CN116632560A - Gluing manufacturing method of missile-borne dual-polarized dual-band integrated antenna assembly - Google Patents
Gluing manufacturing method of missile-borne dual-polarized dual-band integrated antenna assembly Download PDFInfo
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- CN116632560A CN116632560A CN202310407399.4A CN202310407399A CN116632560A CN 116632560 A CN116632560 A CN 116632560A CN 202310407399 A CN202310407399 A CN 202310407399A CN 116632560 A CN116632560 A CN 116632560A
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- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000853 adhesive Substances 0.000 claims abstract description 49
- 230000001070 adhesive effect Effects 0.000 claims abstract description 49
- 239000002313 adhesive film Substances 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 23
- 230000009977 dual effect Effects 0.000 claims abstract description 17
- 230000008569 process Effects 0.000 claims abstract description 14
- 238000012545 processing Methods 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000007740 vapor deposition Methods 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 229910000833 kovar Inorganic materials 0.000 claims description 4
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 3
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- 230000009477 glass transition Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 3
- 238000010008 shearing Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 230000010287 polarization Effects 0.000 claims 2
- 230000010354 integration Effects 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 9
- 238000003466 welding Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000007613 environmental effect Effects 0.000 description 6
- 238000007747 plating Methods 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000004544 spot-on Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/02—Connectors or connections adapted for particular applications for antennas
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
Abstract
The invention discloses an adhesive manufacturing method of a missile-borne dual-polarized dual-band integrated antenna assembly, which relates to the technical field of manufacturing of radar electronic antenna feed subsystems, and comprises the following steps: step one: processing a plurality of grooves on a shell, and uniformly dispensing conductive adhesive in the grooves; step two: inserting Ku/Ka frequency band elastic connectors into the grooves, and completing interconnection of the shell and the elastic connectors through a curing process; step three: paving an integrated conductive adhesive film on the integrated antenna microstrip board, and installing a positioning pin; step four: mounting the integrated antenna micro band plate on the shell through a locating pin, and assembling the integrated antenna micro band plate to a gluing tool; the multi-dimensional interconnection of the dual-polarized antenna assembly is realized at a lower temperature through the conductive adhesive and the conductive adhesive film, so that the dual-polarized antenna assembly has high integration level and high reliability; the missile-borne dual-polarized dual-band integrated antenna assembly can be used in Ku/Ka dual, and the standing wave can be less than or equal to 1.5 due to the fact that the microstrip antenna is continuous, and the millimeter wave application range is excellent in electrical performance.
Description
Technical Field
The invention relates to the technical field of manufacturing of radar electronic antenna feed subsystems, in particular to an adhesive manufacturing method of a missile-borne dual-polarized dual-band integrated antenna assembly.
Background
The missile-borne antenna has higher requirements on miniaturization, high structural strength, wide working frequency band, wide working beam coverage range, equivalent radiation power and the like according to the development needs of military equipment. With the development of missile-borne systems, the volume and weight of the missile-borne systems are more and more strictly limited, and the development trend of miniaturization of antennas as important components is more and more obvious. The missile-borne phased array radar system mostly adopts a tile type stacked vertical blind matching interconnection mode, an antenna component is used as the forefront end of the radar, and the limits of a receptor and an assembly process must develop a dual-polarized dual-band high integration mode.
The prior research has solved the design and the partial integrated manufacturing of dual-band transceiver antenna, based on the manufacturing of planar multilayer microstrip boards and the vertical interconnection process of elastic connectors, the extensible splice manufacturing and the integrated process paths of one group of microstrip boards to a plurality of groups of shells and a plurality of groups of microstrip boards to one group of shells are opened. However, the one-to-many or many-to-one splicing method still has the problems of low positioning accuracy and long process flow, and particularly the flatness and consistency of the antenna array surface are obviously deteriorated when the antenna caliber is increased. When the total number of antenna units is extended to 960 or more, the pass rate of the receiving and transmitting path is reduced by 30%. Because the microstrip board and the antenna housing are subjected to a plurality of heating processes, the microstrip board and the antenna housing have no reworkability, so that the manufacturing cost and the period of the antenna are obviously increased. It is therefore necessary to develop a method of adhesive manufacture of an integrated antenna assembly.
When the integrated antenna shell and a group of microstrip boards are assembled by adopting solder, because a large number of connector elastic inner conductors are densely distributed, short circuit and integral deformation of the shell caused by solder overflow are extremely easy to occur, and the antenna vertical passage signal is poor; because the weldability of the shell metal material is poor, good infiltration welding of the solder and the shell can be realized only by surface treatment, the local modification quality of the dense stepped deep holes is difficult to control, and defects such as poor plating, local burrs and the like are easy to occur, so that poor welding is caused; the integrated assembled microstrip board has large breadth and high warping degree, and the large breadth connection is difficult; in addition, the pattern precision and interlayer alignment requirements of the large-size microstrip board are high, and the yield is low.
In view of the above drawbacks, the present inventors have finally achieved the present invention through long-time studies and practices.
Disclosure of Invention
The invention aims to provide an adhesive manufacturing method of a missile-borne dual-polarized dual-band integrated antenna assembly, which solves the series problems of low yield, poor connection, electrical performance and reliability reduction caused by the deformation of a shell in the heating process due to the fact that a large-size microstrip board and the shell are low in precision, and provides a further solution for the efficient and highly reliable integration of the missile-borne miniaturized dual-band integrated antenna assembly.
The invention solves the technical problems through the following technical proposal, and the invention comprises the following steps:
step one: processing a plurality of grooves on a shell, and uniformly dispensing conductive adhesive in the grooves;
step two: inserting Ku/Ka frequency band elastic connectors into the grooves, and completing interconnection of the shell and the elastic connectors through a curing process;
step three: paving an integrated conductive adhesive film on the integrated antenna microstrip board, and installing a positioning pin;
step four: mounting the integrated antenna micro band plate on the shell through a locating pin, and assembling the integrated antenna micro band plate to a gluing tool;
step five: the conductive adhesive film is solidified through vacuum bag pressing, the integrated antenna microstrip board and the shell are bonded, the inner conductor of the elastic connector is tightly attached to the integrated antenna microstrip board to form an antenna array surface, and the antenna array surface is mounted on the adapter plate;
step six: and carrying out vapor deposition protection on the antenna array surface.
Preferably, in the first step, the material of the shell is one of an aluminum-silicon gradient composite material, a kovar alloy, an aluminum alloy, a titanium alloy and a magnesium alloy.
Preferably, in the first step, the conductive adhesive is a silver-based conductive adhesive or a gold-based conductive adhesive, wherein the silver-based conductive adhesive does not contain a solvent, the mass loss is less than or equal to 0.5% after the curing is completed, and the volume resistivity is less than or equal to 5×10 after the curing is completed -4 Omega cm, chip shearing force is more than or equal to 48N (2 mm x 2 mm), and glass transition temperature is more than or equal to 90 ℃.
Preferably, in the second step, the elastic connector and the shell are fixed by using a cementing tool, the cementing tool is placed into a vacuum oven, the conductive adhesive is cured according to the curing condition of 120-150 ℃ for 30-60 min, the cementing tool is released after the cementing is finished, the solder resist is peeled off, and the shell is subjected to gas phase cleaning.
Preferably, in the third step, before the conductive adhesive film is laid, the integrated antenna microstrip board needs to be pre-baked, the drying temperature is 110-130 ℃, and the drying time is 1.5-4.5 hours.
Preferably, in the third step, the conductive adhesive film is cut by laser cutting, the size of the conductive adhesive film is 0.1mm smaller than that of the integrated antenna microstrip board, and the conductive adhesive film, the elastic connector and the positioning pin are hollowed out in the corresponding installation area.
Preferably, in the first step, the shell is in a numerical control milling appearance, the dimensional accuracy of the groove is +/-0.02 mm, and the flatness of the mounting surface of the elastic connector is less than or equal to 0.03mm.
Preferably, in the fifth step, the specific content is: placing the assembled gluing tool into a vacuum bag, placing the vacuum bag into a vacuum autoclave for curing, wherein the curing temperature of the conductive adhesive film is lower than that of the conductive adhesive, and the curing conditions are as follows: the pressure is 0.1Mpa, the temperature is 120-130 ℃, the curing is 1.5-3 hours, and after the hot pressing is finished, the cementing tool is removed.
Preferably, in the sixth step, the vapor deposition material for vapor deposition protection of the antenna array surface is parylene.
The invention also provides the dual-polarized dual-band integrated antenna assembly manufactured by the adhesive manufacturing method of the missile-borne dual-polarized dual-band integrated antenna assembly.
Compared with the prior art, the invention has the beneficial effects that:
1. the missile-borne dual-polarized dual-band integrated antenna assembly realizes multi-dimensional interconnection of the dual-polarized antenna assembly at a lower temperature through the conductive adhesive and the conductive adhesive film, and has high integration level and high reliability; the missile-borne dual-polarized dual-band integrated antenna assembly can be used in Ku/Ka dual, and the standing wave can be less than or equal to 1.5 due to the fact that the microstrip antenna is continuous, and the millimeter wave application range is excellent in electrical performance.
2. The dual-polarized antenna with the unit spacing of 9.2mm multiplied by 9.2mm can be used for receiving and transmitting, compared with an antenna array surface spliced by a plurality of groups of antenna units, the flatness is improved by more than 0.3mm (root mean square), the dual-polarized antenna has better consistency, and compared with the traditional spliced antenna, the planar size can be reduced by 15%, thereby meeting the higher technical requirements of model products on miniaturization and high consistency.
3. The production efficiency of the process method is higher; because the vacuum gas phase welding can only weld one furnace in order to keep the high temperature consistency in the furnace chamber, the conductive adhesive bonding process in the invention depends on the volumes of the oven and the vacuum autoclave, can cure ten or even tens of pieces at one time, and greatly improves the production efficiency.
4. The integrated antenna component prepared by the invention has higher strength and consistency, the solidification temperature is lower than the welding temperature, so that the deformation of the PTFE medium sleeve of the connector is reduced, the environmental test requirements of 200 temperature cycles (-40 ℃ to +75 ℃) and 13.8g random vibration can be met, the reliability and environmental adaptability are good, and the high service environment requirement of missile-borne can be met.
Drawings
FIG. 1 is a schematic cross-sectional structure of a comparative one-piece multi-Ka/Ku dual-polarized microstrip antenna assembly;
fig. 2 is a schematic top view of a comparative one-piece multi-Ka/Ku dual polarized microstrip antenna assembly;
fig. 3 is a schematic cross-sectional structure of a dual polarized Ka/Ku integrated antenna assembly according to an embodiment;
fig. 4 is a schematic top view of a dual polarized Ka/Ku integrated antenna assembly according to an embodiment;
fig. 5 is a process flow diagram of a dual polarized Ka/Ku integrated antenna assembly according to an embodiment;
fig. 6 is a schematic top view of a dual-polarization microstrip antenna assembly of a second embodiment of Ka/Ku.
Detailed Description
The above and further technical features and advantages of the present invention are described in more detail below with reference to the accompanying drawings.
Comparative example
This comparative example is a dual polarized Ka/Ku one-piece multi-microstrip antenna assembly comprising 4 sets of aluminum alloy antenna elements, each set of Ka/Ku dual polarized microstrip antenna assembly elements comprising 24 sets of Ku band elastic connectors 11 and 24 sets of Ka band elastic connectors 10, as shown in fig. 1-2; the structure is respectively 1 group of 96 unit antenna micro-band plates 1 from top to bottom, the bottom of the antenna micro-band plate 1 is provided with a contact pad 2 contacted with an elastic connector, the lower side of the antenna micro-band plate 1 is provided with a conductive adhesive film 3 with a first through hole, and the first through hole is used for the elastic connector and a locating pin to pass through; 4 the assembly is welded the casing 4 of elastic connector, casing 4 contains local silvered recess 12, ku frequency channel elastic connector 11, ka frequency channel elastic connector 10, ku frequency channel elastic connector 11 and Ka frequency channel elastic connector 10 all pass through 62Sn36Pb2Ag solder 5 welded fastening in corresponding recess 12, elastic connector contains outer conductor, glass sintering body, PTFE insulating medium cover 13, elastic mechanism and inner conductor 14 (for the graphic effect is clear, glass sintering body and elastic mechanism are inner structure no longer showing in the connector, antenna assembly unit and connector quantity reduce).
The assembled comparative antenna assembly is formed by 1 antenna microstrip board and 1 pair of 4 groups of shells, and 4 groups of antenna assembly units are spliced to form an antenna array surface; the antenna array surface comprises a KK adapter 7, a set screw 9, an adapter plate 6 and a second through hole 8 formed in the adapter plate 6 from bottom to top, and the set screw 9 is used for fixing the shell 4 on the adapter plate 6.
The process flow of the comparative example is: spot-coating 62Sn36Pb2Ag soldering paste in the groove 12 of the shell 4 with partial silver plating; installing the Ka frequency band elastic connector 10 and the Ku frequency band elastic connector 11 into the shell 4 through a tool, and assembling and welding the tool; the interconnection of the elastic connector and the shell is completed through vacuum vapor welding, and the welding temperature is 210 ℃; placing a conductive adhesive film 3 with the model of J-468 on the 96-unit antenna microstrip board 1; the antenna micro band plate 1 is arranged on a shell welded with an elastic connector through a locating pin and assembled to a gluing tool; curing the conductive adhesive film 3 by vacuum bag pressing at 130 ℃ for 1.5 hours; assembling 1 group of antenna components on an adapter plate 6 to form an antenna array surface; the antenna array surface is protected by vapor deposition, and then the antenna array surface and the adapter plate 6 are assembled through the fixing screws 9; the tolerance between the antenna assembly units after assembly is + -0.045 mm.
Example 1
The embodiment provides a technical scheme: the gluing manufacturing method of the missile-borne dual-polarized dual-band integrated antenna assembly is shown in fig. 3-5, and comprises the following steps:
step one: processing a plurality of grooves 18 on a shell 15, and uniformly dispensing conductive adhesive 16 in the grooves 18;
the groove 18 has a connector bottom ring, a glue filled ring and a connector top ring therein;
the shell 15 is made of metal materials, the appearance is machined through numerical control milling, the dimensional accuracy of the groove 18 is +/-0.02 mm, and the flatness of the mounting surface of the elastic connector is less than or equal to 0.03mm;
the material of the shell 15 is one of aluminum-silicon gradient composite material, kovar alloy, aluminum alloy, titanium alloy and magnesium alloy, preferably aluminum-silicon gradient composite material, and the silicon content is 25% -29%;
the spot-coating conductive adhesive 16 is silver-based conductive adhesive or gold-based conductive adhesive, preferably, the silver-based conductive adhesive 16 with more than 85 percent of metal filler by weight is used, the silver-based conductive adhesive 16 is one of H20E of Epo-tek company, 84-1A of Henhao company, J-423, J-425, J-427, J-428 of Heilongjiang petrochemical institute and MF1343 of Zhengzhou Silan company, the selected silver-based conductive adhesive 16 does not contain solvent, the mass loss is not more than 0.5 percent after the curing is finished, and the volume resistivity is not more than 5 x 10 after the curing is finished -4 Omega cm, chip shearing force not less than 48N (2 mm x 2 mm), glass transition temperature not less than 90 ℃;
the conductive adhesive 16 is coated for more than 1 circle, the adhesive line diameter of the conductive adhesive 16 is 70-90% of the width of the adhesive filling ring, the adhesive line shape of the conductive adhesive 16 after adhesive dispensing is smooth, and the pull tip and the tail cannot occur, so that the stability of the adhesive elastic connector is ensured;
step two: ku/Ka band elastic connectors are inserted into the grooves 18, and interconnection of the shell 15 and the elastic connectors is completed through a curing process;
the Ku/Ka frequency band elastic connector is a multi-tire elastic connector; transferring a multi-cell elastic connector applicable to two frequency bands into the groove 18, wherein the elastic connector comprises at least two inner conductors applicable to different frequency bands in each outer conductor, and the number of the inner conductors is a multiple of 2, such as a twin connector, a quad connector, an octacell connector and the like;
the insulating medium material of the elastic connector is one or the combination of a plurality of glass bodies, PTFE and PEEK, the inner conductor of the elastic connector protrudes out of the outer conductor and is provided with a PTFE medium sleeve, and the inner conductor of the elastic connector and the bottom socket are coated with strippable solder resist, so that the conductive adhesive 16 cannot form a short circuit between the outer conductor and the inner conductor, and the strippable solder resist is one of Spot-on of Hangao company and 2111WonderMaskP, chemaskW of ITW company;
the curing process comprises the following steps: installing an adhesive bonding tool, fixing the position of the elastic connector and the position of the shell 15 through the adhesive bonding tool, enabling the bottom surface of the elastic connector to be flush with the bottom surface of the shell 15 after the elastic connector is installed, and then fastening the adhesive bonding tool;
placing the shell 15 held by the gluing tool into a vacuum oven, curing according to the curing condition of the conductive adhesive 16, wherein the curing condition is 120-150 ℃ for 30-60 min, removing the gluing tool after gluing is finished, stripping the solder resist, and performing gas phase cleaning on the shell 15;
step three: paving an integrated conductive adhesive film 3 on the integrated antenna microstrip board 1, and installing a positioning pin;
the overall dimension of the integrated antenna micro band plate 1 is consistent with the combined overall dimension of the shell 15, the integrated antenna micro band plate 1 and the shell 15 are provided with corresponding positioning holes, positioning pins are installed in the positioning holes on the shell 15 in a plugging manner, and the positioning pins protrude out of the shell 15;
before laying the conductive adhesive film, pre-baking the integrated antenna microstrip board 1, wherein the baking temperature is 110-130 ℃ and the baking time is 1.5-4.5 hours;
cutting the conductive adhesive film 3 into a shape which is approximately consistent with the integrated antenna micro band plate 1 through laser cutting, wherein the size of the conductive adhesive film is 0.1mm inwards shrinking the size of the integrated antenna micro band plate 1, and the installation area of the elastic connector contact and the positioning pin is hollowed out, so that the interference between the installation of the elastic connector and the positioning pin is avoided; the conductive adhesive film 3 is one of CF3350 of Hegao, CSJM8272 of Zhonglan, and J-468 of Heilongjiang petrochemical institute;
step four: the integrated antenna micro band plate 1 is mounted on the shell 15 through a locating pin and assembled to a gluing tool;
spreading the cut conductive adhesive film 3 on the bonding surface of the integrated antenna micro band plate 1, preheating the conductive adhesive film 3 through a hot table to enable the conductive adhesive film 3 to be gapless with the integrated antenna micro band plate 1, assembling the integrated antenna micro band plate 1 paved with the conductive adhesive film 3 with a shell 15 of a bonding connector, and plugging a positioning pin with a positioning hole on the integrated antenna micro band plate 1 to realize positioning alignment of the integrated antenna micro band plate 1 and the shell 15;
the gluing tool and the additional fastening device ensure the close contact between the integrated antenna microstrip board 1 and the conductive adhesive film 3, the conductive adhesive film 3 and the shell 15, and the inner conductor of the elastic connector and the microstrip board, and then the positioning pin is taken down;
step five: curing the conductive adhesive film 3 by vacuum bag pressing, bonding the integrated antenna micro band plate 1 and the shell 15, tightly attaching an inner conductor of the elastic connector with the integrated antenna micro band plate 1 to form an antenna array surface, and mounting the antenna array surface on the adapter plate 6;
the assembled gluing tool is put into a vacuum bag, and is put into a vacuum autoclave for curing, the curing temperature of the conductive adhesive film 3 is lower than that of the conductive adhesive 16, and the curing conditions are as follows: the pressure is 0.1Mpa, the temperature is 120-130 ℃, the curing is carried out for 1.5-3 hours, and after the hot pressing is finished, the cementing tool is removed;
step six: performing vapor deposition protection on the antenna array surface;
the vapor deposition material for vapor deposition protection of the antenna array surface is parylene c, and then the elastic connector on the housing 15 is interconnected with the transceiver subsystem through the KK adapter 7.
Example two
The embodiment is further refined on the basis of the first embodiment, as shown in fig. 3-5, the dual-polarized dual-band integrated antenna assembly comprises an integrated housing 15, and the housing 15 is provided with a model 84-1A of a conductive adhesive 16 for bonding the Ku/Ka band elastic connectors 17, wherein the model comprises 24 groups of quadruplets Ku/Ka band elastic connectors 17; the structure is respectively an integrated antenna micro band plate 1, a conductive adhesive film 3 with a first through hole and a shell 15 with a groove 18 from top to bottom, wherein the integrated antenna micro band plate 1 and the shell 15 are interconnected through the conductive adhesive film 3;
in the embodiment, 1 group of antenna assemblies are formed by splicing 1 group of micro band plates to 1 group of shells 15 according to the proportion, an antenna array surface is formed after the assembly is completed, the antenna array surface is directly installed with an adapter plate 6 through screws 9, a plurality of second through holes 8 are formed in the adapter plate 6, the second through holes 8 are in one-to-one correspondence with a plurality of Ku/Ka frequency band elastic connectors 17 and are used for plugging KK adapters 7;
as shown in fig. 5, the preparation process of the housing 15 in this embodiment specifically includes: selecting an aluminum-silicon gradient composite material with the silicon content of 27%, plating silver on the part of the contact area between the second through hole 8 and the elastic microstrip plate, spot-coating 84-1A conductive adhesive 16 in the groove 18, and coating 2 circles of conductive adhesive 16;
coating strippable solder resist Spot-on in an inner conductor of the elastic connector and a bottom socket, installing a Ka/Ku quadruplet elastic connector into the shell 15 through a fixture, assembling a cementing fixture, putting the assembled hinging fixture into a vacuum oven, curing at 150 ℃ for 60min, then removing the oven, taking down the cementing fixture, stripping the solder resist, and carrying out gas phase cleaning on the shell 15;
paving a conductive adhesive film 3 with the model of J-468 on the integrated antenna microstrip board 1; assembling the integrated antenna micro band plate 1 and the shell 15, and assembling the integrated antenna micro band plate and the shell to an adhesive bonding tool; curing the conductive adhesive film 3 at 130 ℃ for 1.5 hours by vacuum bag pressing to form an antenna array surface; and adopting vapor deposition protection to the antenna array surface.
In the dual-polarized dual-band integrated antenna assembly, the Ka frequency band unit standing wave is less than or equal to 1.5, and the Ku frequency band unit standing wave is less than or equal to 1.5; the thickness of the section is less than or equal to 9.2mm, the flatness is less than or equal to 0.2mm (root mean square), and the plane size is reduced by more than 30% compared with the comparative example; can meet the environmental test requirements of 200 temperature cycles (-40 ℃ to +75 ℃) and 13.88g random vibration, and has good reliability and environmental adaptability.
Example III
The embodiment is further refined on the basis of the first embodiment, the process flow of the embodiment is consistent with that of the comparative example, and the structural difference is as follows: the Ku/Ka band elastic connectors 17 mounted on the housing 15 are Ku/Ka eight-cell connectors, and are 12 groups in total, as shown in fig. 6;
the preparation process of the shell 15 is as follows: selecting kovar alloy, and plating silver on the contact area between the second through hole 8 and the integrated antenna microstrip board 1; the grooves 18 are internally coated with conductive adhesive 16J-423, and the conductive adhesive 16 is coated for 1 circle;
coating peelable solder resist Chemask W8 in the inner conductor and the bottom socket of the elastic connector, mounting the Ka/Ku eight-cell elastic connector into the groove 18 of the shell 15 through a fixture, and assembling a cementing fixture; placing the assembled tooling into a vacuum oven, curing for 30min at 130 ℃, removing the oven, taking down the tooling, stripping the solder resist, and performing gas phase cleaning on the shell 15;
placing a conductive adhesive film 3 with the model of J-468 on the integrated antenna microstrip board 1; assembling the integrated antenna micro band plate 1 and the integrated shell 15 to an adhesive bonding tool; and (3) curing the conductive adhesive film 3 by vacuum bag pressing at the temperature of CSJM8272 ℃ for 2 hours to form an antenna array surface. The antenna array surface is protected by vapor deposition; the tolerance between the antenna assembly units after the assembly is completed is +/-0.02 mm;
in the dual-polarized dual-band integrated antenna assembly of the embodiment, the Ka frequency band unit standing wave is less than or equal to 1.5, and the Ku frequency band unit standing wave is less than or equal to 1.5; the thickness of the section is less than or equal to 9.2mm, the flatness is less than or equal to 0.2mm (root mean square), and the plane size is reduced by more than 40% compared with the comparative example; can meet the environmental test requirements of 200 temperature cycles (-40 ℃ to +75 ℃) and 13.88g random vibration, and has good reliability and environmental adaptability.
The foregoing description of the preferred embodiment of the invention is merely illustrative of the invention and is not intended to be limiting. It will be appreciated by persons skilled in the art that many variations, modifications, and even equivalents may be made thereto without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. The gluing manufacturing method of the missile-borne dual-polarized dual-band integrated antenna assembly is characterized by comprising the following steps of: the method comprises the following steps:
step one: processing a plurality of grooves on a shell, and uniformly dispensing conductive adhesive in the grooves;
step two: inserting Ku/Ka frequency band elastic connectors into the grooves, and completing interconnection of the shell and the elastic connectors through a curing process;
step three: paving an integrated conductive adhesive film on the integrated antenna microstrip board, and installing a positioning pin;
step four: mounting the integrated antenna micro band plate on the shell through a locating pin, and assembling the integrated antenna micro band plate to a gluing tool;
step five: the conductive adhesive film is solidified through vacuum bag pressing, the integrated antenna microstrip board and the shell are bonded, the inner conductor of the elastic connector is tightly attached to the integrated antenna microstrip board to form an antenna array surface, and the antenna array surface is mounted on the adapter plate;
step six: and carrying out vapor deposition protection on the antenna array surface.
2. The method of manufacturing an integrated dual band antenna assembly for dual polarization as claimed in claim 1, wherein in the first step, the material of the housing is one of an aluminum-silicon gradient composite material, a kovar alloy, an aluminum alloy, a titanium alloy, and a magnesium alloy.
3. The method of manufacturing an integrated dual band antenna assembly according to claim 1, wherein in the first step, the conductive adhesive is a silver-based conductive adhesive or a gold-based conductive adhesive, wherein the silver-based conductive adhesive contains no solvent, the mass loss is less than or equal to 0.5% after curing, and the volume resistivity is less than or equal to 5 x 10 after curing is completed -4 Omega cm, chip shearing force is more than or equal to 48N (2 mm x 2 mm), and glass transition temperature is more than or equal to 90 ℃.
4. The method for manufacturing the adhesive of the missile-borne dual-polarized dual-band integrated antenna assembly is characterized in that in the second step, an elastic connector and a shell are fixed by using an adhesive bonding tool, the adhesive bonding tool is placed into a vacuum oven to be cured according to the curing condition of conductive adhesive, the curing condition is 120-150 ℃ for 30-60 min, the adhesive bonding tool is released after the adhesive bonding is finished, the solder resist is peeled off, and the shell is subjected to gas phase cleaning.
5. The method for manufacturing the adhesive of the missile-borne dual-polarized dual-band integrated antenna assembly according to claim 1, wherein in the third step, before the conductive adhesive film is laid, the integrated antenna microstrip board is required to be pre-baked, the drying temperature is 110-130 ℃, and the drying time is 1.5-4.5 hours.
6. The method for manufacturing the missile-borne dual-polarized dual-band integrated antenna assembly by gluing is characterized in that in the third step, a conductive adhesive film is cut by laser cutting, the size of the conductive adhesive film is reduced by 0.1mm, and the conductive adhesive film, an elastic connector and a positioning pin are hollowed out in a corresponding installation area.
7. The method for manufacturing the adhesive of the missile-borne dual-polarized dual-band integrated antenna assembly according to claim 1, wherein in the first step, the shell is in a numerical control milling shape, the dimensional accuracy of the groove is +/-0.02 mm, and the flatness of the mounting surface of the elastic connector is less than or equal to 0.03mm.
8. The method for manufacturing the missile-borne dual-polarized dual-band integrated antenna assembly according to claim 1, wherein in the fifth step, the specific contents are as follows: placing the assembled gluing tool into a vacuum bag, placing the vacuum bag into a vacuum autoclave for curing, wherein the curing temperature of the conductive adhesive film is lower than that of the conductive adhesive, and the curing conditions are as follows: the pressure is 0.1Mpa, the temperature is 120-130 ℃, the curing is 1.5-3 hours, and after the hot pressing is finished, the cementing tool is removed.
9. The method of manufacturing an integrated dual band antenna assembly for dual polarization as claimed in claim 1, wherein in step six, the vapor deposition material for vapor deposition protection of the antenna array surface is parylene.
10. A dual polarized dual band integrated antenna assembly made by the adhesive manufacturing method of the missile-borne dual polarized dual band integrated antenna assembly of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310407399.4A CN116632560A (en) | 2023-04-17 | 2023-04-17 | Gluing manufacturing method of missile-borne dual-polarized dual-band integrated antenna assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310407399.4A CN116632560A (en) | 2023-04-17 | 2023-04-17 | Gluing manufacturing method of missile-borne dual-polarized dual-band integrated antenna assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116632560A true CN116632560A (en) | 2023-08-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310407399.4A Pending CN116632560A (en) | 2023-04-17 | 2023-04-17 | Gluing manufacturing method of missile-borne dual-polarized dual-band integrated antenna assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116632560A (en) |
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2023
- 2023-04-17 CN CN202310407399.4A patent/CN116632560A/en active Pending
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