CN116705659A - Preheating equipment of chip mounter - Google Patents
Preheating equipment of chip mounter Download PDFInfo
- Publication number
- CN116705659A CN116705659A CN202310708822.4A CN202310708822A CN116705659A CN 116705659 A CN116705659 A CN 116705659A CN 202310708822 A CN202310708822 A CN 202310708822A CN 116705659 A CN116705659 A CN 116705659A
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- feeding
- chip mounter
- feeding roller
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 claims abstract description 65
- 238000004140 cleaning Methods 0.000 claims abstract description 44
- 238000010438 heat treatment Methods 0.000 claims description 51
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000012535 impurity Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 7
- 239000011538 cleaning material Substances 0.000 abstract 1
- 239000000428 dust Substances 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cleaning In General (AREA)
Abstract
The invention discloses preheating equipment of a chip mounter, which comprises a supporting table and a supporting frame, wherein the supporting table is arranged at the top of the supporting frame and is fixedly connected with the top of the supporting frame, and the preheating equipment also comprises a supporting table; the feeding device is arranged above the supporting table, two sides of the feeding device are fixedly connected with feeding brackets, the bottoms of the feeding brackets are fixedly connected with the tops of the supporting table, and the feeding device is used for conveying materials; the cleaning device is arranged on one side of the feeding device above the supporting table, the two sides of the cleaning device are fixedly connected with cleaning supports, the bottoms of the cleaning supports are fixedly connected with the tops of the supporting table, and the cleaning device is used for cleaning materials entering the feeding device and improving the quality of patches. This chip mounter's preheating equipment conveniently clears up material surface to avoid the impurity on material surface to influence the fastening effect of paster.
Description
Technical Field
The invention relates to the technical field of surface mounting, in particular to preheating equipment of a surface mounting machine.
Background
In recent years, with the rapid development of electronic technology, the electronic market demand represented by portable consumer products has been expanding, the demand for further high-density mounting technology in semiconductor packages has been increasing, QFN packages are a leadless packaging technology for surface mounting, the product packaged by QFN has the characteristics of small size, light weight and suitability for portable application, and the packaged structure has excellent electrical performance and thermal performance, so that the QFN package can meet the requirements of miniaturization, thinning and multifunctionality of IT equipment, therefore, QFN packages are widely adopted in packages of a small pin type, lead frames are used as chip carriers of integrated circuits, are key structural members for realizing electrical connection of the circuit outlets inside chips and external leads by means of bonding materials (gold wires, aluminum wires and copper wires), and have the function of bridging with external leads, and lead frames are required to be used in most of semiconductor integrated blocks, and are important basic materials in the electronic information industry.
However, at present, the lead frame is easy to warp in the process of pasting the patch, so that the patch is offset, and the fastening effect of the patch is poor if impurities exist on the lead frame before pasting the patch.
Disclosure of Invention
In order to achieve the above purpose, the invention is realized by the following technical scheme: the preheating equipment of the chip mounter comprises a supporting table and a supporting frame, wherein the supporting table is arranged at the top of the supporting frame and is fixedly connected with the top of the supporting frame, and the preheating equipment also comprises;
the feeding device is arranged above the supporting table, two sides of the feeding device are fixedly connected with feeding brackets, the bottoms of the feeding brackets are fixedly connected with the tops of the supporting table, and the feeding device is used for conveying materials;
cleaning device, this cleaning device sets up the part in supporting bench top one side of material feeding unit, the equal fixedly connected with clearance support in cleaning device both sides, clearance support bottom and supporting bench top fixed connection, cleaning device is used for clearing up the inside material of entering material feeding unit, conveniently clears up the material surface to avoid the impurity on material surface to influence the fastening effect of paster, improve the paster quality.
Preferably, the feeding device comprises a fixed frame, the fixed frame inner wall rotates and is connected with the feed roll, the feed roll both ends all run through the fixed frame and rotate with the fixed frame and be connected, feed roll one end fixedly connected with drive sprocket, the cover is established and the meshing has the transmission toothed chain on the drive sprocket, transmission toothed chain side and feed roll fixed connection, one side fixedly connected with driving motor of feed roll is kept away from to the drive sprocket, the inside heating cavity that begins of feed roll, the inside fixedly connected with heating device of heating cavity, conveniently accomplish autoloading, still can flatten the material through the feed roll that crisscross setting from top to bottom to avoid the paster that the warpage leads to take place the skew condition, make the paster effect better.
Preferably, the feeding rollers are provided with a plurality of groups and are distributed in the fixing frame in an up-down staggered mode, and the distance between the upper feeding rollers and the lower feeding rollers is the same as the thickness of the material.
Preferably, the outer side of the fixing frame is fixedly connected with the feeding bracket, and the driving motor is fixed on the side surface of the fixing frame through the connecting bracket.
Preferably, the heating device comprises a fixed sleeve, fixed sleeve inner wall is through at link fixedly connected with heating member, heating member side fixedly connected with conducting strip, the one end that the heating member was kept away from to the conducting strip runs through fixed sleeve and with fixed sleeve fixed connection, the conducting strip is located the outside one end rotation of fixed sleeve and is connected with the rotor plate, the one end fixedly connected with arc heat-conducting plate that the conducting strip was kept away from to the rotor plate, rotor plate side fixedly connected with arc spring, fixed sleeve one side fixedly connected with dead lever for the arc heat-conducting plate can carry out even heating to the feeding roller, avoids the material that leads to with the heating body is high in temperature and is heated uneven condition, still is provided with rotor plate and arc spring simultaneously, makes the rotor plate can drive the arc heat-conducting plate and hugs closely on the heating cavity inner wall, through the conduction heat of contact, and conduction efficiency is higher.
Preferably, the fixed sleeve is arranged in the heating cavity and fixedly connected with the inner wall of the heating cavity through the rotating support, one end of the arc-shaped spring, which is far away from the rotating plate, is fixedly connected with the heat conducting fin, one side of the arc-shaped heat conducting plate, which is far away from the rotating plate, is stuck to the inner wall of the heating cavity, and the rotating plate is made of heat conducting metal.
Preferably, one end of the fixing rod penetrates through the heating cavity and extends to the outside of the feeding roller, and one end of the fixing rod located at the outside of the feeding roller is fixedly connected with the fixing frame.
Preferably, the cleaning device comprises a positioning support, the support roller is connected with all rotations in positioning support inner wall top and bottom, the equal fixedly connected with brush headstock in positioning support both sides, the wind hole has been seted up on the brush headstock, the fretwork board has been seted up to wind hole inner wall bottom, fretwork board bottom fixedly connected with brush head, the wind hole top has the cleaning fan through the tuber pipe intercommunication, the cleaning fan passes through link and positioning support fixed connection, conveniently clears up the material surface, and the wind of cleaning fan can also clear up the brush head simultaneously, can also avoid the brush head to adhere more impurity and lead to unable condition with material surface clean up in time when in time blowing away dust impurity.
Preferably, the locating support is arranged on the supporting table and fixedly connected with the supporting table, the brush head is an electric brush head, and the brush heads are provided with a plurality of groups and are uniformly distributed at the bottom of the hollowed-out plate.
The invention provides preheating equipment of a chip mounter. The beneficial effects are as follows:
1. this chip mounter's preheating equipment, at first send into cleaning device inside with the material during the use, clear up the material through cleaning device, get rid of the impurity that drops easily on the material surface, inside the material entering material feeding unit of cleaning device clearance, send into chip mounter through material feeding unit and carry out the paster operation, conveniently clear up the material surface to avoid the impurity on material surface to influence the fastening effect of paster, improve the paster quality.
2. This chip mounter's preheating equipment is provided with material feeding unit, and the material after the cleaning device clearance gets into inside the mount from mount one end, drives the feed roll through drive sprocket and transmission toothed chain and rotates simultaneously, and the material is in the rotation drive material that extrudes between the upper and lower feed roll, and the material is advanced through the feed roll, conveniently accomplishes autoloading, and the while can also be through the feed roll that crisscross sets up from top to bottom to the material is leveled to avoid the paster that the warpage leads to take place the skew condition, make the paster effect better.
3. This chip mounter's preheating equipment is provided with heating device, when the material is through between the upper and lower feed roll, heat on the heating member passes through the conducting strip and transmits to on rotating plate and the arc heat-conducting plate, pass through the arc heat-conducting plate and transmit to the feed roll, thereby heat the material through the feed roll, thereby make the material soften and can flatten more easily through heating the material, take place relative slip between feed roll and the arc heat-conducting plate when rotating, make the arc heat-conducting plate can carry out even heating to the feed roll, avoid the material that leads to with the part temperature that the heat-generating body is close to is heated unevenly the condition, still be provided with rotating plate and arc spring simultaneously, make the rotating plate can drive the arc heat-conducting plate and hug closely on the heating cavity inner wall, through contact conduction heat, conduction efficiency is higher.
4. This chip mounter's preheating equipment is provided with cleaning device, and the material passes between the inside backing roll of clearance support during the use, passes the clearance support and clear up the material surface through the brush head, passes the fretwork board through the wind that the clearance fan blew off simultaneously, conveniently clears up the material surface with the dust that the brush head was cleared up off, and the wind of clearance fan can also clear up the brush head simultaneously, can also avoid the brush head to adhere more impurity and lead to unable condition with material surface clean up in time with dust impurity.
Drawings
Fig. 1 is a schematic diagram of a preheating device of a chip mounter according to the present invention;
FIG. 2 is a schematic diagram of a feeding device according to the present invention;
FIG. 3 is a schematic side view of a feeding device according to the present invention;
FIG. 4 is a schematic view of the internal structure of the feed roller of the present invention;
FIG. 5 is a schematic view of the installation structure of the heating device of the present invention;
FIG. 6 is a schematic view of a heating device according to the present invention;
FIG. 7 is a schematic view of a cleaning apparatus according to the present invention;
FIG. 8 is a schematic view of the internal structure of the cleaning device of the present invention.
In the figure: 1. a support table; 2. a support frame; 3. a feeding device; 31. a fixing frame; 32. a feed roller; 33. a drive sprocket; 34. a drive toothed chain; 35. a driving motor; 36. heating the cavity; 37. a heating device; 371. a fixed sleeve; 372. a heating body; 373. a heat conductive sheet; 374. a rotating plate; 375. an arc-shaped heat conducting plate; 376. an arc spring; 377. a fixed rod; 4. a feeding bracket; 5. a cleaning device; 51. a positioning bracket; 52. a support roller; 53. a brush head seat; 54. a wind hole; 55. a hollowed-out plate; 56. a brush head; 57. cleaning a fan; 6. and (5) cleaning the bracket.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the present invention provides a technical solution: the preheating equipment of the chip mounter comprises a supporting table 1 and a supporting frame 2, wherein the supporting table 1 is arranged at the top of the supporting frame 2 and is fixedly connected with the top of the supporting frame 2, and the preheating equipment also comprises;
the feeding device 3 is arranged above the supporting table 1, both sides of the feeding device 3 are fixedly connected with feeding brackets 4, the bottoms of the feeding brackets 4 are fixedly connected with the top of the supporting table 1, and the feeding device 3 is used for conveying materials;
the cleaning device 5, this cleaning device 5 sets up the part in supporting bench 1 top position one side of material feeding unit 3, and cleaning device 5 both sides equal fixedly connected with clearance support 6, clearance support 6 bottom and supporting bench 1 top fixed connection, cleaning device 5 are used for the material to get into material feeding unit 3 inside clear up.
During the use, send into cleaning device 5 at first inside, clear up the material through cleaning device 5, get rid of the impurity that drops easily on the material surface, inside the material entering material feeding unit 3 of the clearance of cleaning device 5, send into the chip mounter through material feeding unit 3 and carry out the paster operation, conveniently clear up the material surface to avoid the impurity on material surface to influence the fastening effect of paster, improve the paster quality.
Referring to fig. 1-4, the present invention provides a technical solution based on the first embodiment: the feeding device 3 comprises a fixed frame 31, the inner wall of the fixed frame 31 is rotationally connected with a feeding roller 32, both ends of the feeding roller 32 penetrate through the fixed frame 31 and are rotationally connected with the fixed frame 31, one end of the feeding roller 32 is fixedly connected with a driving chain wheel 33, a transmission toothed chain 34 is sleeved on the driving chain wheel 33 and meshed with the fixed frame 33, the side face of the transmission toothed chain 34 is fixedly connected with the feeding roller 32, one side of the transmission chain wheel 33, which is far away from the feeding roller 32, is fixedly connected with a driving motor 35, a heating cavity 36 is formed inside the feeding roller 32, the heating cavity 36 is fixedly connected with a heating device 37, the feeding roller 32 is provided with a plurality of groups and is vertically staggered inside the fixed frame 31, the distance between the upper feeding roller 32 and the lower feeding roller 32 is the same as the thickness of a material, the outer side of the fixed frame 31 is fixedly connected with a feeding bracket 4, the driving motor 35 is fixed on the side face of the fixed frame 31 through a connecting bracket, the feeding device 3 is arranged, the material after being cleaned by a cleaning device 5 enters the inside the fixed frame 31, the driving motor 35 drives the feeding roller 32 through the driving chain wheel 33 and the transmission toothed chain 34, and the material is driven to advance through the rotation of the feeding roller 32 when the feeding roller 32.
Referring to fig. 1-6, the present invention provides a technical solution based on the first embodiment and the second embodiment: the heating device 37 comprises a fixed sleeve 371, the inner wall of the fixed sleeve 371 is fixedly connected with a heating body 372 through a connecting frame, the side surface of the heating body 372 is fixedly connected with a heat conducting sheet 373, one end of the heat conducting sheet 373, which is far away from the heating body 372, penetrates through the fixed sleeve 371 and is fixedly connected with the fixed sleeve 371, one end of the heat conducting sheet 373, which is located outside the fixed sleeve 371, is rotationally connected with a rotating plate 374, one end of the rotating plate 374, which is far away from the heat conducting sheet 373, is fixedly connected with an arc-shaped heat conducting plate 375, the side surface of the rotating plate 374 is fixedly connected with an arc-shaped spring 376, one side of the fixed sleeve 371 is fixedly connected with a fixing rod 377, the fixed sleeve 371 is arranged inside the heating cavity 36 and is fixedly connected with the inner wall of the heating cavity 36 through a rotating frame, one end of the arc-shaped spring 376, which is far away from the rotating plate 374, is fixedly connected with the heat conducting sheet 373, one side of the arc-shaped heat conducting plate 375, which is far away from the rotating plate 374, is attached on the inner wall of the heating cavity 36, the rotating plate 374 is made of heat conducting metal, one end of the fixing rod 377 penetrates through the heating cavity 36 and extends to the outside of the feeding roller 32, one end of the fixing rod 377, which is positioned at the outside of the feeding roller 32, is fixedly connected with the fixing frame 31, the heating device 37 is arranged, when materials pass between the upper feeding roller 32 and the lower feeding roller 32, heat on the heating body 372 is transferred to the rotating plate 374 and the arc-shaped heat conducting plate 375 through the heat conducting plate 373 and is transferred to the feeding roller 32 through the arc-shaped heat conducting plate 375, so that the materials are heated through the feeding roller 32, the materials are softened and can be leveled more easily through heating the materials, relative sliding occurs between the feeding roller 32 and the arc-shaped heat conducting plate 375 during rotation, the arc-shaped heat conducting plate 375 can uniformly heat the feeding roller 32, the condition that the materials close to the heating body are heated unevenly due to high temperature is avoided, meanwhile, the rotating plate 374 and the arc-shaped spring 376 are also arranged, the rotating plate can drive the arc-shaped heat conducting plate 375 to be clung to the inner wall of the heating cavity 36, and heat is conducted through contact, so that the conduction efficiency is higher.
Referring to fig. 1 to 8, the present invention provides a technical solution based on the first embodiment, the second embodiment and the third embodiment: the cleaning device 5 comprises a positioning support 51, the top and the bottom of the inner wall of the positioning support 51 are all rotationally connected with a supporting roller 52, both sides of the positioning support 51 are fixedly connected with a brush head seat 53, wind holes 54 are formed in the brush head seat 53, a hollowed-out plate 55 is formed in the bottom of the inner wall of each wind hole 54, a brush head 56 is fixedly connected to the bottom of each hollowed-out plate 55, a cleaning fan 57 is communicated with the top of each wind hole 54 through a wind pipe, the cleaning fans 57 are fixedly connected with the positioning support 51 through a connecting frame, the positioning support 51 is arranged on a supporting table 1 and fixedly connected with the supporting table 1, the brush heads 56 are electrically driven to brush the brush heads 56, a plurality of groups of brush heads 56 are uniformly distributed on the bottom of the hollowed-out plates 55, the cleaning device 5 is arranged, materials pass through the brush heads 56 to clean the surfaces of the materials when the positioning support 51 are penetrated, meanwhile wind blown out by the cleaning fans 57 passes through the hollowed-out plate 55, the dust blown off by the cleaning fans 56 to clean the surfaces of the brush heads, and meanwhile the wind of the fans 57 can also clean the brush heads 56 in time, the dust blown by the dust can be adhered to the surfaces of the brush heads 56, and the dust can be prevented from being adhered to the surfaces of the dust cannot be cleaned.
It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present invention without the inventive step, are intended to be within the scope of the present invention. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.
Claims (9)
1. The utility model provides a chip mounter's preheating equipment, includes brace table (1) and support frame (2), brace table (1) set up at support frame (2) top and with support frame (2) top fixed connection, its characterized in that: also comprises;
the feeding device (3) is arranged above the supporting table (1), feeding brackets (4) are fixedly connected to two sides of the feeding device (3), the bottoms of the feeding brackets (4) are fixedly connected with the top of the supporting table (1), and the feeding device (3) is used for conveying materials;
cleaning device (5), this cleaning device (5) set up the part of top in brace table (1) top one side of material feeding unit (3), all fixedly connected with clearance support (6) in cleaning device (5) both sides, clearance support (6) bottom and brace table (1) top fixed connection, cleaning device (5) are used for clearing up the material that gets into material feeding unit (3) inside.
2. The preheating device of a chip mounter according to claim 1, wherein: the feeding device is characterized in that the feeding device (3) comprises a fixing frame (31), a feeding roller (32) is rotationally connected to the inner wall of the fixing frame (31), two ends of the feeding roller (32) penetrate through the fixing frame (31) and are rotationally connected with the fixing frame (31), a driving sprocket (33) is fixedly connected to one end of the feeding roller (32), a driving toothed chain (34) is sleeved on the driving sprocket (33) and meshed with the driving sprocket, the side face of the driving toothed chain (34) is fixedly connected with the feeding roller (32), a driving motor (35) is fixedly connected to one side, away from the feeding roller (32), of the driving sprocket (33), a heating cavity (36) is formed in the feeding roller (32), and a heating device (37) is fixedly connected to the inside of the heating cavity (36).
3. The preheating device of a chip mounter according to claim 2, wherein: the feeding rollers (32) are provided with a plurality of groups and are distributed inside the fixing frame (31) in an up-down staggered mode, and the distance between the upper feeding rollers (32) and the lower feeding rollers (32) is the same as the thickness of the material.
4. The preheating device of a chip mounter according to claim 2, wherein: the outside of the fixing frame (31) is fixedly connected with the feeding bracket (4), and the driving motor (35) is fixed on the side face of the fixing frame (31) through the connecting bracket.
5. The preheating device of a chip mounter according to claim 2, wherein: heating device (37) are including fixed sleeve (371), fixed sleeve (371) inner wall is through at link fixedly connected with heating member (372), heating member (372) side fixedly connected with conducting strip (373), one end that heating member (372) was kept away from to conducting strip (373) runs through fixed sleeve (371) and with fixed sleeve (371) fixed connection, conducting strip (373) are located the outside one end rotation of fixed sleeve (371) and are connected with rotor plate (374), one end fixedly connected with arc heat-conducting plate (375) of conducting strip (373) is kept away from to rotor plate (374), rotor plate (374) side fixedly connected with arc spring (376), one side fixedly connected with dead lever (377) of fixed sleeve (371).
6. The preheating device of a chip mounter according to claim 5, wherein: the fixing sleeve (371) is arranged in the heating cavity (36) and is fixedly connected with the inner wall of the heating cavity (36) through the rotating support, one end, far away from the rotating plate (374), of the arc-shaped spring (376) is fixedly connected with the heat conducting sheet (373), one side, far away from the rotating plate (374), of the arc-shaped heat conducting sheet (375) is stuck to the inner wall of the heating cavity (36), and the rotating plate (374) is made of heat conducting metal.
7. The preheating device of a chip mounter according to claim 5, wherein: one end of the fixing rod (377) penetrates through the heating cavity (36) and extends to the outside of the feeding roller (32), and one end of the fixing rod (377) located at the outside of the feeding roller (32) is fixedly connected with the fixing frame (31).
8. The preheating device of a chip mounter according to claim 1, wherein: cleaning device (5) are including locating support (51), equal rotation in locating support (51) inner wall top and bottom is connected with backing roll (52), equal fixedly connected with brush headstock (53) in locating support (51) both sides, wind hole (54) have been seted up on brush headstock (53), fretwork board (55) have been seted up to wind hole (54) inner wall bottom, fretwork board (55) bottom fixedly connected with brush head (56), wind hole (54) top has cleaning fan (57) through the tuber pipe intercommunication, cleaning fan (57) are through link and locating support (51) fixed connection.
9. The preheating device of a chip mounter according to claim 8, wherein: the positioning support (51) is arranged on the supporting table (1) and is fixedly connected with the supporting table (1), the brush head (56) is an electric brush head, and the brush heads (56) are provided with a plurality of groups and are uniformly distributed at the bottom of the hollowed-out plate (55).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100997772B1 (en) * | 2010-06-23 | 2010-12-01 | (주)금강이엔지 | Automatic manufacturing and packing system of patch |
| CN213558626U (en) * | 2020-10-13 | 2021-06-29 | 深圳市大石创新科技有限公司 | Paster surface cleaning device for high-speed paster machine |
| CN215188132U (en) * | 2021-06-24 | 2021-12-14 | 郴州市卓坤电子有限公司 | A paster material feeding unit for SMT chip mounter |
| CN215648084U (en) * | 2021-08-31 | 2022-01-25 | 杭州亿融智能科技有限公司 | Automatic feeding mechanism of chip mounter |
| CN215956982U (en) * | 2021-07-27 | 2022-03-04 | 东莞盈泽电子科技有限公司 | Chip mounter with clearance function in advance |
| CN216671573U (en) * | 2021-12-21 | 2022-06-03 | 先进半导体材料(深圳)有限公司 | Preheating device of chip mounter and chip mounter |
| CN217516102U (en) * | 2022-02-25 | 2022-09-30 | 深圳市辉硕电子有限公司 | Automatic conveyor for SMT processing |
-
2023
- 2023-06-15 CN CN202310708822.4A patent/CN116705659B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100997772B1 (en) * | 2010-06-23 | 2010-12-01 | (주)금강이엔지 | Automatic manufacturing and packing system of patch |
| CN213558626U (en) * | 2020-10-13 | 2021-06-29 | 深圳市大石创新科技有限公司 | Paster surface cleaning device for high-speed paster machine |
| CN215188132U (en) * | 2021-06-24 | 2021-12-14 | 郴州市卓坤电子有限公司 | A paster material feeding unit for SMT chip mounter |
| CN215956982U (en) * | 2021-07-27 | 2022-03-04 | 东莞盈泽电子科技有限公司 | Chip mounter with clearance function in advance |
| CN215648084U (en) * | 2021-08-31 | 2022-01-25 | 杭州亿融智能科技有限公司 | Automatic feeding mechanism of chip mounter |
| CN216671573U (en) * | 2021-12-21 | 2022-06-03 | 先进半导体材料(深圳)有限公司 | Preheating device of chip mounter and chip mounter |
| CN217516102U (en) * | 2022-02-25 | 2022-09-30 | 深圳市辉硕电子有限公司 | Automatic conveyor for SMT processing |
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| CN116705659B (en) | 2024-04-19 |
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