CN116685652A - 电路连接用黏合剂薄膜及其制造方法、以及连接结构体及其制造方法 - Google Patents

电路连接用黏合剂薄膜及其制造方法、以及连接结构体及其制造方法 Download PDF

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Publication number
CN116685652A
CN116685652A CN202180089778.2A CN202180089778A CN116685652A CN 116685652 A CN116685652 A CN 116685652A CN 202180089778 A CN202180089778 A CN 202180089778A CN 116685652 A CN116685652 A CN 116685652A
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CN
China
Prior art keywords
component
adhesive film
conductive particles
circuit
mass
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Pending
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CN202180089778.2A
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English (en)
Chinese (zh)
Inventor
森谷敏光
赤井邦彦
市村刚幸
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Resonac Corp
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Resonac Corp
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Publication of CN116685652A publication Critical patent/CN116685652A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/10—Esters
    • C08F22/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
CN202180089778.2A 2020-11-12 2021-11-10 电路连接用黏合剂薄膜及其制造方法、以及连接结构体及其制造方法 Pending CN116685652A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-188669 2020-11-12
JP2020188669 2020-11-12
PCT/JP2021/041394 WO2022102672A1 (ja) 2020-11-12 2021-11-10 回路接続用接着剤フィルム及びその製造方法、並びに、接続構造体及びその製造方法

Publications (1)

Publication Number Publication Date
CN116685652A true CN116685652A (zh) 2023-09-01

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CN202180089778.2A Pending CN116685652A (zh) 2020-11-12 2021-11-10 电路连接用黏合剂薄膜及其制造方法、以及连接结构体及其制造方法

Country Status (5)

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JP (1) JPWO2022102672A1 (enrdf_load_stackoverflow)
KR (1) KR20230107273A (enrdf_load_stackoverflow)
CN (1) CN116685652A (enrdf_load_stackoverflow)
TW (1) TW202229487A (enrdf_load_stackoverflow)
WO (1) WO2022102672A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023106400A1 (enrdf_load_stackoverflow) * 2021-12-10 2023-06-15
WO2024042720A1 (ja) * 2022-08-26 2024-02-29 株式会社レゾナック 回路接続用接着剤フィルム及び接続構造体、並びに、それらの製造方法
KR102749616B1 (ko) * 2023-05-31 2025-01-08 오컴퍼니 주식회사 자동차 전장 부품용 플렉시블 기재의 접합 소재 조성물

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010033793A (ja) * 2008-07-28 2010-02-12 Tokai Rubber Ind Ltd 粒子転写膜の製造方法
CN101652247A (zh) * 2007-03-30 2010-02-17 富士胶片株式会社 导电性物质吸附性树脂薄膜、导电性物质吸附性树脂薄膜的制造方法、使用其的带金属层的树脂薄膜及带金属层的树脂薄膜的制造方法
CN102559075A (zh) * 2010-12-29 2012-07-11 第一毛织株式会社 各向异性导电膜及其组合物和包括该导电膜的装置
CN104541411A (zh) * 2012-08-24 2015-04-22 迪睿合电子材料有限公司 各向异性导电膜及其制造方法
JP2015149127A (ja) * 2014-02-04 2015-08-20 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP2016149393A (ja) * 2015-02-10 2016-08-18 昭和電工株式会社 半導体用接着剤並びに半導体装置及びその製造方法
CN107112657A (zh) * 2015-01-13 2017-08-29 迪睿合株式会社 各向异性导电膜、其制造方法及连接构造体
WO2020004510A1 (ja) * 2018-06-26 2020-01-02 日立化成株式会社 異方性導電フィルム及びその製造方法並びに接続構造体の製造方法
WO2020184583A1 (ja) * 2019-03-13 2020-09-17 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW557237B (en) 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
JP6231257B2 (ja) * 2011-12-15 2017-11-15 デクセリアルズ株式会社 導電性接着剤、及び電子部品の接続方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101652247A (zh) * 2007-03-30 2010-02-17 富士胶片株式会社 导电性物质吸附性树脂薄膜、导电性物质吸附性树脂薄膜的制造方法、使用其的带金属层的树脂薄膜及带金属层的树脂薄膜的制造方法
JP2010033793A (ja) * 2008-07-28 2010-02-12 Tokai Rubber Ind Ltd 粒子転写膜の製造方法
CN102559075A (zh) * 2010-12-29 2012-07-11 第一毛织株式会社 各向异性导电膜及其组合物和包括该导电膜的装置
CN104541411A (zh) * 2012-08-24 2015-04-22 迪睿合电子材料有限公司 各向异性导电膜及其制造方法
JP2015149127A (ja) * 2014-02-04 2015-08-20 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
CN107112657A (zh) * 2015-01-13 2017-08-29 迪睿合株式会社 各向异性导电膜、其制造方法及连接构造体
JP2016149393A (ja) * 2015-02-10 2016-08-18 昭和電工株式会社 半導体用接着剤並びに半導体装置及びその製造方法
WO2020004510A1 (ja) * 2018-06-26 2020-01-02 日立化成株式会社 異方性導電フィルム及びその製造方法並びに接続構造体の製造方法
WO2020184583A1 (ja) * 2019-03-13 2020-09-17 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット

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TW202229487A (zh) 2022-08-01
JPWO2022102672A1 (enrdf_load_stackoverflow) 2022-05-19
WO2022102672A1 (ja) 2022-05-19
KR20230107273A (ko) 2023-07-14

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