CN116647981B - Halogen-free high-TG low-loss copper-clad plate and preparation device - Google Patents

Halogen-free high-TG low-loss copper-clad plate and preparation device Download PDF

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Publication number
CN116647981B
CN116647981B CN202310720566.0A CN202310720566A CN116647981B CN 116647981 B CN116647981 B CN 116647981B CN 202310720566 A CN202310720566 A CN 202310720566A CN 116647981 B CN116647981 B CN 116647981B
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CN
China
Prior art keywords
rod
sliding
copper
clad plate
rotating
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Active
Application number
CN202310720566.0A
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Chinese (zh)
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CN116647981A (en
Inventor
孙武
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Mingguang Ruizhi Electronic Technology Co ltd
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Mingguang Ruizhi Electronic Technology Co ltd
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Priority to CN202310720566.0A priority Critical patent/CN116647981B/en
Publication of CN116647981A publication Critical patent/CN116647981A/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/046—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation
    • Y02A30/14—Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Laminated Bodies (AREA)

Abstract

The application discloses a halogen-free high-TG low-loss copper-clad plate and a preparation device, wherein the copper-clad plate comprises a first copper foil and a plurality of layers of bonding sheets; the bonding sheet is made of a polypropylene film, glass fiber cloth and epoxy resin glue solution; be provided with a plurality of micropores on the polypropylene film, still include the second copper foil, and the multilayer bonding piece sets up between first copper foil and second copper foil, through setting up the multilayer bonding piece, can make the copper-clad plate that adapts to different trades through the number of piles of adjustment bonding piece, and through setting up the polypropylene film that has the micropore in the bonding piece, make it have certain holding power through setting up the micropore, make the copper-clad plate be difficult for taking place to warp in buckling, can make the cohesiveness between the bonding piece stronger in the micropore simultaneously, promote the life of copper-clad plate, and the polypropylene film has good heat resistance and insulativity, can make the performance of copper-clad plate obtain certain promotion.

Description

Halogen-free high-TG low-loss copper-clad plate and preparation device
Technical Field
The application relates to the technical field of copper-clad plate production, in particular to a halogen-free high-TG low-loss copper-clad plate and a preparation device.
Background
The copper-clad plate is also called a base material, which is a plate-like material obtained by impregnating a reinforcing material with a resin, coating one or both sides with copper foil, and hot-pressing, and is called a copper-clad laminate, which is a basic material for a PCB, often called a base material, and when it is used for multilayer board production, it is also called a CORE (CORE). The copper-clad plate mainly comprises three parts: the substrate, copper foil and copper-clad plate adhesive are mainly used for manufacturing printed circuit boards and play an important role in the electronic industry of televisions, radios, computers and mobile communication.
For example, the patent is entitled "copper-clad plate structure" with publication number of CN101415296B, which includes two conductor layers, at least three insulating dielectric layers between the two conductor layers, at least one insulating dielectric layer is an improved insulating dielectric layer, the improved insulating dielectric layer is composed of epoxy resin, latent curing agent, curing accelerator, and filler, and the weight percentages of the components are: 60-90% of epoxy resin, 1-15% of latent curing agent, 0.01-0.3% of curing accelerator and 5-25% of filler. The filler is inorganic powder, and the inorganic powder is at least one powder selected from crystalline silica micropowder, alumina powder, magnesium hydroxide powder, aluminum hydroxide powder, chalk powder, layered silicate powder, barite powder, sepiolite powder, talcum powder and mica powder. Compared with the prior art, the application has the beneficial effects that the performance of the manufactured copper-clad plate is not greatly different from that of the copper-clad plate without the filler, but the manufacturing cost is effectively reduced.
The prior art has the following defects: for example, although the manufacturing cost of the copper-clad plate is reduced by a method of filling inorganic powder, the cohesiveness and bending resistance of the copper-clad plate are required to be improved, so that the copper-clad plate is limited in application field, is easy to damage, and affects the service life.
Disclosure of Invention
The application aims to provide a halogen-free high-TG low-loss copper-clad plate and a preparation device, which are used for solving the defects in the prior art.
In order to achieve the above object, the present application provides the following technical solutions:
the halogen-free high-TG low-loss copper-clad plate comprises a first copper foil and a plurality of layers of bonding sheets;
the bonding sheet is made of a polypropylene film, glass fiber cloth and epoxy resin glue solution;
the polypropylene film is provided with a plurality of micropores.
Preferably, the adhesive sheet further comprises a second copper foil, and the plurality of layers of the adhesive sheet are disposed between the first copper foil and the second copper foil.
The preparation device of the halogen-free high-TG low-loss copper-clad plate is used for preparing the halogen-free high-TG low-loss copper-clad plate and further comprises a sliding seat, a lifting table, a sliding table and a hollow rod;
a plurality of clamping assemblies for clamping the adhesive sheet;
two support assemblies for supporting the adhesive sheet as it moves;
the clamping assembly comprises a fixing shell fixedly connected with a hollow rod, a supporting plate is arranged on the fixing shell in a sliding mode, a plurality of pressing blocks corresponding to the supporting plate one to one are arranged on the hollow rod in a sliding mode, rotating columns are arranged on the pressing blocks and the supporting plate in a rotating mode, torsion springs are arranged between the pressing blocks and the supporting plate and the corresponding rotating columns, and clamping plates are arranged on the rotating columns in a rotating mode.
Preferably, the briquetting is last to be fixedly provided with first rack, fixedly provided with second rack on the layer board, it is provided with the second gear to rotate on the fixed shell, just first rack and second rack all with second gear engagement.
Preferably, a first rotating rod is rotatably arranged on the hollow rod, a plurality of reels corresponding to the pressing blocks one by one are fixedly arranged on the first rotating rod, a steel wire rope is arranged between each reel and each pressing block, and two ends of the steel wire rope are fixedly connected with the reels and the pressing blocks respectively and are wound on the reels;
a spring is arranged between the hollow rod and the pressing block, and two ends of the spring are fixedly connected with the hollow rod and the pressing block respectively.
Preferably, the first rotating rod is fixedly provided with a first gear, the lifting table is fixedly provided with a fixed toothed plate, and the fixed toothed plate is meshed with the first gear.
Preferably, the support assembly comprises a protection rod, a second rotating rod is fixedly arranged on the protection rod, the second rotating rod is rotationally connected with the lifting table, a first belt wheel is rotationally arranged on the lifting table, a second belt wheel is fixedly arranged on the second rotating rod, and a belt is arranged between the second belt wheel and the first belt wheel in a transmission mode.
Preferably, the belt is fixedly provided with a sliding block, the sliding block is provided with a slot, the sliding table is fixedly provided with a bolt, and the bolt is clamped with the slot.
Preferably, the lifting platform is fixedly provided with a plurality of limit shells corresponding to the protection rods, the limit shells are provided with support plates in a sliding manner, the support plates are in contact with the corresponding protection rods, the limit shells are provided with sliding grooves, and pushing blocks are arranged in the sliding grooves in a sliding manner;
a connecting rod is arranged between the protection rod and the second rotating rod, two ends of the connecting rod are respectively connected with the protection rod and the second rotating rod in a rotating way, a push rod is arranged between the connecting rod and the push block, steel balls are fixedly arranged at two ends of the push rod, and the two steel balls are respectively embedded on the connecting rod and the push block;
the lifting table is fixedly provided with a plurality of brackets which are in one-to-one correspondence with the protection rods.
Preferably, a plurality of first hydraulic rods are arranged between the sliding seat and the lifting table and are fixedly connected with two ends of the first hydraulic rods respectively, a plurality of second hydraulic rods are arranged between the two sliding tables and the lifting table, and two ends of the second hydraulic rods are fixedly connected with the sliding table and the lifting table respectively;
the sliding seat is arranged on the transverse shafts in a sliding mode.
In the technical scheme, the halogen-free high-TG low-loss copper-clad plate and the preparation device provided by the application have the beneficial effects that:
1. in this embodiment, through setting up the multilayer bonding piece to through setting up the polypropylene film that has the micropore in the bonding piece, make it have certain holding power through setting up the micropore, make the copper-clad plate be difficult for taking place the deformation at buckling, can make the cohesiveness between the bonding piece stronger in the micropore simultaneously, promote the life of copper-clad plate, and the polypropylene film has good heat resistance and insulativity, can make the performance of copper-clad plate obtain certain promotion.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
This document provides an overview of various implementations or examples of the technology described in this disclosure, and is not a comprehensive disclosure of the full scope or all of the features of the technology disclosed.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
FIG. 1 is a schematic diagram of an overall structure according to an embodiment of the present application;
FIG. 2 is an enlarged view at A provided by an embodiment of the present application;
FIG. 3 is an internal view of a hollow bar according to an embodiment of the present application;
FIG. 4 is a cross-sectional view of a briquette and a stationary housing provided by an embodiment of the application;
FIG. 5 is a schematic view of the overall bottom structure provided by an embodiment of the present application;
FIG. 6 is an enlarged view of point B provided by an embodiment of the present application;
FIG. 7 is a partial cross-sectional view of a lift table according to an embodiment of the present application;
fig. 8 is a schematic structural diagram of a sliding table according to an embodiment of the present application;
FIG. 9 is a schematic diagram of a supporting plate structure according to an embodiment of the present application;
FIG. 10 is a cross-sectional view of a retaining shell according to an embodiment of the present application;
fig. 11 is a schematic structural diagram of a copper-clad plate according to an embodiment of the present application.
Reference numerals illustrate:
1. a first copper foil; 2. an adhesive sheet; 3. a second copper foil; 4. a sliding seat; 41. a first hydraulic lever; 42. a transverse axis; 5. a lifting table; 51. a second hydraulic lever; 52. a first pulley; 53. fixing the toothed plate; 54. a bracket; 55. a limit shell; 56. a support plate; 57. a chute; 58. a pushing block; 59. a push rod; 6. a sliding table; 61. a plug pin; 7. a hollow rod; 71. a first rotating lever; 72. a first gear; 73. a reel; 74. a wire rope; 75. briquetting; 76. a spring; 77. a first rack; 78. a clamping plate; 79. rotating the column; 8. a fixed case; 81. a supporting plate; 82. a second rack; 83. a second gear; 9. a protective rod; 91. a second rotating rod; 92. a connecting rod; 93. a second pulley; 94. a belt; 95. a slide block; 96. a slot.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.
Referring to fig. 1 to 11, a halogen-free high TG low loss copper clad laminate includes a first copper foil 1, and further includes a multilayer adhesive sheet 2;
the bonding sheet 2 is made of a polypropylene film, glass fiber cloth and epoxy resin glue solution;
be provided with a plurality of micropores on the polypropylene film, in this embodiment, set up the polypropylene film in will bonding piece 2, set up a plurality of micropores simultaneously on the polypropylene film, and the micropore diameter is 10-30 microns, make bonding piece 2 have certain holding power through setting up the micropore, make the copper-clad plate buckle and make difficult emergence deformation, can make the cohesiveness between bonding piece 2 stronger in the micropore simultaneously, promote the life of copper-clad plate, and the polypropylene film has good heat resistance and insulativity, can make the performance of copper-clad plate obtain certain promotion.
In this embodiment, the copper clad laminate further includes a second copper foil 3, and the multi-layer bonding sheet 2 is disposed between the first copper foil 1 and the second copper foil 3, and the thickness, bending performance and insulating strength of the produced copper clad laminate can be controlled by adjusting the number of layers of the bonding sheet 2, so that the application range of the produced copper clad laminate is wider.
Furthermore, the application also discloses a halogen-free high-TG low-loss copper-clad plate preparation device which is used for stacking the bonding sheet 2 and the copper foil in the production process of the copper-clad plate, and specifically comprises a sliding seat 4, a lifting table 5, a sliding table 6 and a hollow rod 7; a plurality of clamping members for clamping the adhesive sheet 2; two supporting members for supporting the adhesive sheet 2 as it moves; the clamping assembly comprises a fixed shell 8 fixedly connected with a hollow rod 7, a supporting plate 81 is arranged on the fixed shell 8 in a sliding manner, a plurality of pressing blocks 75 in one-to-one correspondence with the supporting plate 81 are arranged on the hollow rod 7 in a sliding manner, a rotating column 79 is arranged on each pressing block 75 and the supporting plate 81 in a rotating manner, torsion springs are arranged between each pressing block 75 and each supporting plate 81 and the corresponding rotating column 79, a clamping plate 78 is arranged on each rotating column 79 in a rotating manner, the bonding sheets 2 are clamped through the plurality of pressing blocks 75 which are arranged on the hollow rod 7 in a sliding manner, the bonding sheets 2 are clamped in one-to-one correspondence with the supporting plates 81, effective clamping of the bonding sheets 2 is achieved, and the torsion springs are arranged between each pressing block 75 and each supporting plate 81 through the corresponding torsion springs, so that the clamping plates 78 can be moved through the support of the torsion springs when the bonding sheets 2 are clamped and relaxed. And give bonding piece 2 certain compensation power, prevent to lead to the fact tearing to bonding piece 2 and splint 78's contact position when carrying out centre gripping or relaxing bonding piece 2, avoid causing the damage to bonding piece 2, simultaneously when loosening bonding piece 2, make to produce certain frictional force between splint 78 and the bonding piece 2 under the effect of torsional spring, stretch bonding piece 2 to both sides, avoid bonding piece 2 to appear the fold phenomenon after putting down, influence production quality.
Further, the first rack 77 is fixedly arranged on the pressing block 75, the second rack 82 is fixedly arranged on the supporting plate 81, the second gear 83 is rotatably arranged on the fixing shell 8, the first rack 77 and the second rack 82 are meshed with the second gear 83, in the embodiment, the first rack 77 arranged on the pressing block 75 and the second rack 82 arranged on the supporting plate 81 are used for transmission through the second gear 83, the pressing block 75 can be lowered and simultaneously driven to lift the supporting plate 81, the pressing block 75 and the supporting plate 81 can slide in opposite directions, the bonding sheet 2 is clamped, the pressing block 75 can be effectively prevented from unilaterally pressing down the bonding sheet 2, and the risk of damaging the bonding sheet 2 during clamping is reduced.
Further, a first rotating rod 71 is rotatably arranged on the hollow rod 7, a plurality of reels 73 corresponding to the pressing blocks 75 one by one are fixedly arranged on the first rotating rod 71, a steel wire rope 74 is arranged between the reels 73 and the pressing blocks 75, and two ends of the steel wire rope 74 are fixedly connected with the reels 73 and the pressing blocks 75 respectively and are wound on the reels 73; the spring 76 is arranged between the hollow rod 7 and the pressing block 75, two ends of the spring 76 are fixedly connected with the hollow rod 7 and the pressing block 75 respectively, in the embodiment, the first rotating rod 71 is arranged, when the first rotating rod 71 rotates, the winding shaft 73 can be controlled to wind or loosen the steel wire rope 74, when the steel wire rope 74 is loosened, the pressing block 75 slides downwards to be matched with the supporting plate 81 to clamp the bonding sheet 2 under the action of the spring 76, when the steel wire rope 74 is tightened, the spring 76 is compressed, the pressing block 75 and the supporting plate 81 are loosened to clamp the bonding sheet 2, a plurality of clamping assemblies are controlled through the winding shafts 73 on the first rotating rod 71, the synchronous clamping of the bonding sheet 2 by the clamping assemblies is realized, and the stability of the bonding sheet 2 during clamping is improved.
In a further embodiment of the present application, the first gear 72 is fixedly disposed on the first rotating rod 71, the fixed toothed plate 53 is fixedly disposed on the lifting platform 5, and the fixed toothed plate 53 is meshed with the first gear 72, so that the first gear 72 is rotated when the sliding platform 6 slides by fixedly disposing the first gear 72 on the first rotating rod 71 and the plurality of reels 73 on the first rotating rod 71 roll or loosen the steel wire 74, so that the clamping assembly can be controlled when the sliding platform 6 slides.
In the embodiment provided by the application, the supporting component comprises the protection rod 9, the second rotating rod 91 is fixedly arranged on the protection rod 9, the second rotating rod 91 is rotationally connected with the lifting platform 5, the first belt pulley 52 is rotationally arranged on the lifting platform 5, the second belt pulley 93 is fixedly arranged on the second rotating rod 91, a belt 94 is arranged between the second belt pulley 93 and the first belt pulley 52 in a transmission manner, the protection rod 9 is arranged to support and protect the bonding sheet 2 when the bonding sheet 2 is stacked and moved, the bonding sheet 2 is placed to bend due to large self gravity, even the clamping position is broken, and meanwhile, the first belt pulley 52 and the second belt pulley 93 are transmitted through the belt 94, so that the protection rod 9 can rotate, and the supporting and protecting of the bonding sheet 2 are met while the clamping of the bonding sheet 2 is not influenced.
Specifically, the sliding block 95 is fixedly arranged on the belt 94, the slot 96 is formed in the sliding block 95, the plug pin 61 is fixedly arranged on the sliding table 6, and the plug pin 61 is clamped with the slot 96, in this embodiment, through the sliding block 95 arranged on the belt 94, the plug pin 61 is arranged on the sliding table 6 and the slot 96 is clamped with the sliding block 95, so that when the sliding table 6 slides, the sliding block 95 can drive the belt 94 through the plug pin 61, thereby the second belt pulley 93 rotates, the second rotating rod 91 is driven to rotate, and the protection rod 9 rotates.
In the scheme provided by the application, a plurality of limiting shells 55 corresponding to the protective rods 9 are fixedly arranged on the lifting platform 5, a supporting plate 56 is slidably arranged on the limiting shells 55, the supporting plate 56 is in contact with the corresponding protective rods 9, a sliding groove 57 is formed in the limiting shells 55, and a push block 58 is slidably arranged in the sliding groove 57; a connecting rod 92 is arranged between the protective rod 9 and the second rotating rod 91, two ends of the connecting rod 92 are respectively connected with the protective rod 9 and the second rotating rod 91 in a rotating way, a push rod 59 is arranged between the connecting rod 92 and the push block 58, steel balls are fixedly arranged at two ends of the push rod 59, and the two steel balls are respectively embedded on the connecting rod 92 and the push block 58; the lifting platform 5 is fixedly provided with a plurality of brackets 54 corresponding to the protective rods 9 one by one, the supporting plates 56 are arranged, so that the protective rods 9 are placed to be bent and deformed when supporting and protecting the bonding sheets 2, meanwhile, the connecting rods 92 arranged between the second rotating rods 91 and the protective rods 9 are arranged, the push rods 59 are arranged on the connecting rods 92, the steel balls are inlaid and arranged to achieve a connecting effect, the steering of the push rods 59 is not limited, the supporting plates 56 can be pushed through the cooperation of the push rods 59 and the push blocks 58 when the protective rods 9 rotate to the supporting plates 56, the protective rods 9 on the other sides are supported, the protective rods 9 are folded and are folded onto the brackets 54 when not working, the protective rods 9 are prevented from being bent and deformed due to gravity, and the service life of the protective rods is prolonged.
Further, a plurality of first hydraulic rods 41 are arranged between the sliding seat 4 and the lifting table 5 and are fixedly connected with two ends of the first hydraulic rods 41 respectively, a plurality of second hydraulic rods 51 are arranged between the two sliding tables 6 and the lifting table 5, and two ends of the second hydraulic rods 51 are fixedly connected with the sliding table 6 and the lifting table 5 respectively; the present embodiment further includes a plurality of transverse shafts 42, and the sliding seat 4 is slidably disposed on the transverse shafts 42, and in this embodiment, the first hydraulic rod 41, the second hydraulic rod 51, the sliding seat 4 and the transverse shafts 42 are conventional devices, and an operation manner and a working principle thereof are common knowledge and common technical means of those skilled in the art, and are not described in detail.
In a further embodiment of the present application, when stacking the bonding sheet 2 and copper foil, the sliding seat 4 slides along the transverse shaft 42 to the upper part of the area where the bonding sheet 2 is located, then the first hydraulic rod 41 stretches to enable the lifting platform 5 to descend to the position where the clamping components are opposite to the two sides of the bonding sheet 2, then the second hydraulic rod 51 shortens to enable the sliding platforms 6 on the two sides to slide inwards, the sliding platform 6 slides and drives the hollow rod 7 and the first rotating rod 71 on the hollow rod 7, at the moment, the first gear on the first rotating rod 71 rotates under the action of the fixed toothed plate 53 on the lifting platform 5 and simultaneously drives the first rotating rod 71 to rotate, the scroll 73 simultaneously rotates along with the first rotating rod 71 and loosens the steel wire 74 on the scroll 73, the spring 76 pushes the pressing block 75 to slide downwards, and enables the second gear 83 to rotate and drive the second gear 82 to slide upwards during the downward sliding of the pressing block 75 through the first gear 77, and enables the second gear 82 to slide upwards along with the supporting plate 81 and the supporting plate 75 to enable the first gear to rotate and simultaneously drive the first gear 71 to rotate and simultaneously drive the first rotating rod 71 to rotate and the bonding sheet 2 to rotate, and simultaneously rotate along with the first rotating rod 71 and the first rotating rod 71 to rotate, and the scroll 73 simultaneously rotates along with the first rotating rod 71 to rotate along with the first rotating rod 74 and the first rotating rod 77 and the steel wire 74 and the clamping rod 74 to loosen the clamping plate 78, and the pressing plate 78 to rotate, thereby damage the bonding sheet 2 to the bonding sheet 2, and the bonding sheet 2 is prevented from being clamped by the bonding sheet 2, and the bonding sheet 2 is brought into contact when being clamped to be clamped and the bonding sheet 2 is clamped and damaged when the bonding sheet 2 is brought into contact when and clamped and is released when the bonding sheet is rotated; when the sliding table 6 slides inwards, the bolt 61 fixedly arranged on the lifting table 5 slides along with the sliding table, and when the sliding block 95 is pushed by the bolt 61, the belt 94 drives the first belt pulley 52 and the second belt pulley 93 to rotate, when the second belt pulley 93 rotates, the second rotating rod 91 rotates along with the second belt pulley and the protective rod 9 rotates, the protective rod 9 rotates to the lower part of the clamped bonding sheet 2, the push rod 59 is pushed while the second rotating rod 91 rotates, the push rod 59 pushes the push block 58 to slide upwards, and when the protective rod 9 rotates to a specific supporting position quickly, the push block 58 pushes the supporting plate 56 to slide upwards, so that the supporting plate 56 supports the protective rod 9 on the other side, and the protective support of the protective rod 9 on the bonding sheet 2 is more stable; after the bonding sheet 2 is clamped, the lifting table 5 is lifted upwards under the action of the first hydraulic rod 41, then the sliding seat 4 slides to the upper part of the stacking position of the bonding sheet 2 along the transverse shaft 42, the first hydraulic rod 41 works to enable the lifting table 5 to descend, and then the sliding tables 6 on two sides slide outwards, the principle of the sliding tables is the same as that of the bonding sheet 2 during clamping, and the protection rod 9 rotates to the bracket 54 under the action of the sliding tables 6 after the bonding sheet 2 is put down and moves to the upper part of the bracket 54 through the inclined plane on the bracket 54, so that the bracket 54 supports the protection rod 9, and the mode avoids deformation and bending of the longer protection rod 9 after long-time use and prolongs the service life of the protection rod 9; meanwhile, when the pressing block 75 and the supporting plate 81 loosen the bonding sheet 2, under the action of the torsion spring, the clamping plate 78 pulls two sides of the bonding sheet 2, the phenomenon that the bonding sheet 2 is wrinkled after being placed is avoided, the subsequent production quality and portability are improved, the operation is repeated, and after the bonding sheet 2 and the copper foil are stacked, the next manufacturing procedure can be carried out.
While certain exemplary embodiments of the present application have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the application. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the application, which is defined by the appended claims.

Claims (6)

1. The preparation device of the halogen-free high-TG low-loss copper-clad plate is characterized by further comprising a sliding seat (4), a lifting table (5), a sliding table (6) and a hollow rod (7);
a plurality of clamping assemblies for clamping the adhesive sheet (2);
two support assemblies for supporting the adhesive sheet (2) as it moves;
the clamping assembly comprises a fixed shell (8) fixedly connected with a hollow rod (7), a supporting plate (81) is arranged on the fixed shell (8) in a sliding mode, a plurality of pressing blocks (75) which are in one-to-one correspondence with the supporting plate (81) are arranged on the hollow rod (7) in a sliding mode, rotating columns (79) are respectively arranged on the pressing blocks (75) and the supporting plate (81) in a rotating mode, torsion springs are respectively arranged between the pressing blocks (75), the supporting plate (81) and the corresponding rotating columns (79), and clamping plates (78) are respectively arranged on the rotating columns (79) in a rotating mode;
a first rack (77) is fixedly arranged on the pressing block (75), a second rack (82) is fixedly arranged on the supporting plate (81), a second gear (83) is rotatably arranged on the fixed shell (8), and the first rack (77) and the second rack (82) are meshed with the second gear (83);
the hollow rod (7) is rotatably provided with a first rotating rod (71), a plurality of reels (73) which are in one-to-one correspondence with the pressing blocks (75) are fixedly arranged on the first rotating rod (71), steel wire ropes (74) are arranged between the reels (73) and the pressing blocks (75), and two ends of each steel wire rope (74) are fixedly connected with the reels (73) and the pressing blocks (75) respectively and are wound on the reels (73);
a spring (76) is arranged between the hollow rod (7) and the pressing block (75), and two ends of the spring (76) are fixedly connected with the hollow rod (7) and the pressing block (75) respectively.
2. The halogen-free high-TG low-loss copper-clad plate preparation device according to claim 1, wherein a first gear (72) is fixedly arranged on the first rotating rod (71), a fixed toothed plate (53) is fixedly arranged on the lifting table (5), and the fixed toothed plate (53) is meshed with the first gear (72).
3. The halogen-free high-TG low-loss copper-clad plate preparation device according to claim 1, wherein the supporting component comprises a protection rod (9), a second rotating rod (91) is fixedly arranged on the protection rod (9), the second rotating rod (91) is rotationally connected with a lifting table (5), a first belt wheel (52) is rotationally arranged on the lifting table (5), a second belt wheel (93) is fixedly arranged on the second rotating rod (91), and a belt (94) is arranged between the second belt wheel (93) and the first belt wheel (52) in a transmission manner.
4. The device for preparing the halogen-free high-TG low-loss copper-clad plate according to claim 3, wherein a sliding block (95) is fixedly arranged on the belt (94), a slot (96) is formed in the sliding block (95), a bolt (61) is fixedly arranged on the sliding table (6), and the bolt (61) is clamped with the slot (96).
5. The halogen-free high-TG low-loss copper-clad plate preparation device according to claim 3, wherein a plurality of limit shells (55) corresponding to the protection rods (9) are fixedly arranged on the lifting table (5), a supporting plate (56) is slidably arranged on the limit shells (55), the supporting plate (56) is in contact with the corresponding protection rods (9), a sliding groove (57) is formed in the limit shells (55), and a pushing block (58) is slidably arranged in the sliding groove (57);
a connecting rod (92) is arranged between the protective rod (9) and the second rotating rod (91), two ends of the connecting rod (92) are respectively connected with the protective rod (9) and the second rotating rod (91) in a rotating way, a push rod (59) is arranged between the connecting rod (92) and the push block (58), steel balls are fixedly arranged at two ends of the push rod (59), and the two steel balls are respectively embedded and arranged on the connecting rod (92) and the push block (58);
a plurality of brackets (54) which are in one-to-one correspondence with the protection rods (9) are fixedly arranged on the lifting table (5).
6. The preparation device of the halogen-free high-TG low-loss copper-clad plate according to claim 1, wherein a plurality of first hydraulic rods (41) are arranged between the sliding seat (4) and the lifting table (5) and are fixedly connected with two ends of the first hydraulic rods (41) respectively, a plurality of second hydraulic rods (51) are arranged between the two sliding tables (6) and the lifting table (5), and two ends of the second hydraulic rods (51) are fixedly connected with the sliding tables (6) and the lifting table (5) respectively;
also comprises a plurality of transverse shafts (42), and the sliding seat (4) is arranged on the transverse shafts (42) in a sliding way.
CN202310720566.0A 2023-06-19 2023-06-19 Halogen-free high-TG low-loss copper-clad plate and preparation device Active CN116647981B (en)

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CN202310720566.0A CN116647981B (en) 2023-06-19 2023-06-19 Halogen-free high-TG low-loss copper-clad plate and preparation device

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CN112123806A (en) * 2020-09-10 2020-12-25 洪宇豪 Copper-clad plate production process
CN215500337U (en) * 2021-09-08 2022-01-11 上海井十电子科技有限公司 Conveying device for processing printed circuit board
CN113973442A (en) * 2021-10-31 2022-01-25 江西昶龙科技有限公司 Transmission device used in full-automatic resistor chip mounter
CN216491317U (en) * 2021-12-22 2022-05-10 深圳市宏德旺科技有限公司 Circuit board processing is with SMT nanometer steel mesh that possesses categorised clamping function
CN114474878A (en) * 2022-03-02 2022-05-13 江苏生益特种材料有限公司 Copper-clad plate and manufacturing method thereof
CN115297619A (en) * 2022-09-30 2022-11-04 四川英创力电子科技股份有限公司 Printed circuit board centre gripping material feeding unit

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5927504A (en) * 1998-06-23 1999-07-27 Samsung Electronics Co., Ltd. Apparatus for carrying plural printed circuit boards for semiconductor module
AU2005203658A1 (en) * 1999-10-13 2005-09-08 Mitek Holdings, Inc. Automated board processing apparatus
CN207869531U (en) * 2017-12-22 2018-09-14 广州尚牛设计有限公司 A kind of automatic clamping and positioning device of multi-layered high-density pcb board
CN207766660U (en) * 2018-01-19 2018-08-24 东莞市帝和电子有限公司 A kind of PCB multilayer printed wiring boards
CN112123806A (en) * 2020-09-10 2020-12-25 洪宇豪 Copper-clad plate production process
CN215500337U (en) * 2021-09-08 2022-01-11 上海井十电子科技有限公司 Conveying device for processing printed circuit board
CN113973442A (en) * 2021-10-31 2022-01-25 江西昶龙科技有限公司 Transmission device used in full-automatic resistor chip mounter
CN216491317U (en) * 2021-12-22 2022-05-10 深圳市宏德旺科技有限公司 Circuit board processing is with SMT nanometer steel mesh that possesses categorised clamping function
CN114474878A (en) * 2022-03-02 2022-05-13 江苏生益特种材料有限公司 Copper-clad plate and manufacturing method thereof
CN115297619A (en) * 2022-09-30 2022-11-04 四川英创力电子科技股份有限公司 Printed circuit board centre gripping material feeding unit

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Denomination of invention: A halogen-free high TG low loss copper clad plate and its preparation device

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