WO2022246637A1 - Heat dissipation device and heat dissipation system - Google Patents
Heat dissipation device and heat dissipation system Download PDFInfo
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- WO2022246637A1 WO2022246637A1 PCT/CN2021/095729 CN2021095729W WO2022246637A1 WO 2022246637 A1 WO2022246637 A1 WO 2022246637A1 CN 2021095729 W CN2021095729 W CN 2021095729W WO 2022246637 A1 WO2022246637 A1 WO 2022246637A1
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- heat dissipation
- liquid
- jet
- heat
- dissipation device
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 116
- 239000007788 liquid Substances 0.000 claims abstract description 231
- 238000009826 distribution Methods 0.000 claims abstract description 14
- 238000000926 separation method Methods 0.000 claims description 69
- 238000001816 cooling Methods 0.000 claims description 51
- 238000005192 partition Methods 0.000 claims description 21
- 238000011144 upstream manufacturing Methods 0.000 claims description 18
- 238000003860 storage Methods 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 description 16
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000011148 porous material Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000001012 protector Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- the present application relates to the field of heat dissipation equipment, and more specifically relates to a heat dissipation device and a heat dissipation system.
- the existing heat dissipation methods for chips mainly include air cooling and liquid cooling.
- the air-cooled structure is simple and reliable, but its heat dissipation capacity is limited, and it is difficult to meet the heat dissipation requirements of high-power and high-heat-flux components.
- Liquid cooling generally uses a flow channel cold plate as a heat exchange device. A thermal interface material is required to connect the common flow channel cold plate and the chip. The heat dissipation capacity of the flow channel cold plate is limited by the heat transfer performance of the thermal interface material. Therefore, for chips with high heat flux density and high power consumption, it is difficult for ordinary runner cold plates to provide efficient heat dissipation.
- the present application provides a heat dissipation device and a heat dissipation system.
- embodiments of the present application provide a heat dissipation device.
- the heat dissipation device is used to supply liquid to the heat source, which includes a liquid separation cavity and a heat dissipation cavity connected by a plurality of jet holes, the liquid separation cavity is formed with an inlet of liquid, and the heat source at least partially housed within the cooling cavity,
- the liquid separation chamber includes at least two sub-cavities, and the liquid flows through each sub-cavity in turn and then enters the cooling chamber.
- the sub-cavities arranged step by step in the liquid separation chamber play a role in guiding and distributing the liquid in the flow process.
- the flow speed is closer, so that the liquid flows evenly after entering the heat dissipation cavity, and the heat dissipation effect is good.
- a plurality of tubular jet columns communicating with the jet holes are arranged in the cooling cavity, and the jet columns are directed from the jet holes toward Heat source extension.
- the jet column guides the liquid to the vicinity of the heat source, and the liquid forms a jet impact after flowing out of the jet column, which is equivalent to reducing the distance between the liquid in the free impact state and the heat source, reducing the speed loss of the liquid during the flow process, and ensuring The effect of jet impact.
- the liquid separation chamber includes at least three sub-cavities
- the opening area of the liquid separation hole located upstream is larger than the opening area of the liquid separation hole located downstream.
- the opening area (pore diameter) of the upstream liquid separation hole is larger than the opening area (pore diameter) of the downstream liquid separation hole, which makes it difficult for the liquid to be blocked during the flow process and the flow is smooth.
- the axes of at least one upstream liquid distribution hole do not coincide with the axes of all downstream liquid distribution holes.
- the plurality of liquid distribution holes located upstream and the plurality of liquid distribution holes located downstream are at least partly staggered, which improves the guiding and distributing ability of the liquid distribution holes to the liquid, and makes the liquid flow more uniformly during the flow process.
- the opening area of the liquid separation hole is larger than the opening area of the jet hole.
- the opening area (aperture) of the liquid separation hole is larger than that of the jet hole, which makes it difficult for the liquid to be blocked during the flow process, and the flow is smooth.
- the opening area of the liquid separation hole is more than three times the opening area of the jet hole.
- the opening area (aperture) of the liquid separation hole is large, which ensures that the liquid has a greater pressure when it flows to the jet hole, or that the liquid does not flow in the liquid separation cavity. As for the occurrence of a large pressure drop, the subsequent jet effect is guaranteed.
- At least two of the jet holes have different opening areas.
- the differential setting of the opening area (aperture diameter) of the jet hole can realize the liquid with different jet velocity in different areas, so as to provide stronger jet impact for the key cooling area of the heat source as required.
- the cross-sectional area of the internal through hole of the jet column is equal to the cross-sectional area of the jet hole.
- the cross-sectional area (inner diameter) of the jet column is equal to that of the jet hole, which makes the pressure drop during the flow of the liquid in the jet column very small. In other words, increasing the length of the jet column has little effect on the system pressure drop of the cooling device. It is easy to cause loss of additional liquid pumping power.
- a plurality of outlets for allowing liquid to flow out of the heat dissipation chamber are formed on the peripheral wall of the heat dissipation chamber,
- a flow guide part is formed on the outer periphery of the jet column at least near the end of the heat source, and the flow guide part has a surface capable of guiding the liquid to the direction of the outlet.
- the surface structure of the guide part can guide the liquid to the outlet, avoiding flow blockage and/or unstable flow of the liquid in the heat dissipation chamber, so that the liquid in the heat dissipation device flows smoothly and has a good cooling effect.
- a plurality of jet columns are connected to each other to form a jet layer, and a penetrating jet layer is formed between adjacent jet columns and An opening leading to an outlet.
- the jet layer formed by the connected jet columns has high structural strength, is easy to manufacture and is not easily damaged.
- the heat dissipation device includes a jet partition for separating the liquid separation chamber and the heat dissipation chamber, and the jet hole is located in the jet partition. through the jet diaphragm in the thickness direction,
- the fluidic layer is welded to the fluidic diaphragm, or
- the jet layer is integrally formed with the jet partition.
- connection mode of the jet layer and the jet partition is simple and flexible, and can be welded or integrally formed.
- the inlet is connected to a plurality of outlets.
- the connected inlet and outlet realize the continuous circulation of the liquid in the cooling device.
- the heat dissipation chamber includes a side wall, the side wall surrounds the outer periphery of the heat source, and the side wall does not contact the heat source,
- the heat dissipation cavity includes a side cavity between the heat source and the side wall.
- the liquid When the liquid flows into the side cavity, it can contact the outer peripheral surface of the heat source, so that the contact area between the heat source and the liquid is large, and the heat dissipation effect is good.
- the heat dissipation device is used to dissipate heat from an electronic device including a heat source, and the electronic device further includes a base, and the heat source is arranged on the base a surface of
- the heat dissipation device further includes a sealing ring, which is sleeved on the outer periphery of the heat source and embedded in the inner periphery of the side wall, and one end surface of the sealing ring abuts against a surface of the base.
- the sealing ring forms a seal between the heat source and the side wall, and the sealing ring abuts against a surface of the base to make the sealing structure more reliable.
- the liquid separation chamber is located above the heat dissipation chamber, and the lower part of the heat dissipation chamber is used for disposing a heat source.
- the upper and lower arrangement of the liquid separation chamber and the heat dissipation chamber makes the power of the liquid flow in the heat dissipation device not only provided by the pump, but also by its own gravity, and the jet impact effect is good.
- the heat source includes a chip.
- the heat dissipation device can provide high-efficiency heat dissipation for chips with high power density, and avoid high temperature or overheating in local areas of the chip.
- embodiments of the present application provide a heat dissipation system.
- the heat dissipation system includes a pump, a liquid storage tank, and at least one heat dissipation device according to any possible implementation manner of the first aspect of the present application,
- the pump is used to pump the liquid in the liquid storage tank to the heat sink and to pump the liquid flowing from the heat sink back to the liquid storage tank.
- the liquid in the heat dissipation system can achieve internal circulation under the driving action of the pump, and a heat dissipation system can provide heat dissipation function for one or more devices, or one or more heat sources of the devices.
- the heat dissipation system further includes a refrigerator and a preheater
- the refrigerator is arranged downstream of the heat sink and upstream of the liquid storage tank, and the refrigerator is used to cool down the liquid flowing through it.
- the preheater is arranged downstream of the liquid storage tank and upstream of the cooling device, and the preheater is used to heat the flowing liquid to a predetermined temperature.
- the refrigerator is convenient to cool down the superheated liquid flowing through the cooling device in the system, and the preheater can heat the liquid that is going to flow into the cooling device to a suitable temperature, so that factors such as the density, viscosity, pressure difference and flow rate of the liquid can be controlled at a temperature
- the optimal state is achieved under the condition of control, and the heat transfer performance of the system is improved.
- Fig. 1 is a schematic diagram of the state of the liquid jet impacting the impacted surface
- FIGS. 2 and 3 are schematic diagrams of two possible implementations of the heat dissipation system according to the present application.
- Fig. 4 and Fig. 5 are schematic diagrams of two possible implementations of the heat dissipation device according to the present application.
- 10 cooling device 10a inlet; 10b outlet; 10c upper wall; 10d side wall;
- 11 liquid separation cavity 11a first-level sub-cavity; 11b second-level sub-cavity; 11c third-level sub-cavity; 11h liquid separation hole; 11p liquid separation partition;
- heat dissipation system and heat dissipation device will be introduced below with the up-down relationship in the figure. It should be understood that the up and down relationship of each component in the device is relative, and the up and down position of each component will change accordingly according to the different usage status of the device.
- the heat dissipation device and heat dissipation system according to the present application are introduced.
- the heat dissipation device of the present application is not limited to be used for heat dissipation of chips.
- Micro-channel heat sink (also known as micro-channel heat exchanger) is a potential high-efficiency heat dissipation device.
- the microchannel heat sink has large specific surface area, compact structure, small heat transfer temperature difference and high heat transfer efficiency, and it can be applied as a cooling device such as a chip.
- the heat dissipation device provided by combining the jet liquid cooling technology (also called the jet cooling technology) is another kind of high-efficiency heat dissipation device with potential.
- This cooling device (also referred to as jet device hereinafter) makes liquid (also referred to as working fluid) pass through micro-holes or slits under a certain pressure difference, and then impacts the surface of the chip in the form of high-speed jet liquid.
- liquid also referred to as working fluid
- the boundary layer in this area is relatively thin, and the local heat transfer coefficient is large.
- the cooling effect can be improved by making the stagnation zone s coincide with the high heat flux zone.
- the heat transfer performance of the impinging jet is affected by many parameters, such as the velocity of the impinging jet, the shape of the nozzle, the arrangement of the nozzle array, the diameter of the nozzle, the distance between the nozzle and the surface of the chip, the angle of the nozzle relative to the chip, and the distance between the nozzles, etc. , the heat transfer performance is difficult to control; on the other hand, due to the relatively complex microchannel structure, the resistance along the flow of the working fluid is relatively large, which will significantly increase the pump power loss of the system and increase the risk of system blockage.
- a possible method is to reduce the distance between the jet hole j and the impacted surface f (or the height of the jet cavity), for example, set the distance to less than 0.5 mm.
- the pressure drop of the jet cavity needs to be limited (for example, less than 30kpa); the increase in pressure drop will cause the flow rate of the working fluid to decrease, which in turn will cause a decrease in the heat dissipation effect.
- the smaller the height of the jet cavity the smaller the distance between the inlet and outlet, resulting in a higher temperature of the liquid at the inlet, thereby affecting the cooling effect of the jet.
- the applicant made the present application in consideration of some circumstances including the above-mentioned ones.
- the heat dissipation device according to the present application is arranged in a heat dissipation system capable of providing a circulating flow path, and the heat dissipation device can provide a heat source with uniform and sufficient cooling liquid (hereinafter also referred to as liquid).
- Fig. 2 shows a heat dissipation system according to an embodiment of the present application. It comprises a heat sink 10 and a piping system external to the heat sink 10 providing it with an external liquid circulation.
- the piping system includes a pump 20 and a reservoir 30 .
- the pipeline system further includes a refrigerator 40, a preheater 50, a flow meter 60, a shut-off valve 71, a flow valve 72, a side valve 73, a filter 80, a sight glass 90 and a pressure protector p.
- there are two flowmeters 60 which are respectively arranged upstream and downstream of the cooling device 10 , so as to accurately measure the liquid flow rate and provide a basis for controlling the liquid flow rate in the cooling device 10 .
- the refrigerator 40 is disposed close to the outlet of the heat sink 10 to cool down the liquid flowing through the heat sink 10 that has absorbed the heat of the heat source S1 .
- the preheater 50 is arranged close to the inlet of the cooling device 10 to stabilize the liquid in the system at a suitable temperature.
- the serial order of the components in the heat dissipation system is: liquid storage tank 30, pump 20, stop valve 71, preheater 50, filter 80, flow meter 60, and sight glass 90 , flow valve 72, pressure protector p, cooling device 10, flow meter 60 and refrigerator 40.
- the liquid storage tank 30 is used to contain a certain amount of cooling liquid.
- the liquid storage tank 30 is connected downstream with the pump 20 , and the pump 20 pumps the liquid to the downstream cooling device 10 at a certain pressure.
- the pump 20 is connected downstream with a shut-off valve 71 .
- the shut-off valve 71 When the heat sink 10 is working normally, the shut-off valve 71 is in a conduction state, and liquid can flow through the shut-off valve 71 . In the event that the flow cycle of the liquid needs to be interrupted, for example when the cooling system needs to be repaired, the shut-off valve 71 is closed.
- the shut-off valve 71 is connected downstream to the preheater 50 .
- a preheater 50 is used to heat the liquid to a suitable temperature, eg 40°C. This is because, after the refrigerator 40 in the pipeline system cools down the temperature of the liquid, the liquid with too low temperature does not necessarily have optimal heat exchange performance.
- the temperature of the liquid will affect its density, viscosity, pressure and flow rate, and the liquid at an appropriate temperature can make the liquid flowing through the cooling device 10 have higher heat transfer performance.
- the preheater 50 is connected downstream with a filter 80 .
- the filter 80 can filter impurities in the liquid to prevent the pipeline system from being blocked or the flow performance of the liquid from being reduced.
- the filter 80 is connected downstream to the flow meter 60 .
- the flow meter 60 here is used to measure the flow of liquid ready to flow into the heat sink 10 .
- Flow meter 60 is connected downstream to sight glass 90 .
- the sight glass 90 has a transparent observation area to facilitate observation of the state of the liquid, such as whether the liquid is flowing or whether there are impurities in the liquid.
- Sight glass 90 is connected downstream to flow valve 72 .
- the flow valve 72 is used to regulate the liquid flow in the pipeline according to the reading of the flow meter 60 .
- a pressure protector p is provided between the flow valve 72 and the inlet of the cooling device 10, for releasing pressure to protect various components in the system, for example, when the system pressure is overloaded.
- the outlet of the heat sink 10 is connected to another flow meter 60 which is connected downstream to the refrigerator 40 .
- a refrigerator 40 is connected downstream to the inlet of the liquid storage tank 30 to complete the cycle of the system.
- a side valve 73 is provided in the branch, and the side valve 73 is used to adjust the flow of liquid in the system when necessary.
- connection sequence of the components in the above pipeline system is not unique, and in other possible implementations, the connection sequence of certain components may be exchanged, and some components may also be omitted.
- a cooling system may also include multiple cooling devices 10 , or multiple cooling devices 10 may share a set of external piping systems.
- the plurality of cooling devices 10 are connected together in parallel.
- the first embodiment of the heat sink is introduced.
- the heat sink 10 is formed in a cover shape, and has an upper wall 10c and a side wall 10d.
- the side wall 10d surrounds the outer periphery of the upper wall 10c in a ring shape.
- the side wall 10d and the upper wall 10c may be two parts connected together, or may be formed as a whole.
- An opening is formed on the side wall 10d at the end opposite to the upper wall 10c, and the opening is used to allow the heat source S1 of the heat sink to protrude, or in other words, the cover-shaped heat sink 10 covers the heat source S1 inside.
- the heat source S1 is a chip.
- the heat source S1 is disposed on a base S0 (for example, a substrate of a chip).
- the side wall 10d abuts against the surface of the base S0 and forms a sealing structure between the side wall 10d and the base S0.
- heat source S1 may also be different from the chip, such as other electronic equipment and its components.
- the heat sink 10 further includes a sealing ring 15 between the outer periphery of the heat source S1 and the inner periphery of the side wall 10d.
- the lower bottom surface of the sealing ring 15 abuts against the surface of the base S0 to ensure the sealing between the side wall 10d and the base S0.
- the inner cavity of the cooling device 10 is provided with a jet partition 13 , thereby dividing the inner cavity into a liquid separation chamber 11 and a heat dissipation chamber 12 located on both sides of the jet partition 13 .
- a plurality of jet holes 14 h are formed in the jet partition 13 , so as to connect the liquid separation chamber 11 and the heat dissipation chamber 12 , so that liquid can enter the heat dissipation chamber 12 from the liquid separation chamber 11 .
- the liquid separation chamber 11 is formed with an inlet 10a, and the inlet 10a may also be referred to as a liquid inlet or a liquid inlet of a heat sink.
- the inlet 10a is disposed on the top of the liquid separation chamber 11 (for example, formed on the upper wall 10c in this embodiment).
- the liquid in the external piping system enters the liquid separation chamber 11 through the inlet 10a.
- the liquid separation chamber 11 can regulate the flow of the liquid so that the liquid passes through the jet hole 14h at a certain pressure and flow rate.
- the liquid passing through the jet hole 14h flows to the surface of the heat source S1 in the way of jet impact in the cooling cavity 12, and takes away the heat of the heat source S1.
- the peripheral wall of the cooling chamber 12 is formed with one or more outlets 10b surrounding the cooling chamber, and the liquid can flow out of the cooling chamber 12 through the outlets 10b to enter the external piping system for the next cycle.
- the outlet 10b here may also be referred to as a liquid outlet or a liquid outlet of the heat sink.
- the liquid separation chamber 11 includes a primary sub-cavity 11a and a secondary sub-cavity 11b. These two sub-chambers are separated by a liquid separator 11p.
- the outer periphery of the liquid separation partition 11p is connected to the side wall 10d, and a plurality of liquid separation holes 11h are formed in the liquid separation partition 11p, and the liquid separation holes 11h are connected to the primary sub-cavity 11a and the secondary sub-cavity 11b.
- the liquid separation separator 11p is arranged facing the inlet 10a, or in other words, the axis of the liquid separation hole 11h is parallel to the axis of the inlet 10a.
- a plurality of liquid separation holes 11h are evenly distributed on the liquid separation separator 11p.
- holes or openings above or below, although axes and diameters are used to describe, the present application does not limit the shapes of various holes and openings, and these holes and openings do not necessarily have to be cylindrical as a whole.
- the size of the aperture is used to express the size of the hole or opening, that is, the area of the area surrounded by the hole or opening; for the convenience of expression, the area surrounded by the hole or opening is also used below The area of is replaced by the aperture or opening area.
- the liquid will sequentially flow through the inlet 10a, the primary sub-cavity 11a, the liquid separation hole 11h and the secondary sub-cavity 11b.
- the dotted arrows in FIG. 4 schematically show the flow method of the liquid in the heat sink 10 .
- the liquid distribution hole 11h plays a role in guiding and distributing the liquid, so that the liquid flowing into the secondary sub-cavity 11b flows more uniformly than the liquid located in the primary sub-cavity 11a, which in turn makes the liquid flowing into the cooling chamber 12 The liquid flows evenly, so that the liquid can have a better heat dissipation effect when the jet flow hits the heat source S1.
- the hood-shaped heat dissipation device 10 is arranged with the opening (the side where the heat source S1 is located) facing downward; optionally, the liquid separation chamber 11 is located above the heat dissipation chamber 12; Above the secondary sub-cavity 11b; Optionally, the inlet 10a is located above the outlet 10b.
- the above arrangement makes the flow of the liquid in the cooling device not only rely on the pressure provided by the pump, but also rely on its own gravity, and the impact effect of the jet is good.
- the arrangement direction of the heat sink 10 can be changed accordingly.
- the structure is rotated by 90° and set in such a way that the opening faces along the horizontal direction.
- the specific positions of the cavities and the inlet 10a and outlet 10b inside the cooling device 10 can also be adjusted according to actual application scenarios.
- the aperture (or opening area or cross-sectional area) of the liquid distribution hole 11h is larger than the aperture (or opening area or cross-sectional area) of the jet hole 14h (or Said opening area or cross-sectional area) is much larger.
- the aperture (or opening area or cross-sectional area) of the liquid separation hole 11h is more than three times the aperture (or opening area or cross-sectional area) of the jet hole 14h. Therefore, the liquid in the liquid separation chamber 11 can be regulated in a balanced flow, and will not be greatly hindered and its flow velocity will not be lost too much, thereby ensuring the subsequent jet impact effect.
- a fluidic layer 14 is also formed in the cooling cavity 12 .
- the fluidic layer 14 includes a plurality of fluidic columns 140 arranged in an array, and each fluidic column 140 is arranged in alignment with a fluidic hole 14h.
- the jet column 140 is in the shape of a hollow tube, one end of which is connected to the surface of the jet partition 13, so that the internal channel of the jet column 140 is connected to the jet hole 14h, and the other end extends to the vicinity of the heat source S1, so that the liquid column impacted by the jet is generated in the The area very close to the heat source S1.
- the distance between the liquid outlet of the jet column 140 (that is, the other end) and the heat source S1 is no more than 1 mm, and optionally, the distance between the liquid outlet of the jet column 140 and the heat source S1 is 0.35 to 0.7 mm.
- the diameter of the inner channel of the jet column 140 is equal to the diameter of the jet hole 14h and the two holes are completely aligned. This makes the pressure drop during the flow of the liquid in the jet hole 14h and the jet column 140 very small; and, even if the length of the jet column 140 is increased, the impact on the system pressure drop of the cooling device 10 is also very small, and it is not easy to cause additional The loss of liquid pumping power.
- the length occupied by the jet column 140 also has the effect of widening the distance between the inlet 10a and the outlet 10b, so that the liquid near the inlet 10a The flow of the liquid and the liquid in the vicinity of the outlet 10b interferes less with each other.
- the apertures of the jet holes 14h (and the jet columns 140 connected to the jet holes 14h) at different positions are not exactly the same, so as to adjust the flow rate of the liquid columns impacted by the jets in different areas, thereby adjusting and controlling the cooling device 10 to The heat dissipation capabilities of different regions of the heat source S1.
- the jet hole 14h facing the region is set as a structure corresponding to a higher jet intensity.
- the axis of the jet column 140 may not be perpendicular to the surface of the heat source S1, so that the jet column 140 can adjust the flow direction of the liquid and guide the liquid to the hot spot area accurately.
- the jet column 140 optionally also includes a flow guiding part 142 .
- the air guide part 142 is located at the outer peripheral area of the end of the main body 141 close to the heat source S1.
- the surface of the flow guide part 142 is formed into a substantially conical shape, and the conical generatrix is generally toward the position of the outlet 10b in the direction of extension away from the direction of the heat source S1, so that the liquid that has completed the impact of the jet can be guided to the outlet 10b, avoiding the cooling cavity 12
- the flow of the liquid in the heat sink 10 is blocked and/or unstable, so that the liquid in the heat sink 10 flows smoothly.
- the fluidic layer 14 further includes a connection structure connecting adjacent fluidic columns 140 , and the fluidic layer 14 further forms openings 144 between adjacent fluidic columns 140 .
- the opening 144 communicates the liquid outlet of the jet column 140 with the outlet 10b.
- the cooling chamber 12 forms a recirculation chamber 122 at the side of the opening 144 close to the outlet 10b.
- the liquid injected from the jet column 140 flows through the opening 144 and enters the recirculation chamber 122 after the jet hits the heat source S1, and then flows out of the heat dissipation device through the outlet 10b. 10.
- the peripheral portion 143 of the fluidic layer 14 is connected to the side wall 10d, so that the structure of the fluidic layer 14 is stable.
- the fluidic layer 14 can be welded with the side wall 10d and/or the fluidic partition 13 ; or at least two of the fluidic layer 14 , the fluidic partition 13 and the sidewall 10d can be integrally formed.
- the side wall 10 d is not in contact with the heat source S1 , and the space between the side wall 10 d and the heat source S1 is formed as a side cavity 123 .
- the side cavity 123 surrounds the outer periphery of the heat source S1, so that the liquid can flow to the outer peripheral wall of the heat source S1, and cool down the outer peripheral wall of the heat source S1 in a direct contact manner.
- cooling sources or chips in a heat sink is not limited to one. There may be multiple heat sources or chips in one heat sink, or multiple heat sources of different types.
- a second embodiment of the heat sink is introduced.
- the second embodiment is a modification of the first embodiment, and for features identical or similar to those of the first embodiment, the same reference numerals are used in this embodiment, and detailed descriptions of these features are omitted.
- the liquid separation chamber 11 has three sub-cavities, that is, the primary sub-cavity 11a, the secondary sub-cavity 11b and the tertiary sub-cavity 11c which are serially connected in sequence in the flow direction of the liquid.
- the primary sub-cavity 11a and the secondary sub-cavity 11b are separated by a liquid separation partition 11p (hereinafter also referred to as the upstream liquid separation partition), and a plurality of connected primary sub-cavities 11a are formed in the upstream liquid separation partition and the liquid separation hole 11h (hereinafter also referred to as the upstream liquid separation hole) of the secondary sub-cavity 11b; Separators) are spaced apart, and a plurality of liquid separation holes 11h (hereinafter also referred to as downstream liquid separation holes) connecting the secondary sub-cavity 11b and the tertiary sub-cavity 11c are formed in the downstream liquid separation partition.
- a liquid separation partition 11p hereinafter also referred to as the upstream liquid separation partition
- the upstream liquid separation hole 11h hereinafter also referred to as the upstream liquid separation hole
- the pore diameter of the upstream liquid separation hole is larger than the pore diameter of the downstream liquid separation hole.
- the number of downstream liquid separation holes is greater than the number of upstream liquid separation holes. This makes the trend of pressure change stable when the liquid flows through the liquid separation hole step by step, the liquid flows smoothly, and the blockage is not easy to occur.
- the upstream liquid separation holes and the downstream liquid separation holes are at least partially staggered, or in other words, the axes of at least one of the plurality of upstream liquid separation holes do not coincide with the axes of all the downstream liquid separation holes.
- This staggered setting method improves the guiding and distributing ability of the multi-stage liquid separation holes to the liquid, and can make the liquid tend to be more uniform during the flow process.
- the present application does not limit the number of sub-cavities in the liquid separation chamber, and the number of sub-cavities can be increased according to different scales of heat sinks and different heat dissipation requirements.
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- Thermal Sciences (AREA)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation device for supplying a liquid to a heat source (S1). The heat dissipation device comprises a liquid distribution cavity (11) and a heat dissipation cavity (12) which are in communication with each other by means of a plurality of jet holes (14h), wherein the liquid distribution cavity (11) is provided with a liquid inlet (10a); a heat source (S1) is at least partially accommodated in the heat dissipation cavity (12); the liquid distribution cavity (11) comprises at least two sub-cavities; a liquid flows through the sub-cavities in sequence and then enters the heat dissipation cavity (12); and in the flowing path of the liquid, two adjacent sub-cavities are in communication with each other by means of a plurality of liquid distribution holes (11h). A heat dissipation system is further provided in the present application.
Description
本申请涉及散热设备领域,更具体地涉及一种散热装置和散热系统。The present application relates to the field of heat dissipation equipment, and more specifically relates to a heat dissipation device and a heat dissipation system.
以芯片为例,尤其是对于高度集成化和大规模使用小型电子器件的电子设备的芯片,其功耗密度非常大。Taking chips as an example, especially for chips of highly integrated and large-scale electronic equipment using small electronic devices, their power consumption density is very high.
现有的对芯片进行散热的方式主要有风冷和液冷两种。风冷结构简单可靠性高,但是其散热能力有限,难以满足大功率以及高热流密度元器件的散热需求。液冷一般采用流道冷板作为换热的装置,普通的流道冷板与芯片之间需要有热界面材料进行连接,流道冷板的散热能力受限于热界面材料的传热性能,故针对高热流密度以及高功耗的芯片,普通的流道冷板难以提供高效的散热。The existing heat dissipation methods for chips mainly include air cooling and liquid cooling. The air-cooled structure is simple and reliable, but its heat dissipation capacity is limited, and it is difficult to meet the heat dissipation requirements of high-power and high-heat-flux components. Liquid cooling generally uses a flow channel cold plate as a heat exchange device. A thermal interface material is required to connect the common flow channel cold plate and the chip. The heat dissipation capacity of the flow channel cold plate is limited by the heat transfer performance of the thermal interface material. Therefore, for chips with high heat flux density and high power consumption, it is difficult for ordinary runner cold plates to provide efficient heat dissipation.
因此如何采用高效的散热方案来避免芯片(或者说电子设备)局部区域出现高温或者超温现象,以提高设备的相关性能和可靠性是本领域迫切需要解决的问题。Therefore, how to adopt an efficient heat dissipation solution to avoid high temperature or overheating in a local area of the chip (or electronic device) to improve the performance and reliability of the device is an urgent problem in this field.
发明内容Contents of the invention
有鉴于此,本申请提供一种散热装置和散热系统。In view of this, the present application provides a heat dissipation device and a heat dissipation system.
第一方面,本申请的实施例提供一种散热装置。In a first aspect, embodiments of the present application provide a heat dissipation device.
在第一方面的第一种可能的实现方式中,散热装置用于向热源供给液体,其包括由多个射流孔导通的分液腔和散热腔,分液腔形成有液体的入口,热源至少部分地被容纳在散热腔内,In a first possible implementation of the first aspect, the heat dissipation device is used to supply liquid to the heat source, which includes a liquid separation cavity and a heat dissipation cavity connected by a plurality of jet holes, the liquid separation cavity is formed with an inlet of liquid, and the heat source at least partially housed within the cooling cavity,
分液腔包括至少两个子腔体,液体依次流过各个子腔体后进入散热腔,The liquid separation chamber includes at least two sub-cavities, and the liquid flows through each sub-cavity in turn and then enters the cooling chamber.
在液体的流动路径上,相邻的两个子腔体之间由多个分液孔连通。On the flow path of the liquid, two adjacent sub-cavities are connected by a plurality of liquid distribution holes.
分液腔内逐级设置的子腔体对流动过程中的液体起到了导引分配的作用,例如,位于后一级子腔体的液体较位于前一级子腔体的液体在各处的流动速度更接近,进而使得液体在进入散热腔后流动均匀,散热效果好。The sub-cavities arranged step by step in the liquid separation chamber play a role in guiding and distributing the liquid in the flow process. The flow speed is closer, so that the liquid flows evenly after entering the heat dissipation cavity, and the heat dissipation effect is good.
根据第一方面的第一种可能的实现方式,在散热装置的第二种可能的实现方式中,散热腔内设置有多个管状的、与射流孔连通的射流柱,射流柱从射流孔朝向热源延伸。According to the first possible implementation of the first aspect, in the second possible implementation of the heat dissipation device, a plurality of tubular jet columns communicating with the jet holes are arranged in the cooling cavity, and the jet columns are directed from the jet holes toward Heat source extension.
射流柱将液体引导至热源附近,液体在流出射流柱之后形成射流冲击,这相当于减小了自由冲击状态的液体与热源之间的距离,减少了液体在流动过程中的速度损耗,保证了射流冲击的效果。The jet column guides the liquid to the vicinity of the heat source, and the liquid forms a jet impact after flowing out of the jet column, which is equivalent to reducing the distance between the liquid in the free impact state and the heat source, reducing the speed loss of the liquid during the flow process, and ensuring The effect of jet impact.
根据第一方面的以上任一种可能的实现方式,在散热装置的第三种可能的实现方式中,分液腔包括至少三个子腔体,According to any one of the above possible implementations of the first aspect, in a third possible implementation of the heat sink, the liquid separation chamber includes at least three sub-cavities,
在液体的流动路径上,位于上游的分液孔的开口面积大于位于下游的分液孔的开口面积。On the flow path of the liquid, the opening area of the liquid separation hole located upstream is larger than the opening area of the liquid separation hole located downstream.
上游的分液孔的开口面积(孔径)大于下游的分液孔的开口面积(孔径),这使得液体在流动过程中不容易发生堵塞,流动顺畅。The opening area (pore diameter) of the upstream liquid separation hole is larger than the opening area (pore diameter) of the downstream liquid separation hole, which makes it difficult for the liquid to be blocked during the flow process and the flow is smooth.
根据第一方面的任一种可能的实现方式,在散热装置的第四种可能的实现方式中,至少一个位于上游的分液孔的轴线与位于下游的所有分液孔的轴线都不重合。According to any possible implementation manner of the first aspect, in a fourth possible implementation manner of the heat sink, the axes of at least one upstream liquid distribution hole do not coincide with the axes of all downstream liquid distribution holes.
位于上游的多个分液孔与位于下游的多个分液孔至少部分地错开设置,提高了分液孔对液体的导引分配能力,能使得液体在流动过程中更趋于均匀流动。The plurality of liquid distribution holes located upstream and the plurality of liquid distribution holes located downstream are at least partly staggered, which improves the guiding and distributing ability of the liquid distribution holes to the liquid, and makes the liquid flow more uniformly during the flow process.
根据第一方面的任一种可能的实现方式,在散热装置的第五种可能的实现方式中,分液孔的开口面积大于射流孔的开口面积。According to any possible implementation manner of the first aspect, in a fifth possible implementation manner of the heat sink, the opening area of the liquid separation hole is larger than the opening area of the jet hole.
分液孔的开口面积(孔径)大于射流孔的开口面积(孔径),这使得液体在流动过程中不容易发生堵塞,流动顺畅。The opening area (aperture) of the liquid separation hole is larger than that of the jet hole, which makes it difficult for the liquid to be blocked during the flow process, and the flow is smooth.
根据第一方面的第五种可能的实现方式,在散热装置的第六种可能的实现方式中,分液孔的开口面积是射流孔的开口面积的3倍以上。According to a fifth possible implementation of the first aspect, in a sixth possible implementation of the heat sink, the opening area of the liquid separation hole is more than three times the opening area of the jet hole.
相比于射流孔而言,分液孔的开口面积(孔径)很大,这保证了液体在流至射流孔时具有较大的压力,或者说,液体在分液腔内流动的过程中不至于发生较大的压降,保证了后续的射流效果。Compared with the jet hole, the opening area (aperture) of the liquid separation hole is large, which ensures that the liquid has a greater pressure when it flows to the jet hole, or that the liquid does not flow in the liquid separation cavity. As for the occurrence of a large pressure drop, the subsequent jet effect is guaranteed.
根据第一方面的第五或第六种可能的实现方式,在散热装置的第七种可能的实现方式中,多个射流孔中的至少两个射流孔的开口面积不相同。According to the fifth or sixth possible implementation manner of the first aspect, in a seventh possible implementation manner of the heat sink, at least two of the jet holes have different opening areas.
射流孔的开口面积(孔径)的差异化设置,能实现在不同区域提供不同射流速度的液体,以根据需要为热源的重点冷却区域提供更强的射流冲击。The differential setting of the opening area (aperture diameter) of the jet hole can realize the liquid with different jet velocity in different areas, so as to provide stronger jet impact for the key cooling area of the heat source as required.
根据第一方面的第二种可能的实现方式,在散热装置的第八种可能的实现方式中,射流柱的内部通孔的横截面积等于射流孔的横截面积。According to the second possible implementation manner of the first aspect, in the eighth possible implementation manner of the heat sink, the cross-sectional area of the internal through hole of the jet column is equal to the cross-sectional area of the jet hole.
射流柱与射流孔的横截面积(内径)相等,这使得液体在射流柱内流动的过程中的压降非常小,或者说,增加射流柱长度对散热装置的系统压降影响很小,不容易造成额外的液体泵送功率的损耗。The cross-sectional area (inner diameter) of the jet column is equal to that of the jet hole, which makes the pressure drop during the flow of the liquid in the jet column very small. In other words, increasing the length of the jet column has little effect on the system pressure drop of the cooling device. It is easy to cause loss of additional liquid pumping power.
根据第一方面的第二或第八种可能的实现方式,在散热装置的第九种可能的实现方式中,散热腔的周壁形成有用于供液体流出散热腔的多个出口,According to the second or eighth possible implementation manner of the first aspect, in the ninth possible implementation manner of the heat dissipation device, a plurality of outlets for allowing liquid to flow out of the heat dissipation chamber are formed on the peripheral wall of the heat dissipation chamber,
射流柱在至少靠近热源的端部的外周形成导流部,导流部具有能将液体引导至出口所在方向的表面。A flow guide part is formed on the outer periphery of the jet column at least near the end of the heat source, and the flow guide part has a surface capable of guiding the liquid to the direction of the outlet.
导流部的表面结构能将液体向出口引导,避免散热腔内的液体发生流动阻塞和/或流动不稳定的现象,使得散热装置内的液体流动顺畅、冷却效果好。The surface structure of the guide part can guide the liquid to the outlet, avoiding flow blockage and/or unstable flow of the liquid in the heat dissipation chamber, so that the liquid in the heat dissipation device flows smoothly and has a good cooling effect.
根据第一方面的第九种可能的实现方式,在散热装置的第十种可能的实现方式中,多个射流柱彼此相连并形成射流层,相邻的射流柱之间形成有贯通射流层并与出口导通的开口。According to the ninth possible implementation of the first aspect, in the tenth possible implementation of the heat sink, a plurality of jet columns are connected to each other to form a jet layer, and a penetrating jet layer is formed between adjacent jet columns and An opening leading to an outlet.
彼此相连的射流柱所形成的射流层结构强度高,制作方便且不容易损坏。The jet layer formed by the connected jet columns has high structural strength, is easy to manufacture and is not easily damaged.
根据第一方面的第十种可能的实现方式,在散热装置的第十一种可能的实现方式中,散热装置包括用于间隔分液腔和散热腔的射流隔板,射流孔在射流隔板的厚度方向上贯穿射流隔板,According to the tenth possible implementation of the first aspect, in the eleventh possible implementation of the heat dissipation device, the heat dissipation device includes a jet partition for separating the liquid separation chamber and the heat dissipation chamber, and the jet hole is located in the jet partition. through the jet diaphragm in the thickness direction,
射流层与射流隔板焊接相连,或者The fluidic layer is welded to the fluidic diaphragm, or
射流层与射流隔板形成为一体。The jet layer is integrally formed with the jet partition.
射流层与射流隔板的连接方式简单灵活,可以焊接也可以一体成型地制作。The connection mode of the jet layer and the jet partition is simple and flexible, and can be welded or integrally formed.
根据第一方面的第九种可能的实现方式,在散热装置的第十二种可能的实现方式中,入口与多个出口相连通。According to a ninth possible implementation manner of the first aspect, in a twelfth possible implementation manner of the heat sink, the inlet is connected to a plurality of outlets.
连通的入口和出口实现了散热装置内液体的持续循环。The connected inlet and outlet realize the continuous circulation of the liquid in the cooling device.
根据第一方面的任一种可能的实现方式,在散热装置的第十三种可能的实现方式中,散热腔包括侧壁,侧壁环绕在热源的外周,侧壁与热源不接触,According to any possible implementation manner of the first aspect, in the thirteenth possible implementation manner of the heat dissipation device, the heat dissipation chamber includes a side wall, the side wall surrounds the outer periphery of the heat source, and the side wall does not contact the heat source,
散热腔包括位于热源与侧壁之间的侧边腔。The heat dissipation cavity includes a side cavity between the heat source and the side wall.
液体在流动至侧边腔时能与热源的外周面接触,使得热源与液体的接触面积大,散热效果好。When the liquid flows into the side cavity, it can contact the outer peripheral surface of the heat source, so that the contact area between the heat source and the liquid is large, and the heat dissipation effect is good.
根据第一方面的十三种可能的实现方式,在散热装置的第十四种可能的实现方式中,散热装置用于对包括热源的电子设备进行散热,电子设备还包括基部,热源设置于基部的一个表面,According to the thirteen possible implementation manners of the first aspect, in the fourteenth possible implementation manner of the heat dissipation device, the heat dissipation device is used to dissipate heat from an electronic device including a heat source, and the electronic device further includes a base, and the heat source is arranged on the base a surface of
侧壁用于抵靠至基部的一个表面,a side wall for abutting against a surface of the base,
散热装置还包括密封圈,密封圈套设在热源的外周、且密封圈嵌设在侧壁的内周,密封圈的一个端面抵靠至基部的一个表面。The heat dissipation device further includes a sealing ring, which is sleeved on the outer periphery of the heat source and embedded in the inner periphery of the side wall, and one end surface of the sealing ring abuts against a surface of the base.
密封圈在热源和侧壁之间形成了密封,且密封圈抵靠至基部的一个表面使得密封结构更牢靠。The sealing ring forms a seal between the heat source and the side wall, and the sealing ring abuts against a surface of the base to make the sealing structure more reliable.
根据第一方面的任一种可能的实现方式,在散热装置的第十五种可能的实现方式中,分液腔位于散热腔的上方,散热腔的下部用于设置热源。According to any possible implementation manner of the first aspect, in a fifteenth possible implementation manner of the heat dissipation device, the liquid separation chamber is located above the heat dissipation chamber, and the lower part of the heat dissipation chamber is used for disposing a heat source.
分液腔和散热腔的上下设置方式使得液体在散热装置内的流动的动力除了由泵提供之外还能借助自身的重力,射流冲击效果好。The upper and lower arrangement of the liquid separation chamber and the heat dissipation chamber makes the power of the liquid flow in the heat dissipation device not only provided by the pump, but also by its own gravity, and the jet impact effect is good.
根据第一方面的任一种可能的实现方式,在散热装置的第十六种可能的实现方式中,热源包括芯片。According to any possible implementation manner of the first aspect, in a sixteenth possible implementation manner of the heat sink, the heat source includes a chip.
根据本申请的散热装置能为功率密度较大的芯片提供高效的散热,避免芯片的局部区域出现高温或超温现象。The heat dissipation device according to the present application can provide high-efficiency heat dissipation for chips with high power density, and avoid high temperature or overheating in local areas of the chip.
第二方面,本申请的实施例提供一种散热系统。In a second aspect, embodiments of the present application provide a heat dissipation system.
在第二方面的第一种可能的实现方式中,散热系统包括泵、储液箱和至少一个根据本申请的第一方面的任一种可能的实现方式的散热装置,In a first possible implementation manner of the second aspect, the heat dissipation system includes a pump, a liquid storage tank, and at least one heat dissipation device according to any possible implementation manner of the first aspect of the present application,
泵用于将储液箱内的液体泵送至散热装置,并将从散热装置流出的液体泵送回储液箱。The pump is used to pump the liquid in the liquid storage tank to the heat sink and to pump the liquid flowing from the heat sink back to the liquid storage tank.
散热系统内的液体在泵的驱动作用下能实现内循环,并且一个散热系统能为一个或多个设备、或者说设备的一个或多个热源提供散热功能。The liquid in the heat dissipation system can achieve internal circulation under the driving action of the pump, and a heat dissipation system can provide heat dissipation function for one or more devices, or one or more heat sources of the devices.
根据第二方面的第一种可能的实现方式,在散热系统的第二种可能的实现方式中,散热系统还包括制冷器和预热器,According to the first possible implementation of the second aspect, in the second possible implementation of the heat dissipation system, the heat dissipation system further includes a refrigerator and a preheater,
制冷器设置在散热装置的下游以及储液箱的上游,制冷器用于给流经的液体降温,The refrigerator is arranged downstream of the heat sink and upstream of the liquid storage tank, and the refrigerator is used to cool down the liquid flowing through it.
预热器设置在储液箱的下游以及散热装置的上游,预热器用于将流经的液体加热至预定温度。The preheater is arranged downstream of the liquid storage tank and upstream of the cooling device, and the preheater is used to heat the flowing liquid to a predetermined temperature.
制冷器方便将系统内流过散热装置的过热的液体降温,预热器能将预备流入散热装置的液体加热到合适的温度,使例如液体的密度、黏度、压差和流速等因素在温度 可控的情况下达到最优状态,提高系统的换热性能。The refrigerator is convenient to cool down the superheated liquid flowing through the cooling device in the system, and the preheater can heat the liquid that is going to flow into the cooling device to a suitable temperature, so that factors such as the density, viscosity, pressure difference and flow rate of the liquid can be controlled at a temperature The optimal state is achieved under the condition of control, and the heat transfer performance of the system is improved.
图1是液体射流冲击被冲击表面的状态示意图;Fig. 1 is a schematic diagram of the state of the liquid jet impacting the impacted surface;
图2和图3是根据本申请的散热系统的两个可能的实施方式的示意图;2 and 3 are schematic diagrams of two possible implementations of the heat dissipation system according to the present application;
图4和图5是根据本申请的散热装置的两个可能的实施方式的示意图。Fig. 4 and Fig. 5 are schematic diagrams of two possible implementations of the heat dissipation device according to the present application.
附图标记说明:Explanation of reference signs:
j射流孔;f被冲击表面;s驻点区;j jet hole; f impacted surface; s stagnation area;
S0基部;S1热源;S0 base; S1 heat source;
10散热装置;10a入口;10b出口;10c上壁;10d侧壁;10 cooling device; 10a inlet; 10b outlet; 10c upper wall; 10d side wall;
11分液腔;11a一级子腔体;11b二级子腔体;11c三级子腔体;11h分液孔;11p分液隔板;11 liquid separation cavity; 11a first-level sub-cavity; 11b second-level sub-cavity; 11c third-level sub-cavity; 11h liquid separation hole; 11p liquid separation partition;
12散热腔;121射流腔;122回流腔;123侧边腔;12 cooling cavity; 121 jet cavity; 122 return cavity; 123 side cavity;
13射流隔板;14射流层;14h射流孔;140射流柱;141主体;142导流部;143外周部;144开口;15密封圈;13 jet partition; 14 jet layer; 14h jet hole; 140 jet column; 141 main body; 142 diversion part; 143 peripheral part; 144 opening;
20泵;30储液箱;40制冷器;50预热器;60流量计;71截止阀;72流量阀;73边路阀;80过滤器;90目视镜;p压力保护器。20 pump; 30 liquid storage tank; 40 refrigerator; 50 preheater; 60 flow meter; 71 stop valve; 72 flow valve; 73 side valve; 80 filter;
下面参照附图描述本申请的示例性实施方式。应当理解,这些具体的说明仅用于示教本领域技术人员如何实施本申请,而不用于穷举本申请的所有可行的方式,也不用于限制本申请的范围。Exemplary embodiments of the present application are described below with reference to the accompanying drawings. It should be understood that these specific descriptions are only used to teach those skilled in the art how to implement the present application, but are not intended to exhaust all possible ways of the present application, nor are they used to limit the scope of the present application.
若非特别说明,下文将以图中的上下关系来介绍根据本申请的散热系统和散热装置。应当理解,装置中各部件的上下关系是相对的,根据装置使用状态的不同,各部件的上下位置会随之相应改变。Unless otherwise specified, the heat dissipation system and heat dissipation device according to the present application will be introduced below with the up-down relationship in the figure. It should be understood that the up and down relationship of each component in the device is relative, and the up and down position of each component will change accordingly according to the different usage status of the device.
应当理解,说明书以及权利要求中“和/或”表示所连接对象的至少其中之一,字符“/”一般表示前后关联对象是一种“或”的关系。It should be understood that "and/or" in the specification and claims means at least one of the connected objects, and the character "/" generally means that the related objects are an "or" relationship.
以芯片为例,介绍根据本申请的散热装置和散热系统。但是,应当理解,本申请的散热装置不限于用于芯片的散热。Taking the chip as an example, the heat dissipation device and heat dissipation system according to the present application are introduced. However, it should be understood that the heat dissipation device of the present application is not limited to be used for heat dissipation of chips.
微通道散热器(也称微通道换热器)是一种具有潜力的高效散热设备。微通道散热器的比表面积大、结构紧凑、传热温差小且传热效率高,其能够被应用作为例如芯片的散热装置。Micro-channel heat sink (also known as micro-channel heat exchanger) is a potential high-efficiency heat dissipation device. The microchannel heat sink has large specific surface area, compact structure, small heat transfer temperature difference and high heat transfer efficiency, and it can be applied as a cooling device such as a chip.
然而,液体在微通道内流动时会有较大升温和通道压降,从而使得微通道散热器的散热能力在流动方向上逐渐降低,导致芯片热源的温度逐渐升高。而芯片温度的不均匀性将导致诸如材料热应力和变形等一系列可靠性问题。However, when the liquid flows in the microchannel, there will be a large temperature rise and channel pressure drop, so that the heat dissipation capacity of the microchannel heat sink gradually decreases in the flow direction, resulting in a gradual increase in the temperature of the chip heat source. The non-uniformity of chip temperature will lead to a series of reliability problems such as material thermal stress and deformation.
在微通道散热器的基础上,结合射流液冷技术(也称射流冷却技术)所提供的散热装置是另一种具有潜力的高效散热装置。On the basis of the micro-channel heat sink, the heat dissipation device provided by combining the jet liquid cooling technology (also called the jet cooling technology) is another kind of high-efficiency heat dissipation device with potential.
这种散热装置(下文也称射流装置)使液体(也称工质)在一定压差下通过微型孔或者狭缝后,以高速射流液体的形式冲击芯片表面。如图1所示,在射流孔j正对 的被冲击表面f的驻点区s,该区域的边界层较薄,局部换热系数大。通常,可以通过使驻点区s与高热流密度区域重合,来提高冷却效果。This cooling device (also referred to as jet device hereinafter) makes liquid (also referred to as working fluid) pass through micro-holes or slits under a certain pressure difference, and then impacts the surface of the chip in the form of high-speed jet liquid. As shown in Figure 1, in the stagnation point area s of the impacted surface f facing the jet hole j, the boundary layer in this area is relatively thin, and the local heat transfer coefficient is large. Generally, the cooling effect can be improved by making the stagnation zone s coincide with the high heat flux zone.
然而,一方面,冲击射流的换热性能受较多参数的影响,譬如冲击射流速度、喷嘴形状、喷嘴阵列排列方式、喷嘴直径、喷嘴与芯片表面距离、喷嘴相对于芯片的角度和喷嘴间距等,换热性能难以控制;另一方面,由于微通道结构相对复杂,导致工质流动的沿程阻力较大,这会显著提升系统的泵功率损耗并且使系统的堵塞风险增加。However, on the one hand, the heat transfer performance of the impinging jet is affected by many parameters, such as the velocity of the impinging jet, the shape of the nozzle, the arrangement of the nozzle array, the diameter of the nozzle, the distance between the nozzle and the surface of the chip, the angle of the nozzle relative to the chip, and the distance between the nozzles, etc. , the heat transfer performance is difficult to control; on the other hand, due to the relatively complex microchannel structure, the resistance along the flow of the working fluid is relatively large, which will significantly increase the pump power loss of the system and increase the risk of system blockage.
为了提高射流装置的冷却效果,一种可能的方法是减小射流孔j与被冲击表面f之间的距离(或者说射流腔体的高度),例如将该距离设置为小于0.5mm。In order to improve the cooling effect of the jet device, a possible method is to reduce the distance between the jet hole j and the impacted surface f (or the height of the jet cavity), for example, set the distance to less than 0.5 mm.
在同样的进口流量下,射流腔体的高度减小会使射流冷却效果提升,但这也会造成射流腔体整体压降的显著提升。实际应用中,射流腔体的压降需要有一定的约束(例如小于30kpa);压降提升会造成工质流量降低,从而又造成散热效果下降。此外,射流腔体的高度变小将导致进出口之间相隔距离变小,导致进口的液体温度较高,进而影响射流冷却效果。Under the same inlet flow rate, reducing the height of the jet cavity will improve the cooling effect of the jet, but this will also cause a significant increase in the overall pressure drop of the jet cavity. In practical applications, the pressure drop of the jet cavity needs to be limited (for example, less than 30kpa); the increase in pressure drop will cause the flow rate of the working fluid to decrease, which in turn will cause a decrease in the heat dissipation effect. In addition, the smaller the height of the jet cavity, the smaller the distance between the inlet and outlet, resulting in a higher temperature of the liquid at the inlet, thereby affecting the cooling effect of the jet.
申请人考虑了包括上述情况的一些情况而作出本申请。根据本申请的散热装置设置在能提供循环流路的散热系统中,散热装置能为热源提供流速均匀且流量充足的冷却液(以下也简称液体)。The applicant made the present application in consideration of some circumstances including the above-mentioned ones. The heat dissipation device according to the present application is arranged in a heat dissipation system capable of providing a circulating flow path, and the heat dissipation device can provide a heat source with uniform and sufficient cooling liquid (hereinafter also referred to as liquid).
图2示出了根据本申请的一个实施方式的散热系统。其包括散热装置10以及在散热装置10的外部为其提供外部液体循环的管路系统。Fig. 2 shows a heat dissipation system according to an embodiment of the present application. It comprises a heat sink 10 and a piping system external to the heat sink 10 providing it with an external liquid circulation.
管路系统包括泵20和储液箱30。可选地,管路系统还包括制冷器40、预热器50、流量计60、截止阀71、流量阀72、边路阀73、过滤器80、目视镜90和压力保护器p。The piping system includes a pump 20 and a reservoir 30 . Optionally, the pipeline system further includes a refrigerator 40, a preheater 50, a flow meter 60, a shut-off valve 71, a flow valve 72, a side valve 73, a filter 80, a sight glass 90 and a pressure protector p.
在本实施例中,流量计60有两个,分别设置在散热装置10的上游和下游,以准确计量液体流量,为散热装置10内液体流速的控制提供依据。In this embodiment, there are two flowmeters 60 , which are respectively arranged upstream and downstream of the cooling device 10 , so as to accurately measure the liquid flow rate and provide a basis for controlling the liquid flow rate in the cooling device 10 .
制冷器40靠近散热装置10的出口设置,以给流过散热装置10的吸收了热源S1的热量的液体降温。预热器50靠近散热装置10的入口设置,以将系统内的液体稳定在合适的温度。The refrigerator 40 is disposed close to the outlet of the heat sink 10 to cool down the liquid flowing through the heat sink 10 that has absorbed the heat of the heat source S1 . The preheater 50 is arranged close to the inlet of the cooling device 10 to stabilize the liquid in the system at a suitable temperature.
具体地,顺着液体的流动方向,散热系统内各部件的依次串联顺序为:储液箱30、泵20、截止阀71、预热器50、过滤器80、流量计60、目视镜90、流量阀72、压力保护器p、散热装置10、流量计60和制冷器40。Specifically, along the flow direction of the liquid, the serial order of the components in the heat dissipation system is: liquid storage tank 30, pump 20, stop valve 71, preheater 50, filter 80, flow meter 60, and sight glass 90 , flow valve 72, pressure protector p, cooling device 10, flow meter 60 and refrigerator 40.
储液箱30用于容纳一定量的冷却液。The liquid storage tank 30 is used to contain a certain amount of cooling liquid.
储液箱30在下游与泵20相连,泵20将液体以一定的压力泵送给下游的散热装置10。The liquid storage tank 30 is connected downstream with the pump 20 , and the pump 20 pumps the liquid to the downstream cooling device 10 at a certain pressure.
泵20在下游与截止阀71相连。在散热装置10正常工作的情况下,截止阀71处于导通状态,液体能流过截止阀71。在需要液体的流动循环中断的情况下,例如需要对散热系统进行维修的情况下,截止阀71被关闭。The pump 20 is connected downstream with a shut-off valve 71 . When the heat sink 10 is working normally, the shut-off valve 71 is in a conduction state, and liquid can flow through the shut-off valve 71 . In the event that the flow cycle of the liquid needs to be interrupted, for example when the cooling system needs to be repaired, the shut-off valve 71 is closed.
截止阀71在下游与预热器50相连。预热器50用于将液体加热至合适的温度,例如40℃。这是因为,在管路系统中的制冷器40给液体降温后,过低温度的液体并不一定具有最优的换热性能。液体的温度会影响其密度、黏度、压力和流速,合适温度的液体能使流过散热装置10的液体具有较高的换热性能。The shut-off valve 71 is connected downstream to the preheater 50 . A preheater 50 is used to heat the liquid to a suitable temperature, eg 40°C. This is because, after the refrigerator 40 in the pipeline system cools down the temperature of the liquid, the liquid with too low temperature does not necessarily have optimal heat exchange performance. The temperature of the liquid will affect its density, viscosity, pressure and flow rate, and the liquid at an appropriate temperature can make the liquid flowing through the cooling device 10 have higher heat transfer performance.
预热器50在下游与过滤器80相连。过滤器80能将液体中的杂质过滤,防止管路 系统堵塞或是液体的流动性能降低。The preheater 50 is connected downstream with a filter 80 . The filter 80 can filter impurities in the liquid to prevent the pipeline system from being blocked or the flow performance of the liquid from being reduced.
过滤器80在下游与流量计60相连。此处的流量计60用于计量预备流入散热装置10的液体流量。The filter 80 is connected downstream to the flow meter 60 . The flow meter 60 here is used to measure the flow of liquid ready to flow into the heat sink 10 .
流量计60在下游与目视镜90相连。目视镜90具有透明的观察区,以方便观察液体的状态,例如液体是否在流动或液体内是否有杂质等。 Flow meter 60 is connected downstream to sight glass 90 . The sight glass 90 has a transparent observation area to facilitate observation of the state of the liquid, such as whether the liquid is flowing or whether there are impurities in the liquid.
目视镜90在下游与流量阀72相连。流量阀72用于根据流量计60的读数,调控管路内的液体流量。 Sight glass 90 is connected downstream to flow valve 72 . The flow valve 72 is used to regulate the liquid flow in the pipeline according to the reading of the flow meter 60 .
流量阀72和散热装置10的入口之间设有压力保护器p,用于例如在系统压力过载的情况下泄压以保护系统内的各部件。A pressure protector p is provided between the flow valve 72 and the inlet of the cooling device 10, for releasing pressure to protect various components in the system, for example, when the system pressure is overloaded.
散热装置10的出口连接另一个流量计60,该流量计60在下游连接制冷器40。制冷器40在下游与储液箱30的入口相连,形成系统的完整循环。The outlet of the heat sink 10 is connected to another flow meter 60 which is connected downstream to the refrigerator 40 . A refrigerator 40 is connected downstream to the inlet of the liquid storage tank 30 to complete the cycle of the system.
泵20的下游还设有使液体流回储液箱30的支路。该支路中设有边路阀73,边路阀73用于在需要时调整系统内液体的流量。Downstream of the pump 20 there is also a branch for the liquid to flow back to the reservoir 30 . A side valve 73 is provided in the branch, and the side valve 73 is used to adjust the flow of liquid in the system when necessary.
应当理解,上述管路系统中各部件的连接顺序不是唯一的,在其它可能的实施方式中,某几个部件的连接顺序可以交换,此外,部分部件也可以被省略。It should be understood that the connection sequence of the components in the above pipeline system is not unique, and in other possible implementations, the connection sequence of certain components may be exchanged, and some components may also be omitted.
此外,参照图3,一个散热系统也可以包括多个散热装置10,或者说多个散热装置10可以共用一套外部的管路系统。可选地,这多个散热装置10以并联的方式连接在一起。In addition, referring to FIG. 3 , a cooling system may also include multiple cooling devices 10 , or multiple cooling devices 10 may share a set of external piping systems. Optionally, the plurality of cooling devices 10 are connected together in parallel.
接下来,参照图4和图5介绍根据本申请的散热装置10。Next, the heat sink 10 according to the present application will be described with reference to FIGS. 4 and 5 .
(散热装置的第一实施方式)(First embodiment of heat sink)
参照图4,首先介绍散热装置的第一实施方式。Referring to FIG. 4 , firstly, the first embodiment of the heat sink is introduced.
散热装置10形成为罩状,其具有上壁10c和侧壁10d。侧壁10d呈环形地围拢在上壁10c的外周部。可选地,侧壁10d和上壁10c可以是连接在一起的两个部分,也可以形成为一体。The heat sink 10 is formed in a cover shape, and has an upper wall 10c and a side wall 10d. The side wall 10d surrounds the outer periphery of the upper wall 10c in a ring shape. Optionally, the side wall 10d and the upper wall 10c may be two parts connected together, or may be formed as a whole.
侧壁10d在与上壁10c相对的一端形成开口,该开口用于使被散热件的热源S1伸入,或者说,罩状的散热装置10将热源S1罩在其内部。An opening is formed on the side wall 10d at the end opposite to the upper wall 10c, and the opening is used to allow the heat source S1 of the heat sink to protrude, or in other words, the cover-shaped heat sink 10 covers the heat source S1 inside.
本实施方式中,热源S1为芯片。热源S1设置在基部S0(例如为芯片的基板)之上。侧壁10d抵接到基部S0的表面,并在侧壁10d和基部S0之间形成密封结构。In this embodiment, the heat source S1 is a chip. The heat source S1 is disposed on a base S0 (for example, a substrate of a chip). The side wall 10d abuts against the surface of the base S0 and forms a sealing structure between the side wall 10d and the base S0.
应当理解,被热源S1还可以是区别于芯片的例如其它电子设备及其部件。It should be understood that the heat source S1 may also be different from the chip, such as other electronic equipment and its components.
可选地,散热装置10还包括在热源S1的外周和侧壁10d的内周之间的密封圈15。密封圈15的下底面抵靠到基部S0的表面,以保证侧壁10d和基部S0之间的密封。Optionally, the heat sink 10 further includes a sealing ring 15 between the outer periphery of the heat source S1 and the inner periphery of the side wall 10d. The lower bottom surface of the sealing ring 15 abuts against the surface of the base S0 to ensure the sealing between the side wall 10d and the base S0.
散热装置10的内腔设有射流隔板13,从而将内腔分隔为位于射流隔板13两侧的分液腔11和散热腔12。射流隔板13内形成有多个射流孔14h,从而导通分液腔11和散热腔12,使得液体能从分液腔11进入散热腔12。The inner cavity of the cooling device 10 is provided with a jet partition 13 , thereby dividing the inner cavity into a liquid separation chamber 11 and a heat dissipation chamber 12 located on both sides of the jet partition 13 . A plurality of jet holes 14 h are formed in the jet partition 13 , so as to connect the liquid separation chamber 11 and the heat dissipation chamber 12 , so that liquid can enter the heat dissipation chamber 12 from the liquid separation chamber 11 .
分液腔11形成有入口10a,入口10a还可以被称为液体入口或者散热装置液体入口。可选地,入口10a设置在分液腔11的顶部(例如本实施方式中形成于上壁10c)。外部管路系统内的液体通过入口10a进入分液腔11内。分液腔11能调节液体的流动,使液体以一定的压力和流速穿过射流孔14h。The liquid separation chamber 11 is formed with an inlet 10a, and the inlet 10a may also be referred to as a liquid inlet or a liquid inlet of a heat sink. Optionally, the inlet 10a is disposed on the top of the liquid separation chamber 11 (for example, formed on the upper wall 10c in this embodiment). The liquid in the external piping system enters the liquid separation chamber 11 through the inlet 10a. The liquid separation chamber 11 can regulate the flow of the liquid so that the liquid passes through the jet hole 14h at a certain pressure and flow rate.
穿过射流孔14h的液体在散热腔12内以射流冲击的方式流至热源S1的表面,将 热源S1的热量带走。散热腔12的周壁形成有环绕散热腔的一个或多个出口10b,液体能通过出口10b流出散热腔12,以进入外部管路系统准备进行下一个循环。这里的出口10b还可以称为液体出口或者散热装置液体出口。The liquid passing through the jet hole 14h flows to the surface of the heat source S1 in the way of jet impact in the cooling cavity 12, and takes away the heat of the heat source S1. The peripheral wall of the cooling chamber 12 is formed with one or more outlets 10b surrounding the cooling chamber, and the liquid can flow out of the cooling chamber 12 through the outlets 10b to enter the external piping system for the next cycle. The outlet 10b here may also be referred to as a liquid outlet or a liquid outlet of the heat sink.
本实施方式中,分液腔11包括一级子腔体11a和二级子腔体11b。这两个子腔体由分液隔板11p间隔开。分液隔板11p的外周与侧壁10d相连,分液隔板11p内形成有多个分液孔11h,分液孔11h导通一级子腔体11a和二级子腔体11b。可选地,分液隔板11p正对入口10a设置,或者说,分液孔11h的轴线与入口10a的轴线平行。可选地,多个分液孔11h均布于分液隔板11p。In this embodiment, the liquid separation chamber 11 includes a primary sub-cavity 11a and a secondary sub-cavity 11b. These two sub-chambers are separated by a liquid separator 11p. The outer periphery of the liquid separation partition 11p is connected to the side wall 10d, and a plurality of liquid separation holes 11h are formed in the liquid separation partition 11p, and the liquid separation holes 11h are connected to the primary sub-cavity 11a and the secondary sub-cavity 11b. Optionally, the liquid separation separator 11p is arranged facing the inlet 10a, or in other words, the axis of the liquid separation hole 11h is parallel to the axis of the inlet 10a. Optionally, a plurality of liquid separation holes 11h are evenly distributed on the liquid separation separator 11p.
应当理解,上文或下文在提到孔或开口的时候,虽然使用轴线和孔径等描述,但本申请对各种孔和开口的形状不作限制,这些孔和开口整体上不必须为圆柱形。当孔或开口的横截面不是圆形时,孔径的大小用于表达孔或开口的大小,即孔或开口所围绕的区域的面积大小;下文为表述方便,也将孔或开口所围绕的区域的面积用孔径或开口面积代替。It should be understood that when referring to holes or openings above or below, although axes and diameters are used to describe, the present application does not limit the shapes of various holes and openings, and these holes and openings do not necessarily have to be cylindrical as a whole. When the cross-section of the hole or opening is not circular, the size of the aperture is used to express the size of the hole or opening, that is, the area of the area surrounded by the hole or opening; for the convenience of expression, the area surrounded by the hole or opening is also used below The area of is replaced by the aperture or opening area.
在流通方向上,液体将依次流过入口10a、一级子腔体11a、分液孔11h和二级子腔体11b。图4中的虚线箭头示意性地示出了液体在散热装置10内的流动方法。In the flow direction, the liquid will sequentially flow through the inlet 10a, the primary sub-cavity 11a, the liquid separation hole 11h and the secondary sub-cavity 11b. The dotted arrows in FIG. 4 schematically show the flow method of the liquid in the heat sink 10 .
分液孔11h对液体起到了引导分配的作用,使得流入二级子腔体11b内的液体比位于一级子腔体11a的液体在各处的流动更均匀,进而会使得流入散热腔12的液体流动均匀,从而液体在射流冲击热源S1的过程中能起到更好的散热效果。The liquid distribution hole 11h plays a role in guiding and distributing the liquid, so that the liquid flowing into the secondary sub-cavity 11b flows more uniformly than the liquid located in the primary sub-cavity 11a, which in turn makes the liquid flowing into the cooling chamber 12 The liquid flows evenly, so that the liquid can have a better heat dissipation effect when the jet flow hits the heat source S1.
可选地,罩形的散热装置10以开口(热源S1所在侧)朝下的方式设置;可选地,分液腔11位于散热腔12的上方;可选地,一级子腔体11a位于二级子腔体11b的上方;可选地,入口10a位于出口10b的上方。上述设置方式使得液体在散热装置内的流动除了依靠泵提供的压力外还能借助自身的重力,射流冲击效果好。Optionally, the hood-shaped heat dissipation device 10 is arranged with the opening (the side where the heat source S1 is located) facing downward; optionally, the liquid separation chamber 11 is located above the heat dissipation chamber 12; Above the secondary sub-cavity 11b; Optionally, the inlet 10a is located above the outlet 10b. The above arrangement makes the flow of the liquid in the cooling device not only rely on the pressure provided by the pump, but also rely on its own gravity, and the impact effect of the jet is good.
应当理解,根据热源S1的不同结构和设置方式,散热装置10的设置方向可以相应改变,例如,参考图4,在基部S0的表面竖直设置的情况下,散热装置10可以以图4中的结构旋转90°、以开口朝向沿水平方向的方式设置。此外,散热装置10内部各腔体以及入口10a和出口10b的具体位置也可以根据实际应用场景进行调整。It should be understood that, according to different structures and arrangements of the heat source S1, the arrangement direction of the heat sink 10 can be changed accordingly. For example, referring to FIG. The structure is rotated by 90° and set in such a way that the opening faces along the horizontal direction. In addition, the specific positions of the cavities and the inlet 10a and outlet 10b inside the cooling device 10 can also be adjusted according to actual application scenarios.
可选地,为了使散热装置10内的液体在进入散热腔12之前不产生较大的压降,分液孔11h的孔径(或者说开口面积或横截面积)比射流孔14h的孔径(或者说开口面积或横截面积)大很多。例如,分液孔11h的孔径(或者说开口面积或横截面积)是射流孔14h的孔径(或者说开口面积或横截面积)的3倍以上。从而,既使得分液腔11内的液体既能得到均衡流动的调节,又不至于受到较大的阻碍而过多损耗其流速,保证了后续的射流冲击效果。Optionally, in order to prevent the liquid in the heat dissipation device 10 from generating a large pressure drop before entering the heat dissipation chamber 12, the aperture (or opening area or cross-sectional area) of the liquid distribution hole 11h is larger than the aperture (or opening area or cross-sectional area) of the jet hole 14h (or Said opening area or cross-sectional area) is much larger. For example, the aperture (or opening area or cross-sectional area) of the liquid separation hole 11h is more than three times the aperture (or opening area or cross-sectional area) of the jet hole 14h. Therefore, the liquid in the liquid separation chamber 11 can be regulated in a balanced flow, and will not be greatly hindered and its flow velocity will not be lost too much, thereby ensuring the subsequent jet impact effect.
可选地,散热腔12内还形成有射流层14。射流层14包括多个阵列排布的射流柱140,每个射流柱140与一个射流孔14h对齐地设置。Optionally, a fluidic layer 14 is also formed in the cooling cavity 12 . The fluidic layer 14 includes a plurality of fluidic columns 140 arranged in an array, and each fluidic column 140 is arranged in alignment with a fluidic hole 14h.
射流柱140呈中空的管状,其一端连接到射流隔板13的表面、使射流柱140的内部通道与射流孔14h导通,另一端延伸至热源S1附近,从而使射流冲击的液柱产生于距离热源S1非常近的区域。例如,射流柱140的液体出口(即上述另一端)与热源S1之间的距离不超过1mm,可选地,射流柱140的液体出口与热源S1之间的距离为0.35至0.7mm。The jet column 140 is in the shape of a hollow tube, one end of which is connected to the surface of the jet partition 13, so that the internal channel of the jet column 140 is connected to the jet hole 14h, and the other end extends to the vicinity of the heat source S1, so that the liquid column impacted by the jet is generated in the The area very close to the heat source S1. For example, the distance between the liquid outlet of the jet column 140 (that is, the other end) and the heat source S1 is no more than 1 mm, and optionally, the distance between the liquid outlet of the jet column 140 and the heat source S1 is 0.35 to 0.7 mm.
可选地,射流柱140的内部通道的孔径与射流孔14h的孔径相等且这两个孔完全对齐地设置。这使得,液体在射流孔14h和射流柱140内流动的过程中的压降非常小;并且,即使增加射流柱140的长度,对散热装置10的系统压降影响也很小,不容易造成额外的液体泵送功率的损耗。由于在液体的流动方向上,出口10b位于射流柱140的液体出口附近,因此,射流柱140所占据的长度还起到了拉开入口10a和出口10b之间的距离的效果,使得入口10a附近的液体和出口10b附近的液体彼此之间流动的干扰较小。Optionally, the diameter of the inner channel of the jet column 140 is equal to the diameter of the jet hole 14h and the two holes are completely aligned. This makes the pressure drop during the flow of the liquid in the jet hole 14h and the jet column 140 very small; and, even if the length of the jet column 140 is increased, the impact on the system pressure drop of the cooling device 10 is also very small, and it is not easy to cause additional The loss of liquid pumping power. Since the outlet 10b is located near the liquid outlet of the jet column 140 in the flow direction of the liquid, the length occupied by the jet column 140 also has the effect of widening the distance between the inlet 10a and the outlet 10b, so that the liquid near the inlet 10a The flow of the liquid and the liquid in the vicinity of the outlet 10b interferes less with each other.
可选地,不同位置处的射流孔14h(以及与射流孔14h相连的射流柱140)的孔径不完全相同,以调节不同区域的射流冲击的液柱的流量,从而调节和控制散热装置10对热源S1的不同区域的散热能力。例如,在热源S1的发热较严重的区域(也称热点区域),该区域正对的射流孔14h被设置为对应射流强度较大的结构。Optionally, the apertures of the jet holes 14h (and the jet columns 140 connected to the jet holes 14h) at different positions are not exactly the same, so as to adjust the flow rate of the liquid columns impacted by the jets in different areas, thereby adjusting and controlling the cooling device 10 to The heat dissipation capabilities of different regions of the heat source S1. For example, in the region where the heat source S1 generates more serious heat (also referred to as a hot spot region), the jet hole 14h facing the region is set as a structure corresponding to a higher jet intensity.
可选地,射流柱140的轴线可以与热源S1的表面不垂直,从而使射流柱140具备调整液体的流向、将液体精准地引导至热点区域的作用。Optionally, the axis of the jet column 140 may not be perpendicular to the surface of the heat source S1, so that the jet column 140 can adjust the flow direction of the liquid and guide the liquid to the hot spot area accurately.
射流柱140除了包括柱状的主体141外,可选地,射流柱140还包括导流部142。导流部142位于主体141的靠近热源S1的端部的外周区域。导流部142的表面形成为大致锥形,锥形的母线在远离热源S1所在方向的延伸方向大致朝向出口10b所在的位置,从而能将完成射流冲击的液体引导至出口10b,避免散热腔12内的液体发生流动阻塞和/或流动不稳定的现象,使得散热装置10内的液体流动顺畅。In addition to the column-shaped main body 141 , the jet column 140 optionally also includes a flow guiding part 142 . The air guide part 142 is located at the outer peripheral area of the end of the main body 141 close to the heat source S1. The surface of the flow guide part 142 is formed into a substantially conical shape, and the conical generatrix is generally toward the position of the outlet 10b in the direction of extension away from the direction of the heat source S1, so that the liquid that has completed the impact of the jet can be guided to the outlet 10b, avoiding the cooling cavity 12 The flow of the liquid in the heat sink 10 is blocked and/or unstable, so that the liquid in the heat sink 10 flows smoothly.
可选地,射流层14还包括连接相邻的射流柱140的连接结构,并且,射流层14在相邻的射流柱140之间还形成开口144。开口144导通射流柱140的液体出口和出口10b。散热腔12在开口144的靠近出口10b一侧的腔体形成回流腔122,从射流柱140射出的液体在射流冲击热源S1后,流过开口144进入回流腔122,之后经过出口10b流出散热装置10。Optionally, the fluidic layer 14 further includes a connection structure connecting adjacent fluidic columns 140 , and the fluidic layer 14 further forms openings 144 between adjacent fluidic columns 140 . The opening 144 communicates the liquid outlet of the jet column 140 with the outlet 10b. The cooling chamber 12 forms a recirculation chamber 122 at the side of the opening 144 close to the outlet 10b. The liquid injected from the jet column 140 flows through the opening 144 and enters the recirculation chamber 122 after the jet hits the heat source S1, and then flows out of the heat dissipation device through the outlet 10b. 10.
可选地,射流层14的外周部143和侧壁10d相连,以使得射流层14的结构稳定。可选地,射流层14可以与侧壁10d和/或射流隔板13焊接;也可以是射流层14、射流隔板13以及侧壁10d中的至少两者一体成型地制作。Optionally, the peripheral portion 143 of the fluidic layer 14 is connected to the side wall 10d, so that the structure of the fluidic layer 14 is stable. Optionally, the fluidic layer 14 can be welded with the side wall 10d and/or the fluidic partition 13 ; or at least two of the fluidic layer 14 , the fluidic partition 13 and the sidewall 10d can be integrally formed.
可选地,侧壁10d与热源S1不接触,侧壁10d与热源S1之间的空间形成为侧边腔123。侧边腔123围绕在热源S1的外周,使得液体能流至热源S1的外周壁,以直接接触的方式给热源S1的外周壁降温。Optionally, the side wall 10 d is not in contact with the heat source S1 , and the space between the side wall 10 d and the heat source S1 is formed as a side cavity 123 . The side cavity 123 surrounds the outer periphery of the heat source S1, so that the liquid can flow to the outer peripheral wall of the heat source S1, and cool down the outer peripheral wall of the heat source S1 in a direct contact manner.
可以理解,一个散热装置内的散源或者芯片的数量不限于一个。一个散热装置内可以有多个热源或者芯片,或者有多个不同类型的热源。It can be understood that the number of cooling sources or chips in a heat sink is not limited to one. There may be multiple heat sources or chips in one heat sink, or multiple heat sources of different types.
(散热装置的第二实施方式)(Second embodiment of heat sink)
参照图5,介绍散热装置的第二实施方式。第二实施方式是第一实施方式的变型,对于与第一实施方式相同或相似的特征,在本实施方式中使用相同的附图标记,并省略对这些特征的详细介绍。Referring to FIG. 5 , a second embodiment of the heat sink is introduced. The second embodiment is a modification of the first embodiment, and for features identical or similar to those of the first embodiment, the same reference numerals are used in this embodiment, and detailed descriptions of these features are omitted.
在本实施方式中,分液腔11具有三个子腔体,即在液体的流动方向上依次串联的一级子腔体11a、二级子腔体11b和三级子腔体11c。一级子腔体11a和二级子腔体11b由一个分液隔板11p(以下也称上游分液隔板)间隔开,上游分液隔板内形成有多个连通一级子腔体11a和二级子腔体11b的分液孔11h(以下也称上游分液孔);二级 子腔体11b和三级子腔体11c由另一个分液隔板11p(以下也称下游分液隔板)间隔开,下游分液隔板内形成有多个连通二级子腔体11b和三级子腔体11c的分液孔11h(以下也称下游分液孔)。In this embodiment, the liquid separation chamber 11 has three sub-cavities, that is, the primary sub-cavity 11a, the secondary sub-cavity 11b and the tertiary sub-cavity 11c which are serially connected in sequence in the flow direction of the liquid. The primary sub-cavity 11a and the secondary sub-cavity 11b are separated by a liquid separation partition 11p (hereinafter also referred to as the upstream liquid separation partition), and a plurality of connected primary sub-cavities 11a are formed in the upstream liquid separation partition and the liquid separation hole 11h (hereinafter also referred to as the upstream liquid separation hole) of the secondary sub-cavity 11b; Separators) are spaced apart, and a plurality of liquid separation holes 11h (hereinafter also referred to as downstream liquid separation holes) connecting the secondary sub-cavity 11b and the tertiary sub-cavity 11c are formed in the downstream liquid separation partition.
可选地,上游分液孔的孔径大于下游分液孔的孔径。可选地,下游分液孔的数量大于上游分液孔的数量。这使得液体在逐级流过分液孔的过程中,压力变化的趋势平稳,液体流动顺畅,不容易发生堵塞。Optionally, the pore diameter of the upstream liquid separation hole is larger than the pore diameter of the downstream liquid separation hole. Optionally, the number of downstream liquid separation holes is greater than the number of upstream liquid separation holes. This makes the trend of pressure change stable when the liquid flows through the liquid separation hole step by step, the liquid flows smoothly, and the blockage is not easy to occur.
可选地,上游分液孔与下游分液孔至少部分地错开设置,或者说,多个上游分液孔中的至少一个的轴线与所有下游分液孔的轴线都不重合。这种错位设置的方式提高了多级分液孔对液体的导引分配能力,能使得液体在流动过程中更趋于均匀。Optionally, the upstream liquid separation holes and the downstream liquid separation holes are at least partially staggered, or in other words, the axes of at least one of the plurality of upstream liquid separation holes do not coincide with the axes of all the downstream liquid separation holes. This staggered setting method improves the guiding and distributing ability of the multi-stage liquid separation holes to the liquid, and can make the liquid tend to be more uniform during the flow process.
应当理解,本申请对分液腔内的子腔体的数量不作限制,根据散热装置的不同规模和不同的散热需求,子腔体的数量可以增加。It should be understood that the present application does not limit the number of sub-cavities in the liquid separation chamber, and the number of sub-cavities can be increased according to different scales of heat sinks and different heat dissipation requirements.
以上所述,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以所述权利要求的保护范围为准。The above is only a specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the application. Should be covered within the protection scope of this application. Therefore, the protection scope of the present application should be determined by the protection scope of the claims.
Claims (18)
- 一种散热装置,其用于向热源(S1)供给液体,其特征在于,A heat sink for supplying liquid to a heat source (S1), characterized in that,所述散热装置包括由多个射流孔(14h)导通的分液腔(11)和散热腔(12),所述分液腔(11)形成有所述液体的入口(10a),所述热源(S1)至少部分地被容纳在所述散热腔(12)内,The heat dissipation device includes a liquid separation chamber (11) and a heat dissipation chamber (12) connected by a plurality of jet holes (14h), the liquid separation chamber (11) is formed with an inlet (10a) for the liquid, the a heat source (S1) is at least partially housed within said cooling cavity (12),所述分液腔(11)包括至少两个子腔体,所述液体依次流过各个所述子腔体后进入所述散热腔(12),The liquid separation chamber (11) includes at least two sub-cavities, and the liquid flows through each of the sub-cavities in sequence and then enters the cooling chamber (12),在所述液体的流动路径上,相邻的两个所述子腔体之间由多个分液孔(11h)连通。On the flow path of the liquid, two adjacent sub-cavities are connected by a plurality of liquid separation holes (11h).
- 根据权利要求1所述的散热装置,其特征在于,所述散热腔(12)内设置有多个管状的、与所述射流孔(14h)连通的射流柱(140),所述射流柱(140)从所述射流孔(14h)朝向所述热源(S1)延伸。The heat dissipation device according to claim 1, characterized in that, a plurality of tubular jet columns (140) communicating with the jet holes (14h) are arranged in the heat dissipation chamber (12), and the jet columns ( 140) extending from said jet hole (14h) towards said heat source (S1).
- 根据权利要求1或2所述的散热装置,其特征在于,所述分液腔(11)包括至少三个子腔体,The heat dissipation device according to claim 1 or 2, characterized in that, the liquid separation chamber (11) comprises at least three sub-cavities,在所述液体的流动路径上,位于上游的所述分液孔(11h)的开口面积大于位于下游的所述分液孔(11h)的开口面积。On the flow path of the liquid, the opening area of the liquid dispensing hole (11h) located upstream is larger than the opening area of the liquid dispensing hole (11h) located downstream.
- 根据权利要求1至3中任一项所述的散热装置,其特征在于,至少一个位于上游的所述分液孔(11h)的轴线与位于下游的所有所述分液孔(11h)的轴线都不重合。The heat dissipation device according to any one of claims 1 to 3, characterized in that the axis of at least one liquid distribution hole (11h) located upstream is the same as the axes of all the liquid distribution holes (11h) located downstream None of them overlap.
- 根据权利要求1至4中任一项所述的散热装置,其特征在于,所述分液孔(11h)的开口面积大于所述射流孔(14h)的开口面积。The heat dissipation device according to any one of claims 1 to 4, characterized in that, the opening area of the liquid separation hole (11h) is larger than the opening area of the jet hole (14h).
- 根据权利要求5所述的散热装置,其特征在于,所述分液孔(11h)的开口面积是所述射流孔(14h)的开口面积的3倍以上。The heat dissipation device according to claim 5, characterized in that the opening area of the liquid separation hole (11h) is more than three times the opening area of the jet hole (14h).
- 根据权利要求5或6所述的散热装置,其特征在于,所述多个射流孔(14h)中的至少两个所述射流孔(14h)的开口面积不相同。The heat dissipation device according to claim 5 or 6, characterized in that at least two of the jet holes (14h) in the plurality of jet holes (14h) have different opening areas.
- 根据权利要求2所述的散热装置,其特征在于,所述射流柱(140)的内部通孔的横截面积等于所述射流孔(14h)的横截面积。The heat dissipation device according to claim 2, characterized in that, the cross-sectional area of the internal through hole of the jet column (140) is equal to the cross-sectional area of the jet hole (14h).
- 根据权利要求2或8所述的散热装置,其特征在于,所述散热腔(12)的周壁形成有用于供所述液体流出所述散热腔(12)的多个出口(10b),The heat dissipation device according to claim 2 or 8, characterized in that, the peripheral wall of the heat dissipation cavity (12) is formed with a plurality of outlets (10b) for the liquid to flow out of the heat dissipation cavity (12),所述射流柱(140)在至少靠近所述热源(S1)的端部的外周形成导流部(142),所述导流部(142)具有能将所述液体引导至所述出口(10b)所在方向的表面。The jet column (140) forms a guide part (142) on the outer periphery of at least the end close to the heat source (S1), and the guide part (142) has a function capable of guiding the liquid to the outlet (10b) ) in the direction of the surface.
- 根据权利要求9所述的散热装置,其特征在于,多个所述射流柱(140)彼此相连并形成射流层(14),相邻的所述射流柱(140)之间形成有贯通所述射流层(14)并与所述出口(10b)导通的开口(144)。The heat dissipation device according to claim 9, characterized in that, a plurality of the jet columns (140) are connected to each other to form a jet layer (14), and adjacent jet columns (140) are formed with through the The fluidic layer (14) and the opening (144) leading to the outlet (10b).
- 根据权利要求10所述的散热装置,其特征在于,所述散热装置包括用于间隔所述分液腔(11)和所述散热腔(12)的射流隔板(13),所述射流孔(14h)在所述射流隔板(13)的厚度方向上贯穿所述射流隔板(13),The heat dissipation device according to claim 10, characterized in that, the heat dissipation device comprises a jet partition (13) for separating the liquid separation chamber (11) from the heat dissipation chamber (12), and the jet hole (14h) penetrating through the jet barrier (13) in the thickness direction of the jet barrier (13),所述射流层(14)与所述射流隔板(13)焊接相连,或者The fluidic layer (14) is welded to the fluidic partition (13), or所述射流层(14)与所述射流隔板(13)形成为一体。The jet layer (14) is integrally formed with the jet partition (13).
- 根据权利要求9所述的散热装置,其特征在于,所述入口(10a)与所述多个出口(10b)相连通。The heat dissipation device according to claim 9, characterized in that, the inlet (10a) communicates with the plurality of outlets (10b).
- 根据权利要求1至12中任一项所述的散热装置,其特征在于,所述散热腔(12)包括侧壁(10d),所述侧壁(10d)环绕在所述热源(S1)的外周,所述侧壁(10d)与所述热源(S1)不接触,The heat dissipation device according to any one of claims 1 to 12, characterized in that, the heat dissipation chamber (12) comprises a side wall (10d), and the side wall (10d) surrounds the heat source (S1) outer periphery, said side wall (10d) is not in contact with said heat source (S1),所述散热腔(12)包括位于所述热源(S1)与所述侧壁(10d)之间的侧边腔(123)。The heat dissipation cavity (12) includes a side cavity (123) located between the heat source (S1) and the side wall (10d).
- 根据权利要求13所述的散热装置,其特征在于,所述散热装置用于对包括所述热源(S1)的电子设备进行散热,所述电子设备还包括基部(S0),所述热源(S1)设置于所述基部(S0)的一个表面,The heat dissipation device according to claim 13, characterized in that, the heat dissipation device is used to dissipate heat from electronic equipment including the heat source (S1), the electronic equipment also includes a base (S0), and the heat source (S1 ) is disposed on one surface of said base (S0),所述侧壁(10d)用于抵靠至所述基部(S0)的所述一个表面,said side wall (10d) is adapted to abut against said one surface of said base (S0),所述散热装置还包括密封圈(15),所述密封圈(15)套设在所述热源(S1)的外周、且所述密封圈(15)嵌设在所述侧壁(10d)的内周,所述密封圈(15)的一个端面抵靠至所述基部(S0)的所述一个表面。The heat dissipation device further includes a sealing ring (15), the sealing ring (15) is sleeved on the outer periphery of the heat source (S1), and the sealing ring (15) is embedded in the side wall (10d) On the inner periphery, one end surface of the sealing ring (15) abuts against the one surface of the base (S0).
- 根据权利要求1至14中任一项所述的散热装置,其特征在于,所述分液腔(11)位于所述散热腔(12)的上方,所述散热腔(12)的下部用于设置所述热源(S1)。The heat dissipation device according to any one of claims 1 to 14, characterized in that, the liquid separation chamber (11) is located above the heat dissipation chamber (12), and the lower part of the heat dissipation chamber (12) is used for The heat source (S1) is set.
- 根据权利要求1至15中任一项所述的散热装置,其特征在于,所述热源(S1)包括芯片。The heat dissipation device according to any one of claims 1 to 15, characterized in that the heat source (S1) comprises a chip.
- 一种散热系统,其特征在于,包括泵(20)、储液箱(30)和至少一个根据权利要求1至16中任一项所述的散热装置,A heat dissipation system, characterized in that it comprises a pump (20), a liquid storage tank (30) and at least one heat dissipation device according to any one of claims 1 to 16,所述泵(20)用于将所述储液箱(30)内的液体泵送至所述散热装置,并将从所述散热装置流出的所述液体泵送回所述储液箱(30)。The pump (20) is used to pump the liquid in the liquid storage tank (30) to the heat sink, and pump the liquid flowing out of the heat sink back to the liquid storage tank (30 ).
- 根据权利要求17所述的散热系统,其特征在于,所述散热系统还包括制冷器(40)和预热器(50),The heat dissipation system according to claim 17, characterized in that, the heat dissipation system further comprises a refrigerator (40) and a preheater (50),所述制冷器(40)设置在所述散热装置的下游以及所述储液箱(30)的上游,所述制冷器(40)用于给流经的所述液体降温,The refrigerator (40) is arranged downstream of the heat sink and upstream of the liquid storage tank (30), and the refrigerator (40) is used to cool down the liquid flowing through it,所述预热器(50)设置在所述储液箱(30)的下游以及所述散热装置的上游,所述预热器(50)用于将流经的所述液体加热至预定温度。The preheater (50) is arranged downstream of the liquid storage tank (30) and upstream of the heat sink, and the preheater (50) is used to heat the liquid flowing through it to a predetermined temperature.
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CN101080160A (en) * | 2006-05-25 | 2007-11-28 | 国际商业机器公司 | Cooling apparatus, cooled electronic module and methods of fabrication thereof |
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CN109755199A (en) * | 2019-02-20 | 2019-05-14 | 合肥工业大学 | A kind of minim channel jet stream radiator |
CN111356343A (en) * | 2020-03-11 | 2020-06-30 | 深圳绿色云图科技有限公司 | Cooling liquid distribution device and liquid cooling cabinet |
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2021
- 2021-05-25 CN CN202180085716.4A patent/CN116671268A/en active Pending
- 2021-05-25 WO PCT/CN2021/095729 patent/WO2022246637A1/en active Application Filing
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US5239443A (en) * | 1992-04-23 | 1993-08-24 | International Business Machines Corporation | Blind hole cold plate cooling system |
CN101080160A (en) * | 2006-05-25 | 2007-11-28 | 国际商业机器公司 | Cooling apparatus, cooled electronic module and methods of fabrication thereof |
CN109637987A (en) * | 2018-11-15 | 2019-04-16 | 华中科技大学 | A kind of micro- spray direct liquid cooling radiator of immersion jet stream |
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