CN116671268A

CN116671268A - Heat radiating device and heat radiating system

Info

Publication number: CN116671268A
Application number: CN202180085716.4A
Authority: CN
Inventors: 陈进宇; 吕建标; 苏玉; 朱龙光; 陈晓丹; 郑见涛
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-05-25
Filing date: 2021-05-25
Publication date: 2023-08-29
Also published as: WO2022246637A1

Abstract

A heat dissipating device for supplying a heat source (S1) with a liquid, the heat dissipating device comprising a liquid separating chamber (11) and a heat dissipating chamber (12) which are communicated by a plurality of jet holes (14 h), the liquid separating chamber (11) being formed with an inlet (10 a) for the liquid, the heat source (S1) being at least partially accommodated in the heat dissipating chamber (12), the liquid separating chamber (11) comprising at least two subchambers, the liquid flowing through each subchamber in turn and then entering the heat dissipating chamber (12), the adjacent subchambers being communicated by a plurality of liquid separating holes (11 h) on the flow path of the liquid. The application also provides a heat dissipation system.

Description

Heat radiating device and heat radiating system

Technical Field

The present application relates to the field of heat dissipating devices, and more particularly, to a heat dissipating device and a heat dissipating system.

Background

Taking chips as an example, especially for highly integrated and large-scale electronic devices using small electronic devices, the power consumption density is very high.

The existing heat dissipation mode for the chip mainly comprises air cooling and liquid cooling. The air cooling structure is simple and high in reliability, but the heat dissipation capacity is limited, so that the heat dissipation requirements of high-power and high-heat-flow-density components are difficult to meet. The liquid cooling generally adopts a flow channel cold plate as a heat exchange device, a thermal interface material is needed to be connected between the common flow channel cold plate and the chip, and the heat dissipation capacity of the flow channel cold plate is limited by the heat transfer performance of the thermal interface material, so that the common flow channel cold plate is difficult to provide efficient heat dissipation for the chip with high heat flow density and high power consumption.

Therefore, how to use an efficient heat dissipation scheme to avoid the phenomenon of high Wen Huozhe overtemperature in a local area of a chip (or electronic device) so as to improve the related performance and reliability of the device is an urgent problem in the art.

Disclosure of Invention

In view of the above, the present application provides a heat dissipating device and a heat dissipating system.

In a first aspect, embodiments of the present application provide a heat dissipating device.

In a first possible implementation manner of the first aspect, the heat dissipating device is configured to supply a liquid to the heat source, and the heat dissipating device includes a liquid distribution chamber and a heat dissipating chamber, the liquid distribution chamber being formed with an inlet for the liquid, the heat source being at least partially accommodated in the heat dissipating chamber,

the liquid separating cavity comprises at least two subchambers, liquid sequentially flows through each subchamber and then enters the heat dissipation cavity,

on the flow path of the liquid, two adjacent subchambers are communicated by a plurality of liquid separating holes.

The subchambers that divide the intracavity to set up step by step play the effect of guide distribution to the liquid of flow in-process, for example, the liquid that is located the subchamber of back level is more close than the flow velocity of the liquid of the subchamber of preceding level in everywhere, and then makes the liquid flow even after getting into the radiating chamber, and the radiating effect is good.

In a second possible implementation form of the heat dissipating device according to the first possible implementation form of the first aspect, a plurality of tubular jet pillars are provided in the heat dissipating cavity in communication with the jet holes, the jet pillars extending from the jet holes towards the heat source.

The jet flow column guides the liquid to the vicinity of the heat source, and the liquid forms jet flow impact after flowing out of the jet flow column, which is equivalent to reducing the distance between the liquid in a free impact state and the heat source, reducing the speed loss of the liquid in the flowing process and ensuring the jet flow impact effect.

In a third possible implementation form of the heat sink according to any of the preceding possible implementation forms of the first aspect, the liquid separation chamber comprises at least three sub-chambers,

in the flow path of the liquid, the opening area of the liquid dividing hole located upstream is larger than the opening area of the liquid dividing hole located downstream.

The opening area (aperture) of the upstream liquid separation hole is larger than that of the downstream liquid separation hole, so that the liquid is not easy to be blocked in the flowing process, and the flowing is smooth.

In a fourth possible implementation form of the heat dissipating device according to any of the preceding possible implementation forms of the first aspect, the axis of the at least one upstream tap hole is not coincident with the axis of all downstream tap holes.

The liquid distribution holes at the upstream and the liquid distribution holes at the downstream are at least partially staggered, so that the guiding and distributing capacity of the liquid distribution holes to the liquid is improved, and the liquid tends to flow uniformly in the flowing process.

In a fifth possible implementation manner of the heat dissipating device according to any one of the possible implementation manners of the first aspect, an opening area of the liquid separation hole is larger than an opening area of the jet hole.

The opening area (aperture) of the liquid separation hole is larger than that of the jet hole, so that the liquid is not easy to be blocked in the flowing process, and the flowing is smooth.

In a sixth possible implementation manner of the heat dissipating device according to the fifth possible implementation manner of the first aspect, an opening area of the liquid separation hole is more than 3 times an opening area of the jet hole.

Compared with the jet hole, the opening area (aperture) of the liquid separation hole is large, so that the liquid is ensured to have larger pressure when flowing to the jet hole, or the liquid is prevented from generating larger pressure drop in the flowing process of the liquid in the liquid separation cavity, and the subsequent jet effect is ensured.

In a seventh possible implementation manner of the heat dissipating device according to the fifth or sixth possible implementation manner of the first aspect, an opening area of at least two jet holes of the plurality of jet holes is different.

The different arrangement of the opening areas (apertures) of the jet holes can realize the provision of the liquid with different jet velocities in different areas so as to provide stronger jet impact for the key cooling areas of the heat source according to the needs.

In a second possible implementation manner of the first aspect, in an eighth possible implementation manner of the heat dissipating device, a cross-sectional area of the internal through hole of the jet column is equal to a cross-sectional area of the jet hole.

The jet flow column and the jet flow hole have the same cross section area (inner diameter), so that the pressure drop in the process of flowing the liquid in the jet flow column is very small, or the influence of increasing the length of the jet flow column on the system pressure drop of the heat radiating device is small, and the loss of extra liquid pumping power is not easy to cause.

In a ninth possible implementation form of the heat dissipating device according to the second or eighth possible implementation form of the first aspect, the peripheral wall of the heat dissipating cavity is formed with a plurality of outlets for liquid to flow out of the heat dissipating cavity,

the jet flow column forms a flow guiding part at least near the periphery of the end part of the heat source, and the flow guiding part is provided with a surface capable of guiding the liquid to the direction of the outlet.

The surface structure of the flow guide part can guide the liquid to the outlet, so that the phenomenon that the liquid in the heat dissipation cavity is blocked and/or unstable in flow is avoided, and the liquid in the heat dissipation device flows smoothly and has a good cooling effect.

In a tenth possible implementation manner of the heat dissipating device according to the ninth possible implementation manner of the first aspect, the plurality of jet columns are connected to each other and form a jet layer, and openings penetrating the jet layer and communicating with the outlet are formed between adjacent jet columns.

The jet layer formed by the jet columns connected with each other has high structural strength, is convenient to manufacture and is not easy to damage.

In an eleventh possible implementation manner of the heat dissipating device according to the tenth possible implementation manner of the first aspect, the heat dissipating device includes a jet spacer for spacing the liquid separation chamber and the heat dissipating chamber, the jet holes penetrate the jet spacer in a thickness direction of the jet spacer,

the jet layer is welded with the jet separator, or

The jet layer and the jet separator are formed as one body.

The connection mode of the jet layer and the jet separator is simple and flexible, and the jet layer and the jet separator can be welded or manufactured in an integrated mode.

In a twelfth possible implementation form of the heat dissipating device according to the ninth possible implementation form of the first aspect, the inlet is in communication with a plurality of outlets.

The communicating inlet and outlet enable continuous circulation of liquid within the heat sink.

In a thirteenth possible implementation form of the heat dissipating device according to any of the preceding possible implementation forms of the first aspect, the heat dissipating cavity comprises a sidewall surrounding a periphery of the heat source, the sidewall being not in contact with the heat source,

the heat dissipation cavity comprises a side cavity positioned between the heat source and the side wall.

The liquid can contact with the outer peripheral surface of the heat source when flowing to the side cavity, so that the contact area between the heat source and the liquid is large, and the heat dissipation effect is good.

In a thirteenth possible implementation manner of the heat dissipating device according to the thirteenth possible implementation manner of the first aspect, the heat dissipating device is configured to dissipate heat of an electronic device including a heat source, the electronic device further includes a base, the heat source is disposed on one surface of the base,

the side wall is adapted to abut against one surface of the base,

the heat dissipating device further comprises a sealing ring sleeved on the outer periphery of the heat source, and the sealing ring is embedded on the inner periphery of the side wall, and one end face of the sealing ring abuts against one surface of the base.

The sealing ring forms a seal between the heat source and the side wall, and the sealing ring abuts against one surface of the base portion so that the sealing structure is firmer.

In a fifteenth possible implementation manner of the heat dissipating device according to any one of the possible implementation manners of the first aspect, the liquid separation cavity is located above the heat dissipating cavity, and a lower portion of the heat dissipating cavity is used for setting the heat source.

The up-down arrangement mode of the liquid separating cavity and the heat dissipating cavity ensures that the flowing power of the liquid in the heat dissipating device can be provided by a pump and the gravity of the pump can be used for realizing good jet impact effect.

In a sixteenth possible implementation form of the heat sink according to any of the possible implementation forms of the first aspect, the heat source comprises a chip.

The heat dissipation device can provide high-efficiency heat dissipation for the chip with larger power density, and avoid the phenomenon of high temperature or overtemperature in the local area of the chip.

In a second aspect, embodiments of the present application provide a heat dissipation system.

In a first possible implementation form of the second aspect, the heat dissipating system comprises a pump, a tank and at least one heat dissipating device according to any one of the possible implementation forms of the first aspect of the application,

the pump is used for pumping the liquid in the liquid storage tank to the heat dissipation device and pumping the liquid flowing out of the heat dissipation device back to the liquid storage tank.

The liquid in the heat dissipation system can realize internal circulation under the driving action of the pump, and one heat dissipation system can provide a heat dissipation function for one or more devices or one or more heat sources of the devices.

In a second possible implementation manner of the heat dissipation system according to the first possible implementation manner of the second aspect, the heat dissipation system further comprises a refrigerator and a preheater,

a refrigerator is arranged at the downstream of the heat radiating device and at the upstream of the liquid storage tank, the refrigerator is used for cooling the liquid flowing through,

a preheater is disposed downstream of the reservoir and upstream of the heat sink, the preheater being configured to heat the liquid flowing therethrough to a predetermined temperature.

The refrigerator is convenient for cooling the overheated liquid flowing in the heat dissipation device, the preheater can heat the liquid ready to flow in the heat dissipation device to a proper temperature, so that factors such as density, viscosity, pressure difference and flow rate of the liquid can reach an optimal state under the condition of controllable temperature, and the heat exchange performance of the system is improved.

Drawings

FIG. 1 is a schematic illustration of a liquid jet impacting an impacted surface;

FIGS. 2 and 3 are schematic views of two possible embodiments of a heat dissipation system according to the present application;

fig. 4 and 5 are schematic views of two possible embodiments of a heat sink according to the application.

Reference numerals illustrate:

j jet holes; f impacted surface; s reside point area;

s0 base; s1, a heat source;

10a heat dissipation device; 10a inlet; 10b outlet; 10c upper wall; 10d side walls;

11 liquid separating cavities; 11a primary subchambers; 11b secondary subchambers; 11c three-stage subchambers; 11h of liquid separation holes; 11p liquid separation baffle;

12 heat dissipation cavities; 121 jet cavity; 122 a reflow chamber; 123 side cavities;

13 jet separator; 14 jet layer; 14h jet holes; 140 jet columns; 141 a main body; 142 flow directors; 143 an outer peripheral portion; 144 opening; 15 sealing rings;

20 pumps; 30 liquid storage tanks; a 40 refrigerator; 50 a preheater; a 60 flow meter; 71 a shut-off valve; 72 flow valve; 73 side way valves; an 80 filter; a 90-mesh mirror; p pressure protector.

Detailed Description

Exemplary embodiments of the present application are described below with reference to the accompanying drawings. It should be understood that these specific illustrations are for the purpose of illustrating how one skilled in the art may practice the application, and are not intended to be exhaustive of all of the possible ways of practicing the application, nor to limit the scope of the application.

The heat dissipation system and the heat dissipation device according to the present application will be described below in the context of the drawings unless otherwise specified. It will be appreciated that the relationship between the components in the device is relative and that the position of the components relative to each other will vary depending on the condition of use of the device.

It should be understood that in the description and in the claims, "and/or" means at least one of the connected objects, and that the character "/" generally means that the associated object is an "or" relationship.

Taking a chip as an example, a heat dissipating device and a heat dissipating system according to the present application are described. However, it should be understood that the heat dissipating device of the present application is not limited to use for heat dissipation of chips.

A microchannel heat sink (also known as a microchannel heat exchanger) is a potential high efficiency heat sink device. The microchannel heat sink has a large specific surface area, a compact structure, a small heat transfer temperature difference, and high heat transfer efficiency, and can be applied as a heat sink of a chip, for example.

However, when the liquid flows in the micro-channel, a larger temperature rise and channel pressure drop occur, so that the heat dissipation capacity of the micro-channel heat sink gradually decreases in the flow direction, and the temperature of the chip heat source gradually increases. And die temperature non-uniformity can lead to a range of reliability problems such as thermal stress and deformation of the material.

The heat dissipation device provided by combining the jet liquid cooling technology (also called jet cooling technology) is another potential efficient heat dissipation device on the basis of the microchannel heat sink.

Such a heat sink (hereinafter also referred to as a fluidic device) causes liquid (also referred to as a working fluid) to pass through a micro-hole or slit under a pressure differential and then impinge on the chip surface in the form of a high-velocity jet of liquid. As shown in fig. 1, in the stagnation point region s of the impacted surface f opposite to the jet hole j, the boundary layer of the region is thinner, and the local heat exchange coefficient is large. In general, the cooling effect can be enhanced by overlapping the stagnation zone s with the high heat flux density region.

However, on the one hand, the heat exchange performance of the impingement jet is affected by a number of parameters, such as impingement jet speed, nozzle shape, nozzle array arrangement, nozzle diameter, nozzle-to-chip surface distance, nozzle-to-chip angle and nozzle spacing, etc., and the heat exchange performance is difficult to control; on the other hand, the micro-channel structure is relatively complex, so that the on-way resistance of the working medium flow is larger, which can significantly increase the pump power loss of the system and increase the risk of blockage of the system.

In order to increase the cooling effect of the fluidic device, one possible approach is to reduce the distance between the jet aperture j and the impacted surface f (or the height of the jet cavity), for example to set the distance to less than 0.5mm.

At the same inlet flow, the reduced height of the jet cavity will result in an improved jet cooling effect, but this will also result in a significant increase in the overall pressure drop across the jet cavity. In practical applications, the pressure drop across the jet cavity needs to be constrained (e.g., less than 30 kpa); the pressure drop increase can cause the flow of the working medium to be reduced, thereby reducing the heat dissipation effect. In addition, the height of the jet cavity is reduced, so that the distance between the inlet and the outlet is reduced, the temperature of the liquid at the inlet is higher, and the jet cooling effect is further affected.

The applicant has devised the present application taking into account some of the cases including the above cases. The heat sink according to the present application is provided in a heat sink system capable of providing a circulation flow path, and the heat sink can supply a cooling liquid (hereinafter, also referred to as liquid) having a uniform flow rate and a sufficient flow rate to a heat source.

Fig. 2 illustrates a heat dissipation system according to one embodiment of the present application. Which includes a heat sink 10 and a piping system providing an external fluid circulation to the heat sink 10 at the outside thereof.

The tubing system includes a pump 20 and a reservoir 30. Optionally, the piping system further comprises a refrigerator 40, a preheater 50, a flow meter 60, a shut-off valve 71, a flow valve 72, a side valve 73, a filter 80, a sight glass 90 and a pressure protector p.

In the present embodiment, two flow meters 60 are respectively disposed upstream and downstream of the heat sink 10 to accurately measure the liquid flow rate, and provide a basis for controlling the liquid flow rate in the heat sink 10.

The refrigerator 40 is disposed near the outlet of the heat sink 10 to cool down the liquid flowing through the heat sink 10, which absorbs the heat of the heat source S1. The preheater 50 is located near the inlet of the heat sink 10 to stabilize the liquid within the system at a suitable temperature.

Specifically, along the flow direction of the liquid, the serial connection sequence of each component in the heat dissipation system is as follows: the liquid tank 30, the pump 20, the shut-off valve 71, the preheater 50, the filter 80, the flow meter 60, the sight glass 90, the flow valve 72, the pressure protector p, the heat sink 10, the flow meter 60, and the refrigerator 40.

The reservoir 30 is adapted to contain a quantity of cooling liquid.

The tank 30 is connected downstream to a pump 20, the pump 20 pumping liquid at a certain pressure to the downstream heat sink 10.

The pump 20 is connected downstream to a shut-off valve 71. In the case where the heat sink 10 is operating normally, the shut-off valve 71 is in an on state, and liquid can flow through the shut-off valve 71. In the case where interruption of the flow circulation of the liquid is required, for example, in the case where maintenance of the heat radiation system is required, the shut-off valve 71 is closed.

A shut-off valve 71 is connected downstream to the preheater 50. The preheater 50 is used to heat the liquid to a suitable temperature, for example 40 ℃. This is because the excessively low temperature liquid does not necessarily have optimal heat exchange performance after the liquid is cooled by the refrigerator 40 in the piping system. The temperature of the liquid affects its density, viscosity, pressure and flow rate, and a suitable temperature of the liquid can provide a higher heat transfer performance to the liquid flowing through the heat sink 10.

The preheater 50 is connected downstream to a filter 80. The filter 80 can filter impurities in the liquid to prevent clogging of a pipe system or degradation of the flow property of the liquid.

Filter 80 is connected downstream to flow meter 60. The flow meter 60 here is used to meter the flow of liquid ready to flow into the heat sink 10.

The flow meter 60 is connected downstream to a visual mirror 90. The view mirror 90 has a transparent viewing area to facilitate viewing of the state of the liquid, such as whether the liquid is flowing or whether there are impurities within the liquid, etc.

The sight glass 90 is connected downstream to the flow valve 72. The flow valve 72 is used to regulate the flow of liquid in the pipeline based on the readings of the flow meter 60.

A pressure protector p is provided between the flow valve 72 and the inlet of the heat sink 10 for pressure relief to protect components within the system, for example in the event of a system pressure overload.

The outlet of the heat sink 10 is connected to another flow meter 60, which flow meter 60 is connected downstream to the refrigerator 40. The refrigerator 40 is connected downstream to the inlet of the tank 30, forming a complete cycle of the system.

Downstream of the pump 20, a branch is also provided which leads the liquid back to the tank 30. The bypass is provided with a bypass valve 73, and the bypass valve 73 is used for adjusting the flow rate of the liquid in the system when required.

It should be understood that the connection order of the components in the above-described piping system is not exclusive, and in other possible embodiments, the connection order of several components may be exchanged, and further, some components may be omitted.

Furthermore, referring to fig. 3, one heat dissipating system may also include a plurality of heat dissipating devices 10, or a plurality of heat dissipating devices 10 may share an external piping system. Optionally, the plurality of heat sinks 10 are connected together in parallel.

Next, a heat sink 10 according to the present application is described with reference to fig. 4 and 5.

(first embodiment of heat sink)

Referring to fig. 4, first, a first embodiment of the heat dissipating device will be described.

The heat sink 10 is formed in a hood shape, having an upper wall 10c and a side wall 10d. The side wall 10d is annularly enclosed in the outer peripheral portion of the upper wall 10 c. Alternatively, the side wall 10d and the upper wall 10c may be two parts connected together or may be formed as one body.

The side wall 10d is formed with an opening at an end opposite to the upper wall 10c for allowing the heat source S1 of the heat-to-be-radiated member to extend, or, in other words, the heat sink 10 having a hood shape to house the heat source S1 therein.

In the present embodiment, the heat source S1 is a chip. The heat source S1 is disposed above a base S0 (e.g., a substrate of a chip). The side wall 10d abuts against the surface of the base S0, and a sealing structure is formed between the side wall 10d and the base S0.

It should be understood that the heated source S1 may also be, for example, other electronic devices and components thereof, which are distinct from the chip.

Optionally, the heat sink 10 further comprises a sealing ring 15 between the outer periphery of the heat source S1 and the inner periphery of the side wall 10d. The lower bottom surface of the seal ring 15 abuts against the surface of the base S0 to ensure sealing between the side wall 10d and the base S0.

The inner cavity of the heat dissipating device 10 is provided with a jet flow partition plate 13, so that the inner cavity is divided into a liquid separating cavity 11 and a heat dissipating cavity 12 positioned at two sides of the jet flow partition plate 13. The jet separator 13 has a plurality of jet holes 14h formed therein so as to communicate the liquid separation chamber 11 and the heat dissipation chamber 12, so that liquid can enter the heat dissipation chamber 12 from the liquid separation chamber 11.

The liquid separation chamber 11 is formed with an inlet 10a, the inlet 10a may also be referred to as a liquid inlet or a heat sink liquid inlet. Alternatively, the inlet 10a is provided at the top of the liquid separation chamber 11 (e.g., formed in the upper wall 10c in the present embodiment). Liquid in the external pipe system enters the liquid separation chamber 11 through the inlet 10 a. The liquid separation chamber 11 can regulate the flow of liquid so that the liquid passes through the jet hole 14h at a certain pressure and flow rate.

The liquid passing through the jet hole 14h flows to the surface of the heat source S1 in a jet impact manner in the heat dissipation chamber 12, and takes away the heat of the heat source S1. The peripheral wall of the heat dissipating chamber 12 is formed with one or more outlets 10b surrounding the heat dissipating chamber, through which outlets 10b liquid can flow out of the heat dissipating chamber 12 to enter the external piping system for the next cycle. The outlet 10b may also be referred to herein as a liquid outlet or a heat sink liquid outlet.

In the present embodiment, the liquid separation chamber 11 includes a primary subchamber 11a and a secondary subchamber 11b. The two subchambers are separated by a liquid dividing baffle 11p. The outer periphery of the liquid separation plate 11p is connected with the side wall 10d, a plurality of liquid separation holes 11h are formed in the liquid separation plate 11p, and the liquid separation holes 11h are communicated with the primary subchamber 11a and the secondary subchamber 11b. Alternatively, the liquid separation partition 11p is disposed opposite to the inlet 10a, or, the axis of the liquid separation hole 11h is parallel to the axis of the inlet 10 a. Alternatively, a plurality of liquid separation holes 11h are uniformly distributed in the liquid separation partition 11p.

It should be understood that where reference is made above or below to a hole or opening, although described using axes, apertures, etc., the application is not limited to the shape of the various holes and openings, which need not be cylindrical in shape as a whole. When the cross section of the hole or opening is not circular, the size of the aperture is used to express the size of the hole or opening, i.e., the size of the area surrounded by the hole or opening; for convenience of description, the area of the area surrounded by the hole or opening is also replaced with the aperture or opening area.

In the flow direction, the liquid will flow through the inlet 10a, the primary subchamber 11a, the liquid separation holes 11h and the secondary subchamber 11b in this order. The dashed arrows in fig. 4 schematically illustrate the method of liquid flow within the heat sink 10.

The liquid separation holes 11h play a role in guiding and distributing liquid, so that the liquid flowing into the secondary subchamber 11b flows more uniformly than the liquid flowing into the primary subchamber 11a, and the liquid flowing into the heat dissipation chamber 12 flows uniformly, and the liquid can play a better heat dissipation effect in the process of impacting the heat source S1 by jet flow.

Alternatively, the hood-shaped heat sink 10 is provided with the opening (the side on which the heat source S1 is located) facing downward; optionally, the liquid separation cavity 11 is located above the heat dissipation cavity 12; optionally, the primary subchamber 11a is located above the secondary subchamber 11 b; optionally, the inlet 10a is located above the outlet 10b. The arrangement mode ensures that the flow of the liquid in the heat dissipation device can also be by the gravity of the liquid besides the pressure provided by the pump, and the jet impact effect is good.

It should be understood that the arrangement direction of the heat sink 10 may be changed accordingly according to different structures and arrangements of the heat source S1, for example, referring to fig. 4, in the case where the surface of the base S0 is vertically arranged, the heat sink 10 may be arranged in such a manner that the structure in fig. 4 is rotated by 90 ° with the opening facing in the horizontal direction. In addition, the specific positions of each cavity and the inlet 10a and the outlet 10b in the heat dissipating device 10 can also be adjusted according to the actual application scenario.

Alternatively, in order that the liquid in the heat sink 10 does not create a large pressure drop before entering the heat dissipation chamber 12, the aperture (or open area or cross-sectional area) of the liquid separation hole 11h is much larger than the aperture (or open area or cross-sectional area) of the jet hole 14h. For example, the aperture (or opening area or cross-sectional area) of the liquid separation hole 11h is 3 times or more the aperture (or opening area or cross-sectional area) of the jet hole 14h. Therefore, the liquid in the liquid separating cavity 11 can be regulated in an even flow mode, the flow speed of the liquid is not excessively lost due to large obstruction, and the subsequent jet impact effect is guaranteed.

Optionally, a jet layer 14 is also formed within the heat dissipation chamber 12. The jet stack 14 includes a plurality of jet columns 140 arranged in an array, each jet column 140 being disposed in alignment with one jet aperture 14h.

The jet column 140 has a hollow tubular shape, one end of which is connected to the surface of the jet separator 13 to communicate the internal passage of the jet column 140 with the jet hole 14h, and the other end of which extends to the vicinity of the heat source S1, so that a liquid column on which the jet impinges is generated in a region very close to the heat source S1. For example, the distance between the liquid outlet of the jet column 140 (i.e., the other end described above) and the heat source S1 is not more than 1mm, alternatively, the distance between the liquid outlet of the jet column 140 and the heat source S1 is 0.35 to 0.7mm.

Alternatively, the bore diameter of the internal passage of the jet column 140 is equal to the bore diameter of the jet aperture 14h and the two apertures are disposed in perfect alignment. This results in very little pressure drop during the flow of liquid within jet aperture 14h and jet column 140; also, even if the length of the jet column 140 is increased, the influence on the system pressure drop of the heat sink 10 is small, and the loss of the additional pumping power of the liquid is not easy to be caused. Since the outlet 10b is located near the liquid outlet of the jet column 140 in the flow direction of the liquid, the length occupied by the jet column 140 also has the effect of pulling the distance between the inlet 10a and the outlet 10b apart, so that the liquid near the inlet 10a and the liquid near the outlet 10b flow with less interference with each other.

Alternatively, the apertures of the jet holes 14h (and the jet columns 140 connected to the jet holes 14 h) at different positions are not exactly the same to adjust the flow rate of the liquid column impacted by the jet in different areas, thereby adjusting and controlling the heat radiation capability of the heat radiation device 10 to different areas of the heat source S1. For example, in a region (also referred to as a hot spot region) where heat generation of the heat source S1 is serious, the jet holes 14h facing the region are provided so as to correspond to a structure where the jet intensity is large.

Alternatively, the axis of the jet column 140 may be non-perpendicular to the surface of the heat source S1, so that the jet column 140 has the function of adjusting the flow direction of the liquid and guiding the liquid to the hot spot area accurately.

In addition to the jet stack 140 comprising a cylindrical body 141, the jet stack 140 optionally comprises a deflector 142. The flow guide 142 is located at an outer peripheral region of the end of the main body 141 near the heat source S1. The surface of the flow guiding portion 142 is formed into a substantially conical shape, and the extending direction of the conical bus bar away from the direction of the heat source S1 is substantially towards the position of the outlet 10b, so that the liquid with jet impact can be guided to the outlet 10b, the phenomenon of flow blockage and/or unstable flow of the liquid in the heat dissipation cavity 12 is avoided, and the liquid in the heat dissipation device 10 flows smoothly.

Optionally, the fluidic layer 14 further includes a connecting structure connecting adjacent fluidic columns 140, and the fluidic layer 14 further forms openings 144 between adjacent fluidic columns 140. The opening 144 communicates with the liquid outlet of the jet column 140 and the outlet 10b. The heat dissipation chamber 12 forms a return chamber 122 in a chamber body on the side of the opening 144 near the outlet 10b, and after the jet stream impinges on the heat source S1, the liquid emitted from the jet stream column 140 flows through the opening 144 into the return chamber 122 and then flows out of the heat dissipation device 10 through the outlet 10b.

Alternatively, the outer peripheral portion 143 of the fluidic layer 14 and the sidewall 10d are connected to stabilize the structure of the fluidic layer 14. Alternatively, the jet layer 14 may be welded to the sidewall 10d and/or the jet spacer 13; at least two of the jet layer 14, the jet separator 13, and the side wall 10d may be integrally formed.

Alternatively, the sidewall 10d is not in contact with the heat source S1, and a space between the sidewall 10d and the heat source S1 is formed as the side cavity 123. The side chamber 123 surrounds the outer periphery of the heat source S1, so that the liquid can flow to the outer peripheral wall of the heat source S1 to cool the outer peripheral wall of the heat source S1 in a direct contact manner.

It is understood that the number of sources or chips within a heat sink is not limited to one. There may be multiple heat sources or chips within a heat sink, or multiple different types of heat sources.

(second embodiment of heat sink)

Referring to fig. 5, a second embodiment of the heat dissipating device is described. The second embodiment is a modification of the first embodiment, and for the same or similar features as those of the first embodiment, the same reference numerals are used in the present embodiment, and detailed description of these features is omitted.

In the present embodiment, the liquid separation chamber 11 has three subchambers, namely, a primary subchamber 11a, a secondary subchamber 11b, and a tertiary subchamber 11c, which are sequentially connected in series in the flow direction of the liquid. The primary subchamber 11a and the secondary subchamber 11b are separated by a liquid separating partition plate 11p (hereinafter also referred to as an upstream liquid separating partition plate), and a plurality of liquid separating holes 11h (hereinafter also referred to as upstream liquid separating holes) which are communicated with the primary subchamber 11a and the secondary subchamber 11b are formed in the upstream liquid separating partition plate; the secondary subchamber 11b and the tertiary subchamber 11c are separated by another liquid separation partition 11p (hereinafter also referred to as a downstream liquid separation partition), and a plurality of liquid separation holes 11h (hereinafter also referred to as downstream liquid separation holes) communicating the secondary subchamber 11b and the tertiary subchamber 11c are formed in the downstream liquid separation partition.

Optionally, the aperture of the upstream tap hole is larger than the aperture of the downstream tap hole. Optionally, the number of downstream dispensing orifices is greater than the number of upstream dispensing orifices. The liquid flow device has the advantages that the trend of pressure change is stable in the process of gradually flowing through the liquid separating holes, the liquid flow is smooth, and blockage is not easy to occur.

Optionally, the upstream and downstream liquid dividing holes are at least partially offset, or the axis of at least one of the plurality of upstream liquid dividing holes is not coincident with the axis of all downstream liquid dividing holes. The staggered arrangement improves the guiding and distributing capacity of the multi-stage liquid distributing holes to the liquid, and can lead the liquid to be more uniform in the flowing process.

It should be understood that the present application is not limited to the number of subchambers within the fluid chamber, and that the number of subchambers may be increased depending on the different sizes of the heat dissipating device and the different heat dissipating requirements.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

A heat sink for supplying a liquid to a heat source (S1), characterized in that,

the heat dissipation device comprises a liquid separation cavity (11) and a heat dissipation cavity (12) which are communicated by a plurality of jet holes (14 h), the liquid separation cavity (11) is provided with an inlet (10 a) of the liquid, the heat source (S1) is at least partially accommodated in the heat dissipation cavity (12),

the liquid separating cavity (11) comprises at least two subchambers, the liquid sequentially flows through each subchamber and then enters the heat dissipating cavity (12),

on the flow path of the liquid, two adjacent subchambers are communicated by a plurality of liquid separating holes (11 h).
The heat sink according to claim 1, characterized in that a plurality of tubular jet columns (140) communicating with the jet holes (14 h) are provided in the heat sink (12), the jet columns (140) extending from the jet holes (14 h) towards the heat source (S1).
The heat sink according to claim 1 or 2, characterized in that the liquid separation chamber (11) comprises at least three subchambers,

in the flow path of the liquid, the opening area of the liquid separation hole (11 h) located upstream is larger than the opening area of the liquid separation hole (11 h) located downstream.
A heat sink according to any one of claims 1-3, characterized in that the axis of at least one of the liquid dividing holes (11 h) located upstream is not coincident with the axis of all liquid dividing holes (11 h) located downstream.
The heat sink according to any one of claims 1 to 4, characterized in that the opening area of the liquid dividing hole (11 h) is larger than the opening area of the jet hole (14 h).
The heat sink according to claim 5, wherein the opening area of the liquid separation hole (11 h) is 3 times or more the opening area of the jet hole (14 h).
The heat sink according to claim 5 or 6, characterized in that the opening areas of at least two of the jet holes (14 h) of the plurality of jet holes (14 h) are different.
The heat sink according to claim 2, characterized in that the cross-sectional area of the internal through-hole of the jet column (140) is equal to the cross-sectional area of the jet aperture (14 h).
The heat sink according to claim 2 or 8, characterized in that the peripheral wall of the heat sink chamber (12) is formed with a plurality of outlets (10 b) for the liquid to flow out of the heat sink chamber (12),

the jet column (140) forms a flow guide part (142) at least near the periphery of the end part of the heat source (S1), and the flow guide part (142) has a surface capable of guiding the liquid to the direction of the outlet (10 b).
The heat sink according to claim 9, wherein a plurality of the jet columns (140) are connected to each other and form a jet layer (14), and openings (144) penetrating the jet layer (14) and communicating with the outlet (10 b) are formed between adjacent jet columns (140).
The heat sink according to claim 10, characterized in that the heat sink comprises a jet spacer (13) for spacing the liquid separation chamber (11) and the heat sink chamber (12), the jet aperture (14 h) penetrating the jet spacer (13) in the thickness direction of the jet spacer (13),

the jet layer (14) is welded to the jet separator (13), or

The jet layer (14) is formed integrally with the jet separator (13).
The heat sink according to claim 9, wherein the inlet (10 a) is in communication with the plurality of outlets (10 b).
The heat sink according to any one of the claims 1 to 12, characterized in that the heat sink (12) comprises a side wall (10 d), the side wall (10 d) surrounding the periphery of the heat source (S1), the side wall (10 d) being free from contact with the heat source (S1),

the heat dissipation cavity (12) comprises a side cavity (123) located between the heat source (S1) and the side wall (10 d).
The heat sink according to claim 13, wherein the heat sink is adapted to dissipate heat of an electronic device comprising the heat source (S1), the electronic device further comprising a base (S0), the heat source (S1) being arranged on one surface of the base (S0),

the side wall (10 d) is intended to abut against the one surface of the base (S0),

the heat dissipation device further comprises a sealing ring (15), the sealing ring (15) is sleeved on the periphery of the heat source (S1), the sealing ring (15) is embedded on the inner periphery of the side wall (10 d), and one end face of the sealing ring (15) abuts against one surface of the base (S0).
The heat sink according to any one of claims 1 to 14, characterized in that the liquid separation chamber (11) is located above the heat sink chamber (12), a lower part of the heat sink chamber (12) being used for arranging the heat source (S1).
The heat sink according to any of the claims 1 to 15, characterized in that the heat source (S1) comprises a chip.
A heat dissipating system comprising a pump (20), a reservoir (30) and at least one heat dissipating device according to any of claims 1 to 16,

the pump (20) is used for pumping the liquid in the liquid storage tank (30) to the heat dissipation device and pumping the liquid flowing out of the heat dissipation device back to the liquid storage tank (30).
The heat removal system of claim 17, further comprising a refrigerator (40) and a preheater (50),

the refrigerator (40) is arranged at the downstream of the heat radiating device and at the upstream of the liquid storage tank (30), the refrigerator (40) is used for cooling the liquid flowing through,

the preheater (50) is arranged downstream of the liquid storage tank (30) and upstream of the heat dissipating device, and the preheater (50) is used for heating the liquid flowing through to a predetermined temperature.