unit 9 is configured to select and execute either one of the first lifting mode and the second lifting mode in accordance with the mounting state of the second support unit 3 detected by the position detection unit 7.
Specifically, the control unit 9 executes the first lifting mode if the presence detection unit 7 determines that the second support unit 3 is attached, and executes the second lifting mode if the presence detection unit 7 determines that the second support unit 3 is detached.
< action flow >)
Fig. 8 is a flowchart showing an example of an operation flow in another embodiment of the present invention.
First, the worker attaches or removes the connection portion 33 of the second support portion 3, and confirms the attached state (step s 10). When the second support portion 3 is attached, the control portion 9 executes the first lifting mode (steps s1 to s 5). On the other hand, if the second supporting portion 3 is removed, the control portion 9 executes a second lifting mode shown below (steps s21 to s 24).
In the second elevation mode, if the wafer holding apparatus 1 is able to receive the wafer W, the control section 9 is switched to the fourth support mode (upper stage position) and stands by (step s 21).
Then, the wafer W is placed thereon (step S22), and the first support portion S1 of the wafer W is sucked and held (step S23).
Then, the first lifting/lowering unit 5 is controlled to switch to the fifth support mode (lower stage position) (step s 24). When the fourth support mode (upper stage position) is switched to the fifth support mode (lower stage position L), the third support portion S3 is subjected to negative pressure to suction and hold the wafer W.
Thereafter, a desired process, inspection, or the like is performed (step s 6), and it is determined whether the process or the like is ended (step s 7). Then, if the processing or the like is not completed, the above-described step s6 is continued, and if the processing or the like is completed, a series of flows is completed.
According to this aspect, when holding a wafer that is likely to warp or deform, the first lift mode can be executed to reliably hold the wafer. In addition, when holding wafers that are not warped or deformed, the second lifting mode can be executed to quickly hold the wafers, so that the number of wafers processed per unit time can be increased, which is preferable.
In the above-described flow, the configuration in which the operator determines (manually determines) the attachment state of the second support portion 3 in step s10 is exemplified. However, in step s10, the wafer holding apparatus 1 may be configured to determine (automatically determine) the attachment state of the second support portion 3 by capturing an image of the identification mark 71 with the camera 72 using the position detecting portion 7 and determining the presence or absence of the identification mark 71 with the image processing device 73.
In the above description, the configuration in which the position detecting unit 7 includes the identification mark 71, the camera 72, and the image processing device 73 and the attached state of the second support unit 3 is determined based on the presence or absence of the identification mark 71 is exemplified.
However, the bit detection unit 7 is not limited to this configuration, and may be configured to detect the attachment/detachment state of the coupling unit 33 by a sensor or the like, and switch the output ON/OFF signal according to the attachment/detachment state.
In the above, the configuration in which the negative pressure is generated in the third support portion S3 and the wafer W is sucked and held when the fourth support mode (upper stage position) is switched to the fifth support mode (lower stage position) in step S24 is exemplified. In the case of such a structure, the wafer is preferably held reliably. However, in the case where the wafer W is less likely to be warped, deformed, or the like and is reliably held, the suction holding may be performed only by the first support portion S1.
Third mode
In the above description, the mode of attaching and detaching the second support portion 3 and selecting and switching the first lifting mode and the second lifting mode is exemplified.
However, in order to realize the present invention, the second support portion 3 is not necessarily attached to or detached from the second support portion, and the second lifting mode may be provided as follows: the wafer W is lifted by switching the first support part 2 to the upper stage position H/the lower stage position L in a state where the second support part 3 is fixed to the lower stage position L, and the wafer W is lifted by selecting one of the first lifting mode and the third lifting mode.
The third lifting mode includes a sixth support mode and a seventh support mode, and is switched from the sixth support mode to the seventh support mode while sucking and holding the wafer W received in the sixth support mode. In addition, the third lifting mode is performed in a state where the second support portion 3 is attached, as in the first lifting mode (as shown in fig. 2).
The sixth support mode is a mode in which the upper end of the first support portion is disposed at a position higher than the heights of the upper ends of the second support portion 3 and the third support portion 4.
Specifically, in the sixth support mode, the actuator of the first elevating section 5 is controlled to change the height at which the wafer W is supported and held so that the height of the upper end of the second contact and holding section 31 and the height of the upper end of the third contact and holding section 41 are arranged to be the same (i.e., the lower stage position L), and the height of the upper end of the first contact and holding section 21 is arranged at the upper stage position H above them.
The seventh support mode is a mode in which the height of the upper end of the first support portion 3 is set to be the same as the height of the upper ends of the second support portion 4 and the third support portion 4 (i.e., the lower stage position L).
Specifically, in the seventh support mode, the actuator of the first elevating section 5 is controlled to change the height at which the wafer W is supported and held so that the height of the upper end of the first contact and holding section 21 is set to be the same as the height of the upper ends of the second contact and holding section 31 and the third contact and holding section 41 (i.e., the lower stage position L).
Fig. 9 is a cross-sectional view showing an example of a wafer holding device according to still another embodiment of the present invention. Fig. 9 (a) shows a case where the wafer W is supported at the upper stage position H in the third lift mode. Fig. 9 (b) shows a case where the wafer W is supported at the lower stage position L in the third lift mode.
< action flow >)
Fig. 10 is a flowchart showing an example of an operation flow in a further embodiment of the present invention.
First, the operator selects which of the first lift mode and the third lift mode lifts the wafer W in a state where the coupling portion 33 of the second support portion 3 is attached (step s 15). Then, the control unit 9 determines which lifting mode is selected (step s 16), and if the first lifting mode is selected, steps s1 to s5 are executed in the same manner as described above. On the other hand, if the third lift mode is selected, the third lift mode shown below is executed (steps s31 to s 34).
In the third elevation mode, if the wafer holding apparatus 1 is able to receive the wafer W, the control section 9 is switched to the sixth support mode (upper stage position) and stands by (step s 31).
Then, the wafer W is placed thereon (step S32), and the first support portion S1 of the wafer W is sucked and held (step S33).
Then, the first lifting/lowering unit 5 is controlled to switch to the seventh support mode (lower stage position) (step s 34). When the sixth support mode (upper stage position) is switched to the seventh support mode (lower stage position), negative pressure is generated in the second support portion S2 and the third support portion S3, and the wafer W is sucked and held.
Thereafter, a desired process, inspection, or the like is performed (step s 6), and it is determined whether the process or the like is ended (step s 7). Then, if the processing or the like is not completed, the above-described step s6 is continued, and if the processing or the like is completed, a series of flows is completed.
According to this aspect, when holding a wafer that is likely to warp or deform, the first lift mode can be executed to reliably hold the wafer. In addition, when holding wafers that are not warped or deformed, the third lift mode can be executed to quickly hold the wafers, so that the number of wafers processed per unit time can be increased, which is preferable.
In the above-described flow, the following configuration is exemplified: in step s15, the operator selects which of the first lift mode and the third lift mode is used to lift the wafer W, and in step s16, the operator determines which lift mode is selected.
However, the first elevation mode or the third elevation mode may be selected by an operator's operation or the like, but the control unit 9 may be configured to register the first elevation mode or the third elevation mode in association with the type information (a so-called recipe file or the like) of the wafer W to be processed, and to receive the recipe information in step s15, and to determine the elevation mode in step s 16. That is, the operator may determine whether to use the first lift mode or the third lift mode according to the type of the wafer W held (that is, whether the wafer is easily deformed), or may automatically switch the wafer according to a recipe file registered in advance.
If the control unit 9 is configured to automatically switch the lifting mode, the trouble of the operator to attach and detach the second support unit 3 can be omitted, which is preferable. Further, setting errors of the lifting mode by the operator can be prevented, which is more preferable.
In the above, the configuration in which the second support portion S2 and the third support portion S3 are subjected to negative pressure to suction and hold the wafer W when the sixth support mode (upper stage position) is switched to the seventh support mode (lower stage position) in step S34 is exemplified. In the case of such a structure, the wafer is preferably held reliably. However, in the case where the wafer W is less likely to be warped, deformed, or the like and is reliably held, the suction holding may be performed only by the first support portion S1.
In the above, the second support portion 3 is fixed to the lower stage position L, but the present invention is not limited to this, and the first support portion 2 and the second support portion 3 may be lifted and lowered in conjunction with each other, and the first contact holding portion 21 and the third contact holding portion 41 may be switched to the upper stage position H and the lower stage position L.
In the above, the control unit 9 has been described as having the first elevation mode and the second elevation mode or the third elevation mode, but the control unit may be configured to have the first elevation mode, the second elevation mode, and the third elevation mode, and to execute the second elevation mode by the setup or operation of the operator, or to execute the third elevation mode by the operation of the operator, or to execute the third elevation mode automatically based on the type information of the wafer W. Specifically, it is possible to exemplify a configuration in which the operation flow shown in fig. 10 (after step s 15) is executed after it is determined that the second support portion 3 is attached in step s11 of the operation flow shown in fig. 8.
Description of the marking
1 wafer holding device
2 first supporting part
3 second supporting part
4 third support part
5 first lifting part
6 second lifting part
7 in-place detecting part
8 negative pressure suction part
9 control part
21 first abutment holding portion
22 post
23 connecting parts
31 second abutment holding portion
32 support post
33 connecting parts
41 third abutment holding portion
42 support column
43 connecting component
51 pole
52 main body
61 bar
62 main body
71 identification mark
72 camera
73 image processing apparatus
W wafer
R contact allowable region
S1 first supporting part
S2 second bearing part
S3 third support part
Claims (8)
1. A wafer holding device for receiving a wafer in a horizontal state and holding the wafer in a predetermined posture, characterized in that,
the wafer holding device comprises:
a first support portion that supports a first support portion from below, the first support portion being distributed and set at least at 3 places so as to surround a center of the wafer in a contact permission area set at a lower portion of an outer periphery of the wafer;
a second support portion that supports a second support portion from below, the second support portion being set at a position in the contact permission area that supplements between the first support portions;
a third support portion that supports a third support portion from below, the third support portion being set at a position in the contact permission region that supplements between the first support portion and the second support portion;
A first lifting part which changes the relative height between the upper end of the first supporting part and the upper end of the second supporting part;
a second lifting part which changes the relative height between the upper end of the second supporting part and the upper end of the third supporting part;
a negative pressure suction unit that sucks and holds the wafer by generating a negative pressure at the first support portion; and
a control unit that controls the change of the relative height of the first lifting unit and the second lifting unit and the switching of the suction holding or release by the negative pressure suction unit,
the control unit has at least a first support mode, a second support mode, and a third support mode, and in a state in which the wafer received in the first support mode is sucked and held, the control unit switches from the first support mode to the second support mode and then to the third support mode, and in the first support mode, an upper end of the first support unit is disposed at a position higher than a height of an upper end of the second support unit and an upper end of the third support unit, and in the second support mode, an upper end of the first support unit and an upper end of the second support unit are disposed at the same height, and in the third support mode, the upper end of the first support unit and the upper end of the second support unit are disposed at the same height as the height of the upper end of the third support unit.
2. The wafer holding device according to claim 1, wherein the third support portion is set to be arc-shaped along an outer edge shape of the wafer to be held.
3. The wafer holding device according to claim 1 or 2, wherein the negative pressure suction unit sucks and holds the wafer by generating negative pressure also in the second support portion.
4. The wafer holding device according to claim 3, wherein the negative pressure suction unit sucks and holds the wafer by generating negative pressure also in the third support portion.
5. A wafer holding device for receiving a wafer in a horizontal state and holding the wafer in a predetermined posture, characterized in that,
the wafer holding device comprises:
a first support portion that supports a first support portion from below, the first support portion being distributed and set at least at 3 places so as to surround a center of the wafer in a contact permission area set at a lower portion of an outer periphery of the wafer;
a second support portion that supports a second support portion from below, the second support portion being set at a position in the contact permission area that supplements between the first support portions;
A third support portion that supports a third support portion from below, the third support portion being set at a position in the contact permission region that supplements between the first support portion and the second support portion;
a first lifting part which changes the relative height between the upper end of the first supporting part and the upper end of the second supporting part;
a second lifting part which changes the relative height between the upper end of the second supporting part and the upper end of the third supporting part;
a negative pressure suction unit that sucks and holds the wafer by generating a negative pressure at the first support portion; and
a control unit that controls the change of the relative height of the first lifting unit and the second lifting unit and the switching of the suction holding or release by the negative pressure suction unit,
the control part has at least a first lifting mode and a second lifting mode,
the first lift mode includes at least a first support mode in which an upper end of the first support portion is disposed at a position higher than the heights of an upper end of the second support portion and an upper end of the third support portion, a second support mode in which an upper end of the first support portion and an upper end of the second support portion are disposed at the same height, and a third support mode in which an upper end of the first support portion and an upper end of the second support portion are disposed at the same height,
The second lift mode has a fourth support mode in which an upper end of the first support portion is disposed above a height of an upper end of the third support portion, and a fifth support mode in which the upper end of the first support portion is disposed at the same height as the upper end of the third support portion,
the control unit selects and executes any one of the first lifting mode and the second lifting mode.
6. A wafer holding device according to claim 5, wherein,
the second support portion is formed in a detachable configuration,
the wafer holding device has an in-place detecting part for detecting the mounting state of the second supporting part,
the control section performs the first lifting mode if the attachment of the second support section is detected by the in-place detecting section, and performs the second lifting mode if the detachment of the second support section is detected by the in-place detecting section.
7. The wafer holding device according to claim 5, which receives a wafer in a horizontal state and holds the wafer in a prescribed posture,
the wafer holding device comprises:
a first support portion that supports a first support portion from below, the first support portion being distributed and set at least at 3 places so as to surround a center of the wafer in a contact permission area set at a lower portion of an outer periphery of the wafer;
a second support portion that supports a second support portion from below, the second support portion being set at a position in the contact permission area that supplements between the first support portions;
a third support portion that supports a third support portion from below, the third support portion being set at a position in the contact permission region that supplements between the first support portion and the second support portion;
a first lifting part which changes the relative height between the upper end of the first supporting part and the upper end of the second supporting part;
a second lifting part which changes the relative height between the upper end of the second supporting part and the upper end of the third supporting part;
a negative pressure suction unit that sucks and holds the wafer by generating a negative pressure at the first support portion; and
A control unit that controls the change of the relative height of the first lifting unit and the second lifting unit and the switching of the suction holding or release by the negative pressure suction unit,
the control part is provided with at least one lifting mode and a third lifting mode,
the first lift mode includes at least a first support mode in which an upper end of the first support portion is disposed at a position higher than the heights of an upper end of the second support portion and an upper end of the third support portion, a second support mode in which an upper end of the first support portion and an upper end of the second support portion are disposed at the same height, and a third support mode in which an upper end of the first support portion and an upper end of the second support portion are disposed at the same height,
The third lifting mode has a sixth supporting mode in which an upper end of the first supporting portion is disposed above a height of an upper end of the second supporting portion and an upper end of the third supporting portion, and a seventh supporting mode in which the upper end of the first supporting portion is disposed at the same height as the upper ends of the second supporting portion and the third supporting portion,
the control unit selects and executes any one of the first lifting mode and the third lifting mode.
8. The wafer holding device according to any one of claims 5 to 7, wherein the negative pressure suction portion also generates a negative pressure in the third support portion to suction and hold the wafer.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-004672 | 2021-01-15 | ||
| JP2021201876A JP2022109874A (en) | 2021-01-15 | 2021-12-13 | Wafer holding device |
| JP2021-201876 | 2021-12-13 | ||
| PCT/JP2021/046437 WO2022153774A1 (en) | 2021-01-15 | 2021-12-16 | Wafer holding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116711061A true CN116711061A (en) | 2023-09-05 |
Family
ID=87826222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180088991.1A Pending CN116711061A (en) | 2021-01-15 | 2021-12-16 | Wafer holding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116711061A (en) |
-
2021
- 2021-12-16 CN CN202180088991.1A patent/CN116711061A/en active Pending
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