CN116620859A - Mechanical arm device for storing and carrying wafers - Google Patents
Mechanical arm device for storing and carrying wafers Download PDFInfo
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- CN116620859A CN116620859A CN202310419380.1A CN202310419380A CN116620859A CN 116620859 A CN116620859 A CN 116620859A CN 202310419380 A CN202310419380 A CN 202310419380A CN 116620859 A CN116620859 A CN 116620859A
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- 235000012431 wafers Nutrition 0.000 title claims description 123
- 230000007246 mechanism Effects 0.000 claims abstract description 120
- 230000002452 interceptive effect Effects 0.000 claims abstract description 6
- 230000005540 biological transmission Effects 0.000 claims description 98
- 239000003638 chemical reducing agent Substances 0.000 claims description 26
- 210000000245 forearm Anatomy 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 2
- 230000008901 benefit Effects 0.000 description 5
- 210000001503 joint Anatomy 0.000 description 5
- 238000003032 molecular docking Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to the technical field of wafer storage and transportation, and provides a mechanical arm device for wafer storage and transportation, which comprises: a mechanical arm structure, an internal cable structure; the mechanical arm structure comprises a base mechanism and a plurality of joint arms, wherein the base mechanism is connected with the joint arms end to end in sequence, and any one joint arm is configured to rotate 360 degrees on a fixed horizontal plane; the inner cable structure is integrally sealed and embedded in the mechanical arm structure. According to the technical scheme, the occupied space is small, the goods taking is flexible, 360-degree rotation can be realized by a single arm, left and right library position switching of the wafer box can be realized, and the repeated precision is high. And adopt the line of walking of integrated closed embedded carrying out the arm, the inside is walked the line and can not appear pulling, also can not appear interfering with outside moving part, also not influencing the outward appearance clean and tidy simultaneously to and not extravagant cable resource, reduce cost.
Description
Technical Field
The application relates to the technical field of wafer storage and transportation, in particular to a mechanical arm device for wafer storage and transportation.
Background
Wafer storage refers to the storage of semiconductor wafers in a specific environment to ensure their quality and stability. Since wafers are a very important component of the semiconductor manufacturing process, special measures must be taken to ensure that they are not damaged or contaminated during storage. Wafer storage needs to be performed under specific environmental conditions, such as temperature, humidity, dust control, and the like. Typically, wafers are stored in special containers such as cassettes or boats and inert gases such as nitrogen or argon are used during storage to protect the wafers from oxidation or contamination.
And meanwhile, the wafer box or the wafer boat is stored by adopting a Stocker stereo library. A Stocker stereo library is a device for storing and managing wafers. It is generally composed of a plurality of storage bins, a mechanical arm and the like, can store a large number of wafer cassettes in a small space, and can automatically control the storage and handling of the wafer cassettes. Because wafers are important in semiconductor manufacturing processes, the Stocker's stereoscopic library is widely used in semiconductor manufacturing facilities. A stereoscopic Stocker is typically made up of multiple bins, each of which can hold hundreds to thousands of wafer cassettes. The stereoscopic warehouse of the Stocker can be expanded according to the needs to meet different requirements of factories. In a Stocker stereo library, the robot arm can automatically control the storage and handling of wafers. When a wafer is required, the robot arm automatically removes the wafer from the bin and transports it to the next processing station. When the mechanical arm is used for taking out and putting back the wafer, special measures, such as using antistatic gloves, antistatic tools and the like, must be taken to prevent the wafer from being damaged by static electricity.
When carrying by adopting the mechanical arm in the stereoscopic storage of the Stocker, the existing mechanical arm occupies large space, cannot rotate or has large rotating space, and is difficult to realize mirror image transfer of the wafer box, namely, the wafer box stored on the left side and the right side of the mechanical arm in the stereoscopic storage of the Stocker is mutually transferred on the left side and the right side (the horizontal position is unchanged, and the left side is put on the right side or the right side is put on the left side), and the repeated precision is lower during transfer.
Further, for the routing mode of the mechanical arm adopted in the existing stereoscopic storage of the Stocker, the cable is generally exposed outside the mechanical arm. Because each joint of the mechanical arm moves, the cable is easily pulled to break when being arranged outside the cable; secondly, the mechanical arm is easy to generate winding interference with components in the vertical warehouse, so that the normal operation of the mechanical arm is influenced; thirdly, the appearance and the cleanliness of the whole equipment are affected; fourthly, the cable resource is wasted and the cost is increased.
Disclosure of Invention
The application aims to solve the problems, and provides a mechanical arm device for storing and carrying wafers, which has the advantages of small occupied space, flexible goods taking, 360-degree rotation of a single arm, capability of realizing left and right bin position switching of wafer boxes and high repetition precision. And adopt the line of walking of integrated closed embedded carrying out the arm, the inside is walked the line and can not appear pulling, also can not appear interfering with outside moving part, also not influencing the outward appearance clean and tidy simultaneously to and not extravagant cable resource, reduce cost.
The above object of the present application is achieved by the following technical solutions:
a robotic arm apparatus for wafer storage handling, comprising: a mechanical arm structure, an internal cable structure;
the mechanical arm structure comprises a base mechanism and a plurality of joint arms, wherein the base mechanism is connected with the joint arms end to end in sequence, and any one joint arm is configured to rotate 360 degrees on a fixed horizontal plane; the inner cable structure is integrally sealed and embedded in the mechanical arm structure.
Further, the plurality of articulated arms includes: the wafer box comprises a large arm transmission mechanism, a small arm transmission mechanism and a wafer box bearing arm; the input end of the big arm transmission mechanism is rotatably connected with the base mechanism, the input end of the small arm transmission mechanism is rotatably connected with the output end of the big arm transmission mechanism, and the input end of the wafer box bearing arm is rotatably connected with the output end of the small arm transmission mechanism.
Further, the base mechanism comprises a first driving motor and a first speed reducer;
the first driving motor is connected with the first speed reducer, and drives the large arm transmission mechanism to rotate through the first speed reducer; the input end of the big arm transmission mechanism is rotatably connected with the base mechanism through the connection of the flange interface of the first speed reducer of the base mechanism and the flange interface of the big arm transmission mechanism.
Further, the base mechanism comprises a second driving motor, a first driving wheel, a first conveying belt and a second driving wheel, and the large arm driving mechanism comprises a first rotating shaft, a third driving wheel, a second conveying belt, a fourth driving wheel, a second speed reducer and a second rotating shaft;
the second driving motor drives the first driving wheel, the first driving wheel drives the second driving wheel through the first conveying belt, the second driving wheel is connected with the first rotating shaft, the third driving wheel is driven by the first rotating shaft, the third driving wheel drives the fourth driving wheel through the second conveying belt, the second speed reducer is driven by the fourth driving wheel, and the forearm transmission mechanism is driven by the second speed reducer to rotate; the input end of the small arm transmission mechanism is rotatably connected with the output end of the large arm transmission mechanism through the connection of the flange interface of the second speed reducer of the large arm transmission mechanism and the flange interface of the small arm transmission mechanism, and the second rotating shaft is connected with the fourth driving wheel.
Further, the small arm transmission mechanism comprises a fifth transmission wheel, a third transmission belt, a sixth transmission wheel and a third rotation shaft, and the wafer box bearing arm comprises a flange seat;
the fifth driving wheel drives the sixth driving wheel through the third conveying belt, the sixth driving wheel is connected with the third rotating shaft, the third rotating shaft is connected with the wafer box bearing arm, and the wafer box bearing arm is driven to rotate through the third rotating shaft; the input end of the wafer box bearing arm is rotatably connected with the output end of the small arm transmission mechanism through the connection of the third rotating shaft of the small arm transmission mechanism and the flange seat of the wafer box bearing arm.
Further, the internal cable structure includes: the wire slot comprises an arm body wire slot, a cable, a wire slot bracket and a fixing buckle;
the arm body wire slot is arranged in the mechanical arm structure and is used for laying the cable; the cable support is arranged in the mechanical arm structure, and the layout passage of the arm body wire slot is used for lifting the cable, so that the cable is prevented from interfering with the internal transmission structure of the mechanical arm mechanism, and a dredging effect is achieved; the fixing buckle is used for fixing the cable and preventing the cable from swinging at will in the mechanical arm mechanism and affecting the transmission of the internal transmission structure.
Further, the base mechanism further comprises: the motor comprises a mounting seat, a mounting backboard, a base supporting plate, a motor driving seat and a motor mounting fixing plate;
the mounting seat is used for mounting and fixing the joint arm; the mounting backboard and the base support backboard are used for fixedly supporting the mounting seat and the internal structure of the base mechanism; the motor driving seat is used for transmitting the rotation moment of the second driving motor to the first driving wheel, and the motor mounting fixing plate is used for fixedly mounting the second driving motor.
Further, the wafer cassette carrier arm further comprises: the wafer carrier comprises a bracket, a first wafer bracket, a second wafer bracket and a positioning pin;
the bracket is horizontally arranged for placing the wafer box; the first wafer support is perpendicular to the bracket, the second wafer support is perpendicular to the first wafer support and is arranged above the bracket and used for supporting the wafer box and preventing the wafer box from sliding backwards and falling; the locating pin is arranged on the bracket and used for locating the wafer box.
Further, the mechanical arm structure further includes: a plurality of sets of sensor structures;
the sensor structure is used for teaching functions of the rotation positions and initial origins of the plurality of joint arms, rough positioning recognition after the mechanical arms rotate in place and high-precision positioning recognition after the mechanical arms extend out of place.
Further, the execution sequence of the plurality of joint arms is as follows:
the large arm transmission mechanism performs clockwise rotation, the small arm transmission mechanism performs anticlockwise rotation, and the wafer box bearing arm performs clockwise rotation;
or (b)
The big arm transmission mechanism performs anticlockwise rotation, the small arm transmission mechanism performs clockwise rotation, and the wafer box bearing arm performs anticlockwise rotation;
in order to keep the wafer box moving in a straight line when the wafer box bearing arm is used for taking and placing the wafer box, the rotating angle of the large arm transmission mechanism is consistent with the rotating angle of the small arm transmission mechanism but opposite in direction, and the rotating speed and the rotating angle of the small arm transmission mechanism are consistent with the wafer box bearing arm but opposite in direction.
Compared with the prior art, the application has the following beneficial effects:
(1) The mechanical arm structure designed by the application comprises a base mechanism and a plurality of joint arms, wherein the base mechanism is connected with the joint arms in sequence in an end-to-end mode, and any joint arm is configured to rotate in 360 degrees on a fixed horizontal plane. According to the technical scheme, the space occupation is small, the goods taking is flexible, 360-degree rotation of a single joint arm can be realized, mirror image switching of left and right library positions of the wafer box can be realized, and the repeated precision is high.
(2) The application integrally seals and embeds the internal cable structure in the mechanical arm structure. Above-mentioned technical scheme will walk the line setting inside the arm, can guarantee to walk the line and can not appear pulling, can not appear interfering with outside motion part, also not influencing the outward appearance clean and tidy simultaneously to and not extravagant cable resource, reduce cost.
(3) The mechanical arm device also has the advantages of strong loading capacity and high cleanliness.
Drawings
FIG. 1 is a schematic view of an overall structure of a robot arm apparatus for wafer storage and handling according to the present application;
FIG. 2 is a detailed cross-sectional view of a robot arm assembly for wafer storage handling according to the present application;
fig. 3 is a schematic diagram illustrating an internal routing of a robot arm device for wafer storage and handling according to the present application.
Reference numerals
1, a mechanical arm structure; 2: an internal cable structure; 3: a wafer cassette;
11: a base mechanism; 12: a large arm transmission mechanism; 13: a forearm transmission mechanism; 14: a wafer cassette carrier arm;
111: a first driving motor; 112: a first speed reducer; 113: a second driving motor; 114: a first driving wheel; 115: a first conveyor belt; 116: a second driving wheel; 117: a mounting base; 118. mounting a backboard; 119. a base support plate; 1110. a motor driving seat; 1111: a motor is provided with a fixed plate; 1112: a first inert wheel;
121: a first rotation shaft; 122: a third driving wheel; 123: a second conveyor belt; 124: a fourth driving wheel; 125: a second speed reducer; 126: a second rotation shaft; 127: a first sensor structure; 128: a second inert wheel;
131: a fifth driving wheel; 132: a third conveyor belt; 133: a sixth driving wheel; 134: a third rotation shaft; 135: a second sensor structure; 136: a third sensor structure; 137: a third inert wheel;
141: a flange seat; 142: a bracket; 143: a first wafer support; 144: a second wafer support; 145: a positioning pin;
21: a cable; 22: a wire slot bracket; 23: and fixing the buckle.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
First embodiment
As shown in fig. 1-3, the present embodiment provides a mechanical arm device for storing and carrying wafers, which includes: a mechanical arm structure 1 and an internal cable structure 2.
The mechanical arm structure 1 comprises a base mechanism 11 and a plurality of joint arms, wherein the base mechanism 11 and the joint arms are sequentially connected end to end, and any joint arm is configured to rotate 360 degrees on a fixed horizontal plane. The inner cable structure 2 is integrally sealed and embedded in the mechanical arm structure 1.
Specifically, the application mainly comprises two parts, namely the mechanical arm structure 1 comprising a base mechanism 11 and a plurality of joint arms, wherein each joint arm can realize 360-degree rotation in the horizontal direction, the advantages of small occupied space, flexible goods taking and 360-degree rotation of a single arm are realized, the left and right warehouse position switching of the wafer box is easy to realize, and the repeatability precision is high. Secondly, close the cable of arm device into the inside of embedded and arm structure 1 of inside cable structure integration, can guarantee to walk the line and can not appear pulling, can not appear interfering with outside moving part, also not influencing the outward appearance clean and tidy simultaneously to and not extravagant cable resource, reduce cost.
The following is a specific description of the mechanical arm structure 1 and the internal cable structure 2:
several of the articulated arms include: a large arm drive 12, a small arm drive 13 and a wafer cassette carrier arm 14. The base mechanism 11, the big arm transmission mechanism 12, the small arm transmission mechanism 13 and the wafer box bearing arm 14 are connected end to end in sequence, and specifically: the input end of the big arm transmission mechanism 12 is rotatably connected with the base mechanism 11, the input end of the small arm transmission mechanism 13 is rotatably connected with the output end of the big arm transmission mechanism 12, and the input end of the wafer box bearing arm 14 is rotatably connected with the output end of the small arm transmission mechanism 13. And the transmission of force inside a plurality of joint arms is realized through an internal transmission mechanism, so that 360-degree rotation of each joint arm is realized.
The following is the rotation principle of each joint arm and the specific docking mode:
(1) Rotation principle and docking mode of large arm transmission mechanism 12
Principle of rotation: the base mechanism 11 includes a first drive motor 111 and a first speed reducer 112; the first driving motor 111 is connected to the first speed reducer 112, and drives the large arm transmission mechanism 12 to rotate through the first speed reducer 112.
The butt joint mode is as follows: the input end of the large arm transmission mechanism 12 is rotatably connected with the base mechanism 11 through the connection of the flange interface of the first speed reducer 112 of the base mechanism 11 and the flange interface of the large arm transmission mechanism 12.
(2) Rotation principle and docking mode of forearm transmission 13
Principle of rotation: the base mechanism 11 comprises a second driving motor 113, a first driving wheel 114, a first conveying belt 115 and a second driving wheel 116, and the large arm driving mechanism 12 comprises a first rotating shaft 121, a third driving wheel 122, a second conveying belt 123, a fourth driving wheel 124, a second speed reducer 125 and a second rotating shaft 126; the second driving motor 113 drives the first driving wheel 114, the first driving wheel 114 drives the second driving wheel 116 through the first conveying belt 115, the second driving wheel 116 is connected with the first rotating shaft 121, the third driving wheel 122 is driven through the first rotating shaft 121, the third driving wheel 122 drives the fourth driving wheel 124 through the second conveying belt 123, the fourth driving wheel 124 drives the second speed reducer 125, and the forearm transmission mechanism 13 is driven to rotate through the second speed reducer 125.
The butt joint mode is as follows: the flange interface of the second speed reducer 125 of the large arm transmission mechanism 12 is connected with the flange interface of the small arm transmission mechanism 13, so that the input end of the small arm transmission mechanism 13 is rotatably connected with the output end of the large arm transmission mechanism 12, and the second rotating shaft 126 is connected with the fourth driving wheel 124.
(3) Rotation principle and docking mode of wafer cassette carrier arm 14
Principle of rotation: the small arm transmission mechanism comprises a fifth transmission wheel 131, a third transmission belt 132, a sixth transmission wheel 133 and a third rotating shaft 134, and the wafer box bearing arm comprises a flange seat 141; the fifth driving wheel 131 drives the sixth driving wheel 133 through the third conveying belt 132, the sixth driving wheel 133 is connected to the third rotating shaft 134, the third rotating shaft 134 is connected to the wafer cassette carrier arm 14, and the third rotating shaft 134 drives the wafer cassette carrier arm 14 to rotate.
The butt joint mode is as follows: the third rotary shaft 134 of the arm transmission mechanism 14 is connected with the flange seat 141 of the wafer box carrying arm 14, so that the input end of the wafer box carrying arm 14 is rotatably connected with the output end of the arm transmission mechanism 13.
The above is the rotation principle of each joint arm, and the specific butt joint mode of each joint arm and the previous structure. The foregoing is merely specific and other ways may be used in practice.
The inner cable construction 2 comprises: the wire slot is formed by an arm body, a cable 21, a wire slot bracket 22 and a fixing buckle 23. The arm body wire slot is arranged in the mechanical arm structure 1 and is used for laying the cable 21; the cable support 22 is disposed in the mechanical arm structure 1, and is disposed on a routing path of the arm body trunking, and is used for raising the cable 21, so as to avoid interference between the cable 21 and an internal transmission structure of the mechanical arm structure 1, and play a role in dredging; the fixing buckle 23 is used for fixing the cable 21, and preventing the cable 21 from swinging randomly in the mechanical arm mechanism 1 to influence the transmission of an internal transmission structure.
In fig. 3, the arm-shaped wire groove is drawn from below the first rotation shaft 121, passes through the center of the first rotation shaft 121, winds over the first rotation shaft 121, guides the arm-shaped wire groove to the bottom of the arm-shaped wire groove 12 through the wire groove bracket 22, sets the arm-shaped wire groove in a direction close to the second rotation shaft 126, fixes the arm-shaped wire groove through the fixing buckle 23, enters from below the second rotation shaft 126, and exits from above the second rotation shaft 126 to enter the forearm-shaped wire groove 13. The layout modes of the arm body line grooves of the other joint arms are similar, and are not repeated in the embodiment. In addition, the layout mode of the arm body wire slot is not limited to the above, and various other different modes can be adopted, so that the cables can be reasonably arranged in the arm body without influencing the operation of the transmission mechanism.
Further, the base unit 11 further includes: mounting base 117, mounting back plate 118, base support plate 119, motor drive base 1110, motor mounting fixing plate 1111; the mounting seat 117 is used for mounting and fixing the joint arm; the mounting back plate 118 and the base support back plate 119 are used for fixedly supporting the mounting base 117 and the internal structure of the base mechanism 11; the motor driving base 1110 is used for transmitting the rotation moment of the second driving motor 113 to the first driving wheel 114, and the motor mounting fixing plate 1111 is used for fixedly mounting the second driving motor 113.
Further, the wafer cassette carrier arm 14 further comprises: a bracket 142, a first wafer support 143, a second wafer support 144, and a positioning pin 145; the bracket 142 is horizontally arranged for placing the wafer cassette 3; the first wafer support 143 is perpendicular to the bracket 142, and the second wafer support 144 is perpendicular to the first wafer support 143, and is disposed above the bracket 142, and is used for supporting the wafer box 3, so as to prevent the wafer box 3 from sliding and falling backward; the positioning pins 145 are disposed on the bracket 142, and are used for positioning the wafer cassette 3.
Further, the mechanical arm structure 1 further includes: a plurality of sets of sensor structures;
the sensor structure is used for teaching functions of the rotation positions and initial origins of the plurality of joint arms, rough positioning recognition after the mechanical arms rotate in place and high-precision positioning recognition after the mechanical arms extend out of place. A first sensor structure 127 disposed on the large arm drive mechanism 12, a second sensor structure 135, a third sensor structure 136, and a fourth sensor structure 137 disposed on the wafer cassette carrier arm 14; wherein the first sensor structure 127 is used for detecting the rotation position and the initial origin of the articulated arm, the second sensor structure 135 and the third sensor structure 136 are used for coarse positioning identification and high-precision positioning identification respectively, and the fourth sensor structure 137 is used for detecting whether the wafer cassette 3 is put in place or not.
Further, first, second and third inert wheels 1112, 128 and 137 are respectively provided for the first, second and third conveyor belts 115, 123 and 132 for adjusting the tension of the conveyor belts.
Further, the execution sequence of the plurality of joint arms is as follows:
the large arm transmission mechanism 12 performs clockwise rotation, the small arm transmission mechanism 13 performs anticlockwise rotation, and the wafer box bearing arm 14 performs clockwise rotation;
or (b)
The big arm transmission mechanism 12 performs anticlockwise rotation, the small arm transmission mechanism 13 performs clockwise rotation, and the wafer box bearing arm 14 performs anticlockwise rotation;
in order to keep the wafer box carrying arm 14 in linear translation motion when taking and placing the wafer box, the rotation angle of the big arm transmission mechanism 12 is consistent with the rotation angle of the small arm transmission mechanism 13 but opposite to the rotation angle, and the rotation speed and the rotation angle of the small arm transmission mechanism 13 are consistent with the wafer box carrying arm 14 but opposite to the rotation angle of the small arm transmission mechanism 13.
The object can be fetched and placed in the narrow space in a horizontal linear motion mode by driving forward and backward motion of multiple joints of the mechanical arm through the motor; the advantage of design like this is that can realize closely the station and get put article, occupation space is little, is difficult for taking place the collision, still can practice thrift the space, increases standing stock volume, improves space utilization.
The above description is only a preferred embodiment of the present application, and the protection scope of the present application is not limited to the above examples, and all technical solutions belonging to the concept of the present application belong to the protection scope of the present application. It should be noted that modifications and adaptations to the present application may occur to one skilled in the art without departing from the principles of the present application and are intended to be within the scope of the present application.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
It should be noted that the above embodiments can be freely combined as needed. The foregoing is merely a preferred embodiment of the present application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present application, which are intended to be comprehended within the scope of the present application.
Claims (10)
1. A robotic arm apparatus for storing and handling wafers, comprising: a mechanical arm structure, an internal cable structure;
the mechanical arm structure comprises a base mechanism and a plurality of joint arms, wherein the base mechanism is connected with the joint arms end to end in sequence, and any one joint arm is configured to rotate 360 degrees on a fixed horizontal plane;
the inner cable structure is integrally sealed and embedded in the mechanical arm structure.
2. The robotic arm apparatus for wafer storage handling of claim 1, wherein a plurality of the articulated arms comprise: the wafer box comprises a large arm transmission mechanism, a small arm transmission mechanism and a wafer box bearing arm;
the input end of the big arm transmission mechanism is rotatably connected with the base mechanism, the input end of the small arm transmission mechanism is rotatably connected with the output end of the big arm transmission mechanism, and the input end of the wafer box bearing arm is rotatably connected with the output end of the small arm transmission mechanism.
3. The robotic arm apparatus for wafer storage and handling of claim 2, wherein the base mechanism comprises a first drive motor and a first speed reducer;
the first driving motor is connected with the first speed reducer, and drives the large arm transmission mechanism to rotate through the first speed reducer;
the input end of the big arm transmission mechanism is rotatably connected with the base mechanism through the connection of the flange interface of the first speed reducer of the base mechanism and the flange interface of the big arm transmission mechanism.
4. The mechanical arm device for storing and transporting wafers according to claim 2, wherein the base mechanism comprises a second driving motor, a first driving wheel, a first conveying belt and a second driving wheel, and the large arm driving mechanism comprises a first rotating shaft, a third driving wheel, a second conveying belt, a fourth driving wheel, a second speed reducer and a second rotating shaft;
the second driving motor drives the first driving wheel, the first driving wheel drives the second driving wheel through the first conveying belt, the second driving wheel is connected with the first rotating shaft, the third driving wheel is driven by the first rotating shaft, the third driving wheel drives the fourth driving wheel through the second conveying belt, the second speed reducer is driven by the fourth driving wheel, and the forearm transmission mechanism is driven by the second speed reducer to rotate;
the input end of the small arm transmission mechanism is rotatably connected with the output end of the large arm transmission mechanism through the connection of the flange interface of the second speed reducer of the large arm transmission mechanism and the flange interface of the small arm transmission mechanism, and the second rotating shaft is connected with the fourth driving wheel.
5. The mechanical arm device for storing and transporting wafers according to claim 2, wherein the small arm transmission mechanism comprises a fifth transmission wheel, a third transmission belt, a sixth transmission wheel and a third rotation shaft, and the wafer box bearing arm comprises a flange seat;
the fifth driving wheel drives the sixth driving wheel through the third conveying belt, the sixth driving wheel is connected with the third rotating shaft, the third rotating shaft is connected with the wafer box bearing arm, and the wafer box bearing arm is driven to rotate through the third rotating shaft;
the input end of the wafer box bearing arm is rotatably connected with the output end of the small arm transmission mechanism through the connection of the third rotating shaft of the small arm transmission mechanism and the flange seat of the wafer box bearing arm.
6. The robotic arm apparatus for wafer storage handling of claim 1, wherein the internal cable structure comprises: the wire slot comprises an arm body wire slot, a cable, a wire slot bracket and a fixing buckle;
the arm body wire slot is arranged in the mechanical arm structure and is used for laying the cable;
the cable support is arranged in the mechanical arm structure, and the layout passage of the arm body wire slot is used for lifting the cable, so that the cable is prevented from interfering with the internal transmission structure of the mechanical arm mechanism, and a dredging effect is achieved;
the fixing buckle is used for fixing the cable and preventing the cable from swinging at will in the mechanical arm mechanism and affecting the transmission of the internal transmission structure.
7. The robotic arm apparatus for wafer storage and handling of claim 4, wherein the base mechanism further comprises: the motor comprises a mounting seat, a mounting backboard, a base supporting plate, a motor driving seat and a motor mounting fixing plate;
the mounting seat is used for mounting and fixing the joint arm;
the mounting backboard and the base support backboard are used for fixedly supporting the mounting seat and the internal structure of the base mechanism;
the motor driving seat is used for transmitting the rotation moment of the second driving motor to the first driving wheel, and the motor mounting fixing plate is used for fixedly mounting the second driving motor.
8. The robotic arm apparatus for wafer storage handling of claim 2, wherein the wafer cassette carrier arm further comprises: the wafer carrier comprises a bracket, a first wafer bracket, a second wafer bracket and a positioning pin;
the bracket is horizontally arranged for placing the wafer box;
the first wafer support is perpendicular to the bracket, the second wafer support is perpendicular to the first wafer support and is arranged above the bracket and used for supporting the wafer box and preventing the wafer box from sliding backwards and falling;
the locating pin is arranged on the bracket and used for locating the wafer box.
9. The robotic arm apparatus for wafer storage handling of claim 1, wherein the robotic arm structure further comprises: a plurality of sets of sensor structures;
the sensor structure is used for teaching functions of the rotation positions and initial origins of the plurality of joint arms, rough positioning recognition after the mechanical arms rotate in place and high-precision positioning recognition after the mechanical arms extend out of place.
10. The robot arm apparatus for wafer storage handling of claim 2, wherein the sequence of execution of the plurality of articulated arms is:
the large arm transmission mechanism performs clockwise rotation, the small arm transmission mechanism performs anticlockwise rotation, and the wafer box bearing arm performs clockwise rotation;
or (b)
The big arm transmission mechanism performs anticlockwise rotation, the small arm transmission mechanism performs clockwise rotation, and the wafer box bearing arm performs anticlockwise rotation;
in order to keep the wafer box moving in a straight line when the wafer box bearing arm is used for taking and placing the wafer box, the rotating angle of the large arm transmission mechanism is consistent with the rotating angle of the small arm transmission mechanism but opposite in direction, and the rotating speed and the rotating angle of the small arm transmission mechanism are consistent with the wafer box bearing arm but opposite in direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310419380.1A CN116620859A (en) | 2023-04-19 | 2023-04-19 | Mechanical arm device for storing and carrying wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310419380.1A CN116620859A (en) | 2023-04-19 | 2023-04-19 | Mechanical arm device for storing and carrying wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116620859A true CN116620859A (en) | 2023-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310419380.1A Pending CN116620859A (en) | 2023-04-19 | 2023-04-19 | Mechanical arm device for storing and carrying wafers |
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| Country | Link |
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| CN (1) | CN116620859A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117484526A (en) * | 2023-12-29 | 2024-02-02 | 泓浒(苏州)半导体科技有限公司 | Mechanical arm linkage structure for conveying wafers and control method thereof |
-
2023
- 2023-04-19 CN CN202310419380.1A patent/CN116620859A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117484526A (en) * | 2023-12-29 | 2024-02-02 | 泓浒(苏州)半导体科技有限公司 | Mechanical arm linkage structure for conveying wafers and control method thereof |
| CN117484526B (en) * | 2023-12-29 | 2024-03-19 | 泓浒(苏州)半导体科技有限公司 | Mechanical arm linkage structure for conveying wafers and control method thereof |
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