CN116634541B - Power supply circuit, power supply method and electronic equipment - Google Patents
Power supply circuit, power supply method and electronic equipment Download PDFInfo
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- CN116634541B CN116634541B CN202310887847.5A CN202310887847A CN116634541B CN 116634541 B CN116634541 B CN 116634541B CN 202310887847 A CN202310887847 A CN 202310887847A CN 116634541 B CN116634541 B CN 116634541B
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- 230000005236 sound signal Effects 0.000 claims description 25
- 238000004146 energy storage Methods 0.000 claims description 17
- 239000003990 capacitor Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 8
- 238000010295 mobile communication Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 5
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W52/00—Power management, e.g. TPC [Transmission Power Control], power saving or power classes
- H04W52/02—Power saving arrangements
- H04W52/0209—Power saving arrangements in terminal devices
- H04W52/0251—Power saving arrangements in terminal devices using monitoring of local events, e.g. events related to user activity
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0063—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with circuits adapted for supplying loads from the battery
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W52/00—Power management, e.g. TPC [Transmission Power Control], power saving or power classes
- H04W52/02—Power saving arrangements
- H04W52/0209—Power saving arrangements in terminal devices
- H04W52/0261—Power saving arrangements in terminal devices managing power supply demand, e.g. depending on battery level
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/02—Terminal devices
- H04W88/06—Terminal devices adapted for operation in multiple networks or having at least two operational modes, e.g. multi-mode terminals
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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- Power Engineering (AREA)
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Abstract
The application discloses a power supply circuit, a power supply method and electronic equipment, which relate to the field of terminals and are used for reducing time division distortion noise and cost of the electronic equipment in the process that a user uses a receiver of the electronic equipment to answer a call when the network system of the electronic equipment is a global mobile communication system. The power supply circuit includes: the device comprises a processor, a battery, a first power module and a first diode. The first diode and the first power supply module are connected in parallel between the battery and the audio power amplifier; the battery is also used for being coupled to the second generation radio frequency module, and the processor is also coupled to the control end of the first power supply module. When the electronic equipment performs communication through the second generation radio frequency module: if the communication mode of the electronic equipment is the earphone mode, the processor controls the first power module to work so as to boost the voltage of the battery and output the boosted voltage to the audio power amplifier after the power supply rejection ratio is improved; and if the communication mode of the electronic equipment is the play mode, the processor controls the first power supply module to stop working.
Description
Technical Field
The embodiment of the application relates to the field of terminals, in particular to a power supply circuit, a power supply method and electronic equipment.
Background
Global system for mobile communications (global system for mobile communications, GSM) uses time division multiple access (time division multiple access, TDMA) time slot sharing techniques. Under the GSM network system, the second generation (second generation, 2G) radio frequency power amplifier of the electronic equipment (such as a mobile phone) can transmit signals once every 4.615ms (217 Hz), and large current (such as 1.5A) is consumed during signal transmission. Because of the internal resistance of the power supply, the voltage of the power supply also has an instant voltage drop every 4.615 ms. That is, the voltage of the power supply may produce a voltage dip of 217 Hz. Meanwhile, since the 2G radio frequency power amplifier and the audio power amplifier share a power supply, a voltage drop of 217Hz is conducted into an audio signal path, so that time division distortion (time division distortion, TDD) noise audible to human ears is generated by the electronic device, and the experience of a user when the user uses an earphone of the electronic device to answer a call is affected.
Disclosure of Invention
The application provides a power supply circuit, a power supply method and electronic equipment, which are used for reducing TDD noise of the electronic equipment in the process that a user uses a receiver of the electronic equipment to answer a call when the network system of the electronic equipment is a GSM network system, so that the experience of the user when the user uses the receiver of the electronic equipment to answer the call is improved, and the cost is reduced.
In order to achieve the above purpose, the application adopts the following technical scheme:
in a first aspect, a power supply circuit is provided that may include a processor, a battery, a first power module, and a first diode. Wherein the anode of the first diode is coupled to the battery, and the cathode of the first diode is used for being coupled to a power supply end of an audio power amplifier in the electronic device. An input of the first power supply module is coupled to the battery, and an output of the first power supply module is configured to be coupled to a power supply of the audio power amplifier. The battery is also used for coupling to a power supply terminal of a 2G radio frequency module in the electronic device. The processor is also coupled to a control terminal of the first power module. The first power supply module is used for boosting the voltage of the battery and outputting the voltage to the audio power amplifier after the power supply rejection ratio is improved. When the electronic equipment applying the power supply circuit performs a call through the 2G radio frequency module, the processor in the power supply circuit is used for controlling the first power supply module to work or not work according to the call mode. Specifically, when the communication mode of the electronic device is the earphone mode, the processor is used for controlling the first power module to work; when the communication mode of the electronic device is the play mode, the processor is used for controlling the first power module to stop working.
When the electronic equipment is in communication through the 2G radio frequency module and the communication mode is the earphone mode, the first power module boosts the voltage of the battery, so that the first diode is in an open circuit state, and the battery supplies power to the audio power amplifier through the first power module. Meanwhile, the first power supply module is further used for outputting the voltage of the battery to the audio power amplifier after the power supply rejection ratio is improved, so that the conversation of the electronic equipment through the 2G radio frequency module can be reduced, TDD noise generated when the electronic equipment is in a receiver mode is reduced, and conversation experience of a user is further improved. When the electronic equipment is in a call through the 2G radio frequency module and the call mode is an external-amplifier mode, the loudspeaker is far away from the human ear, TDD noise does not need to be reduced, and therefore the battery can directly supply power to the audio power amplifier through the first diode. Therefore, the first power supply module only needs to meet the power consumption requirement of the earphone with smaller power consumption. The power consumption of the earphone is smaller than that of the loudspeaker, so that the cost of the first power supply module is lower. In addition, the first power supply module only improves the power supply rejection ratio of the voltage of the battery in the earphone mode, reduces one-path power supply conversion, and accordingly improves the system efficiency of the electronic equipment.
In a possible implementation manner of the first aspect, the first power module may include an energy storage element and a power chip. The input end of the power supply chip is coupled to the battery through the energy storage element, and the output end of the power supply chip is coupled to the power supply end of the audio power amplifier. If the communication mode of the electronic equipment is the earphone mode, the processor is used for controlling the power chip to work. Therefore, under the cooperation of the power chip and the energy storage element, the voltage of the battery is boosted, the power supply rejection ratio is improved, and then the voltage is output to the audio power amplifier, so that TDD noise generated when the electronic equipment is in communication through the 2G radio frequency module is reduced. If the communication mode of the electronic equipment is the play mode, the processor is used for controlling the power chip to stop working, so that one-path power supply conversion is reduced, and the system efficiency of the electronic equipment is improved.
In a possible implementation manner of the first aspect, the energy storage element may be a capacitor, and the power supply chip may be a charge pump type boost power supply chip.
In a possible implementation manner of the first aspect, the energy storage element may be an inductor, and the power supply chip may be a boost (boost) power supply chip.
In a possible implementation manner of the first aspect, the power supply circuit may further include a second diode. The anode of the second diode may be coupled to the output of the first power supply module, and the cathode of the second diode is configured to be coupled to the supply terminal of the audio power amplifier. The second diode can be used for preventing current from flowing backwards, so that elements in the power supply circuit are protected, and normal operation of the power supply circuit is ensured.
In a possible implementation manner of the first aspect, the power supply circuit may further include a second power supply module. An input of the second power supply module may be coupled to the battery and an output of the second power supply module may be configured to be coupled to a power supply of an audio codec module of the electronic device. The signal output of the audio codec module is coupled to the signal input of the audio power amplifier, and the signal input of the audio codec may be coupled to the output of the processor. The second power module is used for reducing the voltage of the battery and outputting the voltage to the audio coding and decoding module after the power supply rejection ratio is improved so as to reduce the influence of TDD noise on the audio coding and decoding module. The audio encoding and decoding module is used for converting the digital audio signal from the processor into an analog audio signal and outputting the analog audio signal to the audio power amplifier.
In a possible implementation manner of the first aspect, the power supply circuit further includes a third power supply module. The input end of the third power supply module is coupled to the battery, and the output end of the third power supply module is coupled to the power supply end of the processor. The third power module is used for reducing the voltage of the battery and improving the power supply rejection ratio and then outputting the voltage to the processor so as to reduce the influence of TDD noise on the processor.
In a second aspect, a method of supplying power is provided. The power supply method may be applied to the power supply circuit described in the first aspect and any possible implementation manner thereof. The power supply method comprises the following steps: if the communication mode of the electronic equipment is the earphone mode, a processor of the power supply circuit controls a first power supply module in the power supply circuit to work; and if the communication mode of the electronic equipment is the play mode, the processor of the power supply circuit controls the first power supply module in the power supply circuit to stop working.
In a third aspect, an electronic device is provided. The electronic device comprises a memory and a power supply circuit as described in the first aspect and any one of its possible implementations. The memory stores instructions which, when executed by a processor in the power supply circuit, perform the method as described in the second aspect above.
In a fourth aspect, there is provided a computer readable storage medium comprising instructions which, when run on an electronic device, cause the electronic device to perform the method as described in the second aspect.
In a fifth aspect, there is provided a computer program product comprising instructions which, when run on an electronic device as described above, cause the electronic device to perform the method as described in the second aspect.
In a sixth aspect, a chip system is provided, the chip system comprising a processor for supporting an electronic device to implement the functions referred to in the first aspect above. In one possible design, the electronic device may further include interface circuitry that may be used to receive signals from other devices (e.g., memory) or to send signals to other devices (e.g., a communication interface). The system-on-chip may include a chip, and may also include other discrete devices.
The technical effects of the second to sixth aspects are referred to the technical effects of the first aspect and any of its embodiments and are not repeated here.
Drawings
FIG. 1 is a schematic diagram of an electronic device in the prior art;
fig. 2 is a schematic waveform diagram of a voltage of a battery when an electronic device in the prior art communicates through a 2G radio frequency module;
FIG. 3 is a schematic diagram of another electronic device in the prior art;
fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 5 is a schematic flow chart of a power supply method according to an embodiment of the present application;
fig. 6 is a schematic diagram of a call interface of an electronic device according to an embodiment of the present application;
fig. 7 is a schematic diagram of a signal flow of an electronic device according to an embodiment of the present application;
FIG. 8 is a second schematic diagram of a signal flow of an electronic device according to an embodiment of the present application;
fig. 9 is a schematic structural diagram of a 2G rf module according to an embodiment of the present application;
FIG. 10 is a second schematic diagram of an electronic device according to an embodiment of the present application;
FIG. 11 is a third schematic diagram of an electronic device according to an embodiment of the present application;
FIG. 12 is a schematic diagram of an electronic device according to an embodiment of the present application;
fig. 13 is a schematic structural diagram of a chip system according to an embodiment of the present application.
Detailed Description
Some concepts to which the present application relates will be described first.
The terms "first," "second," and the like, in accordance with embodiments of the present application, are used solely for the purpose of distinguishing between similar features and not necessarily for the purpose of indicating a relative importance, number, sequence, or the like.
The terms "exemplary" or "such as" and the like, as used in relation to embodiments of the present application, are used to denote examples, illustrations, or descriptions. Any embodiment or design described herein as "exemplary" or "for example" should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.
The terms "coupled" and "connected" in accordance with embodiments of the application are to be construed broadly, and may refer, for example, to a physical direct connection, or to an indirect connection via electronic devices, such as, for example, electrical resistance, inductance, capacitance, or other electrical devices.
In general, an electronic device such as a cell phone may include an earpiece and a speaker (also known as a speaker). When the electronic equipment is in the headphone mode, the electronic equipment plays the audio signal through the headphone, and when the electronic equipment is in the play mode, the electronic equipment plays the audio signal through the loudspeaker.
When the electronic device is in the GSM network system, during the communication process, the radio frequency power amplifier of the electronic device transmits signals every 4.615ms (i.e. the transmission frequency is 217 Hz). The rf power amplifier is required to draw a large current (e.g., 1.5A) from the battery (i.e., power supply) to transmit the signal. Because the battery has internal resistance, and the radio frequency power amplifier needs to consume large current for transmitting signals, the voltage drop (or ripple) with fixed frequency (217 Hz) can be generated by the power supply voltage (or the voltage of the battery) during GSM communication. Meanwhile, since the radio frequency power amplifier and the audio signal path are commonly powered, a voltage drop of 217Hz is transmitted into the audio signal path, so that 217Hz noise (which can be called TDD noise) is generated by the electronic equipment, and the experience of a user when receiving a call through an earphone of the electronic equipment is affected.
By way of example, fig. 1 shows a schematic structural diagram of an electronic device according to the prior art. As shown in fig. 1, the electronic device may include: the device comprises a power supply circuit 110, an antenna 120, a 2G radio frequency module 130, an audio power amplifier 140, a receiver 151, a loudspeaker 152 and an audio codec module 160. The power supply circuit 110 may include: a battery 111, a second power module 112, a third power module 113, and a processor 114. The battery 111 is coupled to the power supply terminal of the 2G rf module 130, the power supply terminal of the audio power amplifier 140, the power supply terminal of the second power supply module 112, and the power supply terminal of the third power supply module 113. The first signal terminal of the 2G rf module 130 is coupled to the antenna 120,2G and the second signal terminal of the rf module 130 is coupled to the processor 114. An output of the audio power amplifier 140 is coupled to an input of the earpiece 151, an input of the horn 152. An output of the second power module 112 is coupled to a power supply of the audio codec module 160. The signal input of the audio codec module 160 is coupled to the output of the processor 114, and the signal output of the audio codec module 160 is coupled to the signal input of the audio power amplifier 140. An output of the third power module 113 is coupled to a power supply of the processor 114.
Specifically, when the electronic device performs a call through the 2G radio frequency module (i.e., the electronic device is in a GSM network system), the 2G radio frequency module transmits a signal to the base station through the antenna every 4.615ms (i.e., the transmission frequency is 217 Hz), and in the signal transmission process, the 2G radio frequency module consumes a large current.
As shown in fig. 2, since the battery has internal resistance, the voltage of the battery may be caused to generate a voltage drop of 217 Hz. That is, when talking through the 2G rf module, the voltage of the battery will generate a voltage drop of 217Hz (i.e. TDD noise). The voltage drop of 217Hz is transmitted to the audio power amplifier via the wire and then to the earpiece or the speaker, resulting in TDD noise audible to the human ear of the electronic device, affecting the user experience.
Therefore, when the electronic equipment is in a call through the 2G radio frequency module, TDD noise can be generated no matter the electronic equipment is in an earphone mode or an external playing mode.
In order to solve the above-mentioned problems, in a possible modification, an electronic device is provided in which a fourth power supply module is added to the power supply circuit. And the fourth power module is used for boosting the voltage of the battery and improving the power supply rejection ratio and outputting the boosted voltage to the audio power amplifier. Therefore, when the call is conducted through the 2G radio frequency module, the fourth power module can supply power to the audio power amplifier after suppressing the voltage drop of 217Hz, so that the power supply interference of the audio power amplifier is reduced. Based on the above, when the communication is performed through the 2G radio frequency module, whether the electronic equipment is in the earphone mode or the play mode, the TDD noise generated by the electronic equipment can be reduced.
By way of example, as shown in fig. 3, one possible modification to the electronic device provided may include: the improved power supply circuit 110, the antenna 120, the 2G radio frequency module 130, the audio power amplifier 140, the earphone 151, the loudspeaker 152 and the audio codec module 160. The improved power supply circuit 110 may include: a battery 111, a second power module 112, a third power module 113, a processor 114, and a fourth power module 310. The battery 111 is coupled to the power supply terminal of the 2G rf module 130, the power supply terminal of the fourth power module 310, the power supply terminal of the second power module 112, and the power supply terminal of the third power module 113. The first signal terminal of the 2G rf module 130 is coupled to the antenna 120,2G and the second signal terminal of the rf module 130 is coupled to the processor 114. An output of the fourth power supply module 310 is coupled to a supply terminal of the audio power amplifier 140. An output of the audio power amplifier 140 is coupled to an input of the earpiece 151, an input of the horn 152. An output of the second power module 112 is coupled to a power supply of the audio codec module 160. The signal input of the audio codec module 160 is coupled to the output of the processor 114, and the signal output of the audio codec module 160 is coupled to the signal input of the audio power amplifier 140. An output of the third power module 113 is coupled to a power supply of the processor 114.
Because the fourth power module 310 is located between the output end of the battery 111 and the power supply end of the audio power amplifier 140, when the electronic device performs a call through the 2G radio frequency module 130, the fourth power module 310 can suppress the voltage drop of 217Hz and then supply power to the audio power amplifier 140, so that the interference of the voltage drop of 217 to the audio power amplifier 140 can be reduced, and further TDD noise generated when the electronic device performs a call through the 2G radio frequency module 130 can be reduced. Therefore, in the electronic device provided by the possible improved mode, when the 2G radio frequency module is used for talking, whether the electronic device is in the receiver mode or the external mode, the TDD noise generated by the electronic device can be reduced.
In order to reduce both TDD noise generated when the electronic device is in the earpiece mode and TDD noise generated when the electronic device is in the external mode, the fourth power module needs to meet both the power consumption requirement of the speaker and the power consumption requirement of the earpiece. However, since the power consumption of the speaker is generally greater than that of the earpiece, the fourth power module needs to meet the power consumption requirement of the speaker with greater power consumption, and at this time, the fourth power module naturally also meets the power consumption requirement of the earpiece with smaller power consumption. However, since the power consumption of the speaker is greater than that of the earpiece, the cost of the fourth power module is high.
To this end, an embodiment of the present application provides an electronic device, in which a fourth power module is replaced by a first power module and a first diode connected in parallel in a power supply circuit. When the electronic equipment is in a conversation mode through the 2G radio frequency module and the conversation mode is a receiver mode, the first power supply module can boost the voltage of the battery and improve the power supply rejection ratio, and then the voltage is output to the audio power amplifier. That is, the first power supply module supplies power to the audio power amplifier after suppressing a voltage drop of 217Hz generated by the voltage of the battery. When the electronic device performs a call through the 2G radio frequency module and the call mode is the play mode, the first diode may step down the voltage of the battery (for example, the voltage drop is 0.6V or 0.7V) and output the voltage drop to the audio power amplifier. That is, the first power module only needs to meet the power consumption requirement of the earphone. Because the power consumption of the earphone is smaller, the first power module is lower in cost than the fourth power module.
The electronic device according to the embodiment of the application can be mobile or fixed. The electronic device may be deployed on land (e.g., indoor or outdoor, hand-held or vehicle-mounted, etc.), on water (e.g., ship model), or in the air (e.g., drone, etc.). The electronic device may be referred to as a User Equipment (UE), an access terminal, a terminal unit, a subscriber unit (subscriber unit), a terminal station, a Mobile Station (MS), a mobile station, a terminal agent, a terminal apparatus, or the like. For example, the electronic device may be a cell phone, a Virtual Reality (VR) device, an augmented reality (augmented reality, AR) device, a terminal in industrial control (industrial control), a terminal in unmanned (self driving), a terminal in remote medical (remote medical), a terminal in smart grid (smart grid), a terminal in transportation security (transportation safety), a terminal in smart city, a terminal in smart home (smart home), and the like. The embodiment of the application is not limited to the specific type, structure and the like of the electronic equipment.
As shown in fig. 4, an electronic device provided by an embodiment of the present application may include: the further improved power supply circuit 110, antenna 120,2G rf module 130, audio power amplifier 140, earpiece 151 and horn 152, audio codec module 160. The further improved power supply circuit 110 may include: a battery 111, a second power module 112, a third power module 113, a processor 114, a first power module 410, and a first diode 420. The battery 111 is coupled to the power supply terminal of the 2G rf module 130, the anode of the first diode 420, the power supply terminal of the first power module 410, the power supply terminal of the second power module 112, and the power supply terminal of the third power module 113. The first signal terminal of the 2G rf module 130 is coupled to the antenna 120,2G and the second signal terminal of the rf module 130 is coupled to the processor 114. The cathode of the first diode 420 and the output of the first power supply module 410 are both coupled to the supply terminal of the audio power amplifier 140. A control terminal of the first power module 410 is coupled to an output terminal of the processor 114. An output of the audio power amplifier 140 is coupled to an input of the earpiece 151, an input of the horn 152. An output of the second power module 112 is coupled to a power supply of the audio codec module 160. The signal input of the audio codec module 160 is coupled to the output of the processor 114, and the signal output of the audio codec module 160 is coupled to the signal input of the audio power amplifier 140. An output of the third power module 113 is coupled to a power supply of the processor 114.
The processor 114 is configured to execute the power supply method provided by the embodiment of the present application. As shown in fig. 5, the power supply method may include:
s501, when the electronic equipment performs a call through the 2G radio frequency module, the processor determines a call mode of the electronic equipment.
The talk mode of the electronic device may include an earpiece mode and a play-out mode. The earpiece mode refers to playing an audio signal through an earpiece of the electronic device, and the external mode refers to playing an audio signal through a speaker of the electronic device. In general, the default call mode of the electronic device is a handset mode, and in response to a switching operation of the call mode, the call mode of the electronic device may be switched from the handset mode to a play mode. Of course, the communication mode of the electronic device can also be switched from the play mode to the earpiece mode.
Illustratively, as shown at a in fig. 6, the handset displays a call interface 601. The call interface 601 includes a handsfree control 602 and a hang-up control 603, and the handsfree control 602 is in an off state. At this time, the phone call mode is the default handset mode. At this time, the handset plays the talking voice (i.e., audio signal) through the handset. Because the playing sound of the earphone is smaller, the earphone needs to be closely attached to the human ear, so that the user can hear the content of the talking voice. In response to a user clicking on the hands-free control 602 (i.e., switching talk mode), the hands-free control 602 is in an open state, as shown at B in fig. 6, and the talk mode of the handset is switched from the earpiece mode to the talk mode. At this time, the mobile phone plays the talking voice through the loudspeaker. Because the loudspeaker plays louder sound, therefore, the loudspeaker of the mobile phone does not need to be clung to the human ear, and the user can hear the content of the talking voice.
S502, if the communication mode of the electronic equipment is the earphone mode, the processor controls the first power supply module to work.
Referring to fig. 4, as shown in fig. 7, when the electronic device performs a call through the 2G rf module 130 and the call mode is the earpiece mode, the processor 114 may control the first power module 410 to operate. The first power module 410 may boost the voltage of the battery when operating. At this time, the voltage of the cathode of the first diode 420 is greater than the voltage of the battery, and the voltage of the anode of the first diode 420 is the voltage of the battery. That is, the cathode voltage of the first diode is greater than the anode voltage of the first diode. Since the diode has unidirectional conductivity, when the first power module 410 is operated, the first diode 420 is in an open state, so that the battery can supply power to the audio power amplifier 140 through the first power module 410, and the electronic device plays audio signals through the earpiece 151. The first power module 410 may also output the voltage of the battery to the audio power amplifier 140 after increasing the power supply rejection ratio. That is, the first power module 410 improves the stability of the supply voltage of the audio power amplifier 140, and thus, the first power module 410 reduces TDD noise generated by the electronic device when talking through the 2G radio frequency module.
Illustratively, the diode (e.g., the first diode, and the second diode referred to below) according to the embodiments of the present application may be, but is not limited to, a schottky diode.
S503, if the communication mode of the electronic device is the play mode, the processor controls the first power module to stop working.
Referring to fig. 5, as shown in fig. 8, when the electronic device performs a call through the 2G rf module 130 and the call mode is the play mode, the processor 114 may control the first power module 410 to stop working. After the first power module 410 stops operating, the battery 111 can no longer supply power to the audio power amplifier 140 through the first power module 410. At this time, the voltage of the positive electrode of the first diode 420 is the voltage of the battery, and the voltage of the negative electrode of the first diode 420 is 0. That is, the positive voltage of the first diode 420 is greater than the negative voltage of the first diode 420. Based on the unidirectional conductivity of the diode, the first diode 420 is turned on in the forward direction, and the battery can supply power to the audio power amplifier 140 through the first diode 420, and the electronic device can play the audio signal through the speaker 152.
Because the loudspeaker of the electronic equipment is far away from the human ear when the electronic equipment is in the play mode, even if the electronic equipment generates TDD noise in the conversation process, the influence on the conversation of the user is limited, so that the TDD noise can be not reduced. In addition, when the electronic equipment is in the external-discharge mode, the battery supplies power to the audio power amplifier through the first diode, so that one-path power supply conversion can be reduced, namely unnecessary noise reduction operation is reduced, and the system efficiency of the electronic equipment can be improved.
In summary, the power supply rejection ratio of the voltage of the battery is improved by the first power supply module, so that the TDD noise generated when the electronic device is in the earpiece mode and talking through the 2G radio frequency module can be reduced. Meanwhile, the first power supply module only needs to meet the power consumption requirement of the earphone, and the power consumption of the earphone is smaller than that of the loudspeaker, so that the cost of the first power supply module is lower than that of the fourth power supply module. In addition, the power supply circuit of the fourth power supply module is replaced by the first power supply module and the first diode which are connected in parallel, so that one-path power supply conversion can be reduced, and the system efficiency of the electronic equipment is improved.
It should be noted that, the electronic device provided in the embodiment of the present application may further include at least one radio frequency module of the third generation (3rd generation,3G) radio frequency module, the fourth generation (4th generation,4G) radio frequency module, the fifth generation (5th generation,5G) radio frequency module, and the subsequent version radio frequency module. The figures herein illustrate that the electronic device includes a 2G radio frequency module.
When the electronic equipment performs communication through the radio frequency modules except the 2G radio frequency module, the electronic equipment does not generate TDD noise. Therefore, when the electronic equipment is in a call through the radio frequency modules except the 2G radio frequency module, the processor controls the first power supply module to stop working no matter the electronic equipment is in the earphone mode or the external mode.
Referring to fig. 4, as shown in fig. 9, the 2G rf module 130 may include: a radio frequency switch (switch) 901, a diplexer (duplexer) 902, a first filter 903, a second filter 904, a 2G radio frequency power amplifier (radio frequency power amplifier, RFPA) 905, a low noise amplifier (low noise amplifier, LNA) 906, a radio frequency transceiver 907, a radio frequency chip 908, a baseband chip 909, and the like.
Specifically, a first end of the radio frequency switch 901 is coupled to the antenna 120, a second end of the radio frequency switch 901 is coupled to a first end of the duplexer 902, and a second end of the duplexer 902 is coupled to a first end of the first filter 903 and a first end of the second filter 904; a second end of the first filter 903 is coupled to an output of the 2G radio frequency power amplifier 905, and a second end of the second filter 904 is coupled to an input of the low noise amplifier 906; an input of the 2G radio frequency power amplifier 905, an output of the low noise amplifier 906 is coupled to a first end of the radio frequency transceiver 907; a second end of the radio frequency transceiver 907 is coupled to a first end of the radio frequency chip 908; a second end of the radio frequency chip 908 is coupled to a first end of the baseband chip 909; a second end of baseband chip 909 is coupled to processor 114.
Alternatively, referring to fig. 4, as shown in fig. 10, the first power module 410 according to an embodiment of the present application may include an energy storage element 1010 and a power chip 1020. An input of the power chip 1020 is coupled to the battery 111 through the energy storage element 1010, and an output of the power chip 1020 is coupled to a power supply of the audio power amplifier 140. When the communication mode of the electronic device is the handset mode, the processor 114 controls the power chip 1020 to operate. The energy storage element 1010 and the power chip 1020 are matched with each other, and output to the audio power amplifier 140 after boosting the voltage of the battery and improving the power supply rejection ratio, so that the TDD noise generated when the electronic equipment is in communication through the 2G radio frequency module is reduced. When the communication mode of the electronic device is the play mode, the processor 114 controls the power chip 1020 to stop working.
It should be noted that, when the types of the power supply chips are different, the types of the energy storage elements are also different. For example, the energy storage element is a capacitor, and the power supply chip is a charge pump type boost power supply chip. For another example, the energy storage element is an inductor, and the power supply chip is a boost (boost) power supply chip.
As shown in fig. 11, the energy storage element is taken as an inductance L, and the power supply chip is taken as an example of a boost type boost power supply chip. The boost-type boost power supply chip may include: the first switch K1, the second switch K2, and the controller 1101 are not limited thereto. The first end of the inductor L is coupled to the battery, the second end of the inductor L is coupled to the ground through the first switch K1, and the second end of the inductor L is further coupled to the power supply end of the audio power amplifier 140 through the second switch K2. The control terminal of the first switch K1 and the control terminal of the second switch K2 are coupled to the controller 1101. The controller 1101 is also coupled to a processor 114.
Specifically, when the electronic device performs a call through the 2G rf module 130 and the call mode is the earpiece mode, the processor 114 may instruct the controller 1101 to control the first switch K1 to be turned on and the second switch K2 to be turned off, or the first switch K1 to be turned off and the second switch K2 to be turned on. Based on this, the inductor L can be made to store energy, thereby boosting the voltage of the battery, and power is supplied to the audio power amplifier 140 such that the voltage of the negative electrode of the first diode 420 is greater than the voltage of the battery.
Of course, the boost power supply chip further includes a module for boosting the power supply rejection ratio of the voltage of the battery, which is not shown in fig. 11. This section may refer to an implementation manner in the prior art, and this is not repeated in the embodiments of the present application.
Optionally, as shown in fig. 4, the second power module 112 according to the embodiment of the present application may step down the voltage of the battery and increase the power supply rejection ratio and output the voltage to the audio codec module 160, so as to reduce the influence of TDD noise on the audio codec module 160. The third power module 113 according to the embodiment of the present application may step down the voltage of the battery 111 and increase the power supply rejection ratio, and output the voltage to the processor 114, so as to reduce the influence of TDD noise on the processor 114.
The second power module 112 and the third power module 113 may be, but not limited to, high efficiency, low drop out, low dropout linear voltage regulator chips (low dropout regulaor, LDOs). Wherein the low dropout linear regulator may have an efficiency of greater than 90% and a voltage drop of less than 200mV.
Alternatively, as shown in fig. 4, the audio codec module 160 according to an embodiment of the present application may process the digital audio signal from the processor 114 into an analog audio signal and transmit the analog audio signal to the audio power amplifier 140.
Optionally, as shown in fig. 4, the audio power amplifier 140 according to the embodiment of the present application may amplify the analog audio signal output by the audio codec module 160 and output the amplified analog audio signal to the earpiece 151 or the speaker 152.
Specifically, when the electronic device is in earpiece mode, earpiece 151 may play an analog audio signal from an audio power amplifier. The speaker 152 may play an analog audio signal from the audio power amplifier when the electronic device is in the play-out mode.
Further, as shown in fig. 12 in conjunction with fig. 4, the power supply circuit 110 further modified as described above may further include a second diode 1201. The anode of the second diode 1201 is coupled to the output of the first power supply module 410, and the cathode of the second diode 1201 is coupled to the supply terminal of the audio power amplifier 140.
When the electronic device is talking through the 2G rf module and the talking mode is the play mode, the battery supplies power to the audio power amplifier 140 through the first diode 420. At this time, the voltage of the anode of the first diode 420 is the same as the voltage of the anode of the second diode 1201. The voltage of the cathode of the second diode 1201 is the difference between the voltage of the battery and the voltage drop of the first diode 420, and the voltage of the anode of the second diode 1201 is 0. That is, the voltage of the negative electrode of the second diode 1201 is greater than the voltage of the positive electrode of the second diode 1201. Based on the unidirectional conductivity of the diode, at this time, the second diode 1201 is in an open state, so that current can be prevented from flowing backward, thereby protecting elements in the power supply circuit and ensuring the normal operation of the power supply circuit.
When the first power module boosts the voltage of the battery, the voltage is increased by an amount greater than the voltage drop of the second diode. Therefore, in the electronic device shown in fig. 12, when the electronic device is talking through the 2G rf module and the talking mode is the earphone mode, the voltage of the cathode of the first diode is still greater than the voltage of the anode of the first diode. At this time, the first diode is still in an open state, and the voltage of the battery still passes through the first power module and the second diode and is output to the audio power amplifier.
Alternatively, when the first power module 410 includes the energy storage element 1010 and the power chip 1020, the anode of the second diode 1201 may be coupled to the output terminal of the power chip 1020, and the cathode of the second diode 1201 may be coupled to the power supply terminal of the audio power amplifier 140.
In summary, since the volume of the earphone playing the audio signal is small, when the electronic device is in the earphone mode, the user needs to attach the earphone of the electronic device to the ear to hear the talking sound. Therefore, when the electronic device is in the earphone mode and the electronic device is in the 2G radio frequency module, the TDD noise generated by the electronic device has a large influence on the conversation of the user, and thus the TDD noise of the electronic device needs to be reduced. Because the volume of the loudspeaker playing the audio signal is also larger, when the electronic equipment is in the play mode, a user can hear the content of the talking voice without tightly attaching the loudspeaker of the electronic equipment to the ear. Therefore, when the electronic equipment is in the outward-playing mode, the loudspeaker is far away from the ear, and the TDD noise generated by the electronic equipment has little influence on the conversation of the user. Therefore, in the electronic device provided by the embodiment of the application, when the 2G radio frequency module is used for talking and the talking mode is the earphone mode, the TDD noise of the electronic device is reduced by the first power module. Meanwhile, the power consumption of the earphone is smaller than that of the loudspeaker, so that the cost of the first power supply module is also lower. Based on the above, the electronic device provided by the embodiment of the application can reduce TDD noise when the electronic device is in the earphone mode, improve the conversation experience of a user, reduce the cost and reduce one-path power supply conversion, thereby improving the system efficiency of the electronic device.
As shown in fig. 13, the embodiment of the application further provides a chip system. The chip system 1300 includes at least one processor 114 and at least one interface circuit 1301. The at least one processor 114 and the at least one interface circuit 1301 may be interconnected by wires. The processor 114 is configured to support the electronic apparatus in performing the steps of the method embodiments described above, and the at least one interface circuit 1301 may be configured to receive signals from other devices (e.g., memory) or to transmit signals to other devices (e.g., communication interfaces). The system-on-chip may include a chip, and may also include other discrete devices.
Embodiments of the present application also provide a computer-readable storage medium including instructions that, when executed on an electronic device described above, cause the electronic device to perform the steps of the method embodiments described above.
Embodiments of the present application also provide a computer program product comprising instructions which, when run on an electronic device as described above, cause the electronic device to perform the steps of the method embodiments described above.
Technical effects concerning the chip system, the computer-readable storage medium, the computer program product refer to the technical effects of the previous method embodiments.
It should be understood that, in various embodiments of the present application, the sequence numbers of the foregoing processes do not mean the order of execution, and the order of execution of the processes should be determined by the functions and internal logic thereof, and should not constitute any limitation on the implementation process of the embodiments of the present application.
Those of ordinary skill in the art will appreciate that the various illustrative modules and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
It will be clearly understood by those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described system, apparatus and module may refer to corresponding procedures in the foregoing method embodiments, which are not repeated herein.
In the several embodiments provided by the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the above-described device embodiments are merely illustrative, e.g., the division of the modules is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple modules or components may be combined or integrated into another device, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some interface, indirect coupling or communication connection of devices or modules, electrical, mechanical, or other form.
The modules described as separate components may or may not be physically separate, and components shown as modules may or may not be physically separate, i.e., may be located in one device, or may be distributed over multiple devices. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional module in the embodiments of the present application may be integrated in one device, or each module may exist alone physically, or two or more modules may be integrated in one device.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A power supply circuit, which is characterized by comprising a processor, a battery, a first power module and a first diode;
the anode of the first diode is coupled to the battery, and the cathode of the first diode is used for being coupled to the power supply end of the audio power amplifier; an input end of the first power supply module is coupled to the battery, and an output end of the first power supply module is used for being coupled to a power supply end of the audio power amplifier; the battery is also used for being coupled to a power supply end of the 2G radio frequency module; the processor is further coupled to a control terminal of the first power module; the first power supply module is used for boosting the voltage of the battery and outputting the voltage to the audio power amplifier after the power supply rejection ratio is improved; when the call is made through the 2G radio frequency module, the processor is configured to:
if the communication mode is the receiver mode, controlling the first power supply module to work;
and if the communication mode is the play mode, controlling the first power supply module to stop working.
2. The circuit of claim 1, wherein the first power module comprises an energy storage element and a power chip; the input end of the power supply chip is coupled to the battery through the energy storage element, and the output end of the power supply chip is coupled to the power supply end of the audio power amplifier; the processor is specifically configured to:
if the communication mode is the receiver mode, controlling the power chip to work;
and if the communication mode is the play mode, controlling the power chip to stop working.
3. The circuit of claim 2, wherein the energy storage element is a capacitor and the power supply chip is a charge pump boost power supply chip.
4. The circuit of claim 2, wherein the energy storage element is an inductor and the power supply chip is a boost type boost power supply chip.
5. The circuit of any of claims 1-4, wherein the power supply circuit further comprises a second diode; the positive electrode of the second diode is coupled to the output end of the first power supply module, and the negative electrode of the second diode is used for being coupled to the power supply end of the audio power amplifier.
6. The circuit of any one of claims 1-4, wherein the power supply circuit further comprises a second power supply module; the battery is further coupled to a power supply end of the second power supply module, and an output end of the second power supply module is used for being coupled to a power supply end of the audio encoding and decoding module; the signal output end of the audio coding and decoding module is coupled to the signal input end of the audio power amplifier, and the signal input end of the audio coding and decoding module is coupled to the output end of the processor;
the second power supply module is used for reducing the voltage of the battery and outputting the voltage to the audio encoding and decoding module after the power supply rejection ratio is improved;
the audio encoding and decoding module is used for converting the digital audio signal from the processor into an analog audio signal and outputting the analog audio signal to the audio power amplifier.
7. The circuit of any one of claims 1-4, wherein the power supply circuit further comprises a third power supply module; the battery is further coupled to an input of the third power module, an output of the third power module being coupled to a power supply of the processor;
and the third power supply module is used for reducing the voltage of the battery and outputting the voltage to the processor after the power supply rejection ratio is improved.
8. A power supply method applied to the power supply circuit of any one of claims 1 to 7, the method comprising:
if the communication mode is the earphone mode, controlling a first power supply module in the power supply circuit to work;
and if the communication mode is the play mode, controlling the first power supply module to stop working.
9. An electronic device comprising a memory and the power supply circuit of any one of claims 1-7; the memory stores instructions that, when executed by a processor in the power circuit, perform the method of claim 8.
10. A computer-readable storage medium comprising instructions that, when executed on an electronic device, cause the electronic device to perform the method of claim 8.
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| CN111316528A (en) * | 2018-07-27 | 2020-06-19 | 华为技术有限公司 | Power supply circuit of terminal equipment, terminal equipment and power supply method |
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