CN116682790A - Sensor and preparation method thereof - Google Patents
Sensor and preparation method thereof Download PDFInfo
- Publication number
- CN116682790A CN116682790A CN202310577515.7A CN202310577515A CN116682790A CN 116682790 A CN116682790 A CN 116682790A CN 202310577515 A CN202310577515 A CN 202310577515A CN 116682790 A CN116682790 A CN 116682790A
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- Prior art keywords
- sensor
- steel mesh
- waterproof
- layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000002360 preparation method Methods 0.000 title abstract description 9
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 54
- 239000010959 steel Substances 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 69
- 239000000047 product Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000013066 combination product Substances 0.000 claims description 2
- 229940127555 combination product Drugs 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 5
- 230000008859 change Effects 0.000 abstract description 4
- 239000000428 dust Substances 0.000 abstract description 4
- 239000003292 glue Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Calibration Of Command Recording Devices (AREA)
Abstract
The invention discloses a sensor and a preparation method thereof, wherein the sensor comprises a substrate and a shell arranged on the substrate, the shell comprises a first steel mesh layer and a second steel mesh layer which are arranged inside and outside, a waterproof and breathable layer is arranged between the first steel mesh layer and the second steel mesh layer, and the first steel mesh layer, the waterproof and breathable layer and the second steel mesh layer are integrally formed. The waterproof breathable layer is arranged on the shell, and the steel mesh layers are arranged on the two sides of the waterproof breathable layer, so that the two sides of the waterproof breathable layer are sufficiently supported, the waterproof grade is improved, the waterproof breathable sensor has higher reliability, and can sense the fluctuation and change of air flow in any direction except the bottom, so that the sensor is close to the omni-directivity, and the sensing sensitivity is improved; the sensor has good dustproof performance, and the sensor performance is not influenced because the upper part and the periphery can sense external changes and one side is shielded by large dust, so that the bad risk is reduced; the preparation method of the invention has simple process and low cost.
Description
Technical Field
The invention relates to the technical field of electronic device waterproofing, in particular to a sensor and a preparation method thereof.
Background
Nowadays, with the development of technology and the improvement of living standard, consumer electronics are becoming wider and more widely used and more highly integrated, which requires that the sensor must be developed toward waterproof property, miniaturization and high reliability.
In the prior art, the waterproof mode of the sensor adopts a mode of filling high-elasticity glue into a product, but the mode needs multiple glue dispensing, bubble pumping, solidification and the like, the process is complex, and meanwhile, the surface of the MEMS chip is covered with glue, so that the induction sensitivity of the MEMS chip is reduced, the sensitivity of the product is influenced, and the heat dissipation is influenced; and because the MEMS chip cannot effectively vibrate and transmit sound after being wrapped by the adhesive, and cannot sense the change of the type of external gas, MI C, gas sensors and the like cannot be waterproof in the mode, and the waterproof mode has large limitation and cannot be popularized on a large scale; in order to better dispense, the overflow of the high-elasticity adhesive is avoided, and the defect that the size of the sensor is generally larger is also caused by adopting the waterproof mode.
The sensor waterproof mode is as follows: the waterproof membrane is stuck at the positions of the air holes/the sound transmission holes so as to realize the waterproof of the sensor, but the waterproof and sound transmission membrane and the sensor are difficult to realize firm adhesion, the waterproof and sound transmission membrane is soft and easy to fold, difficult to absorb effectively, difficult to produce, difficult to promote effectively in yield, and high in cost; when the water pressure is high, the waterproof breathable film is limited in rigidity and is not supported, so that the waterproof breathable film is easy to break, and the waterproof grade is low; in addition, because the strength of the waterproof film is insufficient, the area of the waterproof film can be reduced as much as possible, so that the overall strength of the product is ensured, the product experiences smaller areas of changes such as external air pressure/sound pressure/gas, and the like, the sensitivity of the product is relatively low, and the full orientation cannot be realized; when foreign matters cover the surface of the film, the induction performance of the product can be seriously affected; in order to firmly bond the films, a larger bonding area needs to be reserved, so that the product size is larger.
Disclosure of Invention
Aiming at the defects, the technical problems to be solved by the invention are as follows: the sensor and the preparation method thereof are provided, wherein the sensor adopts a simple and low-cost waterproof process, realizes high-grade waterproof performance, has good sensitivity and reliability, and has the advantage of small size.
In order to solve the technical problems, the technical scheme of the invention is as follows:
the utility model provides a sensor, includes the base plate and establishes the shell on the base plate, the shell with the base plate encloses into the closed chamber jointly, be provided with sensor chip subassembly in the closed chamber, the shell includes inside and outside first steel mesh layer and the second steel mesh layer that sets up, first steel mesh layer with be provided with waterproof ventilative layer between the second steel mesh layer, first steel mesh layer waterproof ventilative layer with second steel mesh layer integrated into one piece.
Preferably, the first steel mesh layer, the waterproof and breathable layer and the second steel mesh layer are integrally formed through sintering.
Preferably, the casing is adhered to the upper surface of the substrate by a silver adhesive layer.
Preferably, the sensor chip assembly includes a MEMS chip and an ASIC chip stacked one above the other, and the ASIC chip is disposed on the substrate.
Preferably, the ASIC chip is disposed on the substrate through a first adhesive layer; and/or the MEMS chip is arranged on the ASIC chip through a second adhesive layer.
Preferably, the MEMS chip and the ASIC chip are electrically connected, and the ASIC chip is electrically connected to the substrate.
Preferably, the MEMS chip and the ASIC chip are electrically connected to each other and/or the ASIC chip and the substrate by gold wires.
A method of manufacturing a sensor comprising the steps of:
firstly, clamping waterproof and breathable materials by using two layers of steel meshes, and forming a composite product after integrally forming;
step two, die-cutting the combination product according to the shell structure of the sensor to be prepared;
step three, stamping the die-cut formed composite product to form a shell;
step four, arranging a shell on a substrate, and packaging the shell into the sensor according to any one of claims 1 to 7, wherein a sensor assembly is arranged on the substrate.
In the first step, the waterproof and breathable material is clamped by two layers of steel meshes and is integrally formed by sintering; and/or, in the second step, according to the shell structure of the sensor to be prepared, the die-cut composite product is square.
Preferably, in the fourth step, the casing is disposed on the substrate by silver paste.
After the technical scheme is adopted, the invention has the beneficial effects that:
because the sensor and the preparation method thereof provided by the invention, the sensor comprises the substrate and the shell arranged on the substrate, the shell and the substrate jointly enclose a closed cavity, the sensor chip assembly is arranged in the closed cavity, the shell comprises a first steel mesh layer and a second steel mesh layer which are arranged inside and outside, a waterproof breathable layer is arranged between the first steel mesh layer and the second steel mesh layer, and the first steel mesh layer, the waterproof breathable layer and the second steel mesh layer are integrally formed. Therefore, the sensor shell is provided with the waterproof and breathable layer, and the two sides of the waterproof and breathable layer are steel mesh layers, so that the two sides of the waterproof and breathable layer are provided with enough supports, the waterproof grade is improved, and the sensor shell has higher reliability; the sensor can sense the fluctuation and change of the air flow in any direction except the bottom, so that the sensor is close to the omni-directivity, and the sensing sensitivity is improved; meanwhile, the sensor has good dustproof performance, the upper part and the periphery can sense external changes, the sensor performance is not influenced by shielding one side by large dust, and the bad risk is reduced; thus, the electronic equipment using the sensor has good performance; the preparation method of the invention has simple process and low cost.
Drawings
FIG. 1 is a schematic diagram of a sensor in accordance with the present invention;
FIG. 2 is an enlarged schematic view of the structure of FIG. 1 at A;
FIG. 3 is a schematic structural view of the composite product after being integrally formed by clamping a waterproof and breathable material by using a double-layer steel mesh;
FIG. 4 is a schematic view of the die-cut square configuration of the combination;
FIG. 5 is a cross-sectional view taken along the direction B-B in FIG. 4;
FIG. 6 is a top view of a sensor packaged with a housing disposed on a substrate;
FIG. 7 is a cross-sectional view taken along the direction C-C in FIG. 6;
in the figure: 1-shell, 10-first steel mesh layer, 11-waterproof ventilative layer, 12-second steel mesh layer, 3-base plate, 4-first bonding glue film, 5-ASI C chip, 6-second bonding glue film, 7-MEMS chip, 8-gold thread, 9-silver adhesive bonding layer, 100-sensor.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 and 2, according to the embodiment of the first aspect of the present invention, the sensor 100 includes a substrate 3 and a housing 1 disposed on the substrate 3, the housing 1 and the substrate 3 together enclose a closed cavity, a sensor chip assembly is disposed in the closed cavity, specifically, the sensor chip assembly includes a MEMS chip 7 and an ASI C chip 5 stacked one on top of the other, and the ASI C chip 5 is disposed on the substrate 3. Of course, the MEMS chip 7 and the ASI C chip 5 are not limited to the above-listed packaging methods, and the MEMS chip 7 and the ASIC chip 5 may be disposed on the substrate 3, respectively, and stacked up and down, so that the overall size may be reduced, and the product may have the advantage of small size.
The shell 1 comprises a first steel mesh layer 10 and a second steel mesh layer 12 which are arranged inside and outside, a waterproof and breathable layer 11 is arranged between the first steel mesh layer 10 and the second steel mesh layer 12, and the first steel mesh layer 10, the waterproof and breathable layer 11 and the second steel mesh layer 12 are integrally formed, wherein the waterproof and breathable layer 11 can be made of polytetrafluoroethylene PTFE, but is not limited to.
The first steel mesh layer 10, the second steel mesh layer 12 and the waterproof and breathable layer 11 in the shell 1 are integrally formed, namely, the waterproof and breathable layer 11 is supported on the inner side and the outer side, so that the waterproof and breathable shell has high waterproof grade and high reliability; the sensor 100 can sense the fluctuation and the change of the air flow in any direction except the bottom, so that the sensor 100 is close to the omni-directivity, and the sensing sensitivity is improved; meanwhile, the sensor 100 has excellent dustproof performance, because the upper part and the periphery can sense external changes, the performance of the sensor 100 is not influenced because the large dust shields one side, and the bad risk is reduced; the sensor 100 of the present invention may be an intelligent sensor such as a gas pressure sensor, a gas sensor, or an acoustic sensor.
As shown in fig. 1, the MEMS chip 7 and the ASIC chip 5 are electrically connected, and the ASIC chip 5 is electrically connected with the substrate 3, specifically, the MEMS chip 7 and the ASIC chip 5 are electrically connected with each other by gold wires 8, and/or the ASIC chip 5 and the substrate 3 are electrically connected with each other by gold wires 8. Of course, the MEMS chip 7 and the ASIC chip 5 may also be electrically connected by metal conductors, and the ASIC chip 5 and the substrate 3 may be electrically connected by conductive structures provided inside the substrate 3.
As shown in fig. 1 and 2, in some embodiments of the present invention, the first steel mesh layer 10, the waterproof and breathable layer 11, and the second steel mesh layer 12 are integrally formed by sintering. Specifically, the shell 1 adopts two layers of steel mesh to clamp the waterproof breathable layer 11, and then is sintered and molded to form the combined part of the shell 1+ waterproof breathable film.
In sample packaging, the first steel mesh layer 10, the waterproof and breathable layer 11 and the second steel mesh layer 12 are combined to form a finished product, the finished product is subjected to die cutting Cheng Fangxing, see fig. 3, then the finished product is punched into the shell 1, see fig. 4, the shell 1 is then adhered to the substrate 3 through silver adhesive, see fig. 6 and 7, and at the moment, the sensor chip assembly is arranged on the substrate 3, and the waterproof sensor 100 is packaged.
As shown in fig. 1, in some embodiments of the present invention, a case 1 is adhered to an upper surface of a substrate 3 by a silver adhesive layer 9, and an ASIC chip 5 is disposed on the upper surface of the substrate 3 by a first adhesive layer 4; and/or the MEMS chip 7 is provided on top of the ASIC chip 5 by means of a second adhesive layer 6.
In summary, the packaging mode of the sensor 100 of the present invention is simple, the step of adhering a waterproof breathable film or filling high-elasticity waterproof glue is omitted, the size close to that of a non-waterproof product can be achieved, and the size of the sensor is reduced by 30% compared with that of the waterproof sensor 100 in the prior art, and the sensor has the advantage of small volume.
According to an embodiment of the second aspect of the invention, a method for manufacturing a sensor comprises the steps of:
step one, clamping a waterproof and breathable material by utilizing two layers of steel meshes, and forming a composite product after integrally forming, namely forming the composite product with a waterproof and breathable film, wherein the figure 3 is shown; preferably, the waterproof and breathable material is formed integrally by sintering, wherein the waterproof and breathable material can be polytetrafluoroethylene PTFE. Wherein the two steel mesh layers may be the first steel mesh layer 10 and the second steel mesh layer 12 of the sensor 100 of the first aspect of the present invention;
step two, die cutting the combination according to the shell structure of the sensor to be prepared, wherein the die cutting combination is square in a preferred scheme, and see fig. 4 and 5;
thirdly, stamping the die-cut formed composition to form a shell 1, wherein the shell 1 is provided with a waterproof breathable layer 11;
step four, arranging the shell 1 on the substrate 3, packaging the sensor 100 of the first aspect of the invention, see fig. 6 and 7, wherein a sensor component is arranged on the substrate 3 before packaging, see fig. 1; specifically, the housing 1 is provided on the substrate 3 by silver paste.
The preparation method of the sensor has simple process and low cost, omits the step of pasting a waterproof breathable film or filling high-elasticity waterproof glue, can achieve the dimension close to a non-waterproof product, reduces the dimension by 30 percent compared with the dimension of the waterproof product in the prior art, and has the advantages that the shell and the waterproof material are integrally formed, the inner side and the outer side are both provided with the support for the waterproof breathable material, the waterproof grade is high, and the reliability is higher compared with the prior art; the sensor 100 prepared by the method has excellent dustproof performance, and because the upper part and the periphery can sense external changes, the performance of the sensor 100 is not influenced because the large dust shields one side, and the bad risk is reduced; the method can be widely applied to intelligent sensors such as air pressure sensors, gas sensors, acoustic sensors and the like.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover any and all modifications, adaptations or variations of the sensor and its manufacturing method that come within the spirit and principles of the invention.
Claims (10)
1. The utility model provides a sensor, includes the base plate and establishes the shell on the base plate, the shell with the base plate encloses into the closed chamber jointly, be provided with sensor chip subassembly in the closed chamber, its characterized in that, the shell includes inside and outside first steel mesh layer and the second steel mesh layer that sets up, first steel mesh layer with be provided with waterproof ventilative layer between the second steel mesh layer, first steel mesh layer waterproof ventilative layer with second steel mesh layer integrated into one piece.
2. The sensor of claim 1, wherein the first steel mesh layer, the waterproof and breathable layer, and the second steel mesh layer are integrally formed by sintering.
3. The sensor of claim 1, wherein the housing is adhered to the substrate by a silver paste adhesive layer.
4. A sensor according to any one of claims 1 to 3, wherein the sensor chip assembly comprises a MEMS chip and an ASIC chip arranged one above the other, the ASIC chip being arranged on top of the substrate.
5. The sensor of claim 4, wherein the ASIC chip is disposed on top of the substrate by a first adhesive layer; and/or the MEMS chip is arranged on the ASIC chip through a second adhesive layer.
6. The sensor of claim 4, wherein the MEMS chip and the ASIC chip are electrically connected, the ASIC chip being electrically connected with the substrate.
7. The sensor of claim 6, wherein the MEMS chip and the ASIC chip are electrically connected by gold wires and/or the ASIC chip and the substrate.
8. A method of manufacturing a sensor, comprising the steps of:
firstly, clamping waterproof and breathable materials by using two layers of steel meshes, and forming a composite product after integrally forming;
step two, die-cutting the combination product according to the shell structure of the sensor to be prepared;
step three, stamping the die-cut formed composite product to form a shell;
step four, arranging a shell on a substrate, and packaging the shell into the sensor according to any one of claims 1 to 7, wherein a sensor assembly is arranged on the substrate.
9. The method for manufacturing a sensor according to claim 8, wherein in the first step, the waterproof and breathable material is sandwiched by two layers of steel mesh and integrally formed by sintering; and/or, in the second step, according to the shell structure of the sensor to be prepared, the die-cut composite product is square.
10. The method of manufacturing a sensor according to claim 8, wherein in the fourth step, the housing is provided on the substrate by silver paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310577515.7A CN116682790A (en) | 2023-05-19 | 2023-05-19 | Sensor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310577515.7A CN116682790A (en) | 2023-05-19 | 2023-05-19 | Sensor and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116682790A true CN116682790A (en) | 2023-09-01 |
Family
ID=87782841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310577515.7A Pending CN116682790A (en) | 2023-05-19 | 2023-05-19 | Sensor and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116682790A (en) |
-
2023
- 2023-05-19 CN CN202310577515.7A patent/CN116682790A/en active Pending
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