CN116682768A - Diffusion device and wafer storage equipment - Google Patents

Diffusion device and wafer storage equipment Download PDF

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Publication number
CN116682768A
CN116682768A CN202310673244.5A CN202310673244A CN116682768A CN 116682768 A CN116682768 A CN 116682768A CN 202310673244 A CN202310673244 A CN 202310673244A CN 116682768 A CN116682768 A CN 116682768A
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China
Prior art keywords
diffusion
gas
wafer
wafer storage
gas flow
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CN202310673244.5A
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Chinese (zh)
Inventor
洪巧水
邬昊
张军
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Glory Semiconductor Materials Jiashan Co ltd
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Glory Semiconductor Materials Jiashan Co ltd
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Priority to CN202310673244.5A priority Critical patent/CN116682768A/en
Publication of CN116682768A publication Critical patent/CN116682768A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to the technical field of semiconductors, in particular to a diffusion device and wafer storage equipment; the wafer storage device comprises a wafer storage box and a diffusion device arranged on the wafer storage box; the diffusion device comprises a diffusion body, wherein at least two gas flow channels are arranged in the diffusion body, and the diffusion body is also provided with a gas inlet communicated with the at least two gas flow channels; the diffusion body is further provided with at least two diffusion parts, the at least two diffusion parts are sequentially arranged along the set direction, the at least two gas flow channels are communicated with the at least two diffusion parts in a one-to-one correspondence mode, and the at least two diffusion parts are located in the wafer storage box and used for enabling gas to be conveyed into the wafer storage box. The diffusion device can uniformly diffuse the gas into the wafer storage box so as to ensure that the wafers stored in the wafer storage equipment can be protected by the protective gas conveyed and diffused by the diffusion device.

Description

Diffusion device and wafer storage equipment
Technical Field
The invention relates to the technical field of semiconductors, in particular to a diffusion device and wafer storage equipment.
Background
With the dramatic development of semiconductor process technology, semiconductor chips are widely used in electronic devices (e.g., computers, mobile phones, tablet computers, etc.).
In the process of manufacturing semiconductor chips, it is necessary to transfer wafers; wafer storage devices (e.g., front opening unified pods FOUP (Front Opening Unified Pod)) are typically required to protect, transport, and store wafers during wafer transfer; moreover, when wafers are placed by the wafer storage apparatus, a protective gas (for example, nitrogen gas) is required to be introduced to protect the wafers.
However, the wafer storing apparatus provided by the related art has difficulty in uniformly diffusing the protective gas, and thus it is easy to cause that a part of the wafers stored in the wafer storing apparatus is difficult to be protected by the protective gas.
Disclosure of Invention
The invention aims to provide a diffusion device and wafer storage equipment, wherein the diffusion device can diffuse gas more uniformly, so that the gas can be diffused into a wafer storage box of the wafer storage equipment more uniformly, and wafers stored in the wafer storage equipment can be protected by protective gas conveyed and diffused by the diffusion device.
Embodiments of the present invention are implemented as follows:
in a first aspect, the present invention provides a diffusing device comprising:
the diffusion body is internally provided with at least two gas flow channels, and the diffusion body is also provided with gas inlets communicated with the at least two gas flow channels; wherein, the liquid crystal display device comprises a liquid crystal display device,
the diffusion body is also provided with at least two diffusion parts, the at least two diffusion parts are sequentially arranged along the set direction, and the at least two gas flow channels are communicated with the at least two diffusion parts in a one-to-one correspondence manner.
In an alternative embodiment, the diffusion part comprises at least two gas conveying members, wherein the at least two gas conveying members are connected with the diffusion body and are sequentially arranged along a set direction, and the gas conveying members are communicated with the corresponding gas flow channels and are used for outputting the gas conveyed by the corresponding gas flow channels.
In an alternative embodiment, the gas delivery member is provided with at least two gas delivery channels, the at least two gas delivery channels are communicated with the corresponding gas flow channels, and the gas outlet directions of any two gas delivery channels are distributed in an included angle.
In an alternative embodiment, the diffusion body comprises an outer shell, an inner shell and at least one partition, the inner shell being disposed within the outer shell and provided with an air inlet; at least one partition member is connected with the inner wall of the inner shell and divides the inner cavity of the inner shell into at least two gas flow channels; the housing is provided with at least two diffusion sections.
In an alternative embodiment, at least two gas flow channels are each configured to deliver gas in a set direction to a respective corresponding diffuser portion.
In an alternative embodiment, the air inlet is arranged at one end of the diffusion body along the set direction; the diffusion part is distributed on one side of the diffusion body adjacent to the air inlet.
In an alternative embodiment, the diffusion device comprises at least two diffusion bodies, each provided with at least two diffusion portions; the at least two diffusion parts of the at least one diffusion body and the at least two diffusion parts of the other diffusion body are distributed in a one-to-one correspondence in a set direction, so that the gas output from the diffusion parts of the at least one diffusion body can be recovered from the corresponding diffusion parts of the other diffusion body.
In a second aspect, the present invention provides a wafer storage apparatus comprising a wafer storage cassette and a diffusion device according to any one of the preceding embodiments disposed in the wafer storage cassette, at least two diffusion sections being located within the wafer storage cassette for delivering gas into the wafer storage cassette.
In an alternative embodiment, the wafer cassette is provided with at least two wafer cassettes, the at least two diffusions being distributed in a one-to-one correspondence with the at least two wafer cassettes in a set direction.
In an alternative embodiment, the wafer storage portion includes at least two wafer supports, the at least two wafer supports are distributed in sequence along a set direction, the wafer supports are used for supporting wafers, and the at least two gas transmission members of the diffusion portion and the at least two wafer supports of the corresponding wafer storage portion are distributed in a one-to-one correspondence in the set direction.
The diffusion device provided by the embodiment of the invention has the beneficial effects that: the diffusion body of the diffusion device provided by the embodiment of the invention is provided with at least two gas flow channels, the diffusion body is also provided with at least two diffusion parts, the at least two diffusion parts are sequentially arranged along the set direction, and the at least two gas flow channels are correspondingly communicated with the at least two diffusion parts one by one. In this way, the gas inputted from the gas inlet into the at least two gas flow passages can be outputted from the corresponding diffusion sections, respectively, and since the at least two diffusion sections are distributed in the set direction in order, it is possible to ensure that the gas outputted from the at least two diffusion sections can be distributed more uniformly in the set direction.
The wafer storage device provided by the embodiment of the invention has the beneficial effects that: the wafer storage device provided by the embodiment of the invention can utilize the diffusion device arranged in the wafer storage box to convey protective gas in the wafer storage box; the diffusion body of the diffusion device is provided with at least two gas flow passages, the diffusion body is also provided with at least two diffusion parts, and the at least two gas flow passages are communicated with the at least two diffusion parts in a one-to-one correspondence manner, so that protective gas input into the at least two gas flow passages from the gas inlet can be output from the corresponding diffusion parts respectively, and the at least two diffusion parts are sequentially distributed along the set direction, so that the gas output from the at least two diffusion parts can be ensured to be more uniformly distributed in the wafer protection box along the set direction, and the wafers stored in the wafer storage equipment can be protected by the protective gas conveyed and diffused by the diffusion device.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a wafer storage apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a diffusing device according to an embodiment of the present invention at a first view angle;
FIG. 3 is a cross-sectional view of a diffusion device according to an embodiment of the present invention;
FIG. 4 is a schematic view of a diffusing device according to an embodiment of the present invention at a second view angle;
fig. 5 is a schematic structural diagram of a diffusion device according to an embodiment of the present invention at a third viewing angle.
Icon: 010-diffusion means; 100-diffusion body; 110-a housing; 120-an inner shell; 121-gas flow channels; 122-separator; 123-air inlet; 130-a diffuser; 131-gas conveying parts; 132-a gas transmission channel; 020-wafer storage device; 200-wafer storage box; 210-wafer storage; 220-wafer support; a-setting the direction.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "vertical", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in place when the inventive product is used, are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or elements referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed", "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1, the present embodiment provides a wafer storage apparatus 020, for example: a front opening unified pod (Front Opening Unified Pod, simply referred to as a FOUP), the wafer storage apparatus 020 is used to protect, transport, and store wafers.
The wafer storing apparatus 020 includes a wafer storing cassette 200, the wafer storing cassette 200 is provided with at least two wafer storing sections 210, and the at least two wafer storing sections 210 are sequentially arranged along a set direction a and are each for storing wafers.
Further, the wafer storing portion 210 includes at least two wafer supports 220, the at least two wafer supports 220 are sequentially distributed along the set direction a, and the wafer supports 220 are used for supporting wafers; the arrangement enables the wafer storing portion 210 to store at least two wafers by using at least two wafer supports 220, which is beneficial to increasing the storage capacity of the wafer storage cassette 200.
It should be noted that, the number of the wafer storages 210 provided in the wafer cassette 200 includes, but is not limited to, two, three, five, and seven, and the number of the wafer supports 220 in each wafer storage 210 includes, but is not limited to, two, three, five, and seven; the structure of the wafer support 220 and the principle of supporting the wafer are similar to those of the related art, and will not be described herein.
It should be further noted that, the set direction a may refer to a vertical direction, and at least two wafer supports 220 are sequentially arranged along the vertical direction, so that at least two wafers can be stacked and stored along the vertical direction.
When wafers are stored in the wafer storage device, a protective gas needs to be introduced into the wafer storage cassette 200, for example: nitrogen gas to protect the wafers stored in the wafer cassette 200 with a protective gas.
The wafer storage device provided by the related art cannot uniformly convey the gas into the wafer storage box, so that the part of the wafers stored in the wafer storage device is difficult to contact with the protective gas, and the part of the wafers are difficult to be protected by the protective gas.
Referring to fig. 1, 2 and 3, in order to improve the above-mentioned problem, the wafer storage apparatus 020 of the present embodiment further includes a diffusing device 010, and the diffusing device 010 is disposed in the wafer storage box 200; wherein the diffusing device 010 includes a diffusing body 100, at least two gas flow passages 121 and a gas inlet 123 communicating with the at least two gas flow passages 121 are provided inside the diffusing body 100; the diffusion body 100 is further provided with at least two diffusion portions 130, the at least two diffusion portions 130 are sequentially arranged along the set direction a, and the at least two gas flow channels 121 are communicated with the at least two diffusion portions 130 in a one-to-one correspondence manner, and the at least two diffusion portions 130 are located in the wafer storage box 200 and are used for conveying gas into the wafer storage box 200. In this way, the protective gas can be supplied into the wafer cassette 200 by the diffusion device 010 provided in the wafer cassette 200; since the diffusion body 100 of the diffusion device 010 is provided with at least two gas flow channels 121, and the diffusion body 100 is further provided with at least two diffusion portions 130, and at least two of the gas flow channels 121 are communicated with at least two of the diffusion portions 130 in a one-to-one correspondence, the protective gas inputted from the gas inlet 123 into the at least two gas flow channels 121 can be outputted from the corresponding diffusion portions 130, respectively, and since the at least two diffusion portions 130 are sequentially distributed along the set direction a, the gas outputted from the at least two diffusion portions 130 can be ensured to be more uniformly distributed in the wafer protection box along the set direction a, which is beneficial to protecting the wafers stored in the wafer storage device 020 by the protective gas conveyed and diffused by the diffusion device 010.
Further, at least two diffusion portions 130 provided on the diffusion body 100 are distributed in one-to-one correspondence with at least two wafer storage portions 210 in the set direction a. In this way, the protective gas supplied into the wafer cassette 200 by the at least two diffusion sections 130 can be uniformly diffused at the at least two wafer storage sections 210, and thus, the wafers stored in the at least two wafer storage sections 210 can be reliably brought into contact with the protective gas, and the reliability of protecting the wafers with the protective gas can be ensured.
The structure of the diffusion body 100 may be set as desired; referring to fig. 4, the diffusion body 100 of the present embodiment includes an outer casing 110, an inner casing 120, and at least one partition 122, wherein the inner casing 120 is disposed in the outer casing 110 and is provided with an air inlet 123; at least one partition 122 is connected to the inner wall of the inner case 120 and divides the inner cavity of the inner case 120 into at least two gas flow passages 121; the housing 110 is provided with a diffusion portion 130. In this way, at least two gas flow channels 121 can be reliably partitioned in the inner cavity of the inner case 120 by the partition 122, so that each gas flow channel 121 does not interfere with each other when gas is conveyed, and the gas conveyed in at least two gas flow channels 121 is respectively output from the corresponding diffusion part 130, thereby ensuring the uniformity of gas diffusion through the diffusion device 010.
Further, the diffusion body 100 of the present embodiment includes five separators 122, the separators 122 have a plate-like structure, one side of each separator 122 is connected with the inner sidewall of the inner casing 120 and is distributed at intervals along the circumferential direction of the inner casing 120, the other side of each separator 122 is connected with each other, and one gas flow channel 121 is formed between two adjacent separators 122, i.e. five gas flow channels 121 are provided inside the diffusion body 100, and the five gas flow channels 121 are all communicated with the gas inlet 123; the diffusion body 100 is further provided with five diffusion sections 130, and the five diffusion sections 130 communicate with the five gas flow passages 121 in one-to-one correspondence. In this way, the gas is diffused from the five diffusion sections 130 in the set direction a by the diffusion device 010, and the uniformity of the gas diffusion can be improved.
It should be appreciated that in other embodiments, the number of dividers 122 may also be one, two, three, six, etc., without specific limitation. Moreover, in other embodiments, both sides of the divider 122 may be connected to the inner sidewall of the inner housing 120.
It should be noted that the shape of the inner shell 120 may be selected according to needs, including but not limited to a cylindrical shape and a prismatic shape.
It should be noted that, the cross-sectional shape of the gas flow channel 121 may be selected according to needs, and in this embodiment, the cross-sectional shape of the gas flow channel 121 is a fan shape; in other embodiments, the shape of the gas flow channel 121 may be circular, square, oval, triangular, diamond, pentagonal, etc., which is not particularly limited herein; the connection manner of the partition 122 for partitioning the inner case 120 into the plurality of gas flow channels 121 and the inner case 120 includes, but is not limited to, integral molding and welding.
Optionally, in other embodiments, the diffusion body 100 includes a housing 110 and at least two flow guiding pipes connected in the housing 110, the flow guiding pipes are provided with gas flow channels 121, the housing 110 is provided with a gas inlet 123, the at least two flow guiding pipes are all communicated with the gas inlet 123, and the at least two flow guiding pipes are communicated with the at least two diffusion parts 130 in a one-to-one correspondence. In this way, the gas delivered by each flow guide pipe can be diffused from the corresponding diffusion portion 130, and the uniformity of gas diffusion can be improved.
In order to smoothly transfer the gas from the gas flow passage 121 to the corresponding diffuser 130 and reduce loss of the gas in the gas flow passage 121 and noise; referring to fig. 3, at least two gas flow channels 121 are configured to deliver gas to respective corresponding diffusion portions 130 along a set direction a.
Further, in the set direction a, the air inlet 123 is disposed at one end of the diffusion body 100, and the diffusion portion 130 is disposed on one side of the diffusion body 100 adjacent to the air inlet 123; specifically, the air inlet 123 is disposed at the bottom wall of the inner case 120, and the diffuser 130 is disposed at the side wall of the outer case 110.
To further improve the uniformity of the diffusion gas of the diffusion device 010; referring to fig. 2, in a preferred embodiment, the diffusing part 130 includes at least two gas conveying members 131, wherein the at least two gas conveying members 131 are connected to the diffusing body 100 and are sequentially arranged along a set direction a, and specifically, the at least two gas conveying members 131 are connected to the housing 110 and are sequentially arranged along the set direction a; the gas delivery member 131 communicates with the corresponding gas flow passage 121 and is configured to output the gas delivered by the corresponding gas flow passage 121. So configured, the gas delivered from the gas flow channels 121 can be delivered from at least two gas delivery members 131 of the corresponding diffuser 130 to further improve the uniformity of the gas delivered from the diffuser 130.
Further, referring to fig. 1 and 2, at least two gas delivering members 131 of the diffusing part 130 and at least two wafer supporting members 220 of the corresponding wafer storing part 210 are distributed in a one-to-one correspondence in the set direction a. In this way, the protective gas supplied into the wafer cassette 200 through the at least two gas supplying members 131 can be uniformly diffused at the at least two wafer supporting members 220, thereby ensuring that the wafers stored on the at least two wafer supporting members 220 can be reliably contacted with the protective gas, and ensuring the reliability of protecting the wafers with the protective gas.
It should be noted that, the number of the air delivery members 131 disposed in each diffusion portion 130 may be the same or different, and each diffusion portion 130 in this embodiment is provided with 5 air delivery members 131; of course, in other embodiments, the number of the air delivery members 131 of the diffuser 130 may be 1, 2, 4, 6, etc., which is not limited herein.
The structure of the gas delivery member 131 may be set as desired; referring to fig. 5, in a preferred embodiment, the gas delivery member 131 is provided with at least two gas delivery channels 132, at least two gas delivery channels 132 are respectively communicated with the corresponding gas flow channels 121, and the gas outlet directions of any two gas delivery channels 132 are distributed at an included angle. In this way, it is advantageous to ensure that the gas output from each gas delivery member 131 can be more uniformly diffused and output by using the plurality of gas delivery passages 132.
It should be noted that, the number of the gas delivery channels 132 provided in each gas delivery member 131 may be the same or different; each gas transmission member 131 of the present embodiment is provided with two gas transmission channels 132 distributed in an included angle; alternatively, the included angle between the two gas delivery passages 132 includes, but is not limited to, 30 °, 45 °, 60 °, 90 °, 120 °.
Of course, in other embodiments, the number of the air delivery passages 132 provided by the air delivery member 131 may be one, three, four, etc., which is not particularly limited herein.
Optionally, the air delivery member 131 includes at least two air delivery pipes connected at an included angle, and the at least two air delivery pipes are connected with the diffusion body 100, specifically, the at least two air delivery pipes are connected with the housing 110, and the at least two air delivery pipes are all provided with the air delivery channel 132.
When the protective gas is introduced into the wafer cassette 200 to protect the wafers, the gas in the wafer cassette 200 needs to be exhausted while the protective gas is introduced, and a cycle is formed, thereby ensuring the balance of the gas pressure in the wafer cassette 200. In order to ensure the balance of the gas pressure in the wafer storage box 200 and ensure that the protective gas introduced into the wafer storage box 200 can reliably contact each wafer, thereby forming a good protective effect; the diffusion device 010 includes at least two diffusion bodies 100, at least two diffusion bodies 100 are all disposed in the wafer storage box 200, at least two diffusion portions 130 are all disposed on at least two diffusion bodies 100, at least two gas flow channels 121 are all disposed on at least two diffusion bodies 100, and at least two gas flow channels 121 of each diffusion body 100 are communicated with at least two diffusion portions 130 in a one-to-one correspondence; wherein at least two diffusion parts 130 of at least one diffusion body 100 are distributed in one-to-one correspondence with at least two diffusion parts 130 of another diffusion body 100 in a set direction a so that gas outputted from the diffusion parts 130 of at least one diffusion body 100 can be recovered from the corresponding diffusion parts 130 of the other diffusion body 100. In this way, it is ensured that the gas outputted from at least two diffusion sections 130 of one diffusion device 010 does not flow intensively to the same position due to the recovered gas, and the uniformity of gas diffusion is further improved.
It should be understood that the at least two diffusion portions 130 of the at least one diffusion body 100 and the at least two diffusion portions 130 of the other diffusion body 100 are distributed in a one-to-one correspondence in the set direction a, and may refer to that the at least two diffusion portions 130 of the at least one diffusion body 100 and the at least two diffusion portions 130 of the other diffusion body 100 are completely distributed relatively in the set direction a, or are distributed relatively in a staggered manner, which is not limited herein.
The diffusing device 010 of the present embodiment includes two diffusing bodies 100, the two diffusing bodies 100 are distributed on the same side of the wafer storage box 200, and the two diffusing bodies 100 are distributed at intervals. Of course, in other embodiments, the two diffusion bodies 100 may also be diagonally distributed in the wafer cassette 200.
It should be understood that in other embodiments, the number of diffusion bodies 100 of the diffusion device 010 may be one, three, four, etc., and is not particularly limited herein.
The gas flow passages 121 and the diffuser 130 provided in the plurality of diffuser bodies 100 of the diffuser 010 may be identical or different in structure, and are not particularly limited herein.
It should be noted that, the wafer storage device is further provided with an air valve, and the air valve is used for controlling the opening and closing of the air inlet 123 of the diffusion body 100; thus, the gas valve may be used to open the gas inlet 123 when it is desired to diffuse the gas in the wafer cassette 200 by the diffusion device 010; when it is not necessary to diffuse the gas in the wafer cassette 200 by using the diffusion device 010, the gas valve may be used to close the gas inlet 123. The arrangement of the air valve is similar to that of the related art, and will not be described here again.
It should be appreciated that the diffusing device 010 of the present embodiment may also be used in other devices, such as: a diffusion furnace, not particularly limited herein; when the diffusion device 010 is arranged in the diffusion furnace, the diffusion device 010 can be used for conveying the reaction gas in the inner cavity of the diffusion furnace, so that the reaction gas is uniformly distributed in the diffusion furnace, wafers stacked in the diffusion furnace along the vertical direction can reliably and stably grow films, and the films grown on the wafers can be kept consistent as much as possible.
In the wafer storage apparatus 020 of the present embodiment, when wafers are stored, the protective gas may be delivered from the gas inlet 123 of the diffusion body 100 into each gas flow channel 121, and then the gas entering each gas flow channel 121 may be delivered from the gas delivery member 131 of the diffusion part 130 corresponding to each gas flow channel 121 to the corresponding wafer support 220, so that the protective gas may be reliably diffused to the wafers placed on each wafer support 220.
In summary, the diffusing device 010 of the present invention can be used for a wafer storage device, and the diffusing device 010 can diffuse the gas more uniformly, so that the gas can be diffused more uniformly into the wafer storage box 200 of the wafer storage device 020, so as to ensure that the wafers stored in the wafer storage device 020 can be protected by the protective gas conveyed and diffused by the diffusing device 010.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A diffusion device, comprising:
the diffusion device comprises a diffusion body (100), wherein at least two gas flow channels (121) are arranged in the diffusion body (100), and the diffusion body (100) is further provided with gas inlets (123) communicated with the at least two gas flow channels (121); wherein, the liquid crystal display device comprises a liquid crystal display device,
the diffusion body (100) is further provided with at least two diffusion parts (130), the at least two diffusion parts (130) are sequentially arranged along a set direction, and the at least two gas flow channels (121) are communicated with the at least two diffusion parts (130) in a one-to-one correspondence mode.
2. The diffusing device according to claim 1, wherein said diffusing portion (130) comprises at least two gas-delivering members (131), at least two of said gas-delivering members (131) being connected to said diffusing body (100) and being arranged in sequence along said set direction, said gas-delivering members (131) being in communication with the corresponding gas flow channels (121) and being adapted to deliver the gas delivered by the corresponding gas flow channels (121).
3. The diffusing device according to claim 2, wherein the gas delivery member (131) is provided with at least two gas delivery channels (132), at least two gas delivery channels (132) are both communicated with the corresponding gas flow channels (121), and the gas outlet directions of any two gas delivery channels (132) are distributed at an included angle.
4. The diffusion device according to claim 1, wherein the diffusion body (100) comprises an outer shell (110), an inner shell (120) and at least one partition (122), the inner shell (120) being arranged within the outer shell (110) and being provided with the air inlet (123); at least one partition (122) is connected with the inner wall of the inner shell (120) and divides the inner cavity of the inner shell (120) into at least two gas flow channels (121); the housing (110) is provided with at least two of the diffusion sections (130).
5. The diffusion device according to claim 1, wherein at least two of the gas flow channels (121) are each configured to deliver gas in the set direction to a respective corresponding one of the diffusion sections (130).
6. The diffusion device according to claim 1, wherein the air inlet (123) is provided at one end of the diffusion body (100) in the set direction; the diffusion portion (130) is distributed on one side of the diffusion body (100) adjacent to the air inlet (123).
7. A diffusion device according to any one of claims 1-6, characterized in that the diffusion device comprises at least two diffusion bodies (100), at least two diffusion bodies (100) each being provided with at least two diffusion sections (130); wherein at least two diffusion portions (130) of at least one diffusion body (100) are distributed in one-to-one correspondence with at least two diffusion portions (130) of another diffusion body (100) in the set direction so that gas output from the diffusion portion (130) of at least one diffusion body (100) can be recovered from the corresponding diffusion portion (130) of the other diffusion body (100).
8. Wafer storage device, characterized by comprising a wafer storage cassette (200) and a diffusion device according to any of claims 1-7 arranged in the wafer storage cassette (200), at least two of the diffusion sections (130) being located in the wafer storage cassette (200) for delivering gas into the wafer storage cassette (200).
9. The wafer storing apparatus according to claim 8, wherein the wafer storing cassette (200) is provided with at least two wafer storing sections (210), and at least two of the diffusing sections (130) are distributed in one-to-one correspondence with at least two of the wafer storing sections (210) in the set direction.
10. The wafer storage apparatus according to claim 9, wherein the wafer storage section (210) includes at least two wafer supports (220), at least two of the wafer supports (220) are sequentially distributed along the set direction, and the wafer supports (220) are configured to support wafers; at least two gas delivery members (131) of the diffusing part (130) and at least two wafer supports (220) of the corresponding wafer storage part (210) are distributed in a one-to-one correspondence manner in the set direction.
CN202310673244.5A 2023-06-07 2023-06-07 Diffusion device and wafer storage equipment Pending CN116682768A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310673244.5A CN116682768A (en) 2023-06-07 2023-06-07 Diffusion device and wafer storage equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310673244.5A CN116682768A (en) 2023-06-07 2023-06-07 Diffusion device and wafer storage equipment

Publications (1)

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CN116682768A true CN116682768A (en) 2023-09-01

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CN (1) CN116682768A (en)

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