CN116652815A - Single-side grinding method and double-side grinding method for fragile workpiece - Google Patents

Single-side grinding method and double-side grinding method for fragile workpiece Download PDF

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Publication number
CN116652815A
CN116652815A CN202310664796.XA CN202310664796A CN116652815A CN 116652815 A CN116652815 A CN 116652815A CN 202310664796 A CN202310664796 A CN 202310664796A CN 116652815 A CN116652815 A CN 116652815A
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CN
China
Prior art keywords
fragile workpiece
fragile
workpiece
sacrificial
sided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310664796.XA
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Chinese (zh)
Inventor
王永成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Leading Semiconductor Technology Development Co ltd
Original Assignee
Shanghai Leading Semiconductor Technology Development Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Leading Semiconductor Technology Development Co ltd filed Critical Shanghai Leading Semiconductor Technology Development Co ltd
Priority to CN202310664796.XA priority Critical patent/CN116652815A/en
Publication of CN116652815A publication Critical patent/CN116652815A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Abstract

The invention discloses a single-sided grinding method and a double-sided grinding method for fragile workpieces, which relate to the technical field of grinding processes and comprise the following steps: the method comprises the steps of respectively fixing a sacrificial piece and a fragile workpiece on a carrying disc of a single-sided grinder, enabling the material of the sacrificial piece to be the same as that of the fragile workpiece, enabling the thickness of the sacrificial piece to be larger than that of the fragile workpiece, and then grinding the fragile workpiece; the double-sided grinding method comprises the following steps: the sacrificial piece and the fragile workpiece are respectively placed on the star wheel of the double-sided grinder, the material of the sacrificial piece is the same as that of the fragile workpiece, the top end of the sacrificial piece is higher than that of the fragile workpiece, and then the fragile workpiece is ground. The single-side grinding method and the double-side grinding method of the fragile workpiece prevent ceramic pieces and semiconductor wafers from being broken in grinding processing.

Description

Single-side grinding method and double-side grinding method for fragile workpiece
Technical Field
The invention relates to the technical field of grinding processes, in particular to a single-sided grinding method and a double-sided grinding method for fragile workpieces.
Background
When some fragile ceramic pieces or semiconductor wafers are subjected to grinding, high points of the workpieces are firstly contacted with a grinding disc, and the wafers are easily broken by impact at the moment of contact; meanwhile, the high points of the workpiece participate in grinding processing first, so that all processing pressure is concentrated on the high points, and fragments are easily caused.
Disclosure of Invention
The invention aims to provide a single-side grinding method and a double-side grinding method for fragile workpieces, which are used for solving the problems of the prior art and avoiding the breakage of ceramic parts and semiconductor wafers in grinding processing.
In order to achieve the above object, the present invention provides the following solutions:
the invention provides a single-sided grinding method of a fragile workpiece, which comprises the following steps:
(1) Preparing at least one sacrificial member which is made of the same material as the fragile workpiece to be ground, and enabling the thickness of each sacrificial member to be larger than that of the fragile workpiece;
(2) The sacrificial piece and the fragile workpiece are respectively fixed on a carrier plate of a single-sided grinder, and one end, far away from the carrier plate, of the sacrificial piece is ensured to be far away from the carrier plate compared with one end, far away from the carrier plate, of the fragile workpiece;
(3) The fragile workpiece is ground by the single-sided grinder, and a grinding disc of the single-sided grinder is firstly contacted with the sacrificial member and then contacted with the fragile workpiece.
Preferably, when the number of the sacrificial members is at least two, in the step (2), all the sacrificial members are uniformly arranged around the fragile workpiece in the circumferential direction.
Preferably, the sacrificial member is cylindrical.
Preferably, the fragile workpiece is a semiconductor wafer, a glass piece, or a ceramic piece.
The invention also provides a double-sided grinding method of the fragile workpiece, which comprises the following steps:
(1) Preparing at least one sacrificial member which is made of the same material as the fragile workpiece to be ground, and enabling the thickness of each sacrificial member to be larger than that of the fragile workpiece; arranging a placement hole on a planetary wheel of the double-sided grinder corresponding to the sacrificial member;
(2) The sacrificial piece passes through the placing hole, the fragile workpiece passes through the workpiece hole of the planetary wheel, and the bottom end of the sacrificial piece and the bottom end of the fragile workpiece are respectively contacted with the top surface of the lower grinding disc of the double-sided grinder; and ensuring that the top end of each sacrificial member is higher than the top end of the frangible workpiece;
(3) And grinding the fragile workpiece through the double-sided grinder, wherein an upper grinding disc of the double-sided grinder is firstly contacted with the sacrificial piece and then contacted with the fragile workpiece.
Preferably, when the number of the sacrificial members is at least two, in the step (2), all the sacrificial members are uniformly arranged around the fragile workpiece in the circumferential direction.
Preferably, the sacrificial member is cylindrical.
Preferably, the fragile workpiece is a semiconductor wafer, a glass piece, or a ceramic piece.
Compared with the prior art, the invention has the following technical effects:
the single-side grinding method and the double-side grinding method of the fragile workpiece prevent ceramic pieces and semiconductor wafers from being broken in grinding processing.
Furthermore, the single-sided grinding method and the double-sided grinding method of the fragile workpiece share the stress between the fragile workpiece and the grinding disc through the sacrificial piece in the grinding process, so that the phenomenon that the fragile workpiece is broken due to stress concentration when the high point of the fragile workpiece is contacted with the grinding disc is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic illustration of a single-sided lapping process for fragile workpieces of the present invention;
FIG. 2 is a schematic illustration of a single-sided lapping process for fragile workpieces according to the present invention;
FIG. 3 is a schematic illustration of a single-sided lapping process of a fragile workpiece of the present invention;
FIG. 4 is a schematic illustration of a single-sided lapping process of a fragile workpiece of the present invention;
FIG. 4 is a schematic illustration of a single-sided lapping process of a fragile workpiece of the present invention;
FIG. 5 is a schematic illustration of a method of double-sided lapping of a fragile workpiece according to the present invention;
FIG. 6 is a schematic illustration of a method of double-sided lapping of a fragile workpiece according to the present invention;
FIG. 7 is a schematic illustration of a method of double-sided lapping of fragile workpieces according to the present invention;
1, a carrying disc; 2. a frangible workpiece; 3. a sacrificial member; 4. a grinding disc; 5. a grinding disc is arranged; 6. a star wheel; 7. and (3) a lower grinding disc.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention aims to provide a single-side grinding method and a double-side grinding method for fragile workpieces, which are used for solving the problems of the prior art and avoiding the breakage of ceramic parts and semiconductor wafers in grinding processing.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
Example 1
As shown in fig. 1 to 4, the present embodiment provides a single-sided polishing method for a fragile workpiece, wherein the fragile workpiece 1 is a semiconductor wafer, a glass piece or a ceramic piece; the method comprises the following steps:
(1) Preparing 8 sacrificial members 3 which are made of the same material as the fragile workpiece 1 to be ground, and enabling the thickness of each sacrificial member 3 to be larger than the thickness of the fragile workpiece 1; in this embodiment, the sacrificial member 3 is cylindrical.
(2) Fixing the sacrifice piece 3 and the fragile workpiece 1 on the carrier plate 1 of the single-sided grinder respectively, and ensuring that one end of the sacrifice piece 3, which is far away from the carrier plate 1, is far away from the carrier plate 1 than one end of the fragile workpiece 1, which is far away from the carrier plate 1, as shown in fig. 1 and 2; the single-sided grinder is the existing mature equipment, and the working principle and structure of the single-sided grinder are not repeated in the embodiment;
all the sacrificial members 3 are circumferentially uniformly arranged around the fragile workpiece 1 as shown in fig. 4.
(3) The fragile workpiece 1 is polished by a single-sided polisher, and the polishing pad 4 of the single-sided polisher is first brought into contact with the sacrificial member 3 and then with the fragile workpiece 1.
Since the grinding disk 4 of the single-sided grinder is in contact with the highest point of the fragile workpiece 1 and is also in contact with the 8 sacrificial members 3, compared with the prior art in which the sacrificial members 3 are not provided, the stress when the high point of the fragile workpiece 1 is in contact with the grinding disk 4 is dispersed by the 8 sacrificial members 3, thereby avoiding the occurrence of the phenomenon that the fragile workpiece 1 is broken due to stress concentration when the high point of the fragile workpiece 1 is in contact with the grinding disk 4.
The specific number and shape of the sacrificial members 3 may be adaptively adjusted as required, and are not limited to the above-described embodiments.
Example two
As shown in fig. 5-7, the present embodiment also provides a double-sided grinding method for a fragile workpiece, wherein the fragile workpiece 1 is a semiconductor wafer, a glass piece or a ceramic piece; the method comprises the following steps:
(1) Preparing 8 sacrificial members 3 which are made of the same material as the fragile workpiece 1 to be ground, and enabling the thickness of each sacrificial member 3 to be larger than the thickness of the fragile workpiece 1; arranging a placement hole corresponding to the sacrificial member 3 on the planetary wheel 6 of the double-sided grinder; in this embodiment, the sacrificial member 3 is cylindrical. The double-sided grinder is the existing mature equipment, and the working principle and structure of the double-sided grinder are not repeated in the embodiment;
(2) The sacrificial member 3 passes through the placing hole, the fragile workpiece 1 passes through the workpiece hole of the planetary wheel 6, and the bottom end of the sacrificial member 3 and the bottom end of the fragile workpiece 1 are respectively contacted with the top surface of the lower grinding disc 7 of the double-sided grinder; and ensures that the tip of each sacrificial member 3 is higher than the tip of the frangible workpiece 1, as shown in fig. 5;
all the sacrifice pieces 3 are uniformly arranged circumferentially around the fragile work piece 1 as shown in fig. 7.
(3) The fragile workpiece 1 is polished by a double-sided grinder, and the upper polishing pad 5 of the double-sided grinder is first brought into contact with the sacrificial member 3 and then into contact with the fragile workpiece 1.
Since the upper grinding disk 5 and the lower grinding disk 7 of the double-sided grinder are in contact with the fragile workpiece 1 and are also in contact with the 8 sacrificial members 3, compared with the prior art in which the sacrificial members 3 are not provided, the stress when the high points of the fragile workpiece 1 are in contact with the grinding disk 4 is dispersed by the 8 sacrificial members 3, thereby avoiding the occurrence of the phenomenon that the fragile workpiece 1 is broken due to stress concentration when the high points of the fragile workpiece 1 are in contact with the grinding disk 4.
The specific number and shape of the sacrificial members 3 may be adaptively adjusted as required, and are not limited to the above-described embodiments.
In the description of the present invention, it should be noted that the azimuth or positional relationship indicated by the terms "top", "bottom", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention.
The principles and embodiments of the present invention have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present invention; also, it is within the scope of the present invention to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the invention.

Claims (8)

1. A method for single-sided grinding of a fragile workpiece, comprising the steps of:
(1) Preparing at least one sacrificial member which is made of the same material as the fragile workpiece to be ground, and enabling the thickness of each sacrificial member to be larger than that of the fragile workpiece;
(2) The sacrificial piece and the fragile workpiece are respectively fixed on a carrier plate of a single-sided grinder, and one end, far away from the carrier plate, of the sacrificial piece is ensured to be far away from the carrier plate compared with one end, far away from the carrier plate, of the fragile workpiece;
(3) The fragile workpiece is ground by the single-sided grinder, and a grinding disc of the single-sided grinder is firstly contacted with the sacrificial member and then contacted with the fragile workpiece.
2. The single-sided lapping method of a fragile workpiece according to claim 1, wherein: and (2) when the number of the sacrificial pieces is at least two, enabling all the sacrificial pieces to be uniformly arranged around the fragile workpiece in the circumferential direction in the step (2).
3. The single-sided lapping method of a fragile workpiece according to claim 1, wherein: the sacrificial member is cylindrical.
4. The single-sided lapping method of a fragile workpiece according to claim 1, wherein: the fragile workpiece is a semiconductor wafer, a glass piece or a ceramic piece.
5. A method for double-sided grinding of a fragile workpiece, comprising the steps of:
(1) Preparing at least one sacrificial member which is made of the same material as the fragile workpiece to be ground, and enabling the thickness of each sacrificial member to be larger than that of the fragile workpiece; arranging a placement hole on a planetary wheel of the double-sided grinder corresponding to the sacrificial member;
(2) The sacrificial piece passes through the placing hole, the fragile workpiece passes through the workpiece hole of the planetary wheel, and the bottom end of the sacrificial piece and the bottom end of the fragile workpiece are respectively contacted with the top surface of the lower grinding disc of the double-sided grinder; and ensuring that the top end of each sacrificial member is higher than the top end of the frangible workpiece;
(3) And grinding the fragile workpiece through the double-sided grinder, wherein an upper grinding disc of the double-sided grinder is firstly contacted with the sacrificial piece and then contacted with the fragile workpiece.
6. The method for double-sided lapping of a fragile workpiece according to claim 5, wherein: and (2) when the number of the sacrificial pieces is at least two, enabling all the sacrificial pieces to be uniformly arranged around the fragile workpiece in the circumferential direction in the step (2).
7. The method for double-sided lapping of a fragile workpiece according to claim 5, wherein: the sacrificial member is cylindrical.
8. The method for double-sided lapping of a fragile workpiece according to claim 5, wherein: the fragile workpiece is a semiconductor wafer, a glass piece or a ceramic piece.
CN202310664796.XA 2023-06-07 2023-06-07 Single-side grinding method and double-side grinding method for fragile workpiece Pending CN116652815A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310664796.XA CN116652815A (en) 2023-06-07 2023-06-07 Single-side grinding method and double-side grinding method for fragile workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310664796.XA CN116652815A (en) 2023-06-07 2023-06-07 Single-side grinding method and double-side grinding method for fragile workpiece

Publications (1)

Publication Number Publication Date
CN116652815A true CN116652815A (en) 2023-08-29

Family

ID=87718715

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310664796.XA Pending CN116652815A (en) 2023-06-07 2023-06-07 Single-side grinding method and double-side grinding method for fragile workpiece

Country Status (1)

Country Link
CN (1) CN116652815A (en)

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