CN116673800A - Polycrystalline diamond grinding method based on pressure regulation - Google Patents
Polycrystalline diamond grinding method based on pressure regulation Download PDFInfo
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- CN116673800A CN116673800A CN202310679786.3A CN202310679786A CN116673800A CN 116673800 A CN116673800 A CN 116673800A CN 202310679786 A CN202310679786 A CN 202310679786A CN 116673800 A CN116673800 A CN 116673800A
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- pressure regulation
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- 239000010432 diamond Substances 0.000 title claims abstract description 77
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 71
- 238000000227 grinding Methods 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 62
- 230000033228 biological regulation Effects 0.000 title claims abstract description 15
- 238000012545 processing Methods 0.000 claims abstract description 54
- 239000000463 material Substances 0.000 claims abstract description 29
- 239000002245 particle Substances 0.000 claims description 18
- 238000007373 indentation Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 6
- 238000003754 machining Methods 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- 238000000259 microwave plasma-assisted chemical vapour deposition Methods 0.000 claims description 3
- 235000015392 Sesbania grandiflora Nutrition 0.000 claims description 2
- 244000275021 Sesbania grandiflora Species 0.000 claims description 2
- 238000003801 milling Methods 0.000 claims 1
- 238000004904 shortening Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
According to the polycrystalline diamond grinding method based on pressure regulation, the polycrystalline diamond grinding processing parameters are set through pressure regulation, the processed polycrystalline diamond is divided into multiple layers according to the height, and the processing load of each layer is set according to the critical breaking strength and the processing area of the material, so that the load in the whole processing process is in the critical state of damage such as cracks and the like of the material, the processing efficiency is maximized, and meanwhile, the subsurface cracks and other damage are not caused in the grinding process; the method has the characteristics of rapidness, low cost, strong operability and the like, can be used for grinding and processing polycrystalline diamond with different growth modes and different sizes, and has certain guiding significance for optimizing material processing parameters, shortening processing time and improving yield.
Description
Technical Field
The invention belongs to the technical field of polycrystalline diamond processing, and particularly relates to a polycrystalline diamond grinding method based on pressure regulation.
Background
Diamond has some of the most extreme physical, optical and mechanical properties of any material, such as the lowest coefficient of friction, the lowest coefficient of compression, the highest bulk modulus and coefficient of thermal conductivity, a broad range of optical transparency from deep Ultraviolet (UV) to far infrared, and extreme mechanical hardness and wear resistance. Diamond is widely used in modern industries, such as cutting tools, optical windows, heat dissipation, etc., and is considered to be an ideal material for the fabrication of high performance semiconductor electronic components. The industrial application of diamond requires high precision planarization to achieve ultra-smooth and atraumatic surfaces. In addition, the high hardness, wear resistance and anisotropy characteristics make diamond processing extremely difficult. Therefore, the principles, processes and equipment types of diamond ultra-precision polishing technology have been the focus of academia and industry attention.
The initial surface roughness, large diameter, and large thickness deviation of polycrystalline diamond bring about unprecedented unbalance in efficiency and quality. Lapping is an important tool for planarization of large-size polycrystalline diamond. Conventional grinding processes are usually performed by using a specific pressure, and this does not take into account thickness deviation of the sample, and most of grinding processes of materials in academia are focused on uniformity of grinding tracks and development of new tools, and researches on grinding pressures for thickness deviation of materials are freshly reported. The pressure is an important parameter for adjusting the processing efficiency and the processing quality of materials, the whole-procedure fixed pressure processing is adopted for processing large-size wafers in the industry, and when the pressure is set to be too small for the grinding processing of diamond, the material removal rate is too low, so that the processing time is increased in an intangible way; the pressure to which the material is subjected in an initial unit area of processing when the pressure is excessively large is likely to exceed the ultimate strength of the material, which definitely increases the breakage of the material, reduces the yield, and the current large-size polycrystalline diamond is expensive, which definitely greatly increases the production cost.
Therefore, a polishing method in which parameter setting is performed based on pressure adjustment is significant for the polishing process of the polycrystalline diamond material.
Disclosure of Invention
Aiming at the defects in the prior art, the invention adopts an indentation method to obtain the breaking strength of the material, and the processed sample is layered according to the material breaking strength and the contour line obtained by the height information, and the load required by grinding is calculated, so that the load in the whole grinding process is optimized, the processing efficiency is improved, the yield of production is improved, and the production cost is saved.
In order to solve the technical problems, the invention adopts the following technical scheme:
a method of polycrystalline diamond grinding based on pressure regulation, comprising the steps of:
(1) Selecting a polycrystalline diamond sample, polishing, cutting into small blocks, and then carrying out an indentation test on the sample by using an indentation method to obtain the minimum load F when the diamond cracks 0 ；
(2) Selecting 2-50 mu m diamond as diamond abrasive particles in the grinding polycrystalline diamond grinding liquid for grinding and processing, wherein the effective radius of the diamond abrasive particles is equal to the radius of the tip end of a pressing head used in the indentation method in the step a;
(3) Calculating the number N of effective abrasive particles participating in grinding in the diamond grinding liquid in the grinding processing process;
(4) Calculating the critical pressure P of the diamond generating cracks under the action of abrasive particles in the grinding process,
P=F 0 *N/A 0 ，
wherein A is 0 An area for abrasive machining of diamond;
(5) Detecting the surface shape of polycrystalline diamond to be ground, and calculating to obtain contour lines, wherein the interval of the contour lines is m;
(6) Calculating the area An of each contour envelope, wherein n is more than or equal to 1, and the actual processed area Ai of each layer is as follows:
when the surface to be processed is convex, ai=an;
when the processed surface is concave, ai=s-An, wherein S is the area of the processed sample;
the load to be applied by each sub-contour grinding process
F n =a*P*A i ，
Wherein the method comprises the steps ofaIs a safe loading coefficient;
(7) The calculated area is A i When the applied load is Fn, the material removal rate R of grinding processing is the volume of material removed in unit time under the process parameters, and the time T required for processing is needed at the intervals of the high-speed lines n The method comprises the following steps:
T n = 0.5*m*A i /R；
(8) The load F required for machining each contour line n Processing time T n Inputting a numerical control system of a grinding machine tool;
(9) And (3) processing the polycrystalline diamond to be ground in the step (5) according to the program set in the step (8).
In the step (3), the number of diamonds on the grinding disc can be obtained through the concentration and flow of the total diamonds of the grinding fluid, and the number N of effective abrasive particles participating in grinding can be obtained according to the proportion through the size of the grinding disc and the size of the diamonds.
In step (1), the polycrystalline diamond sample is grown by a method including, but not limited to, MPCVD method, DC arc method, hot wire method.
In step (2), the form of the indenter includes, but is not limited to, a vickers indenter, a rockwell indenter, a spherical indenter, a triangular pyramid indenter.
In the step (6), the safety coefficient of processingaIs set to 0.5-0.9.
The beneficial effects of the invention are as follows:
according to the polycrystalline diamond grinding method based on pressure regulation, the polycrystalline diamond grinding processing parameters are set through pressure regulation, the processed polycrystalline diamond is divided into multiple layers according to the height, and the processing load of each layer is set according to the critical breaking strength and the processing area of the material, so that the load in the whole processing process is in the critical state of damage such as cracks and the like of the material, the processing efficiency is maximized, and meanwhile, the subsurface cracks and other damage are not caused in the grinding process; the method has the characteristics of rapidness, low cost, strong operability and the like, can be used for grinding and processing polycrystalline diamond with different growth modes and different sizes, and has certain guiding significance for optimizing material processing parameters, shortening processing time and improving yield.
Drawings
FIG. 1 shows the dimensions of a diamond indenter and chisel edge used in the indentation test of the present invention;
FIG. 2 is a concave contour plot of a polycrystalline diamond sample to be lapped in example 1;
FIG. 3 is a graph showing the surface effect of the original surface flatness in example 1 after various times of processing;
FIG. 4 is a graph comparing the time spent processing 2-4 inch samples, respectively, using the present invention with conventional methods.
Detailed Description
Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present invention, which is described by the following specific examples.
The following is a detailed description of embodiments:
example 1
The invention provides a polycrystalline diamond grinding method based on pressure regulation, as shown in fig. 1 to 4.
The polycrystalline diamond grinding method based on pressure regulation comprises the following steps:
a. taking polycrystalline diamond obtained by MPCVD growth mode as a sample, polishing the sample, wherein the surface roughness after polishing is less than 10nm, the thickness of the sample is 1mm, cutting the sample into small blocks with the size of 10mm by an infrared nanosecond laser 2 The indentation test was performed on the sample using a vickers hardness tester, the indenter used was a vickers indenter, the indenter chisel was 1 μm, as shown in fig. 1, a displacement load curve was recorded during the indentation, when the load was suddenly changed, the material was considered to be broken, and the average load F when the diamond crack was obtained was recorded 0 =0.35±0.03N；
b. Selecting diamond abrasive particles with the diameter of 10 mu m as diamond in grinding liquid in the grinding process of polycrystalline diamond, wherein the effective radius of the abrasive particles is 1/10 of the diameter of the abrasive particles according to an empirical formula, and the effective radius of the diamond abrasive particles is equal to the radius of the tip of a pressing head used in the pressing mark method in the step a;
c. calculating the number of effective abrasive particles on the unit grinding disc according to the flow and the concentration of the grinding liquid; namely, the number N and N of the effective abrasive particles in the diamond grinding fluid participating in grinding in the grinding process can be obtained through the concentration of the diamond abrasive particles in the grinding fluid, the flow rate of the grinding fluid and the contact area of the sample;
d. calculating to obtain unit area A in the grinding process 0 The critical pressure P of the diamond for generating cracks under the action of using 10 mu m abrasive particles is calculated as P=F 0 *N/A 0 =0.15Mpa。
e. The surface shape of the 2-inch polycrystalline diamond to be polished was examined, the flatness was 18 μm, and contours were calculated, the interval of which was m=3 μm, as shown in fig. 2.
f. The area An of each contour envelope is calculated, n=6, then the actual area Ai processed per layer is:
because the processed surface is concave, ai=s-An, wherein S is the area of the processed sample, and An and Ai can be calculated by software; where s= 1290.32 square millimeters, i=1, ai= 489.68 square millimeters, i=2, ai= 786.73 square millimeters, all values of Ai being obtained in turn by software.
The load F to be applied by each sub-contour grinding process n The method comprises the following steps:
F n =a*P*An，
wherein the method comprises the steps ofaThe coefficient was chosen with reference to the uniformity of the breaking strength of the sample, average breaking F of single indentation =0.9 0 The fluctuation is 0.03/0.35=8.57%, and the coefficient is 0.9 in order to improve the safety of the sample and consider the interval of the contour lines; f (F) 1 =66.1N，F 2 =106.2n, in turn yielding F 1 -F 6 Is not shown.
g. Calculating a material removal rate r=0.12 mm when the area is Ai and the applied load is Fn 3 Per min (obtained by grinding experiments on small-sized samples), then the time required for machining at these high-speed intervals is tn=0.5×m×ai/R; then T is 1 =6.2min，T 2 =9.7 min, followed by calculation of T in turn 1 -T 6 。
The time required for contour line interval processing is Tn, and the volume of the material can be regarded as half of the contour line multiplied by the area provided that the height difference in the contour line is continuous and uniform; the volume can also be accurately calculated in an integral manner, and the material removal volume is as follows: wherein x and y are sample coordinate values in a contour region, a zero point of the coordinate is the center of the lowest point of the contour envelope area, z is a height value relative to the center point, and the processing time length is T=V/R; in this embodiment, a simplified calculation is employed.
h. The load F required for machining each contour line n And processing time T n Inputting a numerical control system of a grinding machine tool;
i. the polycrystalline diamond to be ground in e is processed according to the procedure set in h, as shown in fig. 3, the surface morphology of a 2 inch sample with the flatness of 18 μm is respectively obtained under different processing time periods, while the polycrystalline diamond sample with different sizes, which is grown under the same process, is shown in fig. 4, and compared with the time period required for grinding to the flatness of 1 μm by the invention in a traditional way, the grinding time period is greatly reduced from the figure.
According to the pressure-regulated polycrystalline diamond grinding processing parameter setting method, the processed polycrystalline diamond is divided into multiple layers according to the height, and the processing load of each layer is set according to the critical breaking strength and the processing area of the material, so that the load in the whole processing process is in the critical state of damage such as crack and the like of the material, the processing efficiency is maximized, and the damage is avoided; the method has the characteristics of rapidness, low cost, strong operability and the like, can be used for grinding and processing polycrystalline diamond with different growth modes and different sizes, and has certain guiding significance for optimizing material processing parameters, shortening processing time and improving yield.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which are all within the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "front", "rear", "left", "right", "center", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the protection of the present invention.
Claims (5)
1. A method for milling polycrystalline diamond based on pressure regulation, comprising the steps of:
(1) Selecting a polycrystalline diamond sample, polishing, cutting into small blocks, and then carrying out an indentation test on the sample by using an indentation method to obtain the minimum load F when the diamond cracks 0 ；
(2) Selecting 2-50 mu m diamond as diamond abrasive particles in the grinding polycrystalline diamond grinding liquid for grinding and processing, wherein the effective radius of the diamond abrasive particles is equal to the radius of the tip end of a pressing head used in the indentation method in the step a;
(3) Calculating the number N of effective abrasive particles participating in grinding in the diamond grinding liquid in the grinding processing process;
(4) Calculating the critical pressure P of the diamond generating cracks under the action of abrasive particles in the grinding process,
P=F 0 *N/A 0 ，
wherein A is 0 An area for abrasive machining of diamond;
(5) Detecting the surface shape of polycrystalline diamond to be ground, and calculating to obtain contour lines, wherein the interval of the contour lines is m;
(6) Calculating the area An of each contour envelope, wherein n is more than or equal to 1, and the actual processed area Ai of each layer is as follows:
when the surface to be processed is convex, ai=an;
when the processed surface is concave, ai=s-An, wherein S is the area of the processed sample;
the load to be applied by each sub-contour grinding process
F n =a*P*A i ，
Wherein the method comprises the steps ofaIs a safe loading coefficient;
(7) The calculated area is A i When the applied load is Fn, the material removal rate R of grinding processing is the volume of material removed in unit time under the process parameters, and the time T required for processing is needed at the intervals of the high-speed lines n The method comprises the following steps:
T n = 0.5*m*A i /R；
(8) The load F required for machining each contour line n Processing time T n Inputting a numerical control system of a grinding machine tool;
(9) And (3) processing the polycrystalline diamond to be ground in the step (5) according to the program set in the step (8).
2. A method of polycrystalline diamond grinding based on pressure regulation according to claim 1, wherein: in the step (3), the number of diamonds on the grinding disc can be obtained through the concentration and flow of the total diamonds of the grinding fluid, and the number N of effective abrasive particles participating in grinding can be obtained according to the proportion through the size of the grinding disc and the size of the diamonds.
3. A method of polycrystalline diamond grinding based on pressure regulation according to claim 1, wherein: in step (1), the polycrystalline diamond sample is grown by a method including, but not limited to, MPCVD method, DC arc method, hot wire method.
4. A method of polycrystalline diamond grinding based on pressure regulation according to claim 1, wherein: in step (2), the form of the indenter includes, but is not limited to, a vickers indenter, a rockwell indenter, a spherical indenter, a triangular pyramid indenter.
5. A method of polycrystalline diamond grinding based on pressure regulation according to claim 1, wherein: in the step (6), the safety coefficient of processingaIs set to 0.5-0.9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310679786.3A CN116673800A (en) | 2023-06-09 | 2023-06-09 | Polycrystalline diamond grinding method based on pressure regulation |
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| CN202310679786.3A CN116673800A (en) | 2023-06-09 | 2023-06-09 | Polycrystalline diamond grinding method based on pressure regulation |
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| CN202310679786.3A Pending CN116673800A (en) | 2023-06-09 | 2023-06-09 | Polycrystalline diamond grinding method based on pressure regulation |
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