CN116705671A - Chip FT testing device and testing method - Google Patents
Chip FT testing device and testing method Download PDFInfo
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- CN116705671A CN116705671A CN202310983492.XA CN202310983492A CN116705671A CN 116705671 A CN116705671 A CN 116705671A CN 202310983492 A CN202310983492 A CN 202310983492A CN 116705671 A CN116705671 A CN 116705671A
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- 238000012360 testing method Methods 0.000 title claims abstract description 96
- 238000001179 sorption measurement Methods 0.000 claims abstract description 85
- 238000001514 detection method Methods 0.000 claims abstract description 16
- 238000003825 pressing Methods 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 24
- 238000010030 laminating Methods 0.000 claims description 16
- 238000009434 installation Methods 0.000 claims description 12
- 238000006073 displacement reaction Methods 0.000 claims description 9
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 8
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 8
- 241001330002 Bambuseae Species 0.000 claims description 8
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 8
- 239000011425 bamboo Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 2
- 230000029058 respiratory gaseous exchange Effects 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000012546 transfer Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 239000013256 coordination polymer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a chip FT testing device and a testing method, comprising a shell and at least one group of testing tools arranged in the shell, wherein at least one testing tool is arranged in each group of testing tools, each group of testing tools is provided with a conveying component, a plurality of conveying plates are rotated on the conveying component, when the conveying plates are positioned above the testing tools, the conveying plates are horizontal, lifting plates capable of being lifted and adjusted by the conveying plates are arranged in the conveying plates, vacuum cavities are arranged in the lifting plates, a placing groove is formed in the lifting plates, an adsorption component is rotationally connected in the placing groove, and when a mechanical arm places a chip on the adsorption component, the adsorption component is communicated with the vacuum cavities, so that the adsorption component adsorbs the chip; the utility model has the advantage of improving the detection efficiency.
Description
Technical Field
The utility model belongs to the technical field of chip FT testing, and particularly relates to a chip FT testing device and a chip FT testing method.
Background
Chips are a way of miniaturizing circuits (mainly including semiconductor devices, also including passive components, etc.) in electronics and are typically manufactured on a semiconductor wafer surface, and testing of chips is generally classified into CP testing and FT testing; the CP test is a test for the chip in the design stage, and is a test for the semi-finished product of the chip; the FT test is a test for the finished product of the chip by testing the packaging sheet after the integrated circuit chip is packaged into the finished product from the wafer so as to ensure the performance and quality of the finished product.
The utility model patent of China with the bulletin number of CN217385562U discloses a chip calibration machine, which comprises a third frame, a second manipulator, a plurality of shielding boxes, a plurality of first test tools and a second visual positioning assembly, wherein the second manipulator, the second visual positioning assembly and the shielding boxes are all arranged on the third frame, each first test tool is correspondingly arranged in one shielding box, the shielding boxes are used for shielding external interference signals, the shielding boxes are arranged up and down at intervals, the second manipulator is used for grabbing chips and enabling the chips to move between a conveying mechanism and the first test tools, the second visual positioning assembly is used for positioning the chips, and the first test tools are used for testing the chips; when using, snatch the chip from conveying mechanism through the second manipulator, snatch the chip to the circuit board on the first test fixture in the shielding case, then carry out the function calibration detection of chip, after the detection is accomplished, snatch the chip to conveying mechanism through the second manipulator, thereby realize the calibration detection of automatic carrying out the function to the chip, but this technical scheme is when using, because the taking out of chip and putting into all need the second arm snatch, make after the chip detects the completion, the second arm needs put into the detection box with the chip after snatching new chip again, the chip snatchs consuming time longer, influence detection efficiency.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provide a chip FT testing device and a testing method with improved detection efficiency.
The technical scheme of the utility model is as follows:
the chip FT testing device comprises a shell and at least one group of testing tools arranged in the shell, wherein at least one testing tool is arranged in each group of testing tools, each group of testing tools is provided with a conveying assembly, a plurality of conveying plates are rotated on the conveying assembly, when the conveying plates are positioned above the testing tools, the conveying plates are horizontal, lifting plates capable of being adjusted in a lifting manner by the conveying plates are arranged in the conveying plates, vacuum cavities are arranged in the lifting plates, a placing groove is formed in the lifting plates, an adsorption assembly is rotationally connected in the placing groove, and when a mechanical arm places a chip on the adsorption assembly, the adsorption assembly is communicated with the vacuum cavities, so that the adsorption assembly adsorbs the chip;
the shell is provided with a pressing component positioned above the test tool, a rotating component capable of being adjusted in a lifting mode and a blanking component arranged below the test tool, the pressing component can push the lifting plate to move downwards so that the chip is in contact with the test tool, when the pressing component is reset, the lifting plate is provided with a gear connected with the adsorption component, when the gear is in contact with and drives the rotating component or the blanking component, the gear rotates 180 degrees, and when the gear rotates 345-350 degrees, the adsorption component is exhausted so that the adsorption component does not adsorb the chip any more, and when the gear rotates 351-360 degrees, the adsorption component does not exhaust any more;
the adsorption component comprises a rotary block, an upper plate, an exhaust plate and a vacuum adsorption suction nozzle, wherein the rotary block is rotationally connected in the placing groove, the upper plate is arranged above the rotary block, the exhaust plate is arranged on the upper side surface of the upper plate, the vacuum adsorption suction nozzle is arranged on the upper side surface of the exhaust plate, the rotary block is provided with an air suction cavity communicated with the vacuum cavity, a valve body is arranged above the air suction cavity, and the valve body is connected with the rotary block through a gear.
Further, an exhaust cavity is formed in the exhaust plate, the exhaust cavity is communicated with the vacuum adsorption suction nozzle, and the exhaust plate is used for exhausting after the gear rotates for 345-350 degrees;
the upper plate is provided with an air suction through hole communicated with the air discharge cavity, a connecting piece is arranged in the air suction through hole, the connecting piece is connected with a valve core positioned on the valve body, the lower side surface of the upper plate is provided with an air suction cylinder which is inserted on the rotating block in a sealing way, and the upper plate is elastically connected with the rotating block so that the valve core is in sealing contact with the valve core.
Further, the spring hole has been seted up to rotatory piece upside, be provided with the upward shift spring that is connected with the upper plate in the spring hole, the spacing post has been seted up to the upper plate downside, rotatory piece has been seted up and has been supplied spacing post grafting spacing hole, spacing post can not break away from spacing hole.
Further, the inside installation section of thick bamboo that is located the both sides of standing groove towards the gear that is provided with of vacuum chamber, the installation section of thick bamboo rotates and is connected with the drive shaft of being connected with rotatory piece, the gear is connected to the drive shaft other end, the passageway with the chamber intercommunication of breathing in has been seted up to the drive shaft inside, the hole with the passageway intercommunication has been seted up to the radial side of drive shaft, drive shaft side sealing contact has two sealing rings that are located the installation section of thick bamboo, the through-hole with the vacuum chamber intercommunication has been seted up to the installation section of thick bamboo, and the hole with the passageway intercommunication and with the through-hole all be located between two sealing rings.
Further, the side surface of the rotating block connected with the driving shaft is provided with a laminating plate positioned in the placing groove, one of the laminating plates is provided with an L-shaped through hole, one port of the L-shaped through hole faces the exhaust plate, the side surface of the laminating plate facing the exhaust plate is provided with a laminating ring, the laminating ring is communicated with the L-shaped through hole, the side surface of the exhaust plate is provided with an exhaust hole communicated with the exhaust cavity, the side surface of the exhaust plate provided with the exhaust hole is in sealing lamination with the laminating ring, and when the exhaust plate rotates for 345-350 degrees, the exhaust hole is communicated with the L-shaped through hole;
the laminating board is offered and is supplied the hole that the drive shaft passed, the drive shaft side is provided with the friction ring that contacts with the laminating board.
Further, the lifter plate has offered the gear groove that supplies the gear to place, the protruding lifter plate of gear to make the gear can contact with rotating assembly and unloading subassembly, the lifter plate is provided with the jack-up post that is located between two gears in the side.
Further, rotating assembly is including connecting the telescopic link on the casing and connecting the pinion rack on the telescopic link, unloading subassembly includes two sets of lifter and two pinion racks down, the both ends of pinion rack are fixed on two lifter of same group down, the inside a plurality of mounting panels that are provided with of casing, lifter and test fixture are all installed on the mounting panel, be provided with the receiver that is located the mounting panel between two pinion racks down, the placing port that supplies the receiver to pass has been seted up to the casing side.
Further, the conveying assembly comprises two groups of chain wheels and two conveying chains, each group of chain wheels are connected with the corresponding chain wheel respectively, the conveying plate is rotationally connected with the corresponding chain wheels, the shell is fixedly provided with a vacuum suction assembly, the lifting plate is provided with a valve communicated with the vacuum cavity, and the vacuum suction assembly can suck air in the vacuum cavity through the valve.
Further, the conveying plate is provided with two horizontal plates towards the side of the conveying chain, when the conveying plate is located on the upper side and the lower side of the conveying chain, the horizontal plates are in contact with the conveying chain, so that the conveying plate is kept horizontal, a displacement groove is formed in a lifting groove of the conveying plate, a protruding plate located in the displacement groove is arranged on the lifting plate, the protruding plate is connected with a reset spring located in the displacement groove, a guide groove is formed in a groove surface of the lifting groove, and a guide plate connected with the lifting plate is arranged in the guide groove.
The chip FT testing method comprises a chip FT testing device, and further comprises the following steps:
s1, placing a chip on an adsorption assembly positioned above a conveying chain through a mechanical arm, and adsorbing the chip by the adsorption assembly;
s2, the conveying chain drives the chip to move through the adsorption component, when the adsorption component passes through the rotation component, the gear is meshed with the rotation component and drives the adsorption component to rotate 180 degrees, and at the moment, the chip is located below the adsorption component, and the conveying chain continuously drives the chip to move;
s3, when the chip is located above the testing tool, the pressing component pushes the lifting plate to move downwards until the chip contacts with the testing tool, and the testing tool detects the chip;
s4, after detection is completed, resetting the pressing component, resetting the lifting plate, and driving the chip to move continuously by the conveying chain;
s5, two groups of blanking components and two storage boxes are arranged according to actual conditions, corresponding blanking components are controlled to move upwards based on the conditions detected by the test tool, the blanking components are matched with the gears, the adsorption components rotate and exhaust gas, and chips in different conditions on the adsorption components fall into the two storage boxes respectively.
Compared with the prior art, the utility model has the beneficial effects that:
1. the adsorption assembly is used for realizing the adsorption fixation of the chip, so that the chip can be moved conveniently, the adsorption of the adsorption assembly and the chip is ensured by the negative pressure in the vacuum cavity, and the stability of the adsorption is ensured;
2. the utility model adopts the cooperation of the blanking component, the rotating component and the gear to drive the adsorption component to rotate, thereby facilitating the rotation of the chip, and realizing the exhaust of the adsorption component when the adsorption component rotates, thereby facilitating the blanking of the adsorption component and the detection of the chip.
In summary, the utility model has the advantage of improving the detection efficiency.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a front view of FIG. 1 in accordance with the present utility model;
FIG. 3 is a schematic view of the transport assembly of FIG. 1 according to the present utility model;
FIG. 4 is a schematic view of the transfer plate portion of FIG. 3 in accordance with the present utility model;
FIG. 5 is a schematic view of the front cross-sectional structure of FIG. 4 according to the present utility model;
FIG. 6 is an enlarged schematic view of the portion A of FIG. 5 according to the present utility model;
FIG. 7 is a schematic top view of the cross-sectional structure of FIG. 4 in accordance with the present utility model;
FIG. 8 is an enlarged schematic view of the portion B of FIG. 7 according to the present utility model;
fig. 9 is a schematic structural view of the blanking assembly of fig. 1 according to the present utility model.
In the figure, 1, a vacuum suction component, 2, a conveying plate, 201, a horizontal plate, 202, a lifting groove, 203, a return spring, 204, a sealing ring, 205, a through hole, 206, a mounting cylinder, 3, a mounting plate, 4, a storage box, 5, a test fixture, 6, a blanking component, 61, a lower toothed plate, 62, a lifting rod, 7, a conveying component, 8, a pressing component, 9, a shielding cover, 10, a rotating component, 11, a shell, 12, a lifting plate, 121, a guide plate, 122, a bonding plate, 123, a jacking column, 124, a gear, 125, a vacuum cavity, 126, a bonding ring, 127, an L-shaped through hole, 128, a friction ring, 13, an adsorption component, 131, a vacuum adsorption nozzle, 132, a suction cylinder, 133, an upward movement spring, 134, a suction cavity, 135, a limit column, 136, a valve body, 137, a valve core, 138, a connecting piece, 139, an upper plate, 130, a driving shaft, 1311, a rotating block, 1312, a channel, 1313, a vent plate, 14 and a placing port.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
As shown in fig. 1-9, a chip FT testing device includes a casing 11, at least one set of testing tools 5 disposed in the casing 11, at least one set of testing tools 5 in each set of testing tools 5, in this embodiment, two sets of testing tools 5, each set of testing tools 5 is three, each set of testing tools 5 is provided with a conveying component 7, the two conveying components 7 are connected through a connecting frame, the conveying components 7 are rotated with a plurality of conveying plates 2, when the conveying plates 2 are located above the testing tools 5, the conveying plates 2 are horizontal, a lifting plate 12 capable of lifting and adjusting on the conveying plates 2 is disposed in the conveying plates 2, a vacuum cavity 125 is disposed in the lifting plate 12, a placing groove is disposed in the lifting plate 12, an adsorbing component 13 is rotationally connected in the placing groove, and when a mechanical arm places a chip on the adsorbing component 13, the adsorbing component 13 is communicated with the vacuum cavity 125, so that the adsorbing component 13 adsorbs the chip.
The shell 11 is provided with a pressing component 8 positioned above the test tool 5, three lifting-adjustable rotating components 10 and a blanking component 6 arranged below the test tool 5, the pressing component 8 can push the lifting plate 12 to move downwards so as to enable chips to contact the test tool 5, when the pressing component 8 is reset, the lifting plate 12 is provided with a gear 124 connected with the adsorption component 13, when the gear 124 is in contact with and drive with the rotating component 10 or the blanking component 6, the gear 124 rotates 180 degrees, and when the gear 124 rotates 345-350 degrees, the adsorption component 13 is exhausted so as to enable the adsorption component 13 not to adsorb the chips any more, and when the gear 124 rotates 351-360 degrees, the adsorption component 13 is not exhausted any more;
when the chip is placed on the adsorption component 13 by the mechanical arm, the adsorption component 13 is pressed down, at this time, the adsorption component 13 adsorbs the chip, then the conveying component 7 drives the chip to move through the conveying plate 2, the lifting plate 12 and the adsorption component 13, when the gears 124 on the three lifting plates 12 move to the right sides of the corresponding three rotating components 10, the rotating components 10 move down, at this time, the gears 124 are meshed with the rotating components 10 to rotate 180 degrees, so that the chip is downward, then the rotating components 10 move up and reset, the conveying component 7 drives the chip to move above the testing tool 5, at this time, the pressing component 8 presses down the chip through the lifting plate 12, so that the chip is contacted with the testing tool 5, the testing tool 5 detects the chip, and the working condition of the chip is obtained;
and then the pressing component 8 is reset, the conveying component 7 drives the other three chips to move to the upper parts of the corresponding test tools 5, and the detected chips are subjected to blanking when passing through the blanking component 6.
In this embodiment, as shown in fig. 4, 5 and 6, the adsorption assembly 13 includes a rotating block 1311 rotatably connected in the placement groove, an upper plate 139 located above the rotating block 1311, an exhaust plate 1313 fixed on the upper side surface of the upper plate 139, and a vacuum adsorption nozzle 131 fixed on the upper side surface of the exhaust plate 1313, the rotating block 1311 is provided with an air suction cavity 134 communicating with the vacuum cavity 125, a valve body 136 located on the rotating block 1311 is provided above the air suction cavity 134, and the gear 124 is connected with the rotating block 1311;
an exhaust cavity is formed in the exhaust plate 1313, the exhaust cavity is communicated with the vacuum adsorption suction nozzle 131, and the exhaust plate 1313 exhausts after the gear 124 rotates for 345-350 degrees;
the upper plate 139 is provided with an air suction through hole 205 communicated with the air discharge cavity, a connecting piece 138 is arranged in the air suction through hole 205, the connecting piece 138 is connected with a valve core 137 positioned in the valve body 136, the connecting piece 138 comprises a pore plate fixed in the air suction through hole 205 and a connecting rod fixed on the pore plate, the connecting rod is connected with the valve core 137, the air suction cylinder 132 is integrally formed on the lower side surface of the upper plate 139, a rotary block 1311 is provided with a ring groove for the air suction cylinder 132 to be inserted, the side surface of the ring groove is provided with a sealing ring 204 in sealing contact with the air suction cylinder 132, and the upper plate 139 is elastically connected with the rotary block 1311, so that the valve core 137 is in sealing contact with the valve core 137;
when the mechanical arm places the chip on the vacuum adsorption nozzle 131, the mechanical arm pushes the upper plate 139 to move downwards through the vacuum adsorption nozzle 131 and the exhaust plate 1313, at the moment, the upper plate 139 drives the valve core 137 to move downwards through the pore plate and the connecting rod, the valve core 137 is not contacted with the valve body 136 any more, negative pressure in the vacuum cavity 125 is sucked through the suction cavity 134, the valve body 136, the suction cylinder 132, the exhaust cavity and the vacuum adsorption nozzle 131, the vacuum adsorption nozzle 131 adsorbs the chip, after the mechanical arm is removed, the upper plate 139 moves upwards elastically, the valve core 137 moves upwards to be abutted on the valve body 136, and the vacuum cavity 125 cannot be sucked through the suction cavity 134;
when the gear 124 is meshed with the rotating assembly 10 and the blanking assembly 6, the gear 124 drives the chip to rotate through the rotating block 1311, the upper plate 139, the exhaust plate 1313 and the vacuum adsorption suction nozzle 131, so that the chip can be conveniently detected downwards in a rotating way, when the rotating block 1311 rotates 345-350 DEG through the blanking assembly 6, an exhaust cavity of the exhaust plate 1313 is communicated with the outside air, at the moment, the vacuum adsorption suction nozzle 131 enters the air, the vacuum adsorption suction nozzle 131 does not adsorb the chip any more, and the chip falls;
when the rotating block 1311 rotates to 351 ° -360 °, the exhaust plate 1313 is not connected with external air, and when the vacuum suction nozzle 131 needs to adsorb the chip again, the exhaust plate 1313 is in a closed state, so as to ensure the adsorption of the chip.
In this embodiment, as shown in fig. 6, a spring hole is formed on the upper side of the rotating block 1311, an up-moving spring 133 connected to the upper plate 139 is disposed in the spring hole, a limit post 135 is formed on the lower side of the upper plate 139, a limit hole for inserting the limit post 135 is formed in the rotating block 1311, the limit post 135 cannot be separated from the limit hole, a sliding groove is disposed on the limit hole and the limit post 135 in order to prevent the limit post 135 from separating from the limit hole, and a ball is disposed in the sliding groove so that the limit post 135 cannot be separated from the limit hole;
when the mechanical arm presses the upper plate 139, the upper plate 139 presses the upward moving spring 133, at this time, the plug post moves downward, and when the mechanical arm no longer presses the upper plate 139, the upward moving spring 133 pushes the upper plate 139 to move upward for resetting, so that the use is ensured.
In this embodiment, as shown in fig. 7 and 8, an installation cylinder 206 located at two sides of the placing groove facing the gear 124 is integrally formed inside the vacuum cavity 125, the installation cylinder 206 is connected with a driving shaft 130 through a bearing, the driving shaft 130 is connected with a rotating block 1311, the other end of the driving shaft 130 is connected with the gear 124 through a key, a channel 1312 communicated with the air suction cavity 134 is formed inside the driving shaft 130, a hole communicated with the channel 1312 is formed on the radial side surface of the driving shaft 130, two sealing rings 204 are in sealing contact with the side surface of the driving shaft 130 through a sealing ring, the sealing rings 204 are glued on the installation cylinder 206, a through hole 205 communicated with the vacuum cavity 125 is formed on the installation cylinder 206, and the hole communicated with the channel 1312 and the through hole 205 are located between the two sealing rings 204;
in use, the gear 124 drives the rotating block 1311 to rotate through the driving shaft 130, and in the process of rotating the driving shaft 130, the vacuum cavity 125 and the suction cavity 134 are kept in a communication state in the process of rotating the driving shaft 130 through the channel 1312, the hole communicated with the channel 1312, the through hole 205 and the two sealing rings 204 on the driving shaft 130, and when the vacuum suction nozzle 131 needs to suck chips, the vacuum cavity 125 sucks the gas in the suction cavity 134 through the through hole 205, the space between the two sealing rings 204, the hole communicated with the channel 1312 and the channel 1312, so that the vacuum suction nozzle 131 is ensured to suck the chips.
In this embodiment, as shown in fig. 4, 5 and 6, the side surface of the rotating block 1311 connected with the driving shaft 130 is provided with an attaching plate 122, the attaching plate 122 is fixed in the placing groove, one of the attaching plates 122 is provided with an L-shaped through hole 127, one port of the L-shaped through hole 127 faces the air exhausting plate 1313, the attaching plate 122 is glued with an attaching ring 126 facing the side surface of the air exhausting plate 1313, the attaching ring 126 is communicated with the L-shaped through hole 127, the side surface of the air exhausting plate 1313 is provided with an air exhausting hole communicated with the air exhausting cavity, the side surface of the air exhausting plate 1313 provided with the air exhausting hole is in sealing attachment with the attaching ring 126, and when the air exhausting plate 1313 rotates 345 ° -350 °, the air exhausting hole is communicated with the L-shaped through hole 127;
the pasting plate 122 is provided with a hole for the driving shaft 130 to pass through, and the side surface of the driving shaft 130 is provided with a friction ring 128 contacted with the pasting plate 122;
when the exhaust plate 1313 rotates 345-350 degrees, the exhaust hole is gradually communicated with the L-shaped through hole 127, external air enters the exhaust cavity through the L-shaped through hole 127 and the exhaust hole, negative pressure is not generated in the exhaust cavity, the vacuum adsorption suction nozzle 131 does not adsorb chips any more, when the exhaust plate 1313 rotates more than 345-350 degrees, the exhaust hole is not communicated with the L-shaped through hole 127 any more, when the chips are attached to the vacuum adsorption suction nozzle 131, the exhaust cavity is in a closed state, and at the moment, the air suction cavity 134 can suck air in the exhaust cavity, so that negative pressure is formed in the exhaust cavity, and the vacuum adsorption suction nozzle 131 adsorbs the chips.
In this embodiment, the lifting plate 12 is provided with a gear 124 groove in which the gear 124 is placed, the gear 124 protrudes out of the lifting plate 12, so that the gear 124 can contact with the rotating assembly 10 and the blanking assembly 6, and a jack-post 123 located between the two gears 124 is provided on the upper side of the lifting plate 12;
the gear 124 protrudes out of the lifting plate 12 to ensure that the gear 124 can be meshed with the blanking assembly 6 and the rotating assembly 10, so that the rotation of the rotating block 1311 and the blanking of chips are ensured, and when the pressing assembly 8 is pressed down, the contact with the pressing assembly 8 is realized through the jacking column 123, so that the downward movement of the lifting plate 12 is ensured.
In this embodiment, the rotating assembly 10 includes a telescopic rod connected to the housing 11 and an upper toothed plate connected to the telescopic rod, the blanking assembly 6 includes two sets of lifting rods 62 and two lower toothed plates 61, two ends of the lower toothed plates 61 are fixed on two lifting rods 62 of the same set, a plurality of mounting plates 3 are fixed inside the housing 11 through bolts, the lifting rods 62 and the test tools 5 are all mounted on the mounting plates 3, a storage box 4 placed on the mounting plates 3 is arranged between the two lower toothed plates 61, a placement opening 14 for the storage box 4 to pass through is formed in the side surface of the housing 11, and the lifting rods 62 and the telescopic rod can be air cylinders, pneumatic cylinders or electric telescopic rods;
when the rotary block 1311 needs to be rotated, the telescopic rod pushes the upper toothed plate to move downwards, so that the engagement of the upper toothed plate and the gear 124 is ensured, and after the rotary block 1311 is driven, the telescopic rod is reset, the upper toothed plate is prevented from driving the rotary block 1311 corresponding to the same batch of detection chips, and when the blanking is needed, the lifting rod 62 corresponding to the holes according to the condition of chip detection works, so that the chips which are qualified in detection and the chips which are unqualified in detection are respectively placed in different storage boxes 4, and when the chips in the storage boxes 4 are too many, the storage boxes 4 can be replaced through the placement opening 14.
In this embodiment, the conveying assembly 7 includes two groups of sprockets and two conveying chains, each group of sprockets is connected and the conveying chains are respectively connected to the sprockets, the conveying plate 2 is rotatably connected to the two conveying chains, the vacuum suction assembly 1 is fixed on the shell 11, the lifting plate 12 is provided with a valve mouth communicated with the vacuum cavity 125, the vacuum suction assembly 1 can suck air in the vacuum cavity 125 through the valve mouth, the vacuum suction assembly 1 includes a valve mouth joint, an adjusting rod and a fixing plate, the valve mouth joint is communicated with a vacuum tank through a pipeline, the vacuum tank is communicated with a vacuum pump through a pipeline, the fixing plate is fixed on the shell 11, the adjusting rod can adopt an air cylinder, an air cylinder or an electric telescopic rod, the adjusting rod is fixed on the fixing plate, and the valve mouth joint is fixed on the adjusting rod;
when the chip is detected, the valve of the lifting plate 12 is positioned above the valve connector, the adjusting rod moves upwards to push the valve connector to be inserted into the valve, and then the vacuum tank extracts air from the vacuum cavity 125 through the valve, so that the suction force generated by the negative pressure in the vacuum cavity 125 can enable the vacuum suction nozzle 131 to adsorb the chip;
preferably, each time the sprocket drives the transfer plate 2 to move, the transfer plate 2 moves a distance equal to the length of the adjacent transfer plate 2 side so that the vacuum suction assembly 1 can draw air out of each vacuum chamber 125.
In this embodiment, two horizontal plates 201 are fixed on the side of the conveying plate 2 facing the conveying chain, when the conveying plate 2 is located on the upper side and the lower side of the conveying chain, the horizontal plates 201 are in contact with the conveying chain, so that the conveying plate 2 keeps horizontal, a displacement groove is formed in a lifting groove 202 of the conveying plate 2, a protruding plate located in the displacement groove is fixed on a lifting plate 12, the protruding plate is connected with a reset spring 203 located in the displacement groove, a guide groove is formed on the groove surface of the lifting groove 202, and a guide plate 121 connected with the lifting plate 12 is integrally formed in the guide groove;
when the conveying plate 2 is moved to the upper and lower sides of the conveying chain by the conveying chain, the conveying chain is in contact with the horizontal plate 201, the conveying plate 2 is in a horizontal state at this time, then the pressing component 8 pushes the lifting plate 12 to move downwards, the reset spring 203 is pressed at this time, the chip is detected through the test tool 5, and when the pressing component 8 is reset, the reset spring 203 pushes the lifting plate 12 to reset, and when the lifting plate 12 moves, the vertical lifting of the lifting plate 12 is ensured by the guide plate 121 and the guide groove.
Preferably, a shielding cover 9 fixed on the mounting plate 3 is arranged in the shell 11, the test fixture 5, the pressing component 8 and the rotating component 10 are all arranged in the shielding cover 9, and openings for the conveying chain and the conveying plate 2 to pass through are formed in the left side surface and the right side surface of the shielding cover 9;
the pressing component 8 comprises a pressing telescopic rod and a pressing plate, the pressing telescopic rod is specifically an air cylinder, a pneumatic cylinder or an electric telescopic rod, the pressing plate is fixed on the pressing telescopic rod, and the pressing telescopic rod is fixed on the shielding cover 9.
Example 2
The chip FT testing method comprises a chip FT testing device, and further comprises the following steps:
s1, placing a chip on an adsorption assembly 13 positioned above a conveying chain through a mechanical arm, and adsorbing the chip by the adsorption assembly 13;
s2, a conveying chain drives the chip to move through the adsorption component 13, when the adsorption component 13 passes through the rotary component 10, the gear 124 is meshed with the rotary component 10 and drives the adsorption component 13 to rotate 180 degrees, and at the moment, the chip is positioned below the adsorption component 13, and the conveying chain continuously drives the chip to move;
s3, when the chip is located above the test tool 5, the pressing component 8 pushes the lifting plate 12 to move downwards until the chip contacts with the test tool 5, and the test tool 5 detects the chip;
s4, after detection is completed, resetting the pressing component 8, resetting the lifting plate 12, and driving the chip to move continuously by the conveying chain;
s5, two groups of blanking components and two storage boxes are arranged according to actual conditions, corresponding blanking components are controlled to move upwards based on the conditions detected by the test tool, the blanking components are matched with the gears, the adsorption components rotate and exhaust gas, and chips in different conditions on the adsorption components fall into the two storage boxes respectively.
Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.
Claims (10)
1. The utility model provides a chip FT testing arrangement, includes the casing, sets up at least a set of test fixture in the casing, and the test fixture in every group test fixture is at least one, its characterized in that: each group of test tools is provided with a conveying assembly, a plurality of conveying plates are rotated on the conveying assemblies, wherein when the conveying plates are positioned above the test tools, the conveying plates are horizontal, lifting plates capable of being adjusted in lifting mode of the conveying plates are arranged in the conveying plates, vacuum cavities are arranged in the lifting plates, placing grooves are formed in the lifting plates, an adsorption assembly is rotationally connected in the placing grooves, and when a chip is placed on the adsorption assembly by a mechanical arm, the adsorption assembly is communicated with the vacuum cavities, so that the adsorption assembly adsorbs the chip;
the shell is provided with a pressing component positioned above the test tool, a rotating component capable of being adjusted in a lifting mode and a blanking component arranged below the test tool, the pressing component can push the lifting plate to move downwards so that the chip is in contact with the test tool, when the pressing component is reset, the lifting plate is provided with a gear connected with the adsorption component, when the gear is in contact with and drives the rotating component or the blanking component, the gear rotates 180 degrees, and when the gear rotates 345-350 degrees, the adsorption component is exhausted so that the adsorption component does not adsorb the chip any more, and when the gear rotates 351-360 degrees, the adsorption component does not exhaust any more;
the adsorption component comprises a rotary block, an upper plate, an exhaust plate and a vacuum adsorption suction nozzle, wherein the rotary block is rotationally connected in the placing groove, the upper plate is arranged above the rotary block, the exhaust plate is arranged on the upper side surface of the upper plate, the vacuum adsorption suction nozzle is arranged on the upper side surface of the exhaust plate, the rotary block is provided with an air suction cavity communicated with the vacuum cavity, a valve body is arranged above the air suction cavity, and the valve body is connected with the rotary block through a gear.
2. The chip FT testing apparatus of claim 1 wherein: an exhaust cavity is formed in the exhaust plate, the exhaust cavity is communicated with the vacuum adsorption suction nozzle, and the exhaust plate is used for exhausting after the gear rotates for 345-350 degrees;
the upper plate is provided with an air suction through hole communicated with the air discharge cavity, a connecting piece is arranged in the air suction through hole, the connecting piece is connected with a valve core positioned on the valve body, the lower side surface of the upper plate is provided with an air suction cylinder which is inserted on the rotating block in a sealing way, and the upper plate is elastically connected with the rotating block so that the valve core is in sealing contact with the valve core.
3. A chip FT testing apparatus as claimed in claim 2, characterized in that: the spring hole has been seted up to rotatory piece upside, be provided with the upward shift spring that is connected with the upper plate in the spring hole, the spacing post has been seted up to the upper plate downside, rotatory piece has been seted up and has been supplied spacing post grafting spacing hole, spacing post can not break away from spacing hole.
4. A chip FT testing apparatus according to claim 3, characterized in that: the vacuum chamber is inside to be provided with the installation section of thick bamboo that is located the both sides of standing groove towards the gear, the installation section of thick bamboo rotates and is connected with the drive shaft of being connected with rotatory piece, the gear is connected to the drive shaft other end, the passageway with the chamber intercommunication of breathing in has been seted up to the drive shaft inside, the hole with the passageway intercommunication has been seted up to the radial side of drive shaft, drive shaft side sealing contact has two sealing rings that are located the installation section of thick bamboo, the through-hole with the vacuum chamber intercommunication has been seted up to the installation section of thick bamboo, and the hole with the passageway intercommunication and with the through-hole all be located between two sealing rings.
5. The chip FT testing apparatus of claim 4 wherein: the side face of the rotating block, which is connected with the driving shaft, is provided with a laminating plate positioned in the placing groove, one of the laminating plates is provided with an L-shaped through hole, one port of the L-shaped through hole faces the exhaust plate, the side face of the laminating plate, which faces the exhaust plate, is provided with a laminating ring, the laminating ring is communicated with the L-shaped through hole, the side face of the exhaust plate is provided with an exhaust hole communicated with the exhaust cavity, the side face of the exhaust plate, which is provided with the exhaust hole, is in sealing lamination with the laminating ring, and when the exhaust plate rotates for 345-350 degrees, the exhaust hole is communicated with the L-shaped through hole;
the laminating board is offered and is supplied the hole that the drive shaft passed, the drive shaft side is provided with the friction ring that contacts with the laminating board.
6. The chip FT testing apparatus of claim 5 wherein: the lifting plate is provided with a gear groove for placing gears, the gears protrude out of the lifting plate so that the gears can be in contact with the rotating assembly and the blanking assembly, and a jacking column positioned between the two gears is arranged on the upper side surface of the lifting plate.
7. The chip FT testing apparatus of claim 6 wherein: the rotary component comprises a telescopic rod connected to the shell and an upper toothed plate connected to the telescopic rod, the blanking component comprises two groups of lifting rods and two lower toothed plates, two ends of each lower toothed plate are fixed to the two lifting rods of the same group, a plurality of mounting plates are arranged inside the shell, the lifting rods and the test fixture are all mounted on the mounting plates, a storage box located on the mounting plates is arranged between the two lower toothed plates, and a placement opening for the storage box to pass through is formed in the side face of the shell.
8. The chip FT testing apparatus of claim 7 wherein: the conveying assembly comprises two groups of chain wheels and two conveying chains, each group of chain wheels are connected with the corresponding chain wheel respectively, the conveying plate is rotationally connected to the corresponding chain wheels, the vacuum suction assembly is fixed on the shell, the lifting plate is provided with a valve communicated with the vacuum cavity, and the vacuum suction assembly can suck air in the vacuum cavity through the valve.
9. The chip FT testing apparatus of claim 8 wherein: the conveying plate is provided with two horizontal plates towards the side face of the conveying chain, when the conveying plate is located on the upper side and the lower side of the conveying chain, the horizontal plates are in contact with the conveying chain, so that the conveying plate is kept horizontal, a displacement groove is formed in a lifting groove of the conveying plate, a convex plate located in the displacement groove is arranged on the lifting plate, the convex plate is connected with a reset spring located in the displacement groove, a guide groove is formed in the groove face of the lifting groove, and a guide plate connected with the lifting plate is arranged in the guide groove.
10. The chip FT testing method comprises a chip FT testing device and is characterized in that: the method also comprises the following steps:
s1, placing a chip on an adsorption assembly positioned above a conveying chain through a mechanical arm, and adsorbing the chip by the adsorption assembly;
s2, the conveying chain drives the chip to move through the adsorption component, when the adsorption component passes through the rotation component, the gear is meshed with the rotation component and drives the adsorption component to rotate 180 degrees, and at the moment, the chip is located below the adsorption component, and the conveying chain continuously drives the chip to move;
s3, when the chip is located above the testing tool, the pressing component pushes the lifting plate to move downwards until the chip contacts with the testing tool, and the testing tool detects the chip;
s4, after detection is completed, resetting the pressing component, resetting the lifting plate, and driving the chip to move continuously by the conveying chain;
s5, two groups of blanking components and two storage boxes are arranged according to actual conditions, corresponding blanking components are controlled to move upwards based on the conditions detected by the test tool, the blanking components are matched with the gears, the adsorption components rotate and exhaust gas, and chips in different conditions on the adsorption components fall into the two storage boxes respectively.
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| CN116705671B (en) | 2023-10-13 |
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