CN116677591A - Piezoelectric micropump capable of inhibiting internal vortex - Google Patents
Piezoelectric micropump capable of inhibiting internal vortex Download PDFInfo
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- CN116677591A CN116677591A CN202310782602.6A CN202310782602A CN116677591A CN 116677591 A CN116677591 A CN 116677591A CN 202310782602 A CN202310782602 A CN 202310782602A CN 116677591 A CN116677591 A CN 116677591A
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- 230000002401 inhibitory effect Effects 0.000 title abstract description 4
- 230000004888 barrier function Effects 0.000 claims abstract description 86
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 230000000903 blocking effect Effects 0.000 claims abstract description 43
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 30
- 230000007704 transition Effects 0.000 claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 238000013016 damping Methods 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 abstract description 5
- 230000008859 change Effects 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 14
- 239000012530 fluid Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000004868 gas analysis Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
- F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
- F04B45/047—Pumps having electric drive
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Reciprocating Pumps (AREA)
Abstract
The invention discloses a piezoelectric micropump for inhibiting internal vortex; the piezoelectric micropump comprises a flow inlet layer, a barrier layer, a vibration substrate layer, an upper power supply layer, a shell layer, a buffer sheet and a blocking layer, wherein the buffer sheet and the blocking layer are sequentially laminated, and a reinforcing layer and a vibration layer are arranged on the vibration substrate layer. The barrier layer is provided with a central through hole and a buffer sheet. The buffer sheet is positioned on the side surface of the barrier layer facing the vibration substrate layer and aligned with the central through hole. The buffer sheet is provided with a through hole; the blocking layer is fixed at the center of the side of the buffer sheet facing the vibration substrate layer, or at the side of the reinforcing layer near the blocking layer. The central through hole of the barrier layer, the barrier layer and the reinforcement layer are aligned with each other and the diameters increase in sequence. According to the invention, the blocking layer is introduced between the blocking layer and the vibration substrate layer, so that a three-stage ladder structure is formed in the transition cavity, and the abrupt change of the width of the flow channel is reduced, so that the vortex formed in the piezoelectric micropump is reduced, and the energy utilization efficiency is improved.
Description
Technical Field
The invention belongs to the technical field of piezoelectric gas micropumps, and particularly relates to a piezoelectric micropump for inhibiting internal vortex.
Background
Gas delivery is essential in many fields, such as gas analysis, gas detection, environmental monitoring, medical devices, etc. The conventional gas transmission method may have some limitations, such as large volume, slow response time, high energy consumption, and the like. Thus, there is a need for a more efficient, accurate and portable gas delivery solution. The piezoelectric micropump is an ideal gas transmission technology due to the characteristics of small volume, high response speed and low energy consumption. The piezoelectric micropump converts electrical energy into mechanical energy by using the inverse piezoelectric effect, and generates the flow and pressure of gas. The miniaturized structure and the highly integrated characteristic of the gas-liquid separator enable accurate gas transmission and control in a tiny space. But the structural design of the piezoelectric micropump plays an important role in its gas transmission performance. This includes aspects of the pump channel structure, valve design, pump chamber size, etc. By optimizing the pump configuration, higher gas flow, lower pressure drop and better control accuracy can be achieved.
In recent years, with the continuous development of piezoelectric micropump technology, many new senses are brought to the design of the micropump, and the structure and principle of the micropump are also diversified more and more. With the development of micro-fluidic technology, the demand for micro-piezoelectric pumps is increasing. Microfluidic technology can enable precise control and manipulation of gases on the micrometer to millimeter scale, thereby enabling more compact, efficient fluid delivery and handling systems, such as environmental detection and gas analysis, gas sensors and detection systems, medical devices, industrial process control, scientific research and experimental applications, and the like. Continuous advances in microelectromechanical processing (MEMS) technology provide significant support for the research and fabrication of micropumps. Micro-electromechanical processing technology is adopted to realize micron-sized structure preparation and high integration, and feasibility is provided for the realization of the micropump.
At present, the research of the piezoelectric micropump also faces a plurality of problems and challenges, and the piezoelectric pump researched at present needs to comprehensively consider research and optimization in aspects of material selection, structural design, manufacturing process, circuit driving and control algorithm and the like for the problems of size scaling, pressure output, flow control, energy consumption, reliability and the like of the micropump.
As shown in fig. 1, the conventional piezoelectric micropump structure needs to be provided with a buffer layer 121 between the barrier layer 102 and the vibration substrate layer 107, so as to avoid damage caused by direct impact on the barrier layer 102 with higher rigidity during vibration of the vibration substrate layer 107. The buffer layer 121 increases the number of layers of the piezoelectric micropump as a whole, so that the seams on the piezoelectric micropump increase, resulting in an increase in thickness and an increase in leakage risk;
in addition, a reinforcing layer 109 is required to be arranged on the side surface of the vibration substrate layer 107 facing the barrier layer 102 of the conventional piezoelectric micropump, so that when the vibration substrate layer 107 moves towards the barrier layer 102, the sealing of the central through hole on the barrier layer 102 is quickened, and the backflow is inhibited; however, the stiffening layer 109 may cause a large step of high shock to form in the transition cavity 111 between the vibration substrate layer 107 and the barrier layer 102; the large step is prone to eddy currents 122, resulting in reduced energy utilization of the piezoelectric micropump.
Disclosure of Invention
The invention aims to provide a novel piezoelectric micropump structure, which can realize a pump body structure with higher quality and more compactness, and simultaneously improve the stability and the sealing performance of the micropump. The piezoelectric micropump of the first embodiment of the present invention is divided into a flow inlet layer, a barrier layer, a buffer sheet embedded in the barrier layer, a blocking layer on the buffer sheet, a vibration substrate layer, an upper power supply layer, a housing layer, a reinforcing layer fixed on the side of the vibration substrate layer facing the barrier layer, and a vibration layer fixed on the side of the vibration substrate layer facing the housing layer. Wherein, there is the cavity between vibration substrate layer and the separation layer, between vibration layer and the casing layer.
The utility model provides a restrain inside vortex's piezoelectric micropump, includes intake layer, barrier layer, vibration substrate layer, goes up power supply layer, casing layer that stacks gradually to and buffer sheet and the barrier layer of setting on the barrier layer, reinforcing layer and the vibration layer of setting on vibration substrate layer. An input cavity is formed between the inflow layer and the barrier layer; a transition cavity is formed between the barrier layer and the vibration substrate layer; an output cavity is formed between the vibration substrate layer and the shell layer.
The reinforcing layer is fixed on the side surface of the vibration substrate layer, which faces the barrier layer; the vibration layer is fixed at the side of vibration substrate layer that deviates from the barrier layer. The barrier layer is provided with a central through hole and a buffer sheet. The buffer sheet is positioned on the side surface of the barrier layer facing the vibration substrate layer and aligned with the central through hole. The buffer sheet is provided with a through hole;
the blocking layer is fixed at the center of the side surface of the buffer sheet facing the vibration substrate layer, or is fixed on the side surface of the reinforcing layer, which is close to the blocking layer. The central through hole of the barrier layer, the barrier layer and the reinforcement layer are aligned with each other and the diameters increase in sequence.
Preferably, the blocking layer is fixed at a side center position of the buffer sheet facing the vibration substrate layer. The blocking layer and the buffer sheet are of an integrated structure.
Preferably, the barrier layer is secured to the side of the reinforcement layer adjacent to the barrier layer. The blocking layer and the reinforcing layer are of an integrated structure.
Preferably, the barrier layer is etched to form a mounting groove toward the side center of the vibration substrate layer. The buffer sheet is embedded into the mounting groove; the outer side of the buffer sheet is flush with the side of the barrier layer facing the vibration substrate layer.
Preferably, the vibration layer adopts piezoelectric ceramics, and one side away from the vibration substrate layer is led out to the first power supply terminal through the upper power supply layer; the second power supply terminal is led out through the barrier layer towards one side of the vibration substrate layer.
Preferably, the inlet layer is provided with a plurality of air inlets; the barrier layer is provided with a plurality of input flow passages which encircle the periphery of the central through hole. One end of each input runner is communicated with the central through hole of the barrier layer; the other end of each input runner is respectively communicated with each air inlet hole of the inlet layer.
Preferably, the length of the input runner on the barrier layer is 3mm-5mm, and the thickness is less than 300 mu m; the diameter of the mounting groove on the barrier layer 102 is 7mm-10mm, and the depth is 50 μm-70 μm; the aperture of the central through hole on the barrier layer is 5 mm-7 mm. The diameter of the buffer sheet is 7mm-10mm, and the thickness is 40 μm-60 μm; the blocking layer has a diameter of 2mm to 5mm and a thickness of 10 μm to 50 μm. The diameter of the through holes arranged on the buffer sheet and the blocking layer is 10-50 μm.
Preferably, the vibration substrate layer includes an edge fixing portion, an elastic connection member, and a central vibration portion. The edge of the central hole of the edge fixing part is connected with the outer edge of the central vibrating part through an elastic connecting piece. The elastic connecting piece comprises a first connecting part, a second connecting part and an elastic section. One end of the first connecting part is connected with the central vibrating part, and the other end of the first connecting part is connected with one end of the elastic section. One end of the second connecting part is connected with the other end of the elastic section; the other end of the second connecting part is connected with the edge fixing part. One end of the first connecting part is connected with the central vibrating part, and the other end of the first connecting part is connected with one end of the elastic section. One end of the second connecting part is connected with the other end of the elastic section; the other end of the second connecting part is connected with the edge fixing part. The elastic section is arc-shaped, and the center of the circle position coincides with the center point of the central vibration part.
Preferably, the reinforcing layer is integrally formed with the central vibration portion of the vibration substrate layer.
Preferably, the through hole on the buffer sheet is located at the center of the central through hole on the barrier layer.
The invention has the beneficial effects that:
1. according to the invention, the blocking layer is introduced between the blocking layer and the vibration substrate layer, so that a three-stage ladder structure is formed in the transition cavity, and the abrupt change of the width of the flow channel is reduced, so that the vortex formed in the piezoelectric micropump is reduced, and the energy utilization efficiency is improved.
2. According to the invention, the buffer sheet is embedded into the central through hole of the barrier layer, and the buffer sheet is used for replacing the buffer layer in the traditional piezoelectric micropump, so that the structure of the piezoelectric micropump is more compact, and the stability of the piezoelectric micropump in long-term use is improved.
3. The invention can realize the pulse injection of the fluid through the high-frequency vibration of the piezoelectric layer, thereby realizing the unidirectional high-mass flow transmission of the fluid.
Drawings
FIG. 1 is a schematic diagram of the internal structure of a conventional piezoelectric micropump;
FIG. 2 is a schematic view showing the internal structure of embodiment 1 of the present invention;
FIG. 3 is a first exploded view of embodiment 1 of the present invention;
FIG. 4 is a second exploded view of example 1 of the present invention;
FIG. 5 is a schematic view of the structure of the inflow layer in embodiment 1 of the present invention;
FIG. 6 is a schematic side view of the barrier layer facing the inlet layer in embodiment 1 of the present invention;
FIG. 7 is a schematic side view of a barrier layer facing away from an intake layer in embodiment 1 of the present invention;
FIG. 8 is a schematic view showing the structure of the buffer sheet and the blocking layer in example 1 of the present invention;
FIG. 9 is a schematic side view showing the structure of the vibration substrate layer facing the barrier layer in example 1 of the present invention;
FIG. 10 is a schematic side view of a vibration substrate layer facing away from a barrier layer in embodiment 1 of the present invention;
FIG. 11 is a schematic diagram of the structure of the upper power layer in embodiment 1 of the present invention;
FIG. 12 is a schematic view showing the internal structure of embodiment 2 of the present invention;
FIG. 13 is a schematic view showing the structure of the vibration substrate layer facing the barrier layer in embodiment 2 of the present invention;
FIG. 14 is a simulation comparison chart of the stepped through-flow structure of different stages in the embodiment 2 of the present invention.
Detailed Description
The first embodiment of the present invention will be further described with reference to the accompanying drawings.
As shown in fig. 2, 3 and 4, a piezoelectric micropump for suppressing internal vortex includes an inflow layer 100, a barrier layer 102, a vibration substrate layer 107, an upper power supply layer 112, a case layer 114, and a buffer sheet 104 and a blocking layer 105 provided on the barrier layer 102, and a reinforcing layer 109 and a vibration layer 110 provided on the vibration substrate layer 107, which are laminated in this order. An input cavity is formed between the intake layer 100 and the barrier layer 102; a transition cavity 111 is formed between the barrier layer 102 and the vibration substrate layer 107; an output cavity is formed between the vibration substrate layer 107 and the housing layer 114.
The inflow layer 100 is provided with a plurality of air inlets 101; the barrier layer 102 is provided with a central through hole 103, and a plurality of input flow channels surrounding the central through hole 103. One end of each input runner is communicated with the central through hole 103 of the barrier layer 102; the other end of each input flow channel is respectively communicated with each air inlet hole 101 of the inflow layer 100.
The barrier layer 102 is etched with a mounting groove toward the side center of the vibration substrate layer 107. The mounting groove and the central through hole 103 form a mounting stepped surface therebetween. The buffer sheet 104 is embedded in the mounting groove such that the outer side of the buffer sheet 104 is flush with the side of the barrier layer 102 facing the vibration substrate layer 107.
The blocking layer 105 is fixed at a side center position of the buffer sheet 104 toward the vibration substrate layer 107. In some embodiments, the stopper layer 105 is an integral structure with the bumper 104, i.e., the stopper layer 105 is a raised structure on the bumper 104 (specifically formed by etching at the outer lateral edge of the stopper layer 105).
The center positions of the buffer sheet 104 and the blocking layer 105 are provided with through holes 106; the through holes on the buffer sheet 104 are arranged coaxially with the central through holes 103 on the barrier layer 102, and the aperture of the through holes 106 on the buffer sheet 104 is smaller than the aperture of the central through holes 103 on the barrier layer 102.
The reinforcing layer 109 is fixed to the side of the vibration substrate layer 107 facing the barrier layer 102; the reinforcement layer 109 is aligned with the central through hole 103 of the barrier layer 102.
The vibration layer 110 is fixed to the side of the vibration substrate layer 107 facing away from the barrier layer 102.
The central through hole 103 aperture of the barrier layer 102, the diameter of the barrier layer 105, and the diameter of the reinforcement layer 109 are sequentially increased, so that the transition cavity 111 between the barrier layer 102 and the vibration substrate layer 107 forms a three-stage stepped through-flow structure 123 with gradually increasing height in the direction from the center to the edge. The stepped through-flow configuration helps to inhibit the formation of vortices in the fluid in the transition chamber 111, thereby improving energy utilization.
The power supply terminals of the positive and negative electrodes are respectively disposed on the barrier layer 102 and the power supply layer 112 for supplying power to the vibration layer 110.
As shown in FIG. 5, the inflow layer 100 has a side length of 10mm to 20mm and a thickness of 100 μm to 500 μm, and has a surface provided with a plurality of air intake holes 101 having a diameter of 0.5mm to 2mm, and can be used as a gas flow path. The material of the inflow layer 100 is one or a combination of a plurality of materials with larger heat conduction coefficient and smaller heat expansion coefficient, such as copper, silver, aluminum alloy and the like.
As shown in fig. 6 and 7, the barrier layer 102 is prepared by etching for 3 times to a thickness of less than 350 μm; the length of the input flow channel on the barrier layer 102 is 3mm-5mm, and the thickness is less than 300 mu m; the mounting grooves on the barrier layer 102 have a diameter of 7mm-10mm and a depth of 50 μm-70 μm; the aperture of the central through hole in the barrier layer 102 is 5mm to 7mm. The material of the barrier layer 102 is one or more of copper, silver, aluminum, and aluminum alloy.
As shown in FIG. 8, the diameter of the buffer sheet 104 is 7mm-10mm and the thickness is 40 μm-60. Mu.m; the blocking layer 105 has a diameter of 2mm-5mm and a thickness of 10 μm-50 μm. The diameter of the through holes 106 formed in the buffer sheet 104 and the blocking layer 105 is 10 μm to 50 μm. The through hole 106 and the central through hole 103 are communicated with the air inlet 101 to jointly form an input cavity of the pump body.
The vibration substrate layer 107 has a side length of 10 mm-20 mm, a thickness of 50 μm-500 μm, and is made of one or more materials including stainless steel 304, 430, 429, ni42, ni36, copper, silver, aluminum alloy, and the like, and has a thermal expansion coefficient of 5-10 um/(m×k), young's modulus of 190-220GPa, and Vickers hardness of 250-280 HV.
As shown in fig. 9 and 10, the vibration substrate layer 107 includes an edge fixing portion, an elastic connection member 108, and a central vibration portion. The edge of the central hole of the edge fixing part is connected with the outer edge of the central vibration part through an elastic connecting piece 108. The elastic connection 108 includes a first connection portion, a second connection portion, and an elastic segment. Wherein, the elastic section is convex, and length is 6mm-8mm, and thickness is 0.2mm-0.3mm, and the one end of first connecting portion is connected with central vibrating portion, and the other end of first connecting portion is connected with the one end of elastic section. One end of the second connecting part is connected with the other end of the elastic section; the other end of the second connecting part is connected with the edge fixing part. The elastic connecting pieces 108 are elastic and nonlinear metal strips, and the central vibration part of the vibration substrate layer 107 is elastically supported at four connection points of the edge fixing part through four elastic connecting pieces 108 (the elastic connecting pieces are distributed at 90 degrees); thus allowing the center vibration part to vibrate up and down with respect to the edge fixing part.
The reinforcing layer 109 and the vibration layer 110 are provided on both sides of the central vibration portion of the vibration substrate layer 107, respectively. The reinforcing layer 109 and the vibration substrate layer 107 are integrally formed; the reinforcing layer 109 is formed by etching the edge of the side face of the center vibration portion of the vibration substrate layer 107; the reinforcing layer 109 has a diameter of 2mm to 5mm and a height of 10 μm to 50. Mu.m.
The vibration layer 110 is a piezoelectric material with a high piezoelectric constant and a low loss, which has a diameter of 3mm to 6mm and a thickness of 50 μm to 300 μm, and is bonded to the side of the center vibration portion of the vibration substrate layer 107 away from the barrier layer 102; the material of the vibration layer 110 is one or more of aluminum nitride, scandium-doped aluminum nitride, zinc oxide, lithium nickelate, or lead zirconate titanate, specifically PZT4. The vibration layer 110 is bonded to the vibration substrate layer 107 specifically by one-component or two-component epoxy glue.
As shown in fig. 11, the upper power supply layer 112 is an upper power supply layer on the surface of the vibration substrate layer, which is responsible for supplying power to the surface of the vibration layer 110, which is far from the vibration substrate layer 107, and the internal terminal 113 is connected to the vibration node of the vibration layer 110 by welding, where the vibration amplitude is minimum, and the material is one or more materials with excellent conductivity such as copper, silver, gold, etc., and specifically is red copper T2.
The side length of the shell layer 114 is 10 mm-20 mm, one or more materials with higher hardness coefficients, such as copper, silver, aluminum and aluminum alloy, are selected, and are processed by a 3D printing or CNC machining mode, and an air outlet hole 115 communicated with the output cavity is formed in the center of the shell layer. The edge of the inner side surface of the shell layer 114 is fixed with the edge of the vibration substrate layer 107 and is not contacted with the vibration layer 110, and the transition cavity 111 on the vibration substrate layer 107 is communicated with the air outlet hole 115 arranged on the shell layer 114 through the output cavity to form an output flow channel of the pump body.
The vibration substrate layer 107, the reinforcing layer 109 and the vibration layer 110 form a piezoelectric vibrator, a rectangular wave signal with peak-to-peak value of 20Vpp, a first-order resonant frequency (about 23 kHz) and a phase difference of 180 ° is respectively applied to the power supply terminals of the barrier layer 102 and the power supply layer 112, when the vibration layer 110 receives the first half excitation signal, the vibration layer 110 drives the central vibration part of the vibration substrate layer 107 to move towards the shell layer 114 due to the inverse piezoelectric effect, the reinforcing layer 109 is forced to be separated from the blocking layer 105, at this time, the deformation of the vibration substrate layer 107 increases the volume of the transformation chamber, and external fluid is sucked into the input flow passage and the transformation chamber through the air inlet 101, the central through hole 103 on the barrier layer 102, the buffer sheet and the through hole 106 on the blocking layer. The fluid in the output flow channel is forced to be ejected from the ejection port to form propelling force.
When the vibration layer 110 receives the second half of excitation signal, the vibration layer drives the central vibration part of the vibration substrate layer 107 to move towards the blocking layer 102 due to the inverse piezoelectric effect, so that the reinforcing layer 109 is forced to prop against the through hole 106, and the blocking layer 105 at the moment has the effect of enabling the reinforcing layer 109 to better block the through hole 106, so that the effect of better sealing is achieved, the air inlet is blocked, the deformation of the vibration substrate layer 107 at the moment reduces the volume of the pressure-changing chamber, and fluid in the pressure-changing chamber is input into the output flow passage.
Thus, applying a periodic alternating voltage to the vibration layer 110 may allow unidirectional fluid transport within the cavity, and unidirectional fluid communication may continue at the gas outlet aperture 115.
Example 2
The piezoelectric micropump that suppresses internal vortex is different from embodiment 1 in that: the location of the blocking layer 105 is different.
As shown in fig. 12 and 13, in this embodiment, the blocking layer 105 is fixed to the side of the reinforcing layer 109 adjacent to the blocking layer 102. The blocking layer 105 coincides with the axis of the reinforcing layer 109. The center vibration portions of the stopper layer 105, the reinforcing layer 109, and the vibration substrate layer 107 are integrally formed by etching.
The aperture of the central through hole 103 of the barrier layer 102, the diameter of the blocking layer 105 and the diameter of the reinforcing layer 109 are sequentially increased, so that the transition cavity 111 between the central vibration part of the vibration substrate layer 107 and the barrier layer 102 forms a three-stage stepped through-flow structure with gradually increasing height in the direction from the center to the edge.
As shown in fig. 14, according to the simulation results, it can be found that the three-stage stepped through-flow structure can help to inhibit the fluid from forming vortex in the transition chamber 111 by comparing the first, second and third stages, thereby improving the energy utilization rate.
Claims (10)
1. A piezoelectric micropump for suppressing internal eddy current comprises an inflow layer (100), a barrier layer (102), a vibration substrate layer (107), an upper power supply layer (112) and a housing layer (114) which are laminated in order; the method is characterized in that: the vibration damping device further comprises a buffer sheet (104) and a blocking layer (105) which are arranged on the blocking layer (102), and a reinforcing layer (109) and a vibration layer (110) which are arranged on the vibration substrate layer (107); an input cavity is formed between the inflow layer (100) and the barrier layer (102); a transition cavity (111) is formed between the barrier layer (102) and the vibration substrate layer (107); an output cavity is formed between the vibration substrate layer (107) and the shell layer (114);
the reinforcing layer (109) is fixed on the side surface of the vibration substrate layer (107) facing the barrier layer (102); the vibration layer (110) is fixed on the side surface of the vibration substrate layer (107) facing away from the barrier layer (102); the barrier layer (102) is provided with a central through hole (103) and a buffer sheet (104); the buffer sheet (104) is positioned on the side surface of the barrier layer (102) facing the vibration substrate layer (107) and aligned with the central through hole (103); the buffer sheet (104) is provided with a through hole (106);
the blocking layer (105) is fixed on the side surface center position of the buffer sheet (104) facing the vibration substrate layer (107) or on the side surface of the reinforcing layer (109) close to the blocking layer (102); the central through hole (103) of the barrier layer (102), the blocking layer (105) and the reinforcing layer (109) are aligned with each other and the diameters thereof are sequentially increased.
2. A piezoelectric micropump that suppresses internal vortex as in claim 1 wherein: the blocking layer (105) is fixed at the side center position of the buffer sheet (104) facing the vibration substrate layer (107); the blocking layer (105) and the buffer sheet (104) are of an integrated structure.
3. A piezoelectric micropump that suppresses internal vortex as in claim 1 wherein: the blocking layer (105) is fixed on the side of the reinforcing layer (109) close to the blocking layer (102); the blocking layer (105) and the reinforcing layer (109) are of an integrally formed structure.
4. A piezoelectric micropump that suppresses internal vortex as in claim 1 wherein: the barrier layer (102) is etched towards the side center of the vibration substrate layer (107) to form a mounting groove; the buffer sheet (104) is embedded into the mounting groove; the outer side surface of the buffer sheet (104) is flush with the side surface of the barrier layer (102) facing the vibration substrate layer (107).
5. A piezoelectric micropump that suppresses internal vortex as in claim 1 wherein: the vibration layer (110) adopts piezoelectric ceramics, and one side of the vibration layer (107) facing away from the vibration substrate layer is led out to a first power supply terminal through an upper power supply layer (112); the second power supply terminal is led out through the barrier layer (102) towards one side of the vibration substrate layer (107).
6. A piezoelectric micropump that suppresses internal vortex as in claim 1 wherein: a plurality of air inlets (101) are formed in the inflow layer (100); the barrier layer (102) is provided with a plurality of input flow passages which encircle the periphery of the central through hole (103); one end of each input runner is communicated with a central through hole (103) of the barrier layer (102); the other end of each input runner is respectively communicated with each air inlet hole (101) of the inflow layer (100).
7. A piezoelectric micropump that suppresses internal vortex as in claim 6 wherein: the length of the input runner on the barrier layer (102) is 3mm-5mm, and the thickness is less than 300 mu m; the diameter of the mounting groove on the barrier layer 102 is 7mm-10mm, and the depth is 50 μm-70 μm; the aperture of the central through hole on the barrier layer (102) is 5 mm-7 mm; the diameter of the buffer sheet (104) is 7mm-10mm, and the thickness is 40 μm-60 μm; the diameter of the blocking layer (105) is 2mm-5mm, and the thickness is 10 mu m-50 mu m; the diameter of the through holes (106) arranged on the buffer sheet (104) and the blocking layer (105) is 10-50 μm.
8. A piezoelectric micropump that suppresses internal vortex as in claim 1 wherein: the vibration substrate layer (107) comprises an edge fixing part, an elastic connecting piece (108) and a central vibration part; the edge of the central hole of the edge fixing part is connected with the outer edge of the central vibrating part through an elastic connecting piece (108); the elastic connection (108) comprises a first connection part, a second connection part and an elastic section; one end of the first connecting part is connected with the central vibrating part, and the other end of the first connecting part is connected with one end of the elastic section; one end of the second connecting part is connected with the other end of the elastic section; the other end of the second connecting part is connected with the edge fixing part; one end of the first connecting part is connected with the central vibrating part, and the other end of the first connecting part is connected with one end of the elastic section; one end of the second connecting part is connected with the other end of the elastic section; the other end of the second connecting part is connected with the edge fixing part; the elastic section is arc-shaped, and the center of the circle position coincides with the center point of the central vibration part.
9. A piezoelectric micropump that suppresses internal vortex as in claim 8 wherein: the reinforcing layer (109) is integrally formed with the central vibration portion of the vibration substrate layer (107).
10. A piezoelectric micropump that suppresses internal vortex as in claim 1 wherein: the through hole on the buffer sheet (104) is positioned at the center of the center through hole (103) on the barrier layer (102).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310782602.6A CN116677591A (en) | 2023-06-29 | 2023-06-29 | Piezoelectric micropump capable of inhibiting internal vortex |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310782602.6A CN116677591A (en) | 2023-06-29 | 2023-06-29 | Piezoelectric micropump capable of inhibiting internal vortex |
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| Publication Number | Publication Date |
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| CN116677591A true CN116677591A (en) | 2023-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310782602.6A Pending CN116677591A (en) | 2023-06-29 | 2023-06-29 | Piezoelectric micropump capable of inhibiting internal vortex |
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| Country | Link |
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| CN (1) | CN116677591A (en) |
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- 2023-06-29 CN CN202310782602.6A patent/CN116677591A/en active Pending
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