CN112817488A - Touch module, touch display device and touch module preparation method - Google Patents
Touch module, touch display device and touch module preparation method Download PDFInfo
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- CN112817488A CN112817488A CN202110243707.5A CN202110243707A CN112817488A CN 112817488 A CN112817488 A CN 112817488A CN 202110243707 A CN202110243707 A CN 202110243707A CN 112817488 A CN112817488 A CN 112817488A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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Abstract
The invention discloses a touch module, a touch display device and a touch module preparation method, wherein the touch module can comprise a substrate layer, a first electrode, a second electrode, a first lead layer and a second lead layer, the first electrode, the second electrode, the first lead layer and the second lead layer are positioned on the substrate layer, the substrate layer can comprise a display area and a wiring area, the wiring area can comprise a bending area and a connecting area, one end of the first lead layer is connected with the first electrode of the display area, the other end of the first lead layer directly extends to the wiring area, one end of the second lead layer is connected with the second electrode of the display area, the other end of the second lead layer directly extends to the wiring area and is connected with an external circuit through the connecting area of the wiring area. According to the touch module provided by the invention, the binding area of the touch module in the prior art is removed, the display area and the connection area for connecting an external circuit are integrally arranged by extending the wiring area, and the frame of the touch module can be effectively reduced by arranging the bending area to bend.
Description
Technical Field
The invention relates to the technical field of display, in particular to a touch module, a touch display device and a touch module preparation method.
Background
With the development of the technology, in the setting process of touch display devices such as mobile phones and televisions, frame narrowing is pursued to achieve a larger screen ratio.
Touch-control display device can include touch-control module, touch-control module can have the stratum basale and set up the laminated structure on the stratum basale, usually in order to be connected with external circuit, touch-control module can divide the display area into, wiring district and binding district, the laminated structure who binds the district can be used for being connected with the one end of flexible line way board, through buckling the setting with the flexible line way board, the other end of flexible line way board can buckle to the below of stratum basale, promptly with be provided with stratum basale one side that laminated structure is relative, the rethread flexible line way board is connected with external circuit. However, the existence of the binding region still makes the lower frame of the touch display device larger than the other three sides, and as shown in fig. 1, in order to further implement the narrowing of the lower frame, in the prior art, the narrowing of the frame is implemented by shortening the binding lead, however, the binding area is reduced and the binding difficulty is increased while the binding lead is shortened, so that the touch performance of the device may be affected.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: how to effectively realize the frame narrowing of the touch module.
In order to solve the above technical problems, the present invention provides a touch module, a touch display device and a method for manufacturing a touch module.
In a first aspect of the present invention, a touch module is provided, which includes:
the substrate layer comprises a display area and a wiring area positioned on one side of the display area, the wiring area comprises a bending area and a connecting area, the bending area is bent, and the connecting area is positioned below the substrate layer of the display area;
a first electrode disposed on the base layer of the display region;
a second electrode disposed on the base layer of the display area, the second electrode being spaced apart from the first electrode;
a first lead layer disposed on the substrate layer, one end of the first lead layer being connected to the first electrode, and the other end of the first lead layer extending to the wiring region;
and the second lead layer is arranged on the basal layer, one end of the second lead layer is connected with the second electrode, the other end of the second lead layer extends to the wiring area, and the second lead layer and the first lead layer are arranged at intervals.
In some embodiments, the first electrode comprises a plurality of row arrays, each of the row arrays comprising a plurality of first sub-electrodes; the second electrode comprises a plurality of column arrays, each column array comprises a plurality of second sub-electrodes,
one end of the first lead layer is connected to the first electrode, and includes:
the first lead layer comprises a plurality of first leads, and the first sub-electrodes positioned in a first column or a last column in the row array are connected with the first leads in a one-to-one correspondence manner; alternatively, the first and second electrodes may be,
the first sub-electrode positioned in the first column in part of the row arrays is connected with the first lead, and the first sub-electrode positioned in the last column in the rest of the row arrays is connected with the first lead;
one end of the second lead layer is connected to the second electrode, and includes:
the second lead layer comprises a plurality of second leads, the second sub-electrodes positioned in the first row or the last row in the column array are connected with the second leads in a one-to-one correspondence manner, the first row corresponds to a position far away from the bending region, and the last row corresponds to a position close to the bending region; alternatively, the first and second electrodes may be,
the second sub-electrodes positioned in the first row in part of the column arrays are connected with the second lead, and the second sub-electrodes positioned in the last row in the rest of the column arrays are connected with the second lead.
In some embodiments, the first electrode comprises a plurality of row arrays, each of the row arrays comprising a plurality of first sub-electrodes; the second electrode comprises a plurality of column arrays, each column array comprises a plurality of second sub-electrodes,
one end of the first lead layer is connected to the first electrode, and includes:
the first lead layer comprises a plurality of first leads, and one ends of the first leads are correspondingly connected with the first sub-electrodes positioned in the first column and the last column in the row array;
one end of the second lead layer is connected to the second electrode, and includes:
the second lead layer comprises a plurality of second leads, the second sub-electrodes positioned in the first row or the last row in the column array are connected with the second leads in a one-to-one correspondence manner, the first row corresponds to the position far away from one side of the bending region, and the last row corresponds to the position close to one side of the bending region; alternatively, the first and second electrodes may be,
the second sub-electrodes positioned in the first row in part of the column arrays are connected with the second lead, and the second sub-electrodes positioned in the last row in the rest of the column arrays are connected with the second lead.
In some embodiments, the touch module further includes: a first insulating layer covering the base layer, the first electrode, the second electrode, the first lead layer, and a portion of the second lead layer, the first insulating layer having a plurality of first via holes disposed therein, the first via holes exposing an upper surface of a portion of the first electrode; a bridging structure covering the first via hole and at least a portion of the first insulating layer, bridging two adjacent first sub-electrodes in each row; a plurality of second via holes and third via holes are further arranged in the first insulating layer, the second via holes are located outside the bending area and close to one side of the display area, and the third via holes are located outside the bending area and close to one side of the connecting area;
the other end of the second lead layer extends to the wiring region, including:
one end of the second lead layer arranged on the first insulating layer is connected with the second lead layer arranged below the first insulating layer and led out from the second electrode through the second via hole, and the other end of the second lead layer is connected with the second lead layer arranged below the first insulating layer and extending to the connecting area through the third via hole.
In some embodiments, the touch module further includes: a first insulating layer covering the base layer, the first electrode and a portion of the second electrode, the first insulating layer having a plurality of first vias disposed therein, the first vias exposing an upper surface of a portion of the first electrode; a bridging structure covering the first via hole and at least a portion of the first insulating layer, bridging two adjacent first sub-electrodes in each row; and a connection terminal portion that covers the second electrode and connects the second electrode with the second lead layer provided on the first insulating layer; a plurality of second via holes are also arranged in the first insulating layer, the second via holes are positioned outside the bending area and close to one side of the connecting area,
the other end of the first lead layer extends to the wiring region, including:
the other end of the first lead layer is connected with the first lead layer which is located on the first insulating layer and extends to the connecting area through the second via hole.
In some embodiments, the first electrode comprises a plurality of row arrays, each of the row arrays comprising a plurality of first sub-electrodes; the second electrode comprises a plurality of column arrays, each column array comprises a plurality of second sub-electrodes,
one end of the first lead layer is connected to the first electrode, and includes:
the first lead layer comprises a plurality of first leads, and one ends of the first leads are correspondingly connected with the first sub-electrodes positioned in the first column and the last column in the row array;
one end of the second lead layer is connected to the second electrode, and includes:
the second lead layer comprises a plurality of second leads and third leads, one ends of the second leads are in one-to-one corresponding connection with the second sub-electrodes positioned in the last row in the column array, one ends of the third leads are in one-to-one corresponding connection with the second sub-electrodes positioned in the first row in the column array, the first row corresponds to a position far away from one side of the bending region, and the last row corresponds to a position close to one side of the bending region.
In some embodiments, the touch module further includes: a first insulating layer covering the base layer, the first electrode, the second electrode, the first lead layer, and a portion of the second lead layer, the first insulating layer having a plurality of first via holes disposed therein, the first via holes exposing an upper surface of a portion of the first electrode; the bridging structure covers the first via hole and at least part of the first insulating layer, bridges two adjacent first sub-electrodes in each row, and is also provided with a plurality of second via holes and third via holes, the second via holes are positioned outside the bending area and close to one side of the display area, and the third via holes are positioned outside the bending area and close to one side of the connecting area;
the other end of the second lead layer extends to the wiring region, including:
one end of the second lead is connected with the second lead, which is arranged below the first insulating layer and is led out by the second electrode, through the second via hole, the other end of the second lead is connected with the second lead, which is arranged below the first insulating layer and extends to the connecting area, through the third via hole, and the other end of the third lead is connected with the second lead, which is arranged below the third via hole.
In some embodiments, the touch module further includes: a first insulating layer covering the base layer, the first electrode, the second electrode, the first lead layer, and a portion of the second lead layer, the first insulating layer having a plurality of first via holes disposed therein, the first via holes exposing an upper surface of a portion of the first electrode; a bridging structure covering the first via hole and at least a portion of the first insulating layer, bridging two adjacent first sub-electrodes in each row; the first insulating layer is also provided with a plurality of second via holes, third via holes and fourth via holes, the second via holes are positioned outside the bending area and close to one side of the display area, the third via holes are positioned outside the bending area and close to one side of the connecting area, and the fourth via holes are positioned outside the bending area and close to one side of the connecting area; a fourth lead having one end connected to the second lead positioned above the third via hole and the other end connected to the third lead positioned below the first insulating layer through the fourth via hole,
the other end of the second lead layer extends to the wiring region, including:
set up in on the first insulating layer second lead wire, one end is passed through the second via hole with set up in first insulating layer below and by the second electrode is drawn forth second pin connection, the other end passes through the third via hole with set up in first insulating layer below and extend to connect area the second pin connection, the other end of third lead wire extends to connect area.
In some embodiments, the second via, the third via, and/or the fourth via are disposed at a predetermined distance from an edge of the bending region of the wiring region.
In a second aspect of the present invention, a touch display device is provided, which includes the touch module as described above.
In a third aspect of the present invention, a method for manufacturing a touch module is provided, which includes:
providing a substrate layer, wherein the substrate layer comprises a display area and a wiring area positioned on one side of the display area, the wiring area comprises a bending area close to the display area and a connecting area far away from the display area, and the bending area and the connecting area are arranged in a way that the connecting area is positioned below the substrate layer of the display area after the bending area is bent;
forming a first electrode and a second electrode on the base layer, the second electrode being spaced apart from the first electrode;
forming a first lead layer on the base layer, one end of the first lead layer being connected to the first electrode, and the other end of the first lead layer extending to the wiring region;
and forming a second lead layer on the base layer, one end of the second lead layer being connected to the second electrode, and the other end of the second lead layer extending to the wiring line region.
In some embodiments, the method for manufacturing a touch module further includes: performing a metallizing process on an end portion of the first lead layer and/or an end portion of the second lead layer located in the connection region; alternatively, the first and second electrodes may be,
depositing a conductive layer covering an end of the first lead layer and/or an end of the second lead layer in the connection region.
Compared with the prior art, one or more embodiments in the above scheme can have the following advantages or beneficial effects:
the touch module provided by the invention can comprise a substrate layer, a first electrode, a second electrode, a first lead layer and a second lead layer, wherein the first electrode, the second electrode, the first lead layer and the second lead layer are positioned on the substrate layer, the substrate layer can comprise a display area and a wiring area, the wiring area in the substrate layer can comprise a bending area and a connecting area, one end of the first lead layer is connected with the first electrode in the display area, the other end of the first lead layer directly extends to the connecting area in the wiring area, one end of the second lead layer is connected with the second electrode in the display area, the other end of the second lead layer directly extends to the connecting area in the wiring area, and the second lead layer is connected with an external circuit through the connecting area. According to the touch module provided by the invention, the binding area of the touch module in the prior art is removed, the display area and the connection area for connecting an external circuit are integrally arranged by extending the wiring area, and the frame of the touch module can be effectively reduced by arranging the bending area to bend.
Drawings
The scope of the present disclosure may be better understood by reading the following detailed description of exemplary embodiments in conjunction with the accompanying drawings. Wherein the included drawings are:
FIG. 1 shows a touch display screen bezel schematic;
fig. 2 is a schematic cross-sectional view illustrating a touch module;
FIG. 3 shows a schematic view of a touch display device;
fig. 4 is a top view of a touch module according to an embodiment of the invention;
fig. 5 is a top view of a touch module in which lead layers are simultaneously led out from two sides of a first electrode according to an embodiment of the invention;
fig. 6A is a schematic cross-sectional view of a touch module taken along a dashed line AA' in fig. 5 according to an embodiment of the invention; fig. 6B is a schematic cross-sectional view of a touch module taken along a dashed line BB' in fig. 5 according to an embodiment of the invention;
fig. 7 is a top view of a touch module in which lead layers are simultaneously led out from two sides of a first electrode according to another embodiment of the invention;
fig. 8 is a schematic cross-sectional view of a touch module taken along a dashed line CC' in fig. 7 according to an embodiment of the invention;
fig. 9 is a top view of a touch module provided with a first electrode and a second electrode, both of which are led out from lead layers at two sides simultaneously according to an embodiment of the present invention;
fig. 10 is a top view of a touch module according to another embodiment of the invention, in which a first electrode and a second electrode are both led out from two sides of the touch module simultaneously;
FIG. 11 is a diagram illustrating a comparison between a touch device provided by an embodiment of the present invention and a COP touch device in the prior art;
fig. 12 is a schematic flow chart illustrating a method for manufacturing a touch module according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the following will describe in detail an implementation method of the present invention with reference to the accompanying drawings and embodiments, so that how to apply technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented.
With the development of the technology, in the process of setting touch devices such as mobile phones and televisions, narrowing of the frame is pursued to achieve a larger screen ratio.
The touch display device may include a touch module, the touch module may have a base layer 10, generally for connecting with an external circuit, the base layer 10 may be provided with a touch area (AA area), a wiring area (TRACE area) and a binding area (BONDING area), specifically referring to fig. 2, fig. 2 shows a schematic cross-sectional structure diagram of the touch module, a touch conductive layer 11 is provided on the base layer 10, and the touch conductive layer 11 may be used to form a driving electrode and a sensing electrode of a touch component; the metal layer 12 covers part of the touch conductive layer 11, and the metal layer 12 may connect the touch conductive layer 11 with the bonding structure 13 of the bonding region. In addition, the touch module is further provided with a first insulating layer 14, the first insulating layer 14 can cover part of the base layer 10, part of the touch conductive layer 11 and the metal layer 12, and a plurality of through holes are formed in the first insulating layer 14; a bridging structure 15 covering two adjacent via holes and a part of the first insulating layer 14 is further arranged on the first insulating layer 14, and the bridging structure 15 can connect two adjacent driving electrodes or two adjacent sensing electrodes through the two adjacent via holes; finally, a second insulating layer 16 may be further provided, and the second insulating layer 16 covers a part of the first insulating layer 14 and the bridging structure 15 to perform an insulating protection function.
The binding region may be connected to one end of the flexible printed circuit, and the other end of the flexible printed circuit may be bent to a side where the non-display region is located and then connected to an external circuit, such as an IC chip, as shown in fig. 3, where fig. 3 shows a schematic diagram of a touch display device. However, the reduction of the frame is limited due to the existence of the binding region, and in other prior art, the further narrowing of the frame is realized by shortening the binding lead, and then the binding area is reduced while the binding lead is shortened, the binding difficulty is increased, so that the touch performance of the device is possibly influenced.
In view of the above, the present invention provides a touch module, which may include a substrate layer, a first electrode, a second electrode, a first lead layer and a second lead layer on the substrate layer, wherein the substrate layer may include a display area and a wiring area, the wiring area in the substrate layer may include a bending area and a connecting area, one end of the first lead layer may be connected to the first electrode in the display area, the other end of the first lead layer may directly extend to the connecting area in the wiring area, and one end of the second lead layer may be connected to the second electrode in the display area, and the other end of the second lead layer may directly extend to the connecting area in the wiring area and then be connected to an external circuit through the connecting area. According to the touch module provided by the invention, the binding area of the touch module in the prior art is removed, the display area and the connection area for connecting an external circuit are integrally arranged by extending the wiring area, and the frame of the touch module can be effectively reduced by arranging the bending area to bend. Connection region
Fig. 4 is a top view of a touch module according to an embodiment of the present invention, which includes:
the substrate layer 20, the substrate layer 20 includes a display area and a wiring area located on one side of the display area, the wiring area includes a bending area and a connecting area, the bending area is bent, and the connecting area is located below the substrate layer of the display area and in the connecting area;
a first electrode 21, the first electrode 21 being disposed on the base layer 20 of the display region;
a second electrode 22, the second electrode 22 is disposed on the substrate layer 20 of the display region, and the second electrode 22 is spaced apart from the first electrode 21;
a first lead layer 23, the first lead layer 23 being disposed on the substrate layer 20, one end of the first lead layer 23 being connected to the first electrode 21, the other end of the first lead layer 23 extending to the wiring region;
and a second lead layer 24, wherein the second lead layer 24 is disposed on the substrate layer 20, one end of the second lead layer 23 is connected to the second electrode 22, the other end of the second lead layer 24 extends to the wiring region, and the second lead layer 24 and the first lead layer 23 are disposed at an interval.
Wherein the display area can be represented by AA, the wiring area can be represented by E, the bending area can be represented by B, the connection area can be represented by F, and the connection area F can have a smaller lateral size with respect to the display area AA and the bending area B. The substrate layer 20 may be formed of a flexible material, such as a COP material or a PET material. The first electrode 21 and the second electrode 22 may be disposed on the same layer on the base layer 20, and the first lead layer 23 and the second lead layer 24 may be disposed on the same layer as the first electrode 21 and the second electrode 22. Among them, the first electrode 21 and the second electrode 22 may be formed by depositing metal or ITO, and the first lead layer 23 and the second lead layer 24 may be formed by depositing metal such as copper or the like.
In some embodiments, the first electrode 21 may include a plurality of row arrays, each of the row arrays may include a plurality of first sub-electrodes 211, the second electrode 22 may include a plurality of column arrays, each of the column arrays may include a plurality of second sub-electrodes 221, and the first sub-electrodes 211 and the second sub-electrodes 221 are spaced apart from each other.
In some embodiments, the touch module may further include a first insulating layer (not shown), the first insulating layer covers the base layer 20, the first electrode 21, a portion of the second electrode 22, the first lead layer 23, and the second lead layer 24, a plurality of first vias (not shown) are disposed in the first insulating layer, and the first vias expose a portion of the upper surface of the first electrode 21; the bridging structure 25, the bridging structure 25 covers the first via hole and at least a portion of the first insulating layer, and bridges two adjacent first sub-electrodes 211 in each row. The bridging structure 25 may be formed of the same material as the first electrode 21.
In other embodiments, the touch module may further include a connection terminal 26, the connection terminal 26 partially covers the first electrode 21, and the first electrode 21 is connected to the first lead layer 23 disposed on the substrate layer 20 through the connection terminal 26; and/or the connection terminal 26 partially covers the second electrode 22, and the second electrode 22 is connected to the second lead layer 24 through the connection terminal 26.
In the embodiment of the present invention, the first lead layer 23 may be drawn out only by the first sub-electrode 211 positioned at one side edge of the first electrode 21.
In some embodiments, the first lead layer 23, one end of which is connected to the first electrode 21, may include: the first sub-electrode 211 in the first column of a part of the row arrays is connected to the first lead 231, and the first sub-electrode 211 in the last column of the remaining row arrays is connected to the first lead 231, as shown in fig. 4.
In other embodiments, the first lead layer 23, one end of which is connected to the first electrode 21, may include: the first lead layer 23 includes a plurality of first leads 231, and the first sub-electrodes 211 positioned in the first column or the last column are connected to the first leads 231 in a one-to-one correspondence.
It should be noted that, in fig. 4, the leftmost column may be used as the first column, and the rightmost column may be used as the last column; in other embodiments, the leftmost column in fig. 4 may be used as the last column, and the rightmost column may be used as the first column.
In the embodiment of the present invention, the second lead layer 24 may be led out only by the second sub-electrode 221 positioned at one side edge of the second electrode 22.
In some embodiments, the connection of one end of the second lead layer 24 to the second electrode 22 may include: the second lead layer 24 includes a plurality of second leads 241, and the second sub-electrodes 221 positioned in the first row or the last row in the column array are connected to the second leads 241 in a one-to-one correspondence, for example, as shown in fig. 4, only the second sub-electrodes 221 in the last row are connected to the second leads 241 in a one-to-one correspondence.
In other embodiments, the second sub-electrodes 221 positioned in the first row in some of the column arrays are connected to the second lead 241, and the second sub-electrodes 221 positioned in the last row in the remaining column arrays are connected to the second lead 241.
It should be noted that the first row may correspond to a position away from the bending region, and the last row may correspond to a position close to the bending region.
The other end of the first lead layer 23 and the other end of the second lead layer 24 each extend to a connection region of the wiring region. The bending region B is bent such that the connecting region F is located under the substrate layer 20 of the display area AA.
In order to avoid trace interference, each of the first lead line 231, the second lead line 241 and the first lead line 231 and the second lead line 241 in the wiring area may be set according to a predetermined ratio of line width to space, as a specific example, the predetermined ratio of line width to space may be W/S ═ 50 μm/50 μm, where W represents the line width and S represents the space. In other embodiments, a metal layer may be disposed between adjacent leads to serve as a ground terminal for the wires, so as to achieve a better isolation effect and avoid interference between the leads.
For a touch display device with a larger size, in order to reduce the channel delay, the touch module may be further configured to simultaneously lead out the lead layers from the conductive units on the two side edges of the first electrode 21 and/or the second electrode 22.
In some embodiments, referring to fig. 5, fig. 6A and fig. 6B, fig. 5 is a top view of a touch module provided in an embodiment of the present invention, in which lead layers are simultaneously led out from two sides of a first electrode, and fig. 6A is a schematic cross-sectional structure view of the touch module taken along a dashed line AA' in fig. 5; fig. 6B is a schematic cross-sectional view of a touch module taken along a dashed line BB' in fig. 5 according to an embodiment of the invention. One end of the first lead layer 33 is connected to the first electrode 31, and may include: the first lead layer 33 includes a plurality of first lead lines 331, and one end of each of the first lead lines 331 is connected to the first sub-electrodes 311 in the first and last columns of the row array. One end of the second lead layer 34 is connected to the second electrode 32, and may include: the second lead layer 34 includes a plurality of second leads 341, and the second sub-electrodes 321 positioned in the last row in the column array are connected to the second leads 341 in a one-to-one correspondence.
In other embodiments, one end of the second lead layer 34 is connected to the second electrode 32, and may include: the second lead layer 34 includes a plurality of second leads 341, and the second sub-electrodes 321 positioned in the first row in the column array are connected to the second leads 341 in a one-to-one correspondence; alternatively, the second sub-electrodes 321 positioned in the first row in some of the column arrays are connected to the second lead 341, and the second sub-electrodes 321 positioned in the last row in the remaining column arrays are connected to the second lead 341.
In order to avoid the second lead layer 34 from contacting the first lead layer 33, the second lead layer 34 may be layered or the second lead layer 34 and the first lead layer 33 may be led out from different layers of the display area.
In the embodiment of the present invention, the second lead layers 34 may be layered. The touch module may further include a first insulating layer 35, the first insulating layer 35 covers the base layer 30, the first electrode 31, the second electrode 32, the first lead layer 33 and a portion of the second lead layer 34, a plurality of first via holes are disposed in the first insulating layer 35, and the upper surfaces of the first electrode 31 are exposed by the first via holes; the bridging structure 36, the bridging structure 36 covers the first via hole and at least a part of the first insulating layer 35, and bridges two adjacent first sub-electrodes 311 in each row; a plurality of second via holes 37 and third via holes 38 may also be disposed in the first insulating layer 35, where the second via holes 37 are located outside the bending region and near one side of the display region, and the third via holes 38 are located outside the bending region and near one side of the connection region. In some embodiments, the third via 38 may also be located at the connection region.
The other end of the second wiring layer 34 extends to the wiring region via the wiring region, and may include:
the second lead layer 34 disposed on the first insulating layer 35 has one end connected to the second lead layer 34 disposed under the first insulating layer 35 and led out from the second electrode 32 through a second via 37, and the other end connected to the second lead layer 34 disposed under the first insulating layer 35 and extending to the connection region through a third via 38. See fig. 6A and 6B for details. The first lead 331 drawn from the first sub-electrode 311 of the row array located at the first and last columns may extend to the connection region F after the bending regions are merged into a single lead. The second lead 341 is led out from the second electrode 32, extends to the first insulating layer 35 through the second via 37, and then returns to the same layer in the connection region where the second electrode 32 is provided through the third via 38.
In order to avoid via hole breakage caused by a large stress during bending, in some embodiments, the second via 37 and/or the third via 38 may be disposed at a preset distance from the edge of the bending region, for example, the second via 37 and/or the third via 38 is disposed at a distance of 1 mm from the edge of the bending region.
In other embodiments, the second lead layer 34 and the first lead layer 33 may be led out from different layers. Referring to fig. 7 and 8, fig. 7 is a top view of a touch module in which lead layers are simultaneously led out from two sides of a first electrode according to another embodiment of the present invention, and fig. 8 is a schematic cross-sectional structure view of the touch module taken along a dashed line CC' in fig. 7 according to another embodiment of the present invention. The touch module may further include: a first insulating layer 45, where the first insulating layer 45 covers the base layer 40, the first electrode 41 and a portion of the second electrode 42, and a plurality of first via holes (not shown) are disposed in the first insulating layer 45, and the upper surfaces of the first electrode are exposed by the first via holes; a bridging structure 46, wherein the bridging structure 46 covers the first via hole 46 and at least a part of the first insulating layer 45, and bridges two adjacent first sub-electrodes 411 in each row; and a connection terminal 47, the connection terminal 47 partially covering the second electrode 42 and connecting the second electrode 42 with the second lead layer 44 disposed on the first insulating layer 45; a plurality of second vias 48 are further disposed in the first insulating layer 45, the second vias 48 are located outside the bending region and near one side of the connection region, and the other end of the first lead layer 43 extends to the wiring region, which may include:
the other end of the first lead layer 43 is connected to the first lead layer 43, which is located on the first insulating layer 45 and extends to the connection region, through the second via hole 48, as shown in fig. 8. The first leads 431 led out from the first sub-electrodes 411 in the first column and the last column of the same row array may be merged into a single lead in the wiring region E, and then extend to the upper side of the first insulating layer 45 through the second vias 48, and extend to the connection region on the first insulating layer 45.
In this case, a portion of the wiring area E near the display area AA may be provided as a bending region. In addition, it should be noted that, in some embodiments, the connection terminal 47 and the second lead layer 44 may be simultaneously formed after depositing the first insulating layer 45.
In some embodiments, referring to fig. 9, fig. 9 is a top view of a touch module provided with a first electrode and a second electrode, both of which are led out from lead layers at the same time. The first electrode 51 includes a plurality of row arrays, each of which may include a plurality of first sub-electrodes 511, the second electrode 52 includes a plurality of column arrays, each of which may include a plurality of second sub-electrodes 521, and one end of the first lead layer 53 connected to the first electrode 51 may include: the first lead layer 53 includes a plurality of first leads 531, and one ends of the first leads 531 are correspondingly connected to the first sub-electrodes 511 positioned at the first and last columns in the row array; one end of the second lead layer 54 is connected to the second electrode 52, and may include: the second lead layer 54 includes a plurality of second lead lines 541 and third lead lines 542, one end of the second lead lines 541 is connected to the second sub-electrodes 521 positioned in the last row in the column array in a one-to-one correspondence, and one end of the third lead lines 542 is connected to the second sub-electrodes 521 positioned in the first row in the column array in a one-to-one correspondence. It should be noted that the first row may correspond to a position far from the side of the bending region, and the last row may correspond to a position near the side of the bending region.
In some embodiments, the third lead 542 and the second lead 541 may extend to the connection region after being merged into one lead in the wiring region, as shown in fig. 9. The touch module may further include: a first insulating layer (not shown) covering the base layer 50, the first electrode 51, the second electrode 52, the first lead layer 53 and a portion of the second lead layer 54, wherein a plurality of first via holes (not shown) are formed in the first insulating layer, and the upper surfaces of the first electrodes 51 are exposed by the first via holes; the bridging structure 55 is used for covering the first via hole and at least part of the first insulating layer, bridging two adjacent first sub-electrodes 511 in each row, and is also provided with a plurality of second via holes 56 and third via holes 57, wherein the second via holes 56 are positioned outside the bending area and close to one side of the display area, and the third via holes 57 are positioned outside the bending area and close to one side of the connection area;
the other end of the second wiring layer 54 extends to the wiring region, and includes:
one end of a second lead 541 disposed on the first insulating layer is connected to the second lead 541 disposed below the first insulating layer and led out from the second electrode 54 through a second via 56, the other end of the second lead 541 is connected to the second lead 541 disposed below the first insulating layer and extended to the connection region through a third via 57, and the other end of the third lead 542 is connected to the second lead 541 located below the third via 57.
Referring to fig. 10, fig. 10 is a top view of a touch module provided with a first electrode and a second electrode, both of which have lead layers led out from two sides simultaneously according to another embodiment of the present invention.
A plurality of fourth via holes 58 are further disposed in the first insulating layer, the fourth via holes 58 are located outside the bending region and near one side of the connection region, in other embodiments, the fourth via holes 58 may also be disposed in the connection region; a fourth lead 59, one end of the fourth lead 59 being connected to the second lead 541 located above the third via 57, the other end of the fourth lead 59 being connected to the third lead 542 located below the first insulating layer through the fourth via 58,
the other end of the second wiring layer 54 extends to the wiring region, and may include:
one end of a second lead 541 disposed on the first insulating layer is connected to the second lead 541 disposed below the first insulating layer and led out from the second electrode 52 through a second via 56, the other end of the second lead 541 is connected to the second lead 541 disposed below the first insulating layer and extended to the connection region through a third via 57, and the other end of the third lead 542 is extended to the connection region.
It is noted that, in some embodiments, in order to protect the lead layers, an insulating layer covering the first, second, third, and/or fourth leads 531, 541, 542, and/or 59 may be further provided, and as a specific example, the insulating layer may be formed of MoNb.
On the other hand, the embodiment of the invention also provides a touch display device. Referring to fig. 11, fig. 11 is a comparison diagram of a touch display device provided by an embodiment of the present invention and a COP touch display device in the prior art. The touch display device provided by the embodiment of the invention can comprise the touch module. In some embodiments, the substrate layer in the wiring area is folded to locate the connection area below the substrate layer in the display area, and the connection area can be connected to an external circuit such as a PCBA. Compared with the prior art, the frame is effectively reduced, the integration level is improved, the material cost is saved, and the product yield is improved.
Correspondingly, the embodiment of the invention also provides a touch module preparation method. Referring to fig. 12, fig. 12 is a schematic flow chart illustrating a method for manufacturing a touch module according to an embodiment of the present invention, which includes:
step S101: the substrate layer is provided and comprises a display area and a wiring area located on one side of the display area, the wiring area comprises a bending area close to the display area and a connecting area far away from the display area, and the bending area and the connecting area are arranged to be located below the substrate layer of the display area after the bending area is bent.
Step S102: a first electrode and a second electrode are formed on the base layer, the second electrode being spaced apart from the first electrode.
Step S103: a first wiring layer is formed on the base layer, one end of the first wiring layer is connected to the first electrode, and the other end of the first wiring layer extends to the wiring region.
Step S104: and forming a second lead layer on the substrate layer, wherein one end of the second lead layer is connected with the second electrode, and the other end of the second lead layer extends to the wiring region.
In the embodiment of the present invention, step S101 may specifically be to form the substrate layer by a deposition process conventional in the art, such as magnetron sputtering, physical vapor deposition, or chemical vapor deposition, wherein the substrate layer may be formed by a flexible material such as COP or PET, and the connection region of the wiring region may have a smaller lateral dimension relative to the display region and the bending region.
In other embodiments, after providing the base layer, an insulating material such as silicon nitride or silicon oxide may also be deposited on the base layer.
Step S102 may specifically be depositing a conductive layer on the substrate layer located in the display area, and forming a first electrode and a second electrode of a target pattern through an etching process, in some embodiments, the first electrode and the second electrode may be formed of an ITO material, the first electrode may include a plurality of row arrays, each row array may include a plurality of first sub-electrodes, the second electrode may include a plurality of column arrays, each column array may include a plurality of second sub-electrodes, and the first sub-electrodes may serve as a touch driving motor TxThe second sub-electrode can be used as a touch sensing electrode Rx。
Step S103 may specifically be depositing a conductive layer on the periphery of the display area and the wiring area, and forming a first wiring layer on at least one side of the periphery of the display area and the wiring area through an etching process, where the first wiring layer may include a plurality of first leads extending from the first electrodes to the wiring area.
Step S104 may specifically be depositing a conductive layer on the periphery of the display area and the wiring area, and forming a second wiring layer on at least one side of the periphery of the display area and the wiring area by an etching process, where the second wiring layer may include a plurality of second leads extended from the second electrodes to the wiring area.
In addition, a first insulating layer covering the base layer, the first electrode, the second electrode, the first lead layer, and the second lead layer may be formed; forming a plurality of first via holes in the first insulating layer through an etching process, wherein the first via holes expose part of the upper surface of the first electrode; depositing a bridging structure, wherein the bridging structure can cover two adjacent first via holes and a first insulating layer positioned between the two adjacent first via holes, and bridges two adjacent first sub-electrodes; in other embodiments the bridging structure may cover the first via and the entire first insulating layer.
In some embodiments, in order to avoid overlapping of the first and second wiring layers and to reduce the wiring area, the first wiring layer or the second wiring layer may be further divided into settings. As an example, step S104 may also be depositing a conductive layer on the periphery of the display area and the connection area of the wiring area, and forming a portion of the second lead layer on at least one side of the periphery of the display area and the connection area through an etching process.
In addition, a first insulating layer covering the base layer, a part of the first electrode, the second electrode, the first lead layer, and a part of the second lead layer may be formed; forming a plurality of second via holes and third via holes in the first insulating layer by an etching process; and depositing a second lead layer covering the second via hole, the third via hole and the first insulating layer.
In other embodiments, a connection terminal may be further formed after the first electrode and the second electrode are formed, the connection terminal covering the first sub-electrode or the second sub-electrode at the edge of the display area for connecting the first electrode and the first lead layer, or connecting the second electrode and the second lead layer.
As an example, the first and second lead layers may be formed of the same material in the same layer in a single patterning process, wherein the first and second lead layers may be formed using a copper, aluminum alloy, or silver material, and after the first and second lead layers are formed, an anti-corrosion material such as MoNb covering the first and second lead layers may be deposited as a protective layer in order to protect the lead layers.
In some embodiments, the method for manufacturing a touch module may further include:
step S105: performing gold plating on the end portion of the first lead layer and/or the end portion of the second lead layer in the connection region; alternatively, the first and second electrodes may be,
and depositing a conductive layer, wherein the conductive layer covers the end part of the first lead layer and/or the end part of the second lead layer in the connecting area.
In some embodiments, the conductive layer may be an ITO layer, and the protective layer may be formed by performing a gold plating process or depositing a conductive layer on the end portion of the first lead layer and/or the end portion of the second lead layer in the connection region.
In other embodiments, a second insulating layer may be further deposited, and the second insulating layer may cover the first insulating layer, the bridge structure, the connection terminal, and the second lead layer disposed on the first insulating layer.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (12)
1. A touch module, comprising:
the substrate layer comprises a display area and a wiring area positioned on one side of the display area, the wiring area comprises a bending area and a connecting area, the bending area is bent, and the connecting area is positioned below the substrate layer of the display area;
a first electrode disposed on the base layer of the display region;
a second electrode disposed on the base layer of the display area, the second electrode being spaced apart from the first electrode;
a first lead layer disposed on the substrate layer, one end of the first lead layer being connected to the first electrode, and the other end of the first lead layer extending to the wiring region;
and the second lead layer is arranged on the basal layer, one end of the second lead layer is connected with the second electrode, the other end of the second lead layer extends to the wiring area, and the second lead layer and the first lead layer are arranged at intervals.
2. The touch module of claim 1, wherein the first electrode comprises a plurality of row arrays, each row array comprising a plurality of first sub-electrodes; the second electrode comprises a plurality of column arrays, each column array comprises a plurality of second sub-electrodes,
one end of the first lead layer is connected to the first electrode, and includes:
the first lead layer comprises a plurality of first leads, and the first sub-electrodes positioned in a first column or a last column in the row array are connected with the first leads in a one-to-one correspondence manner; alternatively, the first and second electrodes may be,
the first sub-electrode positioned in the first column in part of the row arrays is connected with the first lead, and the first sub-electrode positioned in the last column in the rest of the row arrays is connected with the first lead;
one end of the second lead layer is connected to the second electrode, and includes:
the second lead layer comprises a plurality of second leads, the second sub-electrodes positioned in the first row or the last row in the column array are connected with the second leads in a one-to-one correspondence manner, the first row corresponds to a position far away from the bending region, and the last row corresponds to a position close to the bending region; alternatively, the first and second electrodes may be,
the second sub-electrodes positioned in the first row in part of the column arrays are connected with the second lead, and the second sub-electrodes positioned in the last row in the rest of the column arrays are connected with the second lead.
3. The touch module of claim 1, wherein the first electrode comprises a plurality of row arrays, each row array comprising a plurality of first sub-electrodes; the second electrode comprises a plurality of column arrays, each column array comprises a plurality of second sub-electrodes,
one end of the first lead layer is connected to the first electrode, and includes:
the first lead layer comprises a plurality of first leads, and one ends of the first leads are correspondingly connected with the first sub-electrodes positioned in the first column and the last column in the row array;
one end of the second lead layer is connected to the second electrode, and includes:
the second lead layer comprises a plurality of second leads, the second sub-electrodes positioned in the first row or the last row in the column array are connected with the second leads in a one-to-one correspondence manner, the first row corresponds to the position far away from one side of the bending region, and the last row corresponds to the position close to one side of the bending region; alternatively, the first and second electrodes may be,
the second sub-electrodes positioned in the first row in part of the column arrays are connected with the second lead, and the second sub-electrodes positioned in the last row in the rest of the column arrays are connected with the second lead.
4. The touch module of claim 3, further comprising: a first insulating layer covering the base layer, the first electrode, the second electrode, the first lead layer, and a portion of the second lead layer, the first insulating layer having a plurality of first via holes disposed therein, the first via holes exposing an upper surface of a portion of the first electrode; a bridging structure covering the first via hole and at least a portion of the first insulating layer, bridging two adjacent first sub-electrodes in each row; a plurality of second via holes and third via holes are further arranged in the first insulating layer, the second via holes are located outside the bending area and close to one side of the display area, and the third via holes are located outside the bending area and close to one side of the connecting area;
the other end of the second lead layer extends to the wiring region, including:
one end of the second lead layer arranged on the first insulating layer is connected with the second lead layer arranged below the first insulating layer and led out from the second electrode through the second via hole, and the other end of the second lead layer is connected with the second lead layer arranged below the first insulating layer and extending to the connecting area through the third via hole.
5. The touch module of claim 3, further comprising: a first insulating layer covering the base layer, the first electrode and a portion of the second electrode, the first insulating layer having a plurality of first vias disposed therein, the first vias exposing an upper surface of a portion of the first electrode; a bridging structure covering the first via hole and at least a portion of the first insulating layer, bridging two adjacent first sub-electrodes in each row; and a connection terminal portion that covers the second electrode and connects the second electrode with the second lead layer provided on the first insulating layer; a plurality of second via holes are also arranged in the first insulating layer, the second via holes are positioned outside the bending area and close to one side of the connecting area,
the other end of the first lead layer extends to the wiring region, including:
the other end of the first lead layer is connected with the first lead layer which is located on the first insulating layer and extends to the connecting area through the second via hole.
6. The touch module of claim 1, wherein the first electrode comprises a plurality of row arrays, each row array comprising a plurality of first sub-electrodes; the second electrode comprises a plurality of column arrays, each column array comprises a plurality of second sub-electrodes,
one end of the first lead layer is connected to the first electrode, and includes:
the first lead layer comprises a plurality of first leads, and one ends of the first leads are correspondingly connected with the first sub-electrodes positioned in the first column and the last column in the row array;
one end of the second lead layer is connected to the second electrode, and includes:
the second lead layer comprises a plurality of second leads and third leads, one ends of the second leads are in one-to-one corresponding connection with the second sub-electrodes positioned in the last row in the column array, one ends of the third leads are in one-to-one corresponding connection with the second sub-electrodes positioned in the first row in the column array, the first row corresponds to a position far away from one side of the bending region, and the last row corresponds to a position close to one side of the bending region.
7. The touch module of claim 6, further comprising: a first insulating layer covering the base layer, the first electrode, the second electrode, the first lead layer, and a portion of the second lead layer, the first insulating layer having a plurality of first via holes disposed therein, the first via holes exposing an upper surface of a portion of the first electrode; the bridging structure covers the first via hole and at least part of the first insulating layer, bridges two adjacent first sub-electrodes in each row, and is also provided with a plurality of second via holes and third via holes, the second via holes are positioned outside the bending area and close to one side of the display area, and the third via holes are positioned outside the bending area and close to one side of the connecting area;
the other end of the second lead layer extends to the wiring region, including:
one end of the second lead is connected with the second lead, which is arranged below the first insulating layer and is led out by the second electrode, through the second via hole, the other end of the second lead is connected with the second lead, which is arranged below the first insulating layer and extends to the connecting area, through the third via hole, and the other end of the third lead is connected with the second lead, which is arranged below the third via hole.
8. The touch module of claim 6, further comprising: a first insulating layer covering the base layer, the first electrode, the second electrode, the first lead layer, and a portion of the second lead layer, the first insulating layer having a plurality of first via holes disposed therein, the first via holes exposing an upper surface of a portion of the first electrode; a bridging structure covering the first via hole and at least a portion of the first insulating layer, bridging two adjacent first sub-electrodes in each row; the first insulating layer is also provided with a plurality of second via holes, third via holes and fourth via holes, the second via holes are positioned outside the bending area and close to one side of the display area, the third via holes are positioned outside the bending area and close to one side of the connecting area, and the fourth via holes are positioned outside the bending area and close to one side of the connecting area; a fourth lead having one end connected to the second lead positioned above the third via hole and the other end connected to the third lead positioned below the first insulating layer through the fourth via hole,
the other end of the second lead layer extends to the wiring region, including:
set up in on the first insulating layer second lead wire, one end is passed through the second via hole with set up in first insulating layer below and by the second electrode is drawn forth second pin connection, the other end passes through the third via hole with set up in first insulating layer below and extend to connect area the second pin connection, the other end of third lead wire extends to connect area.
9. The touch module of claim 8, wherein the second via, the third via and/or the fourth via are disposed at a predetermined distance from an edge of the bending region of the wiring area.
10. A touch display device, comprising the touch module of any one of claims 1 to 9.
11. A method for manufacturing a touch module comprises the following steps:
providing a substrate layer, wherein the substrate layer comprises a display area and a wiring area positioned on one side of the display area, the wiring area comprises a bending area close to the display area and a connecting area far away from the display area, and the bending area and the connecting area are arranged in a way that the connecting area is positioned below the substrate layer of the display area after the bending area is bent;
forming a first electrode and a second electrode on the base layer, the second electrode being spaced apart from the first electrode;
forming a first lead layer on the base layer, one end of the first lead layer being connected to the first electrode, and the other end of the first lead layer extending to the wiring region;
and forming a second lead layer on the base layer, one end of the second lead layer being connected to the second electrode, and the other end of the second lead layer extending to the wiring line region.
12. The method of claim 11, further comprising: performing a metallizing process on an end portion of the first lead layer and/or an end portion of the second lead layer located in the connection region; alternatively, the first and second electrodes may be,
depositing a conductive layer covering an end of the first lead layer and/or an end of the second lead layer in the connection region.
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