CN116647249B - Modularized intelligent signal shielding device unit, shielding device and shielding control method - Google Patents
Modularized intelligent signal shielding device unit, shielding device and shielding control method Download PDFInfo
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- CN116647249B CN116647249B CN202310926974.1A CN202310926974A CN116647249B CN 116647249 B CN116647249 B CN 116647249B CN 202310926974 A CN202310926974 A CN 202310926974A CN 116647249 B CN116647249 B CN 116647249B
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- 238000012986 modification Methods 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 2
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- 230000000873 masking effect Effects 0.000 claims 3
- 230000008646 thermal stress Effects 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 description 8
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- 238000003199 nucleic acid amplification method Methods 0.000 description 7
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- 230000008859 change Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000001629 suppression Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010295 mobile communication Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
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- 230000008054 signal transmission Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04K—SECRET COMMUNICATION; JAMMING OF COMMUNICATION
- H04K3/00—Jamming of communication; Counter-measures
- H04K3/40—Jamming having variable characteristics
- H04K3/45—Jamming having variable characteristics characterized by including monitoring of the target or target signal, e.g. in reactive jammers or follower jammers for example by means of an alternation of jamming phases and monitoring phases, called "look-through mode"
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04K—SECRET COMMUNICATION; JAMMING OF COMMUNICATION
- H04K3/00—Jamming of communication; Counter-measures
- H04K3/60—Jamming involving special techniques
- H04K3/62—Jamming involving special techniques by exposing communication, processing or storing systems to electromagnetic wave radiation, e.g. causing disturbance, disruption or damage of electronic circuits, or causing external injection of faults in the information
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04K—SECRET COMMUNICATION; JAMMING OF COMMUNICATION
- H04K3/00—Jamming of communication; Counter-measures
- H04K3/60—Jamming involving special techniques
- H04K3/68—Jamming involving special techniques using passive jamming, e.g. by shielding or reflection
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention provides a modularized intelligent signal shielding device unit, a shielding device and a shielding control method, which comprise a plurality of independent intelligent modules of the shielding device, a shielding device motherboard and a plurality of power amplifier units; the shielding device comprises a plurality of shielding device independent intelligent modules; any one of the independent intelligent modules of the shielding device is connected with any one of the power amplifier units. The master board of the shielding device and the independent intelligent modules of the shielding devices replace the whole frequency band of the original whole shielding device. When the equipment fails on the site of a user, the equipment can be powered on again by replacing the independent intelligent module of the failed shielding device, so that the rejection rate of the shielding device is reduced. The wireless frequency band and the system can be increased or reduced by adding or reducing the independent intelligent modules of the shielding devices, so that the device is smoothly adapted to the requirements of various frequency bands in different countries in different areas. In addition, a plurality of small-size independent intelligent modules of the shielding device lead to smaller thermal stress of feedback in high-temperature operation, and the failure rate of equipment is reduced.
Description
Technical Field
The invention relates to the technical field of mobile communication and shielding, in particular to a modularized intelligent signal shielding device unit, a shielding device and a shielding control method.
Background
The existing intelligent signal shielding device mostly consists of a radio frequency baseband board and a plurality of power amplifier units. Referring to fig. 1, the radio frequency baseband board is used as a device core, and is composed of a digital baseband chipset and a full-band radio frequency transceiver chip, wherein the digital baseband chipset is one or more chips such as FPGA or DSP, so as to realize detection of wireless network in each frequency band of the air interface and real-time generation of digital baseband interference signals highly correlated with the signals of the air interface base station, and cooperate with the full-band radio frequency transceiver chip and the power amplifier unit to complete interference suppression of the signals of the air interface base station.
Due to the evolution of wireless communication systems, the radio frequency band that the radio frequency baseband board needs to support is continuously expanded. From the original 2G/3G system to the current 4G/5G system, the corresponding frequency ranges from the traditional frequency ranges of 800-900 MHz and 1.8GHz to the current more than twenty radio frequency ranges of 700M-5.8 GHz, so that the radio frequency baseband board is continuously changed. In addition, the difference of wireless network coverage in different areas causes certain difference of radio frequency baseband board frequency bands required by users in different areas. The above factors result in a large number of rf baseband board types for each manufacturer. In addition, after a user purchases a certain type of equipment, if a new frequency band is required, the equipment needs to be purchased again, so that the waste of repeated investment is caused.
In addition, referring to fig. 1 again, since the digital baseband chipset and the radio frequency transceiver on the radio frequency baseband board are mostly BGA (ball grid array) packaged chips (the number of BGA chips of one board is often more than 10), meanwhile, the power consumption of the radio frequency baseband board is tens of W level and needs to be connected with a high-heat power amplifier unit, and even if there is an aluminum board and a fan for heat dissipation, the working temperature of the radio frequency baseband board is still relatively high. In long-term operation, failure of the BGA chip caused by imbalance of local thermal stress of the board card is easy to occur. Failure of one BGA chip can result in failure of the entire device. The maintainability of the intelligent digital signal shield is poor.
Disclosure of Invention
The invention aims to provide a modularized intelligent signal shielding device unit, a shielding device and a shielding control method, which are flexible in coping with wireless system change and upgrading and improve maintainability of the intelligent signal shielding device.
The invention provides a modular intelligent signal shielding device baseband board which is characterized by comprising a plurality of shielding device independent intelligent modules, a motherboard and connecting wires;
the independent intelligent modules of the shielding devices are arranged on the motherboard, and the independent intelligent modules of the shielding devices are connected through connecting wires.
The independent intelligent module of the shielding device integrally comprises a digital baseband chip and N radio frequency transceivers;
the digital chip is connected with the N radio frequency transceivers through digital interfaces, wherein N is less than or equal to 2.
Furthermore, a separate intelligent module of the shielding device supports air interface base station signal detection of a certain section or a plurality of sections of wireless frequency bands and generates digital baseband interference signals with high correlation with the air interface base station signals in real time.
Further, a plurality of board-to-board connectors are included; any one of the independent intelligent modules of the shielding device is connected with the motherboard through any one of the inter-board connectors.
Further, the method further comprises the following steps: and the synchronous buses are sequentially connected among the connectors among the boards.
Furthermore, parameter configuration management and time sequence synchronization of a plurality of independent intelligent modules of the shielding devices are realized through a synchronous bus control mechanism.
The invention also provides a modularized intelligent signal shielding device, which adopts the modularized intelligent signal shielding device baseband board and comprises a plurality of power amplification units, wherein any independent intelligent module of the shielding device is connected with the corresponding power amplification unit through a coaxial cable.
Further, the motherboard comprises a power circuit and a peripheral interface circuit;
the power supply circuit converts the total power supply of the shielding device into working voltage and working current required by the independent intelligent module of the shielding device through a direct current-direct current conversion circuit and a linear voltage stabilizing circuit;
the peripheral interface circuit is used for reporting parameter configuration and state of all the independent intelligent modules of the shielding devices and all the power amplifier units.
The invention also provides a modularized intelligent signal shielding control method, which adopts the modularized intelligent signal shielding device baseband board or the modularized intelligent signal shielding device, and comprises the following steps: and controlling parameter configuration management and time synchronization of a plurality of independent intelligent modules of the shields in the same shielding device.
Further, the parameter configuration management includes modification of wireless system configuration parameters of the plurality of the independent intelligent modules of the shielding device.
Further, a group of IO (input/output) is connected with a group of pull-up resistors or dial switches in each inter-board connector, the states of the pull-up and pull-down or dial switches of each group of resistors are controlled to generate different numbers for each independent intelligent module of the shielding device, the independent intelligent module of the shielding device with any number is selected as a main module, and the independent intelligent modules of the shielding device with the rest numbers are selected as slave modules.
Further, the configuration parameters and the synchronization time sequence issued by the external management device are transmitted to the corresponding main module through the synchronization bus, and the main module uploads the state and alarm information of all the independent intelligent modules of the shielding devices to the external management device through the peripheral interface circuit or the main control module.
Compared with the prior art, the invention has at least the following beneficial effects:
according to the invention, a plurality of independent intelligent modules of the shielding devices are arranged in one shielding device to replace the whole frequency band plate of the whole shielding device in the prior art. When the equipment fails on the site of a user, the equipment can be powered on again by replacing the independent intelligent module of the failed shielding device, so that the rejection rate of the shielding device is reduced. The wireless frequency band and the standard can be increased or reduced by adding or reducing the independent intelligent modules of the shielding devices, so that the device is smoothly adapted to the requirements of various frequency bands in different countries in different areas (for example, the broadcast and television frequency band of a 5G standard N28 is newly added). In addition, a plurality of small-size independent intelligent modules of the shielding device lead to smaller thermal stress of feedback in high-temperature operation, and the failure rate of equipment is reduced.
Furthermore, the invention realizes the time sequence synchronization and parameter configuration management of the independent intelligent modules of each shielding device in the same shielding device through a synchronous bus control mechanism, flexibly responds to the change of the increase of wireless system or frequency band and realizes the smooth upgrading of equipment.
Drawings
FIG. 1 is a schematic diagram of a prior art intelligent shield;
fig. 2 is a schematic structural diagram of a smart signal shielding unit and a shielding device according to a first embodiment of the present invention;
fig. 3 is a schematic diagram of an internal structure of a separate intelligent module of a shielding device according to an embodiment of the invention.
Detailed Description
The following description of a modular intelligent signal shield unit, shield, and shield control method of the present invention, in conjunction with the schematic drawings, illustrates preferred embodiments of the present invention, it being understood that one skilled in the art may modify the invention described herein while still achieving the advantageous effects of the invention. Accordingly, the following description is to be construed as broadly known to those skilled in the art and not as limiting the invention.
The invention is more particularly described by way of example in the following paragraphs with reference to the drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention.
Example 1
The present embodiment provides a modular intelligent signal shield unit, please refer to fig. 2, comprising a plurality of shield independent intelligent modules 1, a motherboard 5 and connection lines.
The plurality of independent intelligent modules 1 of the shielding device are arranged on the motherboard 5, and the plurality of independent intelligent modules 1 of the shielding device are connected through connecting wires.
Specifically, the size of the independent intelligent module 1 of the shielding device is far smaller than that of a radio frequency baseband board of the full frequency band of the original shielding device.
In a specific example, the size of the independent intelligent modules 1 of the shielding device may be one to two times of that of a standard mini-PCIE (small PCI Express interface) module, and the number of the independent intelligent modules 1 of the shielding device provided on one motherboard 5 may be 1 to 16, similar to that of a credit card. It can be appreciated that different numbers of independent intelligent modules 1 of the shielding device are arranged according to the actual working frequency band and the size requirement of the shielding device.
In the prior art, the size of the conventional shielding device comprises 250mmx180mm, and the warp of the board card generated in a long-time working under a high-temperature environment is calculated according to 1%, so that the highest single-angle warp height is 3mm. The pitch of the BGA pads on the board is generally less than 1mm, for example, may be 0.8mm or 0.9mm, so that the BGA chip pin is very prone to failure. In this embodiment, the size of each independent intelligent module 1 of the shielding device is smaller than that of a standard credit card, for example, 40mm×51mm, and the warp of the board card generated in a long-time working under a high-temperature environment is calculated by 1%, and the highest single-angle warp height is 0.64mm. Therefore, the shield independent intelligent module 1 in the present embodiment greatly reduces the possibility that thermal stress caused by high temperature damages the BGA chip pin connection.
Therefore, in this embodiment, a plurality of independent intelligent modules 1 of the shielding device are arranged in one shielding device to replace the radio frequency baseband board of the whole frequency band of the original shielding device. When the equipment fails on the user site, the equipment can be powered on again only by replacing the failed independent intelligent module 1 of the shielding device, the rejection rate of the shielding device is reduced, and the wireless frequency band and the standard can be increased or reduced by increasing or reducing the independent intelligent module 1 of the shielding device, so that the equipment is smoothly adapted to the requirements of 2G/3G/4G/5G multiple frequency bands of different regional countries. In addition, the plurality of small-sized shielding independent intelligent modules 1 cause smaller thermal stress of feedback in high-temperature operation, and the failure rate of equipment is reduced.
In addition, the plurality of small-sized shielding independent intelligent modules 1 cause smaller thermal stress of feedback in high-temperature operation, and the failure rate of equipment is reduced.
Further, referring to fig. 3, the independent intelligent module 1 of the shielding device integrally includes a digital baseband chip and N radio frequency transceivers, so as to independently realize the shielding function of wireless signals in a certain frequency band or multiple frequency bands; the digital chip is connected with the N radio frequency transceivers through digital interfaces, wherein N is less than or equal to 2. The size of the shield independent intelligent module 1 is reduced.
In a specific example, the digital baseband chip may be an FPGA (field programmable gate array) or DSP (digital signal processor) chip, or may be different digital baseband chips according to actual requirements.
The present embodiment further includes a motherboard 5 and an inter-board connector 2; the motherboard 5 provides power supply and signal transmission for the independent intelligent module 1 of the shielding device; the shield independent intelligent module 1 is connected with the motherboard 5 through the inter-board connector 2.
In a specific example, any of the shield-independent intelligent modules 1 is connected to the board-to-board connector 2 through a PCI Express (PCIe) interface, and any of the shield-independent intelligent modules 1 is connected to the motherboard 5 through any of the board-to-board connectors 2. It will be appreciated that different types of board connectors 2 may be selected from different materials as the case may be. In another specific example, motherboard 5 may be a PCB board.
Further, the connection lines may be traces on the motherboard 5, including: and a synchronous bus 3.
The inter-board connectors 2 are connected by the synchronous bus 3. Namely, the inter-board connector 2 is sequentially connected on the motherboard 5 through the IO interface of the inter-board connector 2 by the synchronous bus 3, the motherboard 5 can provide power and signal transmission for the independent intelligent modules 1 of the shielding devices, and meanwhile, the synchronous bus 3 is connected to the independent intelligent modules 1 of the shielding devices, so that the synchronization of data transmission and control signals is ensured, and the performance and stability of the equipment are improved.
In this embodiment, the independent intelligent modules 1 (main modules) of the shielding devices can be connected to a network port/serial port/wireless communication circuit to realize communication with external devices, and the timing synchronization and parameter configuration management of all the independent intelligent modules 1 of the other shielding devices in the same shielding device can be controlled through the synchronization bus 3. The main control unit on the motherboard 5 can be connected with the network port/serial port/wireless communication circuit to realize communication with external equipment.
Further, the motherboard 5 includes a power supply circuit and a peripheral interface circuit therein.
The power supply circuit converts the power supplied by the peripheral interface circuit into the working voltage and the working current required by the independent intelligent module 1 of the shielding device.
The peripheral interface circuits include, but are not limited to, ethernet interfaces, RS232, RS485, and wireless communication circuits. The peripheral interface circuit is used for distributing control commands to all the independent intelligent modules 1 and the power amplifier units 4 of the shielding devices through the synchronous bus 3.
The peripheral interface circuit distributes control instructions of external management equipment to all the independent intelligent modules 1 and the power amplifier units 4 of the shielding devices through the synchronous bus 3, and the configuration and the status reporting of parameters of the independent intelligent modules 1 and the power amplifier units 4 of the shielding devices are realized through wired or wireless network management of users.
In addition, the motherboard 5 may further include a main control unit, where the main control unit is usually an MCU chip such as an ARM, and may also be other control chips. And the main control unit is selectively installed according to actual conditions and is used for realizing all functions realized by the peripheral interface circuit.
The motherboard 5 also includes a socket and a cooling fan connected to the shield independent intelligent module 1. Each independent intelligent module 1 of the shielding device and the corresponding power amplification unit 4 realize the suppression of mobile communication signals of one or more radio frequency bands, and a plurality of independent intelligent modules 1 of the shielding devices and the power amplification units 4 in the same shielding device realize the suppression of the full frequency band of the mobile communication signals so as to achieve the shielding effect. According to the actual situation, different types of sockets made of different materials can be selected. The heat dissipation fan is used for dissipating heat for the shielding lacing module. Different heat dissipation devices can be selected according to actual conditions to realize heat dissipation.
The timing synchronization and parameter configuration management of each independent intelligent module 1 of the same shielding device are realized through a control mechanism of the synchronous bus 3, the change of wireless system or frequency band increase is flexibly dealt with, and the smooth upgrading of equipment is realized.
Example two
Referring to fig. 2, the present embodiment provides a modular intelligent signal shielding apparatus, which includes a modular intelligent signal shielding apparatus unit and a plurality of power amplifier units 4 as in the first embodiment.
Any of the power amplifier units 4 supports a signal amplifying function of a wider radio frequency band. For example, the Sub1G power amplifier unit 4 may support N28, band5, and Band8, and for example, the N78 power amplifier unit 4 may support 3300m to 3600m. And, any one of the independent intelligent modules 1 of the shielding device is connected with the corresponding power amplification unit 4 through a coaxial cable and a radio frequency socket, and performs switching and gain control on the power amplification unit 4 through IO and collects power amplification state information.
The modularized intelligent signal shielding device of the embodiment can also have the advantages and beneficial effects of the modularized intelligent signal shielding device unit as in the first embodiment, so that the modularized intelligent signal shielding device has better reliability and flexibility when signal shielding is performed.
Example III
The embodiment provides a modularized intelligent signal shielding method, which controls parameter configuration management and time synchronization of a plurality of independent intelligent modules 1 of a plurality of shields in the same shielding device. The parameter configuration management comprises modification of wireless system configuration parameters of the plurality of independent intelligent modules 1 of the shielding device, time sequence synchronization of cooperative work of the independent intelligent modules of the shielding device is achieved, and any independent intelligent module 1 of the shielding device is enabled to achieve investigation of signals of the air interface base station in a plurality of frequency bands and generate digital baseband interference signals with high correlation with the signals of the air interface base station in real time.
Because the wireless detection and shielding mechanisms of various systems or frequency bands are generally similar, the different algorithms for different systems can be supported in the digital baseband chip through software algorithms. Therefore, the current device can support more wireless systems or frequency bands by installing more independent intelligent modules 1 of the shielding devices, namely, the detection of the air interface base station signals of a certain frequency band or a plurality of frequency bands is realized by one independent intelligent module 1 of the shielding devices, and digital baseband interference signals highly correlated with the air interface base station signals are generated in real time.
In a specific example, the mobile 5G of 758MHz-798MHz, the telecom CDMA/LTE of 869MHz-880MHz and the mobile GSM/FDD/NB of 925MHz-954MHz can be used by a single independent intelligent module 1 of the shielding device to complete the air interface detection and the signal output, or the mobile 5G of 2515MHz-2615MHz and the mobile TD-LTE of 2615MHz-2675MHz can be used by a single independent intelligent module 1 of the shielding device to complete the air interface detection and the signal output. Different parameters can be allocated according to actual conditions, so that a piece of independent intelligent module 1 of the shielding device can realize air interface detection and suppression signal output of signals in different frequency bands, and the wireless system or the change of frequency band increase can be flexibly dealt with, so that smooth upgrading of equipment is realized.
Furthermore, in this embodiment, a set of pull-up resistors are connected to 4 IO interfaces of each board connector 2, so as to control pull-up and pull-down or dial switches of each set of resistors to correspondingly form different number outputs, thereby implementing configuration of ID numbers of devices or modules.
In a specific example, the coding may be performed by using a rule of 0-15, or other coding modes may be set according to actual situations.
When the rule of 0-15 is adopted for coding, the independent intelligent module 1 of the shielding device corresponding to the inter-board connector 2 with the ID number of 0 is used as a master module, other IDs are slave modules, the master module transmits configuration parameters and synchronous time sequences of the upper computer to each slave module through the synchronous bus 3, and the state and alarm information of each slave module are uploaded to the upper computer. The wireless system configuration parameters of the independent intelligent modules 1 of the shielding devices are modified, and the detection of the air interface base station signals is completed on the synchronous time slot corresponding to the serial number of each independent intelligent module 1 of the shielding device.
In addition, a slave module can be set as a standby master module, and the standby master module is automatically switched to the master module after the master module fails.
In summary, the invention replaces the radio frequency baseband board of the original full frequency band of the shielding device by arranging a plurality of shielding device independent intelligent modules 1 in one shielding device. When the equipment fails on the user site, the equipment can be electrified and recovered again only by replacing the failed independent intelligent module 1 of the shielding device, the rejection rate of the shielding device is reduced, and the upgrading requirement of the user on the intelligent digital signal shielding device is met by replacing the independent intelligent module 1 of the shielding device, so that repeated investment and waste are avoided. In addition, the plurality of small-sized shielding independent intelligent modules 1 cause smaller thermal stress of feedback in high-temperature operation, and the failure rate of equipment is reduced.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (8)
1. A modularized intelligent signal shielding device baseband board is characterized by comprising a plurality of shielding device independent intelligent modules, a motherboard, an inter-board connector and a synchronous bus;
a plurality of independent intelligent modules of the shielding devices are arranged on the motherboard; any independent intelligent module of the shielding device is connected with the motherboard through any inter-board connector, and the inter-board connectors are sequentially connected through the synchronous bus;
the independent intelligent module of the shielding device integrally comprises a digital baseband chip and N radio frequency transceivers; the digital baseband chip is connected with the N radio frequency transceivers through digital interfaces, wherein N is less than or equal to 2.
2. The modular intelligent signal shield baseband board of claim 1, wherein parameter configuration management and timing synchronization of a plurality of said shield-independent intelligent modules is accomplished through a synchronous bus control mechanism.
3. A modular intelligent signal shield employing the modular intelligent signal shield baseband board of any of claims 1-2, comprising a plurality of power amplifier units;
any independent intelligent module of the shielding device is in radio frequency connection with the corresponding power amplifier unit through a radio frequency socket and a coaxial cable.
4. The modular intelligent signal shield of claim 3, wherein the motherboard includes power circuitry and peripheral interface circuitry therein;
the power supply circuit converts the total power supply of the shielding device into working voltage and working current required by the independent intelligent module of the shielding device through a direct current-direct current conversion circuit and a linear voltage stabilizing circuit;
the peripheral interface circuit is used for realizing parameter configuration and state reporting of all the independent intelligent modules of the shielding devices and all the power amplifier units.
5. A modular intelligent signal shielding control method employing the modular intelligent signal shielding baseband board of any one of claims 1-2 or the modular intelligent signal shielding of any one of claims 3-4, comprising:
and controlling parameter configuration management and time synchronization of a plurality of independent intelligent modules of the shields in the same shielding device.
6. The modular intelligent signal masking control method as claimed in claim 5, wherein said parameter configuration management comprises modification of wireless system configuration parameters of a plurality of said mask independent intelligent modules.
7. The modular intelligent signal masking control method as recited in claim 5, wherein,
a group of IO (input/output) is connected with a group of pull-up resistors or dial switches in each inter-board connector, the states of the pull-up and pull-down or dial switches of each group of resistors are controlled to generate different numbers for each independent intelligent module of the shielding device, the independent intelligent module of the shielding device with any number is selected as a main module, and the independent intelligent modules of the shielding device with the rest numbers are selected as slave modules.
8. The modular intelligent signal masking control method of claim 7, wherein,
and transmitting the configuration parameters and the synchronous time sequence issued by the external management equipment to the corresponding main module through a synchronous bus, and uploading the state and alarm information of all the independent intelligent modules of the shielding devices to the external management equipment through a peripheral interface circuit or a main control module by the main module.
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