WO2022246637A1

WO2022246637A1 - Heat dissipation device and heat dissipation system

Info

Publication number: WO2022246637A1
Application number: PCT/CN2021/095729
Authority: WO
Inventors: 陈进宇; 吕建标; 苏玉; 朱龙光; 陈晓丹; 郑见涛
Original assignee: 华为技术有限公司
Priority date: 2021-05-25
Filing date: 2021-05-25
Publication date: 2022-12-01
Also published as: CN116671268A

Abstract

A heat dissipation device for supplying a liquid to a heat source (S1). The heat dissipation device comprises a liquid distribution cavity (11) and a heat dissipation cavity (12) which are in communication with each other by means of a plurality of jet holes (14h), wherein the liquid distribution cavity (11) is provided with a liquid inlet (10a); a heat source (S1) is at least partially accommodated in the heat dissipation cavity (12); the liquid distribution cavity (11) comprises at least two sub-cavities; a liquid flows through the sub-cavities in sequence and then enters the heat dissipation cavity (12); and in the flowing path of the liquid, two adjacent sub-cavities are in communication with each other by means of a plurality of liquid distribution holes (11h). A heat dissipation system is further provided in the present application.

Description

Cooling device and cooling system

technical field

The present application relates to the field of heat dissipation equipment, and more specifically relates to a heat dissipation device and a heat dissipation system.

Background technique

Taking chips as an example, especially for chips of highly integrated and large-scale electronic equipment using small electronic devices, their power consumption density is very high.

The existing heat dissipation methods for chips mainly include air cooling and liquid cooling. The air-cooled structure is simple and reliable, but its heat dissipation capacity is limited, and it is difficult to meet the heat dissipation requirements of high-power and high-heat-flux components. Liquid cooling generally uses a flow channel cold plate as a heat exchange device. A thermal interface material is required to connect the common flow channel cold plate and the chip. The heat dissipation capacity of the flow channel cold plate is limited by the heat transfer performance of the thermal interface material. Therefore, for chips with high heat flux density and high power consumption, it is difficult for ordinary runner cold plates to provide efficient heat dissipation.

Therefore, how to adopt an efficient heat dissipation solution to avoid high temperature or overheating in a local area of the chip (or electronic device) to improve the performance and reliability of the device is an urgent problem in this field.

Contents of the invention

In view of this, the present application provides a heat dissipation device and a heat dissipation system.

In a first aspect, embodiments of the present application provide a heat dissipation device.

In a first possible implementation of the first aspect, the heat dissipation device is used to supply liquid to the heat source, which includes a liquid separation cavity and a heat dissipation cavity connected by a plurality of jet holes, the liquid separation cavity is formed with an inlet of liquid, and the heat source at least partially housed within the cooling cavity,

The liquid separation chamber includes at least two sub-cavities, and the liquid flows through each sub-cavity in turn and then enters the cooling chamber.

On the flow path of the liquid, two adjacent sub-cavities are connected by a plurality of liquid distribution holes.

The sub-cavities arranged step by step in the liquid separation chamber play a role in guiding and distributing the liquid in the flow process. The flow speed is closer, so that the liquid flows evenly after entering the heat dissipation cavity, and the heat dissipation effect is good.

According to the first possible implementation of the first aspect, in the second possible implementation of the heat dissipation device, a plurality of tubular jet columns communicating with the jet holes are arranged in the cooling cavity, and the jet columns are directed from the jet holes toward Heat source extension.

The jet column guides the liquid to the vicinity of the heat source, and the liquid forms a jet impact after flowing out of the jet column, which is equivalent to reducing the distance between the liquid in the free impact state and the heat source, reducing the speed loss of the liquid during the flow process, and ensuring The effect of jet impact.

According to any one of the above possible implementations of the first aspect, in a third possible implementation of the heat sink, the liquid separation chamber includes at least three sub-cavities,

On the flow path of the liquid, the opening area of the liquid separation hole located upstream is larger than the opening area of the liquid separation hole located downstream.

The opening area (pore diameter) of the upstream liquid separation hole is larger than the opening area (pore diameter) of the downstream liquid separation hole, which makes it difficult for the liquid to be blocked during the flow process and the flow is smooth.

According to any possible implementation manner of the first aspect, in a fourth possible implementation manner of the heat sink, the axes of at least one upstream liquid distribution hole do not coincide with the axes of all downstream liquid distribution holes.

The plurality of liquid distribution holes located upstream and the plurality of liquid distribution holes located downstream are at least partly staggered, which improves the guiding and distributing ability of the liquid distribution holes to the liquid, and makes the liquid flow more uniformly during the flow process.

According to any possible implementation manner of the first aspect, in a fifth possible implementation manner of the heat sink, the opening area of the liquid separation hole is larger than the opening area of the jet hole.

The opening area (aperture) of the liquid separation hole is larger than that of the jet hole, which makes it difficult for the liquid to be blocked during the flow process, and the flow is smooth.

According to a fifth possible implementation of the first aspect, in a sixth possible implementation of the heat sink, the opening area of the liquid separation hole is more than three times the opening area of the jet hole.

Compared with the jet hole, the opening area (aperture) of the liquid separation hole is large, which ensures that the liquid has a greater pressure when it flows to the jet hole, or that the liquid does not flow in the liquid separation cavity. As for the occurrence of a large pressure drop, the subsequent jet effect is guaranteed.

According to the fifth or sixth possible implementation manner of the first aspect, in a seventh possible implementation manner of the heat sink, at least two of the jet holes have different opening areas.

The differential setting of the opening area (aperture diameter) of the jet hole can realize the liquid with different jet velocity in different areas, so as to provide stronger jet impact for the key cooling area of the heat source as required.

According to the second possible implementation manner of the first aspect, in the eighth possible implementation manner of the heat sink, the cross-sectional area of the internal through hole of the jet column is equal to the cross-sectional area of the jet hole.

The cross-sectional area (inner diameter) of the jet column is equal to that of the jet hole, which makes the pressure drop during the flow of the liquid in the jet column very small. In other words, increasing the length of the jet column has little effect on the system pressure drop of the cooling device. It is easy to cause loss of additional liquid pumping power.

According to the second or eighth possible implementation manner of the first aspect, in the ninth possible implementation manner of the heat dissipation device, a plurality of outlets for allowing liquid to flow out of the heat dissipation chamber are formed on the peripheral wall of the heat dissipation chamber,

A flow guide part is formed on the outer periphery of the jet column at least near the end of the heat source, and the flow guide part has a surface capable of guiding the liquid to the direction of the outlet.

The surface structure of the guide part can guide the liquid to the outlet, avoiding flow blockage and/or unstable flow of the liquid in the heat dissipation chamber, so that the liquid in the heat dissipation device flows smoothly and has a good cooling effect.

According to the ninth possible implementation of the first aspect, in the tenth possible implementation of the heat sink, a plurality of jet columns are connected to each other to form a jet layer, and a penetrating jet layer is formed between adjacent jet columns and An opening leading to an outlet.

The jet layer formed by the connected jet columns has high structural strength, is easy to manufacture and is not easily damaged.

According to the tenth possible implementation of the first aspect, in the eleventh possible implementation of the heat dissipation device, the heat dissipation device includes a jet partition for separating the liquid separation chamber and the heat dissipation chamber, and the jet hole is located in the jet partition. through the jet diaphragm in the thickness direction,

The fluidic layer is welded to the fluidic diaphragm, or

The jet layer is integrally formed with the jet partition.

The connection mode of the jet layer and the jet partition is simple and flexible, and can be welded or integrally formed.

According to a ninth possible implementation manner of the first aspect, in a twelfth possible implementation manner of the heat sink, the inlet is connected to a plurality of outlets.

The connected inlet and outlet realize the continuous circulation of the liquid in the cooling device.

According to any possible implementation manner of the first aspect, in the thirteenth possible implementation manner of the heat dissipation device, the heat dissipation chamber includes a side wall, the side wall surrounds the outer periphery of the heat source, and the side wall does not contact the heat source,

The heat dissipation cavity includes a side cavity between the heat source and the side wall.

When the liquid flows into the side cavity, it can contact the outer peripheral surface of the heat source, so that the contact area between the heat source and the liquid is large, and the heat dissipation effect is good.

According to the thirteen possible implementation manners of the first aspect, in the fourteenth possible implementation manner of the heat dissipation device, the heat dissipation device is used to dissipate heat from an electronic device including a heat source, and the electronic device further includes a base, and the heat source is arranged on the base a surface of

a side wall for abutting against a surface of the base,

The heat dissipation device further includes a sealing ring, which is sleeved on the outer periphery of the heat source and embedded in the inner periphery of the side wall, and one end surface of the sealing ring abuts against a surface of the base.

The sealing ring forms a seal between the heat source and the side wall, and the sealing ring abuts against a surface of the base to make the sealing structure more reliable.

According to any possible implementation manner of the first aspect, in a fifteenth possible implementation manner of the heat dissipation device, the liquid separation chamber is located above the heat dissipation chamber, and the lower part of the heat dissipation chamber is used for disposing a heat source.

The upper and lower arrangement of the liquid separation chamber and the heat dissipation chamber makes the power of the liquid flow in the heat dissipation device not only provided by the pump, but also by its own gravity, and the jet impact effect is good.

According to any possible implementation manner of the first aspect, in a sixteenth possible implementation manner of the heat sink, the heat source includes a chip.

The heat dissipation device according to the present application can provide high-efficiency heat dissipation for chips with high power density, and avoid high temperature or overheating in local areas of the chip.

In a second aspect, embodiments of the present application provide a heat dissipation system.

In a first possible implementation manner of the second aspect, the heat dissipation system includes a pump, a liquid storage tank, and at least one heat dissipation device according to any possible implementation manner of the first aspect of the present application,

The pump is used to pump the liquid in the liquid storage tank to the heat sink and to pump the liquid flowing from the heat sink back to the liquid storage tank.

The liquid in the heat dissipation system can achieve internal circulation under the driving action of the pump, and a heat dissipation system can provide heat dissipation function for one or more devices, or one or more heat sources of the devices.

According to the first possible implementation of the second aspect, in the second possible implementation of the heat dissipation system, the heat dissipation system further includes a refrigerator and a preheater,

The refrigerator is arranged downstream of the heat sink and upstream of the liquid storage tank, and the refrigerator is used to cool down the liquid flowing through it.

The preheater is arranged downstream of the liquid storage tank and upstream of the cooling device, and the preheater is used to heat the flowing liquid to a predetermined temperature.

The refrigerator is convenient to cool down the superheated liquid flowing through the cooling device in the system, and the preheater can heat the liquid that is going to flow into the cooling device to a suitable temperature, so that factors such as the density, viscosity, pressure difference and flow rate of the liquid can be controlled at a temperature The optimal state is achieved under the condition of control, and the heat transfer performance of the system is improved.

Description of drawings

Fig. 1 is a schematic diagram of the state of the liquid jet impacting the impacted surface;

2 and 3 are schematic diagrams of two possible implementations of the heat dissipation system according to the present application;

Fig. 4 and Fig. 5 are schematic diagrams of two possible implementations of the heat dissipation device according to the present application.

Explanation of reference signs:

j jet hole; f impacted surface; s stagnation area;

S0 base; S1 heat source;

10 cooling device; 10a inlet; 10b outlet; 10c upper wall; 10d side wall;

11 liquid separation cavity; 11a first-level sub-cavity; 11b second-level sub-cavity; 11c third-level sub-cavity; 11h liquid separation hole; 11p liquid separation partition;

12 cooling cavity; 121 jet cavity; 122 return cavity; 123 side cavity;

13 jet partition; 14 jet layer; 14h jet hole; 140 jet column; 141 main body; 142 diversion part; 143 peripheral part; 144 opening;

20 pump; 30 liquid storage tank; 40 refrigerator; 50 preheater; 60 flow meter; 71 stop valve; 72 flow valve; 73 side valve; 80 filter;

Detailed ways

Exemplary embodiments of the present application are described below with reference to the accompanying drawings. It should be understood that these specific descriptions are only used to teach those skilled in the art how to implement the present application, but are not intended to exhaust all possible ways of the present application, nor are they used to limit the scope of the present application.

Unless otherwise specified, the heat dissipation system and heat dissipation device according to the present application will be introduced below with the up-down relationship in the figure. It should be understood that the up and down relationship of each component in the device is relative, and the up and down position of each component will change accordingly according to the different usage status of the device.

It should be understood that "and/or" in the specification and claims means at least one of the connected objects, and the character "/" generally means that the related objects are an "or" relationship.

Taking the chip as an example, the heat dissipation device and heat dissipation system according to the present application are introduced. However, it should be understood that the heat dissipation device of the present application is not limited to be used for heat dissipation of chips.

Micro-channel heat sink (also known as micro-channel heat exchanger) is a potential high-efficiency heat dissipation device. The microchannel heat sink has large specific surface area, compact structure, small heat transfer temperature difference and high heat transfer efficiency, and it can be applied as a cooling device such as a chip.

However, when the liquid flows in the microchannel, there will be a large temperature rise and channel pressure drop, so that the heat dissipation capacity of the microchannel heat sink gradually decreases in the flow direction, resulting in a gradual increase in the temperature of the chip heat source. The non-uniformity of chip temperature will lead to a series of reliability problems such as material thermal stress and deformation.

On the basis of the micro-channel heat sink, the heat dissipation device provided by combining the jet liquid cooling technology (also called the jet cooling technology) is another kind of high-efficiency heat dissipation device with potential.

This cooling device (also referred to as jet device hereinafter) makes liquid (also referred to as working fluid) pass through micro-holes or slits under a certain pressure difference, and then impacts the surface of the chip in the form of high-speed jet liquid. As shown in Figure 1, in the stagnation point area s of the impacted surface f facing the jet hole j, the boundary layer in this area is relatively thin, and the local heat transfer coefficient is large. Generally, the cooling effect can be improved by making the stagnation zone s coincide with the high heat flux zone.

However, on the one hand, the heat transfer performance of the impinging jet is affected by many parameters, such as the velocity of the impinging jet, the shape of the nozzle, the arrangement of the nozzle array, the diameter of the nozzle, the distance between the nozzle and the surface of the chip, the angle of the nozzle relative to the chip, and the distance between the nozzles, etc. , the heat transfer performance is difficult to control; on the other hand, due to the relatively complex microchannel structure, the resistance along the flow of the working fluid is relatively large, which will significantly increase the pump power loss of the system and increase the risk of system blockage.

In order to improve the cooling effect of the jet device, a possible method is to reduce the distance between the jet hole j and the impacted surface f (or the height of the jet cavity), for example, set the distance to less than 0.5 mm.

Under the same inlet flow rate, reducing the height of the jet cavity will improve the cooling effect of the jet, but this will also cause a significant increase in the overall pressure drop of the jet cavity. In practical applications, the pressure drop of the jet cavity needs to be limited (for example, less than 30kpa); the increase in pressure drop will cause the flow rate of the working fluid to decrease, which in turn will cause a decrease in the heat dissipation effect. In addition, the smaller the height of the jet cavity, the smaller the distance between the inlet and outlet, resulting in a higher temperature of the liquid at the inlet, thereby affecting the cooling effect of the jet.

The applicant made the present application in consideration of some circumstances including the above-mentioned ones. The heat dissipation device according to the present application is arranged in a heat dissipation system capable of providing a circulating flow path, and the heat dissipation device can provide a heat source with uniform and sufficient cooling liquid (hereinafter also referred to as liquid).

Fig. 2 shows a heat dissipation system according to an embodiment of the present application. It comprises a heat sink 10 and a piping system external to the heat sink 10 providing it with an external liquid circulation.

The piping system includes a pump 20 and a reservoir 30 . Optionally, the pipeline system further includes a refrigerator 40, a preheater 50, a flow meter 60, a shut-off valve 71, a flow valve 72, a side valve 73, a filter 80, a sight glass 90 and a pressure protector p.

In this embodiment, there are two flowmeters 60 , which are respectively arranged upstream and downstream of the cooling device 10 , so as to accurately measure the liquid flow rate and provide a basis for controlling the liquid flow rate in the cooling device 10 .

The refrigerator 40 is disposed close to the outlet of the heat sink 10 to cool down the liquid flowing through the heat sink 10 that has absorbed the heat of the heat source S1 . The preheater 50 is arranged close to the inlet of the cooling device 10 to stabilize the liquid in the system at a suitable temperature.

Specifically, along the flow direction of the liquid, the serial order of the components in the heat dissipation system is: liquid storage tank 30, pump 20, stop valve 71, preheater 50, filter 80, flow meter 60, and sight glass 90 , flow valve 72, pressure protector p, cooling device 10, flow meter 60 and refrigerator 40.

The liquid storage tank 30 is used to contain a certain amount of cooling liquid.

The liquid storage tank 30 is connected downstream with the pump 20 , and the pump 20 pumps the liquid to the downstream cooling device 10 at a certain pressure.

The pump 20 is connected downstream with a shut-off valve 71 . When the heat sink 10 is working normally, the shut-off valve 71 is in a conduction state, and liquid can flow through the shut-off valve 71 . In the event that the flow cycle of the liquid needs to be interrupted, for example when the cooling system needs to be repaired, the shut-off valve 71 is closed.

The shut-off valve 71 is connected downstream to the preheater 50 . A preheater 50 is used to heat the liquid to a suitable temperature, eg 40°C. This is because, after the refrigerator 40 in the pipeline system cools down the temperature of the liquid, the liquid with too low temperature does not necessarily have optimal heat exchange performance. The temperature of the liquid will affect its density, viscosity, pressure and flow rate, and the liquid at an appropriate temperature can make the liquid flowing through the cooling device 10 have higher heat transfer performance.

The preheater 50 is connected downstream with a filter 80 . The filter 80 can filter impurities in the liquid to prevent the pipeline system from being blocked or the flow performance of the liquid from being reduced.

The filter 80 is connected downstream to the flow meter 60 . The flow meter 60 here is used to measure the flow of liquid ready to flow into the heat sink 10 .

Flow meter 60 is connected downstream to sight glass 90 . The sight glass 90 has a transparent observation area to facilitate observation of the state of the liquid, such as whether the liquid is flowing or whether there are impurities in the liquid.

Sight glass 90 is connected downstream to flow valve 72 . The flow valve 72 is used to regulate the liquid flow in the pipeline according to the reading of the flow meter 60 .

A pressure protector p is provided between the flow valve 72 and the inlet of the cooling device 10, for releasing pressure to protect various components in the system, for example, when the system pressure is overloaded.

The outlet of the heat sink 10 is connected to another flow meter 60 which is connected downstream to the refrigerator 40 . A refrigerator 40 is connected downstream to the inlet of the liquid storage tank 30 to complete the cycle of the system.

Downstream of the pump 20 there is also a branch for the liquid to flow back to the reservoir 30 . A side valve 73 is provided in the branch, and the side valve 73 is used to adjust the flow of liquid in the system when necessary.

It should be understood that the connection sequence of the components in the above pipeline system is not unique, and in other possible implementations, the connection sequence of certain components may be exchanged, and some components may also be omitted.

In addition, referring to FIG. 3 , a cooling system may also include multiple cooling devices 10 , or multiple cooling devices 10 may share a set of external piping systems. Optionally, the plurality of cooling devices 10 are connected together in parallel.

Next, the heat sink 10 according to the present application will be described with reference to FIGS. 4 and 5 .

(First embodiment of heat sink)

Referring to FIG. 4 , firstly, the first embodiment of the heat sink is introduced.

The heat sink 10 is formed in a cover shape, and has an upper wall 10c and a side wall 10d. The side wall 10d surrounds the outer periphery of the upper wall 10c in a ring shape. Optionally, the side wall 10d and the upper wall 10c may be two parts connected together, or may be formed as a whole.

An opening is formed on the side wall 10d at the end opposite to the upper wall 10c, and the opening is used to allow the heat source S1 of the heat sink to protrude, or in other words, the cover-shaped heat sink 10 covers the heat source S1 inside.

In this embodiment, the heat source S1 is a chip. The heat source S1 is disposed on a base S0 (for example, a substrate of a chip). The side wall 10d abuts against the surface of the base S0 and forms a sealing structure between the side wall 10d and the base S0.

It should be understood that the heat source S1 may also be different from the chip, such as other electronic equipment and its components.

Optionally, the heat sink 10 further includes a sealing ring 15 between the outer periphery of the heat source S1 and the inner periphery of the side wall 10d. The lower bottom surface of the sealing ring 15 abuts against the surface of the base S0 to ensure the sealing between the side wall 10d and the base S0.

The inner cavity of the cooling device 10 is provided with a jet partition 13 , thereby dividing the inner cavity into a liquid separation chamber 11 and a heat dissipation chamber 12 located on both sides of the jet partition 13 . A plurality of jet holes 14 h are formed in the jet partition 13 , so as to connect the liquid separation chamber 11 and the heat dissipation chamber 12 , so that liquid can enter the heat dissipation chamber 12 from the liquid separation chamber 11 .

The liquid separation chamber 11 is formed with an inlet 10a, and the inlet 10a may also be referred to as a liquid inlet or a liquid inlet of a heat sink. Optionally, the inlet 10a is disposed on the top of the liquid separation chamber 11 (for example, formed on the upper wall 10c in this embodiment). The liquid in the external piping system enters the liquid separation chamber 11 through the inlet 10a. The liquid separation chamber 11 can regulate the flow of the liquid so that the liquid passes through the jet hole 14h at a certain pressure and flow rate.

The liquid passing through the jet hole 14h flows to the surface of the heat source S1 in the way of jet impact in the cooling cavity 12, and takes away the heat of the heat source S1. The peripheral wall of the cooling chamber 12 is formed with one or more outlets 10b surrounding the cooling chamber, and the liquid can flow out of the cooling chamber 12 through the outlets 10b to enter the external piping system for the next cycle. The outlet 10b here may also be referred to as a liquid outlet or a liquid outlet of the heat sink.

In this embodiment, the liquid separation chamber 11 includes a primary sub-cavity 11a and a secondary sub-cavity 11b. These two sub-chambers are separated by a liquid separator 11p. The outer periphery of the liquid separation partition 11p is connected to the side wall 10d, and a plurality of liquid separation holes 11h are formed in the liquid separation partition 11p, and the liquid separation holes 11h are connected to the primary sub-cavity 11a and the secondary sub-cavity 11b. Optionally, the liquid separation separator 11p is arranged facing the inlet 10a, or in other words, the axis of the liquid separation hole 11h is parallel to the axis of the inlet 10a. Optionally, a plurality of liquid separation holes 11h are evenly distributed on the liquid separation separator 11p.

It should be understood that when referring to holes or openings above or below, although axes and diameters are used to describe, the present application does not limit the shapes of various holes and openings, and these holes and openings do not necessarily have to be cylindrical as a whole. When the cross-section of the hole or opening is not circular, the size of the aperture is used to express the size of the hole or opening, that is, the area of the area surrounded by the hole or opening; for the convenience of expression, the area surrounded by the hole or opening is also used below The area of is replaced by the aperture or opening area.

In the flow direction, the liquid will sequentially flow through the inlet 10a, the primary sub-cavity 11a, the liquid separation hole 11h and the secondary sub-cavity 11b. The dotted arrows in FIG. 4 schematically show the flow method of the liquid in the heat sink 10 .

The liquid distribution hole 11h plays a role in guiding and distributing the liquid, so that the liquid flowing into the secondary sub-cavity 11b flows more uniformly than the liquid located in the primary sub-cavity 11a, which in turn makes the liquid flowing into the cooling chamber 12 The liquid flows evenly, so that the liquid can have a better heat dissipation effect when the jet flow hits the heat source S1.

Optionally, the hood-shaped heat dissipation device 10 is arranged with the opening (the side where the heat source S1 is located) facing downward; optionally, the liquid separation chamber 11 is located above the heat dissipation chamber 12; Above the secondary sub-cavity 11b; Optionally, the inlet 10a is located above the outlet 10b. The above arrangement makes the flow of the liquid in the cooling device not only rely on the pressure provided by the pump, but also rely on its own gravity, and the impact effect of the jet is good.

It should be understood that, according to different structures and arrangements of the heat source S1, the arrangement direction of the heat sink 10 can be changed accordingly. For example, referring to FIG. The structure is rotated by 90° and set in such a way that the opening faces along the horizontal direction. In addition, the specific positions of the cavities and the inlet 10a and outlet 10b inside the cooling device 10 can also be adjusted according to actual application scenarios.

Optionally, in order to prevent the liquid in the heat dissipation device 10 from generating a large pressure drop before entering the heat dissipation chamber 12, the aperture (or opening area or cross-sectional area) of the liquid distribution hole 11h is larger than the aperture (or opening area or cross-sectional area) of the jet hole 14h (or Said opening area or cross-sectional area) is much larger. For example, the aperture (or opening area or cross-sectional area) of the liquid separation hole 11h is more than three times the aperture (or opening area or cross-sectional area) of the jet hole 14h. Therefore, the liquid in the liquid separation chamber 11 can be regulated in a balanced flow, and will not be greatly hindered and its flow velocity will not be lost too much, thereby ensuring the subsequent jet impact effect.

Optionally, a fluidic layer 14 is also formed in the cooling cavity 12 . The fluidic layer 14 includes a plurality of fluidic columns 140 arranged in an array, and each fluidic column 140 is arranged in alignment with a fluidic hole 14h.

The jet column 140 is in the shape of a hollow tube, one end of which is connected to the surface of the jet partition 13, so that the internal channel of the jet column 140 is connected to the jet hole 14h, and the other end extends to the vicinity of the heat source S1, so that the liquid column impacted by the jet is generated in the The area very close to the heat source S1. For example, the distance between the liquid outlet of the jet column 140 (that is, the other end) and the heat source S1 is no more than 1 mm, and optionally, the distance between the liquid outlet of the jet column 140 and the heat source S1 is 0.35 to 0.7 mm.

Optionally, the diameter of the inner channel of the jet column 140 is equal to the diameter of the jet hole 14h and the two holes are completely aligned. This makes the pressure drop during the flow of the liquid in the jet hole 14h and the jet column 140 very small; and, even if the length of the jet column 140 is increased, the impact on the system pressure drop of the cooling device 10 is also very small, and it is not easy to cause additional The loss of liquid pumping power. Since the outlet 10b is located near the liquid outlet of the jet column 140 in the flow direction of the liquid, the length occupied by the jet column 140 also has the effect of widening the distance between the inlet 10a and the outlet 10b, so that the liquid near the inlet 10a The flow of the liquid and the liquid in the vicinity of the outlet 10b interferes less with each other.

Optionally, the apertures of the jet holes 14h (and the jet columns 140 connected to the jet holes 14h) at different positions are not exactly the same, so as to adjust the flow rate of the liquid columns impacted by the jets in different areas, thereby adjusting and controlling the cooling device 10 to The heat dissipation capabilities of different regions of the heat source S1. For example, in the region where the heat source S1 generates more serious heat (also referred to as a hot spot region), the jet hole 14h facing the region is set as a structure corresponding to a higher jet intensity.

Optionally, the axis of the jet column 140 may not be perpendicular to the surface of the heat source S1, so that the jet column 140 can adjust the flow direction of the liquid and guide the liquid to the hot spot area accurately.

In addition to the column-shaped main body 141 , the jet column 140 optionally also includes a flow guiding part 142 . The air guide part 142 is located at the outer peripheral area of the end of the main body 141 close to the heat source S1. The surface of the flow guide part 142 is formed into a substantially conical shape, and the conical generatrix is generally toward the position of the outlet 10b in the direction of extension away from the direction of the heat source S1, so that the liquid that has completed the impact of the jet can be guided to the outlet 10b, avoiding the cooling cavity 12 The flow of the liquid in the heat sink 10 is blocked and/or unstable, so that the liquid in the heat sink 10 flows smoothly.

Optionally, the fluidic layer 14 further includes a connection structure connecting adjacent fluidic columns 140 , and the fluidic layer 14 further forms openings 144 between adjacent fluidic columns 140 . The opening 144 communicates the liquid outlet of the jet column 140 with the outlet 10b. The cooling chamber 12 forms a recirculation chamber 122 at the side of the opening 144 close to the outlet 10b. The liquid injected from the jet column 140 flows through the opening 144 and enters the recirculation chamber 122 after the jet hits the heat source S1, and then flows out of the heat dissipation device through the outlet 10b. 10.

Optionally, the peripheral portion 143 of the fluidic layer 14 is connected to the side wall 10d, so that the structure of the fluidic layer 14 is stable. Optionally, the fluidic layer 14 can be welded with the side wall 10d and/or the fluidic partition 13 ; or at least two of the fluidic layer 14 , the fluidic partition 13 and the sidewall 10d can be integrally formed.

Optionally, the side wall 10 d is not in contact with the heat source S1 , and the space between the side wall 10 d and the heat source S1 is formed as a side cavity 123 . The side cavity 123 surrounds the outer periphery of the heat source S1, so that the liquid can flow to the outer peripheral wall of the heat source S1, and cool down the outer peripheral wall of the heat source S1 in a direct contact manner.

It can be understood that the number of cooling sources or chips in a heat sink is not limited to one. There may be multiple heat sources or chips in one heat sink, or multiple heat sources of different types.

(Second embodiment of heat sink)

Referring to FIG. 5 , a second embodiment of the heat sink is introduced. The second embodiment is a modification of the first embodiment, and for features identical or similar to those of the first embodiment, the same reference numerals are used in this embodiment, and detailed descriptions of these features are omitted.

In this embodiment, the liquid separation chamber 11 has three sub-cavities, that is, the primary sub-cavity 11a, the secondary sub-cavity 11b and the tertiary sub-cavity 11c which are serially connected in sequence in the flow direction of the liquid. The primary sub-cavity 11a and the secondary sub-cavity 11b are separated by a liquid separation partition 11p (hereinafter also referred to as the upstream liquid separation partition), and a plurality of connected primary sub-cavities 11a are formed in the upstream liquid separation partition and the liquid separation hole 11h (hereinafter also referred to as the upstream liquid separation hole) of the secondary sub-cavity 11b; Separators) are spaced apart, and a plurality of liquid separation holes 11h (hereinafter also referred to as downstream liquid separation holes) connecting the secondary sub-cavity 11b and the tertiary sub-cavity 11c are formed in the downstream liquid separation partition.

Optionally, the pore diameter of the upstream liquid separation hole is larger than the pore diameter of the downstream liquid separation hole. Optionally, the number of downstream liquid separation holes is greater than the number of upstream liquid separation holes. This makes the trend of pressure change stable when the liquid flows through the liquid separation hole step by step, the liquid flows smoothly, and the blockage is not easy to occur.

Optionally, the upstream liquid separation holes and the downstream liquid separation holes are at least partially staggered, or in other words, the axes of at least one of the plurality of upstream liquid separation holes do not coincide with the axes of all the downstream liquid separation holes. This staggered setting method improves the guiding and distributing ability of the multi-stage liquid separation holes to the liquid, and can make the liquid tend to be more uniform during the flow process.

It should be understood that the present application does not limit the number of sub-cavities in the liquid separation chamber, and the number of sub-cavities can be increased according to different scales of heat sinks and different heat dissipation requirements.

The above is only a specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the application. Should be covered within the protection scope of this application. Therefore, the protection scope of the present application should be determined by the protection scope of the claims.

Claims

A heat sink for supplying liquid to a heat source (S1), characterized in that,

The heat dissipation device includes a liquid separation chamber (11) and a heat dissipation chamber (12) connected by a plurality of jet holes (14h), the liquid separation chamber (11) is formed with an inlet (10a) for the liquid, the a heat source (S1) is at least partially housed within said cooling cavity (12),

The liquid separation chamber (11) includes at least two sub-cavities, and the liquid flows through each of the sub-cavities in sequence and then enters the cooling chamber (12),

On the flow path of the liquid, two adjacent sub-cavities are connected by a plurality of liquid separation holes (11h).
The heat dissipation device according to claim 1, characterized in that, a plurality of tubular jet columns (140) communicating with the jet holes (14h) are arranged in the heat dissipation chamber (12), and the jet columns ( 140) extending from said jet hole (14h) towards said heat source (S1).
The heat dissipation device according to claim 1 or 2, characterized in that, the liquid separation chamber (11) comprises at least three sub-cavities,

On the flow path of the liquid, the opening area of the liquid dispensing hole (11h) located upstream is larger than the opening area of the liquid dispensing hole (11h) located downstream.
The heat dissipation device according to any one of claims 1 to 3, characterized in that the axis of at least one liquid distribution hole (11h) located upstream is the same as the axes of all the liquid distribution holes (11h) located downstream None of them overlap.
The heat dissipation device according to any one of claims 1 to 4, characterized in that, the opening area of the liquid separation hole (11h) is larger than the opening area of the jet hole (14h).
The heat dissipation device according to claim 5, characterized in that the opening area of the liquid separation hole (11h) is more than three times the opening area of the jet hole (14h).
The heat dissipation device according to claim 5 or 6, characterized in that at least two of the jet holes (14h) in the plurality of jet holes (14h) have different opening areas.
The heat dissipation device according to claim 2, characterized in that, the cross-sectional area of the internal through hole of the jet column (140) is equal to the cross-sectional area of the jet hole (14h).
The heat dissipation device according to claim 2 or 8, characterized in that, the peripheral wall of the heat dissipation cavity (12) is formed with a plurality of outlets (10b) for the liquid to flow out of the heat dissipation cavity (12),

The jet column (140) forms a guide part (142) on the outer periphery of at least the end close to the heat source (S1), and the guide part (142) has a function capable of guiding the liquid to the outlet (10b) ) in the direction of the surface.
The heat dissipation device according to claim 9, characterized in that, a plurality of the jet columns (140) are connected to each other to form a jet layer (14), and adjacent jet columns (140) are formed with through the The fluidic layer (14) and the opening (144) leading to the outlet (10b).
The heat dissipation device according to claim 10, characterized in that, the heat dissipation device comprises a jet partition (13) for separating the liquid separation chamber (11) from the heat dissipation chamber (12), and the jet hole (14h) penetrating through the jet barrier (13) in the thickness direction of the jet barrier (13),

The fluidic layer (14) is welded to the fluidic partition (13), or

The jet layer (14) is integrally formed with the jet partition (13).
The heat dissipation device according to claim 9, characterized in that, the inlet (10a) communicates with the plurality of outlets (10b).
The heat dissipation device according to any one of claims 1 to 12, characterized in that, the heat dissipation chamber (12) comprises a side wall (10d), and the side wall (10d) surrounds the heat source (S1) outer periphery, said side wall (10d) is not in contact with said heat source (S1),

The heat dissipation cavity (12) includes a side cavity (123) located between the heat source (S1) and the side wall (10d).
The heat dissipation device according to claim 13, characterized in that, the heat dissipation device is used to dissipate heat from electronic equipment including the heat source (S1), the electronic equipment also includes a base (S0), and the heat source (S1 ) is disposed on one surface of said base (S0),

said side wall (10d) is adapted to abut against said one surface of said base (S0),

The heat dissipation device further includes a sealing ring (15), the sealing ring (15) is sleeved on the outer periphery of the heat source (S1), and the sealing ring (15) is embedded in the side wall (10d) On the inner periphery, one end surface of the sealing ring (15) abuts against the one surface of the base (S0).
The heat dissipation device according to any one of claims 1 to 14, characterized in that, the liquid separation chamber (11) is located above the heat dissipation chamber (12), and the lower part of the heat dissipation chamber (12) is used for The heat source (S1) is set.
The heat dissipation device according to any one of claims 1 to 15, characterized in that the heat source (S1) comprises a chip.
A heat dissipation system, characterized in that it comprises a pump (20), a liquid storage tank (30) and at least one heat dissipation device according to any one of claims 1 to 16,

The pump (20) is used to pump the liquid in the liquid storage tank (30) to the heat sink, and pump the liquid flowing out of the heat sink back to the liquid storage tank (30 ).
The heat dissipation system according to claim 17, characterized in that, the heat dissipation system further comprises a refrigerator (40) and a preheater (50),

The refrigerator (40) is arranged downstream of the heat sink and upstream of the liquid storage tank (30), and the refrigerator (40) is used to cool down the liquid flowing through it,

The preheater (50) is arranged downstream of the liquid storage tank (30) and upstream of the heat sink, and the preheater (50) is used to heat the liquid flowing through it to a predetermined temperature.