CN116648594A - Heat conduction member and heat exchange device - Google Patents
Heat conduction member and heat exchange device Download PDFInfo
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- CN116648594A CN116648594A CN202280007801.3A CN202280007801A CN116648594A CN 116648594 A CN116648594 A CN 116648594A CN 202280007801 A CN202280007801 A CN 202280007801A CN 116648594 A CN116648594 A CN 116648594A
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- Prior art keywords
- plate portion
- heat
- conductive member
- plate
- heat conductive
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
Abstract
The first plate portion and the second plate portion of the heat conductive member are disposed to face each other in the first direction. The first plate portion of the first plate portion expands in a second direction perpendicular to the first direction. The second plate portion of the second plate portion extends in the second direction and is disposed closer to one of the first directions than the first plate portion. The internal space for accommodating the working medium is a space between the first plate portion and the second plate portion. In the first direction, the thickness of the first plate portion is thicker than the thickness of the second plate portion. A radiator is disposed on one end face of the second plate portion facing the first direction.
Description
Technical Field
The present invention relates to a heat conduction member and a heat exchange device.
Background
Conventionally, as a heat conduction member that radiates heat from a heat source, a vapor chamber is known. In the soaking plate, a cavity portion in which a working fluid is enclosed is formed by overlapping two plate-like bodies that face each other. When the heat generating body is thermally connected to the soaking plate, the working fluid changes to a gas phase. The vapor-phase working fluid moves to the heat sink portion to release latent heat and changes to the liquid-phase working fluid. ( For example, refer to japanese laid-open publication: japanese patent laid-open No. 2019-82264 )
Prior art literature
Patent literature
Patent document 1: japanese laid-open publication: japanese patent laid-open No. 2019-82264
Disclosure of Invention
Problems to be solved by the invention
However, when one of the two opposing plate-like bodies has a smaller thickness than the other, the other plate-like body is difficult to maintain in shape when the internal pressure of the hollow portion becomes high. Therefore, an improvement in the rigidity of the housing is desired.
The invention aims to improve the rigidity of a housing.
Means for solving the problems
An exemplary heat conductive member of the present invention includes a case, a working medium, and a heat sink. The housing has a first plate portion, a second plate portion, and an interior space. The first plate portion and the second plate portion are disposed to face each other in a first direction. The working medium is accommodated in the internal space. The first plate portion has a first plate portion and a side portion. The first plate portion expands in a second direction perpendicular to the first direction. The side surface portion extends from an end portion of the first plate portion in the second direction toward the second plate portion. The second plate portion has a second plate portion. The second plate portion extends in the second direction and is disposed closer to one of the first directions than the first plate portion. The internal space is a space between the first plate portion and the second plate portion in the first direction. The thickness of the first plate portion in the first direction is thicker than the thickness of the second plate portion in the first direction. The heat sink is disposed on one end surface of the second plate portion facing the first direction.
An exemplary heat exchange device of the present invention is provided with the above-described heat conductive member and a cooling device that cools the heat conductive member. The cooling device has a case. The case is disposed on one end surface of the second plate portion facing the first direction, and covers the radiator. The case has an inflow port into which the refrigerant flows and an outflow port from which the refrigerant flows.
Effects of the invention
According to the exemplary heat conductive member and the heat exchange device of the present invention, the rigidity of the case can be improved.
Drawings
Fig. 1 is a sectional view of the heat exchange device as seen from the Y direction.
Fig. 2 is a cross-sectional view of the heat exchange device as seen from the X direction.
Fig. 3 is a plan view of the heat conductive member as seen from the Z direction.
Fig. 4 is an enlarged cross-sectional view of the vicinity of the joint portion of the heat conductive member.
Detailed Description
Hereinafter, exemplary embodiments are described with reference to the drawings.
In the present specification, the direction in which the first plate portion 11 and the second plate portion 12 of the heat conductive member 100 face each other is referred to as "Z direction", and a symbol Z is denoted in the drawing. In the Z direction, the direction from the first plate portion 11 to the second plate portion 12 is referred to as "one Z direction Za", and the direction from the second plate portion 12 to the first plate portion 11 is referred to as "the other Z direction Zb". In the drawing, one direction perpendicular to the Z direction is referred to as "X direction", and a symbol X is denoted. The direction perpendicular to both the Z direction and the X direction is referred to as "Y direction", and a symbol Y is denoted in the figure. Namely, the Z direction, the X direction and the Y direction are mutually perpendicular.
In the following, the term "parallel" in the positional relationship between any one of the azimuth, the line, and the plane and any other one includes not only a state where the two are completely disjoint regardless of extension, but also a substantially parallel state. In addition, "perpendicular" and "orthogonal" include not only a state in which both intersect each other at 90 degrees, but also a substantially perpendicular state and a substantially orthogonal state, respectively. That is, the terms "parallel", "perpendicular" and "orthogonal" include a state in which the positional relationship of the two is angularly offset to an extent that does not deviate from the gist of the present invention.
< 1 Heat exchange device >)
Fig. 1 is a sectional view of a heat exchange device 500 viewed from the Y direction. Fig. 2 is a cross-sectional view of the heat exchange device 500 viewed from the X direction. Fig. 3 is a plan view of the heat conductive member 100 as viewed from the Z direction. Fig. 4 is an enlarged cross-sectional view of the vicinity of the joint portion 13 of the heat conductive member 100. Fig. 1 shows a cross-sectional structure of the heat exchange device 500 cut by a virtual plane P1 parallel to both the X direction and the Z direction in fig. 3. Fig. 2 shows a cross-sectional structure of the heat exchange device 500 in fig. 3, which is cut by a virtual plane P2 parallel to both the Y direction and the Z direction. Fig. 4 is an enlarged view of a portion P surrounded by a broken line in fig. 1.
The heat exchange device 500 includes the heat conductive member 100 and the cooling device 200 that cools the heat conductive member 100. The heat exchange device 500 is attached to a heat source (not shown) such as a heat generator, and exchanges heat between the heat conduction member 100 that performs heat transfer from the heat source and the fluid f that is a refrigerant flowing inside the cooling device 200. That is, the heat source is cooled by radiating heat to the heat conductive member 100.
1-1. Heat conduction component ]
The heat conduction member 100 is also called a soaking plate, and is attached to a heat source to radiate heat to the cooling device 200. In addition, the heat conduction member 100 can radiate heat to the surrounding atmosphere at a portion not in contact with the cooling device 200 and the heat source. In the present embodiment, the cooling device 200 is connected to the end surface of the heat conductive member 100 facing one Za in the Z direction. The heat source can be in contact with the end surface of the heat conductive member 100 facing the other Zb in the Z direction. For example, the heat source is connected to the heat conductive member 100 via a heat conductive sheet (not shown) so as to be heat-transferable. The heat conductive sheet has high heat conductivity and high heat resistance. For example, a graphite sheet, a composite resin sheet containing a thermally conductive material, or the like can be used as the thermally conductive sheet. Alternatively, a heat dissipation grease containing a thermally conductive material may be used instead of the heat conductive sheet. Alternatively, the heat source may be directly connected to the heat conductive member 100. Examples of the heat source include power transistors of an inverter provided in a traction motor for driving wheels of a vehicle. The power transistor is IGBT (Insulated Gate Bipolar Transistor), for example. The heat generation amount of the IGBT is generally 100W or more. In this case, the heat conductive member 100 is mounted on the traction motor. The thickness of the heat conductive member 100 in the Z direction is, for example, 5mm or more. However, the use and the size of the heat conductive member 100 are not limited to the above examples.
The heat conductive member 100 has a heat source contact portion (symbol omitted) and a heat dissipation portion (symbol omitted). The heat source contact portion is, for example, a portion of the heat conductive member 100 that can be in contact with a heat source, and transfers heat from the heat source. The heat radiating portion releases heat transferred to the heat source contact portion to the outside. In the present embodiment, an end surface or the like of the heat conductive member 100 facing the other Z direction Zb is a heat radiating portion. The cooling device 200 is mounted on the heat radiating portion of the heat conductive member 100.
The heat conductive member 100 includes a case 1, a working medium 2, a core structure 3, and a heat sink 4. In the present embodiment, the working medium 2 is pure water, but may be a medium other than water. For example, the working medium 2 may be any of an alcohol compound such as methanol and ethanol, a chlorofluorocarbon substitute such as a hydrofluorocarbon, a hydrocarbon compound such as propane and isobutane, a fluorinated hydrocarbon compound such as difluoromethane, and ethylene glycol. The working medium 2 can be suitably used according to the environment in which the heat conductive member 100 is used.
1-1-1. Shell >
The housing 1 has an internal space 10 for accommodating the working medium 2, and a first plate portion 11 and a second plate portion 12 disposed opposite to each other in the Z direction, which is an example of the "first direction" of the present invention. The housing 1 further includes a joint portion 13 and a column portion 14 of the first plate portion 11 and the second plate portion 12.
The internal space 10 is a closed space surrounded by the first plate portion 11 and the second plate portion 12, and is maintained in a reduced pressure state in which the air pressure is lower than the atmospheric pressure, for example. By setting the internal space 10 to a depressurized state, the working medium 2 is easily vaporized in the internal space 10. The core structure 3 and the column 14 are also accommodated in the internal space 10.
The first plate portion 11 is disposed on the other Z direction Zb than the second plate portion 12. The first plate portion 11 covers and is joined to an end surface of the second plate portion 12 facing the other Z direction Zb.
As a material of the first plate material portion 11 and the second plate material portion 12, for example, a metal having high thermal conductivity such as copper is used. Further, a metal plating layer may be formed on the surface. As the metal other than copper, for example, any one of iron, aluminum, zinc, silver, gold, magnesium, manganese, titanium, and the like, or an alloy (brass, duralumin, stainless steel, and the like) containing copper and at least any one of the above metals can be used.
The first plate member 11 and the second plate member 12 of the present embodiment are rectangular when viewed in the Z direction (see fig. 3, for example). However, the shapes of the first plate member 11 and the second plate member 12 are not limited to this example. For example, the first plate portion 11 and the second plate portion 12 may each have a polygonal shape or a circular shape having a plurality of corners as viewed in the Z direction.
The first plate portion 11 has a first plate portion 111 and a side surface portion 112. The first plate portion 111 expands in a direction perpendicular to the Z direction. The "direction perpendicular to the Z direction" is an example of the "second direction" of the present invention, and includes the X direction and the Y direction in the present embodiment. The side surface portion 112 extends from an end portion of the first plate portion 111 in a direction perpendicular to the Z direction toward the second plate portion 12. The second plate portion 12 has a second plate portion 121. The second plate portion 121 extends in a direction perpendicular to the Z direction and is disposed closer to one Za of the Z direction than the first plate portion 111. The internal space 10 is a space between the first plate portion 111 and the second plate portion 121 in the Z direction.
In the present embodiment, the thickness W1 in the Z direction of the first plate portion 111 is thicker than the thickness W2 in the Z direction of the second plate portion 121. By making W1 > W2, even if the internal pressure of the casing 1 increases due to vaporization of the working medium 2, the first plate portion 111 can be made difficult to deform.
Preferably, the thickness W1 of the first plate portion 111 in the Z direction is thicker than the respective thicknesses d1, d2 of the first joint portion 113 and the second joint portion 122 in the Z direction. By further increasing the thickness W1 of the first plate portion 111, the first plate portion 111 is less likely to deform even if the internal pressure of the housing 1 increases. Therefore, expansion of the housing 1 can be suppressed.
In addition, the width of the first plate portion 111 in the direction perpendicular to the Z direction is narrower than the width of the second plate portion 121 in the direction perpendicular to the Z direction. More specifically, the width of the end surface of the first plate portion 111 facing the inner space 10 toward one Za in the Z direction in the direction perpendicular to the Z direction is narrower than the width of the end surface of the second plate portion 121 facing the inner space 10 toward the other Zb in the Z direction in the direction perpendicular to the Z direction. For example, as shown in fig. 1 and 3, the width Lx1 of the first plate portion 111 in the X direction is narrower than the width Lx2 of the second plate portion 121 in the X direction. As shown in fig. 2 and 3, the width Ly1 of the first plate 111 in the Y direction is smaller than the width Ly2 of the second plate 121 in the Y direction. In this way, even if the internal pressure of the casing 1 increases due to the vaporization of the working medium 2, the first plate portion 111 is less likely to deform.
The area of the end surface of the first plate portion 111 facing one Za in the Z direction (for example, the portion surrounded by Sd in fig. 3) is smaller than the area of the end surface of the second plate portion 121 facing the other Zb in the Z direction (for example, the portion surrounded by Sc in fig. 3). In this way, even if the internal pressure of the casing 1 increases due to vaporization of the working medium 2, the first plate portion 111 is less likely to deform than the second plate portion 121.
On the other hand, a radiator 4 (see fig. 1 and 2) is disposed on an end surface of the second plate portion 121 facing one Za in the Z direction. By the arrangement of the heat sink 4, the second plate portion 121 thinner than the first plate portion 111 becomes difficult to deform, and therefore the strength of the case 1 can be improved. Further, the heat radiation area of the heat transferred from the vaporized working medium 2 to the second plate portion 121 increases. Therefore, the rigidity of the case 1 can be improved, and the cooling efficiency of the heat conductive member 100 can be improved.
The side surface 112 is inclined outward of the internal space 10 in a direction perpendicular to the Z direction as going toward one Za in the Z direction. For example, the side surface portion 112 is inclined outward in the X direction than the internal space 10 as seen in the Y direction toward one Za in the Z direction. The side surface portion 112 is inclined outward in the Y direction than the internal space 10 as seen in the X direction toward one Za in the Z direction. Preferably, an end portion on the Z-direction one Za side (see Sb in fig. 3 and B in fig. 4) of the outer side surface of the side surface portion 112 is disposed outside an end portion on the other Zb side (see Sa in fig. 3 and a in fig. 4) in the Z-direction in a direction perpendicular to the Z-direction. The outer side surface of the side surface 112 is a surface of the side surface 112 facing the outside of the housing 1. The outer side in the direction perpendicular to the Z direction is the outer side in the direction perpendicular to the Z direction, and means the direction from the inside of the internal space 10 toward the outside in the direction perpendicular to the Z direction. By disposing the end portion B of the outer side surface of the side surface portion 112 further outward than the end portion a in the direction perpendicular to the Z direction, the width (e.g., lx1, ly 1) of the first plate portion 111 in the direction perpendicular to the Z direction can be made narrower. Therefore, the first plate portion 11 is more difficult to deform, and in particular, the first plate portion 111 can be made more difficult to deform. In this example, the end B on the Z-direction one Za side of the outer surface of the side surface portion 112 is not disposed outside the end a on the other Zb side in the Z-direction in the direction perpendicular to the Z-direction.
More preferably, in the direction perpendicular to the Z direction, an end portion on the Z direction one Za side (see Sc in fig. 3 and C in fig. 4) of the inner side surface of the side surface portion 112 is disposed further inward than an end portion on the Z direction other Zb side (see Sa in fig. 3 and a in fig. 4) of the outer side surface of the side surface portion 112. The inner surface of the side surface 112 is a surface of the side surface 112 facing the inside of the housing 1. The inner side in the direction perpendicular to the Z direction is the inner side in the direction perpendicular to the Z direction, and means the direction from the outside toward the inside of the internal space 10 in the direction perpendicular to the Z direction. The side surface portion 112 receives a force from the inside to the outside of the case 1 due to an increase in the internal pressure of the case 1 accompanying the vaporization of the working medium 2. At this time, by disposing the end portion C of the inner side surface of the side surface portion 112 further inward than the end portion a of the outer side surface of the side surface portion 112 in the direction perpendicular to the Z direction, the first plate portion 11 is less likely to separate from the second plate portion 12 than a configuration in which the end portion C is not disposed further inward than the end portion a in the direction perpendicular to the Z direction. For example, the component force of the force applied to the side surface portion 112 toward the other Z direction Zb can be made smaller. Therefore, the case 1 is less likely to deform, and for example, the sealing performance of the internal space 10 in which the working medium 2 is sealed can be stably maintained. In this example, the end C on the Z-direction one Za side of the inner surface of the side surface portion 112 is not disposed on the inner side than the end a on the other Zb side of the outer surface of the side surface portion 112 in the direction perpendicular to the Z-direction.
The first plate portion 11 further includes a first joint portion 113. The first joint 113 extends from the end of the side surface 112 on the Z-direction one Za side in a direction perpendicular to the Z-direction to the outside of the case 1. The second plate portion 12 also has a second engagement portion 122. The second joint 122 extends outward in the Z direction from an end of the second plate 121 in the direction perpendicular to the Z direction. The first engaging portion 113 engages with the second engaging portion 122 at the engaging portion 13. That is, the end portion on the Z-direction one Za side of the first joint portion 113 is connected to the end portion on the Z-direction other Zb side of the second joint portion 122. In the present embodiment, the two members are directly joined, but the present invention is not limited to this example, and may be indirectly joined via an intermediate member such as a metal plate or a plating layer.
The thickness d1 of the first joint portion 113 in the Z direction is thicker than the thickness d2 of the second joint portion 122 in the Z direction (see fig. 1). By d1 > d2, the rigidity of the first joint portion 113 is improved. Therefore, when the internal pressure of the casing 1 increases due to the vaporization of the working medium 2, the first joint 113 can be prevented from being separated from the second joint 122 while being deformed. Therefore, the joining strength between the first joining portion 113 and the second joining portion 122 can be improved.
The engagement portion 13 is annular as viewed in the Z direction. As described above, the housing 1 has the engagement portion 13. At the joining portion 13, the outer edge portion of the first plate portion 11 is joined to the second plate portion 12. By forming the joint portion 13 as a ring-shaped body integrally, the internal space 10 can be formed inside the joint portion 13 as seen in the Z direction. In addition, the internal space 10 can be reliably sealed as compared with a structure in which the joint portions of the first joint portion 113 and the second joint portion 122 are not integrally connected in a ring shape.
The joining method of the first joining portion 113 and the second joining portion 122 is not particularly limited. For example, the bonding method may be any of a method of bonding by applying heat and pressure, diffusion bonding, bonding using a solder, or the like. In addition, the joint portion 13 may also include a seal. The sealing portion is, for example, a portion to seal an injection port for injecting the working medium 2 into the case 1 by welding or the like during the manufacturing process of the heat conductive member 100.
Next, the column portion 14 is disposed in the internal space 10. As described above, the housing 1 has the column portion 14. The pillar portion 14 extends from one of the first plate portion 11 and the second plate portion 12. By disposing the column portion 14, the strength of the housing 1 in the Z direction can be improved. For example, in the present embodiment, the column portion 14 extends in the Z direction from the end surface of the first plate portion 111 facing one Za in the Z direction. The tip of the column portion 14 (here, the end on the Z-direction one Za side) is connected to the core structure 3. The column portion 14 is not limited to the example of the present embodiment. For example, at least a part of the column portion 14 may extend from an end surface of the second plate portion 121 toward the other Z-direction Zb. The direction in which the column portion 14 extends may be inclined from the Z direction. The distal end of the column portion 14 extending from the first plate portion 111 may be in contact with the second plate portion 121, or may be connected to an end surface of the second plate portion 121 facing the other Zb in the Z direction. The tip of the column portion 14 extending from the second plate portion 121 may be in contact with the first plate portion 111, or may be connected to an end surface of the first plate portion 111 facing one Za in the Z direction.
At least a part of the column portion 14 may be a medium-sized solid member or a porous body. For example, the solid component may be a metal pillar and the porous body may be a sintered body of metal powder. The "medium-solid" member is a so-called solid member, and the inside thereof is densely filled, and is not porous. For example, a "medium-sized" part may be a part having no voids therein, or may be a part having one or more macroscopic voids therein. The gaseous or liquid working medium 2 does not enter the interior of the medium element.
1-1-2 core Structure
Next, the core structure 3 will be described. As described above, the heat conductive member 100 further includes the core structure 3 accommodated in the internal space 10. The core structure 3 has a capillary structure. The liquefied working medium 2 can penetrate into the interior of the core structure 3. In the present embodiment, the core structure 3 is a porous body such as a sintered body of metal powder. However, the present invention is not limited to this example, and the core structure 3 may be, for example, a mesh shape. Alternatively, at least a part of the core structure 3 may be a part of the case 1, or may include a plurality of grooves arranged on an end surface of the second plate 121 facing the other Z direction Zb, for example. In the present embodiment, the material of the core structure 3 is copper. However, the present invention is not limited to this example, and other metals or alloys, carbon fibers, and ceramics may be used.
The core structure 3 is disposed on an end surface of the second plate portion 121 facing the other Zb in the Z direction, and extends in a direction perpendicular to the Z direction. The working medium 2 in a liquid state permeates into the core structure 3 by capillary phenomenon. Therefore, the working medium 2 can be moved more rapidly in the core structure 3. For example, the working medium 2 can be moved more rapidly from the end surface of the core structure 3 facing one Zb in the Z direction toward the end surface of the second plate 121 facing one Za in the Z direction. In addition, the working medium 2 can be moved more quickly in the direction perpendicular to the Z direction.
The core structure 3 is not limited to the example of the present embodiment. For example, the core structure 3 may be disposed on at least one of the end surface of the first plate 111 facing one Za in the Z direction and the end surface of the second plate 121 facing the other Zb in the Z direction.
1-1-3. Radiator
Next, in the present embodiment, the radiator 4 is attached to the end surface of the second plate portion 121 facing one Za in the Z direction. The heat sink 4 is formed using a metal material such as Al or Cu. The radiator 4 releases heat transferred from the heat conductive member 100 to the fluid f flowing inside the cooling device 200.
Preferably, in the direction perpendicular to the Z direction, the outer edge portion (see Se in fig. 3 and E in fig. 4) of the end portion on the other Z direction Zb side of the heat sink 4 is disposed outside the core structure 3, more specifically, outside the outer edge portion (see Sf in fig. 3 and F in fig. 4) of the end surface of the core structure 3 facing one Za in the Z direction. In this way, the heat released from the working medium 2 inside the core structure 3 to the second plate portion 121 can be efficiently transferred to the heat sink 4. Therefore, the heat conduction efficiency of the heat conduction member 100 can be improved.
Further, not limited to this example, at least a part of the outer edge portion (see Se in fig. 3 and E in fig. 4) of the end portion on the Z-direction other Zb side of the heat sink 4 may be disposed further inward than the outer edge portion (see Sf in fig. 3 and F in fig. 4) of the end surface of the core structure 3 toward the Z-direction one Za in the direction perpendicular to the Z-direction. Alternatively, at least a part of the outer edge portion (see Se in fig. 3 and E in fig. 4) of the end portion on the other Zb side in the Z direction of the heat sink 4 may overlap with the outer edge portion (see Sf in fig. 3 and F in fig. 4) of the end surface of the core structure 3 facing the one Za in the Z direction. In this way, the dimension of the radiator 4 in the direction perpendicular to the Z direction can be further reduced. Therefore, the heat conductive member 100 having the heat sink 4 can be made more compact.
The heat sink 4 includes a base 41 and heat radiating fins 42. The base 41 is a plate-like member extending in a direction perpendicular to the Z direction, and is rectangular when viewed from the Z direction in the present embodiment. The base 41 is disposed at one Za-side end of the heat conductive member 100 in the Z-direction. An end surface of the base 41 facing the other Z direction Zb is in contact with an end surface of the second plate 121 facing the one Z direction Za. The base 41 may be directly connected to each other or indirectly connected to each other via a member having high heat conductivity. In the latter case, for example, the substrate 41 may be indirectly in contact with each other via a heat conductive sheet, a heat dissipation grease, or the like, as in the case of the heat source. The heat sink 42 protrudes from the base 41 toward one Za in the Z direction. In the present embodiment, the fin 42 is plate-shaped extending in the longitudinal direction (for example, X direction) of the case 1 as viewed from the Z direction, and a plurality of fins are arranged in the short direction (for example, Y direction).
However, the heat sink 4 is not limited to the above example. For example, the radiator 4 may be a constituent element of the cooling device 200. That is, the cooling device 200 may have the radiator 4. The heat sink 42 may be columnar or may be two-dimensionally arranged in a direction perpendicular to the Z direction. For example, columnar fins 42 may be arranged in the X direction and in the Y direction. Alternatively, the heat sink 42 may be one. In addition, the heat sink 42 may protrude from the heat conductive member 100. That is, the base 41 may be omitted. In this case, the heat sink 42 may be a member different from the heat conductive member 100 (in particular, the second plate portion 121) and fixed to an end surface of the heat conductive member 100 facing one Za in the Z direction. Alternatively, the heat sink 42 may be part of the heat conducting member 100. For example, the heat sink 42 and the second plate portion 121 may be different portions of the same member. The heat sink 42 may be a cut-and-raised portion formed by cutting a part of the second plate 121 at one end Za in the Z direction.
1-2 Cooling device
Next, the cooling device 200 includes a case 220 and a fluid flow path Pf (see fig. 1 and 2).
The case 220 has a closed cylindrical shape, and is opened in the Z direction by the other Zb. The case 220 has a fluid flow path Pf through which the fluid f flows. In the present embodiment, as shown in fig. 1, the fluid f flows through the fluid flow path Pf in the X direction. The case 220 is disposed on an end surface of the second plate 121 facing one Za in the Z direction, and covers the radiator 4. That is, the radiator 4 is disposed in the fluid flow path Pf. The other Zb-side end of the case 220 in the Z direction is fixed to the base 41 by means of a sealing member (not shown) such as an O-ring, for example, by screw fixation. However, the method of fixing the case 220 is not limited to this example, and may be, for example, welding, bonding, or the like. In the case where the base 41 is omitted as described above, the end portion on the other Zb side in the Z direction of the case 220 is fixed to the end surface of the heat conductive member 100 facing the one Za in the Z direction in the same manner.
The case 220 has an inflow port 221 into which the fluid f flows and an outflow port 222 from which the fluid f flows (see fig. 1). In addition, the fluid f is an example of the "refrigerant" of the present invention. In the present embodiment, the inlet 221 is disposed on one side of the case 220 in the X direction. The outflow port 222 is disposed on the other side of the case 220 in the X direction. The inlet 221 and the outlet 222 are connected to a pump (not shown) for circulating the fluid f, a radiator (not shown) for cooling the fluid f, and the like. By driving the pump, the fluid f circulates in the fluid flow path Pf, the radiator, and the pump. The fluid f can flow into the fluid flow path Pf from the inflow port 221 of the case 220. In the fluid flow path Pf, the fluid f contacts the fins 42 of the radiator 4. The fluid f can flow out of the outflow port 222 of the case 220 to the outside of the fluid flow path Pf.
By flowing the fluid f through the inside of the case 220, the radiator 4 can radiate heat to the fluid f, and therefore the heat radiation efficiency of the radiator 4 can be improved. Further, by flowing the fluid f, which has undergone heat transfer from the radiator 4, out of the case 220 from the outflow port 222 and flowing the new fluid f into the case 220 from the inflow port 221, the fluid f, which has not undergone heat transfer, can be continuously supplied in the vicinity of the radiator 4. Therefore, the heat radiation efficiency of the heat sink 4 can be further improved.
The fluid f is a refrigerant, in this embodiment water. However, the fluid f is not limited to this example, and may be a liquid such as an antifreeze liquid such as ethylene glycol or propylene glycol. Alternatively, the fluid f may be a gas such as air. Accordingly, the heat exchange device 500 can be used as a cold plate for cooling a heat source.
While the fluid f circulates in the fluid flow path Pf, heat transferred from the heat source to the radiator 4 through the heat conductive member 100 is released from the radiator 4 to the fluid f, in particular, from the fins 42. The fluid f subjected to heat transfer flows out from the outflow port 222, is cooled by the radiator, and returns to the fluid flow path Pf. That is, the cooled fluid f flows from the inflow port 221 into the fluid flow path Pf. Through such heat transfer and circulation of the fluid circulation, the heat exchange device 500 is able to cool the heat source.
In addition, the cooling device 200 may have a member for attaching the case 220 to an object other than the heat conductive member 100, a member for increasing the area of the outer surface of the case 220, or the like.
The end portion on the other Zb side in the Z direction of the case 200 may be fixed to the end surface of the second joint 122 facing one Za in the Z direction, or may be fixed to the outer surface of at least one of the first joint 113 and the second joint 122 in the direction perpendicular to the Z direction, not limited to the example of the present embodiment. In this way, the fluid flow path Pf can be further enlarged, and the area where the heat conductive member 100 contacts the fluid f can be increased. Therefore, the cooling efficiency of the cooling device 200 with respect to the heat conductive member 100 can be further improved.
< 2. Other >
The embodiments of the present invention are described above. The scope of the present invention is not limited to the above embodiment. The present invention can be implemented by variously changing the above-described embodiments within a range not departing from the gist of the present invention. The matters described in the above embodiments can be appropriately combined in any manner within the range where no contradiction occurs.
The invention can be used for cooling a heat source.
Symbol description
100-heat conductive member, 1-case, 10-internal space, 11-first plate portion, 111-first plate portion, 112-side wall portion, 113-first joint portion, 12-second plate portion, 121-second plate portion, 113-second joint portion, 13-joint portion, 14-column portion, 2-working medium, 3-core structure, 4-radiator, 41-base body, 42-fin, 200-cooling device, 220-case, 221-inflow port, 222-outflow port, 500-heat exchange device, f-fluid.
Claims (11)
1. A heat-conducting member, characterized in that,
comprises a housing, a working medium and a radiator,
the housing has:
a first plate portion and a second plate portion disposed opposite to each other in a first direction; and
an inner space for accommodating the working medium,
the first plate portion has:
a first plate portion extending in a second direction perpendicular to the first direction; and
a side surface portion extending from an end portion of the first plate portion in the second direction toward the second plate portion,
the second plate portion has a second plate portion that extends in the second direction and is disposed in one of the first directions with respect to the first plate portion,
the internal space is a space between the first plate portion and the second plate portion in the first direction,
the thickness of the first plate portion in the first direction is thicker than the thickness of the second plate portion in the first direction,
the heat sink is disposed on one end surface of the second plate portion facing the first direction.
2. The heat conducting component according to claim 1, wherein,
in the second direction, one end portion of the outer surface of the side surface portion on one side in the first direction is disposed outside the other end portion on the other side in the first direction.
3. A heat conductive member according to claim 1 or 2,
in the second direction, one end portion of the inner side surface of the side surface portion on one side in the first direction is disposed inside the other end portion of the outer side surface of the side surface portion on the other side in the first direction.
4. A heat conductive member according to any one of claim 1 to 3,
the first plate portion further includes a first joint portion that extends from an end portion of one side of the side surface portion in the first direction to an outside in the second direction toward an outside of the housing,
the second plate portion further has a second joint portion that extends outward in the second direction from an end portion of the second plate portion in the second direction,
one end of the first joint in the first direction is connected to the other end of the second joint in the first direction,
the thickness of the first engagement portion in the first direction is thicker than the thickness of the second engagement portion in the second direction.
5. The heat conducting member according to claim 4, wherein,
the thickness of the first plate portion in the first direction is thicker than the respective thicknesses of the first joint portion and the second joint portion in the first direction.
6. The heat conductive member according to any one of claims 1 to 5,
the width of the first plate portion in the second direction is narrower than the width of the second plate portion in the second direction.
7. The heat conductive member according to any one of claims 1 to 6,
an area of one end surface of the first plate portion facing the first direction is smaller than an area of the other end surface of the second plate portion facing the first direction.
8. The heat conductive member according to any one of claims 1 to 7,
the housing further has a post portion disposed in the interior space,
the pillar portion extends from one of the first plate portion and the second plate portion.
9. The heat conductive member according to any one of claims 1 to 8,
also comprises a core structure body accommodated in the inner space,
the core structure is disposed on the other end surface of the second plate portion facing the first direction, and extends in a direction perpendicular to the first direction.
10. The heat conductive member according to any one of claims 1 to 9,
the housing further has a joint portion which is annular as seen from the first direction,
at the joint portion, an outer edge portion of the first plate portion is joined to the second plate portion.
11. A heat exchange device is characterized by comprising:
the heat conductive member according to any one of claims 1 to 10; and
a cooling device for cooling the heat conduction member,
the cooling device has a case which is disposed on one end surface of the second plate portion facing the first direction and covers the radiator,
the case has an inflow port into which the refrigerant flows and an outflow port from which the refrigerant flows.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021028543 | 2021-02-25 | ||
| JP2021-028543 | 2021-02-25 | ||
| PCT/JP2022/007359 WO2022181630A1 (en) | 2021-02-25 | 2022-02-22 | Thermally conductive member and heat exchange device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116648594A true CN116648594A (en) | 2023-08-25 |
Family
ID=83048204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280007801.3A Pending CN116648594A (en) | 2021-02-25 | 2022-02-22 | Heat conduction member and heat exchange device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN116648594A (en) |
| WO (1) | WO2022181630A1 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3654323B2 (en) * | 1996-11-25 | 2005-06-02 | 株式会社デンソー | Boiling cooler |
| JP2002022378A (en) * | 2000-07-06 | 2002-01-23 | Showa Denko Kk | Heat pipe |
| TWM526264U (en) * | 2016-03-21 | 2016-07-21 | Taiwan Microloops Corp | Liquid-cooled heat dissipation device and heat dissipation structure thereof |
| JP6988170B2 (en) * | 2017-04-28 | 2022-01-05 | 株式会社村田製作所 | Vapor chamber |
| CN111094888B (en) * | 2017-07-28 | 2021-12-10 | 达纳加拿大公司 | Ultra-thin heat exchanger for thermal management |
| KR102202435B1 (en) * | 2019-03-08 | 2021-01-13 | 엘지전자 주식회사 | Heat dissipation module |
-
2022
- 2022-02-22 CN CN202280007801.3A patent/CN116648594A/en active Pending
- 2022-02-22 WO PCT/JP2022/007359 patent/WO2022181630A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022181630A1 (en) | 2022-09-01 |
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