CN116675976A - Mixed wave-absorbing material for blocking electromagnetic interference - Google Patents
Mixed wave-absorbing material for blocking electromagnetic interference Download PDFInfo
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- CN116675976A CN116675976A CN202310854375.3A CN202310854375A CN116675976A CN 116675976 A CN116675976 A CN 116675976A CN 202310854375 A CN202310854375 A CN 202310854375A CN 116675976 A CN116675976 A CN 116675976A
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- powder
- absorbing material
- hybrid wave
- shielding
- epoxy resin
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- 239000011358 absorbing material Substances 0.000 title claims abstract description 76
- 230000000903 blocking effect Effects 0.000 title claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 108
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 239000011344 liquid material Substances 0.000 claims abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 13
- 229910010293 ceramic material Inorganic materials 0.000 claims description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 22
- 239000004814 polyurethane Substances 0.000 claims description 22
- 229920002635 polyurethane Polymers 0.000 claims description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 20
- 239000010445 mica Substances 0.000 claims description 20
- 229910052618 mica group Inorganic materials 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 20
- 239000004642 Polyimide Substances 0.000 claims description 19
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 229920001721 polyimide Polymers 0.000 claims description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- -1 metallic aluminum compound Chemical class 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- 239000007770 graphite material Substances 0.000 claims description 12
- 150000002681 magnesium compounds Chemical class 0.000 claims description 12
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 229920005749 polyurethane resin Polymers 0.000 claims description 6
- 229920000459 Nitrile rubber Polymers 0.000 claims description 5
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 239000000839 emulsion Substances 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 21
- 238000000576 coating method Methods 0.000 abstract description 21
- 150000002148 esters Chemical class 0.000 abstract description 8
- 238000005507 spraying Methods 0.000 abstract description 6
- 230000008054 signal transmission Effects 0.000 abstract description 4
- 206010035148 Plague Diseases 0.000 abstract description 3
- 241000607479 Yersinia pestis Species 0.000 abstract description 3
- 229910052759 nickel Inorganic materials 0.000 description 8
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 6
- 229910052749 magnesium Inorganic materials 0.000 description 6
- 239000011777 magnesium Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000007769 metal material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000011056 performance test Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
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- RXKJFZQQPQGTFL-UHFFFAOYSA-N dihydroxyacetone Chemical compound OCC(=O)CO RXKJFZQQPQGTFL-UHFFFAOYSA-N 0.000 description 1
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- 238000009713 electroplating Methods 0.000 description 1
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- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0856—Iron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a mixed wave-absorbing material for blocking electromagnetic interference. Compared with the prior art, the invention adopts various metal powder and ester materials with different interference frequency ranges, and mixes the metal powder and the ester materials according to different material ratios, so that the liquid materials can be formed by solvents, and the liquid materials can be adsorbed on articles to be protected in the modes of coating, adsorbing, spraying, extruding and the like, thereby improving the shielding rate and the protection rate, and simultaneously effectively absorbing electromagnetic interference of different frequency ranges and noise problems which plague signal transmission of cables.
Description
Technical Field
The invention belongs to the technical field of wave-absorbing materials, and particularly relates to a mixed wave-absorbing material for blocking electromagnetic interference.
Background
The wave absorbing material is a functional material capable of absorbing and attenuating electromagnetic wave energy incident in space and reducing or eliminating reflected electromagnetic wave, and is generally formed by compounding a base material and a loss medium. The energy of the microblog is consumed by absorption through small polar molecules. According to the rule that electromagnetic waves propagate in a medium from low magnetic conduction to high magnetic conduction, the high-permeability ferrite is utilized to guide the electromagnetic waves, the radiant energy of the electromagnetic waves is absorbed in a large quantity through resonance, and then the energy of the electromagnetic waves is converted into heat energy through coupling. Electromagnetic waves induce an electric current in a material, and the electric current is hindered from being transmitted inside the material and converted into an internal energy. The greater the conductivity, the greater the macroscopic current induced by the carriers (electric field induced current and magnetic field induced eddy current) facilitates the conversion of electromagnetic energy into thermal energy.
At present, the wave absorbing material is used for preventing interference in a way of blocking electromagnetic interference waves by utilizing characteristics of metal or conductive particles and nonmetal.
However, the existing wave-absorbing material needs to be made of cloth or foam, and conductive materials are attached to the inside and the surface of the material in the modes of electroplating, extrusion and the like, so that the adopted conductive materials cannot be widely applied to various articles due to the fact that the production process of the conductive materials is limited, and the range and the performance of a shielding frequency range are limited.
The wave absorbing material is a solid product, and the wave absorbing material is required to be attached to an object to be protected by the aid of the adhesive tape, and is limited in shape, so that the object to be protected cannot be perfectly protected, the shielding performance is imperfect, and the shielding efficiency is reduced.
Besides being attached to the surface of an article, the shielding cover can be made of a wave-absorbing material for protection, but the shielding cover is generally made of metal and nonmetal solid materials and is made of a single material, and when the single metal material is used for shielding electromagnetic interference waves, the single metal material is limited by the single material and cannot meet the requirement of complex shielding environment, so that various shielding rings, flexible shielding materials and the like are required to be added for reinforcement.
In the prior art, materials such as a metal woven net and a metal film are used for coating the wire and the cable in the shielding requirement of the wire and the cable, but the prior shielding material has the defects of poor shielding performance, poor production efficiency, poor flexibility of the wire and the cable and the like due to poor singleness and flexibility of the prior shielding material.
Disclosure of Invention
In view of the above, the present invention provides a liquid mixed wave absorbing material for blocking electromagnetic interference.
The invention provides a mixed wave-absorbing material for blocking electromagnetic interference, which comprises the following components:
preferably, the metallic aluminum compound is selected from aluminum hydroxide and/or aluminum oxide;
the metal magnesium compound is selected from magnesium hydroxide;
the carbon powder is selected from conductive carbon black and/or common carbon black;
the ceramic material is selected from one or more of silicon carbide ceramic material, silicon nitride ceramic material and silicon dioxide ceramic material;
the mica material is selected from sericite and/or conductive mica powder;
the polyurethane material is selected from solvent type multi-component polyurethane and/or aqueous polyurethane resin;
the viscosity of the solvent type multi-component polyurethane is 100-6000mPa.s at 25 ℃;
the viscosity of the aqueous polyurethane resin is 10-2000 mPa.s at 25 ℃;
the polyimide material is selected from polyimide adhesives and/or bismaleimide adhesives; the viscosity of the polyimide material at 25 ℃ is 500-3000 Pa.s;
the acrylic material is selected from polyurethane modified acrylic ester and/or aqueous acrylic emulsion; the viscosity of the acrylic material at 25 ℃ is 10-1200 mpa.s;
the epoxy resin material is selected from one or more of phenolic resin, bisphenol A epoxy resin and nitrile rubber modified epoxy resin.
Preferably, the particle sizes of the silver powder, the copper powder, the nickel powder, the iron powder, the manganese powder, the carbon powder, the graphite material, the ceramic material and the mica material are respectively and independently smaller than 75 μm;
the particle sizes of the metal aluminum compound and the metal magnesium compound are respectively smaller than 45 mu m.
Preferably, the method comprises the steps of:
preferably, the shielding frequency band of the mixed wave absorbing material is 30 MHz-20 GHz.
Preferably, the method comprises the steps of:
preferably, the shielding frequency band of the mixed wave absorbing material is 30 MHz-20 GHz. Preferably, the method comprises the steps of:
preferably, the shielding frequency band of the mixed wave absorbing material is 30 MHz-40 GHz.
The invention also provides a preparation method of the mixed wave-absorbing material for blocking electromagnetic interference, which comprises the following steps:
mixing silver powder, copper powder, nickel powder, metal aluminum compound, metal magnesium compound, iron powder, manganese powder, carbon powder, graphite material, ceramic material, mica material, polyurethane material, polyimide material, acrylic material and epoxy resin material, and then converting into liquid material by using a solvent;
and solidifying the liquid material to obtain the mixed wave-absorbing material.
The invention provides a mixed wave-absorbing material for blocking electromagnetic interference, which comprises the following components: 0.1 to 30 parts by weight of silver powder; 0.5 to 60 parts by weight of copper powder; 1-50 parts by weight of nickel powder; 1-50 parts by weight of a metal aluminum compound; 0.5 to 50 parts by weight of a metal magnesium compound; 0.5 to 30 parts by weight of iron powder; 0.5 to 30 weight portions of manganese powder; 0.5 to 30 parts by weight of carbon powder; 0.01 to 20 parts by weight of graphite material; 0.1 to 30 parts by weight of ceramic material; 0.01 to 30 parts by weight of mica material; 25-50 parts of polyurethane materials; 25-50 parts of polyimide material; 1 to 50 parts by weight of acrylic material and/or epoxy resin material. Compared with the prior art, the invention adopts various metal powder and ester materials with different interference frequency ranges, and mixes the metal powder and the ester materials according to different material ratios, so that the liquid materials can be formed by solvents, and the liquid materials can be adsorbed on articles to be protected in the modes of coating, adsorbing, spraying, extruding and the like, thereby improving the shielding rate and the protection rate, and simultaneously effectively absorbing electromagnetic interference of different frequency ranges and noise problems which plague signal transmission of cables.
Drawings
FIG. 1 is a schematic diagram of a preparation flow of a hybrid wave-absorbing material according to the present invention;
fig. 2 is a schematic structural diagram of the hybrid wave absorbing material applied to a shielding case material;
fig. 3 is a schematic structural diagram of the hybrid wave-absorbing material applied to an electric wire and cable;
FIG. 4 is a graph showing the detection result of shielding effectiveness of the hybrid wave-absorbing material obtained in example 1 of the present invention;
FIG. 5 is a graph showing the detection result of shielding effectiveness of the hybrid wave-absorbing material obtained in example 2 of the present invention;
FIG. 6 is a graph showing the detection result of shielding effectiveness of the hybrid wave-absorbing material obtained in example 3 of the present invention;
FIG. 7 is a graph showing the detection result of shielding effectiveness of the hybrid wave-absorbing material obtained in example 4 of the present invention;
FIG. 8 is a graph showing the detection result of shielding effectiveness of the hybrid wave-absorbing material obtained in example 5 of the present invention;
fig. 9 is a graph showing the detection result of shielding effectiveness of the hybrid wave-absorbing material obtained in example 6 of the present invention.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides a mixed wave-absorbing material for blocking electromagnetic interference, which comprises the following components:
the wave-absorbing material provided by the invention is a mixed wave-absorbing material and comprises a plurality of metal materials.
Wherein the particle size of the silver powder is preferably less than 75 μm, more preferably less than 50 μm, still more preferably less than 30 μm, still more preferably 1 to 20 μm, and most preferably 3 to 15 μm; the shape of the silver powder is not particularly limited, but is preferably one or more of a plate shape, a dendritic shape and a spherical shape.
The particle size of the copper powder is preferably less than 75 μm, more preferably less than 50 μm, still more preferably less than 30 μm, still more preferably 1 to 20 μm, most preferably 3 to 15 μm; the shape of the copper powder is not particularly limited, but is preferably one or more of a flake, a tree, and a sphere.
The particle size of the nickel powder is preferably less than 75 μm, more preferably less than 50 μm, still more preferably less than 30 μm, still more preferably 1 to 20 μm, most preferably 3 to 15 μm; the shape of the nickel powder is not particularly limited, but is preferably a flake nickel carbonyl powder and/or a spherical nickel powder.
The particle size of the metallic aluminum compound is preferably less than 45 μm, more preferably less than 40 μm, still more preferably less than 30 μm, still more preferably 1 to 20 μm, and most preferably 3 to 15 μm; the metal aluminum compound is not particularly limited as long as it is a compound containing aluminum element well known to those skilled in the art, and preferably includes, but is not limited to, aluminum hydroxide and/or aluminum oxide.
The particle size of the metal magnesium compound is preferably less than 45 μm, more preferably less than 40 μm, still more preferably less than 30 μm, still more preferably 1 to 20 μm, most preferably 3 to 15 μm; the metal magnesium compound is a compound containing magnesium element, which is well known to those skilled in the art, and is not particularly limited, and the present invention preferably includes, but is not limited to, magnesium hydroxide.
The particle size of the iron powder is preferably less than 75 μm, more preferably less than 50 μm, still more preferably less than 30 μm, still more preferably 1 to 20 μm, most preferably 3 to 15 μm; the shape of the iron powder is not particularly limited, but is preferably a flake iron powder and/or a spherical nickel carbonyl powder.
The particle size of the manganese powder is preferably less than 75 μm, more preferably less than 50 μm, still more preferably less than 30 μm, still more preferably 1 to 20 μm, most preferably 3 to 15 μm; the shape of the manganese powder is not particularly limited, and spherical manganese powder is preferable.
The particle size of the carbon powder is preferably less than 75 μm, more preferably less than 50 μm, still more preferably less than 30 μm, still more preferably 1 to 20 μm, and most preferably 3 to 15 μm; the kind of carbon powder is not particularly limited in the present invention, and conductive carbon black and/or ordinary carbon black are preferable.
The particle size of the graphite material is preferably less than 75 μm, more preferably less than 50 μm, still more preferably less than 30 μm, still more preferably 1 to 20 μm, most preferably 3 to 15 μm; the shape of the graphite material is not particularly limited, but a sheet material is preferable.
The particle size of the ceramic material is preferably less than 75 μm, more preferably less than 50 μm, still more preferably less than 30 μm, still more preferably 1 to 20 μm, most preferably 3 to 15 μm; the shape of the ceramic material is not particularly limited in the present invention, and preferably spherical ceramic material and/or plate-like ceramic material; the types of the ceramic materials include, but are not limited to, one or more of silicon carbide ceramic materials, silicon nitride ceramic materials, and silicon dioxide ceramic materials.
The particle size of the mica material is preferably less than 75 μm, more preferably less than 50 μm, still more preferably less than 30 μm, still more preferably 1 to 20 μm, most preferably 3 to 15 μm; the shape of the mica material is not particularly limited in the present invention, and is preferably a granular mica material and/or a flaky mica material; the kind of the mica material includes, but is not limited to, sericite and/or conductive mica powder.
In the present invention, the polyurethane-based material is preferably a polyurethane adhesive, more preferably includes, but is not limited to, solvent-type multi-component polyurethane and/or aqueous polyurethane resin; the viscosity of the solvent-type multicomponent polyurethane at 25 ℃ is preferably 100-6000mpa.s; the solid content of the solvent type multi-component polyurethane is preferably 8% -35%; the curing temperature of the solvent type multicomponent polyurethane is preferably 50-80 ℃; the viscosity of the aqueous polyurethane resin is preferably 10 to 2000mPa.s at 25 ℃.
The polyimide-based material is preferably a polyimide-based adhesive, and more preferably includes, but is not limited to, a polyimide adhesive and/or a bismaleimide adhesive; the solid content of the polyimide adhesive is preferably 9% -40%; the viscosity of the polyimide adhesive is 500-3000 Pa.s at 25 ℃; the maximum curing temperature of the polyimide-based adhesive is preferably 280 ℃.
The acrylic materials include, but are not limited to, polyurethane modified acrylic esters and/or aqueous acrylic emulsions, which do not require additional curing for use at room temperature; the solid content of the acrylic material is preferably 15% -55%; the viscosity of the acrylic material is preferably 10 to 1200mpa.s at 25 ℃.
The epoxy resin material includes, but is not limited to, one or more of phenolic resin, bisphenol a epoxy resin and nitrile rubber modified epoxy resin; the nitrile rubber modified epoxy resin is preferably nitrile rubber modified bisphenol A epoxy resin; the solid content of the epoxy resin material is preferably 12% -55%; the viscosity of the epoxy resin material at 25 ℃ is preferably 100-14200 mPa.s; the curing temperature of the epoxy resin material is 55-80 ℃ or more than 100 ℃.
The particle size of the above-mentioned material may be selected according to the thickness of the desired hybrid wave-absorbing material, and if the thickness of the desired hybrid wave-absorbing material is less than 20 μm, the particle size of the above-mentioned material is preferably not more than 15 μm, and if the thickness of the desired hybrid material is less than 50 μm, the particle size of the above-mentioned material is preferably not more than 45 μm.
In the invention, the mixing proportion of the materials can be selected according to the high and low requirements of the required mixed wave absorbing material on the electromagnetic interference shielding capability or the required shielding frequency range, for example, the high shielding capability in a high-frequency part is required, and the materials with better characteristics, such as copper and silver, can be selected with relatively larger ratio.
In the present invention, specifically, the hybrid wave absorbing material includes:
the shielding frequency band of the mixed wave absorbing material is 30 MHz-20 GHz.
Or specifically, the mixed wave absorbing material comprises:
the shielding frequency band of the mixed wave-absorbing material with the proportion is 30 MHz-20 GHz.
Or specifically, the mixed wave absorbing material comprises:
the shielding frequency band of the mixed wave-absorbing material with the proportion is 30 MHz-40 GHz.
The invention adopts various metal powder and ester materials with different interference frequency ranges, and mixes the metal powder and the ester materials according to different material ratios, so that the metal powder and the ester materials can form liquid materials by using solvents, and the liquid materials can be adsorbed on articles to be protected in the modes of coating, adsorbing, spraying, extruding and the like, thereby improving the shielding rate and the protection rate, and simultaneously effectively absorbing electromagnetic interference of different frequency ranges and noise problems which plague the signal transmission of cables.
The invention also provides a preparation method of the mixed wave-absorbing material for blocking electromagnetic interference, which comprises the following steps: mixing silver powder, copper powder, nickel powder, metal aluminum compound, metal magnesium compound, iron powder, manganese powder, carbon powder, graphite material, ceramic material, mica material, polyurethane material, polyimide material, acrylic material and epoxy resin material, and then converting into liquid material by using a solvent; and solidifying the liquid material to obtain the mixed wave-absorbing material.
Referring to fig. 1, fig. 1 is a schematic diagram of a preparation flow of a hybrid wave-absorbing material provided by the invention.
The sources of all raw materials are not particularly limited, and the raw materials are commercially available; the proportion and the kind of each component are the same as those described above, and are not repeated here.
Mixing silver powder, copper powder, nickel powder, metal aluminum compound, metal magnesium compound, iron powder, manganese powder, carbon powder, graphite material, ceramic material, mica material, polyurethane material, polyimide material, acrylic material and epoxy resin material, and then converting into liquid material by using a solvent; the solvent includes, but is not limited to, esters (butyl ester, ethyl ester) and/or ketones (butanone, aliphatic ketone); the solid content of the liquid material is preferably 10% to 35%, more preferably 20% to 30%, still more preferably 25%.
Solidifying the liquid material to obtain a mixed wave-absorbing material; in the present invention, the liquid material is preferably attached to the article to be protected, and the attaching method is a method well known to those skilled in the art, and is not particularly limited, and the present invention includes methods such as coating, adsorption, spraying, extrusion, and the like; the thickness of the adhesive layer attached to the article to be protected is preferably 1 to 100. Mu.m, more preferably 1 to 45. Mu.m, still more preferably 2 to 40. Mu.m, still more preferably 2 to 25. Mu.m, and most preferably 2 to 12. Mu.m; the curing temperature is preferably 50-80 ℃; the curing time is preferably 18 to 72 hours, more preferably 18 to 48 hours.
The wave-absorbing material provided by the invention is initially manufactured into a liquid state, and after being adsorbed by processes such as coating, adsorption, spraying, extrusion and the like, the wave-absorbing material is solidified to form an elastic film which is stably attached to an article to be adsorbed, so that the form of the article to be adsorbed is not influenced, 100% coating can be achieved, and the coated article is ensured to comprehensively resist external electromagnetic interference and electromagnetic interference generated by the article and not influence the external world.
The mixed wave-absorbing material provided by the invention can be applied to wires and cables and has the capabilities of anti-interference and noise reduction. Fig. 3 is a schematic structural diagram of the hybrid wave-absorbing material according to the present invention applied to electric wires and cables. The wave-absorbing material provided by the invention has the function of absorbing electromagnetic interference waves, is used on wires and cables, is attached to core wires, outer covers and various auxiliary production materials such as bulletproof wires, fiber wires, cotton fiber wires, aramid fiber wires and various filling bodies of the wires and cables in the modes of coating, adsorbing, spraying, extruding and the like, and can solve the problem of electromagnetic interference resistance of cables and the noise problem generated during signal transmission of the cables.
The mixed wave-absorbing material provided by the invention can also be applied to shielding cover materials, as shown in fig. 2, and fig. 2 is a schematic structural diagram of the mixed wave-absorbing material provided by the invention applied to the shielding cover materials. The anti-interference material is attached to a shielding cover material, so that the shielding performance of the shielding cover material can be enhanced, and the anti-interference capability is improved when the shielding cover product is required to be used for shielding electromagnetic interference waves.
In order to further illustrate the present invention, the following examples are provided to describe in detail a hybrid wave-absorbing material that blocks electromagnetic interference.
The reagents used in the examples below are all commercially available; graphite materials used in the examples: the manufacturer trusts new materials and the model Grapheblack; ceramic material: the manufacturer is in the company of Lianyuangang, bei Tanhua silicon limited company and model silicon carbide micropowder; mica material: shenzhen sea Yangfen powder and model HY-M1 of manufacturer; polyurethane material: the manufacturer Phil, model FYM-35; polyimide-based material: manufacturer DuPont, model SP-211; acrylic material: manufacturer three wood group, model BS-982; epoxy resin material is manufactured by Kunshanya, model NPER-133.
Example 1
Mixing silver powder, copper powder, nickel powder, metal aluminum compound, metal magnesium compound, iron powder, manganese powder, carbon powder, graphite material, ceramic material and mica material (filler particle diameter is less than or equal to 15 um), polyurethane material, polyimide material, acrylic material and epoxy resin material according to the proportion of table 1 for 10 hours, and then converting into liquid material with solid content of 25% by using ethyl ester;
the liquid material is coated on the surface of a carrier, and after curing, the mixed wave-absorbing material is obtained, and the types of the carrier, the coating parameters and the curing parameters are shown in table 2. The parameters and model of the vector are shown in Table 3. The properties of the mixed wave-absorbing material were measured, and the results are shown in Table 4.
Table 1 composition of the hybrid wave-absorbing material
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TABLE 2 Carrier types, coating parameters and curing parameters
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TABLE 3 specific model and parameters of the vectors
Table 4 test results of properties of the hybrid wave-absorbing material
Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 | |
Resistor | 0.6Ω | 0.5Ω | 0.2Ω | 0.05Ω | 1.5Ω | 0.5Ω |
Transmittance of light | 1.20% | 0.80% | 0.80% | 1.50% | 1.50% | 0.00% |
Hardness of pencil | H | 2H | 2H | H | H | 5H |
Shielding effectiveness | 40-82db | 72-118db | 72-128db | 70-90db | (-30db) | <29 |
Tensile Strength | 12 | 12 | 12 | 25 | 30 | Metal material |
Elongation percentage | 160% | 160% | 140% | 135% | 110% | \ |
The performance of the hybrid type wave-absorbing material obtained in example 1 was tested, and the shielding effectiveness test results thereof are shown in fig. 4. As can be seen from fig. 4, the formulation with high content ratio of nickel, aluminum, magnesium and iron and extremely low content of graphite is selected to be made into a coating, and the coating is coated on a carrier, and then sent to a third party for shielding performance test, the shielding performance is poor, the shielding efficiency can only reach 86db at the highest, the shielding frequency range can also be between 100MHz and 20GHz, and the shielding efficiency needs to be more than 45 db.
The performance of the hybrid wave-absorbing material obtained in example 2 was tested, and the shielding effectiveness test results thereof are shown in fig. 5. As can be seen from FIG. 5, the formula with moderate content ratio of nickel, aluminum, magnesium and iron, low content of silver and copper and high graphite content is selected to be made into a coating, the coating is coated on a carrier, and then the coating is sent to a third party for shielding performance test, so that the shielding efficiency is improved, the shielding efficiency can only reach 118db at maximum, the shielding frequency range can be between 30MHz and 20GHz, and particularly, the shielding efficiency is improved by 30db at 30MHz compared with the shielding performance of the first type, and reaches 72db, and the shielding efficiency is required to be more than 45 db.
The performance of the hybrid wave-absorbing material obtained in example 3 was tested, and the shielding effectiveness test results thereof are shown in fig. 6. As can be seen from fig. 6, the formula with reduced content ratio of aluminum, magnesium, iron and the like, and increased content of silver, copper, nickel, graphite material, mica and the like is selected to prepare a coating, the coating is coated on a carrier, a third party is sent to perform a shielding performance test, the shielding efficiency is improved again, the maximum shielding efficiency can reach 128db, the shielding frequency range can be between 30MHz and 40GHz, and especially the shielding frequency range is widened.
The performance of the hybrid wave-absorbing material obtained in example 4 was tested, and the shielding effectiveness test results thereof are shown in fig. 7. As can be seen from FIG. 7, the formula with moderate content ratio of Ni, al, mg and Fe, higher content of Ag and Cu and higher content of graphite is selected to prepare the coating, the coating is coated on a carrier, and a third party is sent to perform shielding performance test, the shielding effectiveness is between 30MHz and 18GHz, and the shielding effectiveness is between 60db and 80 db.
The performance of the hybrid wave-absorbing material obtained in example 5 was tested, and the shielding effectiveness test results thereof are shown in fig. 8. In addition, the test in fig. 8 is a shielding effectiveness test of a wire and a cable, when the wire and cable industry calculates the test data of the shielding effectiveness, the conclusion data obtained according to the test equipment is calculated in a negative value, namely-40 db lower than the red line and-30 db lower than the green line. As can be seen from fig. 8, the formulation with high content ratio of nickel, aluminum, magnesium and iron and extremely low content of graphite is selected to be made into a coating, which is coated on a carrier (bulletproof wire for cable), and then is made on the cable, and the cable made by the invention has obviously improved efficiency and stability compared with the cable made by the invention and the cable not made by the invention according to the cable shielding test mode.
The performance of the mixed wave absorbing material obtained in example 6 was tested, and the result of the shielding effectiveness test is shown in fig. 9. As can be seen from fig. 9, a formulation containing silver, copper, nickel, aluminum, magnesium and iron with a high content ratio and moderate graphite content was selected to prepare a coating material, which was coated on the inside of the shield, and then the shield coated with the material of the present invention and the shield not coated with the material of the present invention were subjected to the shielding effectiveness test, and in the surface transfer impedance shielding test, the data value using the present invention was 20, the worst was 29, the data value not using the present invention was 29, the worst was 42, and the smaller data value represents the better shielding performance.
Claims (10)
1. A hybrid wave absorbing material that blocks electromagnetic interference, comprising:
1 to 50 parts by weight of acrylic material and/or epoxy resin material.
2. The hybrid wave absorbing material according to claim 1, wherein the metallic aluminum compound is selected from aluminum hydroxide and/or aluminum oxide;
the metal magnesium compound is selected from magnesium hydroxide;
the carbon powder is selected from conductive carbon black and/or common carbon black;
the ceramic material is selected from one or more of silicon carbide ceramic material, silicon nitride ceramic material and silicon dioxide ceramic material;
the mica material is selected from sericite and/or conductive mica powder;
the polyurethane material is selected from solvent type multi-component polyurethane and/or aqueous polyurethane resin;
the viscosity of the solvent type multi-component polyurethane is 100-6000mPa.s at 25 ℃;
the viscosity of the aqueous polyurethane resin is 10-2000 mPa.s at 25 ℃;
the polyimide material is selected from polyimide adhesives and/or bismaleimide adhesives; the viscosity of the polyimide material at 25 ℃ is 500-3000 Pa.s;
the acrylic material is selected from polyurethane modified acrylic ester and/or aqueous acrylic emulsion; the viscosity of the acrylic material at 25 ℃ is 10-1200 mpa.s;
the epoxy resin material is selected from one or more of phenolic resin, bisphenol A epoxy resin and nitrile rubber modified epoxy resin.
3. The hybrid wave absorbing material according to claim 1, wherein the particle size of the silver powder, copper powder, nickel powder, iron powder, manganese powder, carbon powder, graphite material, ceramic material and mica material is each independently less than 75 μm;
the particle sizes of the metal aluminum compound and the metal magnesium compound are respectively smaller than 45 mu m.
4. The hybrid wave absorbing material of claim 1, comprising:
1 to 5 parts by weight of acrylic material and/or epoxy resin material.
5. The hybrid wave absorbing material of claim 4, wherein the shielding frequency band of the hybrid wave absorbing material is 30MHz to 20GHz.
6. The hybrid wave absorbing material of claim 1, comprising:
7. the hybrid wave-absorbing material of claim 6, wherein the shielding frequency band of the hybrid wave-absorbing material is 30MHz to 20GHz.
8. The hybrid wave absorbing material of claim 1, comprising:
9. the hybrid wave-absorbing material of claim 8, wherein the shielding frequency band of the hybrid wave-absorbing material is 30MHz to 40GHz.
10. A method for preparing the electromagnetic interference blocking hybrid wave absorbing material according to claim 1, comprising the following steps:
mixing silver powder, copper powder, nickel powder, metal aluminum compound, metal magnesium compound, iron powder, manganese powder, carbon powder, graphite material, ceramic material, mica material, polyurethane material, polyimide material, acrylic material and epoxy resin material, and then converting into liquid material by using a solvent;
and solidifying the liquid material to obtain the mixed wave-absorbing material.
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