CN116638429B - Adjustable wafer edge polishing device - Google Patents
Adjustable wafer edge polishing device Download PDFInfo
- Publication number
- CN116638429B CN116638429B CN202310737234.3A CN202310737234A CN116638429B CN 116638429 B CN116638429 B CN 116638429B CN 202310737234 A CN202310737234 A CN 202310737234A CN 116638429 B CN116638429 B CN 116638429B
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- polishing
- wall
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- frame
- cleaning
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- 238000005498 polishing Methods 0.000 title claims abstract description 213
- 238000004140 cleaning Methods 0.000 claims abstract description 75
- 229920000742 Cotton Polymers 0.000 claims abstract description 54
- 239000007788 liquid Substances 0.000 claims abstract description 53
- 238000009423 ventilation Methods 0.000 claims abstract description 20
- 238000009434 installation Methods 0.000 claims abstract description 12
- 230000000712 assembly Effects 0.000 claims description 8
- 238000000429 assembly Methods 0.000 claims description 8
- 241000219146 Gossypium Species 0.000 abstract description 48
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000227 grinding Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000013043 chemical agent Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
- B24B29/04—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for rotationally symmetrical workpieces, e.g. ball-, cylinder- or cone-shaped workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The invention discloses an adjustable wafer edge polishing device, which comprises: the polishing device comprises a polishing base, a polishing mechanism, a cleaning mechanism and a cleaning mechanism, wherein the polishing mechanism is arranged in the polishing base and comprises a driving part, a polishing table and a polishing pad, the driving part is arranged in the polishing base, the polishing table is arranged on the driving part, the polishing pad is arranged on the top of the outer wall of the polishing table, the cleaning mechanism is arranged in the polishing table and comprises a moving part, a plurality of groups of installation parts, a plurality of first cleaning cottons and a plurality of second cleaning cottons. This wafer edge burnishing device with adjustable, shift out the polishing platform through moving part drive multiunit installation component, along with the rotation of polishing platform, make every first clean cotton and the clean cotton clearance of second to receiving liquid frame internal surface polishing liquid residue, avoid receiving remaining polishing liquid on the inner wall of liquid frame, be inconvenient for clean, clean inefficiency, cooperation cleaning tube improves clean effect, through ventilation mechanism for the inside circulation of air of polishing base.
Description
Technical Field
The invention belongs to the technical field of wafer polishing, and particularly relates to an adjustable wafer edge polishing device.
Background
In the semiconductor industry, a silicon wafer used for manufacturing a semiconductor integrated circuit is called a wafer, and in the process of wafer processing, the wafer generally includes peripheral grinding, slicing, grinding, etching, polishing and other steps, and when the wafer is polished, a wafer polishing apparatus is required to be used, and the polishing apparatus can effectively polish the surface of the wafer.
In the process of polishing, grinding and the like of a semiconductor wafer, a large amount of polishing liquid is required to be used, the main components of the polishing liquid are abrasive particles and chemical agents, the abrasive particles mechanically grind the wafer, the chemical agents react with surface materials of the wafer, so that uneven surface substances are removed, the polishing liquid needs to be recovered and recycled after the work is finished, however, the polishing liquid inevitably remains or crystallizes on the inner wall of a liquid discharge groove when flowing through the liquid discharge groove, and therefore, the surface residues of the liquid discharge groove need to be cleaned.
The existing cleaning mode is that after the processing is finished, the cleaning is performed through a manual brushing mode, the gap between the inner wall of the liquid discharge groove and the polishing table is smaller, the liquid discharge groove is inconvenient to clean, the difficulty of a cleaning process is increased, the cleaning efficiency is low, and time and labor are wasted.
Disclosure of Invention
The invention aims at: the polishing table is moved out through the multiunit installation component of moving part drive, along with the rotation of polishing table, makes every first clean cotton and the clean cotton of second clear up receipts liquid frame internal surface polishing liquid residue, avoids receiving remaining polishing liquid on the inner wall of liquid frame, is inconvenient for clean, and cleaning efficiency is low, and cooperation cleaning tube improves clean effect, through ventilation mechanism for the inside air circulation of polishing base to accelerate the inside first clean cotton of polishing table and the clean cotton drying rate of second.
The technical scheme adopted by the invention is as follows: an adjustable wafer edge polishing apparatus comprising:
polishing a base;
the polishing mechanism is arranged in the polishing base and comprises a driving part, a polishing table and a polishing pad, wherein the driving part is arranged in the polishing base, the polishing table is arranged on the driving part, and the polishing pad is arranged at the top of the outer wall of the polishing table;
the cleaning mechanism is arranged in the polishing table and comprises a moving part, a plurality of groups of mounting parts, a plurality of first cleaning cotton and a plurality of second cleaning cotton, wherein the moving part is arranged on the polishing table, each group of mounting parts are arranged on the moving part, each first cleaning cotton is arranged on each mounting part, and each second cleaning cotton is arranged on each mounting part;
the liquid collecting frame is fixedly embedded at the top of the outer wall of the polishing base, and a plurality of cleaning pipes are embedded at one side of the outer wall of the liquid collecting frame along the circumferential direction at equal intervals; and
and the ventilation mechanism is arranged on the polishing table.
The polishing motor is mounted at the bottom of the inner wall of the polishing base through bolts, the rotating shaft is fixedly arranged at the output end of the polishing motor, and the rotating shaft is fixedly embedded at the top of the inner wall of the polishing table.
The polishing device comprises a polishing table, a moving part, a polishing plate and a polishing assembly, wherein the moving part comprises a rotating motor, an external gear, an internal gear, a rotating plate and four groups of moving assemblies, the rotating motor is mounted on the top of the inner wall of the polishing table through bolts, the external gear is fixedly arranged at the output end of the rotating motor, the rotating plate is rotationally embedded in the inner wall of the polishing table, the internal gear is fixedly arranged on the top of the outer wall of the rotating plate, the internal gear is meshed with the external gear, and each group of moving assemblies are all arranged on the rotating plate along the circumferential direction at equal intervals.
Each group of moving assemblies comprises a cam hole and a moving shaft, the cam holes are formed in the top of the outer wall of the rotating plate, and the moving shafts are slidably embedded in the inner wall of the cam holes.
Wherein, every group installation component all includes installing frame, folding frame, installation axle and folding subassembly, the fixed outer wall bottom that sets up in the removal axle of installing frame, and the installing frame slip runs through in outer wall one side of polishing table to the installing frame is fixed to be set up in the outer wall top of first clean cotton, the inner wall that sets up in installing frame is close to one side edge, folding frame movable sleeve locates the outer wall of installation axle, folding subassembly locates between installing frame and the folding frame, folding frame is fixed to be set up in the outer wall one side of the clean cotton of second.
Each group of folding components comprises a folding motor, a first connecting rod, a second connecting rod and a second connecting shaft, the folding motor is arranged at the bottom of the inner wall of the frame through a bolt, one end of the first connecting rod is fixedly sleeved at the output end of the folding motor, the first connecting rod is connected with the second connecting rod through a rotating shaft, the second connecting shaft is fixedly arranged on the inner wall of the folding frame, and one end of the second connecting rod is movably sleeved at the outer wall of the second connecting shaft.
The ventilation mechanism comprises a plurality of ventilation holes, a large gear and a plurality of groups of rotating parts, each ventilation hole is formed in the bottom of the outer wall of the polishing table, the large gear is fixedly sleeved on the outer wall of the polishing table, and each group of rotating parts are arranged in the polishing base.
Each group of rotating parts comprises a rotating shaft, a pinion and fan blades, the rotating shaft is rotationally embedded at the top of the inner wall of the polishing base, the pinion is fixedly sleeved on the outer wall of the rotating shaft and meshed with the pinion, and the fan blades are fixedly sleeved on the outer wall of the rotating shaft close to the bottom edge.
The top of the outer wall of the polishing base is fixedly provided with a dropper, and one side of the outer wall of the dropper is fixedly provided with a dropper pipe.
The polishing device comprises a polishing base, wherein a polishing controller is fixedly arranged at the top of the outer wall of the polishing base, and a swing arm support is arranged at the top of the outer wall of the polishing base.
In summary, due to the adoption of the technical scheme, the beneficial effects of the invention are as follows:
(1) According to the invention, the plurality of groups of mounting components are driven by the moving component to move out of the polishing table, and each first cleaning cotton and each second cleaning cotton are enabled to clean polishing liquid residues on the inner surface of the liquid collecting frame along with the rotation of the polishing table, so that the polishing liquid residues on the inner wall of the liquid collecting frame are avoided, the cleaning is inconvenient, the cleaning efficiency is low, and the cleaning effect is improved by matching with the cleaning pipe.
(2) According to the invention, through the ventilation mechanism, the ventilation of the polishing base is quickened, so that the drying speeds of the first cleaning cotton and the second cleaning cotton in the polishing table are quickened.
Drawings
FIG. 1 is a perspective view of a first view of the present invention;
FIG. 2 is a second perspective view of the present invention;
FIG. 3 is a third perspective view of the present invention;
FIG. 4 is a partial cross-sectional view of the present invention;
FIG. 5 is a schematic view of a portion of the structure of the present invention;
FIG. 6 is a schematic view of a portion of the structure of the present invention;
FIG. 7 is a schematic view of the structure of the polishing table of the present invention;
FIG. 8 is a schematic view of a mounting frame of the present invention;
FIG. 9 is a partial exploded view of the present invention;
fig. 10 is an enlarged schematic view of fig. 4 a in accordance with the present invention.
The marks in the figure: 1. polishing a base; 2. a polishing mechanism; 201. a polishing table; 202. a polishing pad; 203. polishing a motor; 204. a rotating shaft; 3. a cleaning mechanism; 301. a first cleaning cotton; 302. a second cleaning cotton; 303. a rotating motor; 304. an external gear; 305. an internal gear; 306. a rotating plate; 307. a cam hole; 308. a movable shaft; 309. a mounting frame; 310. a folding frame; 311. a mounting shaft; 312. a folding motor; 313. a first link; 314. a second link; 315. a second connecting shaft; 4. a liquid receiving frame; 5. cleaning the tube; 6. a ventilation mechanism; 601. a vent hole; 602. a large gear; 603. a rotation shaft; 604. a pinion gear; 605. fan blades; 7. a dropping device; 8. a material dropping pipe; 9. a polishing controller; 10. swing arm support.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Embodiment one, referring to fig. 1-10: an adjustable wafer edge polishing apparatus comprising:
a polishing base 1;
the polishing mechanism 2 is arranged in the polishing base 1, the polishing mechanism 2 comprises a driving component, a polishing table 201 and a polishing pad 202, the driving component is arranged in the polishing base 1, the polishing table 201 is arranged on the driving component, and the polishing pad 202 is arranged on the top of the outer wall of the polishing table 201;
the cleaning mechanism 3 is arranged in the polishing table 201, the cleaning mechanism 3 comprises a moving part, a plurality of groups of mounting parts, a plurality of first cleaning cotton 301 and a plurality of second cleaning cotton 302, the moving part is arranged on the polishing table 201, each group of mounting parts is arranged on the moving part, each first cleaning cotton 301 is arranged on each mounting part, and each second cleaning cotton 302 is arranged on each mounting part;
the liquid collecting frame 4 is fixedly embedded at the top of the outer wall of the polishing base 1, and a plurality of cleaning pipes 5 are embedded at one side of the outer wall of the liquid collecting frame 4 along the circumferential direction at equal intervals; and
the ventilation mechanism 6 is provided on the polishing table 201.
In this embodiment: a controller is fixedly arranged on one side of the outer wall of the polishing base 1 and used for controlling and adjusting the rotating speed of the polishing table 201 driven by the driving component so as to facilitate polishing treatment on the edge of a wafer, the polishing table 201 is driven by the driving component to rotate on the polishing base 1, the edge of the wafer is polished by the polishing pad 202, polishing liquid is collected by the liquid collecting frame 4, a liquid collecting pipe is fixedly arranged at the bottom of the outer wall of the liquid collecting frame 4 and connected with an external collecting device, the collection of the polishing liquid is realized, meanwhile, the liquid collecting frame 4 plays a role of shielding, the splashing range of the polishing liquid along with the polishing table 201 is reduced, the polishing liquid is prevented from splashing, pollution is caused, the polishing table 201 movably penetrates through the bottom of the outer wall of the liquid collecting frame 4, the polishing liquid inside the liquid collecting frame 4 can be cleaned by the cleaning mechanism 3, the liquid collecting frame 4 is cleaned, the polishing solution is not convenient to clean, the cleaning efficiency is low, the multiple groups of installation components are driven by the moving component to move out of the polishing table 201, along with the rotation of the polishing table 201, each first cleaning cotton 301 and each second cleaning cotton 302 are used for cleaning residues on the polishing solution on the inner surface of the liquid collecting frame 4, the ventilation mechanism 6 is used for accelerating the air circulation inside the polishing base 1, so that the drying speed of the first cleaning cotton 301 and the second cleaning cotton 302 inside the polishing table 201 is accelerated, the liquid collecting frame 4 is a liquid discharge groove in a polishing device, one end of the cleaning pipe 5 is connected with a water pump and an external water source through a pipeline, the cleaning effect is improved, and the cleaning efficiency can be improved due to the arrangement of the multiple first cleaning cottons 301 and the multiple second cleaning cottons 302.
Specifically, the driving part includes a polishing motor 203 and a rotating shaft 204, the polishing motor 203 is mounted on the bottom of the inner wall of the polishing base 1 through bolts, the rotating shaft 204 is fixedly arranged at the output end of the polishing motor 203, and the rotating shaft 204 is fixedly embedded in the top of the inner wall of the polishing table 201.
In this embodiment: the polishing motor 203 drives the rotating shaft 204 to rotate under the condition of being electrified, and the polishing pad 202 on the polishing table 201 rotates due to the fixed connection between the rotating shaft 204 and the polishing table 201, so that the edge of the wafer is polished.
Specifically, the moving parts include a rotating motor 303, an external gear 304, an internal gear 305, a rotating plate 306 and four groups of moving components, the rotating motor 303 is mounted on the top of the inner wall of the polishing table 201 through bolts, the external gear 304 is fixedly arranged at the output end of the rotating motor 303, the rotating plate 306 is rotationally embedded in the inner wall of the polishing table 201, the internal gear 305 is fixedly arranged on the top of the outer wall of the rotating plate 306, the internal gear 305 is meshed with the external gear 304, and each group of moving components are equidistantly arranged on the rotating plate 306 along the circumferential direction.
In this embodiment: the external gear 304 is driven to rotate under the condition of energizing through the rotating motor 303, the internal gear 305 can be driven to drive the rotating plate 306 to rotate, so that each group of moving components are synchronously driven to move, the rotating plate 306 is movably sleeved on the outer wall of the rotating shaft 204, the cross section of the rotating plate 306 is in a circular shape, and each mounting frame 309 is driven to move through each group of moving components.
Specifically, each group of moving components includes a cam hole 307 and a moving shaft 308, the cam hole 307 is formed on the top of the outer wall of the rotating plate 306, and the moving shaft 308 is slidably embedded in the inner wall of the cam hole 307.
In this embodiment: along with the rotation of the rotating plate 306 in the polishing table 201, the position of the cam hole 307 can be changed, so that the cam hole 307 pushes the moving shaft 308 to drive the mounting frame 309 to move, and therefore the first cleaning cotton 301 on the mounting frame 309 leaves the inside of the polishing table 201 and is located above the bottom of the inner wall of the liquid receiving frame 4, and the bottom of the inner wall of the liquid receiving frame 4 is cleaned.
Specifically, each set of mounting members includes a mounting frame 309, a folding frame 310, a mounting shaft 311 and a folding assembly, the mounting frame 309 is fixedly disposed at the bottom of the outer wall of the movable shaft 308, and the mounting frame 309 is slidably disposed on one side of the outer wall of the polishing table 201, and the mounting frame 309 is fixedly disposed at the top of the outer wall of the first cleaning cotton 301, the mounting shaft 311 is fixedly disposed on the inner wall of the mounting frame 309 near one side edge, the folding frame 310 is movably disposed on the outer wall of the mounting shaft 311, the folding assembly is disposed between the mounting frame 309 and the folding frame 310, and the folding frame 310 is fixedly disposed on one side of the outer wall of the second cleaning cotton 302.
In this embodiment: a plurality of limiting holes are formed in one side of the outer wall of the polishing table 201 along the circumferential direction at equal intervals, each mounting frame 309 penetrates through the inner wall of each limiting hole in a sliding mode, each limiting hole is larger than the cross section of each mounting frame 309, when the mounting frame 309 is retracted, the first cleaning cotton 301 and the second cleaning cotton 302 can be extruded, liquid in the first cleaning cotton 301 and the second cleaning cotton 302 is removed, the mounting frames 309 and the folding frames 310 can be changed from horizontal to vertical through the mounting shafts 311, the folding frames 310 rotate on the mounting shafts 311 and are matched with the folding assemblies, the second cleaning cotton 302 can be attached to the inner surface of the liquid collecting frame 4, the inner surface of the liquid collecting frame 4 is cleaned, folding processing is carried out on the folding frames 310 through the folding assemblies, and the inner packages of the folding frames 310 are arranged on the folding assemblies.
Specifically, each group of folding assemblies includes a folding motor 312, a first connecting rod 313, a second connecting rod 314 and a second connecting shaft 315, the folding motor 312 is mounted on the bottom of the inner wall of the frame 309 by bolts, one end of the first connecting rod 313 is fixedly sleeved on the output end of the folding motor 312, the first connecting rod 313 is connected with the second connecting rod 314 by a rotating shaft, the second connecting shaft 315 is fixedly arranged on the inner wall of the folding frame 310, and one end of the second connecting rod 314 is movably sleeved on the outer wall of the second connecting shaft 315.
In this embodiment: the first connecting rod 313 is driven to rotate by the folding motor 312 under the condition of being electrified, one end of the first connecting rod 313 pulls the second connecting rod 314 to rotate on the rotating shaft, so that one end of the second connecting rod 314 pulls the folding frame 310 on the second connecting shaft 315 to rotate on the mounting shaft 311, and the folding frame 310 is supported or the folding frame 310 is folded and stored in the mounting frame 309.
Specifically, the ventilation mechanism 6 includes a plurality of ventilation holes 601, a large gear 602 and a plurality of groups of rotating members, each ventilation hole 601 is formed in the bottom of the outer wall of the polishing table 201, the large gear 602 is fixedly sleeved on the outer wall of the polishing table 201, and each group of rotating members is arranged in the polishing base 1.
In this embodiment: the inside of the polishing table 201 is communicated with the inside of the polishing base 1 through the ventilation hole 601, and the large gear 602 can be driven to rotate along with the rotation of the polishing table 201, so that each group of rotating parts is driven, and the ventilation of the inside of the polishing table 201 is quickened by the rotating parts.
Specifically, each group of rotating components comprises a rotating shaft 603, a pinion 604 and fan blades 605, the rotating shaft 603 is rotationally embedded at the top of the inner wall of the polishing base 1, the pinion 604 is fixedly sleeved on the outer wall of the rotating shaft 603, the pinion 604 is meshed with the large gear 602, and the fan blades 605 are fixedly sleeved on the outer wall of the rotating shaft 603 near the bottom edge.
In this embodiment: through rotation axis 603, be used for the installation and the placement of pinion 604 and fan blade 605, along with the rotatory rotation of gear wheel 602, can drive every pinion 604 and drive rotation axis 603 and rotate on polishing base 1, make the fan blade 605 rotatory, accelerate the inside air circulation of polishing platform 201 to accelerate the inside first clean cotton 301 of polishing platform 201 and the dry speed of second clean cotton 302.
Specifically, the outer wall top of polishing base 1 is fixed and is provided with drop feed ware 7, and the outer wall one side of drop feed ware 7 is fixed and is provided with drop feed pipe 8.
In this embodiment: through the dropper 7, for placing the polishing solution, one end of the dropper pipe 8 is fixedly provided with a dropper head, so that the polishing solution can drop on the polishing pad 202, and the polishing solution reacts with the surface material of the wafer to remove the rugged substance on the surface.
Specifically, the outer wall top of polishing base 1 is fixed and is provided with grinds throwing control appearance 9, and swing arm support 10 is installed at the outer wall top of polishing base 1.
In this embodiment: through grinding and polishing control appearance 9 for the installation and the placing of wafer, grinding and polishing control appearance 9 is located the inside of swing arm support 10, through swing arm support 10, restrict the position of grinding and polishing control appearance 9, swing arm support 10, grinding and polishing control appearance 9, drip 7, folding motor 312, rotary motor 303 and polishing motor 203's power comes from external power source, it should with external power source electric connection, its internal circuit principle structure belongs to the common sense of the person skilled in the art, and not described in detail here, its model can be selected according to the in-service use condition.
When in use, firstly, a wafer is placed on the polishing controller 9, then the polishing controller 9 is placed on the polishing pad 202 and is positioned in the swing arm bracket 10, then the polishing motor 203 is started to drive the rotating shaft 204 to rotate, so that the polishing pad 202 on the polishing table 201 rotates, the edge of the wafer is polished, after polishing is finished, the polishing controller 9 is removed, the rotating motor 303 is started again to drive the external gear 304 to rotate, the internal gear 305 is driven to drive the rotating plate 306 to rotate, the position of the cam hole 307 can be changed along with the rotation of the rotating plate 306 in the polishing table 201, the cam hole 307 drives the movable shaft 308 to drive the mounting frame 309 to move, thus the first cleaning cotton 301 on the mounting frame 309 leaves the inside of the polishing table 201, the folding motor 312 is started again to drive the first connecting rod 313 to rotate, one end of the first connecting rod 313 pulls the second connecting rod 314 to rotate on the rotating shaft, one end of the second connecting rod 314 is pulled to rotate the folding frame 310 on the second connecting shaft 315 on the mounting shaft 311, the folding frame 310 is vertically arranged between the folding frame 310 and the mounting frame 309, the second cleaning cotton 302 is attached to the inner surface of the liquid collecting frame 4, the first cleaning cotton 301 and the second cleaning cotton 302 can be driven to clean residues of polishing liquid on the inner surface of the liquid collecting frame 4 along with the rotation of the polishing table 201 on the liquid collecting frame 4, the cleaning effect can be improved by matching with the cleaning pipe 5, after the cleaning of the inner surface of the liquid collecting frame 4 is completed, the folding frame 310 is folded and accommodated in the mounting frame 309, the mounting frame 309 passes through the limiting hole and enters the polishing table 201, the limiting hole extrudes the first cleaning cotton 301 and the second cleaning cotton 302, when the polishing table 201 rotates, the large gear 602 can be driven to rotate, each small gear 604 can be driven to drive the rotating shaft 603 to rotate on the polishing base 1 due to the meshing between the small gears 604 and the large gear 602, the fan blade 605 is rotated to accelerate the air circulation inside the polishing table 201, thereby accelerating the drying speed of the first cleaning cotton 301 and the second cleaning cotton 302 inside the polishing table 201.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (7)
1. An adjustable wafer edge polishing apparatus, comprising:
a polishing base (1);
the polishing mechanism (2) is arranged in the polishing base (1), the polishing mechanism (2) comprises a driving component, a polishing table (201) and a polishing pad (202), the driving component is arranged in the polishing base (1), the polishing table (201) is arranged on the driving component, and the polishing pad (202) is arranged at the top of the outer wall of the polishing table (201);
the cleaning mechanism (3) is arranged in the polishing table (201), the cleaning mechanism (3) comprises a moving part, a plurality of groups of mounting parts, a plurality of first cleaning cotton (301) and a plurality of second cleaning cotton (302), the moving part is arranged on the polishing table (201), each group of mounting parts is arranged on the moving part, each first cleaning cotton (301) is arranged on each mounting part, and each second cleaning cotton (302) is arranged on each mounting part;
the liquid collecting frame (4) is fixedly embedded at the top of the outer wall of the polishing base (1), and a plurality of cleaning pipes (5) are embedded at one side of the outer wall of the liquid collecting frame (4) along the circumferential direction at equal intervals; and
a ventilation mechanism (6) arranged on the polishing table (201);
the movable part comprises a rotary motor (303), an external gear (304), an internal gear (305), a rotary plate (306) and four groups of movable components, wherein the rotary motor (303) is installed at the top of the inner wall of the polishing table (201) through bolts, the external gear (304) is fixedly arranged at the output end of the rotary motor (303), the rotary plate (306) is rotationally embedded in the inner wall of the polishing table (201), the internal gear (305) is fixedly arranged at the top of the outer wall of the rotary plate (306), the internal gear (305) is meshed with the external gear (304), and each group of movable components are equidistantly arranged on the rotary plate (306) along the circumferential direction;
each group of moving assemblies comprises a cam hole (307) and a moving shaft (308), the cam holes (307) are formed in the top of the outer wall of the rotating plate (306), and the moving shafts (308) are slidably embedded in the inner wall of the cam holes (307);
every group installation component all includes installing frame (309), folding frame (310), installation axle (311) and folding subassembly, installing frame (309) is fixed to be set up in the outer wall bottom of removal axle (308), and installing frame (309) slip runs through in the outer wall one side of polishing table (201) to installing frame (309) is fixed to be set up in the outer wall top of first clean cotton (301), the inner wall that installing frame (309) is close to one side edge in fixed setting of installation axle (311), the outer wall of installing axle (311) is located to folding frame (310) movable sleeve, folding subassembly locates between installing frame (309) and folding frame (310), folding frame (310) is fixed to be set up in the outer wall one side of second clean cotton (302).
2. An adjustable wafer edge polishing apparatus as defined in claim 1, wherein: the driving part comprises a polishing motor (203) and a rotating shaft (204), the polishing motor (203) is mounted on the bottom of the inner wall of the polishing base (1) through bolts, the rotating shaft (204) is fixedly arranged at the output end of the polishing motor (203), and the rotating shaft (204) is fixedly embedded in the top of the inner wall of the polishing table (201).
3. An adjustable wafer edge polishing apparatus as defined in claim 1, wherein: each group of folding components comprises a folding motor (312), a first connecting rod (313), a second connecting rod (314) and a second connecting shaft (315), the folding motor (312) is arranged at the bottom of the inner wall of the frame (309) through bolts, one end of the first connecting rod (313) is fixedly sleeved at the output end of the folding motor (312), the first connecting rod (313) is connected with the second connecting rod (314) through a rotating shaft, the second connecting shaft (315) is fixedly arranged on the inner wall of the folding frame (310), and one end of the second connecting rod (314) is movably sleeved at the outer wall of the second connecting shaft (315).
4. An adjustable wafer edge polishing apparatus as recited in claim 3, wherein: the ventilation mechanism (6) comprises a plurality of ventilation holes (601), a large gear (602) and a plurality of groups of rotating parts, each ventilation hole (601) is formed in the bottom of the outer wall of the polishing table (201), the large gear (602) is fixedly sleeved on the outer wall of the polishing table (201), and each group of rotating parts is arranged in the polishing base (1).
5. An adjustable wafer edge polishing apparatus as recited in claim 4, wherein: each group of rotating parts comprises a rotating shaft (603), a pinion (604) and fan blades (605), the rotating shaft (603) is rotationally embedded at the top of the inner wall of the polishing base (1), the pinion (604) is fixedly sleeved on the outer wall of the rotating shaft (603), the pinion (604) is meshed with the large gear (602), and the fan blades (605) are fixedly sleeved on the outer wall of the rotating shaft (603) close to the bottom edge.
6. An adjustable wafer edge polishing apparatus as recited in claim 4, wherein: the top of the outer wall of the polishing base (1) is fixedly provided with a dropper (7), and one side of the outer wall of the dropper (7) is fixedly provided with a dropper tube (8).
7. An adjustable wafer edge polishing apparatus as recited in claim 4, wherein: the polishing device is characterized in that a polishing controller (9) is fixedly arranged at the top of the outer wall of the polishing base (1), and a swing arm support (10) is arranged at the top of the outer wall of the polishing base (1).
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| CN202310737234.3A CN116638429B (en) | 2023-06-20 | 2023-06-20 | Adjustable wafer edge polishing device |
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| CN202310737234.3A CN116638429B (en) | 2023-06-20 | 2023-06-20 | Adjustable wafer edge polishing device |
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| CN116638429B true CN116638429B (en) | 2024-01-16 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117506703B (en) * | 2023-12-01 | 2024-05-10 | 苏州博宏源机械制造有限公司 | Measuring device and polishing system |
| CN117655898A (en) * | 2023-12-07 | 2024-03-08 | 佛山市顺德区顺崇机械制造有限公司 | Automatic polishing device for side edges of target material and using method thereof |
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| CN116638429A (en) | 2023-08-25 |
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Address after: East workshop on the first floor, No. 22, Aigehao Road, Weitang Town, Xiangcheng District, Suzhou City, Jiangsu Province, 215100 Patentee after: Suzhou Bohongyuan Equipment Co.,Ltd. Country or region after: China Address before: East workshop on the first floor, No. 22, Aigehao Road, Weitang Town, Xiangcheng District, Suzhou City, Jiangsu Province, 215100 Patentee before: SUZHOU BOHONGYUAN MACHINERY MANUFACTURING Co.,Ltd. Country or region before: China |