CN116601748A - Flip chip package with improved thermal performance - Google Patents
Flip chip package with improved thermal performance Download PDFInfo
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- CN116601748A CN116601748A CN202080107369.6A CN202080107369A CN116601748A CN 116601748 A CN116601748 A CN 116601748A CN 202080107369 A CN202080107369 A CN 202080107369A CN 116601748 A CN116601748 A CN 116601748A
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- 239000000853 adhesive Substances 0.000 claims abstract description 107
- 230000001070 adhesive effect Effects 0.000 claims abstract description 107
- 238000000465 moulding Methods 0.000 claims abstract description 73
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000000463 material Substances 0.000 claims abstract description 60
- 238000000034 method Methods 0.000 claims description 61
- 230000002787 reinforcement Effects 0.000 claims description 19
- 239000003351 stiffener Substances 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 9
- 101710149792 Triosephosphate isomerase, chloroplastic Proteins 0.000 description 95
- 101710195516 Triosephosphate isomerase, glycosomal Proteins 0.000 description 95
- 238000012986 modification Methods 0.000 description 25
- 230000004048 modification Effects 0.000 description 25
- 230000032798 delamination Effects 0.000 description 12
- 238000004891 communication Methods 0.000 description 10
- 238000012545 processing Methods 0.000 description 9
- 230000001965 increasing effect Effects 0.000 description 8
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- 230000015572 biosynthetic process Effects 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000002041 carbon nanotube Substances 0.000 description 5
- 229910021393 carbon nanotube Inorganic materials 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- 238000013473 artificial intelligence Methods 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A flip chip package (200) is provided, wherein the flip chip package comprises: at least one chip (202) for connection to a substrate (201); a molding member (209) formed on the substrate (201) to wrap side portions of the at least one chip (202) and expose a top surface of each chip (202), wherein an upper surface of the molding member (209) has a first region continuous with the top surface of each chip (202), a second region to which an adhesive (210) is applied, and a wall-like structure (209 a) placed to surround the top surface of each chip (202), and the first and second regions are separated by the wall-like structure (209 a); a heat spreader (206) placed over the top surface of each chip (202) and bonded to the molding member (209) by an adhesive (210) filled in the second region; a thermal interface material (205), the thermal interface material (205) filling in a spatial region formed by the first region, a top surface of each chip (202), at least a portion of a bottom surface of the heat spreader (206), and a first side of the wall-like structure (209 a).
Description
Technical Field
The present invention relates to a flip chip package having improved thermal properties, a device equipped with a circuit to which the flip chip package structure is applied, and a method of assembling the flip chip package.
Background
Recently, advances in processing performance of semiconductor packages have placed higher demands on thermal performance to ensure stable operation. In this regard, flip chip packaging is advantageous in terms of thermal performance because its structural feature is that the chip is connected to the substrate by bumps underneath it, enabling the heat spreader to be positioned on the top surface of the chip.
To improve cooling performance, a thermal interface material (thermal interface material, TIM) such as thermal grease is applied to the top surface of the chip and sandwiched between the chip and at least a portion of the heat spreader. The thickness of the TIM is preferably made smaller from the standpoint of reducing the thermal resistance in the TIM to improve the thermal performance of the package.
U.S. patent No. 8,368,194 proposes a flip chip package having a heat spreader that includes a flat cover and sidewalls extending downward from the ends of the flat cover. In the proposed package, the distance between the flat cover and the substrate provided with the chip is defined by the height of the side walls in the heat sink made of solid metal. In this case, the thickness of the TIM is defined by the distance between the bottom surface of the flat cover and the top surface of the chip on the substrate, such that the thickness of the TIM is also defined by the height of the sidewalls. Thus, it is difficult to carefully control the thickness of the TIM during assembly of the proposed package. This means that in some cases, it may be difficult to achieve a small thickness of the TIM for the proposed package to achieve higher thermal performance sufficient to ensure stable operation.
Further, when the proposed package is assembled, the difference in thermal expansion coefficient among the heat spreader, the substrate, and the chip causes the gap between the chip and the flat cover (hereinafter referred to as "TIM gap") to expand. The expansion of the TIM gap promotes delamination of the TIM from the heatsink. Delamination of the TIM reduces thermal performance and increases junction temperature during operation, resulting in reduced reliability. As mentioned above, the proposed package has a problem to be solved in achieving higher thermal performance sufficient to ensure stable operation.
Desmond Y.R.Chong et al in the development of a completely new improved high performance flip chip BGA package (taken from conference electronics and technology, 2004, pages 1174-1180) proposes a flip chip package having structural features for reducing the expansion of the TIM gap during the reflow process. The proposed package has a molded member formed on a substrate and is bonded by an adhesive applied to an upper surface of the molded member. The molding member may act as a support member to physically maintain a gap between the heat spreader and the substrate, thereby reducing the TIM gap from expanding during the reflow process.
However, the proposed packages lack structures for controlling TIM thickness and/or TIM gap size, and therefore it is difficult to carefully control TIM gaps to achieve small thickness of TIMs, resulting in higher thermal performance that is sufficient to ensure stable operation. Furthermore, the proposed encapsulated TIM may be in contact with an adhesive applied to the upper surface of the molded component, and at least a portion of the TIM may flow into the adhesive and/or at least a portion of the adhesive may flow into the TIM during the reflow process.
If the TIM flows into the adhesive during the reflow process, voids will be created in the TIM, resulting in an increase in thermal resistance in the TIM. Furthermore, if the adhesive flows into the TIM during the reflow process, the effective volume of the TIM will decrease, resulting in an increase in thermal resistance in the TIM. The increase in thermal resistance in TIMs in turn leads to reduced thermal performance. As mentioned above, the proposed package has a problem to be solved in achieving higher thermal performance sufficient to ensure stable operation.
Disclosure of Invention
Embodiments of the present invention provide a flip chip package, a device equipped with a circuit to which the package structure is applied, and a method of assembling the package.
For example, the circuitry of the application package may be processing circuitry such as a central processing unit (central processing unit, CPU), field-programmable gate array (field-programmable gate array, FPGA), application specific integrated circuit (application specific integrated circuit, ASIC), graphics processing unit (graphics processing unit, GPU), or the like. Further, the circuit to which the package is applied may be a communication circuit such as a high-frequency circuit for a wired communication interface, a wireless communication interface, an optical communication interface, a network switch, or the like. Further, the circuit to which the package is applied may be a power control circuit, such as a power control unit for a vehicle, an energy management system, or the like.
The device may be a mobile device such as a cell phone, smart phone, tablet computer, wearable computer, etc. Further, the apparatus may be a personal computer, a workstation, a server, an artificial intelligence (artificial intelligence, AI) cluster, a cloud computing system, an internet of things (Internet of Things, ioT) device, or the like. In addition, the device may be a camera such as a digital still camera, a digital camera, a security/surveillance camera, a web camera, a video camera, an automobile/transportation camera, a medical camera, machine vision, or the like. Alternatively, the apparatus may be a component comprising the above-described circuitry, such as a module or an electronic unit in a computer or computing system.
In the following, modifier words such as "top", "bottom", "upper", "lower", "upward" and "downward" may be used, but these modifier words merely indicate the relative positional relationship among their target elements, and do not point in any particular direction with respect to the ground. For example, the top surface of the chip may represent the front surface of the chip facing the heat spreader in the flip chip package and the bottom surface of the chip may represent the opposite surface of the chip facing the substrate in the package.
A first aspect of an embodiment of the present invention provides a flip chip package. In a first possible implementation manner of the first aspect, the packaging includes:
at least one chip for connection with the substrate;
a molding member formed on the substrate to wrap side portions of the at least one chip and expose a top surface of each chip, an upper surface of the molding member having a first region continuous with the top surface of each chip, a second region to which an adhesive is applied, and a wall-like structure disposed to surround the top surface of each chip, the first and second regions being separated by the wall-like structure;
a heat spreader placed over a top surface of the at least one chip and bonded to the molded member by an adhesive applied to the second area;
and a thermal interface material filled in a spatial region formed by the first region, the top surface of each chip, at least a portion of the bottom surface of the heat spreader, and the first side of the wall-like structure.
Alternatively, the heat spreader may be made of Cu, ag-diamond, or Co-Mo. Heat sinks made with lower coefficient of thermal expansion (coefficient of thermal expansion, CTE) materials can reduce stress on the thermal interface material during the reflow process.
According to a first possible implementation form of the first aspect, the thermal interface material is formed in a spatial region surrounded by a top surface of the each chip, a bottom surface of the heat spreader, a first region of the molding member, and one side of a wall-like structure in the molding member. Thus, the thickness of the thermal interface material is defined by the height of the wall-like structures in the molded component. Since the height of the wall-like structure composed of the mold compound can be easily controlled during the molding process, the thickness of the thermal interface material can be adjusted to a desired small thickness, thereby achieving improved thermal performance.
Furthermore, in a first possible implementation of the first aspect, the first region and the second region of the molded member are spatially separated by a wall-like structure, thereby avoiding mixing of the thermal interface material applied to the first region and the adhesive applied to the second region during the reflow process. This can avoid the formation of voids in the thermal interface material and prevent the thermal interface material from flowing out into the adhesive, thereby improving thermal performance. In addition, the molded member may serve as a support member to maintain the distance between the bottom of the heat spreader and the substrate, thereby reducing the risk of delamination of the thermal interface material from the heat spreader during the reflow process. For the above reasons, the package according to the first possible implementation of the first aspect may achieve improved thermal performance, thereby ensuring sufficient operational reliability.
A second possible implementation manner of the first aspect provides a package according to the first possible implementation manner of the first aspect, the package further including:
a reinforcement having a square frame-like structure, the reinforcement being formed on the base plate to surround an outer side of the molding member, and the molding member being formed to fill an inner region of the reinforcement.
According to a second possible implementation manner of the first aspect, the reinforcement may enhance the strength of the package, thereby increasing the resistance of the package to external impact.
A third possible implementation manner of the first aspect provides the package according to the first possible implementation manner of the first aspect, wherein:
the heat spreader has a cover portion placed over the at least one chip and a side portion extending downward from an end of the cover portion, the side portion being placed outside the mold member, and an end of the side portion being bonded to a substrate by an adhesive.
According to a third possible implementation manner of the first aspect, the side portion of the heat spreader may enhance the strength of the package, thereby increasing the resistance of the package to external impact. In addition, the structure of the heat sink having the side portions can ensure a large area for heat dissipation to improve cooling efficiency, thereby improving thermal performance thereof.
Optionally, according to any of the first to third possible implementations of the first aspect, in the encapsulation, the second area comprises an adhesive pool for filling the adhesive, wherein the second side of the wall-like structure forms at least part of one side of the adhesive pool.
Alternatively, according to any one of the first to fifth possible implementation manners of the first aspect, in the package, a height of the wall-like structure may be controlled to be about 200 μm or less, and a width thereof may also be controlled to be about 3.0mm or less.
Alternatively, according to any one of the first to third possible implementations of the first aspect, in the package, the thermal interface material may be composed of an organic-based material (e.g., silicon, etc.), a metal (e.g., inSn, inAg, etc.), an Ag sintered material (e.g., nano Ag, etc.), or a Carbon Nanotube (CNT) -based material, etc.
The second aspect of the embodiments of the present invention provides the apparatus. In a first possible implementation manner of the second aspect, the apparatus includes a circuit composed of a flip-chip package, the flip-chip package including:
at least one chip for connection with the substrate;
A molding member formed on the substrate to wrap side portions of the at least one chip and expose a top surface of each chip, an upper surface of the molding member having a first region continuous with the top surface of each chip, a second region to which an adhesive is applied, and a wall-like structure disposed to surround the top surface of each chip, the first and second regions being separated by the wall-like structure;
a heat spreader placed over a top surface of the at least one chip and bonded to the molded member by an adhesive applied to the second area;
and a thermal interface material filled in a spatial region formed by the first region, the top surface of each chip, at least a portion of the bottom surface of the heat spreader, and the first side of the wall-like structure.
Alternatively, the heat spreader may be made of Cu, ag-diamond, or Co-Mo. Heat sinks made with lower CTE materials can reduce stress on the thermal interface material during the reflow process.
According to a first possible implementation of the second aspect, the thermal interface material is formed in a spatial region surrounded by a top surface of the each chip, a bottom surface of the heat spreader, the first region of the molding member, and one side of a wall-like structure in the molding member. Thus, the thickness of the thermal interface material is defined by the height of the wall-like structures in the molded component. Since the height of the wall-like structure composed of the mold compound can be easily controlled during the molding process, the thickness of the thermal interface material can be adjusted to a desired small thickness, thereby achieving improved thermal performance.
Furthermore, in a first possible implementation of the second aspect, the first and second regions of the molded member are spatially separated by a wall-like structure, thereby avoiding mixing of the thermal interface material applied to the first region and the adhesive applied to the second region during the reflow process. This can avoid the formation of voids in the thermal interface material and prevent the thermal interface material from flowing out into the adhesive, thereby improving thermal performance. In addition, the molded member may serve as a support member to maintain the distance between the bottom of the heat spreader and the substrate, thereby reducing the risk of delamination of the thermal interface material from the heat spreader during the reflow process. For the above reasons, the package according to the first possible implementation of the second aspect may achieve improved thermal performance, thereby ensuring sufficient operational reliability such that stable operation of the device may be achieved even in high load environments.
A second possible implementation manner of the second aspect provides the apparatus according to the first possible implementation manner of the second aspect, the package further includes:
a reinforcement having a square frame-like structure, the reinforcement being formed on the base plate to surround an outer side of the molding member, and the molding member being formed to fill an inner region of the reinforcement.
According to a second possible implementation manner of the second aspect, the reinforcement may enhance the strength of the package, thereby increasing the resistance of the device to external impact.
A third possible implementation manner of the second aspect provides the apparatus according to the first possible implementation manner of the second aspect, wherein:
the heat spreader has a cover portion placed over the at least one chip and a side portion extending downward from an end of the cover portion, the side portion being placed outside the mold member, and an end of the side portion being bonded to a substrate by an adhesive.
According to a third possible implementation manner of the second aspect, the side portion of the heat spreader may enhance the strength of the package, thereby increasing the resistance of the device to external impact. In addition, the structure of the heat sink having the side portions can ensure a large area for heat dissipation to improve cooling efficiency, thereby improving thermal performance thereof. This contributes to a stable operation of the device in high load environments.
Optionally, according to any of the first to third possible implementations of the second aspect, in the device, the second area comprises an adhesive pool for filling the adhesive, wherein the second side of the wall-like structure forms at least part of one side of the adhesive pool.
Alternatively, according to any one of the first to third possible implementations of the second aspect, in the device, the height of the wall-like structure may be controlled to be around 200 μm or less, and the width thereof may also be controlled to be around 3.0mm or less.
Alternatively, according to any one of the first to third possible implementations of the second aspect, in the device, the thermal interface material may be composed of an organic-based material (e.g. silicon, etc.), a metal (e.g. InSn, inAg, etc.), an Ag sintered material (e.g. nano Ag, etc.), or a CNT-based material, etc.
A third aspect of embodiments of the present invention provides a method for assembling a flip chip package comprising at least one chip, a substrate, a molded member, a thermal interface material, and a heat spreader. In a first possible implementation manner of the third aspect, the method includes:
connecting the at least one chip with the substrate;
filling a mold compound around the at least one chip on the substrate to wrap side portions of the at least one chip and expose a top surface of each chip, and molding the molding member in a structure in which an upper surface of the molding member has a first region continuous with the top surface of each chip, a second region to which an adhesive is applied, and a wall-like structure placed to surround the top surface of each chip, and the first region and the second region are separated by the wall-like structure;
Applying the adhesive to a second region of the molded member;
applying a thermal interface material over the first region and the top surface of each chip;
attaching the heat spreader to the thermal interface material and the molded member by the adhesive;
and performing a reflow process of the package.
According to a first possible implementation manner of the third aspect, the thermal interface material is formed in a spatial region surrounded by the top surface of each chip, the bottom surface of the heat spreader, the first region of the molding member, and one side of the wall-like structure in the molding member. Thus, the thickness of the thermal interface material is defined by the height of the wall-like structures in the molded component. Since the height of the wall-like structure composed of the mold compound can be easily controlled during the molding process, the thickness of the thermal interface material can be adjusted to a desired small thickness, thereby achieving improved thermal performance.
Furthermore, in a first possible implementation of the third aspect, the first and second regions of the molded member are spatially separated by a wall-like structure, thereby avoiding mixing of the thermal interface material applied to the first region and the adhesive applied to the second region during the reflow process. This can avoid the formation of voids in the thermal interface material and prevent the thermal interface material from flowing out into the adhesive, thereby improving thermal performance. In addition, the molded member may serve as a support member to maintain the distance between the bottom of the heat spreader and the substrate, thereby reducing the risk of delamination of the thermal interface material from the heat spreader during the reflow process. For the above reasons, the package according to the first possible implementation of the first aspect may achieve improved thermal performance, thereby ensuring sufficient operational reliability.
A second possible implementation manner of the third aspect provides the method according to the first possible implementation manner of the third aspect, wherein:
the method further includes forming a stiffener on the substrate prior to filling the mold compound, the stiffener having a square frame-like structure for surrounding an entire area on which the at least one chip is disposed, and the molding member being formed to fill an interior area of the stiffener.
According to a second possible implementation manner of the third aspect, the reinforcement may enhance the strength of the package, thereby increasing the resistance of the package to external impact.
A third possible implementation manner of the third aspect provides the method according to the first possible implementation manner of the third aspect, wherein the heat spreader has a cover portion placed over the at least one chip and a side portion extending downward from an end of the cover portion, and the side portion is placed outside the molding member,
when the heat sink is attached, the end portions of the side portions are adhered to the substrate by an adhesive.
According to a third possible implementation manner of the third aspect, the side portion of the heat spreader may enhance the strength of the package, thereby increasing the resistance of the package to external impact. In addition, the structure of the heat sink having the side portions can ensure a large area for heat dissipation to improve cooling efficiency, thereby improving thermal performance thereof.
Alternatively, according to any one of the first to third possible implementations of the third aspect, in the method, the molding may be implemented using a transfer molding method or a compression molding method.
Alternatively, according to any one of the first to third possible implementation manners of the third aspect, in the method, the height of the wall-like structure may be controlled to be about 200 μm or less, and the width thereof may also be controlled to be about 3.0mm or less.
Alternatively, according to any one of the first to third possible implementations of the third aspect, in the method, the thermal interface material may be composed of an organic-based material (e.g., silicon, etc.), a metal (e.g., inSn, inAg, etc.), an Ag sintered material (e.g., nano Ag, etc.), or a CNT-based material, etc.
Drawings
Figure 1 is a schematic block diagram illustrating an exemplary configuration of an apparatus according to an embodiment of the present invention,
figure 2 is a schematic cross-sectional view of a flip chip package according to an embodiment of the invention,
fig. 3 is an enlarged view of a portion of the flip-chip package of fig. 2,
fig. 4 is a schematic top view of the flip-chip package of fig. 2,
Fig. 5A through 5E are schematic diagrams depicting an assembly process of the flip-chip package of fig. 2 according to an embodiment of the present invention,
fig. 6 shows simulation results of gap variation during assembly of the flip chip package of fig. 2, according to an embodiment of the present invention,
fig. 7 shows a first exemplary variation of a flip-chip package,
fig. 8A and 8B illustrate a package structure in a second exemplary variation of a flip-chip package,
fig. 9A and 9B illustrate a package structure in a third exemplary variation of a flip-chip package according to an embodiment of the present invention,
fig. 10A and 10B illustrate a package structure in a fourth exemplary variation of a flip-chip package according to an embodiment of the present invention,
fig. 11A through 11F are schematic top views of a flip chip package, depicting some of the possible shapes in which the components are molded,
fig. 12A and 12B illustrate possible variations of flip-chip packaging,
fig. 13A and 13B show an example of a conventional flip-chip package.
Detailed Description
The technical scheme of the embodiment is described below with reference to the accompanying drawings. It is to be understood that the embodiments described below are not all embodiments, but only some embodiments related to the present invention. It should be noted that other embodiments, which can be derived by a person skilled in the art without making any inventive effort, are within the scope of the present invention based on the embodiments described below.
(conventional flip chip package) before describing embodiments of the present invention, let us introduce a conventional flip chip package and its problems with reference to fig. 13A and 13B. Fig. 13A and 13B show an example of a conventional flip-chip package.
Fig. 13A schematically illustrates a cross-sectional view of a first conventional flip-chip package. As shown in fig. 13A, a first conventional flip-chip package includes a substrate, a chip, an underfill, a thermal interface material (thermal interface material, TIM), and a heat spreader.
The chip is connected to the substrate by bumps underneath it, and the bottom area of the chip is filled with the underfill. The heat sink has a flat cover and a side wall extending downwardly from an end of the flat cover. The flat cover of the heat spreader is for making a bottom surface of the flat cover parallel to a top surface of the chip. The side wall of the heat spreader is placed to surround a chip and is adhered to the substrate by applying an adhesive to one end of the side wall.
The TIM is sandwiched between at least a portion of the bottom surface of the flat cover of the heat spreader and the top surface of the chip. Hereinafter, a gap between the heat spreader and the chip where the TIM is applied may be referred to as a TIM gap. From the viewpoint of reducing the thermal resistance between the chip and the heat sink, the thickness of the TIM is preferably made smaller.
In a first conventional flip chip package, the TIM gap is defined by the height of the sidewalls in the heat spreader, making it difficult to fine tune the height to achieve a small TIM gap (e.g., about 200 μm or less). This means that it is difficult to achieve a small thickness of the TIM in the first conventional flip-chip package. Furthermore, differences in coefficients of thermal expansion between the heat spreader, the substrate, and the chip cause the TIM gap to expand during the reflow process when assembling a flip chip package, thereby promoting delamination of the TIM from the heat spreader. Delamination of the TIM can reduce thermal performance and increase junction temperature during operation, resulting in reduced reliability of flip-chip packaging.
To reduce the expansion of TIM gaps during the reflow process, a second conventional flip chip package has been proposed, with a molded member (mold) around the chip as shown in fig. 13B. The molding member is formed on the substrate and bonded by an adhesive applied to an upper surface of the molding member. In a second conventional flip chip package, the molding member may act as a support member to physically maintain the gap between the heat spreader and the substrate, thereby reducing the expansion of the TIM gap during the reflow process.
However, the second conventional flip chip package lacks a means to physically define the TIM thickness or TIM gap size, and thus it is difficult to control the TIM gap to achieve a small thickness of TIM (e.g., about 200 μm or less). This problem remains even though the heat spreader of the first conventional flip-chip package may be applied to the second conventional flip-chip package.
Furthermore, in a second conventional flip chip package, the TIM is in contact with the adhesive on the molded member such that during the reflow process, a portion of the TIM may flow into the adhesive and/or a portion of the adhesive may flow into the TIM. If a portion of the TIM flows into the adhesive during the reflow process, voids will form in the TIM, resulting in an increase in the thermal resistance of the TIM. If a portion of the adhesive flows into the TIM during the reflow process, the effective volume of the TIM will decrease, resulting in an increase in thermal resistance in the TIM. The increase in thermal resistance in TIMs in turn leads to reduced thermal performance during operation.
For the above reasons, the embodiments of the present invention described below provide a solution to the problems of the conventional flip-chip packages of the first and second conventional flip-chip packages described above. Embodiments of the invention relate to flip chip packages, devices equipped with circuits employing the package structures, and methods of assembling the packages.
(exemplary configuration of apparatus) an exemplary configuration of an apparatus according to an embodiment of the present invention is described below.
Fig. 1 is a schematic block diagram of an room for describing an exemplary configuration of an apparatus according to an embodiment of the present invention.
The apparatus 10 in fig. 1 is an example of an apparatus according to an embodiment of the invention. For example, the apparatus 10 may be a mobile device such as a cell phone, smart phone, tablet computer, wearable computer, or the like. Further, the apparatus 10 may be a personal computer, a workstation, a server, an AI cluster, a cloud computing system, an IoT device, or the like. Alternatively, the device 10 may be a digital still camera, a digital camera, a security/surveillance camera, a webcam, a video camera, an automobile/transportation camera, a medical camera, a machine vision camera, or the like.
As shown in fig. 1, the apparatus 10 includes a processing circuit 11 and a communication circuit 12. For example, the processing circuitry 11 may include at least one processor such as CPU, FPGA, ASIC, GPU. The communication circuit 12 may include at least one high frequency circuit for a wired communication interface, a wireless communication interface, an optical communication interface, a network switch, and the like. Optionally, the apparatus 10 may also include power control circuitry for a vehicle, energy management system, or the like.
Each of the processing circuit 11, the communication circuit 12, and the power control circuit is an example of a circuit to which the flip chip package according to the embodiment of the present invention can be applied. The configuration of the apparatus 10 described herein is exemplary, and the applicable scope of the embodiments of the present invention is not limited in this respect.
(structure of flip chip package) the structure of the flip chip package according to the embodiment of the present invention is described below.
Fig. 2 is a schematic cross-sectional view of a flip chip package according to an embodiment of the invention. The flip-chip package 200 of fig. 2 is an example of a flip-chip package according to an embodiment of the invention.
As shown in fig. 2, package 200 includes a substrate 201, a semiconductor chip (die) 202, bumps 203, an underfill 204, a thermal interface material (thermal interface material, TIM) 205, a heat spreader 206, a stiffener 207, and a molded member 209. The molding member 209 is comprised of a mold compound. TIM 205 may be composed of an organic-based material (e.g., silicon, etc.), a metal (e.g., inSn, inAg, etc.), an Ag sintered material (e.g., nano-Ag, etc.), or a CNT-based material, etc.
The stiffener 207 is bonded to the substrate 201 by an adhesive 208. The heat spreader 206 is bonded to the molded member 209 by an adhesive 210. In this example, the adhesive 210 is also filled in the region formed by the heat sink 206 and one side of the mold member 209, thereby enhancing their adhesion.
The chip 202 is used to connect with the substrate 201 through bumps 203 sandwiched between the upper surface of the substrate 201 and the bottom surface of the chip 202. A mold member 209 is formed on the substrate 201 to wrap the side portion of the chip 202 and expose the top surface of the chip 202.
The upper surface of the molding member 209 has a first region continuous with the top surface of the chip 202, a second region where the adhesive 210 is applied, and a wall-like structure 209a.
The wall-like structure 209a is a convex portion having a width W and a height H shown in fig. 3. Fig. 3 is an enlarged view of a portion of the flip-chip package of fig. 2, in accordance with an embodiment of the present invention. For example, the width W may be controlled to about 3.0mm or less and the height H may be controlled to about 200 μm or less. These configurations are merely examples, and thus the width W and the height H may be set to values other than the above-described values.
Further, as shown in fig. 4, a wall-like structure 209a is placed around the top surface of chip 202. Fig. 4 is a schematic top view of the flip chip package of fig. 2, in accordance with an embodiment of the invention. In fig. 4, the heat spreader 206 is omitted for simplicity, and the II-II cut line corresponds to the cross-sectional view of fig. 2. As shown in fig. 4, the TIM 205 fills in the inner region surrounded by the wall-like structure 209a, and the adhesive 210 is applied to the region (second region) outside the wall-like structure 209a. In this example, the second region acts as an adhesive pool for filling the adhesive 210.
In fig. 2, a first region of the upper surface of the molding member 209 is a flat portion near the chip 202 and extends from the inner wall of the wall-like structure 209a toward the edge of the chip 202. A second region of the molding member 209 extends outwardly from the outer wall of the wall structure 209 a. Here, the modifiers "inner" and "outer" denote one side closer to the center of the chip 202 and the other side closer to the edge of the package 200, respectively.
Heat spreader 206 is placed over the top surface of chip 202 and is adhered to molding member 209 by adhesive 210 applied to the second area. The heat spreader 206 may be made of a low CTE material (e.g., cu, ag-diamond, or Co-Mo). During assembly of the package 200, the use of a heat spreader 206 made of a low CTE material may reduce stress on the TIM 205 during the reflow process.
As shown in fig. 2, the heat sink 206 is supported by the wall-like structure 209a, and the first region and the second region of the upper surface of the mold member 209 are spatially separated by the wall-like structure 209 a. This configuration can avoid mixing of the TIM 205 applied to the first region and the adhesive 210 applied to the second region during the reflow process, thereby avoiding void formation in the TIM 205 and preventing the TIM 205 from flowing out into the adhesive 210.
The TIM 205 fills in the spatial region formed by the top surface of the chip 202, the bottom surface of the heat spreader 206, the first region of the molding member 209, and the inner walls of the wall-like structure 209 a. Thus, as shown in fig. 3, the thickness of the TIM 205 is defined by the height H of the wall structure 209 a.
The reinforcement 207 has a structure similar to a square frame, and is formed on the base plate 201 to surround the outside of the mold member 209, as shown in fig. 4. Further, the molding member 209 is formed to fill the inner region of the reinforcement 207. The stiffener 207 may enhance the strength of the package 200, thereby increasing the resistance of the package 200 to external impacts.
As described above, in the package 200, the TIM 205 is formed in a spatial region surrounded by the top surface of the chip 202, at least a portion of the bottom surface of the heat spreader 206, the first region of the molding member 209, and one side of the wall-like structure 209 a. Thus, the thickness of the TIM 205 is defined by the height H of the wall structure 209a, which can be easily controlled during molding. This means that the thickness of the TIM 205 may be trimmed to a desired small thickness (e.g., about 200 μm or less) to achieve improved thermal performance.
In addition, the first and second regions of the molding member 209 are spatially separated by the wall-like structure 209a, thereby avoiding mixing of the TIM 205 and the adhesive 210 during the reflow process. This can avoid void formation in the TIM 205 and prevent the TIM 205 from flowing out into the adhesive 210, thereby improving thermal performance. Further, the molding member 209 may act as a support member to maintain the distance between the heat spreader 206 and the substrate 201, thereby reducing the risk of delamination of the TIM 205 from the heat spreader 206 during the reflow process.
For the reasons described above, the package 200 may achieve improved thermal performance, thereby ensuring adequate operational reliability.
(packaging assembly process) the method of assembling a flip chip package according to an embodiment of the present invention is described below.
Fig. 5A to 5E are schematic views for describing an assembly process of the package 200 of fig. 2.
As shown in fig. 5A, a chip 202 is placed on a substrate 201 so as to sandwich bumps 203 between the bottom surface of the chip 202 and the substrate 201. Further, the reinforcement member 207 is placed on the substrate 201 so as to sandwich the adhesive 208 between the bottom surface of the reinforcement member 207 and the substrate 201.
Next, as shown in fig. 5B, an underfill 204 is filled in the region under the chip 202 to cover the bump 203, wherein the underfill 204 may cover a portion of the side wall of the chip 202. The underfill 204 will cure after filling.
Next, as shown in fig. 5C, a mold compound is filled around the chip 202 on the substrate 201 to wrap the side portions of the chip 202 and expose the top surface of the chip 202. Further, molding is performed to form the molding member 209, wherein an upper surface of the molding member 209 has a first region b1, a second region b2, and a wall-like structure 209a. For example, the molding may be accomplished using a transfer molding process or a compression molding process.
The first region b1 is a region continuous with the top surface of the chip 202, and the second region b2 is a region to which the adhesive 210 is to be applied. Wall-like structure 209a is a portion of molded member 209 that is placed around the top surface of chip 202. The first region b1 and the second region b2 are separated by a wall-like structure 209 a. In this example, the second region b2 forms an adhesive pool for filling the adhesive 210.
Next, as shown in fig. 5D, an adhesive 210 is applied to a second region of the molding member 209. Further, the TIM 205 fills in the area surrounded by the first region b1, the wall-like structure 209a, and the top surface of the chip 202. The TIM 205 and adhesive 210 will cure after application.
Next, as shown in fig. 5E, the heat spreader 206 is placed on the exposed portion (top end) of the wall-like structure 209a to seal the TIM 205 and sandwich the adhesive 210 between the heat spreader 206 and the wall-like structure 209 a. After attaching the heat spreader 206, a reflow process of connecting the chip 202 to the substrate 201 is performed.
During the reflow process, the package 200 is heated to about 250 degrees celsius. However, since the adhesive 210 applied to the first region b1 and the TIM 205 applied to the second region b2 are spatially separated by the wall-like structure 209a, mixing of the TIM 205 and the adhesive 210 is avoided during the reflow process. This can avoid void formation in the TIM 205 and prevent the TIM 205 from flowing out into the adhesive 210, thereby improving thermal performance.
Further, the molding member 209 may act as a support member to maintain the distance between the heat spreader 206 and the substrate 201, thereby reducing the risk of delamination of the TIM 205 from the heat spreader 206 during the reflow process.
(gap variation during assembly) the variation of TIM gap during the reflow process is described below.
Fig. 6 shows simulation results of gap variation during assembly of the flip chip package of fig. 2, with vertical and horizontal axes representing TIM gap and time, respectively, in the graph of fig. 6, in accordance with an embodiment of the present invention. Further, another axis indicating the temperature of the package 200 is shown in fig. 6. In fig. 6, solid rectangular dots represent data corresponding to the package 200 (embodiment), and blank circles represent data corresponding to the conventional package shown in fig. 13A.
At time t 1 The temperature is set to about 150 degrees celsius, i.e., the temperature at which the adhesive cures. In this example, the encapsulation is at time t 6 Cooled to about 30 ℃ before and at a temperature of time t 15 Which was previously increased to about 250 degrees celsius for assembly reflow. For conventional packages, the TIM gap is during the reflow processAnd increases sharply to about 185 μm. In contrast, for package 200, the tim gap gradually increases, but remains below 110 μm, which is significantly smaller than for conventional packages. This means that the package 200 can reduce the risk of delamination of the TIM 205 from the heat spreader 206 during the reflow process.
(first exemplary modification of flip chip package) the following describes a first exemplary modification of flip chip package according to an embodiment of the present invention.
Fig. 7 shows a first exemplary variation of a flip-chip package, according to an embodiment of the present invention. The flip-chip package 300 shown in fig. 7 is an example of a flip-chip package according to the first exemplary modification.
As shown in fig. 7, package 300 includes a substrate 301, a semiconductor chip (die) 302, bumps 303, an underfill 304, a TIM 305, a heat spreader 306, a stiffener 307, and a molding member 309. The stiffener 307 is bonded to the substrate 301 by an adhesive 308. The heat sink 306 is bonded to the molded member 309 by an adhesive 310.
Package 300 differs from package 200 described above in the structure of heat spreader 306 and molded member 309. Specifically, the heat spreader 306 extends to the outer edge of the package 300 and is therefore wider than the heat spreader 206 of the package 200, and the molding member 309 also extends below the extension of the heat spreader 306, as shown in fig. 7. Adhesive 310 is also applied to an extension of the molded member 309 and is sandwiched between the heat sink 306 and the wall structure 309 a.
According to the first modification, since the volume of the radiator 306 is enlarged, the cooling performance of the radiator 306 is also improved accordingly. Furthermore, since the adhesion area between the heat spreader 306 and the wall structure 309a extends, the first modification can effectively reduce the risk of delamination of the TIM 205 from the heat spreader 206 during the reflow process.
(second exemplary modification of flip chip package) a second exemplary modification of flip chip package according to an embodiment of the present invention is described below.
Fig. 8A shows a package structure in a second exemplary variation of a flip-chip package according to an embodiment of the present invention. Fig. 8B illustrates another package structure in a second exemplary variation of a flip-chip package, according to an embodiment of the present invention. The flip-chip package 400 shown in fig. 8A or 8B is an example of a flip-chip package according to a second exemplary modification.
Package 400 includes a substrate 401, a semiconductor chip (die) 402, bumps 403, an underfill 404, a TIM 405, a heat spreader 406, and a molding member 409. The heat spreader 406 is bonded to the molding member 409 by an adhesive 410. The package 400 of fig. 8A differs from the package 200 described above in that the components corresponding to the stiffener 207 are omitted.
In the package 400 of fig. 8A, the area where the adhesive 410 is applied has a structure similar to a flat tray to which the adhesive 410 is added. On the other hand, in the package 400 of fig. 8B, the area where the adhesive 410 is applied has a structure similar to that of a pool filled with the adhesive 410.
(third exemplary modification of flip chip package) a third exemplary modification of the flip chip package according to an embodiment of the present invention is described below.
Fig. 9A shows a package structure in a third exemplary variation of a flip-chip package according to an embodiment of the present invention. Fig. 9B shows another package structure in a third exemplary variation of a flip-chip package, according to an embodiment of the present invention. The flip-chip package 500 shown in fig. 9A or 9B is an example of a flip-chip package according to a third exemplary modification.
Package 500 includes a substrate 501, a semiconductor chip (die) 502, bumps 503, an underfill 504, a TIM 505, a heat spreader 506, a stiffener 507, and a molded member 509. The stiffener 507 is bonded to the substrate 501 by an adhesive 508. The heat sink 506 is bonded to the molded member 509 by an adhesive 510.
Package 500 differs from package 200 described above in the structure of heat spreader 506 and stiffener 507. Specifically, the heat spreader 506 extends to the outer edge of the package 500 and is therefore wider than the heat spreader 206 of the package 200, and the stiffener 507 is buried in the molded structure 509A, as shown in fig. 9A and 9B. In addition, the molding member 509 covers the upper surface of the reinforcing member 507, and the adhesive 510 is further applied to a portion of the molding member 509 covering the reinforcing member 507.
In the package 500 of fig. 9A, the area where the adhesive 510 is applied has a structure similar to a flat tray to which the adhesive 510 is added. On the other hand, in the package 500 of fig. 9B, the area where the adhesive 510 is applied has a structure similar to that of a pool filled with the adhesive 510.
(fourth exemplary modification of flip chip package) a fourth exemplary modification of flip chip package according to an embodiment of the present invention is described below.
Fig. 10A shows a package structure in a fourth exemplary variation of a flip-chip package according to an embodiment of the present invention. Fig. 10B shows another package structure in a fourth exemplary variation of a flip-chip package, according to an embodiment of the present invention. The flip-chip package 600 shown in fig. 10A or 10B is an example of a flip-chip package according to a fourth exemplary modification.
Package 600 includes a substrate 601, a semiconductor chip (die) 602, bumps 603, an underfill 604, a TIM 605, a heat spreader 606, and a molded member 609. The heat sink 606 is bonded to the molding member 609 by an adhesive 610, and is also bonded to the substrate 601 by an adhesive 608.
Package 600 differs from package 200 described above in that the structure of the heat sink 606 and the components corresponding to stiffener 207 are omitted. Specifically, the heat spreader 606 is formed of a flat cover and side walls extending downward from the ends of the flat cover, wherein the flat cover extends to the outer edge of the package 600 and is thus wider than the heat spreader 206 of the package 200, as shown in fig. 10A and 10B.
In the package 600 of fig. 10A, the area where the adhesive 610 is applied has a structure similar to a flat tray to which the adhesive 610 is added. On the other hand, in the package 600 of fig. 10B, the area where the adhesive 610 is applied has a structure similar to that of a pool filled with the adhesive 610.
The above-described modifications are only a part of the modifications of the present embodiment, and other modifications of the present embodiment can be realized according to the above-described embodiments and modifications thereof. Further, these modifications should be included in the scope of the embodiments of the present invention.
(other possible shapes of the molded member) some possible shapes of the molded member of the flip chip package according to the embodiment of the present invention are described below.
Fig. 11A to 11F are schematic top views of a flip chip package according to an embodiment of the invention for describing some possible shapes of the molded components therein. In fig. 11A to 11F, the heat sink is omitted for simplicity.
Fig. 11A and 11B each show a structure of a molding member (mold) such that the TIM is formed to have a rectangular portion and four arms protruding from four corners of the rectangular portion toward four corners of the package. In the case of fig. 11A, the adhesive-applied region has a structure similar to a flat tray to which an adhesive is added. On the other hand, in the case of fig. 11B, the adhesive-applied region has a structure similar to that of the pool filled with the adhesive.
Fig. 11C shows a structure of a molded member such that the TIM is formed to have a rectangular portion and four arms protruding from four corners of the rectangular portion toward four corners of the package. The structure of fig. 11C is different from that of fig. 11B in the arrangement of the adhesive-applied regions. In the case of fig. 11B, there are four separate adhesive pools as areas for applying adhesive. In another aspect, the structure of FIG. 11C has an enlarged pool of adhesive, and the pool is used to surround the area of the TIM.
The example of fig. 11D is a modification of the structure in fig. 11C such that the area of the TIM has a star shape. Similarly, the example of fig. 11E is a modification of the structure in fig. 11C such that the area of the TIM has a circular shape. Further, the example of fig. 11F is a modification to the structure in fig. 11C such that the region of the TIM has a rectangular shape rotated 45 degrees.
The exemplary shapes of the molding member described above are only a part of the possible shapes of the molding member according to the embodiment, and other shapes of the molding member may be realized according to the above examples. Moreover, such possible shapes of the molded member are intended to be included within the scope of embodiments of the present invention.
(multi-chip configuration of flip chip package) the multi-chip configuration of the flip chip package according to an embodiment of the present invention is described below. These multi-chip configurations correspond to possible variants of the flip-chip package according to embodiments of the invention, respectively.
Fig. 12A shows a possible variation of a flip chip package according to an embodiment of the invention. Fig. 12B shows another possible variation of a flip-chip package according to an embodiment of the invention. The flip-chip package 700 shown in fig. 12A or 12B is an example of a flip-chip package according to a possible modification of the present embodiment.
Package 700 includes a substrate 701, semiconductor chips (dies) 702a and 702b, bumps 703a and 703b, underfills 704a and 704b, TIMs 705a and 705b, a heat spreader 706, a stiffener 707, and a molding member 709. The stiffener 707 is bonded to the substrate 701 by an adhesive 708. The heat sink 706 is bonded to the molded member 709 with an adhesive 710.
The package 700 of fig. 12A differs from the package 200 described above mainly in the structure having a plurality of chips (chips 702A and 702 b). Although the number of chips in the package 700 is two, the technique according to the embodiment of the present invention can be applied to a package having three or more chips in a similar manner to the package 700 of fig. 12A.
Alternatively, the molding member 709 may have an additional pool of adhesive to apply the adhesive 710a between adjacent chips, as shown in fig. 12B. The addition of adhesive 710a enhances adhesion between the heat spreader 706 and the molded member 709, thereby reducing the risk of delamination of the TIMs 705a and 705b from the heat spreader 706 during the reflow process.
The above-described multi-chip configuration may be applied to the modifications shown in fig. 7, 8A to 8B, 9A to 9B, and 10A to 10B. Further, possible shapes of the molding member shown in fig. 11A to 11F may be applied to a multi-chip configuration. Even in the case of a multi-chip configuration, the package of the present embodiment can achieve improved thermal performance, thereby ensuring sufficient operational reliability.
The above disclosure discloses exemplary embodiments only and is not intended to limit the scope of the present invention. It will be appreciated by a person skilled in the art that the above-described embodiments, as well as all or part of other embodiments and modifications which may be derived based on the scope of the claims of the invention, are within the scope of the invention.
Claims (11)
1. A flip chip package, comprising:
at least one chip for connection with the substrate;
a molding member formed on the substrate to wrap side portions of the at least one chip and expose a top surface of each chip, an upper surface of the molding member having a first region continuous with the top surface of each chip, a second region to which an adhesive is applied, and a wall-like structure disposed to surround the top surface of each chip, the first and second regions being separated by the wall-like structure;
A heat spreader placed over a top surface of the at least one chip and bonded to the molded member by an adhesive applied to the second area;
and a thermal interface material filled in a spatial region formed by the first region, the top surface of each chip, at least a portion of the bottom surface of the heat spreader, and the first side of the wall-like structure.
2. The flip-chip package of claim 1, further comprising:
a reinforcement having a square frame-like structure, the reinforcement being formed on the base plate to surround an outer side of the molding member, and the molding member being formed to fill an inner region of the reinforcement.
3. The flip-chip package of claim 1, wherein:
the heat spreader has a cover portion placed over the at least one chip and a side portion extending downward from an end of the cover portion, the side portion being placed outside the mold member, and an end of the side portion being bonded to a substrate by an adhesive.
4. A flip-chip package according to any one of claims 1 to 3, characterized in that:
the second region includes an adhesive pool for filling the adhesive, wherein the second side of the wall-like structure forms at least a portion of one side of the adhesive pool.
5. An apparatus comprising a circuit employing a flip-chip package, the package comprising:
at least one chip for connection with the substrate;
a molding member formed on the substrate to wrap side portions of the at least one chip and expose a top surface of each chip, an upper surface of the molding member having a first region continuous with the top surface of each chip, a second region to which an adhesive is applied, and a wall-like structure disposed to surround the top surface of each chip, the first and second regions being separated by the wall-like structure;
a heat spreader placed over a top surface of the at least one chip and bonded to the molded member by an adhesive applied to the second area;
and a thermal interface material filled in a spatial region formed by the first region, the top surface of each chip, at least a portion of the bottom surface of the heat spreader, and the first side of the wall-like structure.
6. The apparatus as recited in claim 5, further comprising:
a reinforcement having a square frame-like structure, the reinforcement being formed on the base plate to surround an outer side of the molding member, and the molding member being formed to fill an inner region of the reinforcement.
7. The apparatus according to claim 5, wherein:
the heat spreader has a cover portion placed over the at least one chip and a side portion extending downward from an end of the cover portion, the side portion being placed outside the mold member, and an end of the side portion being bonded to a substrate by an adhesive.
8. The apparatus according to any one of claims 5 to 7, wherein:
the second region includes an adhesive pool for filling the adhesive, wherein the second side of the wall-like structure forms at least a portion of one side of the adhesive pool.
9. A method for assembling a flip chip package comprising at least one chip, a substrate, a molded member, a thermal interface material, and a heat spreader, the method comprising:
connecting the at least one chip with the substrate;
filling a mold compound around the at least one chip on the substrate to wrap side portions of the at least one chip and expose a top surface of each chip, and molding the molding member in a structure in which an upper surface of the molding member has a first region continuous with the top surface of each chip, a second region to which an adhesive is applied, and a wall-like structure placed to surround the top surface of each chip, and the first region and the second region are separated by the wall-like structure;
Applying the adhesive to a second region of the molded member;
applying a thermal interface material over the first region and the top surface of each chip;
attaching the heat spreader to the thermal interface material and the molded member by the adhesive;
and executing the reflow process of the flip chip package.
10. The method according to claim 9, wherein:
the method further includes forming a stiffener on the substrate prior to filling the mold compound, the stiffener having a square frame-like structure for surrounding an entire area on which the at least one chip is disposed, and the molding member being formed to fill an interior area of the stiffener.
11. The method according to claim 9, wherein:
the heat spreader has a cover portion placed over the at least one chip and a side portion extending downward from an end of the cover portion, the side portion being placed outside the molded member, and in the attached heat spreader, an end of the side portion is bonded to a substrate by an adhesive.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/132538 WO2022110085A1 (en) | 2020-11-28 | 2020-11-28 | Flip-chip package having improved thermal performance |
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| Publication Number | Publication Date |
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| CN116601748A true CN116601748A (en) | 2023-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080107369.6A Pending CN116601748A (en) | 2020-11-28 | 2020-11-28 | Flip chip package with improved thermal performance |
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| CN (1) | CN116601748A (en) |
| WO (1) | WO2022110085A1 (en) |
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| US20240014099A1 (en) * | 2022-07-07 | 2024-01-11 | Marvell Asia Pte Ltd | Integrated circuit device exposed die package structure with adhesive |
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| WO2022110085A1 (en) | 2022-06-02 |
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