CN116708618B

CN116708618B - Foldable electronic device

Info

Publication number: CN116708618B
Application number: CN202211566613.2A
Authority: CN
Inventors: 李昕; 宗献波; 潘广斌
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-12-07
Filing date: 2022-12-07
Publication date: 2024-04-02
Anticipated expiration: 2042-12-07
Also published as: CN116708618A

Abstract

The embodiment of the application provides a foldable electronic device, which comprises a transmission component located in a bending area of the foldable electronic device, wherein the transmission component comprises a first transmission component used for transmitting high-speed signals and a second transmission component used for transmitting power signals, the total thickness of a first conductive layer and a second conductive layer in the first transmission component is smaller than 24um, the total thickness of a third substrate layer and a fourth substrate layer in the second transmission component is smaller than 24um, or the transmission component comprises a third transmission component used for transmitting the high-speed signals and the power signals, the total thickness of a fifth substrate layer and a sixth substrate layer in the third transmission component is smaller than 24um, and the width of at least one of a third sub conductive layer and a fourth sub conductive layer located in the high-speed signal transmission area is smaller than 60 um.

Description

Foldable electronic device

Technical Field

The embodiment of the application relates to the technical field of terminals, in particular to foldable electronic equipment.

Background

With the rapid development of communication technology, the signal transmission performance requirements inside the communication device become higher and higher. For example, in the current trend of multiple antennas, for a foldable communication device, only one antenna is generally disposed on one side, and if an antenna is required to be disposed on the other side, a transmission assembly for transmitting signals needs to be connected to circuit boards on both sides through a rotating shaft assembly, so that extremely high requirements are placed on the performance of the transmission assembly.

Taking an electronic device as an example of a folding screen mobile phone, in the related art, a transmission component is generally arranged on the folding screen mobile phone, one end of the transmission component is connected with a circuit board on one side of the folding screen mobile phone, the other end of the transmission component passes through a rotating shaft to be connected with a circuit board on the other side of the folding screen mobile phone, and as the demand of the folding screen mobile phone on the whole machine is higher and higher, the whole machine is lighter and thinner, the mechanical structural space of the rotating shaft is reduced, and further, the thickness of the transmission component (namely the bending part of the transmission component) in the rotating shaft area is required to be reduced.

However, in the above-mentioned scheme, the transmission component located in the rotating shaft area cannot satisfy both the resistance of the power signal and the characteristic impedance of the high-speed signal, so that the performance requirement of the transmission component required in the folding screen device cannot be met.

Disclosure of Invention

The embodiment of the application provides a foldable electronic device, which can give consideration to the resistance of a power signal and the characteristic impedance of a high-speed signal while thinning a design transmission assembly, and further can meet the performance requirement of the required transmission assembly in folding screen equipment.

A first aspect of the present application provides a foldable electronic device, including a transmission assembly located in a bending region of the foldable electronic device, where the transmission assembly includes at least: the first transmission assembly is used for transmitting high-speed signals and at least comprises the following components in a laminated mode: a first conductive layer, a first substrate layer, a second substrate layer, and a second conductive layer; and a second transmission assembly for transmitting a power signal, the second transmission assembly including at least: a third conductive layer, a third substrate layer, a fourth substrate layer, and a fourth conductive layer; wherein the total thickness of the first conductive layer and the second conductive layer is less than 24um; and the third substrate layer and the fourth substrate layer have a total thickness of less than 24um.

According to the foldable electronic device, the transmission assembly is designed to comprise the first transmission assembly used for transmitting high-speed signals and the second transmission assembly used for transmitting power signals, wherein the total thickness of the first conductive layer and the second conductive layer in the first transmission assembly used for transmitting the high-speed signals is smaller than 24um, the total thickness of the first conductive layer and the second conductive layer in the first transmission assembly is relatively thin, the performance of the first transmission assembly for transmitting the high-speed signals cannot be affected, the total thickness of the third substrate layer and the fourth substrate layer in the second transmission assembly used for transmitting the power signals is smaller than 24um, the total thickness of the third substrate layer and the fourth substrate layer in the second transmission assembly is relatively thin, the performance of the second transmission assembly for transmitting the power signals cannot be affected, and therefore, the resistance of the power signals and the characteristic impedance of the high-speed signals can be considered while the first transmission assembly and the second transmission assembly are designed in a thin mode, and the performance requirements of the required transmission assembly in the folding screen device can be met.

In one possible implementation, at least one of the first conductive layer and the second conductive layer has a thickness of less than 12um; and a thickness of at least one of the third substrate layer and the fourth substrate layer is less than 12um. The total thickness of the first conductive layer and the second conductive layer in the first transmission component is less than 24um, and the thickness of at least one of the first conductive layer and the second conductive layer is less than 12um, that is, the thickness of the first conductive layer is less than 12um, or the thickness of the second conductive layer is less than 12um, or the thicknesses of the first conductive layer and the second conductive layer are respectively less than 12um, so that the effect of relatively thinning the total thickness of the first conductive layer and the second conductive layer can be achieved. The total thickness of the third substrate layer and the fourth substrate layer in the second transmission component is less than 24um, and the thickness of at least one of the third substrate layer and the fourth substrate layer is less than 12um, that is, the thickness of the third substrate layer is less than 12um, or the thickness of the fourth substrate layer is less than 12um, or the thicknesses of the third substrate layer and the fourth substrate layer are respectively less than 12um, so that the effect of relatively thinning the total thickness of the third substrate layer and the fourth substrate layer can be achieved.

In one possible implementation, the thickness of the first conductive layer is 3um or more, and the thickness of the first conductive layer is less than 12um; and the thickness of the second conductive layer is more than or equal to 3um, and the thickness of the second conductive layer is less than 12um.

The thickness of the first conductive layer is between 3um and 12um, so that the effect of relatively thinning the thickness of the first conductive layer and the overall thickness of the first transmission assembly can be achieved on the premise that the manufacturing process of the first transmission assembly and the signal insertion loss performance meet the requirements. The thickness of the second conductive layer is between 3um and 12um, so that the effect of relatively thinning the thickness of the second conductive layer and the whole thickness of the first transmission assembly can be achieved on the premise that the manufacturing process of the first transmission assembly and the signal insertion loss performance meet the requirements.

In one possible implementation, the thickness of the third substrate layer is greater than or equal to 5um, and the thickness of the third substrate layer is less than 12um; and the thickness of the fourth substrate layer is more than or equal to 5um, and the thickness of the fourth substrate layer is less than 12um.

The thickness of the third substrate layer is between 5um and 12um, so that the effect of relatively thinning the thickness of the third substrate layer and the whole thickness of the second transmission assembly can be achieved on the premise that the manufacturing process and the mechanical reliability of the second transmission assembly meet the requirements. The thickness of the fourth substrate layer is between 5um and 12um, so that the effect of relatively thinning the thickness of the fourth substrate layer and the whole thickness of the second transmission assembly can be achieved on the premise that the manufacturing process and the mechanical reliability of the second transmission assembly meet the requirements.

In one possible implementation, the first conductive layer has a thickness of 9um and the second conductive layer has a thickness of 9um.

In one possible implementation, the thickness of the third substrate layer is 9um, and the thickness of the fourth substrate layer is 9um.

In one possible implementation, in the first transmission component, the total thickness of the first conductive layer and the first substrate layer is equal to the total thickness of the second conductive layer and the second substrate layer; and in the second transmission component, the total thickness of the third conductive layer and the third substrate layer is equal to the total thickness of the fourth conductive layer and the fourth substrate layer.

The total thickness of the first conductive layer and the first substrate layer is equal to that of the second conductive layer and the second substrate layer, the upper layer structure and the lower layer structure in the first transmission assembly can be ensured to be symmetrical relatively, the process manufacturing of the first transmission assembly is convenient, and the reliability of the whole structure of the first transmission assembly is also good. The total thickness of the third conductive layer and the third substrate layer is equal to that of the fourth conductive layer and the fourth substrate layer, so that the upper layer structure and the lower layer structure in the second transmission assembly are relatively symmetrical, the process manufacturing of the second transmission assembly is convenient, and the reliability of the whole structure of the second transmission assembly is also good.

In one possible implementation, the first conductive layer includes laterally spaced apart from one another: a first sub-conductive layer and a second sub-conductive layer. By designing the first conductive layer as a first sub-conductive layer and a second sub-conductive layer laterally spaced apart from each other, a normal transmission of high-speed signals can be ensured.

In one possible implementation, the first transmission component further includes: a first adhesive layer; wherein the first adhesive layer is located between the first substrate layer and the second substrate layer; and the second transmission assembly further comprises: a second adhesive layer; wherein the second adhesive layer is located between the third substrate layer and the fourth substrate layer.

By designing the first adhesive layer between the first substrate layer and the second substrate layer, adhesion between the first substrate layer and the second substrate layer can be ensured, and further the overall structural strength of the first transmission assembly can be ensured. By designing the second adhesive layer between the third substrate layer and the fourth substrate layer, adhesion between the third substrate layer and the fourth substrate layer can be ensured, and further the overall structural strength of the second transmission assembly can be ensured.

In one possible implementation, the first adhesive layer includes: a plurality of first sub-adhesive layers arranged at intervals; wherein a first gap is formed between two adjacent first sub-bonding layers; the second adhesive layer includes: a plurality of second sub-adhesive layers arranged at intervals; and a second gap is arranged between two adjacent second sub-bonding layers.

Through the first sub-adhesive linkage that designs into a plurality of intervals setting with first adhesive linkage, can play the effect of saving the cost when bonding between first substrate layer and second substrate layer. Through the second sub-adhesive layer that designs into a plurality of intervals setting with the second adhesive layer, can play the effect of saving the cost when bonding between third substrate layer and fourth substrate layer.

In one possible implementation, the first transmission component further includes: a first cover film and a second cover film; the first cover film is positioned on one surface of the first conductive layer, which is away from the first substrate layer, and the second cover film is positioned on one surface of the second conductive layer, which is away from the second substrate layer;

and the second transmission assembly further comprises: a third cover film and a fourth cover film; the third cover film is located on one face, away from the third substrate layer, of the third conductive layer, and the fourth cover film is located on one face, away from the fourth substrate layer, of the fourth conductive layer.

The first cover film can play a role in insulating and protecting the first conductive layer. The second cover film can play a role in insulating and protecting the second conductive layer. The third cover film can play a role in insulating and protecting the third conductive layer. The fourth cover film can play a role in insulating and protecting the fourth conductive layer.

In one possible implementation, the first transmission component further includes: a first shielding film; the first shielding film is positioned on one surface of the first cover film, which is away from the first conductive layer; and the second transmission assembly further comprises: a second shielding film; the second shielding film is positioned on one surface of the third cover film, which is away from the third conductive layer.

The first shielding film can play a role in shielding protection, and scratch and damage to the first transmission assembly caused by the outside are avoided or reduced. The second shielding film can play a role in shielding protection, and scratch and damage to the second transmission assembly caused by the outside are avoided or reduced.

A second aspect of embodiments of the present application provides another foldable electronic device, including a transmission assembly located in a bending region of the foldable electronic device, where the transmission assembly includes at least: a third transmission assembly for transmitting the high-speed signal and the power signal; the third transmission assembly at least comprises a plurality of transmission assemblies which are sequentially stacked: a fifth conductive layer, a fifth substrate layer, a sixth substrate layer, and a sixth conductive layer; wherein the total thickness of the fifth substrate layer and the sixth substrate layer is less than 24um;

the fifth conductive layer includes spaced apart from each other: a third sub-conductive layer, a fourth sub-conductive layer, and a fifth sub-conductive layer; the interval between the fourth sub-conductive layer and the fifth sub-conductive layer divides the third transmission assembly into a high-speed signal transmission area and a power signal transmission area along the thickness direction of the third transmission assembly; the third sub-conductive layer and the fourth sub-conductive layer are both positioned in the high-speed signal transmission area, and the fifth sub-conductive layer is positioned in the power signal transmission area; wherein at least one of the third sub-conductive layer and the fourth sub-conductive layer has a width of less than 60um.

According to the foldable electronic device, the transmission assembly is designed to comprise the third transmission assembly used for transmitting high-speed signals and power signals, the total thickness of the fifth substrate layer and the sixth substrate layer in the third transmission assembly is smaller than 24um, the total thickness of the fifth substrate layer and the sixth substrate layer in the third transmission assembly is relatively reduced, the performance of the third transmission assembly for transmitting the power signals cannot be affected, however, due to the fact that the total thickness of the fifth substrate layer and the sixth substrate layer is relatively reduced, the distance between the third conductive layer and the fourth conductive layer is reduced, the characteristic impedance is increased, the performance of the third transmission assembly for transmitting the high-speed signals can be affected, the width of at least one of the third sub conductive layer and the fourth sub conductive layer in the high-speed signal transmission area is smaller than 60um, the characteristic impedance can be reduced due to the fact that the line width of the third sub conductive layer and the fourth sub conductive layer is relatively reduced, and therefore the performance of the third transmission assembly for transmitting the high-speed signals can be improved, and the required signal transmission device can be folded when the third transmission assembly is designed to be achieved, and the required high-speed signal transmission device can be achieved.

In one possible implementation, at least one of the fifth substrate layer and the sixth substrate layer has a thickness of less than 12um.

The total thickness of the fifth substrate layer and the sixth substrate layer in the third transmission component is less than 24um, and the thickness of at least one of the fifth substrate layer and the sixth substrate layer is less than 12um, that is, the thickness of the fifth substrate layer is less than 12um, or the thickness of the sixth substrate layer is less than 12um, or the thicknesses of the fifth substrate layer and the sixth substrate layer are respectively less than 12um, so that the effect of relatively thinning the total thickness of the fifth substrate layer and the sixth substrate layer can be achieved.

In one possible implementation, the thickness of the fifth substrate layer is greater than or equal to 5um, and the thickness of the fifth substrate layer is less than 12um. The thickness of the fifth substrate layer is between 5um and 12um, so that the effect of relatively thinning the thickness of the fifth substrate layer and the whole thickness of the third transmission assembly can be achieved on the premise that the manufacturing process and the mechanical reliability of the third transmission assembly meet the requirements.

In one possible implementation, the thickness of the sixth substrate layer is greater than or equal to 5um, and the thickness of the sixth substrate layer is less than 12um. The thickness of the sixth substrate layer is between 5um and 12um, so that the effect of relatively thinning the thickness of the sixth substrate layer and the whole thickness of the third transmission assembly can be achieved on the premise that the manufacturing process and the mechanical reliability of the third transmission assembly meet the requirements.

In one possible implementation, the thickness of the fifth substrate layer is 12um, and the thickness of the sixth substrate layer is 9um.

In one possible implementation, the width of the third sub-conductive layer is greater than or equal to 55um, and the width of the third sub-conductive layer is less than 60um; and the width of the fourth sub-conductive layer is more than or equal to 55um, and the width of the fourth sub-conductive layer is less than 60um.

The width of the third sub-conductive layer positioned in the high-speed signal transmission area is designed to be between 55um and 60um, and the line width of the third sub-conductive layer is relatively reduced, so that the characteristic impedance can be reduced on the premise of meeting the line width processing capacity, and the performance of the third transmission assembly for transmitting high-speed signals can be improved. The width of the fourth sub-conductive layer in the high-speed signal transmission area is designed to be between 55um and 60um, and the line width of the fourth sub-conductive layer is relatively reduced, so that the characteristic impedance can be reduced on the premise of meeting the line width processing capacity, and the performance of the third transmission component for transmitting high-speed signals can be improved.

In one possible implementation, the width of the third sub-conductive layer is 55um; and the width of the fourth sub-conductive layer is 55um.

In one possible implementation, the third transmission component further includes: a third adhesive layer; wherein the third adhesive layer is located between the fifth substrate layer and the sixth substrate layer. By designing the third adhesive layer between the fifth base material layer and the sixth base material layer, adhesion between the fifth base material layer and the sixth base material layer can be ensured, and further the overall structural strength of the third transmission assembly can be ensured.

In one possible implementation, the third adhesive layer includes: a plurality of third sub-adhesive layers arranged at intervals; and a third gap is formed between every two adjacent third sub-bonding layers. By designing the third adhesive layer to be a plurality of third sub adhesive layers arranged at intervals, the fifth substrate layer and the sixth substrate layer can be adhered, and meanwhile, the effect of saving cost is achieved.

In one possible implementation, the third transmission component further includes: a fifth cover film and a sixth cover film; the fifth cover film is located on one surface of the fifth conductive layer, which is away from the fifth substrate layer, and the sixth cover film is located on one surface of the sixth conductive layer, which is away from the sixth substrate layer. The fifth cover film can play a role in insulating and protecting the fifth conductive layer.

The sixth cover film can play a role in insulating and protecting the sixth conductive layer.

In one possible implementation, the third transmission component further includes: a third shielding film; the third shielding film is positioned on one surface of the fifth cover film, which is away from the fifth conductive layer. The third shielding film can play a role in shielding protection, and scratch and damage to the third transmission assembly caused by the outside are avoided or reduced.

In one possible implementation, the foldable electronic device further includes: a first structural member and a second structural member; a bending area is arranged between the first structural member and the second structural member; the first structural member comprises at least: the first circuit board, the second structure includes at least: a second circuit board; one end of the transmission assembly is connected with the first circuit board, and the other end of the transmission assembly is connected with the second circuit board.

In one possible implementation manner, one end of the first transmission component is connected with the first circuit board, and the other end of the first transmission component is connected with the second circuit board; one end of the second transmission assembly is connected with the first circuit board, and the other end of the second transmission assembly is connected with the second circuit board.

One end of the first transmission component is connected with the first circuit board, and the other end of the first transmission component is connected with the second circuit board, so that high-speed signal transmission between the first circuit board and the second circuit board can be ensured. One end of the second transmission assembly is connected with the first circuit board, and the other end of the second transmission assembly is connected with the second circuit board, so that transmission of power signals between the first circuit board and the second circuit board can be ensured.

In one possible implementation, one end of the third transmission component is connected to the first circuit board, and the other end of the third transmission component is connected to the second circuit board. One end of the third transmission assembly is connected with the first circuit board, and the other end of the third transmission assembly is connected with the second circuit board, so that high-speed signal transmission and power signal transmission between the first circuit board and the second circuit board can be ensured simultaneously.

Drawings

Fig. 1 is a schematic perspective view of a folding screen mobile phone in a folded state according to an embodiment of the present application;

fig. 2 is a schematic perspective view of a folding screen mobile phone in a semi-folded state according to an embodiment of the present application;

fig. 3 is a schematic perspective view of a folding mobile phone in an unfolded state according to an embodiment of the present application;

Fig. 4 is a schematic plan view of a folding screen mobile phone according to an embodiment of the present application;

FIG. 5 is a schematic cross-sectional view of a first transmission assembly of the transmission assemblies according to one embodiment of the present disclosure;

FIG. 6 is a schematic cross-sectional view of a first substrate layer, a second substrate layer, and a first adhesive layer of a first transfer member according to an embodiment of the present disclosure;

FIG. 7 is a schematic cross-sectional view of a second transmission assembly of the transmission assemblies according to one embodiment of the present disclosure;

FIG. 8 is a schematic cross-sectional view of a second transmission assembly of the transmission assemblies according to one embodiment of the present disclosure;

FIG. 9 is a schematic cross-sectional view of a third substrate layer, a fourth substrate layer, and a second adhesive layer of a second transfer assembly according to an embodiment of the present disclosure;

fig. 10 is a schematic plan view of another folding screen mobile phone according to an embodiment of the present application;

FIG. 11 is a schematic cross-sectional view of a third transmission assembly of the transmission assemblies according to one embodiment of the present disclosure;

FIG. 12 is a schematic cross-sectional view of a third transmission assembly of the transmission assemblies according to one embodiment of the present disclosure;

FIG. 13 is a schematic cross-sectional view of a fifth substrate layer, a sixth substrate layer, and a third adhesive layer of a third transfer assembly according to an embodiment of the present disclosure;

Fig. 14 is a schematic cross-sectional view of a fifth conductive layer, a fifth substrate layer, a sixth substrate layer, and a sixth conductive layer in a third transmission device according to an embodiment of the present disclosure;

fig. 15 is a schematic cross-sectional view of a third transmission assembly provided with a first through hole according to an embodiment of the present application;

fig. 16 is a schematic cross-sectional view of a first through hole in a third transmission assembly according to an embodiment of the present disclosure;

FIG. 17 is a schematic cross-sectional view of a circuit etched on a fifth conductive layer and a sixth conductive layer after a first plating layer is disposed in a first through hole in a third transmission assembly according to an embodiment of the present disclosure;

fig. 18 is a schematic cross-sectional view of a fifth conductive layer, a fifth substrate layer, a sixth substrate layer, and a sixth conductive layer in a third transmission device according to an embodiment of the present disclosure;

fig. 19 is a schematic cross-sectional view of a third transmission assembly provided with a first through hole according to an embodiment of the present application;

fig. 20 is a schematic cross-sectional view of a third transmission assembly according to an embodiment of the present disclosure, in which a first electroplated layer is disposed in a first through hole, and a second electroplated layer is disposed on a side of a sixth conductive layer facing away from a sixth substrate layer;

fig. 21 is a schematic cross-sectional view of a circuit etched on a fifth conductive layer and a sixth conductive layer after a first electroplated layer is disposed in a first through hole in a third transmission assembly and a second electroplated layer is disposed on a side of the sixth conductive layer facing away from a sixth substrate layer according to an embodiment of the present disclosure.

Reference numerals illustrate:

100-a transmission assembly; 110-a first transmission component; 111-a first conductive layer;

1111—a first sub-conductive layer; 1112-a second sub-conductive layer; 112-a first substrate layer;

113-a second substrate layer; 114-a second conductive layer; 115-a first adhesive layer;

1151-a first sub-adhesive layer; 1152-a first gap; 116-a first cover film;

117-a second cover film; 118-a first shielding film; 120-a second transmission component;

121-a third conductive layer; 122-a third substrate layer; 123-a fourth substrate layer;

124-fourth conductive layer; 125-a second adhesive layer; 1251-a second sub-adhesive layer;

1252-second gap; 126-a third cover film; 127-fourth cover film;

128-a second shielding film; 130-a third transmission component; 130 a-a high-speed signal transmission region;

130 b-a power signal transmission region; 131-a fifth conductive layer; 1311-a third sub-conductive layer;

1312-fourth subconductors; 1313-fifth subconducting layers; 1314-interval;

132-a fifth substrate layer; 133-a sixth substrate layer; 134-a sixth conductive layer;

1341-sixth sub-conductive layer; 1342-seventh sub-conductive layer; 135-a third adhesive layer;

1351-a third sub-adhesive layer; 1352-third gap; 136-a fifth cover film;

137-sixth cover film; 138-a third shielding film; 141-a first through hole;

1411-a first plating layer; 142-a second through hole; 1421-a second electroplated layer;

1422-a third electroplated layer; l1-the thickness direction of the third transfer member; 200-folding screen mobile phone;

210-inflection region; 21-a first structural member; 211-a first circuit board;

212-a first battery; 22-a second structural member; 221-a second circuit board;

222-a second battery; 23-a spindle assembly; 24-a display screen;

25-rear cover.

Detailed Description

The terminology used in the description of the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application, as will be described in detail with reference to the accompanying drawings.

Along with the gradual maturation of flexible screen technology, the display mode of electronic equipment is promoted to change very greatly, one of them is collapsible electronic equipment such as collapsible cell-phone, collapsible computer appearance, and collapsible electronic equipment just can double the efficiency that improves information interaction through a simple folding, and the mode of information interaction can be overturned more completely in designs such as many times folding and spool formula in the future. In addition, the display screen of the folding electronic equipment can flexibly change the switching mode according to different use scenes, and meanwhile, the display screen also has high screen occupation ratio and definition, for example, a foldable mobile phone is used as an example, the mobile phone can be folded to have the size of a traditional mobile phone and is convenient to carry, and the display screen of the folding electronic equipment can be unfolded to have the display size of a flat plate, so that the folding electronic equipment becomes a product which is deeply touted by people.

The embodiments of the present application provide a foldable electronic device, which may include, but is not limited to, a mobile or fixed terminal with a transmission component, such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a handheld computer, an intercom, a netbook, a Point of sale (POS) device, a personal digital assistant (personal digital assistant, PDA), a wearable device, a virtual reality device, a wireless U-disc, a bluetooth sound/earphone, or a vehicle-mounted front-mounted device, a vehicle recorder, a security device, etc.

Referring to fig. 1 to 3, taking the foldable electronic device as a folding screen mobile phone 200 as an example, the folding screen mobile phone 200 may include: the first structural member 21 and the second structural member 22 have a bending region 210 (see fig. 4) between the first structural member 21 and the second structural member 22. For example, a rotating shaft assembly 23 may be disposed in the bending region 210, the rotating shaft assembly 23 is located between the first structural member 21 and the second structural member 22, and the first structural member 21 and the second structural member 22 are rotatably connected through the rotating shaft assembly 23.

Specifically, the rotating shaft assembly 23 may include a rotating shaft and first and second connection members (not shown) disposed on two sides of an axis of the rotating shaft, wherein the rotating shaft is rotatably connected to the first and second connection members, respectively, and the first connection member is fixedly connected to the first structural member 21, and the second connection member is fixedly connected to the second structural member 22, so as to enable the first and second structural members 21 and 22 to be folded and unfolded.

In an embodiment of the present application, as shown in fig. 2 or fig. 3, the folding screen mobile phone 200 may further include: the display screen 24, wherein the display screen 24 may be a flexible screen, and the flexible screen may cover one surface of the first structural member 21, the rotating shaft assembly 23, and the second structural member 22, so that the flexible screen may be in a folded or unfolded state along with rotation of the first structural member 21 and the second structural member 22. Illustratively, when the first structural member 21 and the second structural member 22 are rotated in a direction toward each other to a folded state (see fig. 1), the flexible screen of the folding screen phone 200 is also positioned between the first structural member 21 and the second structural member 22 in the folded state. When the first structural member 21 and the second structural member 22 are rotated away from each other to an unfolded state (see fig. 3), the flexible screen of the folding screen mobile phone 200 is unfolded until the first structural member 21 and the second structural member 22 are located on the same horizontal plane.

It should be noted that the number of the structural members in the folding screen mobile phone 200 may be two (see fig. 1 to 3) or more, and when the number of the structural members is two or more, each adjacent structural member may rotate around the mutually parallel rotating shaft assemblies 23, so as to form a multi-layer structural member, or obtain a larger display area after being unfolded. In the embodiment of the present application, the folding screen mobile phone 200 is mainly described as having two structural members (i.e., the first structural member 21 and the second structural member 22).

Further, the folding screen mobile phone 200 may further include: the rear cover 25, as shown in fig. 1 or 2, is located on a face of the first structural member 21, the rotary shaft assembly 23, and the second structural member 22 facing away from the display screen 24, for example, the first structural member 21, the rotary shaft assembly 23, and the second structural member 22 are located between the display screen 24 and the rear cover 25.

Referring to fig. 4, the folding screen mobile phone 200 may further include: batteries (e.g., first battery 212 and second battery 222) and circuit boards (e.g., first circuit board 211 and second circuit board 221), for example, in fig. 4, first battery 212 and first circuit board 211 are disposed within first structural member 21 and second battery 222 and second circuit board 221 are disposed within second structural member 22.

It should be understood that the structure illustrated in the embodiments of the present application does not constitute a specific limitation on the folding screen mobile phone 200. In other embodiments of the present application, folding screen handset 200 may include more or fewer components than shown, or certain components may be combined, certain components may be split, or different arrangements of components may be provided. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

In order to implement the communication function of the folding screen mobile phone 200, an antenna (not shown in the drawing) is generally provided on the folding screen mobile phone 200 to transmit and receive signals through the antenna. In this embodiment, the antenna may be formed by breaking two breaks in the metal frame of the folding-screen mobile phone 200.

In the prior art, an antenna can only be arranged on one side structural member of a folding screen mobile phone generally, and in a multi-antenna application scene, the antenna environment is very intense.

In order to improve the antenna environment, the two side structural members of the folding screen mobile phone 200 all have antenna functions, as shown in fig. 4, the folding screen mobile phone 200 provided in the embodiment of the application may further include: the transmission assembly 100, the transmission assembly 100 may be, for example, a flexible circuit board (Flexible Printed Circuit, FPC), wherein one end of the transmission assembly 100 is connected to the first circuit board 211 in the first structural member 21, and the other end of the transmission assembly 100 is connected to the second circuit board 221 in the second structural member 22 through the rotation shaft assembly 23. For example, in fig. 4, the folding screen mobile phone 200 may have a transmission assembly 100 therein, where one end of the transmission assembly 100 is connected to a first circuit board 211 in the first structural member 21, and the other end of the transmission assembly 100 is connected to a second circuit board 221 in the second structural member 22 through the rotating shaft assembly 23. The signals transmitted by the transmission assembly 100 may include two signals, namely, a power signal and a high-speed signal, so that the transmission assembly 100 needs to consider both the resistance of the power signal and the characteristic impedance of the high-speed signal. The power signal requires a certain copper thickness to ensure that the resistance is low enough and the high speed signal requires a certain substrate thickness to ensure that the characteristic impedance meets 50 ohms.

As the requirements of the folding screen mobile phone 200 on the thinness and the appearance of the whole mobile phone are higher and higher, the whole mobile phone is light and thin, which can reduce the mechanical structural space of the rotating shaft, and further, the thickness of the transmission component 100 located in the bending region 210 is required to be reduced.

In the related art, in the transmission assembly 100, if the thinned copper is used to ensure that the resistance of the power signal is unchanged, the power wiring needs to be widened, so that the transmission assembly 100 is widened, which affects the design of the rotating shaft assembly 23. If the substrate is thinned, the line width of the wiring is required to be thinned in order to ensure that the characteristic impedance of the high-speed signal is unchanged, and the processing difficulty of the transmission assembly 100 is increased. Therefore, when the transmission assembly 100 is thinned, there is a problem that the requirements of the power supply and the high-speed signal cannot be satisfied, regardless of the substrate or the copper. That is, in the related art, the thinned transmission assembly 100 cannot satisfy both the resistance of the power signal and the characteristic impedance of the high-speed signal, so that the performance requirement of the transmission assembly 100 required in the folding-screen mobile phone 200 cannot be satisfied.

Based on this, in a new foldable electronic device (for example, a folding screen mobile phone 200), the foldable electronic device includes a transmission component located in a bending region of the foldable electronic device, and the transmission component includes a first transmission component for transmitting a high-speed signal and a second transmission component for transmitting a power signal, where a total thickness of the first conductive layer and the second conductive layer in the first transmission component is less than 24um, a total thickness of the third substrate layer and the fourth substrate layer in the second transmission component is less than 24um, or the transmission component includes a third transmission component for transmitting the high-speed signal and the power signal, a total thickness of the fifth substrate layer and the sixth substrate layer in the third transmission component is less than 24um, and a width of at least one of the third sub conductive layer and the fourth sub conductive layer located in the high-speed signal transmission region is less than 60 um.

The following describes in detail the specific structure of the foldable electronic device according to the embodiments of the present application, taking different embodiments as examples, with reference to the specific drawings.

Example 1

Referring to fig. 4, an embodiment of the present application provides a foldable electronic device (e.g., a folding screen mobile phone 200), where the foldable electronic device may include a transmission assembly 100 located in a bending region 210 of the folding screen mobile phone 200, and specifically, the transmission assembly 100 may include at least: a first transmission assembly 110 and a second transmission assembly 120, wherein the first transmission assembly 110 may be used to transmit high speed signals and the second transmission assembly 120 may be used to transmit power signals.

In this embodiment, one end of the first transmission assembly 110 is connected to the first circuit board 211, the other end of the first transmission assembly 110 is connected to the second circuit board 221, one end of the second transmission assembly 120 is connected to the first circuit board 211, and the other end of the second transmission assembly 120 is connected to the second circuit board 221. In this way, transmission of high-speed signals between the first circuit board 211 and the second circuit board 221 and transmission of power signals between the first circuit board 211 and the second circuit board 221 can be ensured.

Specifically, in the embodiment of the present application, fig. 5 is a cross-sectional view A-A' of the transmission assembly 100 shown in fig. 4, and referring to fig. 5, the first transmission assembly 110 may include at least: the first conductive layer 111, the first substrate layer 112, the second substrate layer 113 and the second conductive layer 114, wherein the first substrate layer 112 and the second substrate layer 113 are located between the first conductive layer 111 and the second conductive layer 114, and the first substrate layer 112 is located between the first conductive layer 111 and the second substrate layer 113, and the second substrate layer 113 is located between the first substrate layer 112 and the second conductive layer 114.

Referring to fig. 5, in an embodiment of the present application, the first conductive layer 111 may include: a first sub-conductive layer 1111 and a second sub-conductive layer 1112. By designing the first conductive layer 111 to be the first sub-conductive layer 1111 and the second sub-conductive layer 1112 spaced apart from each other, normal transmission of a high-speed signal can be ensured.

In an embodiment of the present application, as shown in fig. 6, the first transmission component 110 may further include: first adhesive layer 115, first adhesive layer 115 is located between first substrate layer 112 and second substrate layer 113. By designing the first adhesive layer 115 between the first substrate layer 112 and the second substrate layer 113, adhesion between the first substrate layer 112 and the second substrate layer 113 can be ensured, and thus the overall structural strength of the first transfer member 110 can be ensured.

In the embodiment of the present application, the first adhesive layer 115 may be a low-loss adhesive, and the embodiment of the present application is not limited thereto.

In one possible implementation, the first adhesive layer 115 may include: a plurality of first sub-adhesive layers 1151 are disposed at intervals, and a first gap 1152 is provided between two adjacent first sub-adhesive layers 1151. By designing the first adhesive layer 115 as a plurality of first sub-adhesive layers 1151 arranged at intervals, it is possible to achieve a cost-saving effect while adhering between the first base material layer 112 and the second base material layer 113.

Fig. 7 is a cross-sectional view of the transmission assembly 100 shown in fig. 4, and referring to fig. 7 or 8, the second transmission assembly 120 may include at least a stacked arrangement: a third conductive layer 121, a third substrate layer 122, a fourth substrate layer 123, and a fourth conductive layer 124, wherein the third substrate layer 122 and the fourth substrate layer 123 are located between the third conductive layer 121 and the fourth conductive layer 124, and the third substrate layer 122 is located between the third conductive layer 121 and the fourth substrate layer 123, and the fourth substrate layer 123 is located between the third substrate layer 122 and the fourth conductive layer 124.

In the embodiment of the present application, the total thickness of the first conductive layer 111 and the second conductive layer 114 may be less than 24um, and the total thickness of the third substrate layer 122 and the fourth substrate layer 123 may be less than 24um.

By designing the transmission assembly 100 to include the first transmission assembly 110 for transmitting the high-speed signal and the second transmission assembly 120 for transmitting the power signal, wherein the total thickness of the first conductive layer 111 and the second conductive layer 114 in the first transmission assembly 110 for transmitting the high-speed signal is less than 24um, the total thickness of the first conductive layer 111 and the second conductive layer 114 in the first transmission assembly 110 is relatively thin, and the performance of the first transmission assembly 110 for transmitting the high-speed signal is not affected, the total thickness of the third substrate layer 122 and the fourth substrate layer 123 in the second transmission assembly 120 for transmitting the power signal is less than 24um, and the total thickness of the third substrate layer 122 and the fourth substrate layer 123 in the second transmission assembly 120 is relatively thin, and the performance of the second transmission assembly 120 for transmitting the power signal is not affected.

That is, the embodiment of the present application thins the total thickness of the first conductive layer 111 and the second conductive layer 114 for the first transmission assembly 110 for transmitting high-speed signals, and thins the third substrate layer 122 and the fourth substrate layer 123 for the second transmission assembly 120 for transmitting power signals for different signals. Therefore, while the first transmission component 110 and the second transmission component 120 are designed to be thinned, the embodiment of the present application can give consideration to the resistance of the power signal and the characteristic impedance of the high-speed signal, so as to meet the performance requirement of the transmission component 100 required in the folding screen device.

In the embodiment of the present application, the materials of the first conductive layer 111, the second conductive layer 114, the third conductive layer 121, and the fourth conductive layer 124 may be copper.

The materials of the first substrate layer 112, the second substrate layer 113, the third substrate layer 122 and the fourth substrate layer 123 may be low-loss low-dielectric materials such as liquid crystal polymer (Liquid Crystal Polymer, LCP), fluorine, polyimide (PI) or Modified Polyimide (MPI), which are not limited in this embodiment, and are not limited in the above examples.

In the embodiment of the present application, the thickness of at least one of the first conductive layer 111 and the second conductive layer 114 may be less than 12um, that is, the thickness of the first conductive layer 111 is less than 12um, or the thickness of the second conductive layer 114 is less than 12um, or the thicknesses of the first conductive layer 111 and the second conductive layer 114 are respectively less than 12um, which can achieve the effect of relatively thinning the total thickness of the first conductive layer 111 and the second conductive layer 114.

At least one of the third substrate layer 122 and the fourth substrate layer 123 may have a thickness of less than 12um. That is, the thickness of the third substrate layer 122 is less than 12um, or the thickness of the fourth substrate layer 123 is less than 12um, or the thicknesses of the third substrate layer 122 and the fourth substrate layer 123 are respectively less than 12um, which can achieve the effect of relatively thinning the total thickness of the third substrate layer 122 and the fourth substrate layer 123.

In this embodiment of the present application, the thickness of the first conductive layer 111 is greater than or equal to 3um, and the thickness of the first conductive layer 111 is less than 12um, where the thickness of the first conductive layer 111 is between 3um and 12um, so that the effect of relatively thinning the thickness of the first conductive layer 111 and the overall thickness of the first transmission assembly 110 can be achieved on the premise that the manufacturing process and the signal insertion loss performance of the first transmission assembly 110 meet the requirements.

The thickness of the second conductive layer 114 is 3um or more, and the thickness of the second conductive layer 114 is less than 12um. The thickness of the second conductive layer 114 is between 3um and 12um, so that the effect of relatively thinning the thickness of the second conductive layer 114 and the overall thickness of the first transmission component 110 can be achieved on the premise that the manufacturing process and the signal insertion loss performance of the first transmission component 110 meet the requirements.

Illustratively, in the present embodiment, the thickness of the first conductive layer 111 may be 9um, and the thickness of the second conductive layer 114 may be 9um.

Alternatively, in some other embodiments, the thicknesses of the first conductive layer 111 and the second conductive layer 114 may be 3um, 4um, 5um, 6um, 7um, 8um, 10um, or 11um, etc., which are not limited by the embodiments of the present application. Compared with the prior art in which the thicknesses of the first conductive layer 111 and the second conductive layer 114 are about 12um, the thickness of the first conductive layer 111 and the second conductive layer 114 is reduced, so that the overall thickness of the transmission assembly 100 can be reduced.

At this time, the thickness of the first substrate layer 112 may be 12um, and the thickness of the second substrate layer 113 may be 12um. In the prior art, the thicknesses of the first conductive layer 111 and the second conductive layer 114 are respectively 12um, and the thicknesses of the first substrate layer 112 and the second substrate layer 113 are respectively 12um, that is, compared with the first transmission assembly 110 shown in fig. 5 in the prior art, in this embodiment of the present application, the thicknesses of the first conductive layer 111 and the second conductive layer 114 are relatively reduced, and the thicknesses of the first substrate layer 112 and the second substrate layer 113 remain unchanged. Thus, the thickness of the first transmission member 110 can be reduced while maintaining the performance as compared with the prior art, and the characteristic impedance of 50 ohms can be achieved without reducing the line width in the first transmission member 110 for transmitting high-speed signals, without increasing the process difficulty.

In addition, in the embodiment of the present application, the thickness of the third substrate layer 122 is greater than or equal to 5um, and the thickness of the third substrate layer 122 is less than 12um, and the thickness of the third substrate layer 122 is between 5um and 12um, so that the effect of relatively thinning the thickness of the third substrate layer 122 and the overall thickness of the second transmission assembly 120 can be achieved on the premise that the manufacturing process and mechanical reliability of the second transmission assembly 120 meet the requirements.

The thickness of the fourth substrate layer 123 is greater than or equal to 5um, and the thickness of the fourth substrate layer 123 is less than 12um, and the thickness of the fourth substrate layer 123 is between 5um and 12um, so that the effect of relatively thinning the thickness of the fourth substrate layer 123 and the overall thickness of the second transmission assembly 120 can be achieved on the premise that the manufacturing process and mechanical reliability of the second transmission assembly 120 meet the requirements.

Illustratively, in the present embodiment, the thickness of the third substrate layer 122 may be 9um, and the thickness of the fourth substrate layer 123 may be 9um.

Alternatively, in some other embodiments, the thickness of the third substrate layer 122 and the fourth substrate layer 123 may be 5um, 6um, 7um, 8um, 10um, 11um, or the like, which is not limited by the embodiments of the present application and the examples described above. Compared with the thickness of the third substrate layer 122 and the fourth substrate layer 123 in the prior art, the thickness of the third substrate layer 122 and the fourth substrate layer 123 is about 12um, and the thickness of the transmission assembly 100 can be thinned.

At this time, the thickness of the third conductive layer 121 may be 12um, and the thickness of the fourth conductive layer 124 may be 12um. That is, the thickness of the third substrate layer 122 and the thickness of the fourth substrate layer 123 are relatively thinner, and the thickness of the third conductive layer 121 and the thickness of the fourth conductive layer 124 remain unchanged, compared to the related art.

Alternatively, in some embodiments, the thickness of the third conductive layer 121 may be 15um and the thickness of the fourth conductive layer 124 may be 15um. That is, the thickness of the third substrate layer 122 and the thickness of the fourth substrate layer 123 are relatively thinner, and the thickness of the third conductive layer 121 and the thickness of the fourth conductive layer 124 are relatively thicker, compared to the related art. As shown in fig. 7 and 8, the thickness of the third conductive layer 121 and the thickness of the fourth conductive layer 124 in fig. 8 are greater than the thickness of the third conductive layer 121 and the thickness of the fourth conductive layer 124 in fig. 7. In this way, the structure shown in fig. 8 can absorb the influence of the gap between the first and second transfer assemblies 110 and 120 on the transfer performance of the transfer assembly 100 to some extent.

Compared with the prior art, the thickness of the second transmission assembly 120 can be reduced while maintaining the performance unchanged, and in the second transmission assembly 120 for transmitting the power signal, the second transmission assembly 120 shown in fig. 8 can achieve the same resistance when the lengths of the second transmission assemblies 120 are the same, compared with the second transmission assembly 120 shown in fig. 7, and the power trace width can be reduced by 20%, thereby reducing the width of the second transmission assembly 120.

It is understood that in some embodiments, the total thickness of the first conductive layer 111 and the first substrate layer 112 may be equal to the total thickness of the second conductive layer 114 and the second substrate layer 113 in the first transmission component 110. In this way, the upper and lower layers of the first transmission assembly 110 can be ensured to be symmetrical, the process of manufacturing the first transmission assembly 110 is facilitated, and the reliability of the overall structure of the first transmission assembly 110 is also better.

Likewise, the total thickness of the third conductive layer 121 and the third substrate layer 122 may be equal to the total thickness of the fourth conductive layer 124 and the fourth substrate layer 123, so that the upper and lower layers of the second transmission assembly 120 are relatively symmetrical, the process manufacturing of the second transmission assembly 120 is facilitated, and the reliability of the overall structure of the second transmission assembly 120 is also better.

As shown in fig. 9, the second transmission assembly 120 may further include: and a second adhesive layer 125, the second adhesive layer 125 being located between the third substrate layer 122 and the fourth substrate layer 123. By designing the second adhesive layer 125 between the third base material layer 122 and the fourth base material layer 123, the adhesion between the third base material layer 122 and the fourth base material layer 123 can be ensured, and the overall structural strength of the second transmission module 120 can be ensured.

In the embodiment of the present application, the second adhesive layer 125 may be a low-loss adhesive, and the embodiment of the present application is not limited thereto.

In one possible implementation, the second adhesive layer 125 may include: a plurality of second sub-adhesive layers 1251 are provided at intervals, and a second gap 1252 is provided between two adjacent second sub-adhesive layers 1251. By designing the second adhesive layer 125 as a plurality of second sub-adhesive layers 1251 arranged at intervals, the third substrate layer 122 and the fourth substrate layer 123 can be adhered together, and at the same time, the cost can be saved.

In an embodiment of the present application, as shown in fig. 5, the first transmission component 110 may further include: a first cover film 116 and a second cover film 117, wherein the first cover film 116 is located on a side of the first conductive layer 111 facing away from the first substrate layer 112, and the second cover film 117 is located on a side of the second conductive layer 114 facing away from the second substrate layer 113. The first cover film 116 can function as insulation protection for the first conductive layer 111. The second cover film 117 can function as insulation protection for the second conductive layer 114.

In this embodiment, the first cover film 116 and the second cover film 117 may be made of a combination of a metal material and a conductive adhesive, where the metal material may be silver or copper.

Taking the first transmission component 110 shown in fig. 5 as an example, when the thickness of the first conductive layer 111 and the second conductive layer 114 is 9um, the thickness of the first cover film 116 and the second cover film 117 may be 9um-27.5um, where the thickness of the conductive adhesive may be greater than or equal to the thickness of the first conductive layer 111 or the second cover film 117. For example, the thickness of the first cover film 116 and the second cover film 117 may be 10um, 11um, 12um, 13um, 14um, 15um, 16um, 17um, 18um, 19um, 20um, or the like, and when the thickness of the first cover film 116 and the second cover film 117 is 17um, the thickness of the conductive paste may be 12um, and the thickness of the metal material may be 5um.

Compared to the thickness of the first cover film 116 of the prior art, the thickness of the second cover film 117 is generally 27.5um, and in this embodiment, the thickness of the first transmission assembly 110 can be further reduced by combining the thickness reduction of the first cover film 116 and the second cover film 117.

With continued reference to fig. 5, in an embodiment of the present application, the first transmission component 110 may further include: the first shielding film 118, the first shielding film 118 is located on one side of the first cover film 116 away from the first conductive layer 111, and the first shielding film 118 can play a role in shielding protection, so that scratch and damage to the first transmission assembly 110 caused by the outside are avoided or reduced.

The material of the first shielding film 118 may be a cover film made of ink, or the material of the first cover film 116 and the second cover film 117 may be polyimide, which is not limited in this embodiment.

As shown in fig. 7 or 8, the second transmission assembly 120 may further include: a third cover film 126 and a fourth cover film 127, wherein the third cover film 126 is located on a side of the third conductive layer 121 facing away from the third substrate layer 122, and the fourth cover film 127 is located on a side of the fourth conductive layer 124 facing away from the fourth substrate layer 123. The third cap film 126 can function as an insulating protection for the third conductive layer 121. The fourth cap film 127 can function as insulation protection for the fourth conductive layer 124.

In the embodiment of the present application, the third cover film 126 and the fourth cover film 127 may be made of a combination of a metal material and a conductive adhesive, where the metal material may be silver or copper.

Taking the second transmission assembly 120 shown in fig. 8 as an example, when the thickness of the third conductive layer 121 and the fourth conductive layer 124 is 15um, the thickness of the third cover film 126 and the fourth cover film 127 may be 15um-27.5um, where the thickness of the conductive adhesive may be greater than or equal to the thickness of the third conductive layer 121 and the fourth conductive layer 124. For example, the thicknesses of the third cover film 126 and the fourth cover film 127 may be 15um, 16um, 17um, 18um, 19um, 20um, 21um, 22um, or 23um, etc., and when the thicknesses of the third cover film 126 and the fourth cover film 127 are 20um, the thickness of the conductive paste may be 15um, and the thickness of the metal material may be 5um.

In this embodiment, the thickness of the second transmission assembly 120 can be further reduced by combining the thinning of the third cover film 126 and the fourth cover film 127.

With continued reference to fig. 7 or 8, the second transmission component 120 may further include: and a second shielding film 128, wherein the second shielding film 128 is located on a side of the third cover film 126 facing away from the third conductive layer 121. The second shielding film 128 can play a role of shielding protection, and prevent or reduce scratch and damage to the second transmission assembly 120 caused by the outside.

The material of the second shielding film 128 may be a cover film made of ink, or the material of the third cover film 126 and the fourth cover film 127 may be polyimide, which is not limited in this embodiment.

Example two

The present embodiment also provides another foldable electronic device (for example, a folding-screen mobile phone 200), and the difference between the first embodiment and the second embodiment is that the transmission assembly 100 of the folding-screen mobile phone 200 is split into the first transmission assembly 110 and the second transmission assembly 120 that are separated from each other in the first embodiment, and the transmission assembly 100 of the folding-screen mobile phone 200 is a unitary structure (i.e., the third transmission assembly 130) in the second embodiment.

Specifically, as shown in fig. 10, in the embodiment of the present application, the transmission assembly 100 may be applied to, for example, a bending region 210 of the folding screen mobile phone 200, and the transmission assembly 100 may include: the third transmission assembly 130, the third transmission assembly 130 is used for transmitting high-speed signals and power signals, one end of the third transmission assembly 130 is connected with the first circuit board 211, and the other end of the third transmission assembly 130 is connected with the second circuit board 221. In this way, the transmission of the high-speed signal and the power signal between the first circuit board 211 and the second circuit board 221 can be ensured at the same time.

Fig. 11 and 12 are B-B' cross-sectional views of the third transfer assembly 130 shown in fig. 10, and referring to fig. 11 or 12, the third transfer assembly 130 may include at least: a fifth conductive layer 131, a fifth substrate layer 132, a sixth substrate layer 133, and a sixth conductive layer 134, wherein the fifth substrate layer 132 and the sixth substrate layer 133 are located between the fifth conductive layer 131 and the sixth conductive layer 134, and the fifth substrate layer 132 is located between the fifth conductive layer 131 and the sixth substrate layer 133, and the sixth substrate layer 133 is located between the fifth substrate layer 132 and the sixth conductive layer 134.

The fifth conductive layer 131 may include being laterally spaced apart from each other: the third sub-conductive layer 1311, the fourth sub-conductive layer 1312, and the fifth sub-conductive layer 1313, wherein the space 1314 between the fourth sub-conductive layer 1312 and the fifth sub-conductive layer 1313 divides the third transmission assembly 130 into a high-speed signal transmission region 130a and a power signal transmission region 130b along the thickness direction L1 of the third transmission assembly 130, the third sub-conductive layer 1311 and the fourth sub-conductive layer 1312 are both located in the high-speed signal transmission region 130a, and the fifth sub-conductive layer 1313 is located in the power signal transmission region 130b.

In an embodiment of the present application, the total thickness of the fifth substrate layer 132 and the sixth substrate layer 133 may be less than 24um, and the width of at least one of the third sub-conductive layer 1311 and the fourth sub-conductive layer 1312 may be less than 60um.

The transmission assembly 100 is designed to include the third transmission assembly 130 for transmitting high-speed signals and power signals, the total thickness of the fifth substrate layer 132 and the sixth substrate layer 133 in the third transmission assembly 130 is smaller than 24um, the total thickness of the fifth substrate layer 132 and the sixth substrate layer 133 in the third transmission assembly 130 is relatively reduced, and the performance of the third transmission assembly 130 for transmitting power signals is not affected, however, since the total thickness of the fifth substrate layer 132 and the sixth substrate layer 133 is relatively reduced, the distance between the third conductive layer 121 and the fourth conductive layer 124 is reduced, and thus the characteristic impedance is increased, the performance of the third transmission assembly 130 for transmitting high-speed signals is affected, and the width of at least one of the third sub-conductive layer 1311 and the fourth sub-conductive layer 1312 in the high-speed signal transmission area 130a is smaller than 60um, and the line widths of the third sub-conductive layer 1311 and the fourth sub-conductive layer 1312 are relatively reduced, so that the characteristic impedance can be reduced, and the performance of the third transmission assembly 130 for transmitting high-speed signals can be improved, and the required signal transmission assembly 100 can be folded when designed to have the performance of high-speed signal transmission assembly is realized.

In addition, it is understood that the sixth conductive layer 134 may include spaced apart from each other: a sixth sub-conductive layer 1341 and a seventh sub-conductive layer 1342, wherein the sixth sub-conductive layer 1341 is located in the high speed signal transmission area 130a and the seventh sub-conductive layer 1342 is located in the power signal transmission area 130b.

Note that, in the embodiment of the present application, the material of the fifth conductive layer 131 and the sixth conductive layer 134 may be copper.

The materials of the fifth substrate layer 132 and the sixth substrate layer 133 may be low-loss and low-dielectric materials such as liquid crystal polymer (Liquid Crystal Polymer, LCP), fluorine, polyimide (PI), and Modified Polyimide (MPI), which are not limited in this embodiment, and are not limited to the above examples.

In embodiments of the present application, the thickness of at least one of the fifth substrate layer 132 and the sixth substrate layer 133 may be less than 12um. That is, the thickness of the fifth substrate layer 132 is less than 12um, or the thickness of the sixth substrate layer 133 is less than 12um, or the thicknesses of the fifth substrate layer 132 and the sixth substrate layer 133 are respectively less than 12um, so that the effect of relatively thinning the total thickness of the fifth substrate layer 132 and the sixth substrate layer 133 can be achieved.

In the embodiment of the present application, the thickness of the fifth substrate layer 132 is greater than or equal to 5um, and the thickness of the fifth substrate layer 132 is less than 12um. The thickness of the fifth substrate layer 132 is between 5um and 12um, so that the effect of relatively thinning the thickness of the fifth substrate layer 132 and the overall thickness of the third transmission assembly 130 can be achieved on the premise that the manufacturing process and mechanical reliability of the third transmission assembly 130 meet the requirements.

Alternatively, the thickness of the sixth substrate layer 133 is 5um or more, and the thickness of the sixth substrate layer 133 is less than 12um. The thickness of the sixth substrate layer 133 is between 5um and 12um, so that the effect of relatively thinning the thickness of the sixth substrate layer 133 and the overall thickness of the third transmission assembly 130 can be achieved on the premise that the manufacturing process and the mechanical reliability of the third transmission assembly 130 meet the requirements.

Alternatively, the thickness of the fifth substrate layer 132 is 5um or more, the thickness of the fifth substrate layer 132 is less than 12um, and the thickness of the sixth substrate layer 133 is 5um or more, and the thickness of the sixth substrate layer 133 is less than 12um.

Illustratively, in the present embodiment, the thickness of the fifth substrate layer 132 may be 12um and the thickness of the sixth substrate layer 133 may be 9um.

Alternatively, in some other embodiments, the thickness of the fifth substrate layer 132 may be 5um, 6um, 7um, 8um, 9um, 10um, or 11um, which is not limited by the embodiment of the present application. The thickness of the sixth substrate layer 133 may be 5um, 6um, 7um, 8um, 10um, 11um, 12um, or the like, which is not limited in the embodiment of the present application, and is not limited to the above examples. Compared to the thicknesses of the fifth substrate layer 132 and the sixth substrate layer 133 in the prior art, the thickness of one of the fifth substrate layer 132 and the sixth substrate layer 133 or the total thickness of the fifth substrate layer 132 and the sixth substrate layer 133 is reduced, so that the overall thickness of the transmission assembly 100 can be reduced.

At this time, the thickness of the fifth conductive layer 131 may be 12um, and the thickness of the sixth conductive layer 134 may be 12um. That is, the thickness of the fifth conductive layer 131 and the thickness of the sixth conductive layer 134 remain unchanged, compared to the prior art, in which the thickness of the fifth substrate layer 132 and the thickness of the sixth substrate layer 133 are relatively thin.

Alternatively, in some embodiments, the thickness of the fifth conductive layer 131 may be 9um and the thickness of the sixth conductive layer 134 may be 15um. That is, the thickness of the fifth conductive layer 131 and the thickness of the sixth conductive layer 134 remain unchanged, compared to the prior art, in which the thickness of the fifth substrate layer 132 and the thickness of the sixth substrate layer 133 are relatively thin. As shown in fig. 11 and 12, the thickness of the fifth conductive layer 131 in fig. 12 is smaller than the thickness of the fifth conductive layer 131 in fig. 11, and the thickness of the sixth conductive layer 134 in fig. 12 is larger than the thickness of the sixth conductive layer 134 in fig. 11.

Alternatively, in some other embodiments, the thickness of the fifth conductive layer 131 may be 3um, 4um, 5um, 6um, 7um, 8um, 10um, 11um, 13um, 14um, or 15um, which is not limited by the embodiment of the present application and is not limited by the above examples. The thickness of the sixth conductive layer 134 may be 3um, 4um, 5um, 6um, 7um, 8um, 9um, 10um, 11um, 13um, or 14um, which is not limited in the embodiment of the present application and the above examples.

In addition, in the embodiment of the present application, the width of the third sub-conductive layer 1311 is 55um or more, and the width of the third sub-conductive layer 1311 is less than 60um. By designing the width of the third sub-conductive layer 1311 located in the high-speed signal transmission area 130a to be between 55um and 60um, the line width of the third sub-conductive layer 1311 is relatively reduced, so that the characteristic impedance can be reduced on the premise of meeting the line width processing capability, and the performance of the third transmission component 130 for transmitting high-speed signals can be improved.

The width of the fourth sub-conductive layer 1312 is greater than or equal to 55um, and the width of the fourth sub-conductive layer 1312 is smaller than 60um, and by designing the width of the fourth sub-conductive layer 1312 in the high-speed signal transmission area 130a to be between 55um and 60um, the line width of the fourth sub-conductive layer 1312 is relatively reduced, so that the characteristic impedance can be reduced on the premise of meeting the line width processing capability, and the performance of the third transmission assembly 130 for transmitting high-speed signals can be improved.

Illustratively, in embodiments of the present application, the third sub-conductive layer 1311 may have a width of 55um and the fourth sub-conductive layer 1312 may have a width of 55um. Compared with the prior art, the resistor with the same wiring length and line width can be achieved on the premise that the thickness of the third transmission component 130 is thinned.

Alternatively, in some other embodiments, the widths of third sub-conductive layer 1311 and fourth sub-conductive layer 1312 may also be 56um, 57um, 58um, 59um, or the like, which the embodiments of the present application are not limited to nor to the above examples. Compared to the widths of the third and fourth sub-conductive layers 1311 and 1312 in the prior art, which are about 60um, the width (line width) of the third and fourth sub-conductive layers 1311 and 1312 is reduced in the embodiment of the present application.

It should be noted that, the numerical values and numerical ranges referred to in the present application are approximate values, and may have a certain range of errors under the influence of the manufacturing process, and those errors may be considered to be negligible by those skilled in the art.

As shown in fig. 13, in an embodiment of the present application, the third transmission component 130 may further include: and a third adhesive layer 135, wherein the third adhesive layer 135 is located between the fifth and sixth substrate layers 132 and 133. By designing the third adhesive layer 135 between the fifth base material layer 132 and the sixth base material layer 133, adhesion between the fifth base material layer 132 and the sixth base material layer 133 can be ensured, and thus the overall structural strength of the third transmission assembly 130 can be ensured.

In the embodiment of the present application, the third adhesive layer 135 may be a low-loss adhesive, and the embodiment of the present application is not limited thereto.

Wherein, in one possible implementation, the third adhesive layer 135 may include: a plurality of third sub-adhesive layers 1351 are disposed at intervals, and a third gap 1352 is provided between two adjacent third sub-adhesive layers 1351. By designing the third adhesive layer 135 as a plurality of third sub-adhesive layers 1351 provided at intervals, it is possible to achieve a cost-saving effect while adhering between the fifth base material layer 132 and the sixth base material layer 133.

As shown in fig. 11 or fig. 12, in an embodiment of the present application, the third transmission component 130 may further include: a fifth cover film 136 and a sixth cover film 137, wherein the fifth cover film 136 is located on a side of the fifth conductive layer 131 facing away from the fifth substrate layer 132, and the sixth cover film 137 is located on a side of the sixth conductive layer 134 facing away from the sixth substrate layer 133. The fifth cover film 136 can function as insulation protection for the fifth conductive layer 131. The sixth cover film 137 can function as insulation protection for the sixth conductive layer 134.

In the embodiment of the present application, the fifth cover film 136 and the sixth cover film 137 may be made of a combination of a metal material and a conductive adhesive, where the metal material may be silver or copper.

Taking the third transmission component 130 shown in fig. 12 as an example, when the thickness of the fifth conductive layer 131 is 9um, the thickness of the fifth cover film 136 may be 9um-27.5um, where the thickness of the conductive adhesive may be greater than or equal to the thickness of the fifth conductive layer 131. For example, the thickness of the fifth cap film 136 may be 10um, 11um, 12um, 13um, 14um, 15um, 16um, 17um, 18um, 19um, or 20um, etc., and when the thickness of the fifth cap film 136 is 17um, the thickness of the conductive paste may be 12um, and the thickness of the metal material may be 5um.

When the thickness of the sixth conductive layer 134 is 15um, the thickness of the sixth cover film 137 may be 15um-27.5um, wherein the thickness of the conductive paste may be greater than or equal to the thickness of the sixth conductive layer 134. For example, the thickness of the sixth cap film 137 may be 15um, 16um, 17um, 18um, 19um, 20um, 21um, 22um, 23um, or the like, and when the thickness of the sixth cap film 137 is 20um, the thickness of the conductive paste may be 15um, and the thickness of the metal material may be 5um.

In the embodiment of the present application, the total thickness of the third transmission assembly 130 can be further thinned in cooperation with thinning of the fifth cover film 136 and the sixth cover film 137.

With continued reference to fig. 11 or 12, in an embodiment of the present application, the third transmission component 130 may further include: and a third shielding film 138, wherein the third shielding film 138 is located on a side of the fifth cover film 136 facing away from the fifth conductive layer 131. The third shielding film 138 can play a role of shielding protection, and prevent or reduce scratch and damage to the third transmission assembly 130 caused by the outside.

The material of the first shielding film 118 may be a cover film made of ink, or the material of the fifth cover film 136 and the sixth cover film 137 may be polyimide, which is not limited in this embodiment.

Further, a method of making the transmission assembly 100 is described herein.

Taking the transmission device 100 as the third transmission device 130 as an example, in the third transmission device 130, the thickness of the fifth conductive layer 131 is 9um, the thickness of the sixth conductive layer 134 is 15um, the thickness of the fifth substrate layer 132 is 12um, and the thickness of the sixth substrate layer 133 is 9um.

Two different fabrication processes are provided below to process the third transfer member 130. The first manufacturing process comprises the following steps: referring to fig. 14, a press-molded fifth conductive layer 131 and a fifth base material layer 132 are provided, the thickness of the fifth conductive layer 131 is 9um, the thickness of the fifth base material layer 132 is 12um, a press-molded sixth conductive layer 134 and a sixth base material layer 133 are provided, the thickness of the sixth conductive layer 134 is 15um, and the thickness of the sixth base material layer 133 is 9um. And the third adhesive layer 135 is used to adhere and fix the fifth substrate layer 132 and the sixth substrate layer 133.

Then, as shown in fig. 15 and 16, a first through hole 141 is provided along the thickness direction of the laminated structure, and a first plating layer 1411 is provided in the first through hole 141, and finally, lines are etched on the fifth conductive layer 131 and the sixth conductive layer 134 to form a third sub-conductive layer 1311, a fourth sub-conductive layer 1312, and a fifth sub-conductive layer 1313 on the fifth conductive layer 131, and a sixth sub-conductive layer 1341 and a seventh sub-conductive layer 1342 (shown in fig. 17) on the sixth conductive layer 134.

The first manufacturing process is as follows: referring to fig. 18, a press-molded fifth conductive layer 131 and a fifth base material layer 132 are provided, the thickness of the fifth conductive layer 131 is 9um, the thickness of the fifth base material layer 132 is 12um, a press-molded sixth conductive layer 134 and a sixth base material layer 133 are provided, the thickness of the sixth conductive layer 134 is 9um, and the thickness of the sixth base material layer 133 is 9um. And the third adhesive layer 135 is used to adhere and fix the fifth substrate layer 132 and the sixth substrate layer 133.

Then, as shown in fig. 19 and 20, the second through hole 142 is provided along the thickness direction of the laminated structure, the second plating layer 1421 is provided in the second through hole 142, and the third plating layer 1422 is provided on the side of the sixth conductive layer 134 facing away from the sixth base material layer 133, the thickness of the third plating layer 1422 may be 6um, at this time, the total thickness of the sixth base material layer 133 and the third plating layer 1422 may be 15um, and the third plating layer 1422 may be a part of the sixth base material layer 133. Finally, lines are etched on the fifth conductive layer 131 and the sixth conductive layer 134 to form a third sub-conductive layer 1311, a fourth sub-conductive layer 1312, and a fifth sub-conductive layer 1313 on the fifth conductive layer 131, and a sixth sub-conductive layer 1341 and a seventh sub-conductive layer 1342 (see fig. 21) on the sixth conductive layer 134.

Other technical features are the same as those of the first embodiment, and the same technical effects can be achieved, and are not described in detail herein.

In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, indirectly connected through an intermediary, or may be in communication with each other between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.

The embodiments or implications herein must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the embodiments herein. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless specifically stated otherwise.

The terms first, second, third, fourth and the like in the description and in the claims of embodiments of the application and in the above-described figures, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be capable of implementation in sequences other than those illustrated or described herein, for example. Furthermore, the terms "may include" and "have," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: the foregoing embodiments are merely for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto, and although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified or some or all of the technical features may be replaced equivalently, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments in this application.

Claims

1. A foldable electronic device comprising a transmission assembly located within a bending zone of the foldable electronic device, the transmission assembly comprising at least:

the first transmission assembly is used for transmitting high-speed signals and at least comprises a plurality of transmission assemblies which are arranged in a laminated mode in sequence: a first conductive layer, a first substrate layer, a second substrate layer, and a second conductive layer; and

the second transmission assembly is used for transmitting power supply signals and at least comprises a plurality of transmission assemblies which are sequentially stacked: a third conductive layer, a third substrate layer, a fourth substrate layer, and a fourth conductive layer; wherein,

The total thickness of the first conductive layer and the second conductive layer is less than 24um; and

the third substrate layer and the fourth substrate layer have a total thickness of less than 24um.

2. The foldable electronic device of claim 1, wherein the foldable electronic device comprises,

at least one of the first conductive layer and the second conductive layer has a thickness of less than 12um; and

at least one of the third substrate layer and the fourth substrate layer has a thickness of less than 12um.

3. The foldable electronic device of claim 2, wherein the foldable electronic device comprises,

the thickness of the first conductive layer is more than or equal to 3um, and the thickness of the first conductive layer is less than 12um; and

the thickness of the second conductive layer is more than or equal to 3um, and the thickness of the second conductive layer is less than 12um.

4. A foldable electronic device according to claim 2 or 3, characterized in that,

the thickness of the third substrate layer is more than or equal to 5um, and the thickness of the third substrate layer is less than 12um; and

the thickness of the fourth substrate layer is more than or equal to 5um, and the thickness of the fourth substrate layer is less than 12um.

5. A foldable electronic device according to claim 3, wherein,

the first conductive layer has a thickness of 9um, an

The thickness of the second conductive layer is 9um.

6. The foldable electronic device of claim 4, wherein the foldable electronic device comprises a plurality of foldable electronic devices,

the thickness of the third substrate layer is 9um, and

the thickness of the fourth substrate layer is 9um.

7. The foldable electronic device according to any of claims 1-3, 5-6, wherein,

in the first transmission component, the total thickness of the first conductive layer and the first substrate layer is equal to the total thickness of the second conductive layer and the second substrate layer; and

in the second transmission component, the total thickness of the third conductive layer and the third substrate layer is equal to the total thickness of the fourth conductive layer and the fourth substrate layer.

8. The foldable electronic device according to any of claims 1-3, 5-6, wherein,

the first conductive layer includes: a first sub-conductive layer and a second sub-conductive layer.

9. The foldable electronic device according to any of claims 1-3, 5-6, wherein,

the first transmission assembly further includes a first adhesive layer; wherein the first adhesive layer is located between the first substrate layer and the second substrate layer; and

The second transmission assembly further includes a second adhesive layer; wherein the second adhesive layer is located between the third substrate layer and the fourth substrate layer.

10. The foldable electronic device of claim 9, wherein the foldable electronic device comprises a plurality of foldable electronic devices,

the first bonding layer comprises a plurality of first sub bonding layers which are arranged at intervals; wherein a first gap is formed between two adjacent first sub-bonding layers; and

the second bonding layer comprises a plurality of second sub bonding layers which are arranged at intervals; and a second gap is arranged between two adjacent second sub-bonding layers.

11. The foldable electronic device of any of claims 1-3, 5-6, 10, wherein the first transmission component further comprises: a first cover film and a second cover film; wherein,

the first cover film is positioned on one surface of the first conductive layer, which is away from the first substrate layer, and the second cover film is positioned on one surface of the second conductive layer, which is away from the second substrate layer; and

the second transmission assembly further includes: a third cover film and a fourth cover film; wherein,

the third cover film is located on one face, away from the third substrate layer, of the third conductive layer, and the fourth cover film is located on one face, away from the fourth substrate layer, of the fourth conductive layer.

12. The foldable electronic device of claim 11, wherein the first transmission component further comprises: a first shielding film;

the first shielding film is positioned on one surface of the first cover film, which is away from the first conductive layer; and

the second transmission assembly further includes: a second shielding film;

the second shielding film is positioned on one surface of the third cover film, which is away from the third conductive layer.

13. The foldable electronic device of any of claims 1-3, 5-6, 10, 12, further comprising a first structural member and a second structural member; a bending area is arranged between the first structural member and the second structural member;

the first structural member comprises at least: the first circuit board, the second structure includes at least: a second circuit board;

one end of the transmission assembly is connected with the first circuit board, and the other end of the transmission assembly is connected with the second circuit board.

14. A foldable electronic device comprising a transmission assembly located within a bending zone of the foldable electronic device, the transmission assembly comprising at least:

a third transmission assembly for transmitting the high-speed signal and the power signal;

The third transmission assembly at least comprises a plurality of transmission assemblies which are sequentially stacked: a fifth conductive layer, a fifth substrate layer, a sixth substrate layer, and a sixth conductive layer; wherein,

the total thickness of the fifth substrate layer and the sixth substrate layer is less than 24um;

the fifth conductive layer includes laterally spaced apart from one another: a third sub-conductive layer, a fourth sub-conductive layer, and a fifth sub-conductive layer; the interval between the fourth sub-conductive layer and the fifth sub-conductive layer divides the third transmission assembly into a high-speed signal transmission area and a power signal transmission area along the thickness direction of the third transmission assembly;

the third sub-conductive layer and the fourth sub-conductive layer are both positioned in the high-speed signal transmission area, and the fifth sub-conductive layer is positioned in the power signal transmission area;

wherein at least one of the third sub-conductive layer and the fourth sub-conductive layer has a width of less than 60um.

15. The foldable electronic device of claim 14, wherein the foldable electronic device comprises,

at least one of the fifth substrate layer and the sixth substrate layer has a thickness of less than 12um.

16. The foldable electronic device of claim 14 or 15, wherein the foldable electronic device comprises a display unit,

the thickness of the fifth substrate layer is more than or equal to 5um, and the thickness of the fifth substrate layer is less than 12um.

17. The foldable electronic device of claim 16, wherein the foldable electronic device comprises,

the thickness of the sixth substrate layer is more than or equal to 5um, and the thickness of the sixth substrate layer is less than 12um.

18. The foldable electronic device of claim 17, wherein the foldable electronic device comprises,

the thickness of the fifth substrate layer is 12um, and

the thickness of the sixth substrate layer is 9um.

19. The foldable electronic device of any of claims 14-15, 17-18, wherein,

the width of the third sub-conductive layer is larger than or equal to 55um, and the width of the third sub-conductive layer is smaller than 60um; and

the width of the fourth sub-conductive layer is larger than or equal to 55um, and the width of the fourth sub-conductive layer is smaller than 60um.

20. The foldable electronic device of claim 19, wherein the width of the third sub-conductive layer is 55um; and

the width of the fourth sub-conductive layer is 55um.

21. The foldable electronic device of any of claims 14-15, 17-18, 20, wherein,

the third transmission assembly further comprises: a third adhesive layer; wherein the third adhesive layer is located between the fifth substrate layer and the sixth substrate layer.

22. The foldable electronic device of claim 21, wherein the foldable electronic device comprises,

the third adhesive layer includes: a plurality of third sub-adhesive layers arranged at intervals; and a third gap is arranged between two adjacent third sub-bonding layers.

23. The foldable electronic device of any of claims 14-15, 17-18, 20, 22, wherein the third transmission component further comprises: a fifth cover film and a sixth cover film; wherein,

the fifth cover film is located on one surface of the fifth conductive layer, which is away from the fifth substrate layer, and the sixth cover film is located on one surface of the sixth conductive layer, which is away from the sixth substrate layer.

24. The foldable electronic device of claim 23, wherein the third transmission component further comprises: a third shielding film;

the third shielding film is positioned on one surface of the fifth cover film, which is away from the fifth conductive layer.

25. The foldable electronic device of any of claims 14-15, 17-18, 20, 22, 24, further comprising a first structural member and a second structural member; a bending area is arranged between the first structural member and the second structural member;