CN116710836A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN116710836A CN116710836A CN202180003438.3A CN202180003438A CN116710836A CN 116710836 A CN116710836 A CN 116710836A CN 202180003438 A CN202180003438 A CN 202180003438A CN 116710836 A CN116710836 A CN 116710836A
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- circuit board
- backlight module
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 128
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 239000011324 bead Substances 0.000 claims description 8
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 7
- 239000010408 film Substances 0.000 description 21
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 5
- 230000006378 damage Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000012788 optical film Substances 0.000 description 5
- 238000012795 verification Methods 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The display module comprises a backlight module (1), a display substrate (2), a flexible circuit board (3) and a peripheral circuit board (4); the display substrate (2) is positioned on the light emitting side (101) of the backlight module (1); the peripheral circuit board (4) is positioned on the back side (102) of the backlight module (1) which is away from the light emitting side (101); the display substrate (2) is provided with a binding area (100) positioned at one side edge of the display substrate, and the binding area (100) is in binding connection with the peripheral circuit board (4) through the flexible circuit board (3); the display module further comprises a reinforcing protection strip (5), is positioned on the back side (102) of the backlight module (1), and is positioned on one side, close to the backlight module (1), of the peripheral circuit board (4); the reinforced protection strip (5) extends to pass through the edge of the backlight module (1) at the side where the binding area (100) is located; the peripheral circuit board (4) is partially overlapped with the reinforcing guard bar (5).
Description
The embodiment of the disclosure belongs to the technical field of display, and particularly relates to a display module and a display device.
In the current stage, the development trend of NB (Note Book) products using a liquid crystal display Module (LCM) goes to an extreme stage toward ultra-thin and ultra-narrow, so that the conventional COG (i.e. display driving chip is not integrated on a flexible circuit board) technology applied to the NB products, and the display driving chip is directly arranged in a frame area of a backlight Module) cannot meet the requirements of customers, and the COF (i.e. display driving chip is integrated on the flexible circuit board) is applied to design an important solution for the ultra-thin and ultra-narrow frame products.
Disclosure of Invention
The embodiment of the disclosure provides a display module and a display device.
In a first aspect, an embodiment of the present disclosure provides a display module, including a backlight module, a display substrate, a flexible circuit board, and a peripheral circuit board;
the display substrate is positioned on the light emitting side of the backlight module; the peripheral circuit board is positioned on the back side of the backlight module, which is away from the light emitting side;
the display substrate is provided with a binding area positioned at one side edge of the display substrate, and the binding area is in binding connection with the peripheral circuit board through the flexible circuit board;
the display module further comprises a reinforcing protection strip, wherein the reinforcing protection strip is positioned on the back side of the backlight module, and is positioned on one side, close to the backlight module, of the peripheral circuit board; the reinforced protection strip extends to pass through the edge of the backlight module at the side where the binding area is located;
the peripheral circuit board partially overlaps the reinforcing guard bar.
In some embodiments, the flexible circuit board comprises a flexible base film and a circuit device, wherein the circuit device is arranged on the flexible base film and protrudes out of the surface of the flexible base film;
an opening is formed in the peripheral circuit board, and the opening is positioned in the area of the peripheral circuit board overlapped with the reinforced protection strip;
the circuit device is embedded in the opening.
In some embodiments, the reinforcing protection strip includes a first structure and a second structure, where the first structure is distributed along a first edge of the backlight module on a side of the binding area, and a second edge and a third edge adjacent to the first edge; the second structure is positioned in an area formed by surrounding the first structure; the first structure is connected with the second structure, and the thickness of the first structure along the direction far away from the backlight module is larger than that of the second structure along the direction far away from the backlight module;
the first side edge region of the peripheral circuit board overlaps the second structure.
In some embodiments, a surface of the first side edge region of the peripheral circuit board facing away from the backlight module is flush with a surface of the first structure facing away from the backlight module.
In some embodiments, the gap between the circuit device and the reinforcing guard bar ranges from 0.2 to 0.5mm;
the gap between the circuit device and the side wall of the opening ranges from 0.5mm to 1mm.
In some embodiments, the first structure includes a main structure, a first sub-structure, and a second sub-structure; the main structure is distributed along the first edge of the backlight module; the first substructure is distributed along a second edge of the backlight module; the second substructure is distributed along a third edge of the backlight module;
the gap between the peripheral circuit board and the main structure is 1-1.5 mm;
the gap between the peripheral circuit board and the first substructure is 1-1.5 mm;
the gap between the peripheral circuit board and the second substructure is in the range of 1-1.5 mm.
In some embodiments, the edges and corner locations of the reinforcing guard bar each form a cambered chamfer having a radial dimension of greater than or equal to 2mm.
In some embodiments, the reinforcing guard bar is made of PC, PET or metal alloy.
In some embodiments, the backlight module comprises a light bar, the light bar is located at the end face of the first edge of the backlight module, and the light bar is distributed along the extending direction of the first edge of the backlight module;
the light bar overlaps the reinforcing protection bar.
In some embodiments, the light bar comprises a circuit substrate and a plurality of light beads equally spaced on the circuit substrate;
the circuit base film is bent from one end of the first edge of the backlight module to the back side of the backlight module and is connected with the peripheral circuit board in a binding way;
the peripheral circuit board and the part of the circuit base film bent to the back side of the backlight module are not overlapped with each other.
In some embodiments, the peripheral circuit board forms a first notch or hollow in a region corresponding to the circuit base film bent to the back side portion of the backlight module.
In some embodiments, the first structure has a thickness in the range of 0.5 to 0.6mm;
the thickness of the second structure ranges from 0.1 mm to 0.2mm.
In some embodiments, the shape of the peripheral circuit board includes an elongated shape, and the length direction of the peripheral circuit board extends along the extending direction of the first edge of the backlight module;
the back side of the backlight module is provided with a first alignment mark, and the first alignment mark is correspondingly positioned at the periphery of the second side edge area of the peripheral circuit board and is used for limiting the position of the peripheral circuit board;
a second side edge region of the peripheral circuit board is opposite to a first side edge region of the peripheral circuit board;
the gap between the first alignment mark and the peripheral circuit board ranges from 0.5mm to 0.8mm.
In some embodiments, a second alignment mark is disposed on the back side of the backlight module, where the second alignment mark is correspondingly located on the periphery of the first substructure, the second substructure and the second structure, and is used to define the position of the reinforcing protection strip;
the gap ranges between the second alignment mark and the first substructure, between the second substructure and the second structure are respectively 0.3-0.5 mm.
In some embodiments, the peripheral circuit board extends along a direction away from the first edge of the backlight module more than the reinforcing protection strip;
the width of the peripheral circuit board extending along the direction far away from the first edge of the backlight module is smaller than the width of the backlight module along the same direction.
In some embodiments, the peripheral circuit board extends twice as wide in a direction away from the first edge of the backlight module as the reinforcing protection strip extends in a direction away from the first edge of the backlight module;
the width of the peripheral circuit board extending along the direction far away from the first edge of the backlight module is 1/15-1/10 of the width of the backlight module along the same direction.
In some embodiments, the number of flexible circuit boards is a plurality, each flexible circuit board including one of the circuit devices; the flexible circuit boards are sequentially and equally arranged at intervals along the extending direction of the first edge of the backlight module;
the number of the openings in the peripheral circuit board is a plurality, and the openings are sequentially and equally spaced along the extending direction of the first edge of the backlight module;
the circuit devices are respectively embedded in the openings in a one-to-one correspondence.
In some embodiments, the opening includes a second notch formed on a side edge of the peripheral circuit board, which is close to the first edge of the backlight module.
In some embodiments, the opening includes a through hole formed in an edge region of the peripheral circuit board near the first edge of the backlight module.
In a second aspect, an embodiment of the present disclosure further provides a display device, where the display device includes the display module.
The accompanying drawings are included to provide a further understanding of embodiments of the disclosure, and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure, without limitation to the disclosure. The above and other features and advantages will become more readily apparent to those skilled in the art by describing in detail exemplary embodiments with reference to the attached drawings, in which:
FIG. 1 is a schematic diagram of a driving chip rupture and abnormal display of an NB product in the prior art;
fig. 2 is a schematic front view of a display surface of a display module according to an embodiment of the disclosure;
FIG. 3 is a schematic cross-sectional view of the display module of FIG. 2 along the EE line;
FIG. 4 is a schematic rear view of a display module opposite to a display surface according to an embodiment of the disclosure;
FIG. 5 is an enlarged schematic view of a portion A of FIG. 4;
FIG. 6 is a schematic cross-sectional view of the structure along section line BB in FIG. 4;
FIG. 7 is a schematic top view of a structure of a reinforcing guard bar in an embodiment of the present disclosure;
FIG. 8 is a schematic view of a gap arrangement between the peripheral circuit board and the first and second substructures along the section line FF in FIG. 7;
FIG. 9 is a schematic view of a gap arrangement between the circuit device and the opening sidewall along the section line CC in FIG. 4;
fig. 10 is a partially enlarged schematic view of the portion D in fig. 4.
Wherein the reference numerals are as follows:
1. a backlight module; 11. a first edge; 12. a second edge; 13. a third edge; 14. a light bar; 141. a circuit substrate film; 142. a lamp bead; 15. a back plate; 16. a light guide plate; 17. an optical film layer; 18. a reflective layer; 2. a display substrate; 3. a flexible circuit board; 31. a flexible base film; 32. a circuit device; 4. a peripheral circuit board; 40. an opening; 41. a first side edge region; 42. a first notch; 43. a second side edge region; 100. binding area; 101. a light-emitting side; 102. a back side; 5. reinforcing the protective strips; 51. a first structure; 511. a main structure; 512. a first substructure; 513. a second substructure; 52. a second structure; 6. a connector; 7. a first alignment mark; 8. and a second alignment mark.
In order to enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, a display module and a display device provided by the embodiments of the present disclosure are described in further detail below with reference to the accompanying drawings and detailed description.
Embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments shown may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The embodiments of the present disclosure are not limited to the embodiments shown in the drawings, but include modifications of the configuration formed based on the manufacturing process. Thus, the regions illustrated in the figures have schematic properties and the shapes of the regions illustrated in the figures illustrate specific shapes of the regions, but are not intended to be limiting.
With the development trend of ultra-narrow and ultra-thin NB (Note Book) products, the thickness of the liquid crystal display module (LCM) has been reduced from original 2.6T (millimeters) to 1.9T, and the width of the binding side frame area has also been reduced from 7mm to 5mm, which puts forward very harsh conditions for production and verification of the products, and the conventional COG (i.e., display driving chip is not integrated on a flexible circuit board, and the display driving chip is directly arranged in the frame area of the backlight module) technology has not been able to meet the requirements of customers, so that the application of COF (i.e., display driving chip is integrated on a flexible circuit board) technology becomes a possibility on NB models.
However, when COF is applied to bend to the back side of the display module and is bound and connected with the peripheral circuit board, the ultra-thin ultra-narrow NB model is easy to squeeze and damage the display driving chip (IC) during initial assembly and test, which results in the breakage of the display driving chip (IC Crack), and referring to fig. 1, ultra-thin NB fragments easily occur at the same time, which results in abnormal display of NB products. In the face of severe production, verification and use conditions of ultra-thin ultra-narrow NB models, how to protect a display driving chip (IC) and improve the overall strength of a liquid crystal display module under the condition of implementing ultra-thin ultra-narrow NB models is a technical problem to be solved at present.
Aiming at the problem of how to protect a display driving chip (IC) and improve the overall strength of a liquid crystal display module under the condition of ultra-thin and ultra-narrow NB model, the embodiment of the disclosure provides a display module, referring to FIG. 6, comprising a backlight module 1, a display substrate 2, a flexible circuit board 3 and a peripheral circuit board 4; the display substrate 2 is positioned on the light emitting side 101 of the backlight module 1; the peripheral circuit board 4 is positioned on the back side 102 of the backlight module 1, which is away from the light emitting side 101; the display substrate 2 is provided with a binding area 100 positioned at one side edge of the display substrate, and the binding area 100 is in binding connection with the peripheral circuit board 4 through the flexible circuit board 3; the display module further comprises a reinforcing protection strip 5, which is positioned on the back side 102 of the backlight module 1 and on one side of the peripheral circuit board 4, which is close to the backlight module 1; the reinforcing protection strip 5 extends past the edge of the backlight module 1 on the side of the binding region 100; the peripheral circuit board 4 partially overlaps the reinforcing guard bar 5.
The display substrate 2 may be an array substrate of a liquid crystal display module, or may be a liquid crystal display panel of the liquid crystal display module. The flexible circuit board 3 has a certain flexibility, and the flexible circuit board 3 can be flexibly bent to the back side 102 of the backlight module 1 after being bound and connected with the binding area 100 of the display substrate 2 positioned on the light emitting side 101 of the backlight module 1, and is bound and connected with the peripheral circuit board 4 positioned on the back side 102 of the backlight module 1.
In some embodiments, the peripheral circuit board 4 provides the display substrate 2 with data driving signals at the time of display through the flexible wiring board 3.
In some embodiments, the reinforcing guard bar 5 is made of PC, PET or metal alloy. The reinforced protection strip 5 made of the hard PC, PET or metal alloy material has certain supporting strength, and the reinforced protection strip 5 extends through the edge of the backlight module 1 on the side where the binding area 100 is located, so that the reinforced protection strip 5 can continuously support the edge of the side where the corresponding binding area 100 of the backlight module 1 is located, the strength of the backlight module 1 and even the display module is increased along the direction of the side edge where the binding area 100 is located, the deformation of the backlight module 1 and even the display substrate 2 after being stressed is effectively reduced, the breaking rate of line operation is reduced, and therefore the situation that the display module is thinner (such as 1.9mm thickness) is avoided, the breaking of the display module is not easy to occur in the production, verification and use processes, the overall strength of the display module is improved, and the quality of the display module is further improved.
In this embodiment, the peripheral circuit board 4 is disposed on the back side 102 of the backlight module 1, and compared with the scheme that the peripheral circuit board is disposed on the light emitting side 101 of the backlight module 1, the peripheral circuit board 4 does not occupy the side frame area of the binding area 100 of the display module, so that the width of the side frame area of the binding area 100 of the display module can be reduced, which is beneficial to realizing the ultra-narrow frame of the display module.
In this embodiment, the peripheral circuit board 4 and the reinforcing protection strip 5 partially overlap, on one hand, the peripheral circuit board 4 is arranged closer to the binding area 100 of the display substrate 2, so as to shorten the length of the binding connection line; on the other hand, it is advantageous to enhance the protection of the circuit device 32 on the flexible wiring board 3 by the protection strip 5 and the peripheral circuit board 4 together.
In some embodiments, the flexible circuit board 3 includes a flexible base film 31 and a circuit device 32, the circuit device 32 being disposed on the flexible base film 31 and protruding from the surface of the flexible base film 31; an opening 40 is formed in the peripheral circuit board 4, and the opening 40 is positioned in the area of the peripheral circuit board 4 overlapped with the reinforced protection strip 5; the circuit device 32 is embedded in the opening 40. I.e. the flexible wiring board 3 adopts the COF (i.e. the circuit device 32 is integrated on the flexible wiring board 3) scheme. The arrangement is that the opening 40 and the reinforcing protection strip 5 in the peripheral circuit board 4 can enclose a space for accommodating the circuit device 32, and the circuit device 32 is embedded in the space, so that on one hand, the contribution of the circuit device 32 to the thickness of the display module can be reduced, and the whole thickness of the display module is thinned; on the other hand, the circuit device 32 is not easy to be broken due to extrusion injury during the initial assembly and test of the display module in the space, so that good protection is formed for the circuit device 32; on the other hand, since the reinforcing protection strip 5 can be made of a metal alloy material with good heat dissipation performance, the reinforcing protection strip 5 can also play a role in good dissipation of heat generated during operation of the circuit device 32, so that quality protection of the circuit device 32 is better formed.
In some embodiments, circuit device 32 may be a data driving chip. The data driving chip provides data driving signals for the display substrate 2 when the display module is displaying. The circuit device 32 is arranged on the flexible base film 31 to form the flexible circuit board 3, compared with the existing arrangement scheme (namely a COG scheme) that the circuit device is directly arranged in the binding area of the display substrate, the circuit device 32 is embedded in the opening 40 of the peripheral circuit board 4 by bending the flexible base film 31 to the back side 102 of the backlight module 1, so that the frame width of the display module can be greatly reduced, and the display module is beneficial to realizing ultra-narrow frames; for example, the width of the side frame region where the binding region 100 of the display substrate 2 is located can be reduced from 7.0mm to 5.0mm.
In some embodiments, referring to fig. 5, 6, 7 and 8, the reinforcing protective strip 5 includes a first structure 51 and a second structure 52, the first structure 51 being distributed along a first edge 11 of the backlight module 1 on the side of the bonding region 100 and a second edge 12 and a third edge 13 adjacent to the first edge 11; the second structure 52 is located in a region formed by surrounding the first structure 51; the first structure 51 is connected with the second structure 52, and the thickness h1 of the first structure 51 along the direction far away from the backlight module 1 is larger than the thickness h2 of the second structure 52 along the direction far away from the backlight module 1; the first side edge region 41 of the peripheral circuit board 4 overlaps the second structure 52. By thus opening the opening 40 in the first side edge region 41 of the peripheral circuit board 4, it is possible to achieve that the opening 40 and the second structure 52 in the peripheral circuit board 4 enclose a space for accommodating the circuit device 32.
In some embodiments, referring to fig. 6 and 7, the surface of the first side edge region 41 of the peripheral circuit board 4 facing away from the backlight module 1 is flush with the surface of the first structure 51 facing away from the backlight module 1. Namely, the first side edge area 41 of the peripheral circuit board 4 is embedded in a space formed by the first structure 51 and the second structure 52; by the arrangement, on one hand, enough supporting strength of the enhanced protection strip 5 to the backlight module 1 and the display substrate 2 can be ensured, so that the strength of the whole ultrathin display module is ensured; on the other hand, the nesting arrangement between the part of the peripheral circuit board 4 and the reinforcing protection strip 5 can reduce the overall thickness of the display module to a certain extent, which is beneficial to realizing the ultrathin display module.
In some embodiments, the thickness h1 of the first structure 51 ranges from 0.5 to 0.6mm; the thickness h2 of the second structure 52 ranges from 0.1 to 0.2mm. The thickness of the reinforced protection strip 5 is thinner, which is beneficial to realizing an ultrathin display module.
In some embodiments, referring to fig. 6 and 9, the gap a between the circuit device 32 and the reinforcing guard bar 5 ranges from 0.2 to 0.5mm; the gap b between the circuit device 32 and the side wall of the opening 40 ranges from 0.5 to 1mm. The gap a and the gap b are reserved tolerances when the circuit device 32 is assembled, so that the circuit device 32 can be ensured to be smoothly assembled into a space formed by surrounding the opening 40 and the reinforcing protection strip 5, the circuit device is not easy to collide or squeeze to damage, meanwhile, deviation generated when the peripheral circuit board 4 is assembled and interference between the circuit device 32 and the peripheral circuit board 4 caused by the length tolerance of the flexible circuit board 3 are avoided, interference between the flexible circuit board 3 and an external system (such as a back side shell of a display module) is avoided, and the operation yield of the assembly of the circuit device 32 is ensured; on the other hand, the gaps a and b also ensure that the side walls of the opening 40 and the reinforcing guard bar 5 do not collide with the circuit device 32 when the display module is pressed or bumped, thereby protecting the circuit device 32 from being damaged by the collision.
In some embodiments, referring to fig. 7 and 8, the first structure 51 includes a main structure 511, a first sub-structure 512, and a second sub-structure 513; the main structure 511 is distributed along the first edge 11 of the backlight module 1; the first sub-structures 512 are distributed along the second edge 12 of the backlight module 1; the second sub-structures 513 are distributed along the third edge 13 of the backlight module 1; the clearance c1 between the peripheral circuit board 4 and the main structure 511 ranges from 1 to 1.5mm; the clearance c2 between the peripheral circuit board 4 and the first substructure 512 ranges from 1 to 1.5mm; the clearance c3 between the peripheral circuit board 4 and the second substructure 513 ranges from 1 to 1.5mm. The above-mentioned clearance setting makes the reinforcing protection strip 5 can carry out accurate spacing to peripheral circuit board 4, ensures simultaneously that the shaping of reinforcing protection strip 5 material is abundant and effective utilization.
In some embodiments, referring to fig. 8, the edges and corner locations of the reinforcing guard bar 5 form cambered chamfers, respectively, having a radial dimension of greater than or equal to 2mm. By this arrangement, the flexible base film 31 and the circuit device 32 thereon in the flexible wiring board 3 can be prevented from being damaged when being brought into contact with the edge or corner of the reinforcing guard bar 5 during the assembly process, thereby protecting the flexible wiring board 3 and the circuit device 32 thereon well.
In some embodiments, referring to fig. 2 and 6, the backlight module 1 includes light bars 14, the light bars 14 are located on the end face of the first edge 11 of the backlight module 1, and the light bars 14 are distributed along the extending direction of the first edge 11 of the backlight module 1; the light bar 14 overlaps the reinforcing protection bar 5. The reinforcing protection strip 5 can be made of metal alloy with good heat conduction performance, so that the reinforcing protection strip 5 can well radiate heat emitted by the light strip 14 in the overlapping area of the light strip 14 and the reinforcing protection strip 5, and damage to the light strip 14 caused by too high heat accumulation is avoided.
In some embodiments, the backlight module 1 further includes a back plate 15, a light guide plate 16, an optical film layer 17 and a reflective layer 18, where the reflective layer 18, the light guide plate 16 and the optical film layer 17 are sequentially stacked above the bottom wall of the back plate 15; the back plate 15 extends to the edge end surfaces of the cladding reflection layer 18, the light guide plate 16 and the optical film layer 17; the light bar 14 is disposed on a sidewall of the back plate 15 corresponding to the edge end surfaces of the light guide plate 16, the optical film layer 17, and the reflective layer 18 covering the first edge 11. In some embodiments, the light bar 14 includes a circuit substrate 141 and a plurality of light beads 142, the plurality of light beads 142 being equally spaced on the circuit substrate 141; the light emitting surface of the lamp beads 142 faces the edge end surface of the light guide plate 16, and the light emitted by the lamp beads 142 is incident into the light guide plate 16 from the edge end surface of the light guide plate 16, namely, the backlight module 1 adopts a side-in backlight source. The side-entry backlight can reduce the thickness of the backlight module 1 relative to the direct-type backlight (i.e., the beads are located between the light guide plate and the bottom wall of the back plate), thereby being beneficial to reducing the thickness of the entire display module.
In some embodiments, referring to fig. 6 and 10, the circuit substrate 141 is bent from one end of the first edge 11 of the backlight module 1 to the back side 102 of the backlight module 1, and is connected to the peripheral circuit board 4 in a binding manner, and the peripheral circuit board 4 and the portion of the circuit substrate 141 bent to the back side 102 of the backlight module 1 do not overlap with each other. Wherein the circuit base film 141 and the peripheral circuit board 4 are in binding connection through the connector 6 arranged on the peripheral circuit board 4. By making the peripheral circuit board 4 and the portion of the circuit base film 141 bent to the back side 102 of the backlight module 1 not overlap each other, on the one hand, it is advantageous to avoid an increase in thickness after the peripheral circuit board 4 and the circuit base film 141 are stacked; on the other hand, the heat released from the peripheral circuit board 4 can be effectively prevented from causing signal interference to the circuit base film 141, thereby ensuring the normal operation of the light bar 14.
In some embodiments, referring to fig. 10, the peripheral circuit board 4 forms a first notch 42 or a hollow (not illustrated) in a region corresponding to a portion of the circuit base film 141 bent to the back side 102 of the backlight module 1. So arranged, on the one hand, it is advantageous to avoid an increase in thickness after the peripheral circuit board 4 is stacked with the circuit base film 141; on the other hand, the heat released from the peripheral circuit board 4 can be effectively prevented from causing signal interference to the circuit base film 141, thereby ensuring the normal operation of the light bar 14.
In some embodiments, referring to fig. 4 and 5, the shape of the peripheral circuit board 4 includes an elongated shape, and the length direction of the peripheral circuit board 4 extends along the extending direction of the first edge 11 of the backlight module 1; the back side 102 of the backlight module 1 is provided with a first alignment mark 7, and the first alignment mark 7 is correspondingly positioned at the periphery of the second side edge area 43 of the peripheral circuit board 4 and is used for limiting the position of the peripheral circuit board 4; the second side edge region 43 of the peripheral circuit board 4 is opposite to the first side edge region 41 of the peripheral circuit board 4; the gap d1 between the first alignment mark 7 and the peripheral circuit board 4 ranges from 0.5 to 0.8mm. The first alignment mark 7 and the gap d1 between the first alignment mark and the peripheral circuit board 4 can ensure the accuracy of the arrangement position of the peripheral circuit board 4 and the effectiveness and yield of the assembly (such as attachment) of the peripheral circuit board 4.
In some embodiments, referring to fig. 7, the back side 102 of the backlight module 1 is provided with a second alignment mark 8, and the second alignment mark 8 is correspondingly located at the periphery of the first substructure 512, the second substructure 513 and the second structure 52, for defining the position of the reinforcing protection strip 5; the gap d2 between the second alignment mark 8 and the first sub-structure 512, the second sub-structure 513 and the second structure 52 ranges from 0.3 to 0.5mm, respectively. The second alignment mark 8 and the gap d2 between the second alignment mark and the first substructure 512, the second substructure 513 and the second structure 52 can ensure the accuracy of the setting position of the reinforcing protection strip 5, and ensure the effectiveness and yield of the assembly (e.g. attachment) of the reinforcing protection strip 5.
In some embodiments, referring to fig. 4, the width e1 of the peripheral circuit board 4 extending in a direction away from the first edge 11 of the backlight module 1 is greater than the width e2 of the reinforcing protection strip 5 extending in a direction away from the first edge 11 of the backlight module 1; the width e1 of the peripheral circuit board 4 extending along the direction away from the first edge 11 of the backlight module 1 is smaller than the width e3 of the backlight module 1 along the same direction. In this embodiment, the reinforcing protection strip 5 and the peripheral circuit board 4 are only correspondingly disposed in the local area where the first edge 11 of the backlight module 1 is located, that is, the reinforcing protection strip 5 and the peripheral circuit board 4 are not distributed on the entire back side 102 of the backlight module 1, so that the overall thickness of the display module can be ensured not to be too large, and the realization of an ultrathin display module is facilitated.
In some embodiments, referring to fig. 4, the width e1 of the peripheral circuit board 4 extending in a direction away from the first edge 11 of the backlight module 1 is twice the width e2 of the reinforcing protection bar 5 extending in a direction away from the first edge 11 of the backlight module 1; the width e1 of the peripheral circuit board 4 extending along the direction far from the first edge 11 of the backlight module 1 is 1/15-1/10 of the width e3 of the backlight module 1 along the same direction. In this embodiment, the reinforcing protection strips 5 and the peripheral circuit board 4 are only correspondingly distributed in the narrower local area near the first edge 11 of the backlight module 1, so that the overall thickness of the display module can be further ensured not to be too large, and the ultrathin display module is facilitated to be realized; and also contributes to saving the material cost of the reinforcing guard bar 5.
In some embodiments, referring to fig. 4 and 5, the number of flexible wiring boards 3 is plural, each flexible wiring board 3 including one circuit device 32; the flexible circuit boards 3 are sequentially and equally arranged at intervals along the extending direction of the first edge 11 of the backlight module 1; the number of the openings 40 in the peripheral circuit board 4 is a plurality, and the plurality of openings 40 are sequentially and equally spaced along the extending direction of the first edge 11 of the backlight module 1; the plurality of circuit devices 32 are embedded in the plurality of openings 40 in a one-to-one correspondence, respectively. For example, the number of flexible wiring boards 3 is five, and accordingly, the number of circuit devices 32 is five.
In some embodiments, the plurality of circuit devices 32 are a plurality of data driving chips, and the plurality of data driving chips are respectively connected with corresponding interfaces on the peripheral circuit board 4 in a binding manner, so that the corresponding interfaces on the peripheral circuit board 4 provide data driving signals for the data driving chips in a one-to-one correspondence manner, and thus each data driving chip is convenient for providing corresponding data signals for corresponding data lines on the display substrate 2. The plurality of data driving chips are sequentially and equally spaced, so that the data driving signals can be provided for the data lines sequentially arranged on the display substrate 2 along the extending direction of the first edge 11 of the backlight module 1 more quickly and with lower loss.
In some embodiments, referring to fig. 4, the opening 40 includes a second notch formed on a side edge of the peripheral circuit board 4 near the first edge 11 of the backlight module 1.
In some embodiments, the opening includes a through hole (not shown) formed in an edge region of the peripheral circuit board near the first edge of the backlight module.
According to the display module provided in the embodiment, the reinforced protection strip 5 extends through the edge of the backlight module 1 on the side where the binding area 100 is located, so that the reinforced protection strip 5 can continuously support the edge of the side where the corresponding binding area 100 of the backlight module 1 is located, the strength of the backlight module 1 and even the display module in the direction along the side edge where the binding area 100 is located is increased, the deformation of the backlight module 1 and even the display substrate 2 after being stressed is effectively reduced, the breaking rate of line operation is reduced, and therefore the phenomenon that the display module is broken easily in the production, verification and use processes under the condition that the thickness of the display module is thinner (such as 1.9mm thickness) is avoided, the integral strength of the display module is improved, and the quality of the display module is improved. By embedding the circuit device 32 in the space formed by the surrounding of the opening 40 in the peripheral circuit board 4 and the reinforcing protection strip 5, on one hand, the contribution of the circuit device 32 to the thickness of the display module can be reduced, and the whole thickness of the display module is thinned; on the other hand, the circuit device 32 is not easy to be broken due to extrusion injury during the initial assembly and test of the display module in the space, so that good protection is formed for the circuit device 32; on the other hand, since the reinforcing protection strip 5 can be made of a metal alloy material with good heat dissipation performance, the reinforcing protection strip 5 can also play a role in good dissipation of heat generated during operation of the circuit device 32, so that quality protection of the circuit device 32 is better formed.
The embodiment of the disclosure also provides a display device, which comprises the display module in the embodiment.
By adopting the display module in the embodiment, on one hand, the ultrathin and ultra-narrow frames of the display device can be realized; on the other hand, the ultrathin display device is prevented from being broken, and the overall strength of the display device is improved, so that the quality of the display device is improved.
The display device may be: LCD panel, LCD TV, mobile phone, tablet computer, notebook computer, display, notebook computer, digital photo frame, navigator, etc.
It is to be understood that the above embodiments are merely exemplary embodiments employed to illustrate the principles of the present disclosure, however, the present disclosure is not limited thereto. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the disclosure, and are also considered to be within the scope of the disclosure.
Claims (20)
- A display module comprises a backlight module, a display substrate, a flexible circuit board and a peripheral circuit board;the display substrate is positioned on the light emitting side of the backlight module; the peripheral circuit board is positioned on the back side of the backlight module, which is away from the light emitting side;the display substrate is provided with a binding area positioned at one side edge of the display substrate, and the binding area is in binding connection with the peripheral circuit board through the flexible circuit board;the display module further comprises a reinforcing protection strip, wherein the reinforcing protection strip is positioned on the back side of the backlight module, and is positioned on one side, close to the backlight module, of the peripheral circuit board; the reinforced protection strip extends to pass through the edge of the backlight module at the side where the binding area is located;the peripheral circuit board partially overlaps the reinforcing guard bar.
- The display module of claim 1, wherein the flexible circuit board comprises a flexible base film and a circuit device, the circuit device being disposed on the flexible base film and protruding from a surface of the flexible base film;an opening is formed in the peripheral circuit board, and the opening is positioned in the area of the peripheral circuit board overlapped with the reinforced protection strip;the circuit device is embedded in the opening.
- The display module of claim 2, wherein the reinforcing protection bar includes a first structure and a second structure, the first structure being distributed along a first edge of the backlight module on a side of the bonding region, and a second edge and a third edge adjacent to the first edge; the second structure is positioned in an area formed by surrounding the first structure; the first structure is connected with the second structure, and the thickness of the first structure along the direction far away from the backlight module is larger than that of the second structure along the direction far away from the backlight module;the first side edge region of the peripheral circuit board overlaps the second structure.
- A display module according to claim 3, wherein a surface of the first side edge region of the peripheral circuit board facing away from the backlight module is flush with a surface of the first structure facing away from the backlight module.
- The display module of claim 4, wherein a gap between the circuit device and the reinforcing guard bar ranges from 0.2 to 0.5mm;the gap between the circuit device and the side wall of the opening ranges from 0.5mm to 1mm.
- The display module of claim 5, wherein the first structure comprises a main structure, a first sub-structure, and a second sub-structure; the main structure is distributed along the first edge of the backlight module; the first substructure is distributed along a second edge of the backlight module; the second substructure is distributed along a third edge of the backlight module;the gap between the peripheral circuit board and the main structure is 1-1.5 mm;the gap between the peripheral circuit board and the first substructure is 1-1.5 mm;the gap between the peripheral circuit board and the second substructure is in the range of 1-1.5 mm.
- The display module of claim 6, wherein edges and corner positions of the reinforcing guard bar form cambered chamfers, respectively, and a radial dimension of the cambered chamfers is greater than or equal to 2mm.
- The display module of claim 7, wherein the reinforced protection strip is made of PC, PET or metal alloy.
- The display module of claim 8, wherein the backlight module comprises light bars, the light bars are positioned on the end face of the first edge of the backlight module, and the light bars are distributed along the extending direction of the first edge of the backlight module;the light bar overlaps the reinforcing protection bar.
- The display module of claim 9, wherein the light bar comprises a circuit substrate and a plurality of light beads equally spaced apart on the circuit substrate;the circuit base film is bent from one end of the first edge of the backlight module to the back side of the backlight module and is connected with the peripheral circuit board in a binding way;the peripheral circuit board and the part of the circuit base film bent to the back side of the backlight module are not overlapped with each other.
- The display module of claim 10, wherein the peripheral circuit board forms a first notch or hollowed-out in a region corresponding to the circuit base film bent to the back side portion of the backlight module.
- A display module according to claim 3, wherein the thickness of the first structure ranges from 0.5 to 0.6mm;the thickness of the second structure ranges from 0.1 mm to 0.2mm.
- The display module of claim 6, wherein the shape of the peripheral circuit board comprises an elongated shape, and a length direction of the peripheral circuit board extends along an extending direction of the first edge of the backlight module;the back side of the backlight module is provided with a first alignment mark, and the first alignment mark is correspondingly positioned at the periphery of the second side edge area of the peripheral circuit board and is used for limiting the position of the peripheral circuit board;a second side edge region of the peripheral circuit board is opposite to a first side edge region of the peripheral circuit board;the gap between the first alignment mark and the peripheral circuit board ranges from 0.5mm to 0.8mm.
- The display module of claim 6, wherein a second alignment mark is disposed on a back side of the backlight module, and the second alignment mark is correspondingly located on peripheries of the first substructure, the second substructure and the second structure, and is used for defining a position of the enhanced protection strip;the gap ranges between the second alignment mark and the first substructure, between the second substructure and the second structure are respectively 0.3-0.5 mm.
- The display module of claim 13, wherein the peripheral circuit board has a width extending in a direction away from the first edge of the backlight module that is greater than a width of the reinforcing protection strip extending in a direction away from the first edge of the backlight module;the width of the peripheral circuit board extending along the direction far away from the first edge of the backlight module is smaller than the width of the backlight module along the same direction.
- The display module of claim 15, wherein the peripheral circuit board has a width extending in a direction away from the first edge of the backlight module that is twice a width of the reinforcing protection bar extending in a direction away from the first edge of the backlight module;the width of the peripheral circuit board extending along the direction far away from the first edge of the backlight module is 1/15-1/10 of the width of the backlight module along the same direction.
- A display module according to claim 3, wherein the number of flexible wiring boards is plural, each of the flexible wiring boards including one of the circuit devices; the flexible circuit boards are sequentially and equally arranged at intervals along the extending direction of the first edge of the backlight module;the number of the openings in the peripheral circuit board is a plurality, and the openings are sequentially and equally spaced along the extending direction of the first edge of the backlight module;the circuit devices are respectively embedded in the openings in a one-to-one correspondence.
- The display module of claim 17, wherein the opening comprises a second notch opening on a side edge of the peripheral circuit board proximate the first edge of the backlight module.
- The display module of claim 17, wherein the opening comprises a through hole opening in an edge region of the peripheral circuit board proximate the first edge of the backlight module.
- A display device comprising the display module of any one of claims 1-19.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2021/131458 WO2023087207A1 (en) | 2021-11-18 | 2021-11-18 | Display module and display apparatus |
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| CN116710836A true CN116710836A (en) | 2023-09-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202180003438.3A Pending CN116710836A (en) | 2021-11-18 | 2021-11-18 | Display module and display device |
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| CN (1) | CN116710836A (en) |
| WO (1) | WO2023087207A1 (en) |
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| KR100953425B1 (en) * | 2003-07-30 | 2010-04-19 | 삼성전자주식회사 | Liquid crystal display device |
| KR20100009910A (en) * | 2008-07-21 | 2010-01-29 | 삼성모바일디스플레이주식회사 | Organic light emitting diode display and manufacturing method of the same |
| JP5172809B2 (en) * | 2008-12-19 | 2013-03-27 | 株式会社ジャパンディスプレイセントラル | Image display device |
| JP6077848B2 (en) * | 2012-12-10 | 2017-02-08 | 矢崎総業株式会社 | LCD display unit |
| KR102087196B1 (en) * | 2013-12-19 | 2020-03-11 | 삼성디스플레이 주식회사 | Liquid crystal display |
| CN109872635B (en) * | 2019-03-29 | 2021-07-16 | 厦门天马微电子有限公司 | Display device and manufacturing method thereof |
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- 2021-11-18 CN CN202180003438.3A patent/CN116710836A/en active Pending
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| WO2023087207A1 (en) | 2023-05-25 |
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