CN116676564A - Trimming die coating and preparation method thereof - Google Patents
Trimming die coating and preparation method thereof Download PDFInfo
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- CN116676564A CN116676564A CN202310584109.3A CN202310584109A CN116676564A CN 116676564 A CN116676564 A CN 116676564A CN 202310584109 A CN202310584109 A CN 202310584109A CN 116676564 A CN116676564 A CN 116676564A
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- 238000009966 trimming Methods 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 238000007607 die coating method Methods 0.000 title claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 110
- 239000011248 coating agent Substances 0.000 claims abstract description 106
- 238000000151 deposition Methods 0.000 claims abstract description 79
- 238000009498 subcoating Methods 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims abstract description 24
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 230000008021 deposition Effects 0.000 claims description 77
- 238000005229 chemical vapour deposition Methods 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 42
- 239000012495 reaction gas Substances 0.000 claims description 35
- 239000010410 layer Substances 0.000 claims description 19
- 229910000831 Steel Inorganic materials 0.000 claims description 13
- 239000010959 steel Substances 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 12
- 229910000997 High-speed steel Inorganic materials 0.000 claims description 8
- 239000011247 coating layer Substances 0.000 claims description 8
- 239000013077 target material Substances 0.000 claims description 6
- 238000005240 physical vapour deposition Methods 0.000 claims description 5
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 4
- -1 titanium carbide nitride Chemical class 0.000 claims description 2
- 230000001427 coherent effect Effects 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 5
- 230000000052 comparative effect Effects 0.000 description 18
- 239000007789 gas Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/08—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal halides
- C23C16/14—Deposition of only one other metal element
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/36—Carbonitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/403—Oxides of aluminium, magnesium or beryllium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/341—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one carbide layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/347—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with layers adapted for cutting tools or wear applications
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- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The application relates to the technical field of materials, and discloses a trimming die coating and a preparation method thereof, wherein the trimming die coating comprises a substrate, at least one layer of coating, and the coatingComprises a first sub-coating W, a second sub-coating HT-TiCN and a third sub-coating Al 2 O 3 The coating comprises a TiN coating, a TiC coating and a TiCO coating, wherein one side of the TiC coating is deposited on one side of the first subcoat W, one side of the second subcoat HT-TiCN is deposited on one side of the TiN coating, one side of the TiC coating is deposited on one side of the second subcoat HT-TiCN, one side of the TiCO coating is deposited on one side of the TiC coating, and a third subcoat Al 2 O 3 According to the application, through depositing the first sub-coating W on the surface of the substrate preferentially, the substrate and the coating interface form coherent/semi coherent growth, and on the other hand, through depositing the coating with increased hardness gradient on the surface of the first sub-coating W to reduce residual stress, the combination of the two aspects can obviously improve the bonding strength between the trimming die substrate and the coating, thereby prolonging the service life of the tool.
Description
Technical Field
The application relates to the technical field of materials, in particular to a trimming die coating and a preparation method thereof.
Background
The hexagonal trimming die is an important tool in standard bolt production, the service performance and service life of the hexagonal trimming die directly influence the quality and production cost of a product, and the service life of the hexagonal trimming die and the quality of the product can be obviously improved by the coating.
Common trimming dies are M2 die steel (W6 Mo5Cr4V 2), high speed steel, and the like, with hard coatings (e.g., tiN, tiCN, al) deposited directly on the die steel and high speed steel substrate 2 O 3 Etc.) is generally poor in binding force due to the large difference in hardness between the hard coating and the substrate, the large difference in component elements between the substrate and the coating material, and the difficulty in forming coherent growth at the interface between the substrate and the coating, and therefore, a trimming die coating and a method for producing the same are proposed.
Disclosure of Invention
The application aims to provide a trimming die coating and a preparation method thereof, which aims to solve the problems that the common trimming die in the prior art comprises M2 die steel (W6 Mo5Cr4V 2), high-speed steel and the like, and directly deposit a hard coating (such as TiN, tiCN, al) on the die steel and a high-speed steel substrate 2 O 3 Etc.) is generally poor due to the large difference in hardness between the hard coating and the substrate, the large difference in component elements between the substrate and the coating material, and the difficulty in forming coherent growth at the interface between the substrate and the coating.
In order to achieve the above purpose, the present application provides the following technical solutions: a trimming die coating comprising a substrate and a number of layers of coating;
the coating isThe layer comprises a first sub-coating W, a second sub-coating HT-TiCN and a third sub-coating Al 2 O 3 The coating comprises a TiN coating, a TiC coating and a TiCO coating, wherein one side of the TiC coating is deposited on one side of a first subcoat W, one side of a second subcoat HT-TiCN is deposited on one side of the TiN coating, one side of the TiC coating is deposited on one side of the second subcoat HT-TiCN, one side of the TiCO coating is deposited on one side of the TiC coating, and the third subcoat Al 2 O 3 Is deposited on one side of the TiCO coating.
Preferably, one side of the first sub-coating W is deposited on one side of the substrate, and one side of at least one of the coatings is deposited on one side of the substrate.
Preferably, the atomic ratio of C/N of the HT-TiCN of the second sub-coating gradually increases from 0.25 to 4.0, and the HT-TiCN of the second sub-coating is made of high-temperature titanium carbide nitride.
Preferably, the first, second and third subcoats W, HT-TiCN and Al 2 O 3 The hardness of (2) increases in sequence.
Preferably, the third sub-coating layer Al 2 O 3 Is a face centered cubic kappa phase structure.
Preferably, the total thickness of the coating is 8-18 microns, and the total thickness of the coating is preferably 10-12 microns.
Preferably, the thickness of the first sub-coating layer W is 0.5-2 micrometers, the thickness of the TiN coating layer is 1-2 micrometers, the thickness of the second sub-coating layer HT-TiCN is 3-6 micrometers, the thickness of the TiC coating layer is 1-2 micrometers, the thickness of the TiCO coating layer is 0.5-1 micrometer, and the thickness of the third sub-coating layer Al 2 O 3 The thickness of (2) is 2-5 microns.
Preferably, the substrate is hot work die steel or high speed steel.
The application also provides a preparation method of the trimming die coating, which comprises the following steps:
s1, preparing a first sub-coating W, wherein the preparation of the first sub-coating W can be obtained by adopting a physical vapor deposition magnetron sputtering method or a chemical vapor deposition method;
physical vapor deposition magnetron sputtering method: wherein the deposition temperature is 400-600 ℃, the deposition pressure is 0.01-0.1 mbar, the target material is a pure W target, the power of the target material is 5-10 kw, and Ar is introduced into a furnace chamber during deposition;
chemical vapor deposition method: wherein the deposition temperature is 900-1050 ℃, the deposition pressure is 50-100mbar, and the reaction gas comprises WCl 6 And H 2 ；
S2, preparing a TiN coating by adopting a chemical vapor deposition method, wherein the deposition temperature is 900-1000 ℃, the deposition pressure is 50-200mbar, and the reaction gas comprises TiCl 4 、N 4 And H 2 ；
S3, preparing a second sub-coating HT-TiCN by adopting a chemical vapor deposition method, wherein the deposition temperature is 900-1050 ℃, the deposition pressure is 50-200mbar, and the reaction gas comprises TiCl 4 、N 2 、CH 4 And H 2 ；
S4, preparing TiC coating by adopting a chemical vapor deposition method, wherein the deposition temperature is 900-1050 ℃, the deposition pressure is 50-200mbar, and the reaction gas comprises TiCl 4 、CH 4 And H 2 ；
S5, preparing TiCO coating by adopting a chemical vapor deposition method, wherein the deposition temperature is 900-1050 ℃, the deposition pressure is 50-200mbar, and the reaction gas comprises TiCl 4 、CO、CH 4 And H 2 ；
S6, third subcoat Al 2 O 3 The preparation method comprises preparing by chemical vapor deposition at 900-1050 deg.C under 50-100mbar, wherein the reaction gas comprises AlCl 3 、CO 2 、H 2 S and H 2 。
Compared with the prior art, the technical scheme provided by the application has the following technical effects: according to the application, the first sub-coating W is deposited on the surface of the substrate preferentially, so that the substrate and the coating interface form coherent/semi coherent growth, on the other hand, the coating with gradient increased hardness is deposited on the surface of the first sub-coating W to reduce residual stress, and the bonding strength between the trimming die substrate and the coating can be obviously improved by combining the two aspects, so that the service life of the tool is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional structure of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "first," "second," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate describing the application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of a plurality of "a number" is two or more, unless explicitly defined otherwise.
It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for the purpose of understanding and reading the disclosure, and are not intended to limit the scope of the application, which is defined by the claims, but rather by the claims, unless otherwise indicated, and that any structural modifications, proportional changes, or dimensional adjustments, which would otherwise be apparent to those skilled in the art, would be made without departing from the spirit and scope of the application.
Example 1
In the prior art, common trimming dies are M2 die steel (W6 Mo5Cr4V 2), high speed steel and the like, and hard coatings (such as TiN, tiCN, al) are directly deposited on the die steel and the high speed steel matrix 2 O 3 Etc.) are generally poor in binding force due to the large difference in hardness between the hard coating and the substrate, the large difference in component elements between the substrate and the coating material, and the difficulty in forming coherent growth at the interface between the substrate and the coating.
Referring to fig. 1, the present application provides a technical solution:
the matrix material is M2 die steel, and the multilayer coating is sequentially deposited on the surface of the matrix, and the preparation method comprises the following steps:
s1, preparing a first sub-coating W by adopting a chemical vapor deposition method, wherein the deposition parameter is 1000 ℃, the deposition pressure is 70mbar, and the reaction gas comprises WCl 6 And H 2 The thickness of the coating is 1.0 micron;
s2, preparing a TiN layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 950 ℃, the deposition pressure is 100mbar, and the reaction gas comprises TiCl 4 、N 4 And H 2 The thickness of the coating is 1.5 micrometers;
s3, preparing a second sub-coating HT-TiCN by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 100mbar, and the reaction gas comprises TiCl 4 、N 2 、CH 4 And H 2 The C/N atomic ratio of the HT-TiCN coating gradually increases from 0.25 to 4.0, and the thickness of the coating is 4.5 microns;
s4, preparing a TiC layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 150mbar, and the reaction gas comprises TiCl 4 、CH 4 And H 2 The thickness of the coating is 1.5 micrometers;
s5, preparing a TiCO layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 150mbar, and the reaction gas comprises TiCl 4 、CO、CH 4 And H 2 The thickness of the coating is 1.0 micron;
s6, third subcoat Al 2 O 3 The preparation method comprises preparing by chemical vapor deposition at 1020 deg.C under 80mbar, and reacting gas including AlCl 3 、CO 2 、H 2 S and H 2 ，Al 2 O 3 The coating thickness was 4.0 microns for the face centered cubic kappa phase structure.
Example two
The first difference between this embodiment and the first embodiment is that:
the matrix material is M2 die steel, and the multilayer coating is sequentially deposited on the surface of the matrix, and the preparation method comprises the following steps:
s1, preparing a first sub-coating W by adopting a physical vapor deposition method, wherein the deposition temperature is 500 ℃, the deposition pressure is 0.05mbar, the target material is a pure W target, the power of the target material is 8kw, ar is introduced into a furnace chamber during deposition, and the thickness of the coating is 1.0 micrometer;
s2, preparing a TiN layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 950 ℃, the deposition pressure is 100mbar, and the reaction gas comprises TiCl 4 、N 4 And H 2 The thickness of the coating is 1.5 micrometers;
s3, preparing a second sub-coating HT-TiCN by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 100mbar, and the reaction gas comprises TiCl 4 、N 2 、CH 4 And H 2 The C/N atomic ratio of the HT-TiCN coating gradually increases from 0.25 to 4.0, and the thickness of the coating is 4.5 microns;
s4, preparing a TiC layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 150mbar, and the reaction gas comprises TiCl 4 、CH 4 And H 2 The thickness of the coating is 1.5 micrometers;
s5, preparing a TiCO layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 150mbar, and the reaction gas comprisesTiCl 4 、CO、CH 4 And H 2 The thickness of the coating is 1.0 micron;
s6, third subcoat Al 2 O 3 The preparation method comprises preparing by chemical vapor deposition at 1020 deg.C under 80mbar, and reacting gas including AlCl 3 、CO 2 、H 2 S and H 2 ，Al 2 O 3 The coating thickness was 4.0 microns for the face centered cubic kappa phase structure.
Comparative example one
The matrix material is M2 die steel, and the multilayer coating is sequentially deposited on the surface of the matrix, and the preparation method comprises the following steps:
s1, preparing a first sub-coating W by adopting a chemical vapor deposition method, wherein the deposition parameter is 1000 ℃, the deposition pressure is 70mbar, and the reaction gas comprises WCl 6 And H 2 The thickness of the coating is 1.0 micron;
s2, preparing a TiN layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 950 ℃, the deposition pressure is 100mbar, and the reaction gas comprises TiCl 4 、N 4 And H 2 The thickness of the coating is 1.5 micrometers;
s3, preparing a second sub-coating HT-TiCN by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 100mbar, and the reaction gas comprises TiCl 4 、N 2 、CH 4 And H 2 The C/N atomic ratio of the HT-TiCN coating is equal to 0.5, and the thickness of the coating is 4.5 micrometers;
s4, preparing a TiC layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 150mbar, and the reaction gas comprises TiCl 4 、CH 4 And H 2 The thickness of the coating is 1.5 micrometers;
s5, preparing a TiCO layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 150mbar, and the reaction gas comprises TiCl 4 、CO、CH 4 And H 2 The thickness of the coating is 1.0 micron;
s6, third subcoat Al 2 O 3 The preparation method comprises preparing by chemical vapor deposition at 1020 deg.C under 80mbar, and reacting gas including AlCl 3 、CO 2 、H 2 S and H 2 ，Al 2 O 3 The coating thickness was 4.0 microns for the face centered cubic kappa phase structure.
Comparative example two
The first difference between this comparative example and the comparative example is:
the matrix material is M2 die steel, and the multilayer coating is sequentially deposited on the surface of the matrix, and the preparation method comprises the following steps:
s1, preparing a TiN layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 950 ℃, the deposition pressure is 100mbar, and the reaction gas comprises TiCl 4 、N 4 And H 2 The thickness of the coating is 1.5 micrometers;
s2, preparing a second sub-coating HT-TiCN by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 100mbar, and the reaction gas comprises TiCl 4 、N 2 、CH 4 And H 2 The C/N atomic ratio of the HT-TiCN coating gradually increases from 0.25 to 4.0, and the thickness of the coating is 4.5 microns;
s3, preparing a TiC layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 150mbar, and the reaction gas comprises TiCl 4 、CH 4 And H 2 The thickness of the coating is 1.5 micrometers;
s4, preparing a TiCO layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 150mbar, and the reaction gas comprises TiCl 4 、CO、CH 4 And H 2 The thickness of the coating is 1.0 micron;
s5, third subcoat Al 2 O 3 The preparation method comprises preparing by chemical vapor deposition at 1020 deg.C under 80mbar, and reacting gas including AlCl 3 、CO 2 、H 2 S and H 2 ，Al 2 O 3 The coating thickness was 4.0 microns for the face centered cubic kappa phase structure.
Comparative example three
This comparative example differs from comparative example one and comparative example two in that:
the matrix material is M2 die steel, and the multilayer coating is sequentially deposited on the surface of the matrix, and the preparation method comprises the following steps:
s1, first sub-coatingThe layer W is prepared by chemical vapor deposition method, the deposition parameter is 1000 ℃, the deposition pressure is 70mbar, and the reaction gas comprises WCl 6 And H 2 The thickness of the coating is 1.0 micron;
s2, preparing a TiN layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 950 ℃, the deposition pressure is 100mbar, and the reaction gas comprises TiCl 4 、N 4 And H 2 The thickness of the coating is 1.5 micrometers;
s3, preparing a second sub-coating HT-TiCN by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 100mbar, and the reaction gas comprises TiCl 4 、N 2 、CH 4 And H 2 The C/N atomic ratio of the HT-TiCN coating is equal to 0.5, and the thickness of the coating is 4.5 micrometers;
s4, preparing a TiC layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 150mbar, and the reaction gas comprises TiCl 4 、CH 4 And H 2 The thickness of the coating is 1.5 micrometers;
s5, preparing a TiCO layer by adopting a chemical vapor deposition method, wherein the deposition temperature is 1000 ℃, the deposition pressure is 150mbar, and the reaction gas comprises TiCl 4 、CO、CH 4 And H 2 The thickness of the coating is 1.0 micron;
s6, third subcoat Al 2 O 3 The preparation method comprises preparing by chemical vapor deposition at 1020 deg.C under 80mbar, and reacting gas including AlCl 3 、CO 2 、H 2 S and H 2 ，Al 2 O 3 The coating thickness was 4.0 microns for a close packed hexagonal alpha phase structure.
The film-based bonding force comparison data of the first example, the second example, the first comparative example, the second comparative example and the third comparative example are as follows:
| sample of | Film base binding force (N) |
| Example 1 | 105 |
| Example 2 | 100 |
| Comparative example 1 | 90 |
| Comparative example 2 | 82 |
| Comparative example 3 | 95 |
The service life of the stainless steel bolts used in the processing 304 of the first and second embodiments and the first, second and third comparative examples are compared with the following data:
| sample of | Average life (ten thousand times) |
| Example 1 | 1.1 |
| Example 2 | 0.95 |
| Comparative example 1 | 0.81 |
| Comparative example 2 | 0.65 |
| Comparative example 3 | 0.75 |
In summary, the first sub-coating W is deposited on the surface of the substrate preferentially, so that the coherent/semi-coherent growth is formed at the interface between the substrate and the coating, and on the other hand, the coating with gradient increased hardness is deposited on the surface of the coating of the first sub-coating W to reduce residual stress, and the combination of the two aspects can obviously improve the bonding strength between the substrate and the coating of the trimming die, so that the service life of the tool is prolonged.
Thus, embodiments of the present application have been described in detail with reference to the accompanying drawings. It should be noted that, in the drawings or the text of the specification, implementations not shown or described are all forms known to those of ordinary skill in the art, and not described in detail. Furthermore, the above definitions of the components are not limited to the specific structures, shapes or modes mentioned in the embodiments, and may be simply modified or replaced by those of ordinary skill in the art.
It should also be noted that in the embodiments of the present application, unless otherwise known, numerical parameters in the present specification and attached claims are approximations that may vary depending upon the desired properties sought to be obtained by the present application. In particular, all numbers expressing dimensions, range conditions, and so forth, used in the specification and claims are to be understood as being modified in all instances by the term "about". In general, the meaning of expression is meant to include a variation of + -10% in some embodiments, a variation of + -5% in some embodiments, a variation of + -1% in some embodiments, and a variation of + -0.5% in some embodiments by a particular amount.
Those skilled in the art will appreciate that the features recited in the various embodiments of the application and/or in the claims may be combined in various combinations and/or combinations, even if such combinations or combinations are not explicitly recited in the application. In particular, the features recited in the various embodiments of the application and/or in the claims can be combined in various combinations and/or combinations without departing from the spirit and teachings of the application. All such combinations and/or combinations fall within the scope of the application.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the application, and is not meant to limit the application thereto, but to limit the application thereto, and any modifications, equivalents, improvements and equivalents thereof may be made without departing from the spirit and principles of the application.
Claims (9)
1. A trimming die coating, characterized in that: comprising a substrate and a coating layer in at least one layer;
the coating comprises a first sub-coating W, a second sub-coating HT-TiCN and a third sub-coating Al 2 O 3 The coating comprises a TiN coating, a TiC coating and a TiCO coating, wherein one side of the TiC coating is deposited on one side of a first subcoat W, one side of a second subcoat HT-TiCN is deposited on one side of the TiN coating, one side of the TiC coating is deposited on one side of the second subcoat HT-TiCN, one side of the TiCO coating is deposited on one side of the TiC coating, and the third subcoat Al 2 O 3 Is deposited on one side of the TiCO coating.
2. A trimming die coating according to claim 1, wherein: one side of the first sub-coating W is deposited on one side of the substrate and one side of at least one of the coatings is deposited on one side of the substrate.
3. A trimming die coating according to claim 1, wherein: the C/N atomic ratio of the HT-TiCN of the second sub-coating gradually increases from 0.25 to 4.0, and the HT-TiCN of the second sub-coating is made of high-temperature titanium carbide nitride.
4. According to claimA trimming die coating as defined in claim 1, wherein: the first sub-coating W, the second sub-coating HT-TiCN and the third sub-coating Al 2 O 3 The hardness of (2) increases in sequence.
5. A trimming die coating according to claim 1, wherein: the third sub-coating Al 2 O 3 Is a face centered cubic kappa phase structure.
6. A trimming die coating according to claim 1, wherein: the total thickness of the coating is 8-18 microns, and the total thickness of the coating is preferably 10-12 microns.
7. A trimming die coating according to claim 6, wherein: the thickness of the first sub-coating W is 0.5-2 microns, the thickness of the TiN coating is 1-2 microns, the thickness of the second sub-coating HT-TiCN is 3-6 microns, the thickness of the TiC coating is 1-2 microns, the thickness of the TiCO coating is 0.5-1 micron, and the thickness of the third sub-coating Al 2 O 3 The thickness of (2) is 2-5 microns.
8. A trimming die coating according to claim 1, wherein: the matrix is hot work die steel or high-speed steel.
9. The method of preparing a cut off die coating according to claims 1-8, comprising the steps of:
s1, preparing a first sub-coating W, wherein the preparation of the first sub-coating W can be obtained by adopting a physical vapor deposition magnetron sputtering method or a chemical vapor deposition method;
physical vapor deposition magnetron sputtering method: wherein the deposition temperature is 400-600 ℃, the deposition pressure is 0.01-0.1 mbar, the target material is a pure W target, the power of the target material is 5-10 kw, and Ar is introduced into a furnace chamber during deposition;
chemical vapor deposition method: wherein the deposition temperature is 900-1050 ℃, the deposition pressure is 50-100mbar, and the reaction gas comprises WCl 6 And H 2 ；
S2, preparing a TiN coating by adopting a chemical vapor deposition method, wherein the deposition temperature is 900-1000 ℃, the deposition pressure is 50-200mbar, and the reaction gas comprises TiCl 4 、N 4 And H 2 ；
S3, preparing a second sub-coating HT-TiCN by adopting a chemical vapor deposition method, wherein the deposition temperature is 900-1050 ℃, the deposition pressure is 50-200mbar, and the reaction gas comprises TiCl 4 、N 2 、CH 4 And H 2 ；
S4, preparing TiC coating by adopting a chemical vapor deposition method, wherein the deposition temperature is 900-1050 ℃, the deposition pressure is 50-200mbar, and the reaction gas comprises TiCl 4 、CH 4 And H 2 ；
S5, preparing TiCO coating by adopting a chemical vapor deposition method, wherein the deposition temperature is 900-1050 ℃, the deposition pressure is 50-200mbar, and the reaction gas comprises TiCl 4 、CO、CH 4 And H 2 ；
S6, third subcoat Al 2 O 3 The preparation is carried out by adopting a chemical vapor deposition method, wherein the deposition temperature is 900-1050 ℃, the deposition pressure is 50-100mbar, and the reaction gas comprises AlCl 3 、CO 2 、H 2 S and H 2 。
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