CN116654384B - Semiconductor device seals membrane rolling all-in-one - Google Patents
Semiconductor device seals membrane rolling all-in-one Download PDFInfo
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- CN116654384B CN116654384B CN202310959668.8A CN202310959668A CN116654384B CN 116654384 B CN116654384 B CN 116654384B CN 202310959668 A CN202310959668 A CN 202310959668A CN 116654384 B CN116654384 B CN 116654384B
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- round rod
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- 238000005096 rolling process Methods 0.000 title claims abstract description 28
- 239000012528 membrane Substances 0.000 title claims description 28
- 239000002313 adhesive film Substances 0.000 claims abstract description 96
- 230000007246 mechanism Effects 0.000 claims abstract description 67
- 238000007789 sealing Methods 0.000 claims abstract description 64
- 238000004804 winding Methods 0.000 claims abstract description 53
- 238000010438 heat treatment Methods 0.000 claims abstract description 34
- 239000003292 glue Substances 0.000 claims abstract description 26
- 238000003825 pressing Methods 0.000 claims description 43
- 239000010408 film Substances 0.000 description 64
- 238000004806 packaging method and process Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000006978 adaptation Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000012785 packaging film Substances 0.000 description 2
- 229920006280 packaging film Polymers 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
- B65B51/16—Applying or generating heat or pressure or combinations thereof by rotary members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B59/00—Arrangements to enable machines to handle articles of different sizes, to produce packages of different sizes, to vary the contents of packages, to handle different types of packaging material, or to give access for cleaning or maintenance purposes
- B65B59/003—Arrangements to enable adjustments related to the packaging material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application relates to the technical field of semiconductor device sealing films, in particular to a semiconductor device sealing film rolling integrated machine, which comprises: the device comprises a transportation plane, a glue film reel and a winding reel; the adhesive film guide mechanism and the adhesive film heat sealing mechanism are sequentially arranged on the transport plane, the adhesive film reel is positioned above the transport plane, the winding reel is positioned at the tail end of the transport plane, and the annular groove of the winding reel corresponds to the transport plane; the adhesive film guiding mechanism comprises an upper clamping round rod and a lower clamping round rod, the upper clamping round rod and the lower clamping round rod are both used for guiding the adhesive film on the adhesive film reel, and the lower clamping round rod is tangent to the conveying plane; the glue film heat sealing mechanism comprises a lifting mechanism and heating plates, wherein the heating plates are respectively arranged on two sides of the conveying plane, the plate surfaces of the heating plates are attached to the side edges of the conveying plane, and the lifting mechanism is respectively used for controlling the lifting height of the heating plates. The scheme provided by the application realizes automatic film sealing and winding of the semiconductor device and improves the automation degree of the semiconductor device processing equipment.
Description
Technical Field
The application relates to the technical field of semiconductor device sealing films, in particular to a semiconductor device sealing film rolling integrated machine.
Background
The semiconductor device (semiconductor device) is an electronic device with conductivity between good conductor and insulator, which uses the special electric property of semiconductor material to perform specific functions, and can be used for generating, controlling, receiving, converting, amplifying signals and converting energy; the semiconductor material of the semiconductor device is silicon, germanium or gallium arsenide, and can be used as equipment such as rectifiers, oscillators, light emitters, amplifiers, photometers and the like, and is sometimes called a discrete device for distinguishing the semiconductor device from an integrated circuit; semiconductor devices generally utilize different semiconductor materials and adopt different processes and geometric structures, so that various crystal diodes with various kinds and different functional purposes have been developed, and the frequency coverage range of the crystal diodes can be from low frequency, high frequency, microwave, millimeter wave, infrared to light wave; transistors can be divided into bipolar transistors and field effect transistors, and besides being used as general transistors for amplifying, oscillating and switching, there are special purpose transistors such as phototransistors, magneto-dependent transistors, field effect sensors, etc.
With the development of technology, many intelligent products are emerging on the market, and most of the intelligent products are provided with special semiconductor devices; the chip is a semiconductor device commonly used in the electronic industry at present, generally, manufacturers will buy various recordable IC chips from semiconductor manufacturers, and the IC chip (Integrated Circuit Chip) is a chip formed by placing an integrated circuit formed by a large number of microelectronic components (transistors, resistors, capacitors, etc.) on a plastic substrate; an integrated circuit (integrated circuit) is a microelectronic device or component, and is formed by interconnecting the components, such as transistors, diodes, resistors, capacitors, inductors, and the like, and wiring required in a circuit by a process, on a small or several small semiconductor wafers or dielectric substrates, and then packaging the semiconductor wafers or dielectric substrates in a package to form a microstructure having the required circuit function; wherein all the components are structurally integrated, so that the electronic components are greatly advanced towards microminiaturization, low power consumption and high reliability; it is indicated in the circuit by the letter "IC".
The production of IC chips has a plurality of manufacturing processes, the chip is in the process of transferring between each process, need to use the loading tray or the carrier tape as the carrier of depositing and transporting, wherein, because the carrier tape is flexible braid, after the chip is placed in the chip standing groove in the carrier tape, seal the membrane to the braid, can roll up the braid and deposit in the reel at last, make the depositing and transporting of chip more convenient, in the chip packaging technology of current, usually, need two operators to cooperate and accomplish the membrane sealing work of carrier tape, namely one of them operator puts the chip into the carrier tape through tweezers, then another operator holds the hot seal board and carries out the hot seal with the carrier tape, still need to pull away the carrier tape of encapsulation or roll up in the reel after this operator encapsulates a period of time simultaneously, collect the carrier tape and deposit, the chip packaging technology inefficiency of current is lower, the manual encapsulation is higher to the operation requirement of operator, and the same operation of long-time makes the operator easily appear local encapsulation not tight, seal membrane and carrier tape bias, and the membrane is in the hot seal membrane is in the sealing process, the problem of the consumption of manpower and time and the quality of sealing can't be guaranteed.
For example, chinese patent publication No. CN101477828B, entitled "automated IC burning machine", which is to automatically package and store burned chips, specifically, the apparatus includes a carrying and sucking mechanism and a packaging device, wherein the carrying and sucking mechanism is used to suck chips, the chips are carried from a burning seat to a packaging groove of a packaging blank, the packaging blank is conveyed under a heating cutter in a track, the packaging cover film and the packaging blank are thermally welded to form a material tape by the heating cutter, and finally the material tape is rolled on a packaging tray by a rotating motor; although the device realizes automatic packaging and storage of chips, the device is only suitable for packaging empty tapes with one width and thickness size, and can not be adapted to packaging empty tapes with different sizes by adjusting the width and the depth of the track, so that the device has a relatively narrow application range and is not suitable for popularization and use.
Therefore, how to automatically seal and roll up the semiconductor device is a technical problem that needs to be solved by the current technicians.
Disclosure of Invention
In order to overcome the problems in the related art, the application provides the semiconductor device film sealing and winding integrated machine, which can realize film sealing and winding of a semiconductor device, improve the packaging automation degree of the semiconductor device and improve the production efficiency and the packaging quality of products.
In order to achieve the above object, the present application provides a semiconductor device film sealing and winding integrated machine, comprising: the device comprises a transportation plane, a glue film reel and a winding reel, wherein the transportation plane is used for transporting a carrier tape filled with semiconductor devices;
the adhesive film guide mechanism and the adhesive film heat sealing mechanism are sequentially arranged on the transport plane, the adhesive film reel is positioned above the transport plane, the winding reel is positioned at the tail end of the transport plane, and the annular groove of the winding reel corresponds to the transport plane;
the adhesive film guiding mechanism comprises an upper clamping round rod and a lower clamping round rod, wherein the upper clamping round rod and the lower clamping round rod are both used for guiding an adhesive film on the adhesive film reel, and the lower clamping round rod is tangential to the conveying plane;
the glue film heat sealing mechanism comprises a lifting mechanism and heating plates, wherein the heating plates are respectively arranged on two sides of the conveying plane, the plate surfaces of the heating plates are attached to the side edges of the conveying plane, and the lifting mechanism is respectively used for controlling the lifting height of the heating plates.
Preferably, the adhesive film guiding mechanism further comprises an adhesive film pressing plate and a carrier tape pressing plate, the plate surfaces of the adhesive film pressing plate and the carrier tape pressing plate are both close to the conveying plane, the lower clamping round rod is located between the adhesive film pressing plate and the carrier tape pressing plate, and the distance between the initial end of the adhesive film pressing plate and the tail end of the carrier tape pressing plate is smaller than the diameter of the lower clamping round rod.
Preferably, the glue film guiding mechanism further comprises limiting plates, the limiting plates are respectively arranged on two sides of the conveying plane, the upper round clamping rod and the lower round clamping rod are rotationally connected with the limiting plates, the limiting plates comprise guiding plate faces perpendicular to the conveying plane, and the guiding plate faces are located on one side close to the conveying plane.
Preferably, the transport plane is also provided with a glue film compression structure, and the glue film heat sealing mechanism is positioned between the glue film compression structure and the glue film guiding mechanism; the glue film compacting structure comprises a right-angle bracket and compacting rotary rollers, wherein the right-angle bracket is arranged at two ends of the compacting rotary rollers, the compacting rotary rollers are rotationally connected with the right-angle bracket, and the compacting rotary rollers are tangential to the conveying plane.
Preferably, the glue film compacting structure further comprises a fixing bolt and a buffer spring, the right-angle bracket comprises a first support column and a second support column, the second support column is in sliding connection with the conveying plane, the sliding direction of the second support column is perpendicular to the conveying plane, a bolt through hole is formed in the first support column, the fixing bolt is fixed on two sides of the conveying plane through the bolt through hole, the buffer spring is sleeved on a screw rod of the fixing bolt, and two ends of the buffer spring are respectively fixedly connected with a screw cap of the fixing bolt and the surface of the first support column.
Preferably, the width adjusting clamping plate comprises a width fixing plate and a width adjusting plate, wherein the width fixing plate and the width adjusting plate are respectively arranged on two sides of the conveying plane, the plate surfaces of the width fixing plate and the width adjusting plate are attached to the side edges of the conveying plane, the width fixing plate is fixedly connected with the conveying plane, the width adjusting plate is slidably connected with the conveying plane, and the moving direction of the width adjusting plate is parallel to the conveying plane and perpendicular to the plate surface of the width fixing plate.
Preferably, the device further comprises a fixed frame, the fixed frame comprises a fixed flat plate, a cross arm and a portal frame, the fixed flat plate is positioned between the cross arm and the portal frame, the cross arm is fixed on the fixed flat plate through a connecting straight plate, the portal frame is fixed on the lower surface of the fixed flat plate, the width adjusting clamping plate is fixed on the fixed flat plate, the adhesive film reel is rotationally connected with the cross arm, and the winding reel is rotationally connected with the portal frame.
Preferably, the fixed frame is provided with a guide round bar and an adjusting rocker, the guide round bar is respectively fixed on the cross arm and the connecting straight plate, the adjusting rocker is positioned between the guide round bars, the adjusting rocker comprises a rocker support plate, an adjusting round bar and a limiting column, the adjusting round bar and the limiting column are respectively arranged on two plate surfaces of the rocker support plate, one end of the rocker support plate is hinged with the cross arm, the other end of the rocker support plate is fixedly connected with the adjusting round bar, a rocker arc hole is formed in the cross arm, the rocker arc hole is matched with the limiting column, and the rocker arc hole is used for controlling the rotation angle of the rocker support plate.
Preferably, the number of the winding reels is at least 2, the winding reels are uniformly arranged on the portal frame, the circle centers of the winding reels are provided with rotating motors, the circle centers of the winding reels are fixedly connected with the rotating ends of the rotating motors, and the rotating speed of the winding reels is consistent with the moving speed of the carrier tape on the transport plane.
Preferably, the device further comprises a rotary pinwheel and a conveying motor, wherein the rotary pinwheel is arranged at the tail end of the conveying plane, the rotary end of the conveying motor is fixedly connected with the rotary pinwheel, and the rotary pinwheel is used for controlling the moving distance of the carrier tape on the conveying plane.
The technical scheme provided by the application can comprise the following beneficial effects:
in the technical scheme, a transport plane, a film reel and a winding reel are respectively arranged on a film sealing and winding integrated machine, the transport plane is used for transporting a carrier tape provided with a semiconductor device, a film guide mechanism and a film heat sealing mechanism are sequentially arranged on the transport plane, the film reel is arranged above the transport plane, the winding reel is positioned at the tail end of the transport plane, a ring groove of the winding reel corresponds to the transport plane, then an upper round clamping rod and a lower round clamping rod are arranged on the film guide mechanism, the upper round clamping rod and the lower round clamping rod are used for guiding a film on the film reel, the lower round clamping rod is tangential to the transport plane, finally a lifting mechanism and a heating plate are arranged on the film heat sealing mechanism, the heating plates are respectively arranged on two sides of the transport plane, the plate surface of the heating plate is attached to the side edge of the transport plane, and the lifting height of the heating plate is respectively controlled by the lifting mechanism; for example, when a chip is placed on a carrier tape and needs to be sealed, the carrier tape moves on a transport plane, the carrier tape which has completed sealing the film pulls out the adhesive film from the adhesive film reel, then the adhesive film passes through the middle of an upper clamping round rod and a lower clamping round rod, bypasses the lower clamping round rod and passes between the lower clamping round rod and the transport plane, so that the adhesive film can be positioned above the carrier tape and is close to the carrier tape, when the area, needing sealing the film, in the carrier tape moves to the position right below the adhesive film heat sealing mechanism, the lifting mechanism controls the heating plate to descend, the heating end of the heating plate is close to the adhesive film, the two sides of the adhesive film are thermally fused with the carrier tape, then the carrier tape completed by thermally sealing the film moves on the transport plane, the carrier tape is wound up and coiled, and the carrier tape is stored in the annular groove of the wound up carrier tape reel; the packaging film and the winding of the semiconductor device are realized, the packaging automation degree of the semiconductor device is improved, and the production efficiency and the packaging quality of products are improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.
Fig. 1 is a schematic structural diagram of a film sealing and winding integrated machine according to an embodiment of the present application.
Fig. 2 is a schematic structural view of a film guiding mechanism according to an embodiment of the present application.
Fig. 3 is a schematic view of the structure of the pinch roller according to the embodiment of the present application.
Fig. 4 is a schematic view showing the construction of a rotary pinwheel and a transport motor according to an embodiment of the present application.
In the figure: the adhesive film conveying device comprises a conveying plane 1, an adhesive film guiding mechanism 2, an upper clamping round rod 20, a lower clamping round rod 21, an adhesive film pressing plate 22, a carrier tape pressing plate 23, a limiting plate 24, a guide plate surface 240, an adhesive film heat sealing mechanism 3, a lifting mechanism 30, a heating plate 31, an adhesive film pressing structure 4, a right-angle bracket 40, a first support column 401, a bolt through hole 4010, a second support column 402, a pressing roller 41, a fixing bolt 42, a buffer spring 43, a width adjusting clamping plate 5, a width fixing plate 50, a width adjusting plate 51, a fixing frame 6, a fixing plate 60, a cross arm 61, a rocker arm arc hole 610, a portal frame 62, a connecting straight plate 63, an adhesive film reel 7, a guide round rod 8, an adjusting rocker 9, a rocker arm support plate 90, an adjusting round rod 91, a limiting column 92, a winding reel 10, a rotating motor 100, a rotating needle wheel 11 and a conveying motor 110.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments of the present application. All other embodiments obtained by those skilled in the art without making any inventive effort are within the scope of the present application. Preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
In the description of the present application, it should be understood that the terms "thickness," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In order to solve the problems, the embodiment of the application provides a semiconductor device film sealing and winding integrated machine, which can realize film sealing and winding of a semiconductor device during operation, improve the packaging automation degree of the semiconductor device and improve the production efficiency and the packaging quality of products.
The following describes the technical scheme of the embodiment of the present application in detail with reference to the accompanying drawings.
Referring to fig. 1 to 4, the semiconductor device film sealing and winding integrated machine includes: a transport plane 1, a film reel 7 and a take-up reel 10, the transport plane 1 being used for transporting a carrier tape containing semiconductor devices;
the adhesive film guide mechanism 2 and the adhesive film heat sealing mechanism 3 are sequentially arranged on the transport plane 1, the adhesive film reel 7 is positioned above the transport plane 1, the winding reel 10 is positioned at the tail end of the transport plane 1, and the annular groove of the winding reel 10 corresponds to the transport plane 1;
the adhesive film guiding mechanism 2 comprises an upper round clamping rod 20 and a lower round clamping rod 21, wherein the upper round clamping rod 20 and the lower round clamping rod 21 are used for guiding the adhesive film on the adhesive film reel 7, and the lower round clamping rod 21 is tangential to the conveying plane 1;
the glue film heat sealing mechanism 3 comprises a lifting mechanism 30 and a heating plate 31, wherein the heating plates 31 are respectively arranged on two sides of the transport plane 1, the plate surface of the heating plate 31 is attached to the side edge of the transport plane 1, and the lifting mechanism 30 is respectively used for controlling the lifting height of the heating plate 31.
Specifically, the adhesive film guiding mechanism 2 further includes an adhesive film pressing plate 22 and a carrier tape pressing plate 23, the plate surface of the adhesive film pressing plate 22 and the plate surface of the carrier tape pressing plate 23 are both close to the transport plane 1, the lower round clamping rod 21 is located between the adhesive film pressing plate 22 and the carrier tape pressing plate 23, and the distance between the start end of the adhesive film pressing plate 22 and the tail end of the carrier tape pressing plate 23 is smaller than the diameter of the lower round clamping rod 21.
Specifically, the adhesive film guiding mechanism 2 further includes a limiting plate 24, the limiting plates 24 are respectively disposed on two sides of the transport plane 1, the upper round clamping rod 20 and the lower round clamping rod 21 are rotationally connected with the limiting plate 24, the limiting plate 24 includes a guiding plate surface 240, the guiding plate surface 240 is perpendicular to the transport plane 1, and the guiding plate surface 240 is located on one side close to the transport plane 1.
Specifically, the transport plane 1 is also provided with a glue film compression structure 4, and the glue film heat sealing mechanism 3 is positioned between the glue film compression structure 4 and the glue film guiding mechanism 2; the glue film compacting structure 4 comprises a right-angle bracket 40 and compacting rollers 41, the right-angle bracket 40 is arranged at two ends of the compacting rollers 41, the compacting rollers 41 are rotationally connected with the right-angle bracket 40, and the compacting rollers 41 are tangential to the transport plane 1.
Specifically, the glue film compacting structure 4 further includes a fixing bolt 42 and a buffer spring 43, the right angle bracket 40 includes a first support pillar 401 and a second support pillar 402, the second support pillar 402 is slidably connected with the transport plane 1, the sliding direction of the second support pillar 402 is perpendicular to the transport plane 1, a bolt through hole 4010 is formed in the first support pillar 401, the fixing bolt 42 is fixed on two sides of the transport plane 1 through the bolt through hole 4010, the buffer spring 43 is sleeved on a screw rod of the fixing bolt 42, and two ends of the buffer spring 43 are respectively fixedly connected with a nut of the fixing bolt 42 and a surface of the first support pillar 401.
Specifically, the width adjusting clamping plate 5 is further included, the width adjusting clamping plate 5 comprises a width fixing plate 50 and a width adjusting plate 51, the width fixing plate 50 and the width adjusting plate 51 are respectively arranged on two sides of the conveying plane 1, the plate surfaces of the width fixing plate 50 and the width adjusting plate 51 are attached to the side edges of the conveying plane 1, the width fixing plate 50 is fixedly connected with the conveying plane 1, the width adjusting plate 51 is slidably connected with the conveying plane 1, and the moving direction of the width adjusting plate 51 is parallel to the conveying plane 1 and perpendicular to the plate surfaces of the width fixing plate 50.
Specifically, the device further comprises a fixed frame 6, the fixed frame 6 comprises a fixed flat plate 60, a cross arm 61 and a portal frame 62, the fixed flat plate 60 is located between the cross arm 61 and the portal frame 62, the cross arm 61 is fixed on the fixed flat plate 60 through a connecting straight plate 63, the portal frame 62 is fixed on the lower surface of the fixed flat plate 60, the width adjusting clamping plate 5 is fixed on the fixed flat plate 60, the adhesive film reel 7 is rotationally connected with the cross arm 61, and the winding reel 10 is rotationally connected with the portal frame 62.
Specifically, be equipped with direction round bar 8 and adjustment rocker 9 on the fixed frame, direction round bar 8 is fixed respectively xarm 61 with connect on the straight board 63, adjustment rocker 9 is located between the direction round bar 8, adjustment rocker 9 is including rocking arm extension board 90, adjustment round bar 91 and limit post 92, adjustment round bar 91 with limit post 92 sets up respectively on two faces of rocking arm extension board 90, the one end of rocking arm extension board 90 with xarm 61 articulates, the other end and the adjustment round bar 91 fixed connection of rocking arm extension board 90, be equipped with rocking arm arc hole 610 on the xarm 61, rocking arm arc hole 610 with limit post 92 adaptation, rocking arm arc hole 610 is used for controlling rocking arm extension board 90's rotation angle.
Specifically, the number of the winding reels 10 is at least 2, the winding reels 10 are uniformly arranged on the portal frame 62, the circle centers of the winding reels 10 are all provided with rotating motors 100, the circle centers of the winding reels 10 are fixedly connected with the rotating ends of the rotating motors 100, and the rotating speed of the winding reels 10 is consistent with the moving speed of the carrier tape on the transport plane 1.
Specifically, the device further comprises a rotary needle wheel 11 and a transport motor 110, wherein the rotary needle wheel 11 is arranged at the tail end of the transport plane 1, the rotating end of the transport motor 110 is fixedly connected with the rotary needle wheel 11, and the rotary needle wheel 11 is used for controlling the moving distance of the carrier tape on the transport plane 1.
In the first embodiment, in order to realize film sealing and winding of a semiconductor device, the embodiment provides a film sealing and winding integrated machine of the semiconductor device; the film sealing and winding integrated machine is provided with a transport plane, a film reel and a winding reel respectively, the transport plane is utilized to transport a carrier tape provided with a semiconductor device, the film reel is arranged above the transport plane by sequentially arranging a film guide mechanism and a film heat sealing mechanism on the transport plane, the winding reel is positioned at the tail end of the transport plane, an annular groove of the winding reel corresponds to the transport plane, then an upper round clamping rod and a lower round clamping rod are arranged on the film guide mechanism, the upper round clamping rod and the lower round clamping rod are utilized to guide a film on the film reel, the lower round clamping rod is tangential to the transport plane, finally, a lifting mechanism and a heating plate are arranged on the film heat sealing mechanism, the heating plate is respectively arranged on two sides of the transport plane, the plate surface of the heating plate is attached to the side edge of the transport plane, the lifting height of the heating plate is respectively controlled by utilizing the lifting mechanism, the lifting mechanism is composed of a driving cylinder and a connecting plate, and two sides of the connecting plate are respectively fixedly connected with the plate surface of the driving end of the driving cylinder and the heating plate;
for example, when a chip is placed on a carrier tape and needs to be sealed, the carrier tape moves on a conveying plane, meanwhile, the carrier tape which has completed sealing the film pulls out the adhesive film from the adhesive film reel, then the adhesive film is in tangential contact with the upper clamping round rod from the upper clamping round rod and the adhesive film heat sealing mechanism, then the adhesive film passes through the middle of the upper clamping round rod and the lower clamping round rod and bypasses the lower clamping round rod, passes between the lower clamping round rod and the conveying plane, so that the adhesive film can be positioned above the carrier tape and is close to the carrier tape, when the area which needs sealing the film in the carrier tape moves to the position right below the adhesive film heat sealing mechanism, a driving cylinder controls a heating plate to descend, the heating end of the heating plate is close to the adhesive film, two sides of the adhesive film are made to be fused with the carrier tape, then the carrier tape which is completed by heat sealing the film moves on the conveying plane, the carrier tape is wound in a coiling way, and the carrier tape is stored in an annular groove of the coiling reel; the packaging machine has the advantages that the packaging film and the winding of the semiconductor device are realized, the packaging automation degree of the semiconductor device is improved, the film sealing quality of the carrier tape is improved by the aid of the adhesive film guiding mechanism, and the problems that part of the adhesive film is unstable or the adhesive film is damaged when the adhesive film is sealed are avoided.
In the second embodiment, in order to further explain how the adhesive film guiding mechanism aligns the adhesive film with the carrier tape, specifically, the adhesive film guiding mechanism is further provided with a limiting plate, an adhesive film pressing plate and a carrier tape pressing plate, the 2 limiting plates are respectively arranged at two sides of the transport plane, the upper round clamping rod and the lower round clamping rod are both rotationally connected with the limiting plates, the guiding plate faces are perpendicular to the transport plane through arranging the guiding plate faces on the limiting plates, the guiding plate faces are located at one side close to the transport plane, and the guiding plate faces of the 2 limiting plates are oppositely arranged; then the plate surface of the adhesive film pressing plate and the plate surface of the carrier tape pressing plate are both close to the conveying plane, the lower clamping round rod is positioned between the adhesive film pressing plate and the carrier tape pressing plate, and finally the distance between the initial end of the adhesive film pressing plate and the tail end of the carrier tape pressing plate is smaller than the diameter of the lower clamping round rod; for example, when the adhesive film is pulled out from the adhesive film reel, the adhesive film is positioned between the 2 limiting plates during the period that the adhesive film passes through the upper round clamping rod and the lower round clamping rod, the distance between the two limiting plates is consistent with the width of the carrier tape, and finally the adhesive film passes through the space between the lower round clamping rod and the transport plane, so that the adhesive film can be positioned right above the carrier tape, and the problem that the adhesive film is damaged or lost due to deviation between the adhesive film and the carrier tape during film sealing can be avoided; the carrier tape can be flattened before being aligned with the adhesive film by the aid of the carrier tape pressing plate, the adhesive film can be kept close to the carrier tape in parallel after being aligned with the carrier tape by the aid of the adhesive film pressing plate, and the film sealing quality of the carrier tape can be improved.
It is worth noting that, in order to realize sealing the membrane to the carrier tape of different width, specifically, still be provided with width adjustment splint, width adjustment splint comprises width fixed plate and width adjustment board, with width fixed plate and width adjustment board set up the both sides at transportation plane respectively, and make the face of width fixed plate and width adjustment board all laminate with this transportation plane's side, make width fixed plate and transportation plane fixed connection simultaneously, with width adjustment board and transportation plane sliding connection, make the direction of movement of width adjustment board be on a parallel with transportation plane, and the face of perpendicular to width fixed plate, be provided with a rotation handle on the width adjustment board, the screw rod of this rotation handle is with the screwed pipe adaptation on the width fixed plate, when the carrier tape of needs to match wider, the width fixed plate is fixed, twist the rotation handle, the rotation handle can outwards promote the width adjustment board, simultaneously through the angle of control twist can more accurate control the width of width adjustment board, thereby increase or reduce the width of transportation plane, realize carrying tape rolling up to different width and adapted, the variety of this semiconductor device adaptation to the integrative machine of sealing the membrane.
In the third embodiment, in order to prevent the carrier tape after the film is thermally sealed from being separated from the adhesive film, specifically, the adhesive film heat-sealing mechanism is arranged between the adhesive film pressing structure and the adhesive film guiding mechanism by arranging the adhesive film pressing structure on the transport plane; the adhesive film compacting structure consists of a right-angle bracket, a compacting roller, a fixing bolt and a buffer spring, wherein the right-angle bracket is arranged at two ends of the compacting roller, and the compacting roller is rotationally connected with the right-angle bracket to enable the compacting roller to be tangential with a transport plane; the right-angle bracket consists of a first support and a second support, the second support is respectively connected with the width fixing plate and the width adjusting plate in a sliding manner, the sliding direction of the second support is perpendicular to the transportation plane, through the bolt through holes arranged on the first support, the fixing bolts can be fixed on two sides of the transportation plane through the bolt through holes, the buffer springs are sleeved on the screw rods of the fixing bolts, and two ends of the buffer springs are respectively fixedly connected with the screw caps of the fixing bolts and the surfaces of the first support; after the carrier tape finishes the hot-melt sealing film, the carrier tape moves to the position right below the adhesive film pressing structure, at this time, the pressing roller rolls the carrier tape, the right-angle bracket moves upwards or downwards according to the thickness of the carrier tape, and meanwhile, the buffer spring keeps the pressure of the pressing roller on the carrier tape, so that the adhesive tape can be firmly adhered with the carrier tape, and the carrier tape and the adhesive film after the hot-melt sealing film are prevented from being separated.
It is worth to say that, in order to fix each part in the film sealing rolling all-in-one, specifically, through setting up fixed frame in the film sealing rolling all-in-one, fixed frame comprises fixed flat board, xarm and portal frame, set up fixed flat board between xarm and portal frame, fix the xarm in fixed flat board's top through connecting straight board, fix the portal frame at fixed flat board's lower surface simultaneously, fix width adjustment splint on fixed flat board at last, make glued membrane reel and xarm rotate to be connected, make 3 winding reels evenly set up on the portal frame, the winding reel is all rotated with the portal frame simultaneously to be connected, elevating system fixes on fixed flat board, realize the installation fixed to each part in the fixed film sealing rolling all-in-one, make the film sealing rolling all-in-one compacter, the use in space has been practiced thrift.
In the fourth embodiment, in order to avoid the problem that the adhesive film cannot be aligned with the carrier tape during heat sealing due to loosening of the adhesive film in the process from the adhesive film reel to the adhesive film guiding mechanism, specifically, an adjusting rocker and 2 guiding round bars are arranged on a fixed frame, the 2 guiding round bars are respectively fixed on a cross arm and a connecting straight plate, then the adjusting rocker is positioned between the 2 guiding round bars, guiding clamping plates are arranged on the 2 guiding round bars, the adjusting rocker consists of a rocker support plate, an adjusting round bar and a limiting column, the adjusting round bar and the limiting column are respectively arranged on two plate surfaces of the rocker support plate, one end of the rocker support plate is hinged with the cross arm, the other end of the rocker support plate is fixedly connected with the adjusting round bar, and meanwhile, a rocker arc hole is arranged on the cross arm, so that the rocker arc hole is matched with the limiting column; when the glued membrane is tangent from glued membrane reel to glued membrane guiding mechanism's in-process, glued membrane and direction round bar, and be located the centre of direction splint, restriction glued membrane is in the position on the direction round bar, prevent that the glued membrane from the landing on the direction round bar, afterwards glued membrane is tangent with the adjustment round bar, the rotation angle of adjustment round bar accessible rocking arm extension board makes the glued membrane taut, rocking arm arc hole can control the rotation angle of rocking arm extension board, then glued membrane is tangent with another direction round bar, finally glued membrane gets into glued membrane guiding mechanism in, glued membrane is strained through the adjustment rocking arm, can avoid glued membrane from glued membrane reel to glued membrane guiding mechanism's in-process to loosen, the glue membrane can't be with the problem of carrier band alignment when leading to the heat-seal.
It is worth to say that, in order to realize the rolling of the carrier tape after the film sealing, specifically, through setting up 3 rolling reels on the portal frame, and the centre of a circle of the rolling reel is all provided with the rotation motor, the rotation end of rotation motor and the centre of a circle of the rolling reel are fixedly connected, make the rotation speed of the rolling reel unanimous with the movement speed of the carrier tape on the transport plane; when the carrier tape seals the membrane and accomplishes the back, rotate the motor and drive the rolling reel and rotate to pull the carrier tape and remove to the rolling reel from the transportation plane on, realize the rolling to the carrier tape, 3 rolling reels independent operation can the quick replacement another rolling reel work after the rolling is full of one, save the time of change, the speed that the carrier tape removed is unanimous with the rolling speed of rolling reel, can avoid detaining in the sky or draw out the problem that the carrier tape appears from multistage carrier tape.
It should be noted that, in order to realize the automatic movement of carrier tape on the transportation plane, specifically, through setting up rotation pinwheel and transportation motor at the end of transportation plane, wherein, make the centre of a circle of rotation pinwheel and the rotation end fixed connection of transportation motor, utilize transportation motor to drive rotation pinwheel rotation, the sprocket on the rotation pinwheel and the sprocket adaptation on the carrier tape simultaneously, can drive the carrier tape and remove when rotating the pinwheel, this mode of movement can avoid the carrier tape to produce relative slip simultaneously, causes the problem of carrier tape repetition envelope.
The aspects of the present application have been described in detail hereinabove with reference to the accompanying drawings. In the foregoing embodiments, the descriptions of the embodiments are focused on, and for those portions of one embodiment that are not described in detail, reference may be made to the related descriptions of other embodiments. Those skilled in the art will also appreciate that the acts and modules referred to in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application may be sequentially adjusted, combined and pruned according to actual needs, and the structure in the apparatus of the embodiment of the present application may be combined, divided and pruned according to actual needs.
The foregoing description of embodiments of the application has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the improvement of technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (7)
1. The utility model provides a semiconductor device seals membrane rolling all-in-one which characterized in that includes:
the device comprises a transportation plane, a film reel, a winding reel, a film pressing plate and a carrier tape pressing plate, wherein the transportation plane is used for transporting a carrier tape provided with a semiconductor device, and the carrier tape is a flexible braid;
the conveying plane is sequentially provided with a glue film guide mechanism and a glue film heat sealing mechanism, the conveying plane is also provided with a glue film compacting structure, and the glue film heat sealing mechanism is positioned between the glue film compacting structure and the glue film guide mechanism; the adhesive film reel is positioned above the transport plane, the rolling reel is positioned at the tail end of the transport plane, and the annular groove of the rolling reel corresponds to the transport plane; the adhesive film compacting structure comprises a fixing bolt, a buffer spring, a right-angle bracket and compacting rotary rollers, wherein the right-angle bracket is arranged at two ends of the compacting rotary rollers, the compacting rotary rollers are rotationally connected with the right-angle bracket, and the compacting rotary rollers are tangential to the conveying plane;
the adhesive film guiding mechanism comprises an upper clamping round rod and a lower clamping round rod, the upper clamping round rod and the lower clamping round rod are both used for guiding an adhesive film on the adhesive film reel, and the lower clamping round rod is tangent to the conveying plane; the plate surfaces of the adhesive film pressing plate and the plate surface of the carrier tape pressing plate are close to the conveying plane, the lower clamping round rod is positioned between the adhesive film pressing plate and the carrier tape pressing plate, and the distance between the initial end of the adhesive film pressing plate and the tail end of the carrier tape pressing plate is smaller than the diameter of the lower clamping round rod;
the right-angle bracket comprises a first support and a second support, the second support is in sliding connection with the transport plane, the sliding direction of the second support is perpendicular to the transport plane, bolt through holes are formed in the first support, the fixing bolts are fixed on two sides of the transport plane through the bolt through holes, the buffer springs are sleeved on screw rods of the fixing bolts, and two ends of the buffer springs are fixedly connected with screw caps of the fixing bolts and the surfaces of the first support respectively;
the glue film heat sealing mechanism comprises a lifting mechanism and heating plates, wherein the heating plates are respectively arranged on two sides of the conveying plane, the plate surfaces of the heating plates are attached to the side edges of the conveying plane, and the lifting mechanism is respectively used for controlling the lifting height of the heating plates.
2. The semiconductor device film sealing and winding all-in-one machine according to claim 1, wherein the adhesive film guiding mechanism further comprises limiting plates, the limiting plates are respectively arranged on two sides of the conveying plane, the upper clamping round rod and the lower clamping round rod are both rotatably connected with the limiting plates, the limiting plates comprise guiding plate surfaces, the guiding plate surfaces are perpendicular to the conveying plane, and the guiding plate surfaces are located on one side close to the conveying plane.
3. The semiconductor device film sealing and rolling integrated machine according to claim 1, further comprising a width adjusting clamping plate, wherein the width adjusting clamping plate comprises a width fixing plate and a width adjusting plate, the width fixing plate and the width adjusting plate are respectively arranged on two sides of the conveying plane, the plate surfaces of the width fixing plate and the width adjusting plate are attached to the side edges of the conveying plane, the width fixing plate is fixedly connected with the conveying plane, the width adjusting plate is slidably connected with the conveying plane, and the moving direction of the width adjusting plate is parallel to the conveying plane and perpendicular to the plate surface of the width fixing plate.
4. The semiconductor device film sealing and rolling integrated machine according to claim 3, further comprising a fixed frame, wherein the fixed frame comprises a fixed flat plate, a cross arm and a portal frame, the fixed flat plate is located between the cross arm and the portal frame, the cross arm is fixed on the fixed flat plate through a connecting straight plate, the portal frame is fixed on the lower surface of the fixed flat plate, the width adjusting clamping plate is fixed on the fixed flat plate, the film reel is rotationally connected with the cross arm, and the rolling reel is rotationally connected with the portal frame.
5. The semiconductor device film sealing and winding all-in-one machine according to claim 4, wherein the fixed frame is provided with a guide round rod and an adjusting rocker, the guide round rod is respectively fixed on the cross arm and the connecting straight plate, the adjusting rocker is positioned between the guide round rods, the adjusting rocker comprises a rocker support plate, an adjusting round rod and a limiting column, the adjusting round rod and the limiting column are respectively arranged on two plate surfaces of the rocker support plate, one end of the rocker support plate is hinged with the cross arm, the other end of the rocker support plate is fixedly connected with the adjusting round rod, the cross arm is provided with a rocker arc hole, the rocker arc hole is matched with the limiting column, and the rocker arc hole is used for controlling the rotation angle of the rocker support plate.
6. The semiconductor device film sealing and winding all-in-one machine according to claim 4, wherein the number of winding reels is at least 2, the winding reels are uniformly arranged on the portal frame, the circle centers of the winding reels are provided with rotating motors, the circle centers of the winding reels are fixedly connected with the rotating ends of the rotating motors, and the rotating speed of the winding reels is consistent with the moving speed of the carrier tape on the transport plane.
7. The semiconductor device film sealing and winding integrated machine according to claim 1, further comprising a rotating pin wheel and a conveying motor, wherein the rotating pin wheel is arranged at the tail end of the conveying plane, the rotating end of the conveying motor is fixedly connected with the rotating pin wheel, and the rotating pin wheel is used for controlling the moving distance of the carrier tape.
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| CN202310959668.8A CN116654384B (en) | 2023-07-31 | 2023-07-31 | Semiconductor device seals membrane rolling all-in-one |
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| CN202310959668.8A CN116654384B (en) | 2023-07-31 | 2023-07-31 | Semiconductor device seals membrane rolling all-in-one |
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| CN116654384B true CN116654384B (en) | 2023-11-03 |
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| JP2019214409A (en) * | 2018-06-13 | 2019-12-19 | 上野精機株式会社 | Part enclosing device |
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| CN116654384A (en) | 2023-08-29 |
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