CN116653211A - Model injection molding device for manufacturing electronic components - Google Patents
Model injection molding device for manufacturing electronic components Download PDFInfo
- Publication number
- CN116653211A CN116653211A CN202310382575.3A CN202310382575A CN116653211A CN 116653211 A CN116653211 A CN 116653211A CN 202310382575 A CN202310382575 A CN 202310382575A CN 116653211 A CN116653211 A CN 116653211A
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- China
- Prior art keywords
- fixed
- injection molding
- plate
- electronic components
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001746 injection moulding Methods 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000005485 electric heating Methods 0.000 claims abstract description 31
- 230000000903 blocking effect Effects 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 5
- 244000309464 bull Species 0.000 claims description 10
- 239000002994 raw material Substances 0.000 abstract description 12
- 238000000465 moulding Methods 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1753—Cleaning or purging, e.g. of the injection unit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/74—Heating or cooling of the injection unit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention discloses a model injection molding device for manufacturing electronic components, which comprises a bottom plate, wherein a mold box is fixed at the top of the bottom plate, an electric heating box is arranged above the mold box, the bottom of the electric heating box is communicated with a feed pipe, the bottom end of the feed pipe is connected with an injection molding head, the bottom end of the injection molding head penetrates through the mold box and extends into the mold box, a box door is arranged on one side of the electric heating box, a die holder is fixed at the bottom of the inner wall of the electric heating box, a forming groove is formed in the top of the die holder, a quick blocking blanking mechanism is arranged at the top of the electric heating box, and a liftout component is arranged in the die holder. This model injection molding device for electronic components makes, through the setting of leading to stifled blanking mechanism fast, realized the inside logical stifled of inlet pipe to and scrape the material to the raw materials on the adhesion of inlet pipe inner wall, accelerated the speed of blanking, promoted injection molding efficiency.
Description
Technical Field
The invention relates to the technical field of electronic component manufacturing, in particular to a model injection molding device for electronic component manufacturing.
Background
The electronic component is a component part of an electronic element, an electric small machine and an instrument, is often composed of a plurality of parts and can be commonly used in similar products; some parts of the industry such as electric appliances, radios, meters and the like, such as the general names of sub-devices such as capacitors, transistors, hairsprings, springs and the like, commonly include diodes and the like, and the electronic components are assembled by using a plastic mold after being manufactured so as to be used.
Referring to China patent, a model injection molding device for manufacturing electronic components (publication No. CN109333910B, publication No. 2020-12-25) solves the problems that a plastic product manufacturing process is complex, procedures are numerous, raw materials are required to be melted firstly and then added into an injection molding machine, but the model injection molding device for manufacturing electronic components is provided for solving the problems because an electric heating box lacks a quick blocking blanking mechanism, raw materials are easy to adhere to the inner wall of a feeding pipe of the electric heating box after being melted, blanking is slow and even blocked, in addition, a quick demolding function is lacking in a mold box, a product after injection molding is not easy to take down, and the raw materials are easy to adhere to the inner wall of a mold base after being cooled.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a model injection molding device for manufacturing electronic components, which solves the problems that the raw materials are easy to adhere to the inner wall of a feed pipe of an electric heating box to cause slow blanking and even blockage after being melted due to the lack of a quick blocking blanking mechanism in the electric heating box, and the inner wall of a die holder is easy to adhere after cooling due to the lack of a quick demoulding function in the die box.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a model injection molding device for electronic components makes, includes the bottom plate, the top of bottom plate is fixed with the mould case, the top of mould case is provided with the electric heating case, the bottom intercommunication of electric heating case has the inlet pipe, the bottom of inlet pipe is connected with the head of moulding plastics, the bottom of moulding plastics the head runs through the mould case and extends to the inside of mould case, one side of electric heating case is provided with the chamber door, the bottom of electric heating case inner wall is fixed with the die holder, the shaping groove has been seted up at the top of die holder, the top of electric heating case is provided with quick stifled blanking mechanism, the inside of die holder is provided with the liftout subassembly, the right side of mould case is provided with automatic pushing components; the quick blocking blanking mechanism comprises a fixed plate fixed at the top of an electric heating box, one side of the fixed plate is rotationally connected with a rotary table, one side of the rotary table is fixedly provided with a connecting rod, one side of the fixed plate is fixedly provided with two mounting seats, a movable rod is slidably connected between the inner surfaces of the mounting seats, the center of the movable rod is fixedly provided with the movable plate, one side of the movable plate is penetrated and provided with a sliding groove, one end of the connecting rod penetrates through the sliding groove and extends to the outside of the sliding groove, the outer surface of the connecting rod is slidably connected with the inner surface of the sliding groove, the bottom end of the movable rod is fixedly provided with a blocking block, and the other side of the fixed plate is fixedly provided with a first motor, and the output end of the first motor is fixedly connected with one side of the rotary table.
Preferably, the liftout subassembly is including seting up the inside recess of die holder, the both sides of recess inner wall all are fixed with the riser, two sliding connection has T type seat between the opposite side of riser.
Preferably, the top of T type seat is fixed with the liftout board, the surface of liftout board and the internal surface sliding connection of recess, horizontal groove has been seted up to one side of T type seat.
Preferably, one side of the die holder is rotatably connected with a rotating rod, one end of the rotating rod penetrates through the die box and extends to the outside of the die box, the outer surface of the rotating rod is rotatably connected with the inner surface of the die box, and one end of the rotating rod is fixedly provided with a rotating handle.
Preferably, the other end of bull stick runs through the die holder and extends to the inside of recess, the other end of bull stick is fixed with the revolving board, one side of revolving board is fixed with the horizontal pole, the one end of horizontal pole runs through the transverse groove and extends to the inside of transverse groove, the surface and the internal surface sliding connection of transverse groove of horizontal pole.
Preferably, the automatic pushing assembly comprises a mounting plate fixed on one side of the die box, the bottom of the mounting plate is rotationally connected with a movable rod, and the top of the mounting plate is fixed with a second motor.
Preferably, the output end of the second motor is fixed with the top end of the movable rod through a coupler, a gear is fixed on the outer surface of the movable rod, a slide rod is connected to one side of the mold box in a sliding mode, and a rack is fixed at one end of the slide rod.
Preferably, the teeth of the rack are meshed with the teeth of the gear, the other end of the sliding rod is fixedly provided with a push plate, and the bottom of the push plate is in sliding connection with the top of the die holder.
Advantageous effects
The invention provides a model injection molding device for manufacturing electronic components. Compared with the prior art, the method has the following beneficial effects:
(1) This model injection molding device for electronic components makes through the setting of leading to stifled blanking mechanism fast, has realized the inside logical stifled of inlet pipe to and scrape the material to the raw materials on the adhesion of inlet pipe inner wall for the speed of blanking has promoted injection molding efficiency.
(2) The mold injection molding device for manufacturing the electronic component realizes quick jacking of a product through the arrangement of the jacking component, avoids adhesion between the product after injection molding and cooling and the inner wall of the mold base, and further reduces the difficulty of demolding of the product.
(3) This model injection molding device for electronic components makes through the setting of automatic pushing component, cooperatees with the liftout subassembly, has realized taking out the drawing of patterns fast to the product after the jack-up, has promoted production efficiency by a wide margin.
Drawings
FIG. 1 is a perspective view of an external structure of the present invention;
FIG. 2 is a side view of the external structure of the present invention;
FIG. 3 is a perspective view of the quick plugging blanking mechanism of the present invention;
FIG. 4 is a partial structural perspective view of the present invention;
FIG. 5 is a cross-sectional view of a die holder of the present invention;
FIG. 6 is an enlarged view of a portion of FIG. 5A in accordance with the present invention;
fig. 7 is a perspective view of the automatic pushing assembly of the present invention.
In the figure: 1. a bottom plate; 2. a mold box; 3. an electric heating box; 4. a feed pipe; 5. an injection molding head; 6. a door; 7. a die holder; 8. a forming groove; 9. a quick blocking and blanking mechanism; 10. a material ejection assembly; 11. an automatic pushing component; 91. a fixing plate; 92. a turntable; 93. a connecting rod; 94. a mounting base; 95. a moving rod; 96. a moving plate; 97. a chute; 98. a blocking block is communicated; 99. a first motor; 101. a groove; 102. a riser; 103. a T-shaped seat; 104. a liftout plate; 105. a transverse groove; 106. a rotating rod; 107. rotating the handle; 108. a rotating plate; 109. a cross bar; 111. a mounting plate; 112. a movable rod; 113. a second motor; 114. a gear; 115. a slide bar; 116. a rack; 117. a push plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment of the invention provides two technical schemes, which specifically comprise the following embodiments:
example 1
Referring to fig. 1-3, a model injection molding device for manufacturing electronic components comprises a bottom plate 1, a mold box 2 is fixed at the top of the bottom plate 1, an electric heating box 3 is arranged above the mold box 2, an electric heating wire is arranged inside the electric heating box 3 and can heat and melt raw materials, the electric heating wire is controlled by an external switch and is electrically connected with an external power supply, a feed pipe 4 is communicated with the bottom of the electric heating box 3, an injection molding head 5 is connected at the bottom end of the feed pipe 4, the injection molding head 5 can spray melted raw materials into a molding groove 8 of a mold seat 7 and is controlled by the external switch and is electrically connected with the external power supply, the bottom end of the injection molding head 5 penetrates through the mold box 2 and extends to the inside of the mold box 2, a box door 6 is arranged at one side of the electric heating box 3, a mold seat 7 is fixed at the bottom of the inner wall of the electric heating box 3, a molding groove 8 is formed at the top of the mold seat 7, the raw materials are cooled and molded in the molding groove 8, a quick-through blanking mechanism 9 is arranged at the top of the electric heating box 3, a jacking component 10 is arranged inside the mold seat 7, and an automatic pushing component 11 is arranged at the right side of the mold box 2;
the quick blanking mechanism 9 comprises a fixed plate 91 fixed at the top of the electric heating box 3, one side of the fixed plate 91 is rotationally connected with a rotary table 92, one side of the rotary table 92 is fixedly provided with a connecting rod 93, one side of the fixed plate 91 is fixedly provided with two mounting seats 94, a movable rod 95 is slidably connected between the inner surfaces of the two mounting seats 94, the center of the movable rod 95 is fixedly provided with a movable plate 96, one side of the movable plate 96 is penetrated and provided with a sliding groove 97, one end of the connecting rod 93 penetrates and extends to the outside of the sliding groove 97, the outer surface of the connecting rod 93 is slidably connected with the inner surface of the sliding groove 97, the bottom end of the movable rod 95 is fixedly provided with a blocking block 98, the blocking block 98 can block and scrape the inner wall of the feeding pipe 4, the other side of the fixed plate 91 is fixedly provided with a first motor 99, the first motor 99 is controlled by an external switch and is electrically connected with one side of the rotary table 92, the inside blocking of the feeding pipe 4 is realized through the setting of the quick blanking mechanism 9, the blanking mechanism 4 is blocked, the blanking is accelerated, and the injection molding efficiency is improved.
Example 2
Based on example 1, see FIGS. 4-7
The ejector assembly 10 comprises a groove 101 formed in the die holder 7, vertical plates 102 are fixed on two sides of the inner wall of the groove 101, and T-shaped seats 103 are connected between the opposite sides of the two vertical plates 102 in a sliding mode.
The top of T type seat 103 is fixed with liftout plate 104, and liftout plate 104 when upwards moving can jack up the product after the shaping, and the surface sliding connection of liftout plate 104 and the internal surface of recess 101, horizontal groove 105 has been seted up to one side of T type seat 103.
One side of the die holder 7 is rotatably connected with a rotating rod 106, one end of the rotating rod 106 penetrates through the die box 2 and extends to the outside of the die box 2, the outer surface of the rotating rod 106 is rotatably connected with the inner surface of the die box 2, and one end of the rotating rod 106 is fixedly provided with a rotating handle 107.
The other end of bull stick 106 runs through die holder 7 and extends to the inside of recess 101, and the other end of bull stick 106 is fixed with the revolving plate 108, and one side of revolving plate 108 is fixed with horizontal pole 109, and horizontal groove 105 is run through to the one end of horizontal pole 109 and extend to the inside of horizontal groove 105, and the surface of horizontal pole 109 and the interior surface sliding connection of horizontal groove 105 have realized the quick jack-up to the product through the setting of liftout subassembly 10, have avoided the product to mould plastics the cooling back and have taken place the adhesion with the inner wall of die holder 7, have further reduced the degree of difficulty of product drawing of patterns.
The automatic pushing assembly 11 comprises a mounting plate 111 fixed on one side of the die box 2, a movable rod 112 is rotatably connected to the bottom of the mounting plate 111, a second motor 113 is fixed to the top of the mounting plate 111, the second motor 113 is a three-phase asynchronous motor, can rotate positively and negatively, is controlled by an external switch, and is electrically connected with an external power supply.
The output end of the second motor 113 is fixed with the top end of the movable rod 112 through a coupler, a gear 114 is fixed on the outer surface of the movable rod 112, a slide rod 115 is connected to one side of the mold box 2 in a sliding manner, and a rack 116 is fixed at one end of the slide rod 115.
The tooth of rack 116 meshes with the tooth of gear 114, and the other end of slide bar 115 is fixed with push pedal 117, and push pedal 117 can push away the product of jack-up, realizes the product drawing of patterns, and the bottom of push pedal 117 and the top sliding connection of die holder 7 are through the setting of automatic pushing component 11, cooperatees with liftout subassembly 10, has realized taking out the drawing of patterns fast to the product after the jack-up, has promoted production efficiency by a wide margin.
And all that is not described in detail in this specification is well known to those skilled in the art.
During operation, firstly, raw materials are poured into the electric heating box 3, heating wires in the electric heating box 3 are further started to heat and melt the raw materials, the first motor 99 is further started, the first motor 99 drives the rotary table 92 to rotate, meanwhile, the rotary table 92 drives the connecting rod 93 to rotate circumferentially, meanwhile, the connecting rod 93 slides back and forth along the inner surface of the sliding groove 97, meanwhile, the connecting rod 93 drives the moving plate 96 and the moving rod 95 to reciprocate up and down, meanwhile, the moving rod 95 drives the blocking block 98 to reciprocate up and down, accordingly, the inner wall of the feeding pipe 4 is blocked and scraped by the blocking block 98, the melted raw materials fall into the forming groove 8 of the die holder 7 through the injection head 5 to be cooled and formed, the rotary table 107 is rotated by one hundred eighty degrees, the rotary handle 107 drives the rotary table 106 to rotate, meanwhile, the rotary table 106 drives the rotary table 108 to rotate, meanwhile, the rotary table 108 drives the cross rod 109 to rotate, meanwhile, the cross rod 109 slides left and right along the inner surface of the transverse groove 105, meanwhile, the cross rod 109 drives the T-shaped seat 103 to reciprocate up along the inner surface of the two vertical plates 102, meanwhile, the T-shaped seat 103 drives the blocking plate 104 to reciprocate up, finally, the blocking plate 103 drives the blocking plate 103 to flow up and finally, the injection head 5 falls into the forming groove 8 through the forming groove 8 to be cooled and finally, the sliding rod 114 is driven by the second push plate 114 to rotate, the second push plate 113 is driven to rotate, and the inner side of the sliding rod 114 is driven by the sliding rod 114 to rotate, and finally, and the push rod 114 is driven to rotate and the push rod 112 to move up and the lifting plate 112.
The foregoing detailed description of the embodiments of the invention has been provided for the purpose of illustrating the preferred embodiments of the invention and is not to be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (8)
1. The utility model provides a model injection molding device for electronic components makes, includes bottom plate (1), the top of bottom plate (1) is fixed with mould case (2), the top of mould case (2) is provided with electric heat case (3), the bottom intercommunication of electric heat case (3) has inlet pipe (4), the bottom of inlet pipe (4) is connected with injection molding head (5), the bottom of injection molding head (5) runs through mould case (2) and extends to the inside of mould case (2), its characterized in that: a box door (6) is arranged on one side of the electric heating box (3), a die holder (7) is fixed at the bottom of the inner wall of the electric heating box (3), a forming groove (8) is formed in the top of the die holder (7), a quick blocking and blanking mechanism (9) is arranged at the top of the electric heating box (3), a material ejection assembly (10) is arranged in the die holder (7), and an automatic material pushing assembly (11) is arranged on the right side of the die box (2);
the utility model provides a quick stifled fixed plate (91) at electric heating case (3) top of leading to is included in blanking mechanism (9), one side rotation of fixed plate (91) is connected with carousel (92), one side of carousel (92) is fixed with connecting rod (93), one side of fixed plate (91) is fixed with two mount pads (94), two sliding connection has movable rod (95) between the internal surface of mount pad (94), the central authorities of movable rod (95) are fixed with movable plate (96), spout (97) have been seted up in running through of one side of movable plate (96), the one end of connecting rod (93) runs through spout (97) and extends to the outside of spout (97), the surface of connecting rod (93) and the internal surface sliding connection of spout (97), the bottom of movable rod (95) is fixed with and leads to the blocking up piece (98), the opposite side of fixed with first motor (99) of fixed plate (91), the output of first motor (99) is fixed with one side of carousel (92).
2. The mold injection molding apparatus for manufacturing electronic components according to claim 1, wherein: the ejector assembly (10) comprises grooves (101) formed in the die holder (7), vertical plates (102) are fixed on two sides of the inner wall of each groove (101), and T-shaped bases (103) are connected between the opposite sides of the two vertical plates (102) in a sliding mode.
3. The mold injection molding apparatus for manufacturing electronic components according to claim 2, wherein: the top of T type seat (103) is fixed with liftout plate (104), the surface of liftout plate (104) and the internal surface sliding connection of recess (101), horizontal groove (105) have been seted up to one side of T type seat (103).
4. The mold injection molding apparatus for manufacturing electronic components according to claim 1, wherein: one side of die holder (7) rotates and is connected with bull stick (106), the one end of bull stick (106) runs through mould case (2) and extends to the outside of mould case (2), the surface of bull stick (106) rotates with the internal surface of mould case (2) to be connected, the one end of bull stick (106) is fixed with rotation handle (107).
5. The mold injection molding apparatus for manufacturing electronic components according to claim 4, wherein: the other end of bull stick (106) runs through die holder (7) and extends to the inside of recess (101), the other end of bull stick (106) is fixed with swivel plate (108), one side of swivel plate (108) is fixed with horizontal pole (109), the one end of horizontal pole (109) runs through horizontal groove (105) and extends to the inside of horizontal groove (105), the surface of horizontal pole (109) and the interior surface sliding connection of horizontal groove (105).
6. The mold injection molding apparatus for manufacturing electronic components according to claim 1, wherein: the automatic pushing assembly (11) comprises a mounting plate (111) fixed on one side of the die box (2), a movable rod (112) is rotatably connected to the bottom of the mounting plate (111), and a second motor (113) is fixed to the top of the mounting plate (111).
7. The mold injection molding apparatus for manufacturing electronic components according to claim 6, wherein: the output end of the second motor (113) is fixed with the top end of the movable rod (112) through a coupler, a gear (114) is fixed on the outer surface of the movable rod (112), a slide rod (115) is connected to one side of the mold box (2) in a sliding mode, and a rack (116) is fixed at one end of the slide rod (115).
8. The mold injection molding apparatus for manufacturing electronic components according to claim 7, wherein: the teeth of the rack (116) are meshed with the teeth of the gear (114), a push plate (117) is fixed at the other end of the slide rod (115), and the bottom of the push plate (117) is in sliding connection with the top of the die holder (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310382575.3A CN116653211A (en) | 2023-04-12 | 2023-04-12 | Model injection molding device for manufacturing electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310382575.3A CN116653211A (en) | 2023-04-12 | 2023-04-12 | Model injection molding device for manufacturing electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116653211A true CN116653211A (en) | 2023-08-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310382575.3A Pending CN116653211A (en) | 2023-04-12 | 2023-04-12 | Model injection molding device for manufacturing electronic components |
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| CN (1) | CN116653211A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117238820A (en) * | 2023-09-19 | 2023-12-15 | 南京江智科技有限公司 | Semiconductor packaging structure and packaging method thereof |
-
2023
- 2023-04-12 CN CN202310382575.3A patent/CN116653211A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117238820A (en) * | 2023-09-19 | 2023-12-15 | 南京江智科技有限公司 | Semiconductor packaging structure and packaging method thereof |
| CN117238820B (en) * | 2023-09-19 | 2024-03-08 | 南京江智科技有限公司 | Semiconductor packaging structure and packaging method thereof |
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