CN113964140A - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN113964140A CN113964140A CN202111247802.9A CN202111247802A CN113964140A CN 113964140 A CN113964140 A CN 113964140A CN 202111247802 A CN202111247802 A CN 202111247802A CN 113964140 A CN113964140 A CN 113964140A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
Abstract
The invention provides a display panel, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display panel comprises a display area and a binding area located on the periphery of the display area, wherein the binding area comprises at least two stacked flexible substrates and a signal routing wire arranged between the adjacent flexible substrates, the signal routing wire is connected with a binding pin through a via hole penetrating through the flexible substrates, and the binding pin is located on the outermost side of the at least two stacked flexible substrates. The technical scheme of the invention can realize curved surface display.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.
Background
With the rapid development of display technology, various types of display products gradually appear in the life of people, with the pursuit of people for living quality being higher and higher, people have higher and higher requirements on the display products on the vision of people, the four-side curved surface display products meet the requirements of customers, but the four-side curved surface display products have higher requirements on the form change of the flexible display panel.
Disclosure of Invention
The invention aims to provide a display panel, a manufacturing method thereof and a display device, which can realize curved surface display.
To solve the above technical problem, embodiments of the present invention provide the following technical solutions:
in one aspect, a display panel is provided, which includes a display area and a bonding area located at the periphery of the display area, where the bonding area includes at least two stacked flexible substrates and a signal trace disposed between adjacent flexible substrates, the signal trace is connected to a bonding pin through a via hole penetrating through the flexible substrates, and the bonding pin is located at the outermost side of the at least two stacked flexible substrates.
In some embodiments, the at least two stacked flexible substrates include a first flexible substrate and a second flexible substrate which are stacked, the bonding region includes a signal trace located between the first flexible substrate and the second flexible substrate, a bonding pin is disposed on a surface of one side of the first flexible substrate, which is away from the second flexible substrate, and the signal trace is connected to the bonding pin through a via hole penetrating through the first flexible substrate.
In some embodiments, the via has an aperture of 4-6 um.
In some embodiments, the signal trace is made of Al and has a thickness of 0.5-0.6 um.
In some embodiments, the line width of the signal trace is greater than or equal to 3 um; adjacent distance between the signal routing lines is larger than or equal to 3 um.
In some embodiments, the flexible substrate has a thickness of 6-10 um.
In some embodiments, further comprising:
and the protective film is positioned on the outermost side of the at least two stacked flexible substrates and comprises a hollow area exposed out of the binding pins.
Embodiments of the present invention also provide a display device including the display panel as described above.
In some embodiments, the device further comprises a driver chip, and the bonding pin is bonded with the driver chip through the ACF.
The embodiment of the invention also provides a manufacturing method of the display panel, which comprises the following steps:
providing a rigid substrate;
forming at least two layers of flexible substrates which are arranged in a stacked mode on the rigid base plate;
forming signal routing between two adjacent layers of the flexible substrates;
forming a via hole penetrating through the flexible substrate and exposing the signal routing by utilizing a photoetching process;
and forming binding pins on the outermost sides of the at least two stacked flexible substrates, wherein the binding pins are connected with the signal routing lines through the via holes.
In some embodiments, forming at least two layers of flexible substrate in a stacked arrangement on the rigid substrate comprises:
forming a first flexible substrate and a second flexible substrate in a stacked arrangement;
forming signal routing between two adjacent layers of the flexible substrate comprises:
forming a signal routing wire between the first flexible substrate and the second flexible substrate, wherein a binding pin is arranged on the surface of one side, away from the second flexible substrate, of the first flexible substrate, and the signal routing wire is connected with the binding pin through a through hole penetrating through the first flexible substrate.
In some embodiments, the method further comprises:
and forming a protective film positioned at the outermost side of the at least two stacked flexible substrates, wherein the protective film comprises a hollow area exposed out of the binding pins.
The embodiment of the invention has the following beneficial effects:
in the scheme, the binding region comprises at least two stacked flexible substrates and signal routing wires arranged between the adjacent flexible substrates, and the flexible substrates are made of organic materials, so that no inorganic layer exists in the binding region, and crack is not easy to occur during folding and bending; in addition, the signal wiring between the flexible substrates is located in the middle of the PAD area stacking structure and located at the neutral layer position, and the signal wiring is not easy to break when being bent, so that the bonding area can be bent and folded, and the polymorphic change of the PAD area is realized to match with the curved surface display panel. The invention can obviously reduce the folding deformation wire breakage risk of the PAD area and improve the product yield.
Drawings
FIG. 1 is a schematic diagram illustrating a structure of a bonding area of a display panel according to the related art;
FIG. 2 is a schematic plan view of a display panel according to an embodiment of the present invention;
FIGS. 3-6 are schematic structural diagrams of a display panel bonding area according to an embodiment of the invention;
fig. 7-12 are schematic diagrams illustrating a manufacturing process of a display panel bonding area according to an embodiment of the invention.
Reference numerals
01 first flexible substrate
02 second flexible substrate
03 gate insulating layer
04 grid metal layer
05 interlayer insulating layer
06 drive chip
07 binding pin
08 signal routing
09 rigid substrate
10 protective film
11ACF
13 third flexible substrate
14 display panel
15 PAD area
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, a conventional bonding area (PAD area) film layer stack structure of a display panel includes: the flexible circuit comprises a first flexible substrate 01, a second flexible substrate 02, a gate insulating layer 03, a gate metal layer 04 and an interlayer insulating layer 05, wherein the gate metal layer 04 is used as a signal wiring, the interlayer insulating layer 05 is punched to form a via hole, a first source drain metal layer is deposited in the via hole to form a binding pin 07, and the binding of the driving circuit and the signal wiring is realized through the binding pin 07. The above structure has the following problems: 1) the material of the gate metal layer 04 is relatively fragile, and is easy to break due to folding and bending; 2) the PAD region has inorganic layers (interlayer insulating layer 05 and gate insulating layer 03) and tends to have crack when folded and bent. These problems exist so that the PAD area of the flexible screen cannot be bent and folded.
The embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, which can realize bending and folding of a PAD area so as to realize curved surface display.
An embodiment of the present invention provides a display panel, as shown in fig. 2, including a display area (i.e., an AA area) and a bonding area (i.e., a PAD area) located at a periphery of the display area, where the bonding area includes at least two stacked flexible substrates and a signal trace disposed between adjacent flexible substrates, where the signal trace is connected to a bonding pin through a via hole penetrating through the flexible substrates, and the bonding pin is located at an outermost side of the at least two stacked flexible substrates.
In this embodiment, the binding region includes at least two stacked flexible substrates and a signal trace disposed between adjacent flexible substrates, and the flexible substrates are made of an organic material, so that no inorganic layer exists in the binding region, and a crack is not likely to occur during folding and bending; in addition, the signal wiring between the flexible substrates is located in the middle of the PAD area stacking structure and located at the neutral layer position, and the signal wiring is not easy to break when being bent, so that the bonding area can be bent and folded, and the polymorphic change of the PAD area is realized to match with the curved surface display panel. The invention can obviously reduce the folding deformation wire breakage risk of the PAD area and improve the product yield.
In this embodiment, the bonding region may include two layers of flexible substrates, or may include three or more layers of flexible substrates, and the flexible substrates are generally made of polyimide. When the binding region comprises two layers of flexible substrates, the binding region comprises a layer of signal routing between the two layers of flexible substrates; when the bonding region includes more than three layers of flexible substrates, the bonding region may include multiple layers of signal traces located between two adjacent flexible substrates, or may include only one layer of signal trace located between two adjacent flexible substrates. When the binding region comprises a plurality of layers of signal wires, two adjacent layers of signal wires can be connected through a via hole penetrating through the flexible substrate.
In addition, in this embodiment, not only the bonding region includes at least two stacked flexible substrates, but also the base of the other region of the display panel and the bonding region have the same structure, that is, the base of the other region of the display panel also includes at least two stacked flexible substrates, but no signal trace may be disposed between the flexible substrates of the other region, for example, the display region; of course, in order to reduce the occupied area of the signal traces, the signal traces may also be disposed between two adjacent layers of the flexible substrates in the display area of the display panel.
In some embodiments, as shown in fig. 3, in a bonding area of a display panel, at least two stacked flexible substrates include a first flexible substrate 01 and a second flexible substrate 02 which are stacked, the bonding area further includes a signal trace 08 located between the first flexible substrate 01 and the second flexible substrate 02, a bonding pin 07 is disposed on a surface of one side of the first flexible substrate 01, which is away from the second flexible substrate 02, and the signal trace 08 is connected to the bonding pin 07 through a via hole penetrating through the first flexible substrate 01.
In this embodiment, a via hole penetrating through the first flexible substrate 01 may be formed by a photolithography process, the via hole exposes the signal trace 08, a source-drain metal layer is then formed on the first flexible substrate 01, the source-drain metal layer is patterned, the source-drain metal layer is deposited in the via hole, and a binding pin 07 is formed on the first flexible substrate 01 to bind and connect with the driver chip 06, so as to implement transmission of a driving signal.
In some embodiments, as shown in fig. 4, in a bonding area of a display panel, a first flexible substrate 01, a second flexible substrate 02, and a third flexible substrate 13 are disposed in a stacked manner, a signal trace 08 is disposed between the first flexible substrate 01 and the second flexible substrate 02, a signal trace 08 is disposed between the second flexible substrate 02 and the third flexible substrate 13, and signal traces 08 of different layers may be connected in parallel through a via hole penetrating through the second flexible substrate 02, so that the resistance of the signal trace 08 can be reduced.
The surface of one side, away from the second flexible substrate 02, of the first flexible substrate 01 is provided with a binding pin 07, and the signal routing 08 is connected with the binding pin 07 through a via hole penetrating through the first flexible substrate 01.
In this embodiment, a via hole penetrating through the first flexible substrate 01 may be formed by a photolithography process, the via hole exposes the signal trace 08, a source-drain metal layer is then formed on the first flexible substrate 01, the source-drain metal layer is patterned, the source-drain metal layer is deposited in the via hole, and a binding pin 07 is formed on the first flexible substrate 01 to bind and connect with the driver chip 06, so as to implement transmission of a driving signal.
In this embodiment, the signal trace may be made of metal with good electrical conductivity, such as Al, Mo, Au, Ag, and the like. In some embodiments, the signal traces can be made of Al and have a thickness of 0.5-0.6 um. The Al has the advantages of good toughness, high tensile strength and the like, can be folded, and meets the requirement of flexible display; in addition, the thickness of Al is 0.5-0.6 um, so that the wiring resistance of signal wiring can be ensured to be smaller, and the loss of signal transmission can be reduced. In this embodiment, the signal traces between the adjacent flexible substrates are located at the neutral layer of the film structure, and are neither pulled nor pressed when folded, so that the signal traces can be well protected from being folded and broken, and the front and the back can be simultaneously folded and bent, as shown in fig. 5.
When regional via hole was bound in the relevant art preparation, adopt die-cut punching technology to punch, the diameter of the via hole of die-cut punching preparation is at 25 +/-15 um, and the great arranging of being unfavorable for walking the line in aperture has restricted the quantity of walking the line, is unfavorable for the narrow in flexible display panel lower limb PAD region simultaneously. In this embodiment, as the via hole is manufactured by using the photolithography process, the aperture of the manufactured via hole is small, and the aperture of the via hole is 4-6um, which is beneficial to the arrangement of the routing lines and the narrowing of the PAD area at the lower edge of the flexible display panel.
In some embodiments, the line width of the signal trace is greater than or equal to 3um, so that the resistance of the signal trace can be effectively reduced, and transmission of a driving signal is facilitated; adjacent distance between the signal wires is greater than or equal to 3um, and interference between the adjacent signal wires can be avoided.
In some embodiments, the thickness of the flexible substrate can be 6-10 um, so that the binding region can have certain structural strength, and the thickness of the binding region cannot be too large.
In some embodiments, as shown in fig. 4, the display panel further includes:
the protective film 10 is located on the outermost side of the at least two stacked flexible substrates, the protective film 10 is made of a waterproof erosion material and can protect the binding area, and the protective film 10 does not affect connection between the driving chip and the binding pins when the hollow area of the binding pins is exposed. For better protection of the display panel, the protective film may cover both surfaces of the bonding area, i.e., the protective film is located at the outermost side of the at least two layers of flexible substrates, as shown in fig. 4, and is also located at a side surface of the third flexible substrate 13 away from the second flexible substrate 02.
Embodiments of the present invention also provide a display device including the display panel as described above.
The display device includes but is not limited to: radio frequency unit, network module, audio output unit, input unit, sensor, display unit, user input unit, interface unit, memory, processor, and power supply. It will be appreciated by those skilled in the art that the above described configuration of the display device does not constitute a limitation of the display device, and that the display device may comprise more or less of the components described above, or some components may be combined, or a different arrangement of components. In the embodiment of the present invention, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.
The display device may be: the display device comprises a television, a display, a digital photo frame, a mobile phone, a tablet personal computer and any other product or component with a display function, wherein the display device further comprises a flexible circuit board, a printed circuit board and a back plate.
In some embodiments, as shown in fig. 4, the display device further includes a driving chip 06, and the bonding pin 07 is bonded to the driving chip 06 through an ACF (Anisotropic Conductive Film) 11. if the bonding pin 07 and the driving chip 06 are bonded through a gold-tin eutectic soldering process, the bonding pin 07 and the driving chip 06 need to be bonded in a vacuum environment, which requires a high requirement on the equipment environment, and is slow in production speed and low in efficiency.
Four sides curved surface display product is the market trend, and among the correlation technique, flexible display panel is along the laminating of encapsulation apron cambered surface back, and the position of placing in PAD area is a big technological problem because the interior line of PAD area is fragile, can't carry out the bending folding. As shown in fig. 6, the routing structure of the PAD area of this embodiment can be folded at any angle to match the shape of the four-sided curved package cover board; wherein 14 is a display panel, in order to realize a narrow frame, the PAD area 15 is bent to the back of the display panel, and it can be seen that the PAD area can be bent along with the bending of the display panel, and the portion where the PAD area 15 is bound with the driving chip 06 cannot be bent due to the existence of the driving chip 06. The PAD area of this embodiment can be along the optimized mode of putting of encapsulation apron cambered surface, can reduce the space that the PAD area took the complete machine, provides more spaces for overall arrangement such as display device's complete machine battery, device, has advantages such as the duration that improves display device.
The embodiment of the invention also provides a manufacturing method of the display panel, which comprises the following steps:
providing a rigid substrate;
forming at least two layers of flexible substrates which are arranged in a stacked mode on the rigid base plate;
forming signal routing between two adjacent layers of the flexible substrates;
forming a via hole penetrating through the flexible substrate and exposing the signal routing by utilizing a photoetching process;
and forming binding pins on the outermost sides of the at least two stacked flexible substrates, wherein the binding pins are connected with the signal routing lines through the via holes.
In this embodiment, the binding region includes at least two stacked flexible substrates and a signal trace disposed between adjacent flexible substrates, and the flexible substrates are made of an organic material, so that no inorganic layer exists in the binding region, and a crack is not likely to occur during folding and bending; in addition, the signal wiring between the flexible substrates is located in the middle of the PAD area stacking structure and located at the neutral layer position, and the signal wiring is not easy to break when being bent, so that the bonding area can be bent and folded, and the polymorphic change of the PAD area is realized to match with the curved surface display panel. The invention can obviously reduce the folding deformation wire breakage risk of the PAD area and improve the product yield.
In this embodiment, the bonding region may include two layers of flexible substrates, or may include three or more layers of flexible substrates, and the flexible substrates are generally made of polyimide. When the binding region comprises two layers of flexible substrates, the binding region comprises a layer of signal routing between the two layers of flexible substrates; when the bonding region includes more than three layers of flexible substrates, the bonding region may include multiple layers of signal traces located between two adjacent flexible substrates, or may include only one layer of signal trace located between two adjacent flexible substrates. When the binding region comprises a plurality of layers of signal wires, two adjacent layers of signal wires can be connected through a via hole penetrating through the flexible substrate.
In addition, in this embodiment, not only the bonding region includes at least two stacked flexible substrates, but also the base of the other region of the display panel and the bonding region have the same structure, that is, the base of the other region of the display panel also includes at least two stacked flexible substrates, but no signal trace may be disposed between the flexible substrates of the other region, for example, the display region; of course, in order to reduce the occupied area of the signal traces, the signal traces may also be disposed between two adjacent layers of the flexible substrates in the display area of the display panel.
In some embodiments, as shown in fig. 3, in the bonding area of the display panel, the at least two stacked flexible substrates include a first flexible substrate 01 and a second flexible substrate 02 stacked in a stacked manner, and the forming of the at least two layers of flexible substrates stacked in a stacked manner on the rigid substrate includes:
forming a first flexible substrate and a second flexible substrate in a stacked arrangement;
forming signal routing between two adjacent layers of the flexible substrate comprises:
forming a signal routing wire between the first flexible substrate and the second flexible substrate, wherein a binding pin is arranged on the surface of one side, away from the second flexible substrate, of the first flexible substrate, and the signal routing wire is connected with the binding pin through a through hole penetrating through the first flexible substrate.
In some embodiments, the method further comprises:
and forming a protective film positioned at the outermost side of the at least two stacked flexible substrates, wherein the protective film comprises a hollow area exposed out of the binding pins. The protective film 10 is made of a waterproof erosion material and can protect the binding area, and the protective film 10 does not affect the connection between the driving chip and the binding pins including the hollow area exposed out of the binding pins. For better protection of the display panel, the protective film may cover both surfaces of the bonding area, i.e., the protective film is located at the outermost side of the at least two layers of flexible substrates, as shown in fig. 4, and is also located at a side surface of the third flexible substrate 13 away from the second flexible substrate 02.
In a specific example, the method for manufacturing the display panel of the embodiment includes the following steps:
step 1, as shown in fig. 7, providing a rigid substrate 09, and forming a second flexible substrate 02 on the rigid substrate 09;
the rigid substrate 09 may be a glass substrate or a quartz substrate. The second flexible substrate 02 may be formed by a coating process, and may be 6 to 10um thick, and polyimide may be used.
Step 2, as shown in fig. 8, forming a source drain metal layer on the second flexible substrate 02, and patterning the source drain metal layer to form a signal trace 08;
specifically, a magnetron sputtering method can be adopted to deposit metal Al with the thickness of 0.5-0.6 um, and a dry etching process is utilized to form corresponding patterns, wherein the minimum width of the wiring formed by the dry etching process can reach 3um, and the spacing between the wiring and the pattern can reach 3 um. In this embodiment, adopt the Al material of thickness 0.5 ~ 0.6um to make the signal and walk the line, thickness is thicker, and the impedance is less, and the cost is also lower, and Al material tensile strength is high, resistant buckling.
Step 3, as shown in fig. 9, forming a first flexible substrate 01, and patterning the first flexible substrate 01 to form a via hole;
the first flexible substrate 01 may be formed by a coating process, and may be 6 to 10um thick, and polyimide may be used. And forming a via hole penetrating through the first flexible substrate 01 by utilizing a photoetching process, wherein the aperture is 6 +/-2 um.
Step 4, as shown in fig. 10, depositing a metal layer on the first flexible substrate 01, and patterning the metal layer to form a binding pin 07;
the bonding pins 07 include IC bonding pins and display panel bonding pins. Because the aperture of the via hole manufactured by the photoetching process is small, the via hole can be punched at any position, the binding pins 07 can be arranged in two rows or multiple rows, and the width size of the PAD area of the display panel can be effectively reduced.
Step 5, as shown in fig. 11, removing the rigid substrate 09 to form a protective film 10;
specifically, a water-erosion resistant material may be coated to form the protective film 10, and in order to better protect the display panel, the protective film 10 may cover both surfaces of the bonding region. Among them, the protective film may employ an organic material such as solder resist.
Step 6, as shown in fig. 12, the driver chip 06 is bound to the binding pin 07.
In the embodiment, the bonding of the driving chip 06 and the bonding pin 07 can be realized through an ACF (anisotropic conductive film) gluing bonding process, a vacuum condition environment is not needed, the production speed is high, the efficiency is high, and the cost is low. Specifically, an ACF may be coated on the bonding pin 07, and then the driver chip 06 is pressed onto the bonding pin 07, and then the ACF is cured to complete the bonding of the driver chip 06 and the bonding pin 07.
In the embodiments of the methods of the present invention, the sequence numbers of the steps are not used to limit the sequence of the steps, and for those skilled in the art, the sequence of the steps is not changed without creative efforts.
It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is simple, and the relevant points can be referred to the partial description of the product embodiments.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (12)
1. The display panel is characterized by comprising a display area and a binding area located on the periphery of the display area, wherein the binding area comprises at least two stacked flexible substrates and a signal routing wire arranged between the adjacent flexible substrates, the signal routing wire is connected with a binding pin through a via hole penetrating through the flexible substrates, and the binding pin is located on the outermost side of the at least two stacked flexible substrates.
2. The display panel according to claim 1, wherein the at least two stacked flexible substrates include a first flexible substrate and a second flexible substrate which are stacked, the bonding region includes a signal trace located between the first flexible substrate and the second flexible substrate, a bonding pin is disposed on a surface of one side of the first flexible substrate, which is away from the second flexible substrate, and the signal trace is connected to the bonding pin through a via hole penetrating through the first flexible substrate.
3. The display panel of claim 1, wherein the via has an aperture of 4-6 um.
4. The display panel of claim 1, wherein the signal traces are made of Al and have a thickness of 0.5-0.6 um.
5. The display panel according to claim 1, wherein the line width of the signal trace is greater than or equal to 3 um; adjacent distance between the signal routing lines is larger than or equal to 3 um.
6. The display panel according to claim 1, wherein the flexible substrate has a thickness of 6 to 10 um.
7. The display panel according to claim 1, further comprising:
and the protective film is positioned on the outermost side of the at least two stacked flexible substrates and comprises a hollow area exposed out of the binding pins.
8. A display device characterized by comprising the display panel according to any one of claims 1 to 7.
9. The display device according to claim 8, further comprising a driver chip, wherein the bonding pin is bonded to the driver chip through an ACF.
10. A method for manufacturing a display panel is characterized by comprising the following steps:
providing a rigid substrate;
forming at least two layers of flexible substrates which are arranged in a stacked mode on the rigid base plate;
forming signal routing between two adjacent layers of the flexible substrates;
forming a via hole penetrating through the flexible substrate and exposing the signal routing by utilizing a photoetching process;
and forming binding pins on the outermost sides of the at least two stacked flexible substrates, wherein the binding pins are connected with the signal routing lines through the via holes.
11. The method of claim 10, wherein forming at least two layers of flexible substrates stacked on top of each other on the rigid substrate comprises:
forming a first flexible substrate and a second flexible substrate in a stacked arrangement;
forming signal routing between two adjacent layers of the flexible substrate comprises:
forming a signal routing wire between the first flexible substrate and the second flexible substrate, wherein a binding pin is arranged on the surface of one side, away from the second flexible substrate, of the first flexible substrate, and the signal routing wire is connected with the binding pin through a through hole penetrating through the first flexible substrate.
12. The method for manufacturing a display panel according to claim 10, wherein the method further comprises:
and forming a protective film positioned at the outermost side of the at least two stacked flexible substrates, wherein the protective film comprises a hollow area exposed out of the binding pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111247802.9A CN113964140A (en) | 2021-10-26 | 2021-10-26 | Display panel, manufacturing method thereof and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023201591A1 (en) * | 2022-04-20 | 2023-10-26 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023201591A1 (en) * | 2022-04-20 | 2023-10-26 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display device |
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