CN116709643A - Printed circuit board and preparation method thereof - Google Patents
Printed circuit board and preparation method thereof Download PDFInfo
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- CN116709643A CN116709643A CN202210191432.XA CN202210191432A CN116709643A CN 116709643 A CN116709643 A CN 116709643A CN 202210191432 A CN202210191432 A CN 202210191432A CN 116709643 A CN116709643 A CN 116709643A
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- dielectric layer
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- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 238000005553 drilling Methods 0.000 claims abstract description 200
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 238000004381 surface treatment Methods 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 abstract description 10
- 239000011148 porous material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000006260 foam Substances 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- -1 bismaleimide triazines Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Abstract
The invention discloses a printed circuit board and a preparation method thereof, wherein the preparation method of the printed circuit board comprises the following steps: obtaining a processed plate, wherein the processed plate at least comprises a first conductive layer, a first insulating layer, a dielectric layer, a second insulating layer and a second conductive layer which are laminated and bonded in sequence; drilling a preset position of a first conductive layer of the processed plate according to a first drilling range, and drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer; drilling the exposed part of the dielectric layer according to the second drilling range, and drilling through the dielectric layer to prepare a printed circuit board; wherein the second borehole range is smaller than the first borehole range. Through the mode, the phenomenon of concave generated during drilling of the circuit board can be reduced, so that signal transmission of the hole is guaranteed, and the reliability of the printed circuit board is improved.
Description
Technical Field
The invention is applied to the technical field of printed circuit boards, in particular to a printed circuit board and a preparation method thereof.
Background
PCB (Printed Circuit Board), also called a printed circuit board or a printed wiring board, is an important electronic component widely used, and is a support for electronic components, and is also a carrier for electrical connection of electronic components.
As printed circuit boards are being developed toward high frequencies and high speeds, there is an increasing demand for electrical performance and low loss of printed circuit boards. The rigid foam dielectric material has good electrical insulation, small dielectric constant and dielectric loss change, and good broadband stability, and is suitable for special products such as antenna radar, aerospace and the like.
Because the foam medium material is strong in brittleness, not resistant to high temperature and easy to deform, the foam medium material is easy to sink due to the high Wen Chuxian in the drilling process, and the signal transmission and the reliability of holes are affected.
Disclosure of Invention
The invention provides a printed circuit board and a preparation method thereof, which are used for solving the problem that a foam medium material is easy to concave in the drilling process.
In order to solve the technical problems, the invention provides a preparation method of a printed circuit board, which comprises the following steps: obtaining a processed plate, wherein the processed plate at least comprises a first conductive layer, a first insulating layer, a dielectric layer, a second insulating layer and a second conductive layer which are laminated and bonded in sequence; drilling a preset position of a first conductive layer of the processed plate according to a first drilling range, and drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer; drilling the exposed part of the dielectric layer according to the second drilling range, and drilling through the dielectric layer to prepare a printed circuit board; wherein the second borehole range is smaller than the first borehole range.
The second drilling range is obtained by performing difference processing on the first drilling range and the twice preset shrinkage range; the preset shrinkage distance is the thermal shrinkage distance of the dielectric layer.
The step of drilling a preset position of the first conductive layer of the processed plate according to the first drilling range and drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer comprises the following steps: drilling a preset position of a first conductive layer of the processed plate according to a first drilling range by using a first drill bit, and drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer; drilling the exposed part of the dielectric layer according to the second drilling range and drilling through the dielectric layer to prepare the printed circuit board, wherein the step of preparing the printed circuit board comprises the following steps of: drilling the exposed part of the dielectric layer by using a second drill bit according to a second drilling range, and drilling through the dielectric layer to prepare a printed circuit board; wherein the second bit diameter is smaller than the first bit diameter.
The step of drilling the preset position of the first conductive layer of the processed plate according to the first drilling range, and drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer further comprises: drilling a preset position of a first conductive layer of the processed plate according to a first drilling range, and drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer; and drilling the second conductive layer and the second insulating layer which correspond to the preset positions on the processing plate according to the first drilling range until the other side of part of the dielectric layer is exposed.
Wherein, according to the second drilling scope to expose partial dielectric layer and bore the step of penetrating dielectric layer to prepare the printed circuit board includes: and drilling the dielectric layer of the exposed part and the corresponding second insulating layer according to the second drilling range until part of the second conductive layer is exposed, so as to prepare the printed circuit board.
Wherein the dielectric layer comprises a polymethacrylimide layer.
And drilling the exposed part of the dielectric layer according to the second drilling range, wherein the step of drilling through the dielectric layer comprises the following steps: carrying out copper deposition electroplating treatment on the drilled processed plate so as to metalize the processed plate; carrying out pattern transfer treatment on the conductive layer on the metallized processed plate so as to prepare a conductive circuit; and carrying out surface treatment on the processed plate after the pattern transfer treatment to prepare the printed circuit board.
The step of performing pattern transfer treatment on the conductive layer on the metallized processed plate to prepare the conductive circuit comprises the following steps: covering the surface part of the conducting layer on the metallized processed plate with an anti-corrosion film; etching the metallized processed plate to form a conductive circuit; and removing the anti-corrosion film.
The method for preparing the printed circuit board comprises the following steps of: and (3) coating ink and/or electroplating nickel gold on the surface of the processed plate after the pattern transfer treatment to finish the surface treatment.
In order to solve the technical problems, the invention also provides a printed circuit board prepared by the preparation method of the printed circuit board.
The invention has the beneficial effects that; compared with the prior art, the method comprises the steps of firstly obtaining the processed plate, then drilling the preset position of the first conductive layer of the processed plate according to the first drilling range, drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer, drilling through the exposed part of the dielectric layer according to the second drilling range, and drilling through the dielectric layer to prepare the printed circuit board, so that the drilling step is divided into at least two times, firstly, holes with normal aperture are prepared on the conductive layer and the insulating layer through one drilling, then, the dielectric layer is independently drilled through the second drilling range smaller than the first drilling range of the first drilling range, so that the space for shrinking the dielectric layer by heating is reserved, even though the hole formed on the dielectric layer is shrunk by heat, the concave condition of the hole does not occur, the hole formed on the dielectric layer by the two drilling is close to the aperture of the hole formed on the conductive layer and the insulating layer by one drilling, the flatness of the inner wall of the hole is improved, and signal transmission of the hole is improved, and the reliability of the printed circuit board is ensured.
Drawings
FIG. 1 is a schematic flow chart of an embodiment of a method for manufacturing a printed circuit board according to the present invention;
fig. 2 is a schematic flow chart of another embodiment of a method for manufacturing a printed circuit board according to the present invention;
FIG. 3 is a schematic view of an embodiment of the processing board in step S22 in the embodiment of FIG. 2;
FIG. 4 is a schematic view of an embodiment of the processing board in step S23 in the embodiment of FIG. 2;
fig. 5 is a schematic flow chart of another embodiment of a method for manufacturing a printed circuit board according to the present invention;
FIG. 6 is a schematic view of an embodiment of the processing plate in step S33 in the embodiment of FIG. 5;
fig. 7 is a schematic structural diagram of an embodiment of a printed circuit board according to the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
Referring to fig. 1, fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a printed circuit board according to the present invention.
Step S11: and obtaining a processed plate, wherein the processed plate at least comprises a first conductive layer, a first insulating layer, a dielectric layer, a second insulating layer and a second conductive layer which are laminated and attached in sequence.
And obtaining a processed plate, wherein the processed plate at least comprises a first conductive layer, a first insulating layer, a dielectric layer, a second insulating layer and a second conductive layer which are laminated and attached in sequence.
The first conductive layer, the first insulating layer, the dielectric layer, the second insulating layer and the second conductive layer, which are sequentially laminated and bonded, are the minimum processing unit for processing the plate in this embodiment. In a specific application scenario, the processing board may be additionally provided with at least one insulating layer and at least one conductive layer on at least one side of the minimum processing unit. In another specific application scenario, the processing board may be newly added with at least one insulating layer and at least one other minimum processing unit on at least one side of the minimum processing unit. The specific structure of the processed plate is not limited herein.
The insulating layer of the present embodiment may include one or more of epoxy resins, polyimides, bismaleimide triazines (Bismaleimide Triazine, BT), and ceramic bases. The specific material is not limited herein.
The printed circuit board of the embodiment may include an antenna board, and is suitable for special products such as antenna radar, aerospace, and the like, and the dielectric layer may be a foam medium for exciting or inducing electromagnetic waves.
Step S12: and drilling the preset position of the first conductive layer of the processed plate according to the first drilling range, and drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer.
In this embodiment, at least one hole penetrating through the dielectric layer is required to be formed in the processed plate, and the first conductive layer and the first insulating layer are drilled at a predetermined position according to the first drilling range, so as to expose a portion of the dielectric layer. The preset position is a position where a hole needs to be prepared in the first conductive layer. The drilling of this step exposes only a portion of the dielectric layer and does not drill a portion of the dielectric layer.
In this embodiment, the first conductive layer and the first insulating layer are drilled through once according to the first drilling range, so that holes with the size of the first drilling range are prepared on the first conductive layer and the first insulating layer. I.e. the first drilling range is the range of the hole diameter of the hole to be prepared for processing the plate.
In a specific application scenario, the drilling may be performed by mechanically controlling the depth or mechanically drilling a preset position of the first conductive layer, and drilling through the first conductive layer and the first insulating layer to expose a part of the dielectric layer.
In another specific application scenario, the hole may be drilled through a preset position of the first conductive layer by means of laser drilling, and the first conductive layer and the first insulating layer may be drilled through to expose a part of the dielectric layer.
Step S13: and drilling the exposed part of the dielectric layer according to the second drilling range, and drilling through the dielectric layer to prepare the printed circuit board.
And after exposing part of the dielectric layer, drilling the exposed part of the dielectric layer according to a second drilling range, and drilling through the dielectric layer, so that holes are formed in the dielectric layer to prepare the printed circuit board. Wherein the second borehole range is smaller than the first borehole range.
In one specific application scenario, the drilling may be performed by mechanically controlling the depth or mechanically drilling the exposed portion of the dielectric layer and drilling through the dielectric layer.
In another specific application scenario, the exposed portion of the dielectric layer may also be drilled by laser drilling and through the dielectric layer.
The mechanical drilling and laser drilling may generate high temperature exceeding 500 deg.c during drilling, so that the dielectric layer is affected by high temperature and heat shrinkage is produced. Therefore, this embodiment is through dividing into at least twice with the drilling step, independently bore the dielectric layer through the second drilling scope that is less than the first drilling scope of first drilling to reserve the space that the dielectric layer is heated to shrink, thereby make the hole that forms on the dielectric layer even the pyrocondensation, the condition that can make the indent appear in the hole also can not appear, and then make the hole that the secondary drilling formed on the dielectric layer be close with the aperture of the hole that the primary drilling formed on first conducting layer and first insulating layer, improve the planarization of the inner wall of hole, thereby ensure the signal transmission of hole, improve printed circuit board's reliability.
Through at least two drilling holes, the holes penetrating through at least the first conductive layer, the first insulating layer and the dielectric layer are obtained in the embodiment, so that the holes can be used for subsequent preparation of the printed circuit board, and after the subsequent preparation of the printed circuit board is completed, the holes penetrate through the printed circuit board in the embodiment.
Through the steps, the preparation method of the printed circuit board of the embodiment includes the steps of firstly obtaining the processed plate, then drilling the preset position of the first conductive layer of the processed plate according to the first drilling range, drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer, drilling through the dielectric layer according to the second drilling range, and preparing the printed circuit board, so that the drilling step is divided into at least two times, firstly, holes with normal aperture are prepared on the conductive layer and the insulating layer through one drilling, and then, independently drilling the dielectric layer through the second drilling range smaller than the first drilling range of the first drilling to reserve the space for heat shrinkage of the dielectric layer, so that even though the holes formed on the dielectric layer are heat-shrunk, the situation of concave inner holes does not occur, further the holes formed on the dielectric layer through two drilling holes are close to the apertures of the holes formed on the conductive layer and the insulating layer through one drilling, the inner wall of the holes is improved, signal transmission of the holes is further improved, and reliability of the printed circuit board is improved.
Referring to fig. 2, fig. 2 is a schematic flow chart of another embodiment of a method for manufacturing a printed circuit board according to the present invention. The preparation method of the embodiment is suitable for preparing the through hole.
Step S21: and obtaining a processed plate, wherein the processed plate at least comprises a first conductive layer, a first insulating layer, a dielectric layer, a second insulating layer and a second conductive layer which are laminated and attached in sequence.
The method comprises the steps of at least obtaining a first conductive layer, a first insulating layer, a dielectric layer, a second insulating layer and a second conductive layer, sequentially laminating the first conductive layer, the first insulating layer, the dielectric layer, the second insulating layer and the second conductive layer, and laminating the laminated first conductive layer, the first insulating layer, the dielectric layer, the second insulating layer and the second conductive layer to obtain a processed plate.
The first conductive layer, the first insulating layer, the dielectric layer, the second insulating layer and the second conductive layer, which are sequentially laminated and bonded, are the minimum processing unit for processing the plate in this embodiment. In a specific application scenario, the processing board may be additionally provided with at least one insulating layer and at least one conductive layer on at least one side of the minimum processing unit. In another specific application scenario, the processing board may be newly added with at least one insulating layer and at least one other minimum processing unit on at least one side of the minimum processing unit. The specific structure of the processed plate is not limited herein.
Step S22: and drilling a preset position of the first conductive layer of the processed plate according to the first drilling range by using the first drill bit, and drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer.
After the processed plate is obtained, a first drill bit is utilized to drill a preset position of a first conductive layer of the processed plate according to a first drilling range, and the first conductive layer and the first insulating layer are drilled through, so that part of the dielectric layer is exposed. Wherein the first drilling range is the pore diameter range of the prepared pore required for processing the plate.
In the step, holes with the size of a first drilling range are prepared on the first conducting layer and the first insulating layer of the processed plate by one-time drilling.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an embodiment of the processing board in step S22 in the embodiment of fig. 2.
In this embodiment, the first conductive layer 101, the first insulating layer 102, the dielectric layer 103, the second insulating layer 104, and the second conductive layer 105, which are sequentially stacked and bonded, are described as an example, and in other embodiments, the processed plate 100 further includes other stacking methods, which are not limited herein.
The hole 106 in this embodiment penetrates the first conductive layer 101 and the first insulating layer 102, and exposes a portion of the dielectric layer 103. Wherein the pore size of the pores 106 is the same as the first drilling range. The number of holes 106 may be plural or one.
Step S23: and drilling the second conductive layer and the second insulating layer which correspond to the preset positions on the processing plate according to the first drilling range until the other side of part of the dielectric layer is exposed.
And drilling the second conductive layer and the second insulating layer which correspond to the preset positions on the processing plate according to the first drilling range until the other side of part of the dielectric layer is exposed. And preparing holes exposing the other side of the partial dielectric layer by secondary drilling at the same position of the reverse side of the processed plate, wherein the aperture range of the holes is also the first drilling range.
The step of drilling the second conductive layer and the second insulating layer needs to be performed before the step of drilling the dielectric layer, so that the dielectric layer is prevented from thermal shrinkage again due to the temperature generated by the drilling, and the flatness inside the through hole is prevented from being affected.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of the processing board in step S23 in the embodiment of fig. 2.
The second conductive layer 105 and the second insulating layer 104 of the processed plate 100 of the present embodiment are correspondingly provided with holes 107 corresponding to the holes 106 on the first conductive layer 101 and the first insulating layer 102, so as to expose the other side of a part of the dielectric layer 103, where the aperture of the holes 107 is the same as the aperture of the holes 106.
Step S24: and drilling the exposed part of the dielectric layer according to the second drilling range by using a second drill bit, and drilling through the dielectric layer.
And drilling the exposed part of the dielectric layer by using a second drill bit according to a second drilling range, and drilling through the dielectric layer, so that the whole plate of the processing plate is penetrated, and a through hole which is required to be prepared is formed.
The second drilling range is smaller than the first drilling range, and specifically, the second drilling range is obtained by performing difference processing on the first drilling range and twice the preset shrinkage range; the preset shrinkage distance is a thermal shrinkage distance of the dielectric layer, and the thermal shrinkage distance of the dielectric layer can be obtained by drilling the dielectric layer in advance or can be obtained by calculation based on physical parameters of the dielectric layer.
According to the embodiment, the accurate dielectric layer allowance can be reserved by setting the twice preset shrinkage range to the consideration of the second drilling range in advance, so that the dielectric layer is affected by high temperature, the aperture obtained after heat shrinkage is identical to the first drilling range, the inner wall of the whole through hole is smooth, signal transmission of the hole is guaranteed, and the reliability of the printed circuit board is improved.
And the diameter of the second drill bit of the embodiment is smaller than that of the first drill bit, so that the accuracy and the accuracy of the current drilling are improved through the smaller second drill bit, the flatness of the inner wall of the hole of the whole through hole is further improved, the signal transmission of the hole is ensured, and the reliability of the printed circuit board is improved.
The dielectric material of the dielectric layer in this embodiment is polymethacrylimide, wherein the polymethacrylimide has good electrical insulation, the dielectric constant is 1.05-1.13, the dielectric loss is 0.001-0.0018, the DK and Df change is small, and good broadband stability is shown.
Step S25: carrying out copper deposition electroplating treatment on the drilled processed plate so as to metalize the processed plate; carrying out pattern transfer treatment on the conductive layer on the metallized processed plate so as to prepare a conductive circuit; and carrying out surface treatment on the processed plate after the pattern transfer treatment to prepare the printed circuit board.
After the through holes are drilled in the processed plate, copper deposition electroplating treatment can be carried out on the drilled processed plate to metalize the processed plate, so that metalized holes are formed in the processed plate, and interconnection among plates is realized.
And then carrying out pattern transfer treatment on the conductive layer on the metallized processing plate to prepare a conductive circuit so as to realize the function of the circuit board. Specifically, the surface portion of the conductive layer on the metallized processed plate may be covered with an etching resist; etching the metallized processed plate to form a conductive circuit; and removing the anti-corrosion film.
And finally, carrying out surface treatment on the processed plate after the pattern transfer treatment to prepare the printed circuit board. Specifically, the surface of the processed plate after the pattern transfer treatment may be coated with ink and/or electroplated with nickel gold, cleaned and baked to complete the surface treatment.
Through the steps, the preparation method of the printed circuit board in the embodiment divides the preparation of the through hole into three drilling holes, firstly drills through the first conductive layer and the first insulating layer according to the first drilling range, then drills through the second conductive layer and the second insulating layer according to the first drilling range, finally drills through the exposed part of the dielectric layer according to the second drilling range by using the second drill bit, and drills through the dielectric layer, thereby preparing the through hole. According to the embodiment, the space for the medium layer to shrink inwards when the medium layer is reserved during three times of drilling, so that the hole formed in the medium layer cannot be concave even though the medium layer is subjected to heat shrinkage, the hole formed in the medium layer during three times of drilling is identical to the hole formed in the conducting layer and the insulating layer during one time of drilling and the hole formed in the conducting layer and the insulating layer during two times of drilling, the flatness of the inner wall of the hole is improved, signal transmission of the hole is guaranteed, and the reliability of the printed circuit board is improved.
Referring to fig. 5, fig. 5 is a schematic flow chart of a preparation method of a printed circuit board according to another embodiment of the present invention. The preparation method of the embodiment is suitable for preparing the blind holes.
Step S31: and obtaining a processed plate, wherein the processed plate at least comprises a first conductive layer, a first insulating layer, a dielectric layer, a second insulating layer and a second conductive layer which are laminated and attached in sequence.
The step is similar to the step S21 in the previous embodiment, please refer to the previous description, and the description is omitted here.
Step S32: and drilling the preset position of the first conductive layer of the processed plate according to the first drilling range, and drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer.
After the processed plate is obtained, a first drill bit is utilized to drill a preset position of a first conductive layer of the processed plate according to a first drilling range, and the first conductive layer and the first insulating layer are drilled through, so that part of the dielectric layer is exposed. Wherein the first drilling range is the pore diameter range of the prepared pore required for processing the plate.
In the step, holes with the size of a first drilling range are prepared on the first conducting layer and the first insulating layer of the processed plate by one-time drilling.
The schematic structure of the processed plate in this embodiment is the same as that of fig. 3, please refer to fig. 3.
Step S33: and drilling the dielectric layer of the exposed part and the corresponding second insulating layer according to the second drilling range until part of the second conductive layer is exposed.
And drilling the dielectric layer of the exposed part and the corresponding second insulating layer by using a second drill bit according to a second drilling range, and drilling through the dielectric layer, so that the whole plate of the processed plate is penetrated, and the required preparation blind hole is formed. The blind holes are required to be conducted among different conductive layers, so that the second insulating layer is required to be drilled through in the current drilling.
The dielectric material of the dielectric layer in this embodiment is polymethacrylimide, wherein the polymethacrylimide has good electrical insulation, the dielectric constant is 1.05-1.13, the dielectric loss is 0.001-0.0018, the DK and Df change is small, and good broadband stability is shown.
Referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of the processing board in step S33 in the embodiment of fig. 5.
The processed board 200 of the present embodiment includes a first conductive layer 201, a first insulating layer 202, a dielectric layer 203, a second insulating layer 204, and a second conductive layer 205 that are sequentially stacked and bonded. The processing board 200 is provided with a blind hole 206, and the blind hole 206 penetrates through the first conductive layer 201, the first insulating layer 202, the dielectric layer 203, and the second insulating layer 204, and exposes the second conductive layer 205.
Wherein the aperture of the blind via 206 at the second insulating layer 204 is smaller than the aperture at the other layers. Specifically, the aperture of the blind via 206 at the second insulating layer 204 is a second drilling range, and the aperture of the blind via 206 at the other layers is a first drilling range.
Step S34: carrying out copper deposition electroplating treatment on the drilled processed plate so as to metalize the processed plate; carrying out pattern transfer treatment on the conductive layer on the metallized processed plate so as to prepare a conductive circuit; and carrying out surface treatment on the processed plate after the pattern transfer treatment to prepare the printed circuit board.
The step is similar to the step S25 in the previous embodiment, please refer to the previous step, and the description is omitted here.
Through the steps, the preparation method of the printed circuit board in the embodiment splits the preparation of the blind holes into secondary drilling, firstly drills through the first conductive layer and the first insulating layer according to the first drilling range, and then drills through the exposed part of the dielectric layer and the second insulating layer according to the second drilling range by using the second drill bit, so that the through holes are prepared. According to the embodiment, the space for the medium layer to shrink inwards when the medium layer is reserved during secondary drilling, so that even though the holes formed in the medium layer are shrunk, the holes cannot be concave, the holes formed in the medium layer by secondary drilling are close to the holes formed in the conducting layer and the insulating layer by primary drilling, the flatness of the inner wall of the holes is improved, signal transmission of the holes is guaranteed, and the reliability of the printed circuit board is improved.
Referring to fig. 7, fig. 7 is a schematic structural diagram of an embodiment of a printed circuit board according to the present invention. In this embodiment, the printed circuit board is provided with a blind hole and a through hole at the same time, and in other embodiments, the printed circuit board may be provided with only a blind hole or a through hole, which is not limited herein.
The printed circuit board 300 of the present embodiment at least includes a first solder mask layer 308, a first circuit layer 301, a first insulating layer 302, a dielectric layer 303, a second insulating layer 304, a second circuit layer 305, and a second solder mask layer 309, which are laminated and bonded in sequence.
The printed circuit board 300 is provided with a metallized blind via 306 and a metallized through via 307, wherein the metallized blind via 306 penetrates through the first solder mask layer 308, the first circuit layer 301, the first insulating layer 302, the dielectric layer 303, the second insulating layer 304, and exposes the second circuit layer 305. Wherein the aperture of the metallized blind via 306 is smaller at the second insulating layer 304 than at the other layers. Specifically, the aperture of the blind metallization hole 306 at the second insulating layer 304 is a second drilling range, and the aperture of the blind metallization hole 306 at the other layers is a first drilling range.
The metallized through holes 307 extend through the entire printed circuit board 300 to effect board interconnection. Wherein the aperture of the metallized via 307 is a first range of drilling.
The dielectric material of the dielectric layer 303 in this embodiment is polymethacrylimide, where the polymethacrylimide has good electrical insulation, the dielectric constant is 1.05-1.13, the dielectric loss is 0.001-0.0018, the variation of dk and Df is small, and good broadband stability is shown.
Through the structure, the printed circuit board of the embodiment can well use the polymethacrylimide as a medium layer, so that the concave situation of various holes is avoided, the signal transmission of the holes is ensured, the reliability of the printed circuit board is improved, and the broadband stability of the printed circuit board is improved by using the polymethacrylimide.
The foregoing description is only of embodiments of the present invention, and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (10)
1. The preparation method of the printed circuit board is characterized by comprising the following steps of:
obtaining a processed plate, wherein the processed plate at least comprises a first conductive layer, a first insulating layer, a dielectric layer, a second insulating layer and a second conductive layer which are laminated and adhered in sequence;
drilling a preset position of a first conductive layer of the processing plate according to a first drilling range, and drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer;
drilling the dielectric layer of the exposed part according to a second drilling range, and drilling through the dielectric layer to prepare the printed circuit board;
wherein the second borehole range is smaller than the first borehole range.
2. The method for manufacturing a printed circuit board according to claim 1, wherein,
the second drilling range is obtained by performing difference processing on the first drilling range and a twice preset shrinkage range;
the preset shrinkage distance is the thermal shrinkage distance of the dielectric layer.
3. The method of claim 1, wherein the step of drilling a predetermined location of the first conductive layer of the processed board according to a first drilling range and drilling through the first conductive layer and the first insulating layer to expose a portion of the dielectric layer comprises:
drilling a preset position of a first conductive layer of the processing plate according to the first drilling range by using a first drill bit, and drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer;
the step of drilling the exposed part of the dielectric layer according to the second drilling range and drilling through the dielectric layer to prepare the printed circuit board comprises the following steps of:
drilling the dielectric layer of the exposed part according to the second drilling range by using a second drill bit, and drilling through the dielectric layer to prepare the printed circuit board;
wherein the diameter of the second drill bit is smaller than that of the first drill bit.
4. A method of manufacturing a printed circuit board according to any one of claims 1 to 3, wherein the step of drilling a predetermined location of the first conductive layer of the processed board according to a first drilling range and drilling through the first conductive layer and the first insulating layer to expose a portion of the dielectric layer further comprises:
drilling a preset position of a first conductive layer of the processing plate according to a first drilling range, and drilling through the first conductive layer and the first insulating layer to expose part of the dielectric layer; and
and drilling the second conductive layer and the second insulating layer which correspond to the preset positions on the processing plate according to the first drilling range until the other side of the partial dielectric layer is exposed.
5. A method of manufacturing a printed circuit board according to any one of claims 1 to 3, wherein the step of drilling the dielectric layer of the exposed portion in accordance with the second drilling range and drilling through the dielectric layer to manufacture the printed circuit board comprises:
and drilling the dielectric layer and the corresponding second insulating layer of the exposed part according to the second drilling range until the second conductive layer of the exposed part is exposed, so as to prepare the printed circuit board.
6. The method of manufacturing a printed circuit board of claim 1, wherein the dielectric layer comprises a polymethacrylimide layer.
7. The method of manufacturing a printed circuit board of claim 1, wherein the step of drilling the dielectric layer of the exposed portion in accordance with the second drilling range and drilling through the dielectric layer comprises:
carrying out copper deposition electroplating treatment on the drilled processed plate so as to metalize the processed plate;
carrying out pattern transfer treatment on the conductive layer on the metallized processed plate so as to prepare a conductive circuit;
and carrying out surface treatment on the processed plate after the pattern transfer treatment to prepare the printed circuit board.
8. The method of manufacturing a printed circuit board of claim 7, wherein the step of performing a pattern transfer process on the conductive layer on the metallized processed board to manufacture the conductive trace comprises:
covering the surface part of the conducting layer on the metallized processing plate with an anti-corrosion film;
etching the metallized processed plate to form the conductive circuit;
and removing the corrosion-resistant film.
9. The method of manufacturing a printed circuit board according to claim 7, wherein the step of performing surface treatment on the processed board after the pattern transfer treatment to manufacture the printed circuit board comprises:
and coating ink and/or electroplating nickel gold on the surface of the processed plate after the pattern transfer treatment to finish the surface treatment.
10. A printed circuit board, characterized in that the printed circuit board is produced by the production method of a printed circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210191432.XA CN116709643A (en) | 2022-02-28 | 2022-02-28 | Printed circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210191432.XA CN116709643A (en) | 2022-02-28 | 2022-02-28 | Printed circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116709643A true CN116709643A (en) | 2023-09-05 |
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ID=87822728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210191432.XA Pending CN116709643A (en) | 2022-02-28 | 2022-02-28 | Printed circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116709643A (en) |
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2022
- 2022-02-28 CN CN202210191432.XA patent/CN116709643A/en active Pending
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